KR20210001953A - Dicing tape and dicing die-bonding film - Google Patents

Abstract

For Tanδ, which is a ratio (E″/E′) of the storage modulus E′ and the loss modulus E″ measured by dynamic viscoelasticity measurement, a dicing tape or the like having a ratio (A/B) of a value (A) of Tanδ at -15°C to a value (B) of Tanδ at -5°C is 0.75 or more. The rupture of the dicing tape is suppressed in an expand process at the low temperature.

Description

Dicing tape and dicing die-bonding film {DICING TAPE AND DICING DIE-BONDING FILM}

The present invention relates to, for example, a dicing tape used when manufacturing a semiconductor integrated circuit, and a dicing die bonding film provided with the dicing tape.

Conventionally, a dicing die bonding film used in the manufacture of a semiconductor integrated circuit is known. This kind of dicing die-bonding film includes, for example, a dicing tape and a die-bonding layer laminated on the dicing tape and adhered to a wafer. The dicing tape has a base material layer and an adhesive layer in contact with the die bonding layer. This kind of dicing die-bonding film is used, for example, as follows in the manufacture of a semiconductor integrated circuit.

A method of manufacturing a semiconductor integrated circuit generally includes a pre-process of forming a circuit surface on one side of a wafer with a highly integrated electronic circuit, and a post-process of cutting a chip from a wafer on which the circuit surface is formed to perform assembly.

Post-processes include, for example, a mounting process in which the side opposite to the circuit surface of the wafer is affixed to the die bond layer, and the wafer is fixed to the dicing tape, and the wafer attached to the dicing tape through the die bonding layer is small. Chips (die) in a state in which the die bond layer is peeled off between the die bond layer and the pressure-sensitive adhesive layer, and the dicing process is divided into chips (die) and divided into small pieces, the expansion process is made to widen the gap between the small pieces. ) And a die bonding step of adhering the chip (die) in a state where the die bonding layer is affixed to the adherend. The semiconductor integrated circuit is manufactured through these processes.

In the above manufacturing method, in the expanding process, the dicing tape is stretched in the radial direction in a state where the wafer is placed on the die bond layer overlapped with the dicing tape, for example, under a low temperature condition of 0°C or less. As a result, the wafer is cut into pieces together with the die bonding layer. However, there is a case that the dicing tape is ruptured with stretching. When the dicing tape is ruptured, the slicing becomes defective, causing a problem in the subsequent pickup process. In order to prevent such a problem, the dicing tape is required to have the ability to suppress rupture in the expanding process at low temperatures.

As a conventional dicing tape that has taken measures against the problem in the expand process, it is known that, for example, the storage modulus E'at 25°C measured at a frequency of 10 Hz is 3 to 5 GPa (Patent Document One).

In the dicing tape described in Patent Literature 1, lifting occurring between the die-bonding layer and the pressure-sensitive adhesive layer is suppressed in the expanding step at room temperature and thereafter.

Japanese Patent Publication No. 2018-195746

However, it cannot be said that the dicing die-bonding film and the dicing tape in which rupture in the expansion process at low temperature was suppressed are still being sufficiently studied.

Therefore, the present invention makes it a subject to provide a dicing tape and a dicing die-bonding film in which rupture is suppressed in an expand process at a low temperature.

In order to solve the above problem, in the dicing tape according to the present invention, for Tanδ, which is the ratio (E"/E') of the storage modulus E'and the loss modulus E" measured by dynamic viscoelasticity measurement, at -5°C. It is characterized in that the ratio (A/B) of the Tan δ value (A) at -15°C to the Tan δ value (B) is 0.75 or more.

According to the dicing tape of the above configuration, rupture is suppressed in the expanding process at a low temperature.

In the above-described dicing tape, it is preferable that the strength at the time of 25% tensile at -15°C is 15 [N/20 mm] or more. Thereby, it is possible to improve the cutting property of the wafer in the expanding process at a low temperature.

It is preferable that the said dicing tape comprises a base material layer and a pressure-sensitive adhesive layer higher in adhesion than the base layer, and the thickness of the base layer is 80 µm or more and 150 µm or less. Thereby, it is possible to further suppress breakage in the expand process at a low temperature.

In the above-described dicing tape, it is preferable that the thickness of the pressure-sensitive adhesive layer is 5 μm or more and 40 μm or less. Thereby, it is possible to further suppress breakage in the expand process at a low temperature.

The dicing die-bonding film according to the present invention includes the above-described dicing tape and a die-bonding layer bonded to the dicing tape.

In the above-described dicing die-bonding film, the thickness of the die-bonding layer may be 50 µm or more and 135 µm or less. Even in a dicing die-bonding film provided with such a relatively thick die-bonding layer, breakage of the dicing tape can be suppressed in the expanding process at a low temperature.

The dicing die-bonding film is preferably used in a cool expand process in which a wafer is stretched at 0°C or lower in a state in which a wafer is adhered to the die bond layer. In the cool expand process, the wafer is It is split with the bond layer.

The dicing tape and the dicing die-bonding film according to the present invention exhibit an effect of being able to further suppress rupture in the expanding process at a low temperature.

1 is a cross-sectional view taken along a thickness direction of a dicing die-bonding film of this embodiment.
2A is a cross-sectional view schematically showing a mode of half-cutting in a method for manufacturing a semiconductor integrated circuit.
2B is a cross-sectional view schematically showing a mode of half-cutting in a method of manufacturing a semiconductor integrated circuit.
2C is a cross-sectional view schematically showing a mode of half-cutting in a method for manufacturing a semiconductor integrated circuit.
2D is a cross-sectional view schematically showing a mode of half-cutting in a method for manufacturing a semiconductor integrated circuit.
3A is a cross-sectional view schematically showing an aspect of a mounting process in a method for manufacturing a semiconductor integrated circuit.
3B is a cross-sectional view schematically showing an aspect of a mounting step in a method for manufacturing a semiconductor integrated circuit.
4A is a cross-sectional view schematically showing an aspect of an expand process at a low temperature in a method for manufacturing a semiconductor integrated circuit.
4B is a cross-sectional view schematically showing an aspect of an expand process at a low temperature in a method for manufacturing a semiconductor integrated circuit.
4C is a cross-sectional view schematically showing an aspect of an expand process at a low temperature in a method for manufacturing a semiconductor integrated circuit.
5A is a cross-sectional view schematically showing an aspect of an expand process at room temperature in a method for manufacturing a semiconductor integrated circuit.
5B is a cross-sectional view schematically showing an aspect of an expansion process at room temperature in a method for manufacturing a semiconductor integrated circuit.
6 is a cross-sectional view schematically showing a mode of a pickup step in a method for manufacturing a semiconductor integrated circuit.

Hereinafter, an embodiment of a dicing die-bonding film and a dicing tape according to the present invention will be described with reference to the drawings.

The dicing die-bonding film 1 of the present embodiment includes a dicing tape 20 and a die-bonding layer 10 laminated on the pressure-sensitive adhesive layer 22 of the dicing tape 20 and adhered to a semiconductor wafer. It is equipped with.

The dicing tape 20 of this embodiment is usually a long sheet, and is stored in a wound state until use. The dicing die-bonding film 1 of the present embodiment is applied to an annular frame having an inner diameter that is one step larger than that of a silicon wafer to be cut, and used.

The dicing tape 20 of this embodiment includes a base layer 21 and an adhesive layer 22 overlaid on the base layer 21.

In the dicing tape 20 of the present embodiment, the ratio of the storage elastic modulus E'and the loss elastic modulus E" measured by dynamic viscoelasticity measurement (E"/E') of Tan δ at -5°C The ratio (A/B) of the value (A) of Tan δ at -15°C to the value (B) is 0.75 or more.

Since the dicing tape 20 of the present embodiment has the above-described configuration, it is suppressed from being ruptured in the expanding process at a low temperature (described in detail later). The low temperature is a temperature of 0°C or less.

The dynamic viscoelasticity measurement for the dicing tape 20 is carried out according to the method described in Examples. From the average value of the measurement results performed three times, each of the aforementioned Tan δ is determined.

