KR20220156745A - Dicing die bonding film - Google Patents

Abstract

A dicing die-bonding film includes a dicing tape in which an adhesive layer is laminated on a base material layer, and a die-bonding layer laminated on the adhesive layer while part of the adhesive layer is exposed. The adhesive layer contains an acrylic polymer, and the die-bonding layer contains an aromatic compound. A parameter derived by combining a plurality of parameters satisfies a predetermined numerical range, the plurality of parameters being obtained by performing FT-IR analysis on an exposed portion of the adhesive layer and a laminated portion with the die-bonding layer in the adhesive layer. The dicing die-bonding film is capable of reducing the peel force of an adhesive layer from a die-bonding layer when the die-bonding layer is peeled off from the adhesive layer.

Description

Dicing die bond film {DICING DIE BONDING FILM}

The present invention relates to a dicing die bond film.

Conventionally, in the manufacture of semiconductor devices, it is known to use a dicing die-bonding film to obtain a semiconductor chip for die bonding (for example, Patent Document 1).

The dicing die bond film includes a dicing tape in which an adhesive layer is laminated on a substrate layer, and a die bond layer laminated on the adhesive layer in a state in which a part of the adhesive layer is exposed.

And, as a method of obtaining a semiconductor chip (die) for die bonding using the dicing die bond film, a half-cutting step of forming a groove in a semiconductor wafer to process the semiconductor wafer into a chip (die) by a cutting process; , a back-grind step of grinding the semiconductor wafer after the half-cut step to reduce the thickness, and attaching one surface (for example, the surface on the opposite side to the circuit face) of the semiconductor wafer after the back-grind step to the die bond layer, followed by dicing A mount process for fixing the semiconductor wafer to the tape, an expand process for widening the gap between the semiconductor chips, a kerf holding process for maintaining the gap between the semiconductor chips, and a die bond layer by separating between the die bond layer and the pressure-sensitive adhesive layer. It is known to adopt a method having a pick-up step of taking out a semiconductor chip in this attached state.

Then, in the pick-up step, the semiconductor chip taken out while attached to the die-bonding layer (hereinafter, also referred to as 'semiconductor chip having a die-bonding layer') is adhered to the wiring substrate as an adherend.

In addition, the pressure-sensitive adhesive layer is usually irradiated with a resin such as a (meth)acrylic resin, a crosslinking agent that reacts with the resin and polymerizes the resins, and active energy rays such as ultraviolet rays to prevent chain polymerization of the resins. It contains a photopolymerization initiator that generates active species that enable it (for example, Patent Document 2).

In such a pressure-sensitive adhesive layer, when irradiated with active energy rays such as ultraviolet rays, for example, a curing reaction proceeds, and the peeling force of the pressure-sensitive adhesive layer with respect to the die-bonding layer is reduced.

As a result, the die-bonding layer is relatively easily separated from the pressure-sensitive adhesive layer. That is, the pick-up process can be performed relatively smoothly.

Japanese Unexamined Patent Publication No. 2019-9203 Japanese Unexamined Patent Publication No. 2019-67996

By the way, as described above, when the die-bonding layer is separated from the pressure-sensitive adhesive layer, for example, even after curing the pressure-sensitive adhesive layer by irradiating the pressure-sensitive adhesive layer with active energy rays such as ultraviolet rays, the die-bonding layer There are cases in which the peeling force of the pressure-sensitive adhesive layer against the surface cannot be sufficiently reduced.

In this way, if the peeling force of the pressure-sensitive adhesive layer to the die-bonding layer cannot be sufficiently reduced, the pick-up step cannot be performed smoothly, which is not preferable.

However, it is difficult to say that sufficient studies have yet been made on sufficiently reducing the peeling force of the pressure-sensitive adhesive layer with respect to the die-bonding layer when the die-bonding layer is separated from the pressure-sensitive adhesive layer.

Then, the present invention makes it an object to provide a dicing die-bonding film capable of sufficiently reducing the peeling force of the pressure-sensitive adhesive layer with respect to the die-bonding layer when peeling the die-bonding layer from the pressure-sensitive adhesive layer. .

The dicing die bond film according to the present invention,

A dicing tape in which an adhesive layer is laminated on a substrate layer;

A die bond layer laminated on the pressure-sensitive adhesive layer in a state in which a part of the pressure-sensitive adhesive layer is exposed,

The pressure-sensitive adhesive layer includes an acrylic polymer,

The die bond layer contains an aromatic compound,

FTIR analysis is performed on each of the exposed portion of the pressure-sensitive adhesive layer and the laminated portion with the die bond layer,

The sum of all peak heights appearing in the range of 675 cm ^{-1 or more and 900 cm -1 or} less in the exposed portion of the pressure-sensitive adhesive layer is H1,

The peak height appearing in the range of 1600 cm ^-1 or more and 1800 cm ^-1 or less in the exposed portion of the pressure-sensitive adhesive layer is T1,

The sum of all peak heights appearing in the range of 675 cm ^{-1 or more and 900 cm -1 or} less in the laminated portion with the die bond layer is H2,

When the peak height appearing in the range of 1600 cm ^-1 or more and 1800 cm ^-1 or less in the laminated portion with the die bond layer is T2,

The value of R calculated by following formula (1) is 1.5 or less.

In the dicing die bond film,

It is preferable that the said acrylic polymer contains 13 mol% or more of structural units of the alkyl (meth)acrylate which has a C9 or more alkyl group.

In the dicing die bond film,

It is preferable that the said acrylic polymer contains the structural unit of the alkyl (meth)acrylate which has a C12 or more alkyl group.

In the dicing die bond film,

It is preferable that the said acrylic polymer contains 15 mol% or more of structural units of the alkyl (meth)acrylate which has a C12 or more alkyl group.

In the dicing die bond film,

It is preferable that the said acrylic polymer contains the structural unit of the alkyl (meth)acrylate which has an alkyl group of 9 or more and 14 or less carbon atoms, and the structural unit of (meth)acrylate containing a hydroxyl group.

