JP2009246302A - Die sorting tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a die sorting tape in which a stable pickup force for picking up a chip from an adhesive layer can be maintained even if air is mixed into the adhesive surfaces of the adhesive layer and each chip while making the chip reduce pickup error and enabling the chip to be stored and transported without being detached. <P>SOLUTION: The die sorting tape includes a substrate film, an adhesive layer formed on the film and a peeling film temporarily attached to the surface of the adhesive layer. The adhesive layer has a storage modulus of 1×10<SP>4</SP>to 1×10<SP>8</SP>Pa at 23°C, and its probe tack value of 50 to 3,920 mN, and the peeling film has a surface roughness (Ra) of 10 μm or less on the adhesive layer side. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a die sort tape comprising a base film, a pressure-sensitive adhesive layer formed thereon, and a release film temporarily attached to the surface of the pressure-sensitive adhesive layer.

  One of the manufacturing processes of a semiconductor device is a dicing process of cutting and separating a semiconductor wafer on which a circuit is formed through a required pretreatment into a plurality of chips. In this step, a dicing sheet for fixing a semiconductor wafer is attached to a circular or square frame called a ring frame, the semiconductor wafer is attached to the dicing sheet, and dicing is performed for each circuit to obtain a semiconductor chip. Then, following the expanding process by the bonding machine, a die bonding process is performed in which a die bonding adhesive such as an epoxy resin is applied to the pad portion of the chip substrate to bond the semiconductor chip to the chip substrate. Furthermore, after a wire bonding process and an inspection process, resin sealing is finally performed in a molding process to manufacture a semiconductor device.

  On the other hand, an individual semiconductor chip may be accommodated and transported without die bonding. In such a case, the die bonding process is performed in outline.

  For accommodating and transporting such semiconductor chips, a reel-like embossed carrier tape, a chip tray, or the like, in which pocket-shaped recesses are formed on a thermoplastic resin sheet by embossing, is used. After the semiconductor chip is accommodated in the recess, it is covered with a cover sheet and stored and transported until the semiconductor chip is incorporated into the electronic device. By using such an embossed carrier tape, only non-defective products can be selected and shipped after the dicing process, and further, a single semiconductor wafer can be shipped to a plurality of factories.

  However, since dust, dirt, and the like cause trouble in the semiconductor device, the semiconductor chip may be washed with water before using it in the place where the semiconductor chip is transported. When an embossed carrier tape is used, it is necessary to fix it to a dicing tape or the like and wash it again, which is very inefficient.

  On the other hand, the technique of mounting a semiconductor chip using adhesive tapes, such as a heat peeling tape and a general-purpose dicing tape, and accommodating and conveying the semiconductor chip is also used (Patent Document 1). In this case, the semiconductor chip is affixed to the adhesive layer of the adhesive tape, and is stored and transported.

However, in the pressure-sensitive adhesive tape of Patent Document 1, when an electronic component such as a semiconductor chip is mounted on the pressure-sensitive adhesive tape, air may be mixed into the adhesive surface between the pressure-sensitive adhesive layer and the chip. In particular, when the pressure-sensitive adhesive layer surface is smooth, air is mixed. Depending on the air mixing condition, the adhesive area between the adhesive layer and each chip will be different for each chip, causing variations in pick-up force when picking up the chip from the adhesive layer, and causing a pickup failure. It was. On the other hand, when the pressure-sensitive adhesive layer surface is rough, large air can be prevented from being mixed in, but the adhesive area between the pressure-sensitive adhesive layer and the chip is reduced. As a result, it becomes difficult to hold the chip on the adhesive tape, and there is a risk that the semiconductor chip may fall off during storage and transportation.
JP 2000-95291 A

  The present invention seeks to solve the problems associated with the prior art as described above. That is, the present invention can stabilize the pick-up force when picking up the chip from the pressure-sensitive adhesive layer and reduce pickup mistakes even if air is mixed into the adhesive surface between the pressure-sensitive adhesive layer and each chip. An object of the present invention is to provide a die sort tape in which the chips are not dropped when the chips are stored and transported.

The gist of the present invention aimed at solving such problems is as follows.
(1) It consists of a base film, an adhesive layer formed thereon, and a release film temporarily attached to the surface of the adhesive layer,
The storage elastic modulus of the pressure-sensitive adhesive layer at 23 ° C. is 1 × 10 ⁴ to 1 × 10 ⁸ Pa,
The probe tack value is 50-3920 mN,
The die sort tape whose surface roughness (Ra) of the adhesive layer side surface of the said peeling film is 10 micrometers or less.
(2) The die sort tape according to (1), wherein the pressure-sensitive adhesive layer is made of a cured product of an energy ray curable resin,
The storage elastic modulus at 23 ° C. after the energy ray irradiation of the pressure-sensitive adhesive layer is 1 × 10 ⁴ to 1 × 10 ⁸ Pa,
The die sort tape whose probe tack value is 50-3920 mN.

  According to the present invention, the storage elastic modulus of the adhesive layer in the die sort tape, the probe tack value and the surface roughness of the adhesive layer side surface of the release film are controlled to control the shape of the adhesive layer surface, The adhesive area between the pressure-sensitive adhesive layer and the chip when the chip is attached becomes substantially constant. As a result, the pick-up force when picking up the chip from the adhesive layer is stabilized, pick-up mistakes can be reduced, and the die sort tape does not drop off when storing and transporting the chip. Is provided.

Hereinafter, the present invention will be described more specifically.
As shown in FIG. 1, the die sort tape according to the present invention comprises a base film 10, an adhesive layer 20 formed thereon, and a release film 30 temporarily attached to the surface of the adhesive layer. It is characterized by that.

  There is no restriction | limiting in particular as the base film 10, Any can be suitably selected from what is conventionally used as a base film of various adhesive sheets. For example, polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate film, ionomer resin film Plastic sheets such as ethylene / (meth) acrylic acid copolymer film, ethylene / (meth) acrylic acid ester copolymer film, polystyrene film, polycarbonate film, and fluororesin film are used.

  The base film may be a laminated film of these plastic sheets or a crosslinked film. Further, it may be colorless or colored. Furthermore, when irradiating energy rays when forming the pressure-sensitive adhesive layer described later, the substrate film may be transparent or opaque as long as it has transparency to the energy rays to be used. .

  Although the thickness of a base film should just be suitably determined according to a use purpose or a condition, it is 50-300 micrometers normally, Preferably it is the range of 60-200 micrometers.