In addition, the above-described ratio (A/B) may be 2.00 or less.

The above-described ratio (A/B) can be increased, for example, by increasing the value (A) of Tan δ at -15°C.

For example, by blending a material with a glass transition temperature (Tg) closer to -15°C to the dicing tape 20 or increasing the amount of the material to be blended, the value of Tan δ at -15°C (A ) Can be increased.

On the other hand, the above-described ratio (E"/E') can be made small, for example, by increasing the value (B) of Tan δ at -5°C.

For example, by blending a material with a glass transition temperature (Tg) further from -5°C to the dicing tape 20, or increasing the amount of the material to be blended, the value of Tan δ at -5°C (B ) Can be increased.

The value (A) of Tan δ at -15°C is preferably 0.05 or more, more preferably 0.07 or more, and still more preferably 0.10 or more. When the value (A) of Tan δ is 0.05 or more, there is an advantage that the relaxation properties of the dicing tape 20 when stretched at -15°C become larger.

The value (A) of Tan δ at -15°C is preferably 0.50 or less, more preferably 0.40 or less, and still more preferably 0.30 or less. When the value (A) of Tan δ is 0.50 or less, there is an advantage that the stress when tensioned at -15°C can be transmitted more efficiently to the die bonding layer 10.

The value (B) of Tan δ at -5°C is preferably 0.05 or more, more preferably 0.09 or more, and even more preferably 0.11 or more. When the value (B) of Tan δ is 0.05 or more, there is an advantage that the relaxation properties of the dicing tape 20 when stretched at -5°C become larger.

The value (B) of Tan δ at -5°C is preferably 0.50 or less, more preferably 0.40 or less, and still more preferably 0.27 or less. When the value (B) of Tan δ is 0.50 or less, there is an advantage that the stress when tensioned at -5°C can be transmitted to the die bonding layer 10 more efficiently.

In the dicing tape 20, it is preferable that the strength at the time of 25% tensile at -15°C is 15 [N/20 mm] or more. Thereby, it is possible to improve the cutting property of the wafer in the expanding process at a low temperature.

The strength at the time of 25% tensile at -15°C may be 30 [N/20 mm] or less.

The strength at the time of 25% tension mentioned above is a value measured according to the method described in Examples. In addition, the value of the intensity is determined from the average value of the measurement results performed three times.

The strength at the time of 25% tensile can be increased, for example, by selecting a harder resin as the resin constituting the dicing tape 20 or by increasing the thickness of the base layer 21. On the other hand, the strength at the time of 25% tensile can be reduced, for example, by selecting a softer resin as the resin constituting the dicing tape 20 or by making the base layer 21 thinner. .

The base layer 21 may have a single-layer structure or a laminated structure.

Each layer of the base material layer 21 is, for example, a metal foil, a fiber sheet such as paper or cloth, a rubber sheet, and a resin film.

Paper, woven fabric, nonwoven fabric, etc. are mentioned as a fiber sheet which comprises the base material layer 21.

Examples of the material of the resin film include polyolefins such as polyethylene (PE), polypropylene (PP), and ethylene-propylene copolymer; Ethylene copolymers such as ethylene-vinyl acetate copolymer (EVA), ionomer resin, ethylene-(meth)acrylic acid copolymer, and ethylene-(meth)acrylic acid ester (random, alternating) copolymer; Polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); Polyacrylate; Polyvinyl chloride (PVC); Polyurethane; Polycarbonate; Polyphenylene sulfide (PPS); Polyamides such as aliphatic polyamide and wholly aromatic polyamide (aramid); Polyetheretherketone (PEEK); Polyimide; Polyetherimide; Polyvinylidene chloride; ABS (acrylonitrile-butadiene-styrene copolymer); Cellulose or cellulose derivatives; Silicone-containing polymer; And fluorine-containing polymers. These may be used alone or in combination of two or more.

When the base material layer 21 has a resin film, the resin film may be subjected to a stretching treatment or the like to control deformability such as an elongation.

The surface of the substrate layer 21 may be subjected to a surface treatment in order to increase the adhesion to the pressure-sensitive adhesive layer 22. As the surface treatment, for example, a chemical method such as chromic acid treatment, ozone exposure, flame exposure, high-pressure electric shock exposure, ionizing radiation treatment, or an oxidation treatment by a physical method may be employed. Further, coating treatment with a coating agent such as an anchor coating agent, a primer, or an adhesive may be performed.

The base layer 21 is at least one selected from ethylene-vinyl acetate copolymer (EVA) resin, α-olefin-based thermoplastic elastomer resin, ethylene-methylacrylate copolymer (EMA) resin, and ionomer resin (IO). It is preferred to include species. Examples of the α-olefin-based thermoplastic elastomer include a homopolymer of α-olefin and a copolymer of two or more types of α-olefin.

The base layer 21 may contain a mixture (blend) of plural types of the above-described resins. For example, the base layer 21 may contain a mixture of an ethylene-vinyl acetate copolymer resin (EVA) and an ionomer resin (IO), and the ethylene-vinyl acetate copolymer resin (EVA) and a polypropylene elastomer resin You may include a mixture. In this kind of mixture, the ratio of the ethylene-vinyl acetate copolymer resin (EVA) may be 60% by mass or more and 80% by mass or less.

Ethylene-vinyl acetate copolymer resin (EVA) may contain 10 mass% or more and 30 mass% or less of structural units of vinyl acetate.

The thickness of the base layer 21 is preferably 80 µm or more and 150 µm or less. These values are the average values of the measured values in at least three randomly selected locations. Hereinafter, the same applies to the thickness of the pressure-sensitive adhesive layer 22.

On the back side of the base layer 21 (the side where the adhesive layer 22 does not overlap), a release treatment is performed with, for example, a release agent (release agent) such as a silicone resin or a fluorine resin in order to impart releasability. You may have it.

The base layer 21 is preferably a light-transmitting (ultraviolet ray-transmitting) resin film or the like from the viewpoint of being able to provide active energy rays such as ultraviolet rays to the pressure-sensitive adhesive layer 22 from the back side.

The dicing tape 20 of the present embodiment, in a state before being used, includes a release sheet covering one side of the pressure-sensitive adhesive layer 22 (the side where the pressure-sensitive adhesive layer 22 does not overlap with the base layer 21). You may have it. When the die-bonding layer 10 having a smaller area than the pressure-sensitive adhesive layer 22 is disposed so as to be accommodated in the pressure-sensitive adhesive layer 22, the release sheet covers both the pressure-sensitive adhesive layer 22 and the die-bond layer 10 Is placed. The release sheet is used to protect the pressure-sensitive adhesive layer 22 and is peeled off before attaching the die-bonding layer 10 to the pressure-sensitive adhesive layer 22.

As the release sheet, for example, a plastic film or paper, which has been surface-treated with a release agent such as silicone-based, long-chain alkyl-based, fluorine-based, or molybdenum sulfide, can be used.

In addition, as a release sheet, for example, polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene/hexafluoropropylene copolymer, chlorofluoroethylene/vinyl fluoride Films made of fluorine-based polymers such as a leadene copolymer; Films made of polyolefins such as polyethylene and polypropylene; Polyester films, such as polyethylene terephthalate (PET), can be used.

Further, as the release sheet, for example, a plastic film or paper, which is surface coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate-based release agent, can be used.

In addition, the release sheet can be used as a support material for supporting the pressure-sensitive adhesive layer 22. In particular, the release sheet is suitably used when the pressure-sensitive adhesive layer 22 is overlaid on the base layer 21. Specifically, in the state in which the release sheet and the pressure-sensitive adhesive layer 22 are stacked, the pressure-sensitive adhesive layer 22 is overlaid on the base layer 21, and then the release sheet is peeled off (transferred) to the base layer 21. The pressure-sensitive adhesive layer 22 can be overlaid on.

In this embodiment, the pressure-sensitive adhesive layer 22 contains, for example, an acrylic polymer, an isocyanate compound, and a polymerization initiator.

