KR20220156757A - Dicing die bonding film and method for producing semiconductor device - Google Patents

Abstract

Provided is a dicing die bonding film including: a dicing tape having a base material layer and an adhesive layer superimposed on the base material layer; and a die bonding sheet overlapped on the dicing tape. The adhesive layer contains an acrylic copolymer having, as monomer units in the molecule, at least an alkyl (meth) acrylate unit and a (meth) acrylate unit containing a cross-linkable group. In the acrylic copolymer, the cross-linkable group containing (meth)acrylate unit partially has a radically polymerizable carbon-carbon double bond. The acrylic copolymer includes 30 or more to 60 or less parts by mole of the cross-linkable group containing (meth)acrylate unit based on 100 parts by mole of the alkyl (meth)acrylate unit, and 50 or more to 95 or less mole% of the cross-linkable group containing (meth)acrylate unit includes the radially polymerizable carbon-carbon double bond. The dicing die bonding film has good pick-up performance.

Description

Manufacturing method of dicing die bond film and semiconductor device {DICING DIE BONDING FILM AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE}

The present invention relates to, for example, a dicing die-bonding film used when manufacturing a semiconductor device, and a semiconductor device manufacturing method for manufacturing a semiconductor device while using the dicing die-bonding film.

Conventionally, dicing die-bonding films used in the manufacture of semiconductor devices are known. This type of dicing die-bonding film includes, for example, a dicing tape and a die-bonding sheet laminated on the dicing tape and adhered to a wafer. The dicing tape has a substrate layer and an adhesive layer in contact with the die bonding sheet. This type of dicing die bond film is used in the manufacture of semiconductor devices, for example, as follows.

A method of manufacturing a semiconductor device generally includes a pre-process of forming a circuit surface on one side of a wafer with highly integrated electronic circuits, and a post-process of cutting out chips from the wafer on which the circuit surface is formed and assembling them.

The post-process includes, for example, a dicing step of forming a weak portion on the wafer for cutting the wafer into small chips (dies), and attaching the surface of the wafer on the opposite side to the circuit surface to a die bond sheet and using a dicing tape A mount process for fixing the wafer to the wafer, an expand process for splitting the wafer with a weak portion together with the die bond sheet to widen the gap between the chips, and a state in which the die bond sheet and the pressure-sensitive adhesive layer are separated and the die bond sheet is attached A pick-up step of taking out a chip (die) from the chip (die), a die-bonding step of bonding the chip (die) with a die-bonding sheet attached to an adherend via the die-bonding sheet, and a die-bonding sheet adhered to the adherend. It has a curing process for hardening treatment. A semiconductor device is manufactured through these processes, for example.

In the semiconductor device manufacturing method as described above, for example, in the above pick-up step, in order to improve the peelability when peeling the die-bonding sheet together with the chip, the gel fraction of the pressure-sensitive adhesive layer before heating; A dicing die-bonding film in which the gel fraction after heating is specified, respectively, is known (for example, Patent Document 1).

In detail, in the dicing die-bonding film described in Patent Literature 1, the pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive composition containing a base polymer and a thermal crosslinking agent, and the gel fraction before heating is 90% by weight. It is an adhesive layer in which the gel fraction after heating changes to 90% by weight or more while being less than 90% by weight.

According to the dicing die-bonding film described in Patent Literature 1, the die-bonding sheet can be easily peeled off from the cured pressure-sensitive adhesive layer, and chips can be picked up together with the die-bonding sheet.

Japanese Unexamined Patent Publication No. 2009-135377

However, it cannot be said that a dicing die-bonding film having good pick-up properties has been sufficiently studied.

Then, this invention makes it a subject to provide the dicing die-bonding film which has favorable pick-up property. Moreover, this invention makes it a subject to provide the manufacturing method of the semiconductor device which can exhibit favorable pick-up property.

In order to solve the above problems, the dicing die-bonding film according to the present invention includes a dicing tape having a base material layer and an adhesive layer overlapping the base material layer, and a die-bonding sheet superimposed on the dicing tape,

The pressure-sensitive adhesive layer contains at least an acrylic copolymer having an alkyl (meth)acrylate unit and a crosslinkable group-containing (meth)acrylate unit as monomer units in a molecule,

In the acrylic copolymer, some of the crosslinkable group-containing (meth)acrylate units have radically polymerizable carbon-carbon double bonds;

The acrylic copolymer contains 30 parts by mole or more and 60 parts by mole or less of the crosslinkable group-containing (meth)acrylate unit with respect to 100 parts by mole of the alkyl (meth)acrylate unit, and among the crosslinkable group-containing (meth)acrylate units 50 mol% or more and 95 mol% or less contain the radically polymerizable carbon-carbon double bond.

Further, a method of manufacturing a semiconductor device according to the present invention includes a cutting step of cutting a wafer having a circuit surface into chips;

A pick-up step of peeling the die-bonding sheet attached to the pressure-sensitive adhesive layer of the dicing die-bonding film from the pressure-sensitive adhesive layer together with the chip is provided.

1 is a cross-sectional view of a dicing die-bonding film of the present embodiment cut in a thickness direction.
Fig. 2A is a cross-sectional view schematically showing an aspect of a stealth dicing step in a method for manufacturing a semiconductor device.
Fig. 2B is a cross-sectional view schematically showing an aspect of a stealth dicing step in a semiconductor device manufacturing method.
Fig. 2C is a cross-sectional view schematically showing an aspect of a stealth dicing step in a method for manufacturing a semiconductor device.
Fig. 2D is a cross-sectional view schematically showing an aspect of a back-grind step in a method for manufacturing a semiconductor device.
Fig. 3A is a cross-sectional view schematically showing an aspect of a mount step in a method of manufacturing a semiconductor device.
Fig. 3B is a cross-sectional view schematically showing an aspect of a mount step in a method of manufacturing a semiconductor device.
Fig. 4A is a cross-sectional view schematically showing an aspect of an expand step at a low temperature in a method of manufacturing a semiconductor device.
Fig. 4B is a cross-sectional view schematically showing an aspect of an expand step at a low temperature in a method of manufacturing a semiconductor device.
Fig. 4C is a cross-sectional view schematically showing an aspect of an expand step at a low temperature in a method of manufacturing a semiconductor device.
Fig. 5A is a cross-sectional view schematically showing an aspect of an expand step at room temperature in a method for manufacturing a semiconductor device.
Fig. 5B is a cross-sectional view schematically showing an aspect of an expand step at room temperature in a method for manufacturing a semiconductor device.
Fig. 6 is a cross-sectional view schematically showing an aspect of a pick-up step in a semiconductor device manufacturing method.
Fig. 7 is a cross-sectional view schematically showing an aspect of a die bonding process in a method of manufacturing a semiconductor device.
Fig. 8 is a cross-sectional view schematically showing an aspect of a wire bonding step in a method of manufacturing a semiconductor device.
Fig. 9 is a cross-sectional view schematically showing an aspect of a sealing step in a semiconductor device manufacturing method.
Fig. 10 is a schematic cross-sectional view showing an example of a bent state of a semiconductor chip and a die bond sheet.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment of the dicing die-bonding film which concerns on this invention is described, referring drawings. In addition, the drawing in drawing is a schematic diagram, and is not necessarily the same as the length ratio of length and width in the real thing.

As shown in FIG. 1 , the dicing die-bonding film 1 of the present embodiment is laminated on a dicing tape 20 and an adhesive layer 22 (described later) of the dicing tape 20, and A die bond sheet 10 adhered to a semiconductor wafer is provided.

According to the dicing die-bonding film of the present embodiment and the manufacturing method of a semiconductor device described later, good pick-up properties can be exhibited.

In the dicing die-bonding film 1 of the present embodiment, when used, the pressure-sensitive adhesive layer 22 is cured by being irradiated with active energy rays (eg, ultraviolet rays). Specifically, in a state where the die bond sheet 10 having a semiconductor wafer bonded to one side and the pressure sensitive adhesive layer 22 bonded to the other side of the die bond sheet 10 are stacked, at least ultraviolet rays or the like are applied to the adhesive. Layer 22 is irradiated. For example, ultraviolet rays or the like are irradiated from the side where the substrate layer 21 is disposed, and the ultraviolet rays or the like pass through the substrate layer 21 and reach the pressure-sensitive adhesive layer 22 . The pressure-sensitive adhesive layer 22 is cured by irradiation with ultraviolet rays or the like.

Since the adhesive force of the pressure-sensitive adhesive layer 22 can be lowered by curing the pressure-sensitive adhesive layer 22 after irradiation, the die-bonding sheet 10 (state in which the semiconductor wafer is bonded) is relatively easily peeled off from the pressure-sensitive adhesive layer 22 after irradiation. can make it The die bond sheet 10 is bonded to an adherend such as a circuit board or a semiconductor chip in the manufacture of a semiconductor device.

<Dicing tape of dicing die bond film>

The above dicing tape 20 is usually a long sheet, and is stored in a rolled state until used. The dicing die-bonding film 1 of the present embodiment is applied to an annular frame having an inner diameter much larger than that of the silicon wafer to be cut, and then cut and used.

The dicing tape 20 described above includes a substrate layer 21 and an adhesive layer 22 overlapping the substrate layer 21 .

In this embodiment, the adhesive layer 22 contains an acrylic copolymer, an isocyanate compound, and a polymerization initiator, for example.

The pressure-sensitive adhesive layer 22 may have a thickness of 5 μm or more and 40 μm or less. The shape and size of the pressure-sensitive adhesive layer 22 are usually the same as those of the base layer 21 .

The pressure-sensitive adhesive layer 22 contains at least an acrylic copolymer having an alkyl (meth)acrylate unit and a crosslinkable group-containing (meth)acrylate unit as monomer units in a molecule.

In the acrylic copolymer, some of the crosslinkable group-containing (meth)acrylate units have radically polymerizable carbon-carbon double bonds. The acrylic copolymer contains 30 parts by mole or more and 60 parts by mole or less of the crosslinkable group-containing (meth)acrylate unit with respect to 100 parts by mole of the alkyl (meth)acrylate unit, and 50% by mole or more of the crosslinkable group-containing (meth)acrylate unit. 95% by mole or less contains radically polymerizable carbon-carbon double bonds.

In addition, in this specification, the notation "(meth)acrylate" shows at least one of methacrylate (methacrylic acid ester) and acrylate (acrylic acid ester). The term "(meth)acryl" is also the same.

The above-described acrylic copolymer has, in its molecule, an alkyl (meth)acrylate unit and a crosslinkable group-containing (meth)acrylate unit as at least monomer units. The monomer unit is a unit constituting the main chain of the acrylic copolymer. In other words, the monomer unit is derived from the monomer used to polymerize the acrylic copolymer. Each side chain in the above acrylic copolymer is included in each monomer unit constituting the main chain.