1 is a cross-sectional view showing the configuration of a dicing die bond film according to an embodiment of the present invention.
Fig. 2A is a cross-sectional view schematically showing a state of half-cut processing in a method of manufacturing a semiconductor integrated circuit.
Fig. 2B is a cross-sectional view schematically showing a state of half-cut processing in a method of manufacturing a semiconductor integrated circuit.
Fig. 2C is a cross-sectional view schematically showing the state of back-grind processing in a method of manufacturing a semiconductor integrated circuit.
Fig. 2D is a cross-sectional view schematically showing the state of back-grind processing in a method of manufacturing a semiconductor integrated circuit.
Fig. 3A is a cross-sectional view schematically showing a mount step in a method of manufacturing a semiconductor integrated circuit.
Fig. 3B is a cross-sectional view schematically showing a mount step in a method of manufacturing a semiconductor integrated circuit.
Fig. 4A is a cross-sectional view schematically showing the state of an expand step at a low temperature in a method of manufacturing a semiconductor integrated circuit.
Fig. 4B is a cross-sectional view schematically showing the state of an expand step at a low temperature in a method of manufacturing a semiconductor integrated circuit.
Fig. 4C is a cross-sectional view schematically showing the state of an expand step at a low temperature in a method of manufacturing a semiconductor integrated circuit.
Fig. 5A is a cross-sectional view schematically showing the state of an expand step at room temperature in a method of manufacturing a semiconductor integrated circuit.
Fig. 5B is a cross-sectional view schematically showing the state of an expand step at room temperature in a method of manufacturing a semiconductor integrated circuit.
Fig. 6 is a cross-sectional view schematically showing a state of a kerf holding step in a method of manufacturing a semiconductor integrated circuit.
Fig. 7 is a cross-sectional view schematically illustrating a state of a pick-up step in a method of manufacturing a semiconductor integrated circuit.

Hereinafter, one embodiment of the present invention will be described.

[Dicing die bond film]

As shown in FIG. 1 , the dicing die bond film 20 according to the present embodiment includes a dicing tape 10 in which an adhesive layer 2 is laminated on a substrate layer 1, and an adhesive layer 2 A die bond layer 3 laminated on the pressure-sensitive adhesive layer 2 is provided in a state in which a part of the is exposed.

In the dicing die-bonding film 20 , a semiconductor wafer is affixed on the die-bonding layer 3 .

In cutting the semiconductor wafer using the dicing die-bonding film 20, the die-bonding layer 3 is also cut along with the semiconductor wafer. The die bond layer 3 is cut into a size corresponding to the size of a plurality of individual semiconductor chips. In this way, a semiconductor chip including the die bonding layer 3 can be obtained.

In the dicing die-bonding film 20 according to the present embodiment, the pressure-sensitive adhesive layer 2 has adhesiveness and holds the die-bonding layer 3 by sticking it.

In the dicing die bonding film 20 according to the present embodiment, the pressure-sensitive adhesive layer 2 contains an acrylic polymer.

In addition, in this specification, an acryl-type polymer is a polymer containing a (meth)acrylate monomer as a structural unit. (meth)acrylate is a concept containing methacrylate and acrylate. In specifying the claims,

The said acrylic polymer may contain monomers other than a (meth)acrylate monomer as a structural unit.

The pressure-sensitive adhesive layer 2 preferably contains 50% by mass or more of the acrylic polymer, more preferably 70% or more, and still more preferably 80% by mass or more.

Moreover, it is preferable that the adhesive layer 2 contains 95 mass % or less of the said acrylic polymer, and it is more preferable that it contains 90 mass % or less.

It is preferable that the said acrylic polymer is an ultraviolet-curable polymeric polymer (polymerizable acrylic polymer) which has a polymerizable unsaturated bond.

As said polymeric polymer, the polymer etc. which contain a polymerizable vinyl group or ethynyl group at the terminal of a main chain or a side chain are mentioned.

In addition, below, a polymeric vinyl group or an ethynyl group is generically called a polymeric group.

In addition, a polymerizable acrylic polymer can be obtained by copolymerizing a (meth)acrylate monomer and a polymerizable monomer.

In the acrylic polymer contained in the pressure-sensitive adhesive layer 2, the above structural units are analyzed by NMR analysis such as ¹ H-NMR and ¹³ C-NMR, pyrolysis GC/MS analysis, infrared spectroscopy (eg, FTIR method), and the like. can be confirmed by

In addition, the molar ratio of the structural unit mentioned above in the said acrylic polymer is normally computed from the compounding quantity (charged amount) at the time of superposing|polymerizing an acrylic polymer.

In this embodiment, it is preferable that the said acrylic polymer contains the structural unit of an alkyl (meth)acrylate.

The structural unit of the said alkyl (meth)acrylate originates in an alkyl (meth)acrylate monomer.

That is, the structure of the alkyl (meth)acrylate monomer after polymerization is the structural unit of the alkyl (meth)acrylate.

In the structural unit of the alkyl (meth)acrylate, the alkyl may be a saturated hydrocarbon or an unsaturated hydrocarbon.

For example, the alkyl is a straight-chain saturated hydrocarbon, a branched-chain saturated hydrocarbon, an alicyclic hydrocarbon, or an aromatic hydrocarbon. The alkyl is preferably a straight-chain saturated hydrocarbon or a branched-chain saturated hydrocarbon.

Moreover, the said alkyl may contain the polar group containing oxygen, nitrogen, etc.

As a structural unit of the said alkyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, n-octyl (meth)acrylate, for example rate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, n-nonyl (meth) acrylate, iso (sec) -nonyl (meth) acrylate, tert- nonyl (meth) acrylate, Isobornyl(meth)acrylate, n-decyl(meth)acrylate, iso(sec)-decyl(meth)acrylate, tert-decyl(meth)acrylate, n-undecyl(meth)acrylate, iso Each structural unit, such as (sec)-undecyl (meth)acrylate, tert-undecyl (meth)acrylate, and lauryl (meth)acrylate, is mentioned.

In this embodiment, the acrylic polymer preferably contains, among these various alkyl (meth)acrylate structural units, an alkyl (meth)acrylate having an alkyl group having 9 or more carbon atoms as a structural unit, and an alkyl group having 12 or more carbon atoms. It is more preferable to include an alkyl (meth)acrylate having as a structural unit.