The pressure-sensitive adhesive layer 22 preferably has a thickness of 5 µm or more and 40 µm or less. The shape and size of the pressure-sensitive adhesive layer 22 are usually the same as the shape and size of the base layer 21.

In the dicing tape 20 of the present embodiment, the ratio of the thickness of the pressure-sensitive adhesive layer 22 to the total thickness of the dicing tape 20 may be 5% or more and 30% or less.

The above-described acrylic polymer has at least a structural unit of an alkyl (meth)acrylate, a structural unit of a hydroxyl group-containing (meth)acrylate, and a structural unit of a polymerizable group-containing (meth)acrylate in a molecule. The structural unit is a unit constituting the main chain of the acrylic polymer. Each side chain in the above-described acrylic polymer is contained in each structural unit constituting the main chain.

In addition, in this specification, the notation "(meth)acrylate" represents at least one of methacrylate (methacrylic acid ester) and acrylate (acrylic acid ester). Similarly, the notation "(meth)acrylic acid" represents at least one of methacrylic acid and acrylic acid.

In the acrylic polymer contained in the pressure-sensitive adhesive layer 22, the structural units described above can be confirmed by NMR analysis such as ¹ H-NMR and ¹³ C-NMR, pyrolysis GC/MS analysis, infrared spectroscopy, and the like. In addition, the molar ratio of the above-described structural units in the acrylic polymer is usually calculated from the blending amount (input amount) when the acrylic polymer is polymerized.

The structural unit of the above alkyl (meth)acrylate is derived from an alkyl (meth)acrylate monomer. In other words, the molecular structure after the polymerization reaction of the alkyl (meth)acrylate monomer is a structural unit of the alkyl (meth)acrylate. The notation "alkyl" represents a hydrocarbon moiety ester bonded to (meth)acrylic acid.

The hydrocarbon of the alkyl moiety in the constituent unit of the alkyl (meth)acrylate may be a saturated hydrocarbon or an unsaturated hydrocarbon.

In addition, it is preferable that the alkyl moiety does not contain a polar group containing oxygen (O) or nitrogen (N). Thereby, it can suppress that the polarity of an alkyl polymer becomes extremely high. Accordingly, it is suppressed that the pressure-sensitive adhesive layer 22 has excessive affinity for the die-bonding layer 10. Therefore, the dicing tape 20 can be peeled better from the die bonding layer 10. The number of carbon atoms in the alkyl moiety may be 6 or more and 10 or less.

As a structural unit of an alkyl (meth)acrylate, each structural unit, such as hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and decyl (meth)acrylate, is mentioned, for example.

The acrylic polymer has a structural unit of a hydroxyl group-containing (meth)acrylate, and the hydroxyl group of such a structural unit reacts easily with an isocyanate group.

The pressure-sensitive adhesive layer 22 can be appropriately cured by coexisting the acrylic polymer having a structural unit of a hydroxyl group-containing (meth)acrylate and an isocyanate compound in the pressure-sensitive adhesive layer 22. Therefore, the acrylic polymer can be sufficiently gelled. Therefore, the adhesive layer 22 can exhibit adhesive performance while maintaining the shape.

It is preferable that the structural unit of a hydroxyl-containing (meth)acrylate is a structural unit of a hydroxyl-containing C2-C4 alkyl (meth)acrylate. The notation "C2 to C4 alkyl" represents the number of carbon atoms in the hydrocarbon moiety ester bonded to (meth)acrylic acid. In other words, the hydroxyl group-containing C2 to C4 alkyl (meth)acrylate monomer represents a monomer in which (meth)acrylic acid and an alcohol having 2 to 4 carbon atoms (usually a dihydric alcohol) are ester-bonded.

The hydrocarbon moiety of C2 to C4 alkyl is usually a saturated hydrocarbon. For example, the hydrocarbon moiety of C2 to C4 alkyl is a straight chain saturated hydrocarbon or a branched chain saturated hydrocarbon. It is preferable that the hydrocarbon moiety of C2 to C4 alkyl does not contain a polar group containing oxygen (O) or nitrogen (N).

As a structural unit of a hydroxyl-containing C2 to C4 alkyl (meth)acrylate, for example, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxy n-butyl (meth)acrylate, or hydroxy Each structural unit of hydroxybutyl (meth)acrylate such as oxyiso-butyl (meth)acrylate can be mentioned. In addition, in the structural unit of hydroxybutyl (meth)acrylate, the hydroxyl group (-OH group) may be bonded to carbon (C) at the end of the hydrocarbon moiety, and to carbon (C) other than the end of the hydrocarbon moiety. May be combined.

The above-described acrylic polymer contains a structural unit of a polymerizable group-containing (meth)acrylate having a polymerizable unsaturated double bond in the side chain.

Since the above-described acrylic polymer contains a structural unit of a polymerizable group-containing (meth)acrylate, the pressure-sensitive adhesive layer 22 can be cured by irradiation with active energy rays (ultraviolet rays, etc.) before the pickup step. Specifically, radicals are generated from the photopolymerization initiator by irradiation with active energy rays such as ultraviolet rays, and the acrylic polymers can be crosslinked by the action of these radicals. Thereby, the adhesive force of the pressure-sensitive adhesive layer 22 before irradiation can be reduced by irradiation. And the die-bonding layer 10 can be peeled satisfactorily from the adhesive layer 22.

In addition, ultraviolet rays, radiation, and electron beams are employed as active energy rays.

The constituent unit of the polymerizable group-containing (meth)acrylate is specifically, urethane-bonded with the isocyanate group of the isocyanate group-containing (meth)acrylate monomer to the hydroxyl group in the constituent unit of the above-described hydroxyl group-containing (meth)acrylate. It may have a molecular structure.

The structural unit of the polymerizable group-containing (meth)acrylate having a polymerizable group can be prepared after polymerization of the acrylic polymer. For example, after copolymerization of an alkyl (meth)acrylate monomer and a hydroxyl group-containing (meth)acrylate monomer, the hydroxyl group in a part of the structural unit of the hydroxyl group-containing (meth)acrylate and the isocyanate group-containing polymerizable monomer By making a group react with urethanization, the structural unit of the above-described polymerizable group-containing (meth)acrylate can be obtained.

It is preferable that the above-described isocyanate group-containing (meth)acrylate monomer has one isocyanate group in its molecule and one (meth)acryloyl group. As such a monomer, 2-isocyanatoethyl (meth)acrylate is mentioned, for example.

The pressure-sensitive adhesive layer 22 of the dicing tape 20 in the present embodiment further contains an isocyanate compound. Some of the isocyanate compounds may be in a state after reacting by a urethanization reaction or the like.

An isocyanate compound has a plurality of isocyanate groups in a molecule. When the isocyanate compound has a plurality of isocyanate groups in the molecule, the crosslinking reaction between the acrylic polymers in the pressure-sensitive adhesive layer 22 can be advanced. Specifically, one of the isocyanate compounds is reacted with a hydroxyl group of an acrylic polymer, and the other isocyanate group is reacted with a hydroxyl group of another acrylic polymer, whereby a crosslinking reaction through the isocyanate compound can be promoted.

As an isocyanate compound, diisocyanate, such as an aliphatic diisocyanate, an alicyclic diisocyanate, or an aromatic aliphatic diisocyanate, is mentioned, for example.

Further, examples of the isocyanate compound include polymerized polyisocyanates such as dimers and trimers of diisocyanate, and polymethylene polyphenylene polyisocyanate.

Moreover, as an isocyanate compound, the polyisocyanate which made the excess amount of the above-mentioned isocyanate compound and the active hydrogen-containing compound react is mentioned, for example. Examples of the active hydrogen-containing compound include active hydrogen-containing low molecular weight compounds and active hydrogen-containing high molecular weight compounds.

Moreover, as an isocyanate compound, allophanated polyisocyanate, biuret-type polyisocyanate, etc. can also be used.

The isocyanate compounds described above can be used singly or in combination of two or more.