The alkyl (meth)acrylate unit is derived from an alkyl (meth)acrylate monomer. In other words, the molecular structure after polymerization of an alkyl (meth)acrylate monomer is an alkyl (meth)acrylate unit. The notation "alkyl" represents a hydrocarbon moiety ester-bonded to (meth)acrylic acid.

The alkyl moiety (hydrocarbon) in the alkyl (meth)acrylate unit may be a saturated hydrocarbon or an unsaturated hydrocarbon.

The alkyl moiety (hydrocarbon) in the alkyl (meth)acrylate unit may be a straight-chain hydrocarbon or a branched-chain hydrocarbon, and may contain a cyclic structure.

The number of carbon atoms of the alkyl moiety (hydrocarbon) in the alkyl (meth)acrylate unit may be 8 or more and 22 or less, or 9 or more and 22 or less.

The above acrylic copolymer preferably contains a long-chain alkyl (meth)acrylate unit having 8 or more carbon atoms in the alkyl portion as the alkyl (meth) acrylate unit, and the alkyl portion is a saturated hydrocarbon and has 8 to 22 carbon atoms. It is more preferable to include a phosphorus long-chain saturated alkyl (meth)acrylate unit.

The acrylic copolymer preferably has the highest ratio (in terms of moles) of long-chain alkyl (meth)acrylate units having 8 or more carbon atoms among all monomer units in the molecule, and the long-chain alkyl (meth)acrylate units having 9 or more carbon atoms are the highest. The one with the highest occupied ratio (molar conversion) is more preferable. For example, the long-chain alkyl (meth)acrylate unit may occupy 50% or more and 80% or less in terms of mole among all the monomer units.

In the long-chain saturated alkyl (meth)acrylate unit, it is preferable that neither a benzene ring nor a polar group such as an ether bond (-CH ₂ -O-CH ₂ -), an -OH group, or a -COOH group is included in the molecule. . In the long-chain saturated alkyl (meth)acrylate unit, the alkyl moiety does not contain atoms other than C and H and may be a saturated straight-chain hydrocarbon or a saturated branched-chain hydrocarbon composed of 8 or more and 12 or less carbon atoms.

When the above acrylic copolymer contains a long-chain saturated alkyl (meth)acrylate unit, better pick-up properties can be exhibited.

The above acrylic copolymer comprises a saturated branched-chain alkyl (meth)acrylate unit having 8 or more and 10 or less carbon atoms in the alkyl portion and a saturated linear alkyl (meth)acrylate unit having 12 or more and 14 or less carbon atoms in the alkyl portion. It is preferable to include as a (meth)acrylate unit. Thereby, more favorable pick-up property can be exhibited.

The structure of the alkyl moiety (hydrocarbon moiety) of the saturated branched alkyl (meth)acrylate unit may be a saturated branched alkyl structure, and may be an iso structure, a sec structure, a neo structure, or a tert structure.

Specifically, as the saturated branched-chain alkyl (meth)acrylate unit, isoheptyl (meth)acrylate, isooctyl (meth)acrylate, isononyl (meth)acrylate, isodecyl (meth)acrylate, 2- Each unit of ethylhexyl (meth)acrylate and isostearyl (meth)acrylate, etc. are mentioned. Among these, at least one of an isononyl (meth)acrylate unit and a 2-ethylhexyl (meth)acrylate unit is preferable from the viewpoint of being able to exhibit better pickup properties.

The structure of the alkyl moiety (hydrocarbon moiety) of the saturated linear alkyl (meth)acrylate unit may be a saturated linear alkyl structure.

Specifically, as the saturated linear alkyl (meth)acrylate unit, n-octyl (meth)acrylate, n-nonyl (meth)acrylate, n-decyl (meth)acrylate, tridecyl (meth)acrylate , Each unit, such as lauryl (meth)acrylate, myristyl (meth)acrylate, palmityl (meth)acrylate, stearyl (meth)acrylate, and behenyl (meth)acrylate, is mentioned.

Said acrylic copolymer may contain 1 type independently, or may contain 2 or more types as the above-mentioned alkyl (meth)acrylate unit.

The above acrylic copolymer is an alkyl (meth) acrylate of at least one selected from the group consisting of a 2-ethylhexyl (meth) acrylate unit, an isononyl (meth) acrylate unit, and a lauryl (meth) acrylate unit. It is preferable to include as a unit. In particular, it is preferable to combine at least one of a 2-ethylhexyl (meth)acrylate unit and an isononyl (meth)acrylate unit with a lauryl (meth)acrylate unit. Thereby, more favorable pick-up property can be exhibited.

The crosslinkable group-containing (meth)acrylate unit has a hydroxy group capable of forming a urethane bond by a urethanization reaction or a polymerizable group capable of polymerizing by a radical reaction. More specifically, the crosslinkable group-containing (meth)acrylate unit has either an unreacted hydroxyl group or a radically polymerizable carbon-carbon double bond as a polymerizable group. In other words, a part of the crosslinkable group-containing (meth)acrylate unit has an unreacted hydroxyl group, and the other part (all others) has no hydroxyl group and has a radically polymerizable carbon-carbon double bond.

The above acrylic copolymer has, as a crosslinkable group-containing (meth)acrylate unit, a hydroxyl group-containing (meth)acrylate unit in which a hydroxyl group is bonded to an alkyl moiety having 4 or less carbon atoms. When the pressure-sensitive adhesive layer 22 contains an isocyanate compound, the isocyanate group of the isocyanate compound and the hydroxyl group of the hydroxyl group-containing (meth)acrylate unit can easily react.

By allowing the acrylic copolymer having a hydroxyl group-containing (meth)acrylate unit and an isocyanate compound to coexist in the pressure-sensitive adhesive layer 22, the pressure-sensitive adhesive layer 22 can be appropriately cured. Therefore, the acrylic copolymer can be sufficiently gelled. Therefore, the adhesive layer 22 can exhibit adhesive performance while maintaining its shape.

The hydroxyl group-containing (meth)acrylate unit is preferably a hydroxyl group-containing C2 to C4 alkyl (meth)acrylate unit in which an OH group is bonded to an alkyl moiety having 2 or more and 4 or less carbon atoms. The notation "C2 to C4 alkyl" shows the hydrocarbon moiety ester-bonded to (meth)acrylic acid and its carbon number. In other words, the hydroxy group-containing C2 to C4 alkyl (meth)acrylic monomer represents a monomer in which (meth)acrylic acid and an alcohol having 2 or more and 4 or less carbon atoms (usually a dihydric alcohol) are ester-bonded.

The hydrocarbon portion of the C2 to C4 alkyl is usually a saturated hydrocarbon. For example, the hydrocarbon moiety of C2 to C4 alkyl is a straight-chain saturated hydrocarbon or a branched-chain saturated hydrocarbon. It is preferable that the hydrocarbon moiety of C2 to C4 alkyl does not contain a polar group containing oxygen (O) or nitrogen (N).

Examples of the hydroxy group-containing C2 to C4 alkyl (meth)acrylate unit include hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxy n-butyl (meth)acrylate, or hydroxyethyl (meth)acrylate. and each unit of hydroxybutyl (meth)acrylate such as oxyiso-butyl (meth)acrylate. In addition, the hydroxyl group (-OH group) may be bonded to the terminal carbon (C) of the hydrocarbon moiety, or may be bonded to carbon (C) other than the terminal of the hydrocarbon moiety.

The above acrylic copolymer includes, as a crosslinkable group-containing (meth)acrylate unit, a polymerizable (meth)acrylate unit having a radically polymerizable carbon-carbon double bond (polymerizable unsaturated double bond) in the side chain.

Specifically, the polymerizable (meth)acrylate unit has a molecular structure in which an isocyanate group of an isocyanate group-containing (meth)acrylic monomer is bonded to a hydroxyl group in the above-described hydroxyl group-containing (meth)acrylate unit through a urethane bond.

Since the acrylic copolymer contains a radically polymerizable carbon-carbon double bond of a crosslinkable group-containing (meth)acrylate unit, the pressure-sensitive adhesive layer 22 is exposed to active energy rays (ultraviolet rays) before the pick-up process (described in detail later). etc.) can be cured by irradiation. For example, radicals are generated from the photopolymerization initiator by irradiation with active energy rays such as ultraviolet rays, and acrylic copolymers can be crosslinked by the action of the radicals. Thereby, the adhesive force of the adhesive layer 22 before irradiation can be reduced after irradiation. And the die-bonding sheet 10 can be peeled favorably from the adhesive layer 22.

In addition, as an active energy ray, an ultraviolet ray, radiation, and an electron beam are employ|adopted.

The polymerizable (meth)acrylate unit can be prepared by a urethanization reaction after the polymerization reaction of the acrylic copolymer. For example, after copolymerization of an alkyl (meth)acrylate monomer and a hydroxyl group-containing (meth)acrylic monomer, the hydroxyl group in a part of the hydroxyl group-containing (meth)acrylate unit and the isocyanate group of the isocyanate group-containing polymerizable monomer, By carrying out a urethanization reaction, a polymerizable (meth)acrylate unit can be obtained.

It is preferable that the said isocyanate group-containing (meth)acrylic monomer has one isocyanate group in a molecule|numerator and also has one (meth)acryloyl group. As such a monomer, 2-methacryloyloxyethyl isocyanate is mentioned, for example.

In this embodiment, said acrylic copolymer may also contain monomer units other than the above-mentioned monomer unit. For example, you may include each unit, such as (meth)acryloylmorpholine, n-vinyl- 2-pyrrolidone, or acrylonitrile.

In the acrylic copolymer included in the pressure-sensitive adhesive layer 22, each of the above units (each constituent unit) is determined by NMR analysis such as ¹ H-NMR and ¹³ C-NMR, pyrolysis GC/MS analysis, and infrared spectroscopy. You can check. In addition, the molar ratio of the said unit in an acrylic copolymer is normally computed from the compounding quantity (charged amount) at the time of superposing|polymerizing an acrylic copolymer.

The above acrylic copolymer contains 30 parts by mole or more and 60 parts by mole or less of the crosslinkable group-containing (meth)acrylate unit with respect to 100 parts by mole of the alkyl (meth)acrylate unit, and 50 moles of the crosslinkable group-containing (meth)acrylate unit It is preferable that % or more and 95 mol% or less form the urethane bond as mentioned above. In other words, the above acrylic copolymer contains 30 parts by mole or more and 60 parts by mole or less of the crosslinkable group-containing (meth)acrylate unit with respect to 100 parts by mole of the alkyl (meth)acrylate unit, and the crosslinkable group-containing (meth)acrylate unit It is preferable that 50 mol% or more and 95 mol% or less of it are polymerizable (meth)acrylate units which have a radically polymerizable carbon-carbon double bond. As a result, the adhesive strength between the die-bonding sheet 10 and the pressure-sensitive adhesive layer 22 before curing can be maintained, while the release properties between the die-bonding sheet 10 and the pressure-sensitive adhesive layer 22 after curing are more improved. can do. Therefore, better pick-up properties can be exhibited.

