KR102394516B1 - Dicing sheet, method for producing dicing sheet, and method for producing molded chip - Google Patents

Abstract

It is a dicing sheet provided with a base material and the adhesive layer laminated|stacked on at least one surface of a base material, The storage elastic modulus in 23 degreeC of an adhesive layer is 50 kPa or more and 80 kPa or less in the state before energy ray irradiation, In addition, in the state after energy ray irradiation, 5.0 MPa or more and 120 MPa or less, the thickness of the pressure-sensitive adhesive layer is less than 20 µm, and the surface of the pressure-sensitive adhesive layer is in the state before energy ray irradiation, JIS Z 0237: 1991 In the described method, the amount of energy measured using a probe tack under the condition that the peeling rate is changed to 1 mm/min is 0.10 mJ/5 mmφ or more and 0.8 mJ/5 mmφ or less. In such a dicing sheet, the problem in a dicing process and the problem regarding the print visibility in a mold chip do not generate|occur|produce easily. In addition, by using such a dicing sheet, it is possible to manufacture a molded chip which is excellent in print visibility and is excellent in quality and advantageous in terms of cost.

Description

A dicing sheet, the manufacturing method of a dicing sheet, and the manufacturing method of a molded chip TECHNICAL FIELD

The present invention relates to a dicing sheet used when dicing a mold package such as a semiconductor package in which a plurality of chip-like components, such as a semiconductor chip, are resin-sealed. Moreover, this invention relates to the manufacturing method of said dicing sheet, and the manufacturing method of a mold chip using said dicing sheet.

A component in which a chip-like component such as a semiconductor chip is resin-sealed (referred to as a "mold chip" in this specification) is usually manufactured as follows, taking the case where the chip-like component to be sealed is a semiconductor chip as an example.

First, a semiconductor chip is mounted on each base of an aggregate formed by connecting a plurality of bases such as a TAB tape, and these semiconductor chips are collectively resin-sealed to form an electronic component assembly (referred to as "semiconductor package" in this specification). get

Next, the semiconductor package is fixed to the dicing sheet by affixing the adhesive sheet (referred to as a "dicing sheet" in this specification) provided with a base material and an adhesive layer on one surface of a semiconductor package. The semiconductor package fixed to this dicing sheet is cut and separated (diced) into pieces, and a member in which a plurality of mold chips are closely arranged on the dicing sheet is produced (dicing step).

Usually, the adhesive layer of a dicing sheet is designed so that the adhesiveness of the adhesive layer with respect to a to-be-adhered surface may fall by a specific stimulus, and energy-beam irradiation is employ|adopted as a specific stimulus, for example. And before the following process is implemented, the process of irradiating an energy ray to a dicing sheet, and reducing the adhesiveness of the adhesive layer with respect to a to-be-adhered surface is included.

Then, as needed, the dicing sheet in this member is expanded (extended in the main surface inward direction), and the space|interval of the mold chip arrange|positioned on the dicing sheet is enlarged (expanding process).

In this way, the mold chips in a state separated from each other on the dicing sheet are individually picked up and separated from the dicing sheet (pickup step), and transferred to the next step. At this time, it becomes easy to pick-up by including the process of reducing the adhesiveness of the said adhesive layer with respect to the surface of a mold chip.

In a dicing process among this series of processes, it is calculated|required that the semiconductor package and the mold chip by which it is diced maintain the state fixed on the dicing sheet. From a viewpoint of achieving this objective, it is preferable that the adhesive layer of a dicing sheet has high adhesiveness before energy-beam irradiation with respect to the surface of the semiconductor package, and the surface of a mold chip.

Here, in the case where the adherend of the dicing sheet is a semiconductor package, the adherend surface is usually the surface of the encapsulating resin, and the unevenness of the adherend surface tends to be larger than in the case where the semiconductor wafer is the adherend. For this reason, when a dicing sheet having a semiconductor wafer as an adherend is diverted as a dicing sheet used in the above process for a semiconductor package, the above-mentioned adhesiveness to the adherend surface becomes insufficient, and the semiconductor package is cut in the dicing process. During the process, a problem arises in that the mold chip formed by separating the semiconductor package into pieces peels off from the dicing sheet and scatters. Hereinafter, this problem which arises in a dicing process is called "chip scattering".

For the purpose of reducing the possibility of this chip scattering, for example, as described in Cited Document 1, with respect to the pressure-sensitive adhesive layer of the dicing sheet, to improve the adhesion to the adherend surface in the state before energy ray irradiation Incorporation of a resin material (referred to as "tackifying resin" in this specification) for

Japanese Laid-Open Patent Publication No. 2005-229040

A general rosin-based material as the tackifying resin is a preferable material from the viewpoint of improving the adhesion to the adherend surface of the pressure-sensitive adhesive layer, ie, the resin encapsulation surface of the mold package. However, when the resin encapsulation surface has a printed portion formed by a concave portion formed by removing a resin material by laser processing or the like, the following problem may occur. That is, by containing a tackifying resin in the pressure-sensitive adhesive layer included in the dicing sheet, it can be achieved to improve the adhesion to a surface with relatively large irregularities such as a resin sealing surface, but when the resin sealing surface has a printing portion, The material constituting the pressure-sensitive adhesive layer tends to enter the concave portion of the printing portion. For this reason, when the mold chip obtained by separating the mold package into pieces is separated from the dicing sheet, the material which comprises an adhesive layer remains in the recessed part of a printing part, and the visibility of printing may fall. Since the resin encapsulation surface has generally larger irregularities than semiconductor wafers or protective films, when printing is performed by forming recesses in the resin encapsulation surface, the level of the irregularities tends to become large. For this reason, it is easy to generate|occur|produce the problem of the visibility fall of the said printing|printing.

The present invention is to provide a dicing sheet that does not easily cause problems in the dicing process and print visibility in the mold chip, and a method for manufacturing a molded chip using the dicing sheet. intended to provide

The present invention provided to achieve the above object is as follows.

(1) A dicing sheet provided with a base material and the adhesive layer laminated|stacked on at least one surface of the said base material, The storage elastic modulus in 23 degreeC of the said adhesive layer is 50 kPa in the state before energy-beam irradiation More than 80 kPa, and more than 5.0 MPa and not more than 120 MPa in the state after the energy ray is irradiated, the thickness of the pressure-sensitive adhesive layer is less than 20 µm, and the surface of the pressure-sensitive adhesive layer is in the state before the energy ray is irradiated , JIS Z 0237: In the method described in 1991, the amount of energy measured using a probe tack under the condition that the peeling rate is changed to 1 mm/min, 0.10 mJ/5 mmφ or more and 0.8 mJ/5 mmφ or less Characterized by a dicing sheet.

(2) In use, the dicing according to (1), wherein a resin sealing surface of the mold package is affixed to the surface opposite to the substrate side of the pressure-sensitive adhesive layer, and the resin sealing surface has a printing portion formed by a concave portion. Sheet.

(3) The dicing sheet according to the above (2), wherein the average depth of the concave portions of the printing portion on the resin-encapsulating surface is 0.5 µm or more.

(4) the pressure-sensitive adhesive layer is formed from a pressure-sensitive adhesive composition containing an acrylic polymer (A) having an energy ray polymerizable group and a reactive functional group, and an isocyanate-based crosslinking agent capable of crosslinking reaction with the reactive functional group (B), and the acrylic polymer (A) is the acrylic polymer (A1) having a reactive functional group and the isocyanate compound (A2) having an energy ray polymerizable group in the presence of an organometallic catalyst (C) containing at least one of titanium and zirconium The dicing sheet according to any one of (1) to (3), which is obtained by reacting.

(5) The mass ratio of the monomer (m1) providing the structural unit having the reactive functional group in the acrylic polymer (A1) to the entire monomer giving the acrylic polymer (A1) is 5 mass% or more 30 The dicing according to (4), wherein the amount of the compound (A2) used in the reaction for forming the acrylic polymer (A) is not less than 0.4 equivalents and not more than 0.8 equivalents based on the monomer (m1). Sheet.

