JP5097600B2 - Chip holding structure, die sort sheet, and semiconductor device manufacturing method - Google Patents

Description

  The present invention relates to a die holding sheet comprising a chip holding structure when a chip is conveyed or stored in a die sorting sheet having a self-adhesive resin layer, a base film, and a self-adhesive resin layer formed thereon. And a method of manufacturing a semiconductor device.

  One of the manufacturing processes of a semiconductor device is a dicing process of cutting and separating a semiconductor wafer on which a circuit is formed through a required pretreatment into a plurality of chips. In this process, a dicing sheet for fixing a semiconductor wafer is attached to a circular or square frame called a ring frame, a semiconductor wafer is attached to the dicing sheet, and dicing is performed for each circuit to obtain a semiconductor chip. Then, following the expanding process by the bonding machine, a die bonding process is performed in which a die bonding adhesive such as an epoxy resin is applied to the pad portion of the chip substrate to bond the semiconductor chip to the chip substrate. Furthermore, after a wire bonding process and an inspection process, resin sealing is finally performed in a molding process to manufacture a semiconductor device.

  On the other hand, an individual semiconductor chip may be accommodated and transported without die bonding. In such a case, the die bonding process is performed in outline.

  For accommodating and transporting such semiconductor chips, a reel-like embossed carrier tape, a chip tray, or the like, in which pocket-shaped recesses are formed on a thermoplastic resin sheet by embossing, is used. After the semiconductor chip is accommodated in the recess, it is covered with a cover sheet and stored and transported until the semiconductor chip is incorporated into the electronic device. By using such an embossed carrier tape, only non-defective products can be selected and shipped after the dicing process, and further, a single semiconductor wafer can be shipped to a plurality of factories.

  However, since dust, dirt, and the like cause trouble in the semiconductor device, the semiconductor chip may be washed with water before using it in the place where the semiconductor chip is transported. When an embossed carrier tape is used, it is necessary to fix it to a dicing tape or the like and wash it again, which is very inefficient.

  On the other hand, the technique of mounting a semiconductor chip using adhesive tapes, such as a heat peeling tape and a general-purpose dicing tape, and accommodating and conveying the semiconductor chip is also used (Patent Document 1). In this case, the semiconductor chip is affixed to the adhesive layer of the adhesive tape, and is stored and transported.

However, the storage of the semiconductor chip may take several tens of days. With the adhesive tape of Patent Document 1, when the adhesive force of the adhesive layer is large, the semiconductor chip will adhere with the passage of time for storage and transportation. It will adhere to the agent layer. As a result, it becomes difficult to pick up the semiconductor chip, and particularly when the semiconductor chip is thin, there is a risk of damaging the semiconductor chip during the pickup work. Further, when the adhesive strength of the adhesive layer is small, there is a risk that the semiconductor chip falls off during storage and transportation.
JP 2000-95291 A

  The present invention seeks to solve the problems associated with the prior art as described above. That is, according to the present invention, the chip can be stored and transported without dropping, and when a chip is picked up after a storage period of several tens of days, even a thin chip can be easily picked up without being damaged. It is an object of the present invention to provide a chip holding structure that can be used. Another object of the present invention is to provide a die sort sheet used for the structure of the holding structure, and a method for manufacturing a semiconductor device including a step through the holding structure.

The gist of the present invention aimed at solving such problems is as follows.
(1) In a chip holding structure in which a chip is held on a die sort sheet comprising a base film and a self-adhesive resin layer formed thereon,
The storage elastic modulus (G ′) at 23 ° C. of the self-adhesive resin layer is 0.5 to 200 MPa,
A chip holding structure in which the self-adhesive resin layer has a surface roughness (Ra) of 1 μm or less.
(2) The chip holding structure according to (1), wherein the self-adhesive resin layer has a loop tack value of 50 to 2000 mN / 25 mm.
(3) It consists of a base film and a self-adhesive resin layer formed thereon,
The sheet | seat for die sorts whose storage elastic modulus (G ') in 23 degreeC of the said self-adhesive resin layer is 0.5-200 Mpa, and the surface roughness (Ra) is 1 micrometer or less.
(4) The die-sorting sheet according to (3), wherein the self-adhesive resin layer is made of a cured product of an energy ray curable resin,
The sheet | seat for die sorts whose storage elastic modulus (G ') in 23 degreeC after the energy ray irradiation of the said self-adhesive resin layer is 0.5-200 Mpa, and whose surface roughness (Ra) is 1 micrometer or less.
(5) In the chip holding structure according to (1) or (2), a method for manufacturing a semiconductor device, including a step of transporting or storing a semiconductor chip, and a step of picking up the chip from a die sort sheet.

  According to the present invention, by optimizing the storage elastic modulus and surface roughness of the self-adhesive resin layer in the die sort sheet forming the chip holding structure, the chip can be transported and stored without dropping. When a chip is picked up after a storage period of ten days, a chip holding structure is provided that can be easily picked up without being damaged even if the chip is thin.