The above acrylic copolymer preferably contains 25 parts by mole or more and 55 parts by mole or less, and more preferably contains 28 parts by mole or more of the polymerizable (meth)acrylate unit with respect to 100 parts by mole of the alkyl (meth)acrylate unit. As a result, the adhesive strength between the die-bonding sheet 10 and the pressure-sensitive adhesive layer 22 before curing can be maintained, while the release properties between the die-bonding sheet 10 and the pressure-sensitive adhesive layer 22 after curing are more improved. can do. Therefore, better pick-up properties can be exhibited.

In this embodiment, the isocyanate compound that the pressure-sensitive adhesive layer 22 of the dicing tape 20 may further contain has a plurality of isocyanate groups in its molecule. When the isocyanate compound has a plurality of isocyanate groups in the molecule, the crosslinking reaction between the acrylic copolymers in the pressure-sensitive adhesive layer 22 can be promoted. Specifically, a crosslinking reaction via an isocyanate compound can be promoted by reacting one isocyanate group of an isocyanate compound with a hydroxyl group of an acrylic copolymer and reacting the other isocyanate group with a hydroxyl group of another acrylic copolymer.

In addition, the isocyanate compound may be a compound synthesized through a urethanization reaction or the like.

As an isocyanate compound, diisocyanate, such as aliphatic diisocyanate, alicyclic diisocyanate, or aromatic aliphatic diisocyanate, is mentioned, for example.

Moreover, as an isocyanate compound, polymeric polyisocyanate, such as a dimer and trimer of diisocyanate, and polymethylene polyphenylene polyisocyanate are mentioned, for example.

Moreover, as an isocyanate compound, the polyisocyanate which made the excessive amount of the above-mentioned isocyanate compound and the active hydrogen containing compound reacted is mentioned, for example. Examples of active hydrogen-containing compounds include active hydrogen-containing low-molecular-weight compounds and active hydrogen-containing high-molecular-weight compounds.

Moreover, as an isocyanate compound, allophanate-ized polyisocyanate, buret-ized polyisocyanate, etc. can be used.

Said isocyanate compound can be used individually by 1 type or in combination of 2 or more types.

As said isocyanate compound, the reaction product of aromatic diisocyanate and a low molecular-weight compound containing an active hydrogen is preferable. Since the reaction rate of an isocyanate group is relatively slow in the reaction product of aromatic diisocyanate, excessive hardening of the adhesive layer 22 containing such a reaction product is suppressed. As said isocyanate compound, what has 3 or more isocyanate groups in a molecule|numerator is preferable.

The polymerization initiator contained in the pressure-sensitive adhesive layer 22 is a compound capable of initiating a polymerization reaction by applied heat or light energy. When heat energy or light energy is applied to the pressure-sensitive adhesive layer 22 because the pressure-sensitive adhesive layer 22 contains a polymerization initiator, a crosslinking reaction between acrylic copolymers can be promoted. Specifically, between an acrylic copolymer having a polymerizable (meth)acrylate unit containing a radically polymerizable carbon-carbon double bond, a polymerization reaction between polymerizable groups is initiated to cure the pressure-sensitive adhesive layer 22. can In this way, the adhesive strength of the pressure-sensitive adhesive layer 22 is reduced, and the die-bonding sheet 10 can be easily peeled off from the cured pressure-sensitive adhesive layer 22 in the pick-up process (described in detail later).

As a polymerization initiator, a photoinitiator or a thermal polymerization initiator etc. are employ|adopted, for example. As a polymerization initiator, a general commercial product can be used.

The pressure-sensitive adhesive layer 22 may further contain other components other than the components described above. Examples of other components include tackifiers, plasticizers, fillers, anti-aging agents, antioxidants, ultraviolet absorbers, light stabilizers, heat-resistant stabilizers, antistatic agents, surfactants, light release agents and the like. The type and usage amount of other components may be appropriately selected depending on the purpose.

The surface elastic modulus after the pressure-sensitive adhesive layer 22 is cured by active energy rays is preferably 50 MPa or more and less than 431 MPa, more preferably greater than 50 MPa, still more preferably greater than 65 MPa, and particularly greater than 100 MPa. desirable. Thereby, more favorable pick-up property can be exhibited. In addition, the curing treatment conditions of the pressure-sensitive adhesive layer 22 performed for measuring the surface elastic modulus will be described later.

The surface elastic modulus can be increased, for example, by increasing the proportion of polymerizable (meth)acrylate units constituting the acrylic copolymer. On the other hand, the elastic modulus can be lowered by lowering the ratio of polymerizable (meth)acrylate units constituting the acrylic copolymer.

The above surface modulus (tensile modulus) is measured under the following measurement conditions.

Curing treatment conditions: high-pressure mercury lamp 60mW/cm2, irradiation with ultraviolet rays with an intensity of 300mJ/cm2

Measuring device: Nanoindenter ("Triboindenter" manufactured by Hysitron Inc.)

Indenter used: Berkovich (tripod)

Measurement method: single indentation measurement

Measurement temperature: room temperature

Indentation depth: 1 μm

Number of measurements: 10 times (average value calculated)

In detail, in the dicing die-bonding film, a sample for measurement is taken at an exposed portion of the pressure-sensitive adhesive layer 22 where the die-bonding sheet 10 and the pressure-sensitive adhesive layer 22 do not overlap (for example, see FIG. 1). take out Usually, the surface of such an exposed part is covered with a peelable sheet (described in detail later). In the state where the peeling sheet is attached, a piece cut in the thickness direction is cut out in the exposed portion. Specifically, the pressure-sensitive adhesive layer and base material layer having a square shape of about 1 cm per side are cut out in the thickness direction. It is confirmed that the pressure-sensitive adhesive layer and the release sheet are in close contact with each other sufficiently. Using Nitto Seiki's trade name "UM-810" (high pressure mercury lamp, 60 mW/cm 2 ), an ultraviolet ray having an intensity of 300 mJ/cm 2 was irradiated from the substrate layer side to cure the pressure-sensitive adhesive layer. The cured pressure-sensitive adhesive layer is fixed to a support, and the release sheet adhering to the pressure-sensitive adhesive layer is peeled off. And nanoindentation measurement is performed on the surface of the adhesive layer to which the peeling sheet was stuck.

In this embodiment, the substrate layer 21 overlaid on the pressure-sensitive adhesive layer 22 may have a single-layer structure or may have a laminated structure.

Each layer of the substrate layer 21 is, for example, a metal foil, a fiber sheet such as paper or cloth, a rubber sheet, a resin film, or the like.

As the fibrous sheet constituting the substrate layer 21, paper, woven fabric, non-woven fabric, and the like are exemplified.

Examples of the material of the resin film include polyolefins such as polyethylene (PE), polypropylene (PP), and ethylene-propylene copolymers; Ethylene copolymers, such as an ethylene-vinyl acetate copolymer (EVA), an ionomer resin, an ethylene-(meth)acrylic acid copolymer, and an ethylene-(meth)acrylic acid ester (random, alternating) copolymer; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); polyacrylate; polyvinyl chloride (PVC); Polyurethane; polycarbonate; polyphenylene sulfide (PPS); polyamides such as aliphatic polyamides and wholly aromatic polyamides (aramids); polyetheretherketone (PEEK); polyimide; polyetherimide; polyvinylidene chloride; ABS (acrylonitrile-butadiene-styrene copolymer); cellulose or cellulose derivatives; silicone-containing polymers; A fluorine-containing polymer etc. are mentioned. These may be used individually by 1 type or in combination of 2 or more types.

The substrate layer 21 is preferably made of a polymer material such as a resin film.

When the base material layer 21 has a resin film, the resin film may be stretched or the like, and deformability such as elongation may be controlled.

Surface treatment may be given to the surface of the base material layer 21 in order to improve adhesiveness with the adhesive layer 22. As the surface treatment, for example, chemical methods such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, or oxidation treatment by physical methods or the like can be employed. In addition, coating treatment with a coating agent such as an anchor coating agent, a primer, or an adhesive may be performed.

The substrate layer 21 may be a single layer or may be composed of a plurality of layers (for example, three layers). The thickness (total thickness) of the substrate layer 21 may be 80 μm or more and 150 μm or less.

To impart peelability to the back side of the substrate layer 21 (the side on which the pressure-sensitive adhesive layer 22 does not overlap), for example, release treatment is performed with a release agent (release agent) such as a silicone-based resin or a fluorine-based resin. it may be

The base material layer 21 is preferably a light-transmitting (ultraviolet-ray-transmitting) resin film or the like in view of enabling application of active energy rays such as ultraviolet rays to the pressure-sensitive adhesive layer 22 from the back side.

The dicing tape 20 described above may be provided with a release sheet covering one surface of the pressure-sensitive adhesive layer 22 (the surface on which the pressure-sensitive adhesive layer 22 does not overlap with the substrate layer 21) in a state before use. . The release sheet is used to protect the pressure-sensitive adhesive layer 22 and is peeled off before attaching the die-bonding sheet 10 to the pressure-sensitive adhesive layer 22 .

As the release sheet, for example, a plastic film or paper that has been surface-treated with a release agent such as a silicone-based release agent, a long-chain alkyl-based release agent, a fluorine-based release agent, or a release agent such as molybdenum sulfide can be used.

In addition, the peeling sheet can be used as a support material for supporting the pressure-sensitive adhesive layer 22 . In particular, the release sheet is preferably used when overlapping the pressure-sensitive adhesive layer 22 on the substrate layer 21 . In detail, in the state where the release sheet and the pressure-sensitive adhesive layer 22 are laminated, the pressure-sensitive adhesive layer 22 is superimposed on the substrate layer 21, and after the overlapping, the release sheet is peeled (transferred) on the substrate layer 21. The pressure-sensitive adhesive layer 22 may be overlapped.

The dicing die-bonding film 1 of the present embodiment covers one side of the die-bonding sheet 10 (the side where the die-bonding sheet 10 does not overlap with the pressure-sensitive adhesive layer 22) in a state before use. You may provide a peeling sheet. The release sheet is used to protect the die-bonding sheet 10, and is peeled immediately before attaching an adherend (for example, a semiconductor wafer) to the die-bonding sheet 10.

This release sheet can be used as a support material for supporting the die-bonding sheet 10 . The release sheet is suitably used when the die-bonding sheet 10 is stacked on the pressure-sensitive adhesive layer 22 . Specifically, the die-bonding sheet 10 is overlaid on the pressure-sensitive adhesive layer 22 in a state where the release sheet and the die-bonding sheet 10 are laminated, and after the overlapping, the release sheet is peeled off (transferred) to form the pressure-sensitive adhesive layer 22 ), the die bond sheet 10 may be overlapped.