In this embodiment, it is preferable that the said acrylic polymer contains 13 mol% or more of structural units of the alkyl (meth)acrylate which has a C9 or more alkyl group.

In the present embodiment, the acrylic polymer preferably contains 30 mol% or more of a structural unit of an alkyl (meth)acrylate having an alkyl group having 9 or more carbon atoms, and more preferably 40 mol% or more.

In this embodiment, it is preferable that the said acrylic polymer contains 80 mol% or less of structural units of the alkyl (meth)acrylate which has a C9 or more alkyl group.

In this embodiment, it is preferable that the said acrylic polymer contains 15 mol% or more of structural units of the alkyl (meth)acrylate which has a C12 or more alkyl group.

In this embodiment, it is preferable that the said acrylic polymer contains 30 mol% or more of structural units of the alkyl (meth)acrylate which has a C12 or more alkyl group, and it is more preferable that it contains 40 mol% or more.

In this embodiment, it is preferable that the said acrylic polymer contains 80 mol% or less of structural units of the alkyl (meth)acrylate which has a C12 or more alkyl group.

When the die-bonding layer 3 is peeled from the pressure-sensitive adhesive layer 2, the peeling force of the pressure-sensitive adhesive layer 2 relative to the die-bonding layer 3 can be further reduced by the acrylic polymer being the same as described above. have.

Thereby, a pick-up process can be performed more smoothly.

In addition, the upper limit of carbon number in the structural unit of the said alkyl (meth)acrylate is 18.

In this embodiment, it is preferable that the said acrylic polymer is comprised by the structural unit of an alkyl (meth)acrylate and the structural unit of a hydroxyl-containing (meth)acrylate.

When the acrylic polymer is structured in this way, it is preferable that the structural unit of the alkyl (meth)acrylate is an alkyl (meth)acrylate structural unit having an alkyl group having 9 or more and 14 or less carbon atoms.

In the acrylic polymer structured as described above, the structural unit of an alkyl (meth)acrylate having an alkyl group having 9 or more and 14 or less carbon atoms is preferably contained at 15 mol% or more, and more preferably 30 mol% or more. It is more preferable that 40 mol% or more is contained.

In the acrylic polymer structured in this way, it is preferable that the structural unit of an alkyl (meth)acrylate having an alkyl group of 9 or more and 14 or less carbon atoms is contained in an amount of 80 mol% or less.

In the acrylic polymer constituted in this way, the constituent unit of the hydroxyl group-containing (meth)acrylate is preferably contained at 10 mol% or more, and more preferably at 20 mol% or more.

When the die-bonding layer 3 is peeled from the pressure-sensitive adhesive layer 2, the peeling force of the pressure-sensitive adhesive layer 2 relative to the die-bonding layer 3 can be further reduced by the acrylic polymer being the same as described above. have.

Thereby, a pick-up process can be performed more smoothly.

In the structural unit of the said hydroxyl-containing (meth)acrylate, the hydroxyl group contained in this structural unit reacts easily with an isocyanate group.

Therefore, while containing what is comprised by the structural unit of the said alkyl (meth)acrylate and the structural unit of the said hydroxyl-containing (meth)acrylate as said acrylic polymer in the adhesive layer 2, isocyanate By containing the compound, the hydroxyl group in the structural unit of the hydroxyl group-containing (meth)acrylate reacts with the isocyanate group in the isocyanate compound, so that the pressure-sensitive adhesive layer 2 can be appropriately cured.

The structural unit of the said hydroxyl-containing (meth)acrylate originates in the hydroxyl-containing (meth)acrylate monomer.

That is, the structure of the hydroxyl group-containing (meth)acrylate monomer after polymerization is a structural unit of the hydroxyl group-containing (meth)acrylate.

It is preferable that the structural unit of the said hydroxyl-containing (meth)acrylate is a hydroxyl-containing C2-C4 alkyl (meth)acrylate structural unit.

In the structural units of the above hydroxyl group-containing C2 to C4 alkyl (meth)acrylates, the alkyl is usually a saturated hydrocarbon.

For example, the alkyl is a straight-chain saturated hydrocarbon or a branched-chain saturated hydrocarbon.

Moreover, it is preferable that the said alkyl does not contain the polar group containing oxygen, nitrogen, etc.

In the structural unit of the above hydrogen group-containing (meth)acrylate, the hydroxyl group may be bonded to any carbon of the alkyl, but is preferably bonded to the terminal carbon of the alkyl.

As a structural unit of the said hydroxyl-containing (meth)acrylate, for example, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxy n-butyl (meth)acrylate, or hydroxy iso- and structural units such as hydroxybutyl (meth)acrylate such as butyl (meth)acrylate.

Among these structural units of hydroxyl group-containing (meth)acrylate, a structural unit of hydroxyethyl (meth)acrylate is preferable, and a structural unit of 2-hydroxyethyl (meth)acrylate is more preferable.

In the present embodiment, the acrylic polymer is composed of a structural unit of an alkyl (meth)acrylate, a structural unit of a hydroxyl group-containing (meth)acrylate, and a structural unit of a polymerizable group-containing (meth)acrylate. it is desirable

Since the acrylic polymer contains a structural unit of polymerizable group-containing (meth)acrylate, the pressure-sensitive adhesive layer 2 is irradiated with active energy rays (eg, ultraviolet rays) before the pick-up step. ) can be cured.

Specifically, the pressure-sensitive adhesive layer 2 can be cured by irradiating the pressure-sensitive adhesive layer 2 with active energy rays (eg, ultraviolet rays) to crosslink the acrylic polymers contained in the pressure-sensitive adhesive layer 2 with each other. .

It is preferable that the adhesive layer 2 contains the photoinitiator from a viewpoint of making it easy to advance a crosslinking reaction more. Since the pressure-sensitive adhesive layer 2 contains a photopolymerization initiator, radicals are generated from the photopolymerization initiator by irradiation with active energy rays (eg, ultraviolet rays), and crosslinking of the acrylic polymers is effected by the action of the radicals. The reaction can proceed further.