As the isocyanate compound described above, a reaction product of an aromatic diisocyanate and an active hydrogen-containing low molecular weight compound is preferable. Since the reaction rate of the reaction product of the aromatic diisocyanate group is relatively slow, the pressure-sensitive adhesive layer 22 containing such a reaction product is suppressed from being excessively cured. As the isocyanate compound described above, it is preferable to have 3 or more isocyanate groups in the molecule.

The polymerization initiator contained in the pressure-sensitive adhesive layer 22 is a compound capable of initiating a polymerization reaction by applied heat or energy of light. When the pressure-sensitive adhesive layer 22 contains a polymerization initiator, when heat energy or light energy is applied to the pressure-sensitive adhesive layer 22, a crosslinking reaction between acrylic polymers can be promoted. Specifically, between acrylic polymers having a structural unit of a polymerizable group-containing (meth)acrylate, the polymerization reaction between the polymerizable groups can be initiated, and the pressure-sensitive adhesive layer 22 can be cured. Thereby, the adhesive force of the pressure-sensitive adhesive layer 22 is lowered, and the die-bonding layer 10 can be easily peeled from the cured pressure-sensitive adhesive layer 22 in the pickup step.

As a polymerization initiator, a photoinitiator, a thermal polymerization initiator, etc. are adopted, for example. As the polymerization initiator, a general commercial product can be used.

The pressure-sensitive adhesive layer 22 may further contain components other than the components described above. Examples of other components include tackifiers, plasticizers, fillers, anti-aging agents, antioxidants, ultraviolet absorbers, light stabilizers, heat-resistant stabilizers, antistatic agents, surfactants, light peeling agents, and the like. The type and amount of other components may be appropriately selected depending on the purpose.

Next, the dicing die-bonding film 1 of this embodiment is demonstrated in detail.

The dicing die-bonding film 1 of this embodiment includes the above-described dicing tape 20 and the die-bonding layer 10 laminated on the pressure-sensitive adhesive layer 22 of the dicing tape 20. The die bonding layer 10 is adhered to a semiconductor wafer in manufacturing a semiconductor integrated circuit.

The die bonding layer 10 may contain at least one of a thermosetting resin and a thermoplastic resin. It is preferable that the die bonding layer 10 contains a thermosetting resin and a thermoplastic resin.

As a thermosetting resin, an epoxy resin, a phenol resin, an amino resin, an unsaturated polyester resin, a polyurethane resin, a silicone resin, a thermosetting polyimide resin, etc. are mentioned, for example. As the thermosetting resin, only one type or two or more types are employed. Epoxy resin is preferable as the thermosetting resin from the viewpoint of containing less ionic impurities or the like that may cause corrosion of a semiconductor chip to be subjected to die bonding. As a curing agent for an epoxy resin, a phenol resin is preferable.

Examples of the epoxy resin include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolak type , Orthocresol novolak type, trishydroxyphenylmethane type, tetraphenylolethane type, hydantoin type, trisglycidyl isocyanurate type, or glycidylamine type epoxy resin.

The phenol resin can function as a curing agent for an epoxy resin. As a phenol resin, polyoxystyrene, such as a novolak type phenol resin, a resol type phenol resin, and polyparaoxystyrene, etc. are mentioned, for example.

As a novolak type phenol resin, a phenol novolak resin, a phenol aralkyl resin, a cresol novolak resin, a tert-butylphenol novolak resin, a nonylphenol novolak resin, etc. are mentioned, for example.

As the phenol resin, only one type or two or more types are employed.

In the die bonding layer 10, the hydroxyl group of the phenol resin is per 1 equivalent of the epoxy group of the epoxy resin, preferably 0.5 equivalents or more and 2.0 equivalents or less, and more preferably 0.7 equivalents or more and 1.5 equivalents or less. Thereby, the curing reaction of the epoxy resin and the phenol resin can be sufficiently advanced.

When the die bonding layer 10 contains a thermosetting resin, the content ratio of the thermosetting resin in the die bonding layer 10 is 5% by mass or more and 60% by mass with respect to the total mass of the die bonding layer 10 The following are preferable, and 10 mass% or more and 50 mass% or less are more preferable. Thereby, in the die-bonding layer 10, the function as a thermosetting adhesive can be appropriately expressed.

As the thermoplastic resin that can be included in the die bonding layer 10, for example, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, poly Butadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide resin such as 6-nylon or 6,6-nylon (brand name), phenoxy resin, acrylic resin, saturated polyester resin such as PET or PBT, poly An amidimide resin, a fluororesin, and the like.

As the thermoplastic resin, an acrylic resin is preferable from the viewpoint that the adhesion of the die-bonding layer 10 can be further secured because there are few ionic impurities and high heat resistance.

As the thermoplastic resin, only one type or two or more types are employed.

It is preferable that the said acrylic resin is a polymer in which the structural unit of an alkyl (meth)acrylate is the largest among structural units in a molecule|numerator by mass ratio. As said alkyl (meth)acrylate, a C2-C4 alkyl (meth)acrylate is mentioned, for example.

The acrylic resin may contain a structural unit derived from another monomer component copolymerizable with an alkyl (meth)acrylate monomer.

Examples of the other monomer component include a carboxyl group-containing monomer, an acid anhydride monomer, a hydroxy group-containing monomer, a glycidyl group-containing monomer, a sulfonic acid group-containing monomer, a phosphoric acid group-containing monomer, acrylamide, acrylonitrile, and other functional group-containing monomers, or the like. In addition, various polyfunctional monomers, etc. can be mentioned.

The acrylic resin is preferably an alkyl (meth) acrylate (particularly, an alkyl (meth) acrylate having 4 or less carbon atoms in the alkyl moiety) from the viewpoint of exhibiting a higher cohesive force in the die-bonding layer 10. And, a carboxyl group-containing monomer, a nitrogen atom-containing monomer, and a polyfunctional monomer (especially a polyglycidyl polyfunctional monomer), and more preferably ethyl acrylate, butyl acrylate, acrylic acid, and acrylonitrile. And, it is a copolymer of polyglycidyl (meth)acrylate.

The glass transition temperature (Tg) of the acrylic resin is preferably -50°C or more and 50°C or less, and 10°C or more and 30°C or less from the viewpoint of being easy to set the elasticity and viscosity of the die-bonding layer 10 within a desired range. It is more preferable.

When the die-bonding layer 10 contains a thermosetting resin and a thermoplastic resin, the content ratio of the thermoplastic resin in the die-bonding layer 10 is an organic component excluding a filler (for example, a thermosetting resin, a thermoplastic resin, With respect to the total mass of a silane coupling agent, dye), such as a curing catalyst, Preferably it is 30 mass% or more and 70 mass% or less, More preferably, it is 40 mass% or more and 60 mass% or less, More preferably 45 mass% It is more than 55 mass %. Further, by changing the content ratio of the thermosetting resin, the elasticity and viscosity of the die-bonding layer 10 can be adjusted.

When the thermoplastic resin of the die bonding layer 10 has a thermosetting functional group, as the thermoplastic resin, for example, an acrylic resin containing a thermosetting functional group can be employed. This thermosetting functional group-containing acrylic resin preferably contains a structural unit derived from an alkyl (meth)acrylate in the molecule in the largest mass ratio. As said alkyl (meth)acrylate, the (meth)alkyl (meth)acrylate of the said example is mentioned, for example.

On the other hand, as a thermosetting functional group in the thermosetting functional group-containing acrylic resin, a glycidyl group, a carboxyl group, a hydroxy group, an isocyanate group, etc. are mentioned, for example.

It is preferable that the die-bonding layer 10 contains a thermosetting functional group-containing acrylic resin and a curing agent. Examples of the curing agent include those exemplified as curing agents that can be included in the pressure-sensitive adhesive layer 22. When the thermosetting functional group in the thermosetting functional group-containing acrylic resin is a glycidyl group, it is preferable to use a compound having a plurality of phenol structures as a curing agent. For example, various phenol resins described above can be used as a curing agent.