<Die bond sheet of dicing die bond film>

As shown in FIG. 1 , the die bond sheet 10 overlaps the pressure-sensitive adhesive layer 22 of the dicing tape 20 described above. The die bond sheet 10 includes an acrylic polymer containing a crosslinkable group having a crosslinkable group in its molecule that causes a crosslinking reaction by heat curing.

The above crosslinkable group-containing acrylic polymer is a high molecular compound in which at least a (meth)acrylic acid ester monomer is polymerized.

The above crosslinkable group-containing acrylic polymer usually has the above crosslinkable group in its side chain. The above crosslinkable group-containing acrylic polymer may have the above crosslinkable group at the terminal of the side chain. In addition, the above crosslinkable group-containing acrylic polymer may have the above crosslinkable group on at least one of both ends of the main chain.

The crosslinkable group in the molecule of the above crosslinkable group-containing acrylic polymer is not particularly limited as long as it is a functional group that causes a crosslinking reaction by thermal curing.

As a crosslinkable group, a hydroxyl group or a carboxy group etc. are mentioned, for example. These crosslinkable groups can cause a crosslinking reaction with an epoxy group or an isocyanate group. For example, the crosslinkable group-containing acrylic polymer having at least one of a hydroxyl group or a carboxy group in its molecule can cause a crosslinking reaction between compounds having an epoxy group or an isocyanate group in its molecule (e.g., an epoxy resin described later). .

Moreover, as a crosslinkable group, an epoxy group or an isocyanate group etc. are mentioned, for example. These crosslinkable groups can cause a crosslinking reaction with a hydroxy group or a carboxy group. For example, the above crosslinkable group-containing acrylic polymer having at least one of an epoxy group and an isocyanate group in a molecule undergoes a crosslinking reaction between a compound having at least one of a hydroxyl group or a carboxy group in a molecule (for example, a phenol resin described later) can cause

In this embodiment, it is preferable that the crosslinkable group-containing acrylic polymer contained in the die-bonding sheet 10 contains at least one of a carboxy group or an epoxy group as a crosslinkable group. Thereby, the die-bonding sheet 10 can be more favorably adhered to the adherend.

In addition, the die-bonding sheet 10 is required to have a relatively high cohesive force after curing in order to more fully exhibit adhesiveness to an adherend after curing (described in detail later). In order to increase the cohesive force after curing, it is necessary that the organic components included in the die-bonding sheet 10 sufficiently cross-link with each other so that the die-bonding sheet 10 is sufficiently cured. In order to sufficiently advance curing, the crosslinkable group-containing acrylic polymer preferably has a relatively highly reactive functional group such as an epoxy group (glycidyl group) or a carboxy group.

In the above crosslinkable group-containing acrylic polymer, the ratio occupied by the structural unit of the crosslinkable group-containing monomer may be 0.1% by mass or more and 60.0% by mass or less, may be 0.5% by mass or more and 40.0% by mass or less, more preferably 1.0% by mass. % or more and 30.0 mass % or less may be sufficient, More preferably, it may be 3.0 mass % or more and 20.0 mass % or less.

When the above ratio is 0.1% by mass or more, curing when the die-bonding sheet 10 is thermally cured can be more sufficiently advanced. On the other hand, when the above ratio is 60.0% by mass or less, the crosslinking reactivity of the crosslinkable group-containing acrylic polymer can be appropriately suppressed and the stability over time can be improved.

When the crosslinkable group-containing acrylic polymer has a hydroxyl group or a carboxy group as a crosslinkable group in the molecule, the crosslinkable group-containing acrylic polymer may have a proportion of structural units of the crosslinkable group-containing monomer that is 0.1% by mass or more and 20.0% by mass or less. , 0.5 mass % or more and 10.0 mass % or less may be sufficient, More preferably, 0.8 mass % or more and 15.0 mass % or less may be sufficient, Even more preferably, 1.0 mass % or more and 10.0 mass % or less may be sufficient.

When the above crosslinkable group-containing acrylic polymer has an epoxy group as a crosslinkable group in the molecule, the proportion of structural units containing an epoxy group in the crosslinkable group-containing acrylic polymer may be 5% by mass or more and 60% by mass or less, or 6% by mass. It may be more than 40 mass % or less, More preferably, it may be 7 mass % or more and 20 mass % or less.

In addition, a structural unit is a structure derived from each monomer after polymerization of monomers (for example, 2-ethylhexyl acrylate, hydroxyethyl acrylate, etc.) at the time of obtaining (polymerizing) the crosslinkable group-containing acrylic polymer. Same below.

The die-bonding sheet 10 of this embodiment may contain one type of crosslinkable group-containing acrylic polymer, or may contain a plurality of types (for example, two types) of crosslinkable group-containing acrylic polymer.

For example, when the die-bonding sheet 10 contains two types of crosslinkable group-containing acrylic polymers, one crosslinkable group and the other crosslinkable group of the two types of crosslinkable group-containing acrylic polymers undergo a crosslinking reaction with each other. . Specifically, an acrylic polymer containing a crosslinkable group having at least one of a hydroxyl group or a carboxyl group in the molecule as a crosslinkable group and an acrylic polymer containing a crosslinkable group having at least one of an epoxy group or an isocyanate group in the molecule as a crosslinkable group can crosslink each other. have.

The above crosslinkable group-containing acrylic polymer can be synthesized by a general polymerization method using a radical polymerization initiator, for example.

It is preferable that the crosslinkable group-containing acrylic polymer contains the most structural units of an alkyl (meth)acrylate monomer in terms of mass ratio among the structural units in the molecule. As the said alkyl (meth)acrylate monomer, the C1-C18 alkyl (meth)acrylate monomer whose carbon number of an alkyl group (hydrocarbon group) is 1 or more and 18 or less is mentioned, for example.

As an alkyl (meth)acrylate monomer, a saturated linear alkyl (meth)acrylate monomer, a saturated branched chain alkyl (meth)acrylate monomer, etc. are mentioned, for example.

As the saturated linear alkyl (meth)acrylate monomer, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, n-butyl (meth)acrylate, n-heptyl (meth) Acrylate, n-octyl(meth)acrylate, n-nonyl(meth)acrylate, n-decyl(meth)acrylate, tridecyl(meth)acrylate, lauryl(meth)acrylate, myristyl(meth)acrylate ) acrylate, palmityl (meth)acrylate, stearyl (meth)acrylate, and the like. Moreover, it is preferable that carbon number of a linear alkyl group part is 2 or more and 8 or less.

As the saturated branched-chain alkyl (meth)acrylate monomer, isoheptyl (meth)acrylate, isooctyl (meth)acrylate, isononyl (meth)acrylate, isodecyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, ) Acrylate etc. are mentioned. In addition, the alkyl group portion may have any of an iso structure, a sec structure, a neo structure, or a tert structure.

The above crosslinkable group-containing acrylic polymer contains a structural unit derived from a crosslinkable group-containing monomer copolymerizable with an alkyl (meth)acrylate monomer.

In this embodiment, the crosslinkable group-containing acrylic polymer is an acrylic polymer obtained by copolymerization of at least an alkyl (meth)acrylate monomer and a crosslinkable group-containing monomer. In other words, the crosslinkable group-containing acrylic polymer has a structure in which structural units of an alkyl (meth)acrylate monomer and structural units of a crosslinkable group-containing monomer are connected in random order.

Examples of the crosslinkable group-containing monomer include a carboxyl group-containing (meth)acrylic monomer, an acid anhydride (meth)acrylic monomer, a hydroxyl group (hydroxyl group)-containing (meth)acrylic monomer, and an epoxy group (glycidyl group)-containing (meth)acrylic monomer. , isocyanate group-containing (meth)acrylic monomers, sulfonic acid group-containing (meth)acrylic monomers, phosphoric acid group-containing (meth)acrylic monomers, functional group-containing monomers such as acrylamide and acrylonitrile. In addition, the crosslinkable group-containing monomer may have an ether group or an ester group or the like in the molecule.

The crosslinkable group-containing acrylic polymer is preferably,

At least one crosslinkable group-containing monomer selected from the group consisting of a carboxyl group-containing (meth)acrylic monomer, a hydroxyl group-containing (meth)acrylic monomer, an epoxy group-containing (meth)acrylic monomer, and an isocyanate-containing (meth)acrylic monomer, and an alkyl (meth)acrylic monomer ) It is a copolymer of acrylates (particularly, alkyl (meth)acrylates having 8 or less carbon atoms in the alkyl moiety).

As a (meth)acrylic monomer containing a carboxy group, (meth)acrylic acid, a mono(2-(meth)acryloyloxyethyl) succinate monomer, etc. are mentioned, for example. In addition, the carboxy group may be arranged at the terminal portion of the monomer structure, or may be bonded to hydrocarbons other than the terminal portion.

As a hydroxyl group-containing (meth)acrylic monomer, a hydroxyethyl (meth)acrylate monomer, a hydroxypropyl (meth)acrylate monomer, a hydroxybutyl (meth)acrylate monomer, etc. are mentioned, for example. In addition, the hydroxyl group may be arranged at the terminal portion of the monomer structure, or may be bonded to hydrocarbons other than the terminal portion.

As an epoxy group-containing (meth)acryl monomer, a glycidyl (meth)acrylate monomer, 4-hydroxybutyl (meth)acrylate glycidyl ether, etc. are mentioned, for example. In addition, the epoxy group may be arranged at the terminal portion of the monomer structure, or may be bonded to hydrocarbons other than the terminal portion.

Examples of the isocyanate group-containing (meth)acrylic monomer include 2-methacryloyloxyethyl isocyanate, 1,1-(bisacryloyloxymethyl)ethyl isocyanate, 2-acryloyloxyethyl isocyanate, and 2- (2-methacryloyloxyethyloxy) ethyl isocyanate etc. are mentioned.

The die bond sheet 10 may also contain components other than the above crosslinkable group-containing acrylic polymer. For example, the die-bonding sheet 10 may further contain at least one of a thermosetting resin or a thermoplastic resin other than the crosslinkable group-containing acrylic polymer described above.

As a thermosetting resin, an epoxy resin, a phenol resin, an amino resin, an unsaturated polyester resin, a polyurethane resin, a silicone resin, a thermosetting polyimide resin etc. are mentioned, for example. As said thermosetting resin, only 1 type or 2 or more types are employ|adopted.

Examples of the epoxy resin include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, and phenol novolak. type, orthocresol novolac type, trishydroxyphenylmethane type, tetraphenylolethane type, hydantoin type, trisglycidyl isocyanurate type or glycidylamine type epoxy resin.

Phenol resins can act as curing agents for epoxy resins. As a phenol resin, polyoxy styrene, such as a novolak-type phenol resin, a resol-type phenol resin, and polyparaoxy styrene, etc. are mentioned, for example.