Hereinafter, the present invention will be described more specifically.
As shown in FIG. 1, the chip holding structure according to the present invention includes a base film 10 and a self-adhesive resin layer 20 of a die sort sheet having a self-adhesive resin layer 20 formed on one surface thereof. The chip 30 is held on the surface. Moreover, the sheet | seat for die sorts which concerns on this invention has the base film 10 and the self-adhesive resin layer 20 on the one surface. In such a die sort sheet, the chip 30 is held on the self-adhesive resin layer 20, and the outer peripheral portion is fixed to the ring frame 40, and is conveyed and stored. Furthermore, the method of manufacturing a semiconductor device according to the present invention includes a step of transporting and storing the chip in the chip holding structure and a step of picking up the chip from the die sort sheet.

  There is no restriction | limiting in particular as the base film 10, Any can be suitably selected from what is conventionally used as a base film of various adhesive sheets, and can be used. For example, polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate film, ionomer resin film Plastic sheets such as ethylene / (meth) acrylic acid copolymer film, ethylene / (meth) acrylic acid ester copolymer film, polystyrene film, polycarbonate film, and fluororesin film are used.

  The base film may be a laminated film of these plastic sheets or a crosslinked film. Further, it may be colorless or colored. Furthermore, when irradiating energy rays when forming the self-adhesive resin layer to be described later, the substrate film is transparent even if it is transparent as long as it has transparency to the energy rays to be used. Also good.

  Although the thickness of a base film should just be suitably determined according to a use purpose or a condition, it is 50-300 micrometers normally, Preferably it is the range of 60-200 micrometers.

  In addition, the surface of the base film is subjected to unevenness treatment by sandblasting or solvent treatment, or corona discharge treatment, plasma, for the purpose of improving the adhesiveness with the self-adhesive resin layer provided thereon. Oxidation treatment such as treatment, ozone / ultraviolet irradiation treatment, flame treatment, chromic acid treatment, and hot air treatment can be performed. Moreover, primer treatment can also be performed.

  The self-adhesive resin layer 20 is a resin layer having a tackiness enough to temporarily attach and hold a chip, although it has almost no stickiness specific to an adhesive. The self-adhesive resin layer in the chip holding structure according to the present invention has a storage elastic modulus (G ′) (23 ° C.) of 0 when the chip is affixed, transported and stored, that is, in the state of holding the chip. 0.5 to 200 MPa, preferably 1 to 180 MPa, and more preferably 2 to 100 MPa. The storage elastic modulus of the self-adhesive resin layer at the time of chip sticking and chip pick-up is not particularly limited, but is preferably the same as described above.

  When the storage elastic modulus at 23 ° C. of the self-adhesive resin layer is higher than the above range, there is a problem that the adhesion of the chip is bad and the chip cannot be stably held. Further, even if the chip can be temporarily attached, there is a problem that the chip falls off during transportation, storage, and water washing. On the other hand, when the storage elastic modulus is lower than the above range, the chip can be easily held, but the adhesion of the chip becomes too high, resulting in a problem that the pickup becomes difficult.

  The surface roughness (Ra) of the self-adhesive resin layer is 1 μm or less, preferably 0.7 μm or less, and more preferably in the range of 0.0001 to 0.2 μm.

  If the surface roughness (Ra) of the self-adhesive resin layer is larger than the above range, the chip retainability is poor, and even if the chip can be temporarily attached, the chip falls off during transportation, storage, and water washing. This causes a malfunction.

  Control of the storage elastic modulus and surface roughness of the self-adhesive resin layer is important for transporting, storing, washing with water without dropping the chip, and picking up easily without breaking the chip.

When the storage elastic modulus of the self-adhesive resin layer is higher than the above range, or when the surface roughness is large, there is a problem that the chip falls off during conveyance.
Further, when the storage elastic modulus of the self-adhesive resin layer is lower than the above range, it is impossible to pick up, and there is a risk of chip breakage particularly when the thickness of the chip is thin.
Furthermore, when the storage elastic modulus of the self-adhesive resin layer is lower than the above range and the surface roughness is large, there is no problem that the chip falls off during transportation, but the storage period of the chip is several tens of days or more. When picking up after a lapse of time, the adhesiveness between the self-adhesive resin layer and the chip increases, making picking up difficult, and there is a risk of chip breakage particularly when the chip is thin.

  The self-adhesive resin layer in the chip holding structure according to the present invention preferably has a loop tack value of 50 to 2000 mN / 25 mm, more preferably when the chip is affixed and transported / stored, that is, in the state of holding the chip. Is in the range of 70-1500 mN / 25 mm.

  If the loop tack value is larger than the above range, pickup may be difficult. If the loop tack value is smaller than the above range, the adhesion with the temporarily attached chip is poor, and the chip may fall off during conveyance and water washing.

  The thickness of the self-adhesive resin layer is 1 to 50 μm, preferably 3 to 30 μm.