  In addition, on the surface of the base film, for the purpose of improving the adhesiveness with the pressure-sensitive adhesive layer provided thereon, if desired, uneven processing such as sandblasting or solvent treatment, corona discharge treatment, plasma treatment, Oxidation treatment such as ozone / ultraviolet irradiation treatment, flame treatment, chromic acid treatment, and hot air treatment can be performed. Moreover, primer treatment can also be performed.

The adhesive layer 20 has a storage elastic modulus (23 ° C.) at the time of attaching a chip of 1 × 10 ⁴ to 1 × 10 ⁸ Pa, preferably 1.9 × 10 ^{4 to} 7 × 10 ⁷ Pa, more preferably It is 7 * 10 < ⁴ > -1 * 10 < ⁷ > Pa.

  When the storage elastic modulus at 23 ° C. of the pressure-sensitive adhesive layer is higher than the above range, there is a problem in that the chip adhesion is poor and the chip cannot be stably held. Further, even if the chip can be attached, there is a problem that the chip falls off during transportation and storage. On the other hand, when the storage elastic modulus is lower than the above range, it is easy to hold the chip, but the pressure-sensitive adhesive layer cannot maintain a shape having a specific surface roughness, and the bonding area between the chip and the pressure-sensitive adhesive layer is not good. It becomes uniform and the pickup power is not stable.

  The probe tack value of the pressure-sensitive adhesive layer is in the range of 50 to 3920 mN, preferably 70 to 3900 mN, and more preferably 90 to 3830 mN.

  When the probe tack value is larger than the above range, air is mixed in a non-uniform state on the adhesive surface between the pressure-sensitive adhesive layer and the chip, the bonding area between the pressure-sensitive adhesive layer and the chip becomes non-uniform, and the pickup force is not stable. If the probe tack value is smaller than the above range, there is a problem that the adhesion with the attached chip is poor and the chip cannot be stably held. Further, even if the chip can be attached, there is a problem that the chip falls off during transportation and storage.

  The thickness of the pressure-sensitive adhesive layer is 1 to 50 μm, preferably 2 to 30 μm.

  The resin material constituting the pressure-sensitive adhesive layer is not particularly limited as long as the resin material has the above-described properties, but examples thereof include acrylate ester copolymers that are widely used as pressure-sensitive adhesives. The weight average molecular weight of the acrylic ester copolymer is 100,000 or more, preferably 100,000 to 1,500,000, and particularly preferably 150,000 to 1,000,000. The acrylic ester copolymer is composed of structural units derived from (meth) acrylic acid, (meth) acrylic ester monomers or derivatives thereof. As the (meth) acrylic acid ester monomer, a (meth) acrylic acid alkyl ester having 1 to 18 carbon atoms in the alkyl group is used. Examples of derivatives of (meth) acrylic acid ester monomers include dialkyl (meth) acrylamides such as dimethylacrylamide, dimethylmethacrylamide, diethylacrylamide, and diethylmethacrylamide. Among these, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate, butyl acrylate, butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, 2-hydroxy are particularly preferable. Ethyl acrylate, 2-hydroxyethyl methacrylate, dimethylacrylamide, and the like. In addition to these monomers, vinyl acetate, styrene, vinyl acetate and the like may be copolymerized.

  The acrylic ester copolymer is a polymer that is widely used as an adhesive. When used as the pressure-sensitive adhesive layer of the present invention, it is partially cross-linked with a cross-linking agent and adjusted to have the aforementioned storage elastic value and probe tack value. Examples of the crosslinking agent include organic polyvalent isocyanate compounds, organic polyvalent epoxy compounds, and organic polyvalent imine compounds.

  In general, when the amount of the crosslinking agent used is increased, the tackiness of the acrylate copolymer is decreased, the storage elastic modulus is increased, and the probe tack value is decreased.

  Moreover, you may form an adhesive layer using the energy-beam curable resin composition which mix | blended the energy-beam polymeric compound and the photoinitiator as needed with the acrylic ester copolymer.

  As the energy ray polymerizable compound, energy ray polymerizable oligomers such as epoxy acrylate, urethane acrylate, polyester acrylate and polyether acrylate, and energy ray polymerizable monomers are used. Examples of the energy ray polymerizable monomer include isobornyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyloxy (meth) acrylate, cyclohexyl (meth) acrylate, adamantane (meth) ) An alicyclic compound such as acrylate, an aromatic compound such as phenylhydroxypropyl acrylate, benzyl acrylate, phenol ethylene oxide modified acrylate, or tetrahydrofurfuryl (meth) acrylate, morpholine acrylate, N-vinyl pyrrolidone or N-vinyl caprolactam Heterocyclic compounds are mentioned. If necessary, trimethylolpropane tri (meth) acrylate, dipentaerythritol tri (meth) acrylate, propionic acid modified dipentaerythritol tri (meth) acrylate, pentaerythritol tri (meth) acrylate, propylene oxide modified trimethylolpropane Trifunctional type such as tri (meth) acrylate and tris (acryloxyethyl) isocyanurate; tetrafunctional type such as diglycerin tetra (meth) acrylate and pentaerythritol tetra (meth) acrylate; propionic acid-modified dipentaerythritol penta (meth) ) Pentafunctional type such as acrylate; hexafunctional type such as dipentaerythritol hexa (meth) acrylate, caprolactone-modified dipentaerythritol hexa (meth) acrylate What polyfunctional (meth) acrylate may be used. Such energy beam polymerizable compounds may be used alone or in combination.

  Among these, urethane acrylate oligomers are preferably used. The urethane acrylate oligomer includes a polyol compound such as a polyester type or a polyether type and a polyvalent isocyanate compound such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate. 1, 4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, and the like, a terminal isocyanate urethane prepolymer obtained by reacting with an acrylate or methacrylate having a hydroxyl group such as 2-hydroxyethyl acrylate or 2-hydroxy Ethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, polyethylene glycol acrylate, polyethylene glycol methacrylate, etc. Obtained by. Such a urethane acrylate oligomer has an energy ray polymerizable double bond in the molecule and is polymerized and cured by irradiation with energy rays. As the urethane acrylate oligomer, those having a weight average molecular weight of 100 to 50000 are preferable, and those having 1000 to 30000 are particularly preferable.