Examples of the novolak-type phenol resin include phenol novolak resins, phenol aralkyl resins, cresol novolak resins, tert-butyl phenol novolac resins, and nonyl phenol novolac resins.

The hydroxyl equivalent [g/eq] of the phenol resin may be, for example, 90 or more and 220 or less.

As said phenol resin, only 1 type or 2 or more types are employ|adopted.

In this embodiment, the die-bonding sheet 10 may also contain the above-described crosslinkable group-containing acrylic polymer and thermosetting resin, which undergo a crosslinking reaction with each other. In addition, the die-bonding sheet 10 may also contain a plurality of types of crosslinkable group-containing acrylic polymers that crosslink with each other.

For example, the die bond sheet 10 may contain a carboxyl group-containing acrylic polymer or a hydroxyl group-containing acrylic polymer as a crosslinkable group-containing acrylic polymer, and may also contain an epoxy resin as a thermosetting resin. As a result, the die-bonding sheet 10 can be sufficiently cured by a cross-linking reaction between the carboxy group or hydroxy group of the cross-linkable group-containing acrylic polymer and the epoxy group of the epoxy resin.

Examples of thermoplastic resins other than the above crosslinkable group-containing acrylic polymers that can be included in the die bond sheet 10 include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, and ethylene-acrylic acid. Copolymers, ethylene-acrylic acid ester copolymers, polybutadiene resins, polycarbonate resins, thermoplastic polyimide resins, polyamide resins such as 6-polyamide resins and 6,6-polyamide resins, phenoxy resins, crosslinkable An acrylic resin that does not contain a functional group in its molecule, a saturated polyester resin such as PET or PBT, a polyamideimide resin, a fluororesin, and the like are exemplified.

As said thermoplastic resin, only 1 type or 2 or more types are employ|adopted.

The content ratio of the crosslinkable group-containing acrylic polymer in 100 parts by mass of the total mass of the die-bonding sheet 10 is preferably 8 parts by mass or more and 100 parts by mass or less, more preferably 30 parts by mass or more. , more preferably 40 parts by mass or more.

In the die bond sheet 10, with respect to 100 parts by mass of the organic components (eg, the above crosslinkable group-containing acrylic polymer, thermosetting resin, curing catalyst, etc., silane coupling agent, dye) excluding the filler, The content ratio of the crosslinkable group-containing acrylic polymer is preferably 15 parts by mass or more and 100 parts by mass or less, more preferably 40 parts by mass or more and 95 parts by mass or less, still more preferably 60 parts by mass or more. In addition, the elasticity and viscosity of the die-bonding sheet 10 can be adjusted by changing the content of the thermosetting resin in the die-bonding sheet 10 .

On the other hand, the content ratio of the thermosetting resin to 100 parts by mass of the organic component may be 40 parts by mass or less.

The die bond sheet 10 may or may not contain a filler. By changing the amount of the filler in the die-bonding sheet 10, the elasticity and viscosity of the die-bonding sheet 10 can be more easily adjusted. In addition, the physical properties of the die bond sheet 10, such as conductivity, thermal conductivity, and modulus of elasticity, can be adjusted.

As a filler, an inorganic filler and an organic filler are mentioned. As a filler, an inorganic filler is preferable.

Examples of the inorganic filler include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, boron nitride, and silica such as crystalline silica and amorphous silica. Fillers containing Moreover, as a material of an inorganic filler, simple metals, alloys, etc., such as aluminum, gold, silver, copper, and nickel, are mentioned. A filler such as aluminum borate whisker, amorphous carbon black, or graphite may be used. The shape of the filler may be various shapes such as spherical shape, acicular shape, and flake shape. As a filler, only said 1 type or 2 or more types is employ|adopted.

When the die-bonding sheet 10 contains a filler, the content of the filler may be 50% by mass or less, 40% by mass or less, or 30% by mass or less of the total mass of the die-bonding sheet 10. Moreover, the content rate of the said filler may be 10 mass % or more, for example.

The die bond sheet 10 may also contain other components as needed. As said other component, a curing catalyst, a flame retardant, a silane coupling agent, an ion trapping agent, dye etc. are mentioned, for example.

As a flame retardant, antimony trioxide, antimony pentoxide, a brominated epoxy resin, etc. are mentioned, for example.

Examples of the silane coupling agent include β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycidoxypropylmethyldiethoxysilane. can

Examples of the ion trap agent include hydrotalcites, bismuth hydroxide, and benzotriazole.

As said other additive, only 1 type or 2 or more types are employ|adopted.

The die-bonding sheet 10 preferably contains the above-described crosslinkable group-containing acrylic polymer, thermosetting resin, and filler from the viewpoint of being easy to adjust elasticity and viscosity.

The thickness of the die-bonding sheet 10 is not particularly limited, but is, for example, 1 μm or more and 200 μm or less. This thickness may be 3 μm or more and 150 μm or less, or 5 μm or more and 100 μm or less. In the case where the die-bonding sheet 10 is a laminate, the above thickness is the total thickness of the laminate.

The die-bonding sheet 10 may have a single-layer structure, for example, as shown in FIG. 1 . In this specification, a single layer has only the layer formed with the same composition. A form in which a plurality of layers formed of the same composition are laminated is also a single layer.

On the other hand, the die-bonding sheet 10 may have a multilayer structure in which layers each formed of two or more types of different compositions are laminated, for example. When the die-bonding sheet 10 has a multilayer structure, at least one layer constituting the die-bonding sheet 10 may contain the crosslinkable group-containing acrylic polymer described above and, if necessary, further contain a thermosetting resin.

Subsequently, the manufacturing method of the die-bonding sheet 10 and the dicing die-bonding film 1 of this embodiment is demonstrated.

<Method for producing dicing die bond film>

The manufacturing method of the dicing die-bonding film 1 of this embodiment,

A process of producing the die bond sheet 10;

A process of producing the dicing tape 20;

A process of overlapping the manufactured die bond sheet 10 and the dicing tape 20 is provided.

<Process of producing die bond sheet>

The process of producing the die bond sheet 10,

A resin composition preparation step of preparing a resin composition for forming the die bond sheet 10;

It has a die-bonding sheet forming step of forming the die-bonding sheet 10 from the resin composition.

In the resin composition preparation step, a resin composition is prepared by, for example, mixing the above crosslinkable group-containing acrylic polymer with an epoxy resin, a curing catalyst for an epoxy resin, a phenol resin, or a solvent, and dissolving each resin in a solvent . By varying the amount of solvent, the viscosity of the composition can be adjusted. In addition, as these resins, commercially available products can be used.

In the die-bonding sheet formation step, the resin composition prepared as described above is applied to a release sheet, for example. It does not specifically limit as a coating method, For example, general coating methods, such as roll coating, screen coating, and gravure coating, are employ|adopted. Next, if necessary, the applied composition is solidified by desolvation treatment, curing treatment, or the like, and the die-bonding sheet 10 is formed.

<Process of manufacturing dicing tape>

The process of producing a dicing tape,

A synthesis process for synthesizing an acrylic copolymer;

A pressure-sensitive adhesive layer manufacturing step of preparing the pressure-sensitive adhesive layer 22 by evaporating the solvent from the pressure-sensitive adhesive composition containing the above-described acrylic copolymer, an isocyanate compound, a polymerization initiator, a solvent, and other components appropriately added according to the purpose; ,

A substrate layer manufacturing process for producing the substrate layer 21;

A lamination step of laminating the base material layer 21 and the pressure-sensitive adhesive layer 22 is provided by bonding the pressure-sensitive adhesive layer 22 and the base layer 21 together.

In the synthetic step, for example, an acrylic copolymer intermediate is synthesized by radically polymerizing the above saturated branched-chain alkyl (meth)acrylate monomer and a hydroxyl group-containing (meth)acrylic monomer.

Radical polymerization can be performed by a general method. For example, an acrylic copolymer intermediate can be synthesized by dissolving each of the above monomers in a solvent, stirring while heating, and adding a polymerization initiator. In order to adjust the molecular weight of the acrylic copolymer, polymerization may be performed in the presence of a chain transfer agent.

Next, a partial hydroxyl group of the hydroxyl group-containing (meth)acrylate unit contained in the acrylic copolymer intermediate and the isocyanate group of the isocyanate group-containing polymerizable monomer are bonded by a urethanization reaction. As a result, a part of the hydroxy group-containing (meth)acrylate unit becomes a polymerizable (meth)acrylate unit containing a radically polymerizable carbon-carbon double bond.

The urethanization reaction can be performed by a general method. For example, the acrylic copolymer intermediate and the isocyanate group-containing polymerizable monomer are stirred while heating in the presence of a solvent and a urethanization catalyst. As a result, the isocyanate group of the isocyanate group-containing polymerizable monomer can be urethane-bonded to a part of the hydroxy group of the acrylic copolymer intermediate.

In the pressure-sensitive adhesive layer preparation step, for example, an acrylic copolymer, an isocyanate compound, and a polymerization initiator are dissolved in a solvent to prepare an adhesive composition. By varying the amount of solvent, the viscosity of the composition can be adjusted. Next, the pressure-sensitive adhesive composition is applied to the release sheet. As a coating method, general coating methods, such as roll coating, screen coating, and gravure coating, are employ|adopted, for example. The applied composition is subjected to desolvation treatment or solidification treatment to solidify the applied pressure-sensitive adhesive composition to form the pressure-sensitive adhesive layer 22 .

In the substrate layer preparation step, a substrate layer can be produced by forming a film by a general method. Examples of the film forming method include a calender film forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, and a dry lamination method. A coextrusion molding method may be employed. In addition, as the substrate layer 21, you may use a commercially available film or the like.

In the lamination process, the pressure-sensitive adhesive layer 22 and the substrate layer 21 in a state of being overlapped on a release sheet are overlapped and laminated. In addition, the peeling sheet may be in a state overlapped with the pressure-sensitive adhesive layer 22 before use.

In addition, in order to promote the reaction between the crosslinking agent and the acrylic copolymer, and also to promote the reaction between the crosslinking agent and the surface portion of the substrate layer 21, an aging treatment process for 48 hours is performed in a 50°C environment after the lamination process. can also

The dicing tape 20 can be manufactured by these processes.

<Process of overlapping die bond sheet 10 and dicing tape 20>

In the step of overlapping the die-bonding sheet 10 and the dicing tape 20, the die-bonding sheet 10 is affixed to the pressure-sensitive adhesive layer 22 of the dicing tape 20 manufactured as described above.

In such sticking, the release sheet is peeled off from the pressure-sensitive adhesive layer 22 of the dicing tape 20 and the die-bonding sheet 10, respectively, and the die-bonding sheet 10 and the pressure-sensitive adhesive layer 22 are in direct contact. join For example, it can join by crimping. The temperature at the time of bonding is not particularly limited, and is, for example, 30°C or more and 50°C or less, and preferably 35°C or more and 45°C or less. The linear pressure at the time of bonding is not particularly limited, but is preferably 0.1 kgf/cm or more and 20 kgf/cm or less, and more preferably 1 kgf/cm or more and 10 kgf/cm or less.