When the pressure-sensitive adhesive layer 2 is cured by irradiation with active energy rays (eg, ultraviolet rays) in this way, the adhesive force of the pressure-sensitive adhesive layer 2 to the die-bonding layer 3 is reduced. As a result, the semiconductor chip provided with the die bonding layer can be easily picked up from the pressure-sensitive adhesive layer 2 .

In addition, before irradiation with active energy rays (eg, ultraviolet rays), in the pressure-sensitive adhesive layer 2, since the crosslinking reaction between the acrylic polymers does not sufficiently proceed, the pressure-sensitive adhesive layer 2 has sufficient adhesiveness. , and the die bonding layer 3 can be sufficiently adhered and held.

The constituent unit of the polymerizable group-containing (meth)acrylate may be formed by binding a functional group capable of bonding with a hydroxyl group and a monomer having a polymerizable functional group in a molecule to the constituent unit of the hydroxyl group-containing (meth)acrylate.

It is preferable that the functional group bondable to the hydrogen bond is an isocyanate group having a relatively high reactivity with a hydroxyl group. In such a case, the constituent unit of the polymerizable group-containing (meth)acrylate preferably has an isocyanate group and a polymerizable group functional group at both molecular terminals.

Moreover, it is preferable that the said polymerizable functional group is a vinyl group. In such a case, the structural unit of the polymerizable group-containing (meth)acrylate preferably has an isocyanate group and a vinyl group at both molecular terminals.

In addition, a part of (meth)acryloyl group may be sufficient as the said vinyl group.

The structural unit of the polymerizable group-containing (meth)acrylate contains an isocyanate group as the hydroxyl group in the structural unit of the hydroxyl group-containing (meth)acrylate, and the isocyanate group in the structural unit of the polymerizable group-containing (meth)acrylate is urethane You may have a combined molecular structure.

In addition, below, the polymerizable group-containing (meth)acrylate monomer containing an isocyanate group may be referred to as an isocyanate group-containing (meth)acrylate monomer.

The alkyl-based polymer is constituted by the structural unit of the alkyl (meth) acrylate, the structural unit of the hydroxyl group-containing (meth) acrylate, and the structural unit of the polymerizable group-containing (meth) acrylate. In this case, it can be obtained as follows.

Specifically, an alkyl (meth)acrylate monomer and a hydroxyl group-containing (meth)acrylate monomer are polymerized to form an alkyl (meth)acrylate structural unit and an alkyl containing a hydroxyl group-containing (meth)acrylate structural unit. After obtaining the intermediate of the alkyl-based polymer, the alkyl-based polymer can be obtained by subjecting the intermediate of the alkyl-based polymer to a polymerization reaction between the isocyanate group-containing (meth)acrylate monomer.

That is, the acrylic polymer can be obtained by carrying out the polymerization reaction in two steps.

In the polymerization reaction between the acrylic polymer intermediate and the isocyanate group-containing (meth)acrylate monomer, the hydroxyl group in the acrylic polymer intermediate and the isocyanate group of the isocyanate group-containing (meth)acrylate monomer form a urethane bond. It can be done by doing

The isocyanate group-containing (meth)acrylate monomer preferably has one isocyanate group and one (meth)acryloyl group in its molecule.

Examples of such an isocyanate group-containing (meth)acrylate monomer include 2-isocyanatoethyl (meth)acrylate and 4-acryloylmorpholine.

It is preferable that the adhesive layer 2 contains an isocyanate compound.

The said isocyanate compound may be in the state after a part reacted by urethanization reaction etc.

It is preferable that the said isocyanate compound contains a some isocyanate group in a molecule|numerator. By including a plurality of isocyanate groups, when the acrylic polymer has a structural unit of the hydroxyl group-containing (meth)acrylate, a crosslinking reaction between the acrylic polymers in the pressure-sensitive adhesive layer 2 can be promoted. .

Specifically, an isocyanate compound containing a plurality of isocyanate groups is obtained by reacting one isocyanate group of the isocyanate compound with a hydroxyl group of one acrylic polymer and reacting another isocyanate group of the isocyanate compound with a hydroxyl group of another acrylic polymer. A crosslinking reaction can proceed.

That is, the isocyanate compound functions as a crosslinking agent.

The pressure-sensitive adhesive layer 2 preferably contains 0.1 part by mass or more and 5 parts by mass or less, more preferably 0.5 part by mass or more and 3 parts by mass or less, based on 100 parts by mass of the acrylic polymer, of the isocyanate compound. , It is more preferable to include 0.75 parts by mass or more and 2 parts by mass or less.

As said isocyanate compound, diisocyanate, such as aliphatic diisocyanate, alicyclic diisocyanate, or aromatic diisocyanate, is mentioned.

Examples of the aliphatic diisocyanates include ethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, and 2,6-diisocyanate. A methyl natocaproate etc. are mentioned.

Examples of the alicyclic diisocyanate include 3-isocyanatomethyl-3,5,5-trimethylcyclohexane, 1,3-bis(isocyanatomethyl)cyclohexane, and 1,4-bis(isocyanatomethyl)cyclohexane. Hexane, methylcyclohexane-2,4-diisocyanate, methylcyclohexane-2,6-diisocyanate, dicyclohexanemethane-4,4'-diisocyanate, 1,3-diisocyanatocyclohexane, 1,4 - Diisocyanatocyclohexane etc. are mentioned.

Examples of the aromatic diisocyanate include m-phenylene diisocyanate, p-phenylene diisocyanate, diphenylmethane-4,4'-diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, and 1,3' -bis(isocyanatomethyl)benzene, 1,4'-bis(isocyanatomethyl)benzene, 1,3-bis(α-isocyanatoisopropyl)benzene, 1,4-(α-isocyanato isopropyl), etc.

Moreover, triisocyanate is mentioned as said isocyanate compound.

Examples of the triisocyanate include triphenylmethane-4,4',4"-triisocyanate, 1,3,5-triisocyanatobenzene, 1,3,5-tris(isocyanatomethyl)cyclohexane, and 1,3 ,5-tris(isocyanatomethyl)benzene, 2,6-diisocyanatocaproic acid-2-isocyanatoethyl, etc. are mentioned.