  Further, instead of a mixture of the acrylic acid ester copolymer and the energy beam polymerizable compound, which is the above-mentioned pressure-sensitive adhesive, an energy beam polymerizable adhesive polymer in which an energy beam polymerizable group is bonded to the side chain is provided. It can also be used.

  The main skeleton of the adhesive polymer is not particularly limited, and may be an acrylic copolymer that is widely used as an adhesive, and may be either an ester type or an ether type. From the viewpoint of easy control of physical properties, it is particularly preferable to use an acrylic copolymer as a main skeleton.

  The energy beam polymerizable group bonded to the side chain of the adhesive polymer is, for example, a group containing an energy beam polymerizable carbon-carbon double bond, and specifically, a (meth) acryloyl group may be exemplified. it can. The energy beam polymerizable group may be bonded to the adhesive polymer via an alkylene group, an alkyleneoxy group, or a polyalkyleneoxy group.

  Specific examples of such a polymerizable group will be further clarified from the process for producing an energy beam polymerizable adhesive polymer described below.

  The weight average molecular weight of the energy beam polymerizable adhesive polymer to which the polymerizable group is bonded is preferably 100,000 or more, preferably 100,000 to 1,500,000, particularly preferably 150,000. ~ 1,000,000. The glass transition temperature of the energy beam polymerizable adhesive polymer is usually about −70 to 30 ° C.

  The energy beam polymerizable adhesive polymer is obtained by reacting an adhesive polymer containing a functional group with a polymerizable group-containing compound having a substituent that reacts with the functional group.

  The structure of the main skeleton of the energy beam polymerizable adhesive polymer is not particularly limited, but various acrylic copolymers widely used as an adhesive are preferable.

  Hereinafter, the production method of the energy beam polymerizable adhesive polymer will be described in detail with respect to an example having an acrylic copolymer as the main skeleton, but the energy beam polymerizable adhesive polymer is limited to those obtained by the following production method. Not.

  The energy ray-polymerizable acrylic adhesive polymer to which a polymerizable group is bonded contains an acrylic copolymer (a1) having a functional group-containing monomer unit and a polymerizable group having a substituent that reacts with the functional group. It can be obtained by reacting with compound (a2).

  The functional group-containing monomer that forms the acrylic copolymer (a1) is a monomer having a polymerizable double bond and a functional group such as a hydroxyl group, a carboxyl group, an amino group, a substituted amino group, or an epoxy group in the molecule. Preferably, a hydroxyl group-containing unsaturated compound or a carboxyl group-containing unsaturated compound is used.

  More specific examples of such functional group-containing monomers include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, 2-hydroxybutyl acrylate, 2-hydroxybutyl Examples thereof include hydroxyl group-containing acrylates such as methacrylate, and carboxyl group-containing compounds such as acrylic acid, methacrylic acid, and itaconic acid. The above functional group-containing monomers may be used alone or in combination of two or more.

  The acrylic copolymer (a1) is composed of a structural unit derived from the functional group-containing monomer and a structural unit derived from a (meth) acrylic acid ester monomer or a derivative thereof. As the (meth) acrylic acid ester monomer, a (meth) acrylic acid alkyl ester having 1 to 18 carbon atoms in the alkyl group is used. Examples of derivatives of (meth) acrylic acid ester monomers include dialkyl (meth) acrylamides such as dimethylacrylamide, dimethylmethacrylamide, diethylacrylamide, and diethylmethacrylamide. Among these, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, dimethyl are particularly preferable. Such as acrylamide.

  The acrylic copolymer (a1) contains a structural unit derived from the functional group-containing monomer in an amount of usually 3 to 100% by weight, preferably 5 to 40% by weight, particularly preferably 10 to 30% by weight, A structural unit derived from a (meth) acrylic acid ester monomer or a derivative thereof is usually contained in a proportion of 0 to 97% by weight, preferably 60 to 95% by weight, particularly preferably 70 to 90% by weight.

  The acrylic copolymer (a1) can be obtained by copolymerizing a functional group-containing monomer as described above with a (meth) acrylic acid ester monomer or a derivative thereof in a conventional manner. In addition, vinyl formate, vinyl acetate, styrene, vinyl acetate and the like may be copolymerized.

  The method for producing the acrylic copolymer (a1) is not particularly limited. For example, a solution polymerization method in the presence of a solvent, a chain transfer agent, a polymerization initiator, an emulsifier, a chain transfer agent, a polymerization It is produced by a method of emulsion polymerization in an aqueous system in the presence of an initiator, a dispersant and the like.

  Energy in which a polymerizable group is bonded by reacting the acrylic copolymer (a1) having the functional group-containing monomer unit with a polymerizable group-containing compound (a2) having a substituent that reacts with the functional group. A linear polymerizable acrylic adhesive polymer is obtained.

  The polymerizable group-containing compound (a2) contains a substituent capable of reacting with a functional group in the acrylic copolymer (a1). This substituent varies depending on the type of the functional group. For example, when the functional group is a hydroxyl group or a carboxyl group, the substituent is preferably an isocyanate group or an epoxy group. When the functional group is a carboxyl group, the substituent is preferably an isocyanate group or an epoxy group. When the group is an amino group or a substituted amino group, the substituent is preferably an isocyanate group, and when the functional group is an epoxy group, the substituent is preferably a carboxyl group. One such substituent is included for each molecule of the polymerizable group-containing compound (a2).

  The polymerizable group-containing compound (a2) contains 1 to 5, preferably 1 to 2, energy beam polymerizable carbon-carbon double bonds per molecule. Specific examples of such polymerizable group-containing compound (a2) include methacryloyloxyethyl isocyanate, meta-isopropenyl-α, α-dimethylbenzyl isocyanate, methacryloyl isocyanate, allyl isocyanate, glycidyl (meth) acrylate. ; (Meth) acrylic acid etc. are mentioned. In addition, an acryloyl monoisocyanate compound obtained by reaction of a diisocyanate compound or polyisocyanate compound and hydroxyethyl (meth) acrylate; a diisocyanate compound or polyisocyanate compound, a polyol compound, and hydroxyethyl (meta ) An acryloyl monoisocyanate compound obtained by reaction with acrylate.

  The polymerizable group-containing compound (a2) is usually 20 to 100 equivalents, preferably 40 to 95 equivalents, particularly preferably 60 to 90 equivalents per 100 equivalents of the functional group-containing monomer of the acrylic copolymer (a1). Used in

  The reaction between the acrylic copolymer (a1) and the polymerizable group-containing compound (a2) is usually performed at a temperature of about room temperature and normal pressure for about 24 hours. This reaction is preferably performed using a catalyst such as dibutyltin laurate in a solution such as ethyl acetate.