The die bonding layer 10 preferably contains a filler. By changing the amount of the filler in the die-bonding layer 10, the elasticity and viscosity of the die-bonding layer 10 can be adjusted more easily. In addition, physical properties such as conductivity, thermal conductivity, and elastic modulus of the die-bonding layer 10 can be adjusted.

Examples of the filler include inorganic fillers and organic fillers. As a filler, an inorganic filler is preferable.

Examples of the inorganic filler include silica such as aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, boron nitride, crystalline silica or amorphous silica. The filler to contain is mentioned. Further, examples of the material of the inorganic filler include metal elements such as aluminum, gold, silver, copper, nickel, and alloys. A filler, such as aluminum borate whisker, amorphous carbon black, and graphite, may be sufficient. The shape of the filler may be various shapes such as a spherical shape, a needle shape, and a flake shape. As the filler, only one type or two or more types described above are employed.

The average particle diameter of the filler is preferably 0.005 µm or more and 10 µm or less, and more preferably 0.005 µm or more and 1 µm or less. When the average particle diameter is 0.005 µm or more, wettability and adhesion to an adherend such as a semiconductor wafer are further improved. When the average particle diameter is 10 µm or less, the properties due to the added filler can be more fully exhibited, and the heat resistance of the die bonding layer 10 can be further exhibited. The average particle diameter of the filler can be obtained using, for example, a photometric particle size distribution meter (for example, the product name "LA-910", manufactured by Horiba Seisakusho).

When the die-bonding layer 10 contains a filler, the content ratio of the filler is preferably 30% by mass or more and 70% by mass or less, and more preferably 40% by mass with respect to the total mass of the die-bonding layer 10. It is mass% or more and 60 mass% or less, More preferably, it is 42 mass% or more and 55 mass% or less.

The die-bonding layer 10 may contain other components as necessary. As said other component, a curing catalyst, a flame retardant, a silane coupling agent, an ion trap agent, a dye, etc. are mentioned, for example.

Examples of the flame retardant include antimony trioxide, antimony pentoxide, and brominated epoxy resins.

Examples of the silane coupling agent include β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycidoxypropylmethyldiethoxysilane. have.

As an ion trapping agent, hydrotalcite, bismuth hydroxide, benzotriazole, etc. are mentioned, for example.

As said other additive, only 1 type or 2 or more types are employed.

The die-bonding layer 10 preferably contains a thermoplastic resin (particularly, an acrylic resin), a thermosetting resin, and a filler from the viewpoint of being easy to adjust the elasticity and viscosity.

In the die-bonding layer 10, the content ratio of the thermoplastic resin such as acrylic resin to the total mass of the organic components excluding the filler is preferably 30% by mass or more and 70% by mass or less, and 40% by mass or more and 60% by mass It is more preferable that it is below, and it is still more preferable that it is 45 mass% or more and 55 mass% or less.

With respect to the total mass of the die-bonding layer 10, the content ratio of the filler is preferably 30% by mass or more and 70% by mass or less, more preferably 40% by mass or more and 60% by mass or less, and 42% by mass or more and 55% by mass It is more preferable that it is the following.

The thickness of the die bonding layer 10 is not particularly limited, but is, for example, 1 µm or more and 200 µm or less. Such thickness may be 50 µm or more and 135 µm or less. Even in a dicing die-bonding film provided with such a relatively thick die-bonding layer, breakage of the dicing tape can be suppressed in the expanding process at a low temperature. In addition, when the die-bonding layer 10 is a laminate, the above-described thickness is the total thickness of the laminate.

The glass transition temperature (Tg) of the die bonding layer 10 is preferably 0°C or higher, and more preferably 10°C or higher. When the glass transition temperature is 0° C. or higher, the die bond layer 10 can be easily cleaved by cool expansion. The upper limit of the glass transition temperature of the die bonding layer 10 is, for example, 100°C.

The die bonding layer 10 may have a single-layer structure, for example, as shown in FIG. 1. In this specification, a single layer has only a layer formed of the same composition. The form in which multiple layers formed of the same composition are stacked is also a single layer.

Meanwhile, the die-bonding layer 10 may have a multilayer structure in which layers each formed of two or more different compositions are stacked, for example.

In the dicing die-bonding film 1 of the present embodiment, when used, the pressure-sensitive adhesive layer 22 is cured by irradiation with an active energy ray (for example, ultraviolet rays). Specifically, in a state in which the die bond layer 10 to which the semiconductor wafer is adhered to one side and the pressure-sensitive adhesive layer 22 bonded to the other side of the die bond layer 10 are stacked, at least UV light is applied to the pressure sensitive adhesive. The layer 22 is irradiated. For example, an ultraviolet ray or the like is irradiated from the side on which the base layer 21 is disposed, and the ultraviolet ray or the like passing through the base layer 21 reaches the pressure-sensitive adhesive layer 22. The pressure-sensitive adhesive layer 22 is cured by irradiation such as ultraviolet rays.

Since the pressure-sensitive adhesive layer 22 is cured after irradiation, the adhesive strength of the pressure-sensitive adhesive layer 22 can be lowered, so the die-bonding layer 10 (a state in which the semiconductor wafer is adhered) is relatively easily peeled from the pressure-sensitive adhesive layer 22 after irradiation I can make it.

In the state before use, the dicing die-bonding film 1 of the present embodiment has one side of the die-bonding layer 10 (the side where the die-bonding layer 10 does not overlap the pressure-sensitive adhesive layer 22). You may provide a covering release sheet. The release sheet is used to protect the die-bonding layer 10 and is peeled off immediately before affixing an adherend (for example, a semiconductor wafer) to the die-bonding layer 10.

As this release sheet, the same thing as the release sheet mentioned above can be adopted. This release sheet can be used as a support material for supporting the die bonding layer 10. The release sheet is suitably used when overlapping the die-bonding layer 10 on the pressure-sensitive adhesive layer 22. Specifically, the die-bonding layer 10 is overlaid on the pressure-sensitive adhesive layer 22 in a state in which the release sheet and the die-bonding layer 10 are stacked, and then the release sheet is peeled (transferred) to the pressure-sensitive adhesive layer 22. ) On the die bond layer 10 may be overlapped.

Since the dicing die-bonding film 1 of the present embodiment is configured as described above, it is suppressed from rupture in the expand process (described in detail later) at a low temperature.

Next, the dicing tape 20 of this embodiment and the manufacturing method of the dicing die-bonding film 1 are demonstrated.

The manufacturing method of the dicing die-bonding film 1 of this embodiment,

The process of manufacturing the dicing tape 20 (the manufacturing method of the dicing tape) and the process of manufacturing the dicing die-bonding film 1 by overlapping the die bonding layer 10 on the manufactured dicing tape 20 Equipped.

The manufacturing method (process of manufacturing a dicing tape) of a dicing tape,

Synthesis process of synthesizing acrylic polymer,

The pressure-sensitive adhesive layer manufacturing step of producing the pressure-sensitive adhesive layer 22 by volatilizing a solvent from the pressure-sensitive adhesive composition containing the above-described acrylic polymer, an isocyanate compound, a polymerization initiator, a solvent, and other components appropriately added depending on the purpose ,

A lamination step of laminating the substrate layer 21 and the pressure-sensitive adhesive layer 22 is provided by bonding the pressure-sensitive adhesive layer 22 and the substrate layer 21.

In the synthesis process, an acrylic polymer intermediate is synthesized by radical polymerization of a C9 to C11 alkyl (meth)acrylate monomer and a hydroxyl group-containing (meth)acrylate monomer.

Radical polymerization can be carried out by a general method. For example, the acrylic polymer intermediate can be synthesized by dissolving each monomer described above in a solvent, stirring while heating, and adding a polymerization initiator. In order to adjust the molecular weight of the acrylic polymer, polymerization may be performed in the presence of a chain transfer agent.