Moreover, as said isocyanate compound, polymeric polyisocyanate, such as a dimer and trimer of diisocyanate, polymethylene polyphenylene polyisocyanate, etc. are mentioned.

Moreover, as said isocyanate compound, polyisocyanate obtained by making an excessive amount of said isocyanate compound and an active hydrogen containing compound react is mentioned.

Examples of the active hydrogen-containing compound include ethylene glycol, propylene glycol, dipropylene glycol, diethylene glycol, triethylene glycol, 2,2,4-trimethyl-1,3-pentanediol, neopentyl glycol, hexanediol, and cyclohexanediol. Methanol, cyclohexanediol, hydrogenated bisphenol A, xylylene glycol, glycerin, trimethylolethane, trimethylolpropane, hexanetriol, pentaerythritol, sorbitol, sorbitol, sucrose, castor oil, ethylenediamine, hexamethylenediamine , diethanolamine, triethanolamine, water, ammonia, urea, and the like.

Further, various polyether polyols, polyester polyols, polyurethane polyols, acrylic polyols, epoxy polyols, and the like can be mentioned.

Moreover, as said diisocyanate compound, allophanated polyisocyanate, buretized polyisocyanate, etc. can be used.

The said various isocyanate compounds may be used only by 1 type, and may be used in combination of 2 or more type.

As said isocyanate compound, it is preferable that it is a reaction material of the said aromatic diisocyanate and the said active hydrogen containing compound.

Since such a reactant has a relatively slow reaction rate of an isocyanate group, when it is included in the adhesive layer 2, it can suppress that a hardening reaction advances excessively in the adhesive layer 2.

As such a reactant, it is preferable to use one containing three or more isocyanate groups in the molecule.

As described above, the pressure-sensitive adhesive layer 2 preferably contains a photopolymerization initiator from the viewpoint of making it easier to advance the crosslinking reaction between the acrylic polymers.

Examples of the photopolymerization initiator include α-ketol compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, benzophenone compounds, thioxanthone compounds, and camphorquinone. , halogenated ketones, acylphosphine oxides, and acylphosphonates.

As an α-ketol compound, for example, 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, α-hydroxy-α,α'-dimethylacetophenone, 2-methyl- 2-hydroxypropiophenone, and 1-hydroxycyclohexylphenyl ketone.

As an acetophenone compound, for example, methoxy acetophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2,2-diethoxy acetophenone, 2-methyl-1-[4 -(methylthio)-phenyl]-2-morpholinopropane-1, and 2-hydroxy-1-(4-(4-(2-hydroxy-2methylpropionyl)benzoyl)phenyl)-2- and methylpropan-1-one.

As a benzoin ether type compound, benzoin ethyl ether, benzoin isopropyl ether, and anisoin methyl ether is mentioned, for example.

As a ketal compound, a benzyl dimethyl ketal compound is mentioned, for example.

As an aromatic sulfonyl chloride type compound, 2-naphthalene sulfonyl chloride is mentioned, for example.

Examples of the photoactive oxime-based compound include 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime.

Examples of the benzophenone-based compound include benzophenone, benzoinbenzoic acid, and 3,3'-dimethyl-4-methoxybenzophenone.

As a thioxanthone compound, for example, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone xanthone, 2,4-diethylthioxanthone, and 2,4-diisopropylthioxanthone.

Among these, 2-hydroxy-1-(4-(4-(2-hydroxy-2methylpropionyl)benzoyl)phenyl)-2-methylpropan-1-one (as a commercial item, IGM Resins Omnirad 127) is preferred.

The pressure-sensitive adhesive layer 2 preferably contains 0.1 parts by mass or more and 10 parts by mass or less, and more preferably contains 0.5 parts by mass or more and 7 parts by mass or less, based on 100 parts by mass of the acrylic polymer, of the photopolymerization initiator. It is more preferable to include 0.75 parts by mass or more and 5 parts by mass or less.

The pressure-sensitive adhesive layer 2 may contain components other than those described above.

Examples of the other components include a plasticizer, a filler, an antiaging agent, an antioxidant, an ultraviolet absorber, a light stabilizer, a heat stabilizer, an antistatic agent, a surfactant, and an easy peeling agent.

The thickness of the pressure-sensitive adhesive layer 2 is preferably 1 μm or more and 50 μm or less, more preferably 2 μm or more and 30 μm or less, and still more preferably 5 μm or more and 25 μm or less.

The thickness of the pressure-sensitive adhesive layer 2 can be obtained by, for example, measuring the thickness of five randomly selected points using a dial gauge (model R-205 manufactured by PEACOCK) and arithmetic averaging these thicknesses. .

In the dicing die-bonding film 20 according to the present embodiment, FTIR analysis is performed on each of the exposed portion of the pressure-sensitive adhesive layer 2 and the laminated portion with the die-bonding layer 3, and the pressure-sensitive adhesive layer 2 The sum of all peak heights appearing in the range of 675 cm ^{-1 or more and 900 cm -1 or} less in the exposed part of the H1, and 1600 cm ^-1 or more and 1800 cm ^-1 or less in the exposed part of the pressure-sensitive adhesive layer (2) The peak height appearing in the range is T1, the sum of all peak heights appearing in the range of 675 cm ^{-1 or more and 900 cm -1 or} less in the laminated portion with the die bonding layer 3 is H2, and the die bonding layer ( When the peak height appearing in the range of 1600 cm ^-1 or more and 1800 cm ^-1 or less in the laminated portion with 3) is T2, the value of R calculated by the following formula (1) is 1.5 or less.

The FTIR analysis can be performed by employing the following conditions using a Fourier transform infrared spectrophotometer (manufactured by Thermo Scientific, trade name "Nicolet iS10 FT-IR") as a measuring device.