  As a result, the functional group present in the side chain in the acrylic copolymer (a1) reacts with the substituent in the polymerizable group-containing compound (a2), and the polymerizable group-containing group becomes the acrylic copolymer. Introduced into the side chain in (a1), an energy ray polymerizable acrylic adhesive polymer is obtained.

  Examples of the photopolymerization initiator include photoinitiators such as benzoin compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, thioxanthone compounds and peroxide compounds, and photosensitizers such as amines and quinones. 1-hydroxycyclohexyl phenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, β-chloranthraquinone Examples include 2,4,6-trimethylbenzoyldiphenylphosphine oxide. When ultraviolet rays are used as energy rays, the irradiation time and irradiation amount can be reduced by adding a photopolymerization initiator.

  An energy ray polymerizable compound as described above and a photopolymerization initiator as necessary are blended with an acrylate copolymer, or a photopolymerization initiator is blended with an energy ray polymerizable adhesive polymer as necessary, and energy When the irradiation is performed, the energy beam polymerizable compound or the energy beam polymerizable adhesive polymer is cured, the sticky feeling peculiar to the adhesive is lost, the storage elastic modulus is increased, and the probe tack value is decreased.

  As described above, the storage elastic modulus and probe tack value of the pressure-sensitive adhesive layer are determined appropriately depending on the degree of crosslinking of the resin material constituting the pressure-sensitive adhesive layer and the amount of energy beam polymerizable compound or energy beam polymerizable pressure-sensitive adhesive polymer. It can be adjusted by selecting.

  The probe tack value of the pressure-sensitive adhesive layer can also be adjusted by the thickness of the pressure-sensitive adhesive layer. The thickness of an adhesive layer is adjusted with the quantity of the adhesive apply | coated on the peeling film mentioned later. As the pressure-sensitive adhesive layer becomes thicker, the probe tack value becomes smaller.

  When the pressure-sensitive adhesive layer is formed from a resin composition having no energy ray curability, the pressure-sensitive adhesive layer is obtained by adjusting the degree of crosslinking so as to have a predetermined storage elastic modulus and probe tack value as described above. It is done.

  Even when the pressure-sensitive adhesive layer is formed from the energy ray-curable resin composition, the pressure-sensitive adhesive layer is obtained in the same manner as described above. At this time, when the pressure-sensitive adhesive layer before energy ray curing has the above storage elastic modulus and probe tack value, the obtained pressure-sensitive adhesive layer may be used as it is.

  If the pressure-sensitive adhesive layer before energy ray curing does not have the above storage elastic modulus and probe tack value, store the energy ray-curable pressure-sensitive adhesive layer by irradiating it with energy rays before attaching the chip. The elastic modulus and probe tack value are set to the above ranges.

  The release film 30 is temporarily attached onto the pressure-sensitive adhesive layer, and the surface roughness (Ra) on the pressure-sensitive adhesive layer side is 10 μm or less, preferably 8 μm or less, and more preferably 0.001 to 5 μm.

  When the surface roughness of the release film is larger than the above range, the surface of the pressure-sensitive adhesive layer becomes rough, the chip adhesion is poor, and there is a problem that the chip cannot be stably held. Further, even if the chip can be attached, there is a problem that the chip falls off during transportation and storage.

  The thickness of the release film is 10 to 300 μm, preferably 25 to 200 μm.

  Such a release film is not particularly limited, for example, a film made of a resin such as polyethylene terephthalate, polypropylene, or polyethylene, or a foamed film thereof, or paper such as glassine paper, coated paper, laminated paper, or the like , Fluorine-based and long-chain alkyl group-containing carbamates and other release agents can be used.

  As a means for controlling the surface roughness of the release film, an inorganic or organic filler is kneaded into the resin to be the release film to form a film. The surface roughness of the film is controlled by the shape, particle size or content of the filler. Examples of the filler include silica, alumina, calcium carbonate, titanium oxide, carbon black, and organically modified materials thereof. These fillers may be mixed with the resin and coated on the film surface. At the time of film formation, a metal roll is pressed against the film to transfer the shape of the roll onto the film surface. The surface roughness is controlled by the surface (embossed, matte) state of the roll. Unevenness is formed on the film surface by spraying particles on the film surface. The surface roughness is controlled by the particle size of the particles to be sprayed, the spraying pressure, and the spraying time.

  The release film is preferably bonded to the pressure-sensitive adhesive layer at the time of forming the above-mentioned pressure-sensitive adhesive layer, and more preferably, a method of forming the pressure-sensitive adhesive layer by applying a pressure-sensitive adhesive diluted in a solvent to the release film and drying it. It is.

  Generally, when a pressure-sensitive adhesive is applied onto a release film, the pressure-sensitive adhesive is embedded in the unevenness on the surface of the release film, and when the pressure-sensitive adhesive is dried, a pressure-sensitive adhesive layer in which the unevenness on the surface of the release film is transferred almost faithfully can be obtained. . Therefore, when a release film having a large surface roughness is used, a pressure-sensitive adhesive layer having a large surface roughness (Ra) is formed. Moreover, when a release film having a small surface roughness is used, an adhesive layer having a small surface roughness (Ra) is formed.

  By transferring the pressure-sensitive adhesive layer thus obtained to the base film, the die sort tape of the present invention is obtained.

  In order to obtain a die sort tape that reduces pick-up mistakes when picking up a chip from the adhesive layer and that does not drop off when the chip is stored, transported and washed with water. It is important to control the storage elastic modulus of the layer, the probe tack value, and the surface roughness of the release film.

  By setting the storage elastic modulus and probe tack value of the pressure-sensitive adhesive layer and the surface roughness of the release film within the above ranges, air mixing into the adhesive surface between the pressure-sensitive adhesive layer and the chip is reduced, and the chip is removed from the pressure-sensitive adhesive layer. Since the pick-up force at the time of pick-up is stabilized, pick-up mistakes can be reduced, and the chip can be prevented from falling off when the chip is stored and transported. Further, in the die sort tape of the present invention, even if air is mixed, since the air is uniformly mixed into the adhesive surface between the adhesive layer and the chip, the chip pick-up force becomes substantially constant and pickup errors are reduced. be able to.