Through the above steps, the dicing die bond film 1 manufactured as described above is used as an auxiliary tool for manufacturing a semiconductor device (semiconductor integrated circuit), for example. Hereinafter, a method of manufacturing a semiconductor device (method of using a dicing die-bonding film) will be described.

<Method of manufacturing semiconductor device (method of using dicing die bonding film when manufacturing semiconductor device)>

BACKGROUND OF THE INVENTION [0002] In a method of manufacturing a semiconductor device, chips are generally cut out from a semiconductor wafer on which a circuit surface is formed and assembled. At this time, the dicing die bonding film of this embodiment is used as a manufacturing auxiliary tool.

The manufacturing method of the semiconductor device of the present embodiment,

A cutting step of cutting a wafer (semiconductor wafer) on which a circuit surface is formed into chips;

A pick-up step of peeling the die-bonding sheet attached to the pressure-sensitive adhesive layer of the aforementioned dicing die-bonding film from the pressure-sensitive adhesive layer together with the chip is provided.

In the semiconductor device manufacturing method of the present embodiment, in the cutting step, for example, a weak portion is formed inside a semiconductor wafer to which a back grind tape is attached by means of a laser beam, and the semiconductor wafer is cut into chips ( A stealth dicing process for preparing a die), a back-grind process for grinding a semiconductor wafer to which a back-grind tape is attached to thin the thickness, and one surface of the thinned semiconductor wafer (for example, a circuit surface A mounting step of attaching the opposite side) to the die bond sheet 10 and fixing the semiconductor wafer to the dicing tape 20, and extending the dicing tape 20 to cut the semiconductor wafer and cut the chip (die) fabrication, and has an expand process to widen the gap between chips.

In the pick-up process, the semiconductor chip (die) is taken out in a state where the die-bonding sheet 10 and the pressure-sensitive adhesive layer 22 are peeled off and the die-bonding sheet 10 is attached.

The semiconductor device manufacturing method of the present embodiment further includes a die bonding step of adhering the die bonding sheet 10 attached to a semiconductor chip (die) to an adherend, and the die bonding sheet 10 adhered to the adherend. A curing step of curing, a wire bonding step of electrically connecting an electrode of an electronic circuit in a semiconductor chip (die) and an adherend with a wire, and a semiconductor chip (die) and wire on the adherend by using a thermosetting resin. It has a sealing process to seal.

The stealth dicing process is a process in a so-called SDBG (Stealth Dicing Before Grinding) process. In the stealth dicing process, as shown in FIGS. 2A to 2C , a weak portion for cutting the patterned wafer on which the circuit surface is formed into chips (dies) is formed inside the semiconductor wafer W. In detail, the back grind tape G is affixed to the circuit surface of the semiconductor wafer W (refer to FIG. 2A). With the back grinding tape G attached, grinding processing (pre-back grinding processing) is performed by the grinding pad K until the semiconductor wafer W has a predetermined thickness (see FIG. 2B ). A weakened portion is formed inside the semiconductor wafer W by targeting the laser beam to the semiconductor wafer W having a reduced thickness (see FIG. 2C).

A half-cutting process may be performed instead of the stealth dicing process. The half-cut process is a process in a so-called DBG (Dicing Before Grinding) process.

In the half-cut process, in order to process the semiconductor wafer into chips (dies) by cutting, grooves are formed in the semiconductor wafer, and then the semiconductor wafer is ground to make it thinner.

Specifically, in the half-cutting process, a half-cutting process is performed to cut the wafer on which circuit surfaces are formed into chips (dies). More specifically, the tape for a wafer process is affixed to the surface on the opposite side to the circuit surface of a semiconductor wafer. Further, a dicing ring is installed on the tape for wafer processing. In the state where the tape for wafer processing is attached, grooves for division are formed. While a back grind tape is affixed on the surface in which the groove was formed, the tape for a wafer process affixed first is peeled off.

The dicing die bond film of the present embodiment is preferably used in a Stealth Dicing Before Grinding (SDBG) process or a Dicing Before Grinding (DBG) process for manufacturing a semiconductor chip by cutting a semiconductor wafer as described above.

In the back grinding process, as shown in FIG. 2D, grinding processing is further performed on the semiconductor wafer W with the back grinding tape G attached, and the thickness of the chip (die) produced by the subsequent cutting process becomes The thickness of the semiconductor wafer W is thinned until For example, a grinding process may be performed until the semiconductor wafer W subjected to the half-cutting process becomes a predetermined thickness so as not to be individualized. When the grinding process is performed in this way, the semiconductor wafer W is cut into chips and the die-bonding sheet 10 is also cut by the subsequent expand step (particularly, the low-temperature expand step). On the other hand, you may perform grinding processing until the said half-cut processed semiconductor wafer W is individualized. When the grinding process is performed in this way, the die-bonding sheet 10 is cut at the same time as the space between adjacent chips is widened, for example, in the subsequent expand process (particularly the low-temperature expand process).

In the mounting process, the semiconductor wafer W is fixed to the dicing tape 20 as shown in FIGS. 3A to 3B . Specifically, while the dicing ring R is provided on the pressure-sensitive adhesive layer 22 of the dicing tape 20, on the surface of the exposed die bond sheet 10, the thickness of the semiconductor wafer W reduced by cutting as described above is attached (see Fig. 3a). Then, the back grind tape G is peeled off from the semiconductor wafer W (refer to FIG. 3B).

Before the expanding process, the die-bonding sheet 10 may be cut by, for example, irradiation with a laser beam. Specifically, in the case of individualizing the semiconductor wafer W by the above-described cutting process, the die-bonding sheet 10 that has not yet been cut may be cut by irradiation of a laser beam while overlapping the chip formed by the individualization of the semiconductor wafer. Thereafter, the space between adjacent chips may be widened by an expand step.

In the expand step, as shown in Figs. 4A to 4C, the gap between semiconductor chips (dies) X produced by cutting is widened. Specifically, after attaching the dicing ring R to the pressure-sensitive adhesive layer 22 of the dicing tape 20, it is fixed to the holder H of the expander (see Fig. 4A). The dicing die-bonding film 1 is expanded so as to expand in the surface direction by pushing up the pushing member U provided in the expander from the lower side of the dicing die-bonding film 1 (see FIG. 4B ). In this way, the semiconductor wafer W is cut under specific temperature conditions. The temperature conditions are, for example, -20 to 0°C, preferably -15 to 0°C, and more preferably -10 to -5°C. By lowering the lifting member U, the expanded state is released (refer to FIG. 4C up to this low-temperature expand process).

Further, in the expand process, as shown in Figs. 5A and 5B, the dicing tape 20 is extended to expand the area under a higher temperature condition (for example, 10 °C to 25 °C). In this way, after cutting, adjacent semiconductor chips X are separated in the plane direction of the film plane, and the caph (interval) is expanded (room temperature expand step).

In the case of carrying out the DBG process described above, in the expand step, a method of cutting the die bond sheet at a low temperature may be employed, or a method of cutting the die bond sheet with a laser may be employed. When cutting a die-bonding sheet with a laser, after cutting a die-bonding sheet, an expand process may be performed at a lower temperature.

Before the pick-up step, the pressure-sensitive adhesive layer 22 is subjected to a hardening treatment, for example, by irradiating ultraviolet rays to the pressure-sensitive adhesive layer 22 overlapping the base material layer 21 from the base material layer 21 side (curing treatment step).

In the pick-up process, as shown in FIG. 6 , the semiconductor chip X in a state where the die-bonding sheet 10 is attached is peeled from the pressure-sensitive adhesive layer 22 of the dicing tape 20 . In detail, the pin member P is raised, and the semiconductor chip X to be picked up is pushed up through the dicing tape 20 . The pushed-up semiconductor chip X is held by the suction jig J.

By using the dicing die-bonding film of the present embodiment described above, in the pick-up process, good pick-up properties can be exhibited.

In the die bonding process, the semiconductor chip X with the die bonding sheet 10 attached thereto is bonded to the adherend Z. In the die bonding process, as shown in FIG. 7 , for example, the semiconductor chip X in a state where the die bonding sheet 10 is attached may be laminated a plurality of times. In this way, when manufacturing a chip-embedded semiconductor device (Film on Die (FOD) type semiconductor device), the die-bonding sheet 10 may be used to embed the semiconductor chip.

In the curing step, in order to increase the reaction activity of the crosslinkable group (for example, epoxy group) in the above-mentioned crosslinkable group-containing acrylic polymer included in the die bond sheet 10, to advance the curing of the die bond sheet 10, For example, heat treatment is performed at a temperature of 100°C or more and 180°C or less.

In the wire bonding process, as shown in FIG. 8 , the semiconductor chip X (die) and the adherend Z are connected with a wire L while being heated. Therefore, the crosslinkable group in the above-mentioned crosslinkable group-containing acrylic polymer included in the die bond sheet 10 becomes reactive again by heating, and the curing reaction of the die bond sheet 10 can proceed.

In the wire bonding step, a compressive force may be applied to the die-bonding sheet 10 in the thickness direction in some cases.

In the sealing step, as shown in FIG. 9 , the semiconductor chip X (die) and the die bonding sheet 10 are sealed with a thermosetting resin M such as an epoxy resin. In the sealing step, in order to advance the curing reaction of the thermosetting resin M, heat treatment is performed at a temperature of, for example, 100°C or more and 180°C or less.

In addition, in the semiconductor industry in recent years, with the new development of integration technology, thinner semiconductor chips (for example, 20 μm or more and 50 μm or less) and thinner die-bonding sheets (for example, 1 μm or more and 40 μm or less) or less, preferably 7 μm or less, more preferably 5 μm or less) is desired.

An electronic circuit is formed on one surface of such a thin semiconductor chip. If an electronic circuit is formed on one side of a thin semiconductor chip, the semiconductor chip cannot withstand the internal stress and is slightly deformed (warp, etc.), and with this deformation, warpage may also occur on the die bond sheet (see FIG. 10).

In the above-mentioned expand process, especially in the normal temperature expand process, the dicing tape 20 is extended with strong force in the plane direction, so if there is warpage in the chip, the dicing tape 20 and the die-bonding sheet 10 is peeled off, resulting in a so-called chip floating phenomenon. In order to suppress this chip floating, a relatively high adhesive force is required between the dicing tape 20 and the die-bonding sheet 10 in the expanding process. On the other hand, in the pick-up step, it is required that the die-bonding sheet 10 can be easily peeled off from the dicing tape 20 (good pick-up properties). In order to exhibit this conflicting performance, the dicing tape 20 is designed so that the pressure-sensitive adhesive layer 22 of the dicing tape 20 can be cured by irradiation with active energy rays, for example. Specifically, in the low-temperature expand process for cutting in the expand process and the room-temperature expand process for securing chip-to-chip distance, the pressure-sensitive adhesive layer 22 exhibits relatively high adhesive strength before irradiation with active energy rays. carried out in a state of On the other hand, by irradiating active energy rays to the pressure-sensitive adhesive layer 22 before the pick-up process, the adhesive force of the pressure-sensitive adhesive layer 22 is lowered.