・Measurement light: polarization

・Measurement Mode: Total Reflection Attenuation Spectroscopy (ATR)

Measurement range: 600 cm ^-1 to 4000 cm ^-1

・Measurement interval: every 0.5 cm ^-1

In addition, the peak heights T1 and T2 and the sum total of all peak heights H1 and H2 are the data on the exposed portion of the pressure-sensitive adhesive layer 2 obtained when the FTIR analysis was performed as described above, and the die-bonding layer ( After plotting the data related to the layered portion with 3) on a graph in which the abscissa is the wave number (unit is cm ^-1 ) and the ordinate is the detected intensity (abs), the data plotted for each data series are connected. It can be obtained by drawing a curve and analyzing each curve.

When a plurality of peaks are confirmed in the range of 1600 cm ^-1 or more and 1800 cm ^-1 or less, the peak heights T1 and T2 can be measured by obtaining the height (detection intensity) of the highest peak among the plurality.

In addition, the peak height means the height of the peak from the axis representing the wavenumber (horizontal axis).

In addition, the sum of all peak heights H1 and H2 is on each curve in the range of 675 cm ^-1 or more and 900 cm ^-1 or less, that is, the curve for the exposed portion of the pressure-sensitive adhesive layer 2 and the die-bonding layer 3 ) can be obtained by calculating the sum of the heights of all upwardly convex peaks appearing on the curve for the stacked portion.

The peak heights T1 and T2 and the sum of all peak heights H1 and H2 are obtained by arithmetic averaging of the values obtained for five randomly selected locations.

In addition, regarding the laminated portion with the die-bonding layer 3, on one side of the die-bonding layer 3 (surface on the side not in contact with the pressure-sensitive adhesive layer 2), a peeling tape (for example, a tape) is applied. The product name "ELP BT-315" manufactured by Todenko Co., Ltd. is attached, and the die-bonding layer 3 is peeled off from the pressure-sensitive adhesive layer 2 while lightly applying force by hand, thereby revealing the exposed surface of the pressure-sensitive adhesive layer 2 , the above FTIR analysis is performed on five randomly selected locations from the exposed surface.

In addition, when FT-IR analysis is performed, the peak appearing in the range of 675 cm ^-1 or more and 900 cm ^-1 or less means a peak derived from an aromatic compound, and appears in the range of 1600 cm ^-1 or more and 1800 cm ^-1 or less The peak (the highest peak when a plurality of peaks are identified) means a peak derived from a carbonyl group.

From this point, in the above formula (1), H1 / T1 means the ratio of the amount of the aromatic compound to the amount of the acrylic polymer in the exposed portion of the pressure-sensitive adhesive layer 2, H2 / T2 is, It means the ratio of the amount of the aromatic compound to the amount of the acrylic polymer in the laminated portion with the die bonding layer 3.

That is, the value of R calculated in the above formula (1) is 1.5 or less, the amount of the aromatic compound based on the amount of the acrylic polymer in the laminated portion with the die bonding layer 3 is the pressure-sensitive adhesive layer ( This means that it is a value relatively close to the amount of aromatic compound based on the amount of acrylic polymer in the exposed portion of 2).

From these points, it is preferable that the value of R calculated by said Formula (1) is 1.4 or less, and it is more preferable that it is 1.3 or less.

In addition, the lower limit value is 1 in that the value of R calculated by the above formula (1) varies due to the migration of components from the die bond layer 3 to the pressure-sensitive adhesive layer 2, as will be described later.

In addition, the value of R calculated by the formula (1) is determined by setting the pressure-sensitive adhesive layer 2 to contain an acrylic polymer and the die-bonding layer 3 to contain an aromatic compound, then the die-bonding layer It can be adjusted by appropriately adjusting the quantity of the aromatic compound contained in (3).

In addition, the value of R is the structural unit of an alkyl (meth)acrylate having an alkyl group of 9 or more carbon atoms or an alkyl (meth)acrylate having an alkyl group of 12 or more carbon atoms for the acrylic polymer contained in the pressure-sensitive adhesive layer 2. By including the structural unit, it becomes easier to adjust.

The pressure-sensitive adhesive layer 2 can be obtained by applying the pressure-sensitive adhesive composition containing each component as described above to the surface of a resin film or the like using an applicator or the like, and then drying the pressure-sensitive adhesive composition after application.

The die bond layer 3 contains a resin component.

The die bonding layer 3 preferably has thermosetting properties.

The die bonding layer 3 can be made thermosetting by including at least one of a thermosetting resin and a thermoplastic resin having a thermosetting functional group in the die bonding layer 3 .

When the die-bonding layer 3 contains a thermosetting resin, examples of such a thermosetting resin include epoxy resins, phenol resins, amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, and thermosetting polyimide resins. can be heard Among these, it is preferable to use an epoxy resin.

Examples of the epoxy resin include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolac type, Orthocresol novolak type, trishydroxyphenylmethane type, tetraphenylolethane type, hydantoin type, trisglycidyl isocyanurate type, and glycidylamine type epoxy resins.

As a phenol resin, polyoxystyrene, such as a novolak-type phenol resin, a resol-type phenol resin, and polyparaoxystyrene, is mentioned, for example.

In addition, a phenol resin functions as a curing agent for an epoxy resin.

When the die-bonding layer 3 contains a thermoplastic resin having a thermosetting functional group, examples of such a thermoplastic resin include a thermosetting functional group-containing acrylic resin. As an acrylic resin in a thermosetting functional group containing acrylic resin, what contains the monomer unit derived from (meth)acrylic acid ester is mentioned.

In a thermosetting resin having a thermosetting functional group, a curing agent is selected according to the type of the thermosetting functional group.

Examples of (meth)acrylic acid esters include (meth)acrylic acid alkyl esters, (meth)acrylic acid cycloalkyl esters, and (meth)acrylic acid aryl esters. The said acrylic resin may contain the monomer unit derived from the other component copolymerizable with (meth)acrylic acid ester. Examples of the other components include carboxy group-containing monomers, acid anhydride monomers, hydroxyl group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, functional group-containing monomers such as acrylamide and acrylonitrile, and various polyfunctional A monomer etc. are mentioned. From the viewpoint of realizing high cohesive force in the die-bonding layer, the acrylic resin is a (meth)acrylic acid ester (particularly, a (meth)acrylic acid alkyl ester having 4 or less carbon atoms in an alkyl group), a carboxyl group-containing monomer, and a nitrogen atom-containing monomer. It is preferably a copolymer of a monomer and a polyfunctional monomer (particularly, a polyglycidyl-based polyfunctional monomer), and is composed of ethyl acrylate, butyl acrylate, acrylic acid, acrylonitrile, and polyglycidyl (meth)acrylate. It is more preferable that it is a copolymer.