  Although the resin material which comprises such a self-adhesive resin layer is not specifically limited as long as it has the said characteristic, As an example, the acrylic ester copolymer widely used as an adhesive is mentioned. The weight average molecular weight of the acrylic ester copolymer is 100,000 or more, preferably 100,000 to 1,500,000, and particularly preferably 150,000 to 1,000,000. The acrylic ester copolymer is composed of structural units derived from (meth) acrylic acid, (meth) acrylic ester monomers or derivatives thereof. As the (meth) acrylic acid ester monomer, a (meth) acrylic acid alkyl ester having 1 to 18 carbon atoms in the alkyl group is used. Examples of derivatives of (meth) acrylic acid ester monomers include dialkyl (meth) acrylamides such as dimethylacrylamide, dimethylmethacrylamide, diethylacrylamide, and diethylmethacrylamide. Among these, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate, butyl acrylate, butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, 2-hydroxy are particularly preferable. Ethyl acrylate, 2-hydroxyethyl methacrylate, dimethylacrylamide, and the like. In addition to these monomers, vinyl acetate, styrene, vinyl acetate and the like may be copolymerized.

  Examples of the acrylic acid ester copolymer having a functional group include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, 2-hydroxybutyl acrylate, and 2-hydroxybutyl methacrylate. It has a carboxyl group-containing compound such as hydroxyl group-containing acrylate, acrylic acid, methacrylic acid, itaconic acid as a constituent unit.

  The acrylic ester copolymer is a polymer that is widely used as a pressure-sensitive adhesive, and in many cases, has a sticky feeling peculiar to a pressure-sensitive adhesive. When used as the self-adhesive resin layer of the present invention, it is partially cross-linked with a cross-linking agent so as to suppress stickiness and adjust to have the aforementioned storage elastic value. Examples of the crosslinking agent include organic polyvalent isocyanate compounds, organic polyvalent epoxy compounds, and organic polyvalent imine compounds.

  In general, when the amount of the crosslinking agent used is increased, the tackiness of the acrylate copolymer is lowered and the storage elastic modulus is increased.

  Moreover, you may form a self-adhesive resin layer using the energy-beam curable resin composition which mix | blended the energy-beam polymeric compound and the photoinitiator as needed with the acrylic ester copolymer.

  As the energy ray polymerizable compound, energy ray polymerizable oligomers such as epoxy acrylate, urethane acrylate, polyester acrylate and polyether acrylate, and energy ray polymerizable monomers are used. Examples of the energy ray polymerizable monomer include isobornyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyloxy (meth) acrylate, cyclohexyl (meth) acrylate, adamantane (meth) ) An alicyclic compound such as acrylate, an aromatic compound such as phenylhydroxypropyl acrylate, benzyl acrylate, phenol ethylene oxide modified acrylate, or tetrahydrofurfuryl (meth) acrylate, morpholine acrylate, N-vinyl pyrrolidone or N-vinyl caprolactam Heterocyclic compounds are mentioned. If necessary, trimethylolpropane tri (meth) acrylate, dipentaerythritol tri (meth) acrylate, propionic acid modified dipentaerythritol tri (meth) acrylate, pentaerythritol tri (meth) acrylate, propylene oxide modified trimethylolpropane Trifunctional type such as tri (meth) acrylate and tris (acryloxyethyl) isocyanurate; tetrafunctional type such as diglycerin tetra (meth) acrylate and pentaerythritol tetra (meth) acrylate; propionic acid-modified dipentaerythritol penta (meth) ) Pentafunctional type such as acrylate; hexafunctional type such as dipentaerythritol hexa (meth) acrylate, caprolactone-modified dipentaerythritol hexa (meth) acrylate What polyfunctional (meth) acrylate may be used. Such energy beam polymerizable compounds may be used alone or in combination.

  Among these, urethane acrylate oligomers are preferably used. The urethane acrylate oligomer includes a polyol compound such as a polyester type or a polyether type and a polyvalent isocyanate compound such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, and 1,3-xylylene diisocyanate. 1, 4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, and the like, a terminal isocyanate urethane prepolymer obtained by reacting with an acrylate or methacrylate having a hydroxyl group such as 2-hydroxyethyl acrylate or 2-hydroxy Ethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, polyethylene glycol acrylate, polyethylene glycol methacrylate, etc. Obtained by. Such a urethane acrylate oligomer has an energy ray polymerizable double bond in the molecule and is polymerized and cured by irradiation with energy rays. As the urethane acrylate oligomer, those having a weight average molecular weight of 100 to 50000 are preferable, and those having 1000 to 30000 are particularly preferable.

  Examples of the photopolymerization initiator include photoinitiators such as benzoin compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, thioxanthone compounds and peroxide compounds, and photosensitizers such as amines and quinones. 1-hydroxycyclohexyl phenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, β-chloranthraquinone Examples include 2,4,6-trimethylbenzoyldiphenylphosphine oxide. When ultraviolet rays are used as energy rays, the irradiation time and irradiation amount can be reduced by adding a photopolymerization initiator.