When active energy rays are irradiated, fluctuations in the amount of irradiation and the like usually occur in the surface direction of the pressure-sensitive adhesive layer 22 . In order to reduce the influence on the adhesive force decrease by the fluctuation|variation of irradiation amount, an active energy ray is irradiated excessively in many cases. However, excess heat is generated as much as the active energy ray is irradiated excessively. The die bond sheet 10 may be softened by the generated heat. As a result, the die-bonding sheet 10 adheres more strongly to the dicing tape 20, and even after irradiation with active energy rays, the peeling force of the die-bonding sheet 10 increases and the pick-up property deteriorates in some cases. In order to suppress such an increase in the adhesiveness of the die-bonding sheet 10 due to heat, in the present embodiment, the content of radically polymerizable carbon-carbon double bonds in the acrylic copolymer contained in the pressure-sensitive adhesive layer 22 is relatively increased. . As a result, the elasticity of the pressure-sensitive adhesive layer 22 after curing with active energy rays is increased. Therefore, the adhesiveness of the pressure-sensitive adhesive layer 22 to the die-bonding sheet 10 is weakened, and the amount of volume shrinkage accompanying curing is relatively large. Thus, in this embodiment, the pressure-sensitive adhesive layer 22 after curing by active energy ray irradiation is not so greatly affected by wetting from the die-bonding sheet 10, and the adhesion to the die-bonding sheet 10 is suppressed. has been

Although the dicing die-bonding film of this embodiment and the manufacturing method of a semiconductor device are as exemplified above, this invention is not limited to the dicing die-bonding film etc. which were exemplified above.

That is, various forms used in general dicing die bond films and semiconductor device manufacturing methods can be employed within a range that does not impair the effects of the present invention.

Matters disclosed by this specification include the following.

(One)

A dicing tape having a substrate layer and an adhesive layer overlapping the substrate layer, and a die bond sheet overlapping the dicing tape,

The pressure-sensitive adhesive layer contains at least an acrylic copolymer having an alkyl (meth)acrylate unit and a crosslinkable group-containing (meth)acrylate unit as monomer units in a molecule,

In the acrylic copolymer, some of the crosslinkable group-containing (meth)acrylate units have radically polymerizable carbon-carbon double bonds;

The acrylic copolymer contains 30 parts by mole or more and 60 parts by mole or less of the crosslinkable group-containing (meth)acrylate unit with respect to 100 parts by mole of the alkyl (meth)acrylate unit, and among the crosslinkable group-containing (meth)acrylate units The dicing die bonding film in which 50 mol% or more and 95 mol% or less contain the said radically polymerizable carbon-carbon double bond.

(2)

The acrylic copolymer contains 28 parts by mole or more and 55 parts by mole or less of the crosslinkable group-containing (meth)acrylate unit containing the radically polymerizable carbon-carbon double bond, based on 100 parts by mole of the alkyl (meth)acrylate unit. , The dicing die-bonding film according to (1) above.

(3)

The dicing die-bonding film according to (1) or (2) above, wherein the pressure-sensitive adhesive layer has a surface elastic modulus greater than 50 MPa and less than 431 MPa after being cured by active energy rays.

(4)

The dicing die-bonding film according to (3) above, wherein the modulus of elasticity is greater than 100 MPa.

(5)

The acrylic copolymer contains, as the alkyl (meth) acrylate unit, a long-chain alkyl (meth) acrylate unit having 8 or more carbon atoms in the alkyl moiety;

The dicing die-bonding film according to any one of (1) to (4) above, wherein the proportion of the long-chain alkyl (meth)acrylate unit among all the monomer units contained in the acrylic copolymer is the highest in terms of mole.

(6)

The acrylic copolymer contains, as the long-chain alkyl (meth)acrylate unit, a long-chain alkyl (meth)acrylate unit having 9 or more carbon atoms in the alkyl moiety, and the proportion occupied by the long-chain alkyl (meth)acrylate unit The dicing die-bonding film according to (5) above, which is the highest in terms of mole among all the monomer units.

(7)

The acrylic copolymer is a polymerizable (meth)acrylate unit having a hydroxyl group-containing (meth)acrylate unit and a radically polymerizable carbon-carbon double bond (polymerizable unsaturated double bond) as the crosslinkable group-containing (meth)acrylate unit. contains acrylate units;

In addition, the acrylic copolymer includes, as the alkyl (meth)acrylate unit, a saturated branched-chain alkyl (meth)acrylate unit having 8 or more and 10 or less carbon atoms in the alkyl portion, and a saturated linear chain having 12 or more and 14 or less carbon atoms in the alkyl portion. The dicing die-bonding film according to any one of (1) to (6) above, containing an alkyl (meth)acrylate unit.

(8)

The acrylic copolymer is a polymerizable (meth)acrylate unit having a hydroxyl group-containing (meth)acrylate unit and a radically polymerizable carbon-carbon double bond (polymerizable unsaturated double bond) as the crosslinkable group-containing (meth)acrylate unit. contains acrylate units;

In the acrylic copolymer, the content ratio of the polymerizable (meth)acrylate unit,

The dicing die-bonding film according to any one of (1) to (7) above, which is higher in terms of mole than the content of the hydroxyl group-containing (meth)acrylate unit.

(9)

The die bond sheet includes an acrylic polymer containing a crosslinkable group,

The dicing die-bonding film according to any one of (1) to (8) above, wherein the crosslinkable group-containing acrylic polymer contains at least one of a carboxyl group or an epoxy group as a crosslinkable group.

(10)

A method for manufacturing a semiconductor device,

A cutting step of cutting a wafer (pattern wafer) on which a circuit surface is formed into chips;

Manufacturing of a semiconductor device including a pick-up step of peeling the die-bonding sheet attached to the pressure-sensitive adhesive layer of the dicing die-bonding film according to any one of (1) to (9) above from the pressure-sensitive adhesive layer together with the chip. Way.

[Example]

Next, the present invention will be explained in more detail by means of experimental examples, but the present invention is not limited thereto.

A dicing tape was manufactured as follows. Further, this dicing tape was bonded to a die-bonding sheet to prepare a dicing die-bonding film.

<Production of dicing tape>

(raw material monomer of acrylic copolymer)

2-hydroxyethyl acrylate (HEA)

2-hydroxyethyl methacrylate (HEMA)

·Isononyl acrylate (INA)

2-ethylhexyl acrylate (2EHA)

Acryloylmorpholine (ACMO)

・Lauryl acrylate (LA)

(Example 1) to (Example 4) / (Comparative Examples 1 and 2)

Each raw material was put into a reaction vessel equipped with a cooling tube, a nitrogen inlet tube, a thermometer, and a stirring device so as to have the compounding composition shown in Table 1. 0.2 parts by weight of azobisisobutyronitrile (AIBN) was used as a thermal polymerization initiator with respect to a total of 100 parts by weight of the monomers. Ethyl acetate was added as a reaction solvent so that the concentration of all monomers became a predetermined concentration (for example, 35% by mass). Polymerization reaction treatment was performed at 62°C for a predetermined period of time (eg, 3 hours) and at 75°C for a predetermined period of time (eg, 4 hours) in a nitrogen stream to obtain an acrylic copolymer intermediate.

In each Example and each Comparative Example, the monomer concentration and polymerization time during polymerization are as shown in Table 2, respectively.

2-methacryloyloxyethyl isocyanate (hereinafter also referred to as MOI) was added to the liquid containing the intermediate of the acrylic copolymer prepared as described above in an amount shown in Table 1 in terms of mole relative to the sum of HEA and HEMA. added. For example, in Example 1, the MOI was added in an amount of 92% in terms of mole with respect to the hydroxyl group-containing (meth)acrylate monomer blended during polymerization. Further, 0.5% by mass of dibutyltin dilaurate relative to the MOI addition amount was added as a reaction catalyst. Thereafter, an addition reaction treatment (urethanization reaction treatment) was performed at 50°C in an air current for 12 hours to obtain an acrylic copolymer.

Next, an adhesive solution was prepared by adding the following ingredients to 100 parts by mass of the acrylic copolymer.

Photopolymerization initiator: amount shown in Table 1

(Product name "Omnirad127D", manufactured by IGM)

・Polyisocyanate compound: amount shown in Table 1

(Product name "Coronate L", manufactured by Tosoh Corporation)

Antioxidant: amount shown in Table 1

(Product name "Irganox1010", manufactured by BASF Japan)

The pressure-sensitive adhesive solution prepared as described above was applied onto the treated surface of a PET release liner treated with silicone, and heated and dried at 120° C. for 2 minutes to form a pressure-sensitive adhesive layer having a thickness of 10 μm.

Subsequently, the pressure-sensitive adhesive layer and the substrate layer (polyolefin film (125 μm thickness) manufactured by Gunze, product name “Pan Clear NED #125”) were bonded together, and stored at 50° C. for 24 hours to prepare a dicing tape.

<Production of die bond sheet>

・Acrylic polymer: 100 parts by mass

(Product name "Teisan Resin SG-80H", mass average molecular weight: 350000, containing epoxy group, glass transition temperature Tg: 11°C, manufactured by Nagase Chemtex Co., Ltd.)

Phenol resin: 14 parts by mass

(Product name "MEHC-7851SS", solidified at 23°C, manufactured by Maywa Kasei Co., Ltd.)

・Silica filler: 69 parts by mass

(Product name "SE2050-MCV", average particle diameter 500 nm, manufactured by Admatechs)

Each of the above raw materials was added to and mixed with a predetermined amount of methyl ethyl ketone to prepare an adhesive composition solution having a total solid content concentration of 20% by mass. Next, the adhesive composition was applied using an applicator on the silicone release-treated surface of the PET release liner (separator) having the silicone release-treated surface, and a coating film was formed. Heat drying was performed on this coating film at 130°C for 2 minutes to prepare a die-bonding sheet having a thickness of 10 µm on a PET release liner (separator).

<Manufacture of dicing die bond film>

The die bond sheet was punched into a circular shape with a diameter of 330 mm to prepare a circular die bond sheet. A dicing die-bonding film was produced by bonding a circular die-bonding sheet and a dicing tape together at room temperature using a laminator.

<Measurement of physical properties of dicing die bond film>

About the dicing die-bonding films of each Example and each Comparative Example, each physical property was measured as follows.