Next, the hydroxyl group of a part of the structural unit of the hydroxyl group-containing (meth)acrylate contained in the acrylic polymer intermediate and the isocyanate group of the isocyanate group-containing polymerizable monomer are bonded to each other by a urethanization reaction. Thereby, some of the structural units of the hydroxyl group-containing (meth)acrylate become the structural units of the polymerizable group-containing (meth)acrylate.

The urethanization reaction can be carried out by a general method. For example, in the presence of a solvent and a urethanization catalyst, the acrylic polymer intermediate and the isocyanate group-containing polymerizable monomer are stirred while heating. Thereby, it is possible to urethane bond the isocyanate group of the isocyanate group-containing polymerizable monomer to a part of the hydroxyl groups of the acrylic polymer intermediate.

In the pressure-sensitive adhesive layer production process, for example, an acrylic polymer, an isocyanate compound, and a polymerization initiator are dissolved in a solvent to prepare a pressure-sensitive adhesive composition. By varying the amount of solvent, the viscosity of the composition can be adjusted. Next, the pressure-sensitive adhesive composition is applied to the release sheet. As the coating method, for example, a general coating method such as roll coating, screen coating, and gravure coating is adopted. By subjecting the applied composition to a solvent removal treatment, a solidification treatment, or the like, the applied pressure-sensitive adhesive composition is solidified, and the pressure-sensitive adhesive layer 22 is produced.

In the lamination process, the pressure-sensitive adhesive layer 22 and the base material layer 21 in the state of being superposed on the release sheet are stacked and laminated. Further, the release sheet may be in a state of being overlaid on the pressure-sensitive adhesive layer 22 before use.

In addition, in order to accelerate the reaction between the crosslinking agent and the acrylic polymer, and in order to accelerate the reaction between the crosslinking agent and the surface portion of the base layer 21, after the lamination step, an aging treatment step of 48 hours may be performed in an environment at 50°C. .

In addition, the base material layer 21 may use a commercially available film or the like, or may be produced by forming a film by a general method. As a method of forming a film, a calender film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a dry lamination method, and the like can be mentioned. You may employ a coextrusion molding method.

The dicing tape 20 can be manufactured by these processes.

The manufacturing method (process of manufacturing a dicing die bonding film) of a dicing die-bonding film,

A resin composition preparation step of preparing a resin composition for forming the die-bonding layer 10, and

A die-bonding layer production process for producing the die-bonding layer 10 from the resin composition,

An attaching step of attaching the die bonding layer 10 to the pressure-sensitive adhesive layer 22 of the dicing tape 20 manufactured as described above is provided.

In the resin composition preparation step, for example, an epoxy resin, a curing catalyst of an epoxy resin, an acrylic resin, a phenol resin, a solvent, and the like are mixed, and each resin is dissolved in a solvent to prepare a resin composition. By varying the amount of solvent, the viscosity of the composition can be adjusted. In addition, as these resins, commercially available products can be used.

In the die-bonding layer production process, for example, the resin composition prepared as described above is applied to the release sheet. It does not specifically limit as a coating method, For example, general coating methods, such as roll coating, screen coating, and gravure coating, are adopted. Next, if necessary, the applied composition is solidified by a solvent removal treatment, a curing treatment, or the like, and the die bonding layer 10 is produced.

In the affixing process, the peeling sheets are peeled from the pressure-sensitive adhesive layer 22 of the dicing tape 20 and the die-bonding layer 10, respectively, and both are brought into direct contact with the die-bonding layer 10 and the pressure-sensitive adhesive layer 22. Join. For example, it can be bonded by pressing. The temperature at the time of bonding is not particularly limited, and is, for example, 30°C or more and 50°C or less, and preferably 35°C or more and 45°C or less. The line pressure at the time of bonding is not particularly limited, but is preferably 0.1 kgf/cm or more and 20 kgf/cm or less, and more preferably 1 kgf/cm or more and 10 kgf/cm or less.

The dicing die-bonding film 1 manufactured as described above is used, for example, as an auxiliary tool for manufacturing a semiconductor integrated circuit. Hereinafter, specific examples in use will be described.

A method of manufacturing a semiconductor integrated circuit generally includes a step of cutting out a chip from a semiconductor wafer on which a circuit surface is formed and performing assembly.

This process includes, for example, a half-cut process in which grooves are formed in the semiconductor wafer to process the semiconductor wafer into chips (die) by cutting processing, and the semiconductor wafer is ground to reduce the thickness, and the half-cut processed semiconductor. A mounting step of attaching one side of the wafer (for example, the side opposite to the circuit side) to the die bonding layer 10 to fix the semiconductor wafer to the dicing tape 20, and the half-cut semiconductor chips A pick-up process in which a semiconductor chip (die) is taken out while the die bond layer 10 is affixed by peeling between the die bonding layer 10 and the pressure-sensitive adhesive layer 22, and a die bonding It has a die bonding process in which a semiconductor chip (die) in a state in which the layer 10 is affixed is adhered to an adherend. When performing these processes, the dicing tape (dicing die-bonding film) of this embodiment is used as a manufacturing auxiliary tool.

In the half-cut process, as shown in Figs. 2A to 2D, half-cut processing is performed to cut the semiconductor integrated circuit into small pieces (die). Specifically, the wafer processing tape T is affixed to the surface of the semiconductor wafer on the opposite side to the circuit surface. Further, a dicing ring R is provided on the wafer processing tape T. In the state where the wafer processing tape T is affixed, a dividing groove is formed. While the backgrind tape G is affixed to the grooved surface, the wafer processing tape T that was first affixed is peeled off. With the backgrind tape G affixed, grinding is performed until the semiconductor wafer has a predetermined thickness.

In the mounting process, as shown in Figs. 3A to 3B, after installing the dicing ring R on the pressure-sensitive adhesive layer 22 of the dicing tape 20, the surface of the exposed die-bonding layer 10 is The cut-processed semiconductor wafer is affixed (adhered). After that, the backgrind tape G is peeled from the semiconductor wafer.

In the expanding process, as shown in Figs. 4A to 4C, after the dicing ring R is provided on the pressure-sensitive adhesive layer 22 of the dicing tape 20, it is fixed to the holding tool H of the expander. The dicing die-bonding film 1 is stretched so as to expand in the plane direction by pushing up the pushing member U provided in the expander from the lower side of the dicing die-bonding film 1. Thereby, under a specific temperature condition, the half-cut-processed semiconductor wafer is cut together with the die bonding layer 10. The temperature condition is 0°C or less, for example -20 to 0°C, preferably -15 to 0°C, more preferably -10 to -5°C. The expanded state is released by lowering the push-up member U (cool expand process up to this point). Further, in the expand process, as shown in Figs. 5A to 5B, the dicing tape 20 is stretched to enlarge the area under a higher temperature condition. Thereby, the divided adjacent semiconductor chips are separated in the plane direction of the film surface, and the gap is further widened (room temperature expansion process).

In the pick-up process, as shown in FIG. 6, the semiconductor chip in the state in which the die bonding layer 10 is affixed is peeled from the pressure-sensitive adhesive layer 22 of the dicing tape 20. Specifically, the pin member P is raised, and the semiconductor chip to be picked up is pushed up through the dicing tape 20. The pushed-up semiconductor chip is held by the suction jig J.

In the die bonding process, the semiconductor chip in the state in which the die bonding layer 10 is affixed is adhered to the adherend.

As described above, the dicing die-bonding film 1 (dicing tape 20) of the present embodiment is used in the above-described process, and in the cool-expanding process, at 0°C or less, the die-bonding layer 10 ), the dicing tape 20 is stretched and the wafer is cut together with the die bonding layer 10. Further, in the expanding process at room temperature, the dicing tape 20 is stretched.

In addition, the temperature in the cool expand process is usually 0°C or less, for example, -15°C to 0°C. The temperature in the expand process at room temperature is, for example, a temperature of 10°C to 25°C.

Matters disclosed by this specification include the following.

(One)

For Tanδ, which is the ratio (E"/E') of the storage modulus E'and the loss modulus E" measured by dynamic viscoelasticity measurement,

The dicing tape, wherein the ratio (A/B) of the Tan δ value (A) at -15°C to the Tan δ value (B) at -5°C is 0.75 or more and 2.00 or less.