(6) The dicing sheet according to (4) or (5), wherein the organometallic catalyst (C) contains a zirconium-containing chelate compound.

(7) The adhesive layer side surface of the dicing sheet according to any one of (1) to (6) is affixed to the resin sealing surface of the mold package, and the mold package on the dicing sheet is cut into pieces The manufacturing method of the mold chip which converts and obtains a some mold chip.

ADVANTAGE OF THE INVENTION According to this invention, the dicing sheet which hardly raises the problem in a dicing process and the problem regarding the print visibility in the mold chip mentioned above is provided. In addition, by using such a dicing sheet, it is possible to manufacture a molded chip which is excellent in print visibility and is excellent in quality and advantageous in terms of cost.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described.

1. Dicing sheet

The dicing sheet which concerns on one Embodiment of this invention is equipped with a base material and an adhesive layer.

(1) description

As long as the base material of the dicing sheet which concerns on this embodiment does not fracture|rupture in a pick-up process etc., limitation in particular is not carried out, The material is not specifically limited, Usually, it is comprised from the film which mainly has a resin material. Specific examples of the film include polyethylene films such as low-density polyethylene (LDPE) films, linear low-density polyethylene (LLDPE) films, and high-density polyethylene (HDPE) films, polypropylene films, polybutene films, polybutadiene films, and polymethylpentene films. , polyolefin-based films such as an ethylene-norbornene copolymer film and a norbornene resin film; Polyvinyl chloride-type films, such as a polyvinyl chloride film and a vinyl chloride copolymer film; Polyester-type films, such as a polyethylene terephthalate film and a polybutylene terephthalate film; polyurethane film; polyimide film; ionomer resin film; ethylene-based copolymer films such as an ethylene-vinyl acetate copolymer film, an ethylene-(meth)acrylic acid copolymer film, and an ethylene-(meth)acrylic acid ester copolymer film; polystyrene film, polycarbonate film; fluororesin film; And the film etc. which mainly have water additives and modified substances of these resins are mentioned. Moreover, these crosslinked films and copolymer films are also used. Single 1 type may be sufficient as said base material, and the laminated|multilayer film which combined these 2 or more types may be sufficient as it. In addition, "(meth)acrylic acid" in this specification means both acrylic acid and methacrylic acid. The same is true for other similar terms.

The base material may contain various additives, such as a colorant, a flame retardant, a plasticizer, an antistatic agent, a lubricant, and a filler, in the film which has the said resin material as a main component. As a coloring agent, pigments, such as titanium dioxide and carbon black, various dyes, etc. are mentioned, for example. Further, as the filler, an organic material such as a melamine resin, an inorganic material such as fumed silica, and a metallic material such as nickel particles are exemplified. The content of these additives is not particularly limited, but should be limited to a range in which the substrate exhibits a desired function and does not lose desired smoothness or flexibility.

When using an ultraviolet-ray as an energy ray irradiated in order to harden an adhesive layer, it is preferable that a base material has transparency with respect to an ultraviolet-ray. Moreover, when using an electron beam as an energy beam, it is preferable that the base material has the permeability|transmittance of an electron beam.

The thickness of the base material is not limited as long as the dicing sheet can properly function in each of the steps described above. Preferably it is in the range of 20-450 micrometers, More preferably, it is 25-200 micrometers, Especially preferably, it exists in the range of 50-150 micrometers.

The elongation at break of the substrate in the present embodiment is preferably 100% or more, and particularly preferably 200% or more and 1000% or less, as a value measured at 23°C and 50% relative humidity. The substrate having the above elongation at break of 100% or more does not break easily even when the expand step is performed, and the mold chip formed by cutting the mold package is easily separated. In addition, elongation at break is the elongation rate with respect to the original length of the length of the test piece at the time of the breakage of the test piece in the tensile test based on JISK7161:1994.

In addition, the tensile stress at 25% strain measured by a test based on JIS K 7161: 1994 of the substrate in this embodiment is preferably 5 N/10 mm or more and 15 N/10 mm or less, and the maximum tensile stress is It is preferable that they are 15 Mpa or more and 50 Mpa or less. If the tensile stress at 25% strain is less than 5 N/10 mm or the maximum tensile stress is less than 15 MPa, after attaching the mold package to the dicing sheet and fixing it to the ring frame, the base material is flexible, so there is no looseness. Occurs, and may cause a conveyance error. On the other hand, if the tensile stress at the time of 25% strain exceeds 15 N/10 mm or the maximum tensile stress exceeds 50 MPa, the load applied to the dicing sheet increases when the expand process is performed, so that the There exists a possibility that the problem, such as peeling of the dicing sheet itself, may arise. Elongation at break, tensile stress at 25% strain, and maximum tensile stress in the present invention refer to values measured in the elongate direction of the substrate.

(2) adhesive layer

The pressure-sensitive adhesive layer included in the dicing sheet according to the present embodiment has a thickness of less than 20 µm and has predetermined characteristics such as a storage elastic modulus, as will be explained next. In a preferred embodiment, the pressure-sensitive adhesive layer is formed from a pressure-sensitive adhesive composition containing an acrylic polymer (A) having an energy ray polymerizable group and a reactive functional group, and an isocyanate-based crosslinking agent (B) capable of crosslinking reaction with a reactive functional group.

(2-1) thickness

The thickness of the adhesive layer with which the dicing sheet which concerns on this embodiment is equipped is less than 20 micrometers. When the thickness of the pressure-sensitive adhesive layer is less than 20 µm, the pressure-sensitive adhesive residue is less likely to be generated, and the possibility of occurrence of a problem in the dicing process is reduced. Moreover, the problem regarding the print visibility in the above-mentioned mold chip does not arise easily. In particular, when the period from the time the dicing process is performed to separate the mold package into pieces to form a mold chip and the time until irradiation with energy rays is long (for example, 30 days), the thickness of the pressure-sensitive adhesive layer is 20 µm or more On the other hand, the adhesion of the pressure-sensitive adhesive layer to the surface of the mold chip becomes excessively high, and even if irradiated with energy rays, the above-mentioned adhesion is not reduced appropriately, and the problem regarding the print visibility in the above-described mold chip tends to occur. there is. Since the thickness of the adhesive layer is less than 20 micrometers in the dicing sheet which concerns on this embodiment, it is hard to raise|generate the problem regarding the print visibility in such a mold chip mentioned above. It is preferable to set it as 17 micrometers or less, as for the thickness of the adhesive layer with which the dicing sheet which concerns on this embodiment is equipped, it is more preferable to set it as 13 micrometers or less, It is especially preferable to set it as 10 micrometers or less. From the viewpoint of stably realizing the pressure-sensitive adhesive layer having an appropriate adhesiveness to the adherend surface, the thickness of the pressure-sensitive adhesive layer is preferably 2 µm or more, more preferably 4 µm or more, and particularly preferably 5 µm or more. Therefore, the most preferable thickness of an adhesive layer is 5 micrometers or more and 10 micrometers or less.

(2-2) storage modulus

The storage elastic modulus at 23 degreeC of the said adhesive layer before irradiating an energy ray with respect to the adhesive layer with which the dicing sheet which concerns on this embodiment is equipped (it is also called "elastic modulus before irradiation" in this specification) is 50 kPa or more 80 kPa or less.

When the modulus of elasticity before irradiation is in the above range, the material constituting the pressure-sensitive adhesive layer before energy ray irradiation does not easily enter the concave portion of the surface of the encapsulating resin of the mold package, which is the adhered surface of the pressure-sensitive adhesive layer. The problem regarding the visibility of the print in the . Moreover, when the elastic modulus before irradiation exists in the said range, the adhesiveness with respect to the to-be-adhered surface of an adhesive layer becomes appropriate, and chip scattering becomes difficult to generate|occur|produce. From the viewpoint of more stably reducing the problem of print visibility in the above-described molded chip and the possibility of chip scattering, the elastic modulus before irradiation is preferably 50 kPa or more and 75 kPa or less, more preferably 50 kPa or more and 70 kPa or less desirable.