  When the storage elastic modulus of the pressure-sensitive adhesive layer is higher than the above range, when the probe tack value is small, when the surface roughness of the release film is large, when the storage elastic modulus is high and the surface roughness of the release film is large, storage When the elastic modulus is high, the probe tack value is small, and the surface roughness of the release film is large, when the probe tack value is small and the surface roughness of the release film is large, or when the storage elastic modulus is high and the probe tack value is small However, the adhesiveness of the chip to the pressure-sensitive adhesive layer is poor and the chip cannot be held. Even if it can be temporarily held, there is a problem that the chip falls off during transportation and storage.

  When the probe tack value of the pressure-sensitive adhesive layer is larger than the above range, or when the probe tack value is large and the surface roughness of the release film is large, the adhesive surface between the pressure-sensitive adhesive layer and the chip is not uniform. Air is mixed in and the adhesive area between the pressure-sensitive adhesive layer and the chip becomes non-uniform, and the pickup force is not stable.

  When the storage elastic modulus of the pressure-sensitive adhesive layer is lower than the above range, the pressure-sensitive adhesive layer cannot maintain a shape having a specific surface roughness, and the adhesive area between the pressure-sensitive adhesive layer and the chip becomes non-uniform so that the pick-up force Is not stable.

(Example)
EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples.
Evaluation methods and test methods in Examples and Comparative Examples are shown below.

[Chip holding]
The die sort tapes of Examples and Comparative Examples were fixed to a ring frame at 23 ° C., and the polished surface of a chip (silicon chip, # 2000 polished, 10 × 10 mm) whose back surface was polished was attached to the adhesive layer of the die sort tape. (Pressure bonding weight 4.9N, pressure bonding time 2 seconds). Ten seconds after attaching the chip, the die sort tape was inverted with the ring frame. The chip that could be held by the chip was “A”, and the chip that could not be held was “B”.

[Air mixing]
The die sort tapes of Examples and Comparative Examples were fixed to a ring frame at 23 ° C., and the polished surface of a chip (silicon chip, # 2000 polished, 10 × 10 mm) whose back surface was polished was attached to the adhesive layer of the die sort tape. (Pressure bonding weight 4.9N, pressure bonding time 2 seconds). After sticking the chip, it was stored at 23 ° C. for 2 hours, and the degree of air contamination mixed on the bonded surface of the chip and the die sort tape was visually confirmed. The case where air contamination was not confirmed was designated as “A”, the case where air contamination was confirmed in a uniform state was designated as “B”, and the case where air contamination was confirmed in a non-uniform state was designated as “C”.

[Pickup force and its variation (average, maximum, minimum, standard deviation)]
The die sort tapes of Examples and Comparative Examples were fixed to a ring frame at 23 ° C., and the polished surface of a chip (silicon chip, # 2000 polished, 10 × 10 mm) whose back surface was polished was attached to the adhesive layer of the die sort tape. (Pressure bonding weight 4.9N, pressure bonding time 2 seconds). After attaching the chip, the chip was stored at 23 ° C. for 6 hours, and the pick-up force was measured. In the case where the pressure-sensitive adhesive layer was an ultraviolet curable type, the chip was attached, and ultraviolet irradiation was performed after storage at 23 ° C. for 3 hours. For the pickup force, the maximum value of the load applied to the needle when pushed up from the die sort tape side with the needle was measured under the following conditions.
Number of tests: 10 tips Number of push-up needles: 4 (arranged at the corner of an 8mm square)
Push-up needle shape: 0.7mm diameter, tip taper angle 20 degrees, tip radius of curvature 0.03mm
Pushing speed: 0.3m / min
Push-up amount: 2mm (after the needle contacts the tape)

[Storage elastic modulus measurement (G ')]
(Storage modulus without UV irradiation)
About the adhesive layer described in the Example and the comparative example, the adhesive layer pinched | interposed by the two polyethylene terephthalate films (peeling film) which performed the silicone peeling process was obtained. One release film was peeled off, and lamination was repeated so that the pressure-sensitive adhesive layers overlapped to obtain a pressure-sensitive adhesive having a thickness of 3 mm. A sample for elastic modulus measurement was produced by punching into a cylindrical shape with a diameter of 8 mm. The release films on both sides were peeled off, and the storage elastic modulus G ′ at a frequency of 1 Hz and a temperature of 23 ° C. was measured using a viscoelasticity measuring apparatus (DYNAMIC ANALYZER RDA-II manufactured by REOMETRIC).
(Storage elastic modulus when irradiated with ultraviolet rays)
For the pressure-sensitive adhesive layers described in the Examples and Comparative Examples, the pressure-sensitive adhesive layer was laminated to a thickness of about 300 μm, and then irradiated with ultraviolet rays (Adil RAD2000m / 8, manufactured by Lintec Co., Ltd.) (illuminance 220 mW / cm ² and light intensity of 320 mJ / cm ² ). The laminated adhesive layer was used as a sample having a width of 4 mm and a length (distance between chucks) of 30 mm, and the storage elastic modulus E ′ at a frequency of 11 Hz and a temperature of 23 ° C. was measured using a dynamic viscoelasticity measuring device (Orientec). Measurement was performed using RHEOVIBRON DDV-II-EP).
In order to eliminate the difference due to the difference in measurement method between the case of ultraviolet irradiation and the case of no ultraviolet irradiation, the measured value E ′ is expressed as G using the equation E ′ = 3G ′ (see “Viscoelasticity of Ferry Polymer”). Converted to '.

[Surface roughness (arithmetic mean roughness Ra)]
Based on JIS B0601-2001, the arithmetic average roughness Ra of the peeled film surface was measured with a surface roughness meter (SV-3000S4, manufactured by Mitutoyo Corporation). The measurement length was 18 mm, the scanning speed was 1.0 mm / s, and the data sampling pitch was 1.0 μm.

[Probe tack value]
The probe tack value of the adhesive layer was measured based on the probe tack test method of JIS Z0237 Reference 5. Specifically, a test piece (width = about 25 mm, length = about 25 mm) is attached to the probe tack test apparatus, and the probe is brought into contact with the adhesive layer described in the examples and comparative examples for a certain period of time while applying a certain load. After that, the force required to peel the probe from the adhesive layer in the vertical direction was determined, and this was used as the probe tack value. As the probe, a cylindrical probe (diameter = 5 mm) made of stainless steel SUS304 was used, the contact speed and the peeling speed were 10 mm per second, the contact load was 0.98 N / cm ² , and the contact time was 1 second.