The die-bonding layer 3 may contain a thermal curing catalyst (curing accelerator) from the viewpoint of sufficiently advancing the curing reaction of the resin component or increasing the curing reaction rate. Examples of the thermal curing catalyst include imidazole-based compounds, phosphorus-based compounds, amine-based compounds, and trihalogen borane-based compounds.

The die bond layer 3 preferably contains the phosphorus compound.

Examples of the phosphorus compound include triphenylphosphine (TPP), tri(p-tolyl)phosphine (TPTP), tetraphenylphosphonium tetraphenylborate (TPP-K), and tetrabutylphosphonium laurate (TBPLA). , and tetrabutylphosphonium hydrogen hexahydronaphthalate (TBS-3S).

The die bond layer 3 may contain an imidazole-based compound as the thermal curing catalyst.

Examples of the imidazole-based compound include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, and 2-ethyl-4-methyl. Midazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2 -methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methyl Imidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2 ,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methyl Midazolyl-(1′)]-ethyl-s-triazineisocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxy and methylimidazole.

The die bonding layer 3 may contain a thermoplastic resin as the resin component. The thermoplastic resin functions as a binder. As the thermoplastic resin, for example, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, thermoplastic polyimide resins, polyamide resins such as polyamide 6 and polyamide 6,6, phenoxy resins, acrylic resins, saturated polyester resins such as PET and PBT, polyamideimide resins, and fluororesins. As for the said thermoplastic resin, only 1 type may be used, and 2 or more types may be used in combination. As the thermoplastic resin, an acrylic resin is preferable from the viewpoint of making it easy to secure connection reliability by the die bonding layer 3 because it contains few ionic impurities and has high heat resistance.

It is preferable that the said acrylic resin is a polymer which contains the monomer unit derived from (meth)acrylic acid ester as the most monomer unit by mass ratio.

As (meth)acrylic acid ester, the thing similar to what was mentioned above can be used.

The die bond layer 3 may contain one or two or more other components as needed. As other components, a flame retardant, a silane coupling agent, and an ion trap agent are mentioned, for example.

In the dicing die-bonding film 20 according to the present embodiment, it is important that the die-bonding layer 3 contains an aromatic compound.

In addition, in this specification, an aromatic compound means an aromatic hydrocarbon and a heteroaromatic compound.

By including an aromatic compound as the resin component in the die bond layer 3 or including an aromatic compound as the thermosetting catalyst, the die bond layer 3 contains the aromatic compound.

As resin as an aromatic ring compound, an epoxy resin, a phenol resin, etc. are mentioned.

Examples of the thermal curing catalyst as an aromatic compound include the above-described imidazole-based compounds and the above-described phosphorus-based compounds.

When the dicing die-bonding film 20 according to the present embodiment peels the die-bonding layer 3 from the pressure-sensitive adhesive layer 2, the peeling force of the pressure-sensitive adhesive layer 2 relative to the die-bonding layer 3 is sufficiently reduced. Regarding the reason which can decrease, the present inventors presume as follows.

In the conventional dicing die-bonding film 20, from the viewpoint of enhancing the affinity between the die-bonding layer 3 and the pressure-sensitive adhesive layer 2, the polarity (surface free energy) of the die-bonding layer 3 and the pressure-sensitive adhesive layer ( In many cases, the configuration of the die-bonding layer 3 and the configuration of the pressure-sensitive adhesive layer 2 are determined such that the difference in polarity (surface free energy) of 2) is relatively small.

Further, in the dicing die-bonding film 20, the die-bonding layer 3 is constituted to contain an aromatic compound, and the pressure-sensitive adhesive layer 2 is constituted to contain an acrylic polymer in many cases.

In the dicing die-bonding film 20 structured as described above, since the difference between the polarity of the die-bonding layer 3 and the polarity of the pressure-sensitive adhesive layer 2 is small, the die-bonding layer 3 is the pressure-sensitive adhesive layer 2 It is considered that the aromatic compound contained in the die-bonding layer 3 is easily transferred to the pressure-sensitive adhesive layer 2 in the state of being laminated on top (mainly, the thermal curing catalyst as the aromatic compound is easily transferred to the component I think there is).

Here, when the aromatic compound contained in the die-bonding layer 3 is transferred to the pressure-sensitive adhesive layer 2, the surface of the die-bonding layer 3 (the contact with the pressure-sensitive adhesive layer 2) depends on the amount of the aromatic compound transferred to the pressure-sensitive adhesive layer 2. It is thought that the concave portion is formed in the contact surface). That is, in the conventional dicing die-bonding film 20, the aromatic compound contained in the die-bonding layer 3 is easily transferred to the pressure-sensitive adhesive layer 2, so that the surface of the die-bonding layer 3 , it is considered that a relatively large concave portion is formed.

Then, when a relatively large concave portion is formed on the surface of the die-bonding layer 3, as described above, when the difference between the polarity of the die-bonding layer 3 and the polarity of the pressure-sensitive adhesive layer 2 is relatively small, the pressure-sensitive adhesive layer 2 It is thought that a part of it becomes easy to infiltrate into the said recessed part.

In this way, in a state where a part of the pressure-sensitive adhesive layer 2 penetrates into the concave portion, when the pressure-sensitive adhesive layer 2 is irradiated with active energy rays such as ultraviolet rays to cure the pressure-sensitive adhesive layer 2, the die-bonding layer 3 It is thought that a relatively large anchoring effect occurs between the pressure-sensitive adhesive layer 2 and the pressure-sensitive adhesive layer 2 .

As a result, it is considered that the peeling force of the pressure-sensitive adhesive layer 2 to the die-bonding layer 3 cannot be sufficiently reduced.