The storage elastic modulus (also referred to as "elastic modulus after irradiation" in this specification) at 23 degreeC of the said adhesive layer after irradiating an energy ray with respect to the adhesive layer with which the dicing sheet which concerns on this embodiment is equipped is 5.0 MPa or more, 120 MPa or less.

When the modulus of elasticity after irradiation is 5.0 MPa or more, the material constituting the pressure-sensitive adhesive layer after energy ray irradiation does not easily remain in the concave portion of the surface of the encapsulating resin of the mold package, which is the adhered surface of the pressure-sensitive adhesive layer, in the concave portion constituting the printing portion. As a result, the problem of print visibility in the mold chip described above is less likely to occur. From the viewpoint of stably realizing that the problem regarding print visibility in the above-described mold chip is less likely to occur, the elastic modulus after irradiation is preferably 10 MPa or more, more preferably 15 MPa or more, and 20 MPa or more Especially preferred.

When the modulus of elasticity after irradiation is 120 MPa or less, the material constituting the pressure-sensitive adhesive layer that has entered the concave portion of the surface of the encapsulating resin of the mold package, which is the adherend surface of the pressure-sensitive adhesive layer, in the concave portion constituting the printing portion, in the pick-up process, It becomes easy to space|separate suitably from said recessed part. For this reason, the problem regarding the print visibility in the above-mentioned mold chip does not generate|occur|produce easily. From the viewpoint of stably realizing that the problem regarding print visibility in the above-described mold chip is less likely to occur, the elastic modulus after irradiation is preferably 100 MPa or less, more preferably 80 MPa or less, and 60 MPa or less It is more preferable, and it is especially preferable that it is 50 MPa or less.

(2-3) Tack Value

The surface of the pressure-sensitive adhesive layer of the dicing sheet according to the present embodiment is in a state before energy ray irradiation, and in the method described in JIS Z 0237: 1991, the peeling rate is changed to 1 mm/min. The amount of energy (also referred to as "tack value" in this specification) measured using This tack value is calculated|required as an integrated value of the peak measured from the start of a measurement until a probe peels. By the tack value being in the above range, it is possible to suppress the occurrence of chip scattering. From the viewpoint of more stably reducing the possibility of chip scattering, the tack value is preferably 0.13 mJ/5 mmφ or more and 0.75 mJ/5 mmφ or less, and 0.15 mJ/5 mmφ or more and 0.7 mJ/5 mmφ or less. It is more preferable, and it is especially preferable that they are 0.18 mJ/5 mmphi or more and 0.65 mJ/5 mmphi or less.

(2-4) Acrylic polymer (A)

In a preferable aspect, the adhesive composition for forming the adhesive layer with which the dicing sheet which concerns on this embodiment is equipped contains the acrylic polymer (A) which has an energy-beam polymeric group and a reactive functional group. The acrylic polymer (A) is an acrylic polymer comprising, as a unit constituting the skeleton, a structural unit based on an acrylic compound having an energy ray polymerizable group and a reactive functional group. The acrylic polymer (A) may be a homopolymer obtained by polymerization of one type of monomer, or may be a copolymer formed by polymerization of a plurality of types of monomers. It is preferable that the acrylic polymer (A) is a copolymer from a viewpoint of being easy to control the physical property and chemical property of a polymer.

It is preferable that the polystyrene conversion weight average molecular weights (Mw) of an acrylic polymer (A) are 10,000-2 million. Such an acrylic polymer (A) produces the effect of maintaining the cohesiveness of the adhesive layer which is a general function of an adhesive main body, and such an effect is exhibited further, so that molecular weight is high. On the other hand, when the molecular weight of an acrylic polymer (A) is too large, in manufacturing an adhesive layer, it may become difficult to thin-layer. Therefore, as for the polystyrene conversion weight average molecular weight (Mw) of an acrylic polymer (A), it is more preferable that it is 100,000-1,500,000. Moreover, the glass transition temperature Tg of an acrylic polymer (A) becomes like this. Preferably it is -70-30 degreeC, More preferably, it exists in the range of -60-20 degreeC. In addition, the polystyrene conversion weight average molecular weight in this specification is the value of polystyrene conversion measured by the gel permeation chromatography (GPC) method.

The reactive functional group of the acrylic polymer (A) is a functional group capable of crosslinking reaction with an isocyanate-based crosslinking agent (B) described later, and examples thereof include a hydroxyl group, a carboxyl group, and an amino group. Among these, a hydroxyl group with high reactivity with the isocyanate group which concerns on an isocyanate type crosslinking agent (B) is preferable as a reactive functional group which the acrylic polymer (A) has.

The kind of energy-beam polymerizable group which an acrylic polymer (A) has is not specifically limited. As the specific example, the functional group etc. which have ethylenically unsaturated bonds, such as a vinyl group and a (meth)acryloyl group, are mentioned. From the viewpoint of excellent polymerization reactivity, the energy-beam polymerizable group is preferably a functional group having an ethylenically unsaturated bond, and among them, a (meth)acryloyl group is more preferable from the viewpoint of high reactivity when irradiated with energy rays.

An ionizing radiation, ie, an X-ray, an ultraviolet-ray, an electron beam, etc. are mentioned as an energy beam for making an energy-beam polymeric group react. Among these, the ultraviolet-ray with comparatively easy introduction|transduction of irradiation equipment is preferable.

When using an ultraviolet-ray as an ionizing radiation, what is necessary is just to use the near-ultraviolet-ray containing ultraviolet-ray with a wavelength of about 200-380 nm from handling easiness. The amount of ultraviolet light may be appropriately set according to the type of energy-beam polymerizable group of the acrylic polymer (A) or the thickness of the pressure-sensitive adhesive layer, and is usually about 50 to 500 mJ/cm 2 , preferably 100 to 450 mJ/cm 2 , 150 to 400 mJ/cm 2 are more preferable. Moreover, ultraviolet illuminance is about 50-500 mW/cm<2> normally, 100-450 mW/cm<2> is preferable, and 150-400 mW/cm<2> is more preferable. There is no restriction|limiting in particular as an ultraviolet source, For example, a high pressure mercury lamp, a metal halide lamp, etc. are used.

When using an electron beam as an ionizing radiation, about the acceleration voltage, what is necessary is just to set suitably according to the kind of energy-beam polymeric group which an acrylic polymer (A) has, and the thickness of an adhesive layer, and about 10-1000 kV of acceleration voltages normally. It is preferable to be In addition, what is necessary is just to set the irradiation dose in the range which reaction of the energy-beam polymeric group which the acrylic polymer (A) has suitably advances, and is normally selected in the range of 10-1000 krad. There is no restriction|limiting in particular as an electron beam source, For example, various electron beam accelerators, such as a Cockcroft Walton type, a Van der Graf type, a resonance transformer type, an insulated core transformer type, or a linear type, a dynamtron type, a high frequency type, can be used. .

The acrylic polymer (A) is an acrylic polymer (A1) having a reactive functional group and an isocyanate compound (A2) having an energy ray polymerizable group in the presence of an organometallic catalyst (C) containing at least one of titanium and zirconium obtained by reacting. By reacting in the presence of such an organometallic catalyst (C), the adhesive composition containing the obtained acrylic polymer (A) becomes possible to form the adhesive layer which has an appropriate elastic modulus before irradiation and an appropriate tack value.