Example 1
Acrylic copolymer (butyl acrylate / hydroxyethyl acrylate = 85/15 (mass ratio), weight average molecular weight = approximately 840,000) and 80% equivalent of methacryloyloxyethyl acrylate (based on 100 parts by mass of acrylic copolymer) 16 parts by mass) 100 parts by mass of the reacted energy ray polymerizable acrylic adhesive polymer, 3.5 parts by mass of a photopolymerization initiator (manufactured by Ciba Specialty Chemicals, Irgacure 184), and an isocyanate compound (manufactured by Toyo Kinki Manufacturing Co., Ltd.) , BHS-8515) 0.45 parts by mass (all blending ratios in terms of solid content) were used to obtain an adhesive composition.
The pressure-sensitive adhesive composition was applied to a release film having a surface roughness of 0.007 μm, and then dried (100 ° C. for 1 minute in an oven) to prepare a pressure-sensitive adhesive layer having a thickness of 10 μm. Next, an ethylene-methacrylic acid copolymer film (thickness 80 μm) subjected to corona treatment on one side was used as a base film, and the pressure-sensitive adhesive layer was transferred to the corona-treated surface to obtain a die sort tape. This die sort tape was evaluated for chip holding and pickup power. In addition, a storage modulus measurement, a surface roughness measurement, and a probe tack test were performed on the die sort tape different from this. The results are shown in Table 1.

(Example 2)
A die sort tape was obtained and evaluated in the same manner as in Example 1 except that a release film having a surface roughness of 0.024 μm was used. The results are shown in Table 1.

(Example 3)
A die sort tape was obtained and evaluated in the same manner as in Example 1 except that a release film having a surface roughness of 0.8 μm was used. The results are shown in Table 1.

Example 4
A die sort tape was obtained and evaluated in the same manner as in Example 1 except that a release film having a surface roughness of 1.482 μm was used. The results are shown in Table 1.

(Example 5)
A die sort tape was obtained and evaluated in the same manner as in Example 1 except that a release film having a surface roughness of 4.985 μm was used and the thickness of the pressure-sensitive adhesive composition was changed to 15 μm. The results are shown in Table 1.

(Example 6)
UV irradiation device (Lintec Co., RAD-2000m / 8) using, Example 1 of the die sort UV from the substrate film side of the tape (illuminance 120 mW / cm ² in the main wavelength 365 nm, light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 1.

(Example 7)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Example 2, light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 1.

(Example 8)
A die sort tape was obtained and evaluated in the same manner as in Example 1 except that the following energy ray-curable resin composition was used as the adhesive composition and a release film having a surface roughness of 0.024 μm was used. It was. The results are shown in Table 2.
For 100 parts by mass of acrylic copolymer (butyl acrylate / acrylic acid = 91/9 (mass ratio), weight average molecular weight = approximately 500,000), 5-9 functional urethane acrylate (weight average molecular weight) as an energy ray polymerizable compound = Approximately 1500) 100 parts by mass of a mixture containing 118 parts by mass, 3.5 parts by mass of a photopolymerization initiator (manufactured by Ciba Specialty Chemicals, Irgacure 184), and an isocyanate compound (manufactured by Toyo Kinki Manufacturing Co., Ltd., BHS-8515) 7.6 Mass parts were blended (all blending ratios in terms of solid content) to obtain an adhesive composition.

Example 9
A die sort tape was obtained and evaluated in the same manner as in Example 8 except that a release film having a surface roughness of 0.8 μm was used. The results are shown in Table 2.

(Example 10)
A die sort tape was obtained and evaluated in the same manner as in Example 8 except that a release film having a surface roughness of 1.482 μm was used. The results are shown in Table 2.

Example 11
A die sort tape was obtained and evaluated in the same manner as in Example 8 except that a release film having a surface roughness of 4.985 μm was used and the thickness of the pressure-sensitive adhesive composition was changed to 15 μm. The results are shown in Table 2.

Example 12
A die sort tape was obtained and evaluated in the same manner as in Example 1 except that the following energy ray-curable resin composition was used as the adhesive composition and a release film having a surface roughness of 0.024 μm was used. It was. The results are shown in Table 3.
For 100 parts by mass of acrylic copolymer (butyl acrylate / acrylic acid = 91/9 (mass ratio), weight average molecular weight = approximately 500,000), 3-4 functional urethane acrylate (weight average molecular weight) as an energy ray polymerizable compound = Approximately 4000) 100 parts by weight of a mixture containing 124 parts by weight, 3.5 parts by weight of a photopolymerization initiator (manufactured by Ciba Specialty Chemicals, Irgacure 184), and isocyanate compound (manufactured by Toyo Kinki Manufacturing Co., Ltd., BHS-8515) 4.9 Mass parts were blended (all blending ratios in terms of solid content) to obtain an adhesive composition.

(Example 13)
A die sort tape was obtained and evaluated in the same manner as in Example 12 except that a release film having a surface roughness of 0.8 μm was used. The results are shown in Table 3.

(Example 14)
A die sort tape was obtained and evaluated in the same manner as in Example 12 except that a release film having a surface roughness of 1.482 μm was used. The results are shown in Table 3.

(Example 15)
A die sort tape was obtained and evaluated in the same manner as in Example 12 except that a release film having a surface roughness of 4.985 μm was used and the thickness of the pressure-sensitive adhesive composition was changed to 15 μm. The results are shown in Table 3.

(Example 16)
Using a release film with a surface roughness of 0.007μm, using an ultraviolet irradiation device (RAD-2000m / 8, manufactured by Lintec Corporation), ultraviolet rays from the substrate film surface (illuminance 120mW / cm ^{2 at} a main wavelength of 365nm, light intensity) A die sort tape was obtained and evaluated in the same manner as in Example 12 except that 220 mJ / cm ² ) was irradiated. The results are shown in Table 3.

(Example 17)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Example 12, the light quantity 220 mJ / cm ² ) And evaluated. The results are shown in Table 3.