In contrast, in the dicing die-bonding film 20 according to the present embodiment, FTIR analysis is performed on each of the exposed portion of the pressure-sensitive adhesive layer 2 and the laminated portion with the die-bonding layer 3, and the pressure-sensitive adhesive layer ( The sum of all peak heights appearing in the range of 675 cm ^{-1 or more and 900 cm -1 or} less in the exposed portion of 2) is H1, and 1600 cm ^-1 or more in the exposed portion of the pressure-sensitive adhesive layer (2) 1800 cm ^-1 The peak height appearing in the following range is T1, the sum of all peak heights appearing in the range of 675 cm ^{-1 or more and 900 cm -1 or} less in the laminated portion with the die bond layer 3 is H2, When the peak height appearing in the range of 1600 cm ^-1 or more and 1800 cm ^-1 or less in the laminated portion with the layer (3) is T2, the value of R calculated by the following formula (1) is 1.5 or less.

As described above, in the following formula (1), H1/T1 means the ratio of the amount of the aromatic compound to the amount of the acrylic polymer in the exposed portion of the pressure-sensitive adhesive layer 2, and H2/T2 is , means the ratio of the amount of the aromatic compound to the amount of the acrylic polymer in the laminated portion with the die-bonding layer 3.

That is, the value of R calculated by the following formula (1) is 1.5 or less, the amount of the aromatic compound based on the amount of the acrylic polymer in the laminated portion with the die-bonding layer 3 is the pressure-sensitive adhesive layer ( This means that it is a value relatively close to the amount of aromatic compound based on the amount of acrylic polymer in the exposed portion of 2).

From this point of view, in the dicing die-bonding film 20 according to the present embodiment, since migration of the aromatic compound from the die-bonding layer 3 to the pressure-sensitive adhesive layer 2 can be relatively suppressed, the die-bonding layer 3 It is considered that the concave portion formed on the surface of ) becomes relatively small, and the anchor effect that occurs between the die-bonding layer 3 and the pressure-sensitive adhesive layer 2 becomes relatively small.

As a result, when peeling the die-bonding layer 3 from the pressure-sensitive adhesive layer 2, the present inventors estimate that the peeling force of the pressure-sensitive adhesive layer 2 relative to the die-bonding layer 3 can be sufficiently reduced. .

The die bonding layer 3 may contain a filler.

By changing the amount of filler contained in the die-bonding layer 3, the elasticity and viscosity of the die-bonding layer 3 can be more easily adjusted.

In addition, the physical properties of the die bond layer 3, such as conductivity, thermal conductivity, and modulus of elasticity, can be adjusted.

As a filler, an inorganic filler and an organic filler are mentioned. As a filler, an inorganic filler is preferable.

Examples of the inorganic filler include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, boron nitride, and silica such as crystalline silica and amorphous silica. Fillers containing

Moreover, as a material of an inorganic filler, simple metals, alloys, etc., such as aluminum, gold, silver, copper, and nickel, are mentioned.

The inorganic filler may be an aluminum borate whisker, amorphous carbon black, or graphite.

The shape of the filler may be various shapes such as spherical shape, acicular shape, and flake shape.

As a filler, only said 1 type may be used, and you may use it in combination of said 2 or more types.

It is preferable that they are 0.005 micrometer or more and 10 micrometers or less, and, as for the average particle diameter of the said filler, it is more preferable that they are 0.005 micrometer or more and 1 micrometer or less.

When the filler has an average particle diameter of 0.005 μm or more, wettability and adhesiveness to an adherend such as a semiconductor wafer can be further improved.

In addition, when the filler has an average particle diameter of 10 μm or less, not only can the characteristics of the filler incorporated be exhibited more sufficiently, but also the heat resistance of the die-bonding layer 3 can be further exhibited.

The average particle diameter of the filler can be obtained using, for example, a photometric particle size distribution analyzer (eg, product name "LA-910", manufactured by Horiba Seisakusho Co., Ltd.).

When the die-bonding layer 3 contains a filler, the content is preferably 30% by mass or more and 70% by mass or less, and 40% by mass or more and 60% by mass or less, based on the total mass of the die-bonding layer 3. It is more preferable, and it is more preferable that it is 42 mass % or more and 55 mass % or less.

The thickness of the die bonding layer 3 is not particularly limited, but is, for example, 1 μm or more and 200 μm or less. This thickness may be 3 μm or more and 150 μm or less, or 5 μm or more and 135 μm or less.

In addition, the die-bonding layer 3 can be obtained by applying an adhesive composition containing the above components to a surface of a resin film or the like using an applicator or the like, and then drying the adhesive composition after application.

In addition, the attachment of the die-bonding layer 3 to the pressure-sensitive adhesive layer 2 can be performed by laminating the die-bonding layer 3 on the pressure-sensitive adhesive layer 2 produced as described above.

The substrate layer 1 supports the pressure-sensitive adhesive layer 2 .

The substrate layer 1 is made of metal foil, fiber sheet, rubber sheet, or resin film.

It is preferable that the base material layer 1 is produced using a resin film.

The substrate layer 1 may have a single layer structure or a laminated structure.

Examples of the fibrous sheet include those made of paper, woven fabric, or nonwoven fabric.

Examples of the material of the resin film include polyolefins such as polyethylene, polypropylene, and ethylene-propylene copolymers; Ethylene copolymers, such as an ethylene-vinyl acetate copolymer, an ionomer resin, an ethylene-(meth)acrylic acid copolymer, an ethylene-(meth)acrylic acid ester random copolymer, and an ethylene-(meth)acrylic acid ester alternating copolymer; polyesters such as polyethylene terephthalate, polyethylene naphthalate, and polybutylene terephthalate; polyacrylate; polyvinyl chloride (PVC); Polyurethane; polycarbonate; polyphenylene sulfide; polyamides such as aliphatic polyamides and wholly aromatic polyamides (aramids); polyether ether ketone; polyimide; polyetherimide; polyvinylidene chloride; ABS (acrylonitrile-butadiene-styrene copolymer); cellulose or cellulose derivatives; silicone-containing polymers; A fluorine-containing polymer etc. are mentioned.

These may be used only by 1 type, and may be used in combination of 2 or more types.

When the substrate layer 1 is made of a resin film, the substrate layer 1 may be obtained by non-