(2-4-1) Acrylic polymer (A1)

The acrylic polymer (A1) is an acrylic polymer having the above-mentioned reactive functional group. It is preferable that the mass ratio of the monomer (m1) providing a structural unit having a reactive functional group in the acrylic polymer (A1) to the entire monomer giving the acrylic polymer (A1) is 5 mass% or more and 30 mass% or less. . By satisfying the regulation regarding the above mass ratio, the pressure-sensitive adhesive composition containing the acrylic polymer (A) obtained from the acrylic polymer (A1) can form a pressure-sensitive adhesive layer having an appropriate elastic modulus before irradiation and an appropriate tack value. It is preferable that said mass ratio is 7 mass % or more and 25 mass % or less, It is more preferable that they are 10 mass % or more and 20 mass % or less, It is especially preferable that they are 12 mass % or more and 17 mass % or less.

Taking the case where the acrylic polymer (A1) has a hydroxyl group as a reactive functional group as a specific example, the monomer for forming an acrylic polymer (A1) is demonstrated.

As a monomer (also referred to as "raw material monomer" in this specification) that can be a raw material for forming the acrylic polymer (A1) having a hydroxyl group as described above, an acrylic monomer having a hydroxyl group (in this specification, "hydroxyacrylic monomer") '), a non-acrylic monomer having a hydroxyl group, an acrylic monomer not having a hydroxyl group, and a non-acrylic monomer having no hydroxyl group. The acrylic polymer (A1) having a hydroxyl group includes, among the above raw material monomers, a structural unit derived from at least one of a hydroxyacrylic monomer and an acrylic monomer not having a hydroxyl group so that the polymer becomes an acrylic polymer. , a structural unit derived from at least one of a hydroxyacrylic monomer and a non-acrylic monomer having a hydroxyl group so that the polymer (A1) has a hydroxyl group.

As a specific example of a hydroxyacrylic monomer, (meth)acrylate etc. which have hydroxyl groups, such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, N-methylolacrylamide, etc. are mentioned can Moreover, hydroxyvinyl acetate etc. are mentioned as a specific example of the non-acrylic monomer which has a hydroxyl group. It is preferable that the acrylic polymer which has a hydroxyl group contains the structural unit derived from a hydroxyacrylic monomer from a viewpoint of improving handleability, or a viewpoint of facilitating adjustment of the physical property of an adhesive layer. As for the monomer which has these hydroxyl groups, the monomer which has only one hydroxyl group is preferable at the point which becomes easy to control the abundance of the energy-beam polymeric group in an acrylic polymer (A).

Specific examples of the acrylic monomer having no hydroxyl group among the raw material monomers include (meth)acrylic acid, (meth)acrylic acid ester, and derivatives thereof (acrylonitrile, etc.). If specific examples are further shown with respect to (meth)acrylic acid ester, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylic (meth)acrylates having a chain skeleton such as a rate; Cycloalkyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl ( (meth)acrylates having cyclic skeletons such as meth)acrylate, tetrahydrofurfuryl (meth)acrylate, and imide acrylate; (meth)acrylate which has reactive functional groups other than hydroxyl groups, such as glycidyl (meth)acrylate and N-methylaminoethyl (meth)acrylate, is mentioned. Moreover, when the acrylic monomer which does not have a hydroxyl group is an alkyl (meth)acrylate, it is preferable that carbon number of the alkyl group is the range of 1-18. Moreover, as a non-acrylic monomer which does not have a hydroxyl group, olefins, such as ethylene and norbornene, vinyl acetate, styrene, etc. are illustrated.

(2-4-2) Isocyanate-based compound (A2)

An isocyanate-type compound (A2) is a compound which can have an isocyanate group in reaction with the reactive functional group which an acryl-type polymer (A1) has while having an energy-beam polymeric group. As such an isocyanate-based compound, a compound having an isocyanate group, a compound having a blocked isocyanate group, a biuret or isocyanurate compound of a compound having an isocyanate group, a compound having an isocyanate group, and non-aromatic compounds such as ethylene glycol, trimethylolpropane, and castor oil Modified substances, such as an adduct body which are reaction products of a low molecular active hydrogen containing compound, etc. are illustrated.

As a specific example of an isocyanate type compound (A2), (meth)acryloyloxyethyl isocyanate is mentioned. In addition, the reaction product of the (meth)acrylate in which at least 1 hydroxyl group remained, and a polyisocyanate compound is also mentioned as a specific example of an isocyanate type compound (A2). Among these, the isocyanate compound which has only one energy-beam polymeric group is preferable at the point which becomes easy to control the abundance of the energy-beam polymeric group in an acryl-type polymer (A), (meth)acryloyloxyethyl Isocyanate is more preferable.

The reaction for forming the acrylic polymer (A) WHEREIN: It is preferable that the usage-amount of the compound (A2) is 0.4 equivalent or more and 0.8 equivalent or less with respect to the monomer (m1) related to the acrylic polymer (A). By satisfying the regulations regarding the usage-amount of said compound (A2), the adhesive composition containing the acrylic polymer (A) obtained from an acrylic polymer (A1) and a compound (A2), the adhesive layer obtained by this is after energy-beam irradiation It can be avoided that it becomes insufficient to harden excessively or to reduce the adhesion to the adherend surface by irradiation with energy rays. As a result, the problem regarding the print visibility in the above-mentioned mold chip hardly arises. The amount of the compound (A2) used relative to the monomer (m1) is preferably 0.4 equivalents or more and 0.75 equivalents or less, more preferably 0.45 equivalents or more and 0.7 equivalents or less, and particularly preferably 0.5 equivalents or more and 0.7 equivalents or less.

(2-5) Isocyanate-based crosslinking agent (B)

In this specification, an "isocyanate-type crosslinking agent" is a polyisocyanate compound and means the generic name of what has crosslinkability. As the specific example, Aromatic polyisocyanate, such as tolylene diisocyanate, diphenylmethane diisocyanate, and xylylene diisocyanate; Alicyclics such as dicyclohexylmethane-4,4'-diisocyanate, bicycloheptane triisocyanate, cyclopentylene diisocyanate, cyclohexylene diisocyanate, methylcyclohexylene diisocyanate, and hydrogenated xylylene diisocyanate isocyanate compound; Acyclic aliphatic isocyanates, such as hexamethylene diisocyanate, trimethyl hexamethylene diisocyanate, and lysine diisocyanate, its biuret form, isocyanurate form, compound having an isocyanate group, and non-aromatic compounds such as ethylene glycol, trimethylolpropane and castor oil and modified substances such as adduct substances which are reactants of low-molecular active hydrogen-containing compounds. The number of compounds which function as an isocyanate type crosslinking agent (B) in an adhesive composition may be one, or multiple types may be sufficient as them.

Content of the isocyanate type crosslinking agent (B) in an adhesive composition is not limited. It sets suitably according to the kind of isocyanate type crosslinking agent (B). As an example which is not limited, 0.01 mass % or more and 10 mass % or less are preferable with respect to the whole adhesive composition, 0.05 mass % or more and 7 mass % or less are more preferable, 0.1 mass % or more and 3 mass % or less are especially preferable.

(2-6) organometallic catalyst (C)

The organometallic catalyst (C) contains at least one of titanium and zirconium. Specifically, it consists of an organometallic compound containing at least one of titanium and zirconium. Alkoxides, chelates, acylates, etc. of these metal elements are illustrated as such an organometallic compound, As a specific example, a titanium alkoxide, a titanium chelate, a zirconium alkoxide, a zirconium chelate, etc. are mentioned. Among these, it is preferable that the metal element which an organometallic compound contains contains zirconium, and it is preferable that this metal element is zirconium. Moreover, it is preferable that an organometallic compound is a chelate compound. Therefore, it is preferable that an organometallic catalyst (C) contains a zirconium containing chelate compound, and it is more preferable that it consists of a zirconium containing chelate compound.

The organometallic catalyst (C) preferably does not contain a tin-containing organometallic compound. Although the reason is not clear, when an organometallic catalyst (C) does not contain a tin-containing organometallic compound in an adhesive composition, it becomes easy to form the adhesive layer which has an appropriate pre-irradiation modulus and an appropriate tack value.