(Example 18)
A die sort tape was obtained and evaluated in the same manner as in Example 1 except that the following energy ray-curable resin composition was used as the pressure-sensitive adhesive composition. The results are shown in Table 4.
Acrylic copolymer (2-ethylhexyl acrylate / vinyl acetate / hydroxyethyl acrylate = 40/40/20 (mass ratio), weight average molecular weight = approximately 500,000) and 80% equivalent of methacryloyloxyethyl acrylate (acrylic) 21.3 parts by mass with respect to 100 parts by mass of the copolymer) 100 parts by mass of the energy ray-polymerizable acrylic adhesive polymer, 3.5 parts by mass of a photopolymerization initiator (Ibusacure 184, manufactured by Ciba Specialty Chemicals), and isocyan 1.07 parts by mass of a narate compound (BHS-8515, manufactured by Toyo Kinki Manufacturing Co., Ltd.) was blended (all blending ratios in terms of solid content) to obtain an adhesive composition.

Example 19
A die sort tape was obtained and evaluated in the same manner as in Example 18 except that a release film having a surface roughness of 0.024 μm was used. The results are shown in Table 4.

(Example 20)
A die sort tape was obtained and evaluated in the same manner as in Example 18 except that a release film having a surface roughness of 0.8 μm was used. The results are shown in Table 4.

(Example 21)
A die sort tape was obtained and evaluated in the same manner as in Example 1 except that the following energy ray-curable resin composition was used as the adhesive composition and a release film having a surface roughness of 0.024 μm was used. It was. The results are shown in Table 5.
As an energy ray-polymerizable compound for 100 parts by mass of an acrylic copolymer (butyl acrylate / methyl acrylate / hydroxyethyl acrylate / acrylamide = 68.5 / 30 / 0.5 / 1 (mass ratio), weight average molecular weight = approximately 500,000) To 100 parts by mass of a mixture containing 121 parts by mass of 5 to 9 functional urethane acrylate (weight average molecular weight = about 1500), 3.5 parts by mass of a photopolymerization initiator (Ibusacure 184, manufactured by Ciba Specialty Chemicals), and an isocyanate compound (Toyo Kinki Manufacturing Co., Ltd., BHS-8515) 3.7 parts by mass was blended (all blending ratios in terms of solid content) to obtain an adhesive composition.

(Example 22)
A die sort tape was obtained and evaluated in the same manner as in Example 21 except that a release film having a surface roughness of 0.8 μm was used. The results are shown in Table 5.

(Example 23)
A die sort tape was obtained and evaluated in the same manner as in Example 1 except that the following energy ray-curable resin composition was used as the pressure-sensitive adhesive composition. The results are shown in Table 6.
Acrylic copolymer (butyl acrylate / methyl methacrylate / hydroxyethyl acrylate = 52/20/28 (mass ratio), weight average molecular weight = approximately 500,000) and 90% equivalent of methacryloyloxyethyl acrylate (acrylic copolymer) (33.7 parts by mass with respect to 100 parts by mass) 100 parts by mass of the energy ray-polymerizable acrylic adhesive polymer reacted with 3.5 parts by mass of a photopolymerization initiator (Irgacure 184, manufactured by Ciba Specialty Chemicals), and an isocyanate compound ( 0.11 parts by mass (BHS-8515, manufactured by Toyo Kinki Manufacturing Co., Ltd.) was blended (all blending ratios in terms of solid content) to obtain an adhesive composition.

(Example 24)
A die sort tape was obtained and evaluated in the same manner as in Example 23 except that a release film having a surface roughness of 0.279 μm was used. The results are shown in Table 6.

(Example 25)
A die sort tape was obtained and evaluated in the same manner as in Example 23 except that a release film having a surface roughness of 0.8 μm was used. The results are shown in Table 6.

(Example 26)
A die sort tape was obtained and evaluated in the same manner as in Example 1 except that the following energy ray-curable resin composition was used as the pressure-sensitive adhesive composition. The results are shown in Table 7.
Energy ray polymerizable compound for 100 parts by mass of acrylic copolymer (butyl acrylate / methyl methacrylate / acrylic acid / hydroxyethyl acrylate = 84/8/3/5 (mass ratio), weight average molecular weight = approximately 500,000) To 100 parts by mass of a mixture containing 125 parts by mass of a bifunctional urethane acrylate (weight average molecular weight = approximately 8000), 3.5 parts by mass of a photopolymerization initiator (manufactured by Ciba Specialty Chemicals, Irgacure (registered trademark) 184), and isocyanate 2.1 parts by mass of a compound (BHS-8515, manufactured by Toyo Kinki Manufacturing Co., Ltd.) was blended (all blending ratios in terms of solid content) to obtain an adhesive composition.

(Example 27)
A die sort tape was obtained and evaluated in the same manner as in Example 26 except that a release film having a surface roughness of 0.024 μm was used. The results are shown in Table 7.

(Example 28)
A die sort tape was obtained and evaluated in the same manner as in Example 26 except that a release film having a surface roughness of 0.8 μm was used. The results are shown in Table 7.

(Example 29)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Example 26, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 7.

(Example 30)
A die sort tape was obtained and evaluated in the same manner as in Example 29 except that a release film having a surface roughness of 0.024 μm was used. The results are shown in Table 7.

(Example 31)
A sort tape was obtained and evaluated in the same manner as in Example 1 except that the following energy ray-curable resin composition was used as the pressure-sensitive adhesive composition. The results are shown in Table 8.
Energy ray for 100 parts by mass of acrylic copolymer (2-ethylhexyl acrylate / vinyl acetate / acrylic acid / hydroxyethyl methacrylate = 19.6 / 78.4 / 1/1 (mass ratio), weight average molecular weight = approximately 500,000) A photopolymerization initiator is added to 100 parts by mass of a mixture of 35 parts by mass of bifunctional urethane acrylate (weight average molecular weight = about 3000) and 35 parts by mass of hexafunctional urethane acrylate (weight average molecular weight = about 3000) as a polymerizable compound. (Ciba Specialty Chemicals, Irgacure 184) 3.5 parts by weight, rosin-containing diol 4.2 parts by weight, and isocyanate compound (Toyo Kinki Manufacturing Co., Ltd., BHS-8515) 1.9 parts by weight (all blended in solid content) And an adhesive composition was obtained.

(Example 32)
A die sort tape was obtained and evaluated in the same manner as in Example 31 except that a release film having a surface roughness of 0.024 μm was used. The results are shown in Table 8.

(Example 33)
A die sort tape was obtained and evaluated in the same manner as in Example 31 except that a release film having a surface roughness of 0.8 μm was used. The results are shown in Table 8.

(Example 34)
A die sort tape was obtained and evaluated in the same manner as in Example 31 except that a release film having a surface roughness of 4.985 μm was used and the thickness of the pressure-sensitive adhesive composition was changed to 15 μm. The results are shown in Table 8.