(2)

The dicing tape according to (1), wherein the strength at 25% tensile at -15°C is 15 [N/20 mm] or more and 30 [N/20 mm] or less.

(3)

A substrate layer and a pressure-sensitive adhesive layer having higher adhesion than the substrate layer,

The dicing tape according to (1) or (2), wherein the thickness of the base layer is 80 µm or more and 150 µm or less.

(4)

The dicing tape according to (3), wherein the thickness of the pressure-sensitive adhesive layer is 5 µm or more and 40 µm or less.

(5)

The value (A) of Tan δ at -15°C is 0.05 or more and 0.50 or less,

The dicing tape according to any one of (1) to (4), wherein the value (B) of Tan δ at -5°C is 0.05 or more and 0.50 or less.

(6)

The base layer includes at least one selected from ethylene-vinyl acetate copolymer (EVA) resin, α-olefin-based thermoplastic elastomer resin, ethylene-methyl acrylate copolymer (EMA) resin, and ionomer resin (IO). The dicing tape according to any one of (3) to (5), including.

(7)

The base layer includes a polypropylene-based elastomer resin, an ethylene-methyl acrylate copolymer (EMA) resin, an ethylene-vinyl acetate copolymer (EVA) resin, an ethylene-vinyl acetate copolymer (EVA) resin, and an ionomer resin (IO). ), or a mixture of an ethylene-vinyl acetate copolymer (EVA) resin and a polypropylene elastomer resin, the dicing tape according to (6) above.

(8)

The dicing tape according to any one of (3) to (7), wherein the base layer has a single layer structure.

(9)

The pressure-sensitive adhesive layer contains an acrylic polymer, and the acrylic polymer includes, in a molecule, a structural unit of an alkyl (meth)acrylate, a structural unit of a hydroxyl group-containing (meth)acrylate, and a polymerizable group-containing (meth)acrylate The dicing tape according to any one of (3) to (8), having at least a structural unit of.

(10)

The dicing tape according to (9), wherein the pressure-sensitive adhesive layer further contains an isocyanate compound and a polymerization initiator.

(11)

The dicing tape according to any one of (3) to (10), wherein the ratio of the thickness of the pressure-sensitive adhesive layer to the total thickness of the dicing tape is 5% or more and 30% or less.

(12)

A dicing die bonding film comprising the dicing tape according to any one of the above (1) to (11) and a die bonding layer bonded to the dicing tape.

(13)

The dicing die-bonding film according to (12), wherein the die-bonding layer has a thickness of 50 µm or more and 135 µm or less.

(14)

It is used in the cool expand process in which the wafer is stretched while the wafer is adhered to the die bond layer at 0°C or less,

The dicing die-bonding film according to (12) or (13), wherein in the cool expand step, the wafer is cut together with the die-bonding layer.

(15)

The dicing tape according to any one of (12) to (14), wherein the die-bonding layer contains at least one of a thermosetting resin and a thermoplastic resin.

(16)

The dicing tape according to (15), wherein the die bonding layer contains an epoxy resin and a phenol resin as the thermosetting resin, and an acrylic resin as the thermoplastic resin.

(17)

The dicing tape according to (15) or (16), wherein the die bonding layer further includes a filler.

Although the dicing tape and dicing die-bonding film of this embodiment are the same as the above example, the present invention is not limited to the dicing tape and dicing die-bonding film of the example.

That is, various forms used in general dicing tapes and dicing die-bonding films can be adopted within a range that does not impair the effects of the present invention.

[Example]

Next, the present invention will be described in more detail by experimental examples, but the present invention is not limited thereto.

A dicing tape was manufactured in the following manner. Further, a dicing die bonding film was produced using this dicing tape.

<Base layer>

Using the products shown below, a single-layered base layer was produced. Specifically, in each of the Examples and Comparative Examples, a substrate layer was formed using an extrusion T-die molding machine. The extrusion temperature conditions were in the range of 180 to 230°C.

(Example 1)

Raw material name: Vistamaxx 3980FL (thickness 125㎛)

Polypropylene-based elastomer resin

ExxonMobil Japan Corporation Vistamaxx series

(Example 2)

·Material name: Rex Pearl EMA EB330H

Ethylene-methylacrylate copolymer resin (EMA)

Nippon Polyethylene Corporation Rex Pearl (REXPEARL EMA) series

(Example 3)

Blend of ethylene-vinyl acetate copolymer resin (EVA) and ionomer resin (IO) (7:3 mass ratio)

·Material name: EV550

Ethylene-vinyl acetate copolymer resin (containing 14% by mass of EVA vinyl acetate)

Mitsui Dow Polychemical's EVAFLEX series

Raw material name: High Milan 1706

Ionomer resin (IO)

High Milan (series) manufactured by Mitsui Dow Polychemical

(Example 4)

Blend of ethylene-vinyl acetate copolymer resin (EVA) and polypropylene elastomer resin (7:3 mass ratio)

·Material name: EV550

Ethylene-vinyl acetate copolymer resin (containing 14% by mass of EVA vinyl acetate)

Mitsui Dow Polychemical's EVAFLEX series

Raw material name: Vistamaxx 3980FL

Polypropylene-based elastomer resin

ExxonMobil Japan Corporation Vistamaxx series

(Comparative Example 1)

Raw material name: Novatech LC720

Low-density polyethylene resin (LDPE)

Novatec LD series made by Nippon Polyethylene Corporation

(Comparative Example 2)

·Material name: WXK1233 (thickness 100㎛)

Metallocene-based polypropylene random copolymer

WINTEC series made by Nippon Polypro

(Example 5)

·Material name: EV250 (thickness 125㎛)

Ethylene-vinyl acetate copolymer resin (contains 28% by mass of EVA vinyl acetate)

Mitsui Dow Polychemical's EVAFLEX series

(Example 6)

·Material name: EV550 (thickness 125㎛)

Ethylene-vinyl acetate copolymer resin (containing 14% by mass of EVA vinyl acetate)

Mitsui Dow Polychemical's EVAFLEX series

<Adhesive layer>

(Synthesis of acrylic polymer)

In a reaction vessel equipped with a cooling tube, a nitrogen introduction tube, a thermometer, and a stirring device, the following raw materials were put so that the monomer concentration was about 55% by mass, and polymerization reaction was performed at 60°C for 10 hours in a nitrogen stream. Thereby, an acrylic polymer intermediate was synthesized.

2-ethylhexyl acrylate (hereinafter also referred to as "2EHA"): 100 parts by mass,

2-hydroxyethyl acrylate (hereinafter also referred to as "HEA"): 20 parts by mass,

Polymerization initiator: appropriate amount,

Polymerization solvent: Toluene

In the presence of 100 parts by mass of the synthesized acrylic polymer intermediate and 1.4 parts by mass of 2-methacryloyloxyethyl isocyanate (hereinafter also referred to as "MOI"), air in the presence of dibutyltin dilaurylate (0.1 parts by mass) The addition reaction was carried out at 50°C for 60 hours in an air stream to synthesize an acrylic polymer.

(Production of adhesive layer)

Next, a pressure-sensitive adhesive solution was prepared with the following composition, and the viscosity was adjusted to 500 mPa·s by appropriately adding toluene.

Synthesized acrylic polymer: 100 parts by mass,

・Polyisocyanate compound

(Product name "Coronate L", made by Nippon Polyurethane)

: 1.1 parts by mass,

·Photopolymerization initiator

(Product name ``Irgacure 184'', manufactured by Chiba Specialty Chemicals):

: 3 parts by mass

As a release sheet, a PET film was prepared. On the side of the release sheet, the pressure-sensitive adhesive solution prepared as described above was applied using an applicator. Further, on one side of the release sheet (PET-based film), a silicone treatment was applied as a release treatment, and a pressure-sensitive adhesive solution was applied to the side to which the release treatment was performed. After application, drying treatment was performed by heating at 120° C. for 2 minutes, and a pressure-sensitive adhesive layer having a thickness of 10 μm was produced on the release sheet.