The usage-amount of the organometallic catalyst (C) used in reaction for obtaining an acrylic polymer (A) is not limited. The amount used is preferably 0.01 parts by mass or more and 0.5 parts by mass or less, more preferably 0.01 parts by mass or more and 0.3 parts by mass or less, and 0.01 parts by mass or more and 0.25 parts by mass or less with respect to 100 parts by mass of the solid content of the acrylic polymer (A1). is particularly preferred.

(2-7) other ingredients

The adhesive composition for forming the adhesive layer with which the dicing sheet which concerns on this embodiment is equipped with is in addition to said component, a photoinitiator (D), a tackifying resin, coloring materials, such as dye and a pigment, a flame retardant, a filler, You may contain various additives, such as an antistatic agent.

Here, the photoinitiator (D) is demonstrated in detail a little. As a photoinitiator (D), photoinitiators, such as a benzoin compound, an acetophenone compound, an acylphosphine oxide compound, a titanocene compound, a thioxanthone compound, a peroxide compound, Photosensitizers, such as an amine and a quinone, etc. are mentioned Specifically, 1-hydroxycyclohexylphenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisiso butylonitrile, dibenzyl, diacetyl, β-chloranthraquinone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide and the like can be exemplified. When using an ultraviolet-ray as an energy beam, irradiation time and irradiation amount can be decreased by mix|blending a photoinitiator (D).

(2-8) Method for producing pressure-sensitive adhesive composition

The pressure-sensitive adhesive layer provided in the dicing sheet according to the embodiment of the present invention contains an acrylic polymer (A) having an energy ray polymerizable group and a reactive functional group, and an isocyanate-based crosslinking agent (B) capable of crosslinking reaction with a reactive functional group. When it is formed from an adhesive composition, the manufacturing method of the adhesive composition is not limited. It is preferable to manufacture by the method demonstrated below.

First, as a first step, the acrylic polymer (A1) and the isocyanate-based compound (A2) are reacted in the presence of an organometallic catalyst (C) to obtain a component based on the acrylic polymer (A) and the organometallic catalyst (C) to obtain a product comprising In the above reaction, an appropriate solvent may be used. The reaction conditions of the reaction related to the first step are appropriately set according to the kind and content of the acrylic polymer (A1), the isocyanate-based compound (A2), and the organometallic catalyst (C), which are the reaction raw materials. By this reaction, a product containing the components based on the acrylic polymer (A) and the organometallic catalyst (C) can be obtained. It is preferable that the component based on an organometallic catalyst (C) maintains catalytic activity. By maintaining the catalytic activity, as a catalyst for the reaction of the acrylic polymer (A) and the isocyanate-based crosslinking agent (B) generated when the pressure-sensitive adhesive layer is formed from the pressure-sensitive adhesive composition, the component based on the organometallic catalyst (C) can function can

At the 2nd process implemented after a 1st process, the mixture containing the product of a 1st process, an isocyanate type crosslinking agent (B), and a photoinitiator (D) etc. as needed is obtained as an adhesive composition. As long as the product of the 1st process contains the acrylic polymer (A), what passed through processes, such as solvent removal, may be sufficient. The mixing method is not limited, What is necessary is just to set suitably so that the uniformity of a mixture may become high.

(3) release sheet

The dicing sheet which concerns on this embodiment is a base material of an adhesive layer for the purpose of protecting an adhesive layer until affixing the adhesive layer on the mold package (a semiconductor package is mentioned as a specific example) which is to-be-adhered. The peeling surface of a peeling sheet may be pasted together by the surface on the opposite side to the side opposite to. The structure of a release sheet is arbitrary, and what apply|coated the release agent to the plastic film is illustrated. Specific examples of the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate, and polyolefin films such as polypropylene and polyethylene. As the releasing agent, silicone-based, fluorine-based, long-chain alkyl-based and the like can be used, and among these, silicone-based silicones that are inexpensive and provide stable performance are preferable. Instead of the plastic film of the release sheet described above, a paper substrate such as glassine paper, coated paper, or fine paper, or laminated paper obtained by laminating a thermoplastic resin such as polyethylene on a paper substrate may be used. Although there is no restriction|limiting in particular about the thickness of this release sheet, Usually, it is about 20 micrometers or more and 250 micrometers or less.

2. Manufacturing method of dicing sheet

The manufacturing method of the dicing sheet which concerns on one Embodiment of this invention is not limited. The pressure-sensitive adhesive layer provided in the dicing sheet according to the embodiment of the present invention contains an acrylic polymer (A) having an energy ray polymerizable group and a reactive functional group, and an isocyanate-based crosslinking agent (B) capable of crosslinking reaction with a reactive functional group. In the case of being formed from the pressure-sensitive adhesive composition, the detailed method is not particularly limited as long as the pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition described above can be laminated on one side of the substrate. For example, the above-described pressure-sensitive adhesive composition and, if desired, a coating solution containing a solvent is prepared, and on one side of the substrate, it is applied by a die coater, a curtain coater, a spray coater, a slit coater, a knife coater, etc. An adhesive layer can be formed by apply|coating a coating liquid and drying the coating film on the said one surface. The properties of the coating liquid are not particularly limited as long as it can be applied, and the component for forming the pressure-sensitive adhesive layer may be contained as a solute or may be contained as a dispersoid.

By adjusting the above drying conditions (temperature, time, etc.) or by separately forming a heat treatment for crosslinking, the crosslinking reaction between the acrylic polymer (A) and the isocyanate crosslinking agent (B) in the coating film is advanced, and the desired What is necessary is just to form a crosslinked structure with an existence density. In order to fully advance this crosslinking reaction, after laminating|stacking an adhesive layer on a base material by the said method etc., the obtained dicing sheet is left still for several days in the environment of 23 degreeC, 50% of relative humidity, for example. Curing is routinely practiced.

Alternatively, a coating solution is applied on the release surface of the release sheet to form a coating film, and this is dried to form a laminate comprising a pressure-sensitive adhesive layer and a release sheet, which faces the release sheet in the pressure-sensitive adhesive layer of the laminate. The surface on the opposite side to the side to be used may be affixed to one surface of a base material, and the laminated body of a dicing sheet and a peeling sheet may be obtained. The release sheet in this laminate may peel as a process material, and may protect the adhesive layer, without peeling until it sticks to a mold package.

As described above, the manufacturing method according to one embodiment of the present invention includes any of the following steps:

Process of apply|coating the adhesive composition containing an acrylic polymer (A) and an isocyanate type crosslinking agent (B) to one surface of a base material, forming an adhesive layer from the coating film obtained, and obtaining the said dicing sheet; and

A pressure-sensitive adhesive composition is applied to the release surface of a release sheet, an pressure-sensitive adhesive layer is formed from the obtained coating film, and the side opposite to the side opposite to the release sheet in the pressure-sensitive adhesive layer on the release sheet is affixed to one surface of the base material, and a die The process of obtaining a single sheet in the state by which the peeling sheet was affixed on the surface by the side of an adhesive layer.

Here, as described above, the acrylic polymer (A) is obtained by reacting the acrylic polymer (A1) and the isocyanate-based compound (A2) in the presence of an organometallic catalyst (C), and the monomer in the acrylic polymer (A1) It is preferable that the mass ratio of (m1) to the whole monomer giving the acrylic polymer (A1) is 5 mass% or more and 30 mass% or less, and in the reaction for forming the acrylic polymer (A), the amount of compound (A2) used It is preferable that silver is 0.4 equivalent or more and 0.9 equivalent or less with respect to monomer (m1).

3. Manufacturing method of mold chip

The method of manufacturing a mold chip from a mold package using the dicing sheet which concerns on this embodiment is demonstrated below taking the case where the mold package consists of a semiconductor package as a specific example.