(Example 35)
A die sort tape was obtained and evaluated in the same manner as in Example 1 except that the following energy ray-curable resin composition was used as the pressure-sensitive adhesive composition, and a release film having a surface roughness of 0.8 μm was used. It was. The results are shown in Table 9.
For 100 parts by mass of acrylic copolymer (butyl acrylate / acrylic acid = 91/9 (mass ratio), weight average molecular weight = approximately 500,000), 3-4 functional urethane acrylate (weight average molecular weight) as an energy ray polymerizable compound = Approximately 4000) 100 parts by weight of a mixture containing 124 parts by weight, 10 parts by weight of dioctyl phthalate, 3.5 parts by weight of a photopolymerization initiator (manufactured by Ciba Specialty Chemicals, Irgacure 184), and an isocyanate compound (Toyo Kinki Manufacturing Co., Ltd.) 4.9 parts by mass (manufactured by BHS-8515) were blended (all blending ratios in terms of solid content) to obtain an adhesive composition.

(Example 36)
A die sort tape was obtained and evaluated in the same manner as in Example 35 except that a release film having a surface roughness of 1.482 μm was used. The results are shown in Table 9.

(Example 37)
A die sort tape was obtained and evaluated in the same manner as in Example 35 except that a release film having a surface roughness of 4.985 μm was used and the thickness of the pressure-sensitive adhesive composition was changed to 15 μm. The results are shown in Table 9.

(Example 38)
A die sort tape was obtained and evaluated in the same manner as in Example 1 except that the following energy ray-curable resin composition was used as the pressure-sensitive adhesive composition, and a release film having a surface roughness of 0.8 μm was used. It was. The results are shown in Table 10.
For 100 parts by mass of acrylic copolymer (butyl acrylate / acrylic acid = 91/9 (mass ratio), weight average molecular weight = approximately 500,000), 3-4 functional urethane acrylate (weight average molecular weight) as an energy ray polymerizable compound = Approximately 4000) 100 parts by weight of a mixture containing 124 parts by weight, 20 parts by weight of dioctyl phthalate, 3.5 parts by weight of a photopolymerization initiator (manufactured by Ciba Specialty Chemicals, Irgacure 184), and an isocyanate compound (Toyo Kinki Manufacturing Co., Ltd.) 4.9 parts by mass (manufactured by BHS-8515) were blended (all blending ratios in terms of solid content) to obtain an adhesive composition.

(Example 39)
A die sort tape was obtained and evaluated in the same manner as in Example 38 except that a release film having a surface roughness of 1.482 μm was used. The results are shown in Table 10.

(Example 40)
A die sort tape was obtained and evaluated in the same manner as in Example 38 except that a release film having a surface roughness of 4.985 μm was used and the thickness of the pressure-sensitive adhesive composition was changed to 15 μm. The results are shown in Table 10.

(Comparative Example 1)
UV irradiation device (Lintec Co., RAD-2000m / 8) using, die sort UV from the substrate film side of the tape (main illuminance 120 mW / cm ² at a wavelength 365nm of Example 3, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 1.

(Comparative Example 2)
A die sort tape was obtained and evaluated in the same manner as in Example 8 except that a release film having a surface roughness of 0.007 μm was used. The results are shown in Table 2.

(Comparative Example 3)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Comparative Example 2, light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 2.

(Comparative Example 4)
UV irradiation device (Lintec Co., RAD-2000 m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Example 8, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 2.

(Comparative Example 5)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm Example 9, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 2.

(Comparative Example 6)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Example 10, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 2.

(Comparative Example 7)
A die sort tape was obtained and evaluated in the same manner as in Example 12 except that a release film having a surface roughness of 0.007 μm was used. The results are shown in Table 3.

(Comparative Example 8)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Example 13, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 3.

(Comparative Example 9)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Example 18, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 4.

(Comparative Example 10)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Example 19, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 4.

(Comparative Example 11)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Example 20, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 4.

(Comparative Example 12)
A die sort tape was obtained and evaluated in the same manner as in Example 21 except that a release film having a surface roughness of 0.007 μm was used. The results are shown in Table 5.

(Comparative Example 13)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Comparative Example 12, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 5.

(Comparative Example 14)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Example 21, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 5.

(Comparative Example 15)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Example 22, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 5.

(Comparative Example 16)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Example 23, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 6.

(Comparative Example 17)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Example 24, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 6.

(Comparative Example 18)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Example 25, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 6.

(Comparative Example 19)
UV irradiation device (Lintec Co., RAD-2000m / 8) using the illuminance 120 mW / cm ² in the die sort UV from the substrate film side of the tape (main wavelength 365nm of Example 28, the light quantity 220 mJ / cm ² ) To obtain a die sort tape for evaluation. The results are shown in Table 7.

(Comparative Example 20)
A die sort tape was obtained and evaluated in the same manner as in Example 35 except that a release film having a surface roughness of 0.007 μm was used. The results are shown in Table 9.

(Comparative Example 21)
A die sort tape was obtained and evaluated in the same manner as in Comparative Example 20 except that a release film having a surface roughness of 0.024 μm was used. The results are shown in Table 9.

(Comparative Example 22)
A die sort tape was obtained and evaluated in the same manner as in Example 38 except that a release film having a surface roughness of 0.007 μm was used. The results are shown in Table 10.

(Comparative Example 23)
A die sort tape was obtained and evaluated in the same manner as in Comparative Example 22 except that a release film having a surface roughness of 0.024 μm was used. The results are shown in Table 10.

It is a figure for demonstrating the die sort tape of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Base film 20 ... Adhesive layer 30 ... Release film

Claims (2)

It consists of a base film, an adhesive layer formed thereon, and a release film temporarily attached to the surface of the adhesive layer,
The storage elastic modulus of the pressure-sensitive adhesive layer at 23 ° C. is 1 × 10 ⁴ to 1 × 10 ⁸ Pa,
The probe tack value is 50-3920 mN,
The die sort tape whose surface roughness (Ra) of the adhesive layer side surface of the said peeling film is 10 micrometers or less. 2. The die sort tape according to claim 1, wherein the pressure-sensitive adhesive layer is made of a cured product of an energy ray curable resin.
The storage elastic modulus at 23 ° C. after the energy ray irradiation of the pressure-sensitive adhesive layer is 1 × 10 ⁴ to 1 × 10 ⁸ Pa,
The die sort tape whose probe tack value is 50-3920 mN.

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