  Moreover, what blended the acrylic ester copolymer (energy-beam polymerizable adhesive polymer) which has an energy-beam polymerizable group in a side chain, and the photoinitiator as needed as an energy-beam curable resin composition The self-adhesive resin layer may be formed by using. The energy ray-polymerizable adhesive polymer includes, for example, an acrylic ester copolymer having a functional group, a polymerizable group-containing compound having a substituent that reacts with the functional group and an energy ray-polymerizable group in one molecule ( It is obtained by reacting with an energy beam polymerizable group-containing compound). As the acrylate copolymer having a functional group, an acrylate copolymer having the functional group monomer mentioned in the above acrylate copolymer as a constituent unit is used. Examples of the energy beam polymerizable group-containing compound include methacryloyloxyethyl isocyanate, meta-isopropenyl-α, α-dimethylbenzyl isocyanate, methacryloyl isocyanate, allyl isocyanate, and glycidyl (meth) acrylate. The reaction between the acrylic ester copolymer having a functional group and the polymerizable compound having a substituent that reacts with the functional group is usually performed at room temperature using a catalyst such as dibutyltin laurate in a solution such as ethyl acetate. Stirring is performed at normal pressure for 24 hours.

  When the energy ray curable resin composition as described above is irradiated with energy rays, the energy ray polymerizable compound or the energy ray polymerizable adhesive polymer is cured, and the stickiness peculiar to the pressure sensitive adhesive is lost, and the storage elastic modulus. Will increase.

  As described above, the storage elastic modulus and loop tack value of the self-adhesive resin layer are determined by appropriately determining the degree of crosslinking of the resin material constituting the resin layer and the amount of the energy beam polymerizable compound or energy beam polymerizable adhesive polymer. It can be adjusted by selecting.

  In addition, as a method for controlling the surface roughness of the self-adhesive resin layer, a method of laminating an embossed release film when forming the self-adhesive resin layer, a foaming agent in the composition is foamed when the self-adhesive resin composition is dried. Although the method of doing is mentioned, the method of bonding a peeling film is preferable. More preferably, the self-adhesive resin layer diluted with a solvent is applied to a release film and dried to form a self-adhesive resin layer.

  In general, when a self-adhesive resin is applied onto a release film, the self-adhesive resin is embedded in the unevenness of the release film surface, and when the self-adhesive resin is dried, the unevenness of the release film surface is transferred almost faithfully. A functional resin layer can be obtained. Therefore, when a release film having a large surface roughness is used, a self-adhesive resin layer having a large surface roughness (Ra) is formed. In addition, when a release film having a small surface roughness is used, a self-adhesive resin layer having a small surface roughness (Ra) is formed.

  In other words, the surface roughness (Ra) of the self-adhesive resin layer is almost equal to the surface roughness of the release-treated surface of the release film, but the self-adhesive resin layer has a self-adhesive resin layer due to changes over time or volume fluctuations during energy beam irradiation. The surface roughness of the adhesive resin layer may change.

  When the self-adhesive resin layer is formed from a resin composition that does not have energy ray curability, the degree of cross-linking is adjusted to have a predetermined storage modulus as described above, and the product is formed on a predetermined release film. A self-adhesive resin layer is obtained by film formation. The die-sorting sheet of the present invention is obtained by transferring the obtained self-adhesive resin layer to a base film.

  Moreover, also when forming a self-adhesive resin layer from an energy-beam curable resin composition, the sheet | seat for die sorts is obtained similarly to the above. Under the present circumstances, what is necessary is just to use the sheet | seat for die sorts obtained as it is, when the self-adhesive resin layer before energy ray hardening has said storage elastic modulus.

In addition, when the self-adhesive resin layer before curing with energy rays does not have the above-mentioned storage modulus, the energy rays are irradiated with the energy rays before temporarily attaching the chips to the energy-curing self-adhesive resin layer. Thus, the storage elastic modulus may be within the above range, or the energy storage may be irradiated after the chip is temporarily attached, and the storage elastic modulus may be within the above range.
In any case, the storage elastic modulus and surface roughness of the self-adhesive resin layer in a state where the chip is held may be in the above range.

  When irradiating the energy ray curable self-adhesive resin layer with energy rays before temporarily attaching the chips, it is preferable to irradiate the energy rays when preparing the sheet for die sorting. By irradiating the energy ray at the time of producing the die sort sheet and setting it to a predetermined storage elastic modulus, it is not necessary to irradiate the energy ray in a process such as chip temporary attachment, and the process can be simplified.

  If the self-adhesiveness of the energy ray-curable self-adhesive resin layer is small before temporary attachment of the chip, and it is difficult to temporarily attach the chip after irradiation with energy rays, it is transported after the temporary attachment of the chip, Prior to storage and washing with water, the self-adhesive resin layer may be irradiated with energy rays. Since the self-adhesive resin layer at the time of temporarily attaching the chip is in a state of having an adhesive force before energy irradiation, the temporary attachment of the chip is easy, and the energy irradiation after the chip temporary attachment is performed. The storage, water washing, and pick-up processes have the predetermined storage elastic modulus, and thus the effects of the present invention are achieved.

  In addition, when the chip is thin and there is a risk of chip breakage during pick-up, energy rays may be further irradiated before pick-up of the chip.

  A semiconductor device is manufactured by carrying and storing a chip in a state where the chip is held on the die sort sheet having the above-described self-adhesive resin layer, picking up the chip from the die sort sheet, and performing die bonding resin sealing. can do. The manufacturing method of the semiconductor device can effectively prevent the chip from falling off from the die sort sheet when transported and stored. Further, when picking up a chip, even if the chip is thin, the chip can be picked up without being damaged.

(Example)
EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples. Further, the blending amounts (contents) of the respective components are all solid values unless otherwise specified.
Evaluation methods and test methods in Examples and Comparative Examples are shown below.

[Measurement of storage elastic modulus (G ')]
(Storage modulus without UV irradiation)
About the Example and the comparative example, the self-adhesive resin layer pinched | interposed with the two polyethylene terephthalate films (peeling film) which performed the silicone peeling process was obtained. One release film was peeled off, and lamination was repeated so that the self-adhesive resin layers overlapped to obtain a self-adhesive resin layer having a thickness of 3 mm. A sample for elastic modulus measurement was produced by punching into a cylindrical shape with a diameter of 8 mm. The release films on both sides were peeled off, and the storage elastic modulus (G ′) at a frequency of 1 Hz and a temperature of 23 ° C. was measured using a viscoelasticity measuring device (DYNAMIC ANALYZER RDA-II manufactured by REOMETRIC).
(Storage elastic modulus when irradiated with ultraviolet rays)
For the examples and comparative examples, a self-adhesive resin layer was laminated to a thickness of about 300 μm, and then irradiated with ultraviolet rays (Adwill RAD2000m / 8, manufactured by Lintec Co., Ltd.) (illuminance 220 mW / cm ² , light intensity) 320 mJ / cm ² ). The laminated self-adhesive resin layer is a sample having a width of 4 mm and a length (distance between chucks) of 30 mm, and the storage elastic modulus (E ′) at a frequency of 11 Hz and a temperature of 23 ° C. is measured by a dynamic viscoelasticity measuring device. (Measured using RHEOVIBRON DDV-II-EP manufactured by Orientec).
In order to eliminate the difference due to the difference in measurement method between the case of ultraviolet irradiation and the case of no ultraviolet irradiation, the measured value E ′ is expressed as G using the equation E ′ = 3G ′ (see “Viscoelasticity of Ferry Polymer”). 'Converted.

[Surface roughness (Ra) measurement]
About an Example and a comparative example, arithmetic mean roughness Ra was measured with the optical interference type surface roughness meter (the Veeco company make, WycoNT1100) based on ANSI / ASME B46.1.
Objective lens magnification: 10x, Internal lens magnification: 1x Measurement area: 0.35mm ²

[Loop tack test]
Based on FINAT No. 9, the loop tack was measured.
The die sort sheets described in the examples and comparative examples were cut into tapes having a width of 25 mm and a length of 300 mm (including gripping portions of 25 mm at both ends) to obtain test pieces. Next, peel off the release film of the test piece, make the measurement surface (self-adhesive resin layer surface) outside, align the substrate film surfaces at both ends in a loop, and make a tensile tester (Orientec Universal) Attach the grips at both ends to the upper grip of the tensile tester). On the other hand, a test plate was attached horizontally to the lower grip of the tensile tester, a double-sided tape was attached to the test plate, and the same die sort sheet as the test piece was attached via the substrate surface. The release film of the die sort sheet attached to the test plate was peeled off, and the upper grip was lowered at a speed of 300 mm / min. It sticks so that the contact area of the measurement surface of a test piece and the self-adhesive resin layer surface of the sheet | seat for die-sorting by the side of a test board may be set to 25x50 mm. After being held at that position for 15 seconds, it was peeled off at a speed of 300 mm / min, and the tensile load value obtained under an environmental condition of 23 ° C. was measured as a loop tack value. The obtained results are shown in Table 1.

[Manufacture of semiconductor chips]
In the examples and comparative examples, the back surface of the silicon wafer was ground to a thickness of 100 μm using a DGP8760 manufactured by Disco Co., Ltd., dry-polished, and diced to 5 mm × 5 mm to obtain a semiconductor chip.

[Semiconductor chip transport (chip retention)]
In Examples and Comparative Examples, a semiconductor chip is picked up using a die bonding apparatus (BESTEM-D02 manufactured by Canon Machinery Co., Ltd.), and a total of 100 semiconductor chips are about 300 μm from each other on a self-adhesive resin layer of a die sort sheet. Were temporarily arranged and arranged in a lattice pattern so as to be separated by an interval of. In this state, it was stored for 24 hours (23 ° C.), and then washed with water (rotation speed: 3000 rpm, 1 minute) using a spin cleaning machine (Disco Corporation wafer grinding device, DFD651 internal unit). At this time, the presence or absence of chip removal was confirmed, and the number of chips that did not fall off was counted as the OK number.

[Pickup test]
A semiconductor chip is picked up using a die-bonding apparatus, and a total of 100 semiconductor chips are arranged in a lattice pattern so as to be spaced apart from each other at an interval of about 300 μm on the self-adhesive resin layers of the die sort sheets of Examples and Comparative Examples. And temporarily attached. In this state, after storing for 24 hours (23 ° C.), the chip was picked up and picked up from the die sort sheet side using a pickup device (BESTEM-D02 manufactured by Canon Machinery Co., Ltd.). Twenty pieces were randomly picked up, and the number of pieces separated from the die sort sheet without damaging the chips was counted. The test was performed in the same manner as described above except that the storage time was 720 hours (23 ° C.).
The pickup was performed using the pickup device in which five needles were arranged at the four corners and the central portion, with the following protrusion amount.
One-stage protruding amount 4 (needle at four corners): 100 μm
One-stage projecting amount 1 (middle needle): 100 μm
Two-stage projecting amount 1 (middle needle): 300 μm

Example 1
As a self-adhesive resin composition, 3 parts per 100 parts by weight of an acrylic copolymer (weight average molecular weight 500,000) obtained by copolymerizing 90 parts by weight of butyl acrylate (BA) and 10 parts by weight of acrylic acid (AA). To 60 functional parts of urethane acrylate oligomer (weight average molecular weight 3,500), 5 to 9 functional urethane acrylate oligomer (weight average molecular weight 2,200) 60 parts by weight, polyisocyanate compound (manufactured by Nippon Polyurethane Co., Ltd., Coronate L) 10 Part by weight and 3 parts by weight of a benzophenone photopolymerization initiator (manufactured by Ciba Specialty Chemicals, Irgacure 184) are mixed, the concentration is adjusted to 30% by weight with toluene, and a solution of the self-adhesive resin composition Got.

The above-mentioned self-adhesive resin composition solution was applied onto the release-treated surface of a polyethylene terephthalate (PET) film (thickness 38 μm) having a surface roughness of 0.001 μm that had been subjected to silicone release treatment, and dried (100 ° C. in an oven, For 1 minute) to prepare a self-adhesive resin layer having a thickness of 10 μm. Next, an ethylene-methacrylic acid copolymer film (thickness: 80 μm) was used as a base film, and the self-adhesive resin layer was transferred to one side. A sheet for die sorting was obtained by irradiating ultraviolet rays from the surface of the substrate film using an ultraviolet irradiation device (Rintec Co., Ltd., RAD-2000m / 8, illuminance 220 mW / cm ² , light intensity 180 mJ / cm ² ). A chip was temporarily attached onto the self-adhesive resin composition layer of the die sort sheet to obtain a chip holding structure. The structure was subjected to semiconductor chip conveyance (chip retention) and a pickup test. Separately, the die sort sheet was subjected to storage elastic modulus measurement, surface roughness measurement, and loop tack test. The results are shown in Table 1.

(Example 2)
As a self-adhesive resin composition, 20 parts by weight of 2-ethylhexyl acrylate (2EHA), 60 parts by weight of isobutyl acrylate (iBA), 15 parts by weight of methyl methacrylate (MMA), and 5 parts by weight of 2-hydroxyethyl acrylate (HEA) are copolymerized. 5 parts by weight of a polyisocyanate compound (manufactured by Nippon Polyurethane Co., Ltd., Coronate L) is mixed with 100 parts by weight of the copolymer obtained (weight average molecular weight 500,000), and 30% by weight with toluene. The concentration was adjusted to obtain a self-adhesive resin composition solution. The above-mentioned self-adhesive resin composition solution is applied on the release-treated surface of a PET film (thickness 38 μm) with a surface roughness of 0.001 μm that has been subjected to silicone release treatment, and dried (100 ° C. for 1 minute in an oven). A self-adhesive resin layer having a thickness of 10 μm was prepared. Next, an ethylene-methacrylic acid copolymer film (thickness: 80 μm) was used as a base film, and a self-adhesive resin layer was transferred to one side to obtain a sheet for die sorting. A chip holding structure was obtained in the same manner as in Example 1 and evaluated. The results are shown in Table 1.

(Example 3)
100 parts by weight of a copolymer (weight average molecular weight 500,000) obtained by reacting 100 parts by weight of an acrylic copolymer consisting of 85 parts by weight of BA and 15 parts by weight of HEA as a self-adhesive resin composition and 16 parts by weight of methacryloyloxyethyl isocyanate Part of a polyisocyanate compound (manufactured by Nippon Polyurethane, Coronate L) and 3 parts by weight of a benzophenone photopolymerization initiator (manufactured by Ciba Specialty Chemicals, Irgacure 184) are mixed with 30 parts by weight of toluene. The concentration was adjusted to be% and a self-adhesive resin composition solution was obtained. The above-mentioned self-adhesive resin composition solution is applied onto the release-treated surface of a PET film (thickness 38 μm) with a surface roughness of 0.7 μm, which has been subjected to silicone release treatment, and dried (100 ° C. for 1 minute in an oven). A self-adhesive resin layer having a thickness of 10 μm was prepared. Next, an ethylene-methacrylic acid copolymer film (thickness: 80 μm) was used as a base film, and the self-adhesive resin layer was transferred to one side. A die sort sheet was obtained by irradiating ultraviolet rays from the surface of the base film using an ultraviolet irradiation device (manufactured by Lintec Corporation, RAD-2000m / 8). A chip holding structure was obtained in the same manner as in Example 1 and evaluated. The results are shown in Table 1.

(Example 4)
100 parts by weight of a copolymer (weight average molecular weight 500,000) obtained by reacting 100 parts by weight of an acrylic copolymer consisting of 85 parts by weight of BA and 15 parts by weight of HEA as a self-adhesive resin composition and 16 parts by weight of methacryloyloxyethyl isocyanate Part of a polyisocyanate compound (manufactured by Nippon Polyurethane, Coronate L) and 3 parts by weight of a benzophenone photopolymerization initiator (manufactured by Ciba Specialty Chemicals, Irgacure 184) are mixed with 30 parts by weight of toluene. The concentration was adjusted to be% and a self-adhesive resin composition solution was obtained. The above-mentioned self-adhesive resin composition solution is applied onto the release-treated surface of a PET film (thickness 38 μm) with a surface roughness of 0.0004 μm that has been subjected to silicone release treatment, and dried (100 ° C. for 1 minute in an oven). A self-adhesive resin layer having a thickness of 10 μm was prepared. Next, an ethylene-methacrylic acid copolymer film (thickness: 80 μm) was used as a base film, and the self-adhesive resin layer was transferred to one side to obtain a sheet for die sorting. A chip is temporarily attached on the self-adhesive resin composition layer of the die sort sheet, and the chip is held by irradiating ultraviolet rays from the base film using a UV irradiation device (RAD-2000m / 8, manufactured by Lintec Corporation). A structure was obtained. Evaluation similar to Example 1 was performed. The results are shown in Table 1.

(Example 5)
As a solution of the self-adhesive resin composition, polyisocyanate compound with respect to 100 parts by weight of copolymer (weight average molecular weight 800,000) obtained by copolymerizing 85 parts by weight of methyl acrylate (MA) and 15 parts by weight of HEA (Nippon Polyurethane Co., Ltd., Coronate L) Same as Example 2 except that 0.5 part by weight and a PET film having a surface roughness of 0.001 μm (thickness 38 μm) was used as the release film. A chip holding structure was obtained and evaluated. The results are shown in Table 1.

(Example 6)
As a solution of the self-adhesive resin composition, a bi- to tri-functional urethane acrylate oligomer (100 to 100 parts by weight of an acrylic copolymer (weight average molecular weight 500,000) obtained by copolymerizing 90 parts by weight of BA and 10 parts by weight of AA ( 25 parts by weight of a weight average molecular weight 7,000), 2 parts by weight of a polyisocyanate compound (manufactured by Nippon Polyurethane, Coronate L), and 1 part by weight of a benzophenone photopolymerization initiator (manufactured by Ciba Specialty Chemicals, Irgacure 184) were used. Except for the above, a chip holding structure was obtained and evaluated in the same manner as in Example 1. The results are shown in Table 1.

(Example 7)
As a solution of the self-adhesive resin composition, a copolymer (weight average molecular weight 500,000) obtained by reacting 100 parts by weight of an acrylic copolymer comprising 80 parts by weight of BA and 20 parts by weight of HEA and 21.4 parts by weight of methacryloyloxyethyl isocyanate ) To 100 parts by weight, 1 part by weight of a polyvalent isocyanate compound (manufactured by Nippon Polyurethane, Coronate L) and 3 parts by weight of a benzophenone photopolymerization initiator (manufactured by Ciba Specialty Chemicals, Irgacure 184) are mixed with toluene. The concentration was adjusted to 30% by weight to obtain a self-adhesive resin composition solution. The chip is held in the same manner as in Example 1 except that this self-adhesive resin composition was used and a PET film (thickness: 38 μm) with a surface roughness of 0.14 μm was used as the release film. A structure was obtained and evaluated. The results are shown in Table 1.

(Comparative Example 1)
As a solution of the self-adhesive resin composition, obtained by reacting 100 parts by weight of an acrylic copolymer consisting of 40 parts by weight of 2EHA, 40 parts by weight of vinyl acetate (VAc) and 20 parts by weight of HEA, and 21.4 parts by weight of methacryloyloxyethyl isocyanate. 1 part by weight of a polyisocyanate compound (manufactured by Nippon Polyurethane, Coronate L) and a benzophenone photopolymerization initiator (manufactured by Ciba Specialty Chemicals, Irgacure 184) per 100 parts by weight of the copolymer (weight average molecular weight 500,000) ) 3 parts by weight was mixed, and the concentration was adjusted to 30% by weight with toluene to obtain a solution of the self-adhesive resin composition. The above-mentioned self-adhesive resin composition solution is applied on the release-treated surface of a PET film (thickness 38 μm) with a surface roughness of 0.001 μm that has been subjected to silicone release treatment, and dried (100 ° C. for 1 minute in an oven). A self-adhesive resin layer having a thickness of 10 μm was prepared. Next, an ethylene-methacrylic acid copolymer film (thickness: 80 μm) was used as a base film, and the self-adhesive resin layer was transferred to one side to obtain a sheet for die sorting. A chip is temporarily attached on the self-adhesive resin composition layer of the die sort sheet, and the chip is held by irradiating ultraviolet rays from the base film using a UV irradiation device (RAD-2000m / 8, manufactured by Lintec Corporation). A structure was obtained. Evaluation similar to Example 1 was performed. The results are shown in Table 1.

(Comparative Example 2)
The same self-adhesive resin composition solution as in Comparative Example 1 was used, and other than that, a chip holding structure was obtained and evaluated in the same manner as in Example 2. The results are shown in Table 1.

(Comparative Example 3)
A self-adhesive resin composition solution is obtained by copolymerizing 20 parts by weight of 2HEA, 78 parts by weight of vinyl acetate (VAc), 1 part by weight of acrylic acid (AA), and 1 part by weight of 2-hydroxyethyl methacrylate (HEMA). 70 parts by weight of a tri- to tetra-functional urethane acrylate oligomer (weight average molecular weight 3,000), 100 parts by weight of an acrylic copolymer (weight average molecular weight 500,000), polyvalent isocyanate compound (Nihon Polyurethane Co., Ltd., Coronate L) 3 A chip holding structure was obtained and evaluated in the same manner as in Comparative Example 1 except that 3 parts by weight and 3 parts by weight of a benzophenone photopolymerization initiator (manufactured by Ciba Specialty Chemicals, Irgacure 184) were used. The results are shown in Table 1.

(Comparative Example 4)
As a solution of the self-adhesive resin composition, 100 parts by weight of a copolymer (weight average molecular weight 500,000) obtained by copolymerizing 85 parts by weight of 2EHA, 5 parts by weight of MMA, and 10 parts by weight of HEA, a polyvalent isocyanate compound ( A chip holding structure was obtained and evaluated in the same manner as in Example 2 except that 4 parts by weight of Coronate L) manufactured by Nippon Polyurethane Co., Ltd. was used. The results are shown in Table 1.

(Comparative Example 5)
A chip holding structure was obtained and evaluated in the same manner as in Example 3, except that a PET film (thickness: 38 μm) having a surface roughness of 1.20 μm was used as the release film. The results are shown in Table 1.

(Comparative Example 6)
A chip holding structure was obtained and evaluated in the same manner as in Comparative Example 4 except that a PET film (thickness: 38 μm) having a surface roughness of 1.20 μm was used as the release film. The results are shown in Table 1.

It is a figure for demonstrating the chip | tip holding structure of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Base film 20 ... Self-adhesive resin layer 30 ... Chip 40 ... Ring frame

Claims (5)

In the chip holding structure in which the chip is held on a sheet for die sorting consisting of a base film and a self-adhesive resin layer formed thereon,
The die sort sheet is then temporarily attached to diced chips, a sheet for holding,
The storage elastic modulus (G ′) at 23 ° C. of the self-adhesive resin layer is 0.5 to 200 MPa,
A chip holding structure in which the self-adhesive resin layer has a surface roughness (Ra) of 1 μm or less.   The chip holding structure according to claim 1, wherein the self-adhesive resin layer has a loop tack value of 50 to 2000 mN / 25 mm. A die sorting sheet for temporarily attaching and holding a diced chip,
It consists of a base film and a self-adhesive resin layer formed on it,
The sheet | seat for die sorts whose storage elastic modulus (G ') in 23 degreeC of the said self-adhesive resin layer is 0.5-200 Mpa, and the surface roughness (Ra) is 1 micrometer or less. The die-sorting sheet according to claim 3, wherein the self-adhesive resin layer is made of a cured product of an energy ray curable resin.
The sheet | seat for die sorts whose storage elastic modulus (G ') in 23 degreeC after the energy ray irradiation of the said self-adhesive resin layer is 0.5-200 Mpa, and whose surface roughness (Ra) is 1 micrometer or less. A step of temporarily attaching a chip to the self-adhesive resin layer of the die sort sheet according to claim 3 or 4,
A method for manufacturing a semiconductor device, comprising: a step of transporting or storing the chip; and a step of picking up the chip from the die sort sheet.

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