A semiconductor package is an electronic component assembly in which a semiconductor chip is mounted on each base of an assembly of a base as described above, and these semiconductor chips are collectively sealed with resin. Usually, it has a substrate surface and a resin encapsulation surface, and the thickness is 200 It is about 2000 micrometers. The resin encapsulation surface has an arithmetic mean roughness Ra (JIS B 0601: 2001 (ISO 4287: 1997)) of about 0.5 µm, and in order to facilitate removal from the mold of the encapsulation device, the sealing material contains a mold release component. may contain. For this reason, when an adhesive sheet is affixed on the resin sealing surface, there exists a tendency for sufficient fixing performance not to be exhibited.

The resin encapsulation surface of this semiconductor package (mold package) has a printing portion formed by a concave portion formed by removing a resin material by laser processing or the like. A semiconductor package has a height difference between the surface of the resin encapsulation other than the printing part and the plane of the printing part, and this height difference is called the (average) depth of the recessed part of the printing part in this specification. From a viewpoint of improving the visibility of printing by a printing part, 0.5 micrometer or more is preferable and, as for the average depth of the recessed part of a printing part, 0.5 micrometer or more and 10 micrometers or less are more preferable. In this specification, the average depth of the recessed part of a printing part shall be calculated|required as follows. With a laser microscope, the surface of the resin encapsulation other than the printing part of the semiconductor package and the plane of the concave part constituting the printing part are observed, and the height difference is measured. In addition, 5 points in the area|region including the boundary line other than the printing part and the printing part are made into a measurement point, and let the average value of the height difference in a measurement point be the average depth of the recessed part of a printing part.

In the use of the dicing sheet which concerns on this embodiment, in use, the surface (namely, the surface on the opposite side to the base material side of an adhesive layer) is affixed to the resin sealing surface of a semiconductor package (mold package).

In addition, when the release sheet is affixed to the adhesive layer side surface of a dicing sheet, the peeling sheet is peeled to expose the adhesive layer side surface, and what is necessary is just to stick the surface to the resin sealing surface of a semiconductor package. The outer peripheral part of a dicing sheet is affixed to the annular jig for conveyance called a ring frame and fixing to an apparatus with the adhesive layer normally formed in the part. Since the adhesive layer has an appropriate tack value, etc., even if it provides a dicing process with the semiconductor package affixed to a dicing sheet, the possibility that the mold chip formed by fragmentation of a semiconductor package scatters during processing is reduced.

The size of the mold chip formed by the dicing process is usually 5 mm × 5 mm or less, and recently it may be about 1 mm × 1 mm. Since it is suitable, it can fully cope with dicing of such a fine pitch.

A plurality of mold chips can be obtained from a semiconductor package by performing the above dicing process. After completion of the dicing process, an expand process of extending the dicing sheet in the main main inward direction may be usually performed in order to facilitate picking up a plurality of mold chips arranged adjacently on the dicing sheet. The extent of this elongation may be appropriately set in consideration of the spacing that adjacent mold chips should have, the tensile strength of the substrate, and the like.

After performing the expand process implemented as needed, general-purpose means, such as a suction collet, pick up the mold chip on an adhesive layer. The picked-up mold chip is provided in the next process, such as a conveyance process.

When energy-beam irradiation is performed from the base material side of the dicing sheet which concerns on this embodiment until the start of a pick-up process after completion|finish of a dicing process, the inside of the adhesive layer with which a dicing sheet is equipped WHEREIN: Energy-beam polymerization contained in this Reaction of the genitals may advance, and the adhesiveness of the adhesive layer with respect to the surface of a mold chip may be reduced. In addition, since the pressure-sensitive adhesive layer included in the dicing sheet according to the present embodiment is formed from an appropriate pressure-sensitive adhesive composition, the pressure-sensitive adhesive layer is formed in the concave portion of the resin encapsulation surface of the semiconductor package as an adherend, particularly in the concave portion constituting the printing portion. The constituent materials do not remain well. For this reason, the problem regarding the print visibility in the mold chip mentioned above does not generate|occur|produce especially easily.

As mentioned above, in the manufacturing method of the mold chip which concerns on this embodiment, chip scattering does not generate|occur|produce easily, and also in a subsequent process, a problem does not generate|occur|produce easily. For this reason, in a series of processes from a dicing process of dividing a mold package, such as a semiconductor package, into a plurality of mold chips, and a pick-up process to the next process, the yield does not fall easily. Therefore, the mold chip obtained by the manufacturing method which concerns on this embodiment using the dicing sheet which concerns on this embodiment is easy to become cost-effective. In addition, chip scattering may cause problems, such as a defect, of the mold chip manufactured by the same lot by chip|tip collision etc. other than the mold chip directly related to these problems. Therefore, the mold chip manufactured by the manufacturing method of the mold chip which concerns on this embodiment is reduced in possibility of having such a problem, and is excellent in quality.

The embodiments described above are described in order to facilitate understanding of the present invention, and are not described in order to limit the present invention. Accordingly, each element disclosed in the above embodiment is intended to include all design changes and equivalents falling within the technical scope of the present invention.

Example

Hereinafter, the present invention will be more specifically described by way of Examples and the like, but the scope of the present invention is not limited to these Examples and the like.

[Example 1]

(1) Preparation of coating solution

A coating solution having the following composition was prepared.

75 parts by mass of 2-ethylhexyl acrylate, 10 parts by mass of methyl methacrylate, and 15 parts by mass of 2-hydroxyethyl acrylate (HEA) were copolymerized to obtain a copolymer (weight average molecular weight in terms of polystyrene of 700,000), an acrylic polymer. It was obtained as (A1).

Methacryloyloxyethyl isocyanate (MOI) as the compound (A2) and the acrylic polymer (A1) as the organometallic catalyst (C) in the presence of a zirconium chelate catalyst (“ZC-700” manufactured by Matsumoto Fine Chemicals) ha, reacted. The usage-amount of compound (A2) was 0.6 equivalent with respect to HEA which is given a position as a monomer (m1) which provides the structural unit which has a hydroxyl group which is a reactive functional group in an acrylic polymer (A1). The addition amount of the organometallic catalyst (C) was 0.1 parts by mass with respect to 100 parts by mass of the solid content of the acrylic polymer (A1). By said reaction, the product containing the component based on an acrylic polymer (A) and an organometallic catalyst (C) was obtained.

With respect to the above product and 100 parts by mass of the acrylic polymer (A) in the product, 0.3 parts by mass of the isocyanate-based crosslinking agent (B) ("BHS-8515" manufactured by Toyochem Co., Ltd.) and 3.0 parts by mass of the photopolymerization initiator (D) (BASF Corporation) Manufacture "Irgacure (trademark) 184") was mix|blended (all are compounding ratio by solid content conversion), and the adhesive composition was obtained.

(2) Production of dicing sheet

A release sheet ("SP-PET381031" manufactured by Lintec Co., Ltd.) having a release surface in which a silicone release agent layer is formed on one surface of a 38 µm-thick polyethylene terephthalate base film was prepared. On the peeling surface of this release sheet, the above-mentioned coating liquid was apply|coated with the knife coater. The coating film was dried and crosslinking reaction was advanced by making the obtained coating film pass for 1 minute in 100 degreeC environment with the peeling sheet whole, and the laminated body which consists of a peeling sheet and an adhesive layer (10 micrometers in thickness) was obtained.

On one side of a substrate made of an ethylene-methacrylic acid copolymer (EMAA) film having a thickness of 140 μm (corona treatment completed, surface tension: 54 mN/m), the adhesive layer side of the laminate is affixed, The dicing sheet which consists of a base material and an adhesive layer was obtained in the state by which the peeling sheet was further laminated|stacked on the surface on the side of the adhesive layer.