[Surface elastic modulus of pressure-sensitive adhesive layer after UV irradiation]

The detail of the measuring method of the surface elastic modulus of said adhesive layer is as above-mentioned. Table 1 shows the surface elastic modulus measurement results.

[Peel force between pressure-sensitive adhesive layer and die-bonding sheet (after UV irradiation)]

The peel force was measured by the T-shaped peel test. A sample for measurement was produced as follows.

The PET release liner (separator) was peeled from the die-bonding sheet to expose one side of the die-bonding sheet. A backing tape (product name "ELP BT315" manufactured by Nitto Denko Co., Ltd.) was bonded to the exposed surface. Using a high-pressure mercury lamp (product name "UM-810" 60 mW/cm 2 ) manufactured by Nitto Seiki Co., Ltd., an ultraviolet ray having an intensity of 150 mJ/cm 2 was irradiated from the substrate layer side to cure the pressure-sensitive adhesive layer. Then, the adhesive layer was cut out so that it might become a dimension of 50 mm in width x 120 mm in length, and it was set as the sample for a measurement. About the produced measurement sample, the T-shaped peeling test was done using the tensile tester (For example, product name "AUTOGRAPH AGX-V", made by Shimadzu Corporation). The test conditions were a temperature of 25°C and a tensile speed of 300 mm/min.

[Peel force between pressure-sensitive adhesive layer and die-bonding sheet (after excessive UV irradiation)]

The peel force was measured in the same manner as in the above method except that the pressure-sensitive adhesive layer was cured by irradiation with ultraviolet rays having an intensity of 1000 mJ/cm 2 .

Table 1 shows the composition and physical properties of the die-bonding sheet in each Example and each Comparative Example. Further, the isocyanate group of the MOI and the hydroxyl group of the hydroxyl group-containing (meth)acrylate unit undergo a urethanization reaction with a reaction efficiency of approximately 100%. Therefore, the mol% of the hydroxyl group-containing (meth)acrylate unit and the mol% of the polymerizable (meth)acrylate unit in the acrylic copolymer can be calculated respectively based on the compounding amount when the acrylic copolymer is synthesized. have.

The performance of the dicing die-bonding film prepared as described above was evaluated as follows.

<Performance evaluation (pick-up performance by pick-up test)>

The pick-up property was evaluated for the semiconductor chip with the die-bonding sheet in the cut state. A semiconductor chip with a die bond sheet in a cut state was obtained as follows.

Specifically, back grinding was performed on the surface on which the grooves for division were formed of a 12-inch bare wafer (diameter: 300 mm, thickness: 55 µm) in which grooves for division (10 mm × 10 mm) were formed by half-cutting. Tape was applied. Thereafter, the surface of the 12-inch bare wafer (surface opposite to the side to which the back grind tape was applied) was ground to a depth of 25 μm using a back grinder (manufactured by DISCO, Model DGP8760). In this way, a background bare wafer was obtained. The die-bonding sheet of the dicing die-bonding film of each example was affixed on the side opposite to the sticking surface of the back-grind tape of the back-grinded bare wafer. In this way, a bare wafer with a dicing die bond film was obtained. This bare wafer with a dicing die-bonding film was cut by the expand process. In addition, the expand process was carried out using a die separator (trade name: "Die Separator DDS2300, manufactured by Disco Corporation") in a state where the back grind tape was separated from the bare wafer. In the expand process, cool expand was performed. After performing, room temperature expand was performed.

Cool expand was performed as follows. Specifically, a ring frame made of SUS (manufactured by Disco) having a diameter of 12 inches was affixed at room temperature to the frame bonding area on the pressure-sensitive adhesive layer of the dicing die-bonding film affixed to the bare wafer. After that, the bare wafer to which the ring frame made of SUS was attached was mounted on a die separator. Cool expansion was performed by expanding the dicing tape of the dicing die bonding film in the cool expander unit of the die separator device. The conditions at this time were an expand temperature of -15°C, an expand speed of 100 mm/sec, and an expand amount of 7 mm. In addition, after the cool expand, the semiconductor wafer was divided (individualized) into a plurality of semiconductor chips. In addition, the die bond sheet has also been fragmented into a size corresponding to a semiconductor chip. Thus, a plurality of semiconductor chips with die bonding sheets were obtained.

Room-temperature expand was performed as follows after cool expand. Room-temperature expansion was performed by expanding the dicing tape of the dicing die-bonding film using the room-temperature expand unit of the die-separating device described above. The conditions at this time were an expand temperature of 23±2° C., an expand speed of 1 mm/sec, and an expand amount of 10 mm. The dicing tape after normal temperature expansion was subjected to heat shrinkage treatment under conditions of a temperature of 200°C and a time of 20 seconds.

After heat-shrinking the dicing tape, a pick-up test was conducted on the individualized semiconductor chips with die-bonding sheets using a device having a pick-up mechanism (product name: "Die Bonder SPA-300", manufactured by Shinkawa Co., Ltd.). In this pickup test, the pushing speed by the pin member was 1 mm/sec, and the pushing amount was 2000 µm. In addition, the pick-up test was performed after curing the pressure-sensitive adhesive layer. The curing treatment was performed by irradiating ultraviolet rays of 1000 mJ/cm 2 from the substrate layer side using an ultraviolet irradiation unit (high pressure mercury lamp, 70 mW/cm 2 ) incorporated in the die separator.

The pick-up test was performed on five semiconductor chips with die-bonding sheets. The evaluation criteria of pickup properties are as follows.

◎ (Good):

All of the five semiconductor chips with die bonding sheets can be picked up.

○: (slightly good)

Three or four of the five semiconductor chips with die bond sheets can be picked up.

× (bad):

Three or more of the five semiconductor chips with die bond sheets could not be picked up.

As understood from the above evaluation results, the dicing die-bonding films of Examples were better than the dicing die-bonding films of Comparative Examples in terms of pick-up properties.

The pressure-sensitive adhesive layer of the dicing die-bonding film of the examples includes at least an acrylic copolymer having an alkyl (meth)acrylate unit and a crosslinkable group-containing (meth)acrylate unit as monomer units in the molecule, In the present invention, some of the crosslinkable group-containing (meth)acrylate units have radically polymerizable carbon-carbon double bonds, and the acrylic copolymer contains a crosslinkable group-containing (meth)acrylate unit based on 100 parts by mole of the alkyl (meth)acrylate unit. It contains 30 mol parts or more and 60 mol parts or less of acrylate units, and 50 mol% or more and 95 mol% or less of the crosslinkable group-containing (meth)acrylate units have radically polymerizable carbon-carbon double bonds.

A semiconductor device can be efficiently manufactured by using the dicing die-bonding film of Example having such a structure in manufacturing a semiconductor device. In manufacture of a semiconductor device, a hardening process is given to an adhesive layer before a pick-up process, for example, by irradiating an active energy ray, such as an ultraviolet-ray, to an adhesive layer. At this time, in order to fully perform a hardening process, active energy rays may be excessively irradiated. Therefore, heat is generated more than necessary in the pressure-sensitive adhesive layer, and the heat is transmitted to the die-bonding sheet. This softens the die-bonding sheet and makes it easy to wet with the pressure-sensitive adhesive layer (contact area is large). At this time, since the acrylic copolymer contains a relatively large amount of both a hydroxyl group and a radically polymerizable carbon-carbon double bond as in the above embodiment, the shrinkage accompanying curing of the pressure-sensitive adhesive layer is relatively large, and the contact area with the die-bonding sheet is sufficiently can reduce In this way, it is considered that the pressure-sensitive adhesive layer becomes less susceptible to the influence of wetting from the die-bonding sheet by heat.

In addition, since the acrylic copolymer contains a relatively large amount of both hydroxy groups and radically polymerizable carbon-carbon double bonds as in the above example, the elastic modulus of the pressure-sensitive adhesive layer after curing is relatively high. It is thought that also by this, the pressure-sensitive adhesive layer becomes less susceptible to the influence of wetting from the die-bonding sheet by heat.

The dicing die-bonding film of the present invention is suitably used as an auxiliary tool when manufacturing a semiconductor device (semiconductor integrated circuit), for example.

1: dicing die bond film
10: die bond sheet
20: dicing tape
21: base layer
22: adhesive layer

Claims (8)

A dicing tape having a substrate layer and an adhesive layer overlapping the substrate layer, and a die bond sheet overlapping the dicing tape,
The pressure-sensitive adhesive layer contains at least an acrylic copolymer having an alkyl (meth)acrylate unit and a crosslinkable group-containing (meth)acrylate unit as monomer units in a molecule,
In the acrylic copolymer, some of the crosslinkable group-containing (meth)acrylate units have radically polymerizable carbon-carbon double bonds;
The acrylic copolymer contains 30 parts by mole or more and 60 parts by mole or less of the crosslinkable group-containing (meth)acrylate unit based on 100 parts by mole of the alkyl (meth)acrylate unit,
The dicing die-bonding film in which 50 mol% or more and 95 mol% or less of the crosslinkable group-containing (meth)acrylate units contain the radical polymerizable carbon-carbon double bond. According to claim 1,
The acrylic copolymer contains 28 parts by mole or more and 55 parts by mole or less of the crosslinkable group-containing (meth)acrylate unit containing the radically polymerizable carbon-carbon double bond, based on 100 parts by mole of the alkyl (meth)acrylate unit. , dicing die bond film. According to claim 1 or 2,
The dicing die-bonding film having a surface elastic modulus of greater than 50 MPa and less than 431 MPa after the pressure-sensitive adhesive layer is cured by active energy rays. According to claim 3,
The dicing die-bonding film having the surface elastic modulus greater than 100 MPa. According to claim 1 or 2,
The acrylic copolymer contains, as the alkyl (meth) acrylate unit, a long-chain alkyl (meth) acrylate unit having 8 or more carbon atoms in the alkyl moiety;
The dicing die bond film in which the ratio of the long-chain alkyl (meth)acrylate unit among the monomer units contained in the acrylic copolymer is the highest. According to claim 5,
The acrylic copolymer contains, as the long-chain alkyl (meth)acrylate unit, a long-chain alkyl (meth)acrylate unit having 9 or more carbon atoms in the alkyl moiety, and the proportion occupied by the long-chain alkyl (meth)acrylate unit The highest dicing die bond film among these monomer units. According to claim 1 or 2,
The die bond sheet includes an acrylic polymer containing a crosslinkable group,
The dicing die-bonding film in which the crosslinkable group-containing acrylic polymer contains at least one of a carboxyl group and an epoxy group as a crosslinkable group. A method for manufacturing a semiconductor device,
A cutting step of cutting the wafer on which the circuit surface is formed into chips;
A semiconductor device manufacturing method comprising: a pick-up step of peeling the die-bonding sheet attached to the pressure-sensitive adhesive layer of the dicing die-bonding film according to claim 1 or 2 from the pressure-sensitive adhesive layer together with the chip.

Images