<Production of dicing tape>

Using a laminator, the exposed surface of the pressure-sensitive adhesive layer prepared on the release sheet and each base material layer (thickness 125 μm) were bonded at room temperature to prepare a dicing tape.

<Production of the die bond layer>

The following (a) to (d) were dissolved in methyl ethyl ketone to prepare a resin composition having a solid content concentration of 40 to 50% by mass.

(a) Acrylic resin (product name "Teisan Resin SG-280EK23" manufactured by Nagase Chemtex): 15% by mass

(b) Epoxy resin (product name "EPPN501H" manufactured by Nippon Kayaku Corporation): 29% by mass

(c) Novolac-type phenol resin (product name "HF-1M" manufactured by Meiwa Kasei) 16% by mass

(d) Inorganic filler (silica) (product name "SE-2050MCV" manufactured by Admatex): 40% by mass

The resin composition was applied onto a release-treated film (release sheet) made of a 50 µm-thick polyethylene terephthalate film subjected to silicone release treatment. Then, drying treatment was performed at 130 degreeC for 2 minutes. Thereby, a die-bonding layer having a thickness (average thickness) of 60 µm was produced. By bonding the produced die-bonding layers having a thickness of 60 µm, a die-bonding layer having a thickness of 120 µm was produced. In addition, the lamination conditions at the time of bonding were 80 degreeC, 0.15 MPa, and 10 mm/s (second).

<Production of dicing die bond film>

The produced die-bonding layer was cut into a circle with a diameter of 330 mm, and bonded to each dicing tape (temperature: 25°C, speed 10 mm/sec, pressure 0.15 MPa).

After that, only the portion to which the die-bonding layer was bonded was irradiated with ultraviolet rays (300 mJ/cm 2) to prepare a dicing die-bonding film.

In the manner described above, the dicing tapes and dicing die-bonding films of Examples and Comparative Examples were manufactured according to the above-described method, using the base layer of the configuration shown in Table 1.

Table 1 shows the physical properties of each dicing tape (such as Tan δ by dynamic viscoelasticity measurement).

<Tanδ at each temperature (-15℃, -5℃) by dynamic viscoelasticity measurement>

In the following manner, for each dicing tape, Tan δ at each temperature was calculated.

A test sample of the size (width) shown below was cut out from the die-bonding film to prepare a test sample. Using a solid viscoelasticity measuring device (measuring device: RSA-G2, manufactured by TA Corporation), the dynamic storage modulus was measured in a tensile mode under the following test conditions.

Width of test sample: 10 mm,

Chuck distance: 20mm,

Heating rate: 10℃/min,

Test temperature: -30 to 100°C,

Frequency: 1Hz

Storage modulus E'and loss modulus E" at -15°C and -5°C were measured, respectively, and Tan δ was calculated by the calculation formula of Tan δ = E"/E'. The average value of each of the three measurements was adopted. The higher Tan δ, the higher the viscosity property. In addition, the measurement was performed in both the MD direction and the TD direction, and the higher the measured value was adopted as a result.

<Measurement of strength by a tensile tester (at 25% tension)>

Using a tensile tester, the dicing tape provided with the base layer and the pressure-sensitive adhesive layer was measured for strength at 25% tensile under the following test conditions. The average value of each of the three measurements was adopted. In addition, the measurement was performed in both the MD direction and the TD direction, and the one with a higher measurement value was adopted as a final value.

Measuring temperature: -15℃,

Width of test sample: 10 mm,

Chuck distance: 50mm,

Tensile speed: 300mm/min

<Evaluation of rupture suppression performance and severability at the time of expansion>

A blade half-cut was performed on a 12-inch wafer so as to be cut into a chip size of 10 mm x 10 mm. This 12-inch wafer was back-grind (polished) until it reached a thickness of 40 µm. Then, it bonded with the dicing die bonding film. In addition, the wafer bonding temperature was 70°C and the bonding speed was 10 mm/sec.

Thereafter, the semiconductor wafer and the die-bonding layer were cut, and further, the dicing tape was thermally contracted using a die separator DDS2300 manufactured by Disco Corporation.

Specifically, in the cool expander unit, the semiconductor wafer and the die bonding layer were cut under the conditions of an expand temperature of -15°C, an expand speed of 300 mm/sec, and an expand amount of 16 mm.

Subsequently, in the heat expander unit, the dicing sheet is prevented from bursting by heat shrinking the dicing tape under the conditions of an expand amount of 7 mm, a heat temperature of 220°C, an air volume of 40 L/min, a heat distance of 20 mm, and a rotation speed of 5°/sec. The performance was evaluated. What did not rupture the tape was evaluated as ?, and what occurred was evaluated as x.

Regarding the slicing property, the case where the breaking rate was less than 80% was evaluated as x, the case of 80% or more was evaluated as ○, and the case where it was 90% or more was evaluated as?

As understood from the above evaluation results, the dicing die-bonding film of the example was suppressed from rupture in the expand process at a low temperature as compared with the dicing die-bonding film of the comparative example.

Further, according to the dicing tape having a strength of 15 [N/20 mm] or more at 25% tensile strength at -15°C, the cutting property could be improved.

In the dicing tapes of the examples, the ratio (A/B) of the Tan δ value (A) at -15°C to the Tan δ value (B) at -5°C is 0.75 or more.

The value of Tan delta becomes an index of the high viscosity of the dicing tape at that temperature. The above-described ratio (A/B) of 0.75 or more indicates that the viscosity at a lower temperature of -15°C is not significantly lowered compared to the viscosity at -5°C. Therefore, even if the dicing tape is stretched at -15°C, it is considered that rupture is suppressed as the viscosity is not so reduced.

The above-described properties of the dicing tape are particularly advantageous when the thickness of the die bonding layer is relatively thick (for example, 50 µm or more and 135 µm or less). Specifically, in the expanding process, if the thickness of the die bond layer is relatively thick, a relatively large force is required until the die bond layer is cut together with the wafer. Therefore, a large force is applied to the dicing tape itself to be stretched until the wafer and the die bond layer are cut. Due to this influence, until the die-bonding layer is cut, there is a fear that the stretched dicing tape itself may be deformed, that is, it may rupture.

However, since the dicing tape of this embodiment has the physical properties specified by Tan δ as described above, the viscosity is not significantly lowered even at a low temperature of 0° C. or lower, and as described above, it is not suitable for the expansion process at a low temperature. It is thought that rupture is suppressed.

The dicing tape and dicing die-bonding film of the present invention are suitably used, for example, as auxiliary tools when manufacturing a semiconductor integrated circuit.

1: dicing die bond film
10: die bond layer
20: dicing tape
21: base layer
22: adhesive layer

Claims (7)

For Tanδ, which is the ratio (E"/E') of the storage modulus E'and the loss modulus E" measured by dynamic viscoelasticity measurement,
The dicing tape, wherein the ratio (A/B) of the Tan δ value (A) at -15°C to the Tan δ value (B) at -5°C is 0.75 or more. The method of claim 1,
A dicing tape having a strength of 15 [N/20 mm] or more at 25% tensile strength at -15°C. The method according to claim 1 or 2,
A substrate layer and a pressure-sensitive adhesive layer having higher adhesion than the substrate layer,
A dicing tape having a thickness of the base layer of 80 μm or more and 150 μm or less. The method of claim 3,
The thickness of the pressure-sensitive adhesive layer is 5 μm or more and 40 μm or less. A dicing die-bonding film comprising the dicing tape according to claim 1 or 2, and a die-bonding layer bonded to the dicing tape. The method of claim 5,
A dicing die-bonding film, wherein the die-bonding layer has a thickness of 50 µm or more and 135 µm or less. The method of claim 5,
It is used in the cool expand process in which the wafer is stretched while the wafer is adhered to the die bond layer at 0°C or less,
A dicing die-bonding film in which the wafer is cut together with the die-bonding layer in the cool expand process.

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