[Example 2]

Instead of the zirconium chelate catalyst, the organometallic catalyst (C) used in order to obtain the acrylic polymer (A) is used as a titanium chelate catalyst ("TC-750" manufactured by Matsumoto Fine Chemical Co., Ltd.), and the amount used is the acrylic polymer (A1) Except having set it as 0.03 mass part with respect to 100 mass parts of solid content of , it carried out similarly to Example 1, and obtained the dicing sheet in the state by which the release sheet was laminated|stacked on the surface on the side of the adhesive layer.

[Comparative Example 1]

The organometallic catalyst (C) used in order to obtain the acrylic polymer (A) was replaced with a zirconium chelate catalyst as a tin catalyst ("BXX-3778" manufactured by Toyochem Co., Ltd.), and the amount used was 100 solid content of the acrylic polymer (A1) Except having set it as 0.03 mass part with respect to mass part, it carried out similarly to Example 1, and obtained the dicing sheet in the state by which the peeling sheet was laminated|stacked on the surface by the side of an adhesive layer.

[Example 3]

In the same manner as in Example 1, except that the amount of MOI as the compound (A2) used to obtain the acrylic polymer (A) was 0.7 equivalent to HEA, the dicing sheet was applied to the pressure-sensitive adhesive layer side, and the release sheet was applied to the side. obtained in a laminated state.

[Comparative Example 2]

In the same manner as in Example 1, except that the amount of MOI as the compound (A2) used to obtain the acrylic polymer (A) was 0.9 equivalent to HEA, the dicing sheet was applied to the pressure-sensitive adhesive layer side, and the release sheet was applied to the side. obtained in a laminated state.

[Comparative Example 3]

In the same manner as in Example 1, except that the amount of MOI as the compound (A2) used to obtain the acrylic polymer (A) was 0.3 equivalent to HEA, the dicing sheet was applied to the pressure-sensitive adhesive layer side, and the release sheet was applied to the side. obtained in a laminated state.

[Comparative Example 4]

Except having made the thickness of an adhesive layer into 30 micrometers, it carried out similarly to Example 1, and obtained the dicing sheet in the state by which the peeling sheet was laminated|stacked on the surface by the side by the adhesive layer.

[Comparative Example 5]

85 mass parts of 2-ethylhexyl acrylate and 15 mass parts of 2-hydroxyethyl acrylate were copolymerized, and the copolymer (polystyrene conversion weight average molecular weight 700,000) was obtained. Except having used this copolymer instead of the acrylic polymer (A1), it carried out similarly to Example 1, and obtained the dicing sheet in the state by which the peeling sheet was laminated|stacked on the surface on the side of the adhesive layer.

[Comparative Example 6]

Except having prepared the adhesive composition by the method demonstrated next, it carried out similarly to Example 1, and obtained the dicing sheet in the state by which the peeling sheet was laminated|stacked on the surface by the side by the adhesive layer.

With respect to 100 parts by mass of the copolymer, 10 parts by mass of a crosslinking agent and 40 parts by mass of an energy ray-curable compound (both blending amounts are solid content) were added to obtain a composition for adhesive coating as a solution of an organic solvent.

The details of the copolymer, the crosslinking agent and the energy ray-curable compound were as follows.

Copolymer: 2-ethylhexyl acrylate/methyl acrylate/acrylic acid = 50/40/10 composition ratio, polystyrene conversion weight average molecular weight: 800,000

Cross-linking agent: trimethylol propane tolylene diisocyanate (TDI-TMP), manufactured by Toyochem "BHS 8515"

Energy ray-curable compound: 10-functional urethane acrylate, molecular weight: 1700, "UV-1700B" manufactured by Nippon Synthetic Chemical Industry Co., Ltd.

[Test Example 1] <Evaluation of chip scattering>

Using resin for semiconductor packages ("G700" manufactured by Sumitomo Bakelite Co., Ltd.), 50 mm x 50 mm and 600 micrometers in thickness, and the arithmetic mean roughness Ra of the sealing resin surface produced the simulation semiconductor package which is 1 micrometer. The surface on the side of the pressure-sensitive adhesive layer of the dicing sheet produced in the Examples and Comparative Examples was affixed to the sealing resin surface of the simulated semiconductor package prepared above using a tape mounter (“Adwill RAD2500” manufactured by Lintec). . The thus-obtained laminate of the dicing sheet and the simulated semiconductor package was mounted on a ring frame for dicing ("2-6-1" manufactured by Disco Corporation), and a dicing apparatus ("DFD-651" manufactured by Disco Corporation) was used to mount the , a dicing step of cutting from the side of the simulated semiconductor package was performed, and the result was divided into mold chips having a size of 1 mm × 1 mm. In addition, dicing conditions were as follows.

Dicing blade: Disco company "ZBT-5074 (Z1110LS3)"

Blade thickness: 0.17 mm

Blade removal amount: 3.3 mm

Blade rotation speed: 30000 rpm

Cutting speed: 100 mm/min

Depth of cut into substrate: 50 μm

Cutting amount: 1.0 ℓ/min

Cutting water temperature: 20℃

By visually observing the member obtained by the dicing process, the mold chip adhering to the pressure-sensitive adhesive layer side surface of the dicing sheet, counting the number of mold chips falling off from the dicing sheet during the dicing process, and counting the number It divided by the division number in a dicing process, and the chip|tip scattering rate (unit: %) was calculated|required. The case where the chip scattering rate was less than 10% was judged to be good, and the case where it was 10% or more was judged to be defective. A result is shown in Table 1. In Table 1, "A" means what was judged as good, and "B" means what was judged as bad.

[Test Example 2] <Evaluation of print visibility in molded chips>

Using resin for semiconductor packages ("G700" manufactured by Sumitomo Bakelite Co., Ltd.), 50 mm x 50 mm and 600 micrometers in thickness, and the arithmetic mean roughness Ra of the sealing resin surface produced the simulation semiconductor package which is 1 micrometer. The resin encapsulation surface of the simulation semiconductor package was subjected to printing under the following conditions to form a printing portion.

Laser printing device: "LP-V10U-W20" manufactured by Panasonic

Laser for printing : FAYb Laser

Laser Wavelength: 1064 nm

Scan speed: 400 mm/sec

Print pulse period: 1000 ㎲

The average depth of the concave portions of the printing portion was 2 μm. The average depth of the concave portion of the printing portion was obtained as follows. With a laser microscope ("VK-9700" manufactured by KEYENCE), the surface of the resin encapsulation other than the printing portion of the semiconductor package and the plane of the concave portions constituting the printing portion were observed, and the height difference was measured. In addition, 5 points in the area|region including the boundary line other than the printing part and the printing part were made into measurement points, and the average value of the height difference in the measurement points was made into the average depth of the recessed part of the printing part.

The surface on the side of the pressure-sensitive adhesive layer of the dicing sheet produced in the Examples and Comparative Examples was affixed to the sealing resin surface of the simulated semiconductor package prepared above using a tape mounter (“Adwill RAD2500” manufactured by Lintec). . The thus-obtained laminate of the dicing sheet and the simulated semiconductor package was mounted on a ring frame for dicing ("2-6-1" manufactured by Disco Corporation), and a dicing apparatus ("DFD-651" manufactured by Disco Corporation) was used to mount the , a dicing step of cutting from the side of the simulated semiconductor package was performed, and divided into mold chips having a size of 10 mm × 10 mm. In addition, dicing conditions were as follows.

Dicing blade: Disco company "ZBT-5074 (Z1110LS3)"

Blade thickness: 0.17 mm

Blade removal amount: 3.3 mm

Blade rotation speed: 30000 rpm

Cutting speed: 100 mm/min

Depth of cut into substrate: 50 μm

Cutting amount: 1.0 ℓ/min

Cutting water temperature: 20℃

After completion of the above dicing process, the mold chip group was placed on the dicing sheet and left still for 30 days. After standing for 30 days, using an ultraviolet irradiation device (RAD-2000m/12 manufactured by Lintec Corporation), ultraviolet irradiation (illuminance 230 mW/cm 2 , light quantity 190 mJ) from the base side of the dicing sheet after the dicing step in a nitrogen atmosphere /cm2) was carried out.

After UV irradiation, the dicing sheet in the member formed by attaching the mold chip to the pressure-sensitive adhesive layer side surface of the dicing sheet was expanded using an expander (“ME-300B type” manufactured by JCM Corporation) at a speed of 1 mm/ An expand step of extending the sheet by 20 mm in the inward direction of the main surface of the sheet was performed.

Then, 100 mold chips placed on the dicing sheet were picked up and tested. That is, the part of the dicing sheet in contact with the mold chip to be picked up is pushed up by 1.5 mm from the base material side with a needle, and a vacuum collet is attached to the surface of the protruding mold chip opposite to the side opposite to the dicing sheet. and lifted the mold chip attached to the vacuum collet.

The area including the printing part of the resin encapsulation surface of the picked-up mold chip is observed, the recessed part of the printing part is measured by microscopic FT-IR ("Spectrum One" manufactured by Perkin Elmer) if necessary, and printing visibility in the mold chip. was evaluated according to the following criteria. A result is shown in Table 1.

A: There was no mold chip confirmed that the visibility of printing had fallen.

B: Although the mold chip confirmed that the visibility of printing fell slightly existed, the fall of visibility was not confirmed about most mold chips. About the mold chip confirmed that visibility fell slightly, although the recessed part of the printing part was measured using microscopic FT-IR, adhesion of the substance identified as the material which comprises an adhesive layer was not confirmed.

C: There were many mold chips confirmed that the visibility of printing was slightly lowered. About the mold chip confirmed that visibility fell slightly, although the recessed part of the printing part was measured using microscopic FT-IR, adhesion of the substance identified as the material which comprises an adhesive layer was not confirmed.

D: There was a mold chip confirmed that the visibility of printing was clearly lowered. As for the mold chip confirmed to have clearly deteriorated in visibility, as a result of measuring the recessed part of the printing part using microscopic FT-IR, adhesion of the substance identified as the material which comprises an adhesive layer was confirmed.

[Test Example 3] <Measurement of tack value>

A probe tack tester ( It was measured by "RPT-100" manufactured by Lesca Co., Ltd.). The measuring method was the method described in JIS Z 0237: 1991, while the peeling rate was changed to 1 mm/min, the load was 100 gf/cm 2 , and the contact time was 1 second, as described in the above JIS regulations. . The measured energy amount (peak integration value) was calculated|required, and it was set as the tack value (unit: mJ/5 mmphi). A result is shown in Table 1.

[Test Example 4] <Measurement of the thickness of the pressure-sensitive adhesive layer>

The pressure-sensitive adhesive composition used in Examples and Comparative Examples is coated and dried under the same conditions as in Examples and Comparative Examples on one side of a 38 µm-thick polyethylene terephthalate film, and a laminate comprising a film and an pressure-sensitive adhesive layer got The thickness of this laminate was measured using a static pressure thickness meter ("PG-02J" manufactured by Techcrok Corporation), and the thickness of the film was subtracted from the obtained measured value to determine the thickness (unit: µm) of the pressure-sensitive adhesive layer. A result is shown in Table 1.

[Test Example 5] <Measurement of elastic modulus before and after irradiation>

The pressure-sensitive adhesive composition used in Examples and Comparative Examples was applied on the release surface of a release film having a thickness of 38 µm (“SP-PET381031” manufactured by Lintec Co., Ltd.) so that the thickness after drying was 40 µm, and the obtained coating film and release film The coating film was dried by holding the laminated body formed at 100 degreeC for 1 minute. A plurality of the pressure-sensitive adhesive layers on the release film obtained by this procedure were prepared, the laminated body bonded together until it became 800 micrometers in thickness was produced, it punched out in a circular shape of diameter 10mm, and it was set as the sample for a measurement. With a viscoelasticity measuring apparatus ("ARES" manufactured by TA Instruments), a strain of 1 Hz is applied to the sample, the storage elastic modulus of -50 to 150°C is measured, and the value of the storage elastic modulus at 23°C is the elastic modulus before irradiation. (unit: kPa) was obtained. A result is shown in Table 1.

It carried out similarly to the above, and the member by which the adhesive layer formed from the adhesive composition used in the Example and the comparative example was laminated|stacked on the peeling film was obtained. The member was irradiated with ultraviolet rays (illuminance 230 mW/cm 2 , light quantity 190 mJ/cm 2 ) in a nitrogen atmosphere from the release film side of the member using an ultraviolet irradiation device (RAD-2000m/12 manufactured by Lintec Corporation). did About the member after ultraviolet irradiation, the same operation|work as the case of the measurement of the said elastic modulus before irradiation was performed, and the value of the storage elastic modulus in 23 degreeC was obtained as the elasticity modulus (unit: MPa) after irradiation. A result is shown in Table 1.

As can be seen from Table 1, in the dicing sheet of Examples satisfying the conditions of the present invention, a problem does not easily occur in the dicing process, and the problem regarding print visibility in the above-mentioned mold chip also occurs easily. It could be said not to do it.

The dicing sheet which concerns on this invention is used suitably as a dicing sheet of a mold package which has a printing part on the resin-encapsulation surface which is a to-be-adhered surface.

Claims (7)

A dicing sheet comprising a substrate and an adhesive layer laminated on at least one surface of the substrate, the dicing sheet comprising:
The storage elastic modulus at 23 ° C. of the pressure-sensitive adhesive layer is 50 kPa or more and 80 kPa or less in the state before energy ray irradiation, and 5.0 MPa or more and 120 MPa or less in the state after energy ray irradiation,
The thickness of the pressure-sensitive adhesive layer is less than 20 ㎛,
The surface of the pressure-sensitive adhesive layer is in a state before energy ray irradiation, in the method described in JIS Z 0237: 1991, the amount of energy measured using a probe tack under the condition that the peeling rate is changed to 1 mm / min. , 0.10 mJ/5 mm phi or more and 0.8 mJ/5 mm phi or less, The dicing sheet characterized by the above-mentioned. The method of claim 1,
In use, the resin encapsulation surface of the mold package is affixed to the surface opposite to the base material side of the pressure-sensitive adhesive layer,
The dicing sheet, wherein the resin encapsulation surface has a printing portion formed by the concave portion. 3. The method of claim 2,
The dicing sheet, wherein an average depth of the concave portions of the printing portion on the resin encapsulation surface is 0.5 µm or more. The method of claim 1,
The pressure-sensitive adhesive layer is formed from a pressure-sensitive adhesive composition containing an acrylic polymer (A) having an energy ray polymerizable group and a reactive functional group, and an isocyanate-based crosslinking agent (B) capable of crosslinking reaction with the reactive functional group,
The acrylic polymer (A) is an organometallic catalyst (C) in which the acrylic polymer (A1) having the reactive functional group and the isocyanate compound (A2) having the energy ray polymerizable group contain at least one of titanium and zirconium A dicing sheet obtained by reacting in the presence of 5. The method of claim 4,
The mass ratio of the monomer (m1) providing the structural unit having the reactive functional group in the acrylic polymer (A1) with respect to the whole monomer giving the acrylic polymer (A1) is 5 mass% or more and 30 mass% or less ego,
In the reaction for forming the acrylic polymer (A), the amount of the compound (A2) to be used is not less than 0.4 equivalents and not more than 0.8 equivalents based on the monomer (m1). 5. The method of claim 4,
The said organometallic catalyst (C) contains a zirconium containing chelate compound, The dicing sheet. The surface on the side of the pressure-sensitive adhesive layer of the dicing sheet according to any one of claims 1 to 6 is affixed to the resin sealing surface of a mold package, and the mold package on the dicing sheet is cut and separated into pieces, and a plurality of The manufacturing method of the mold chip which obtains a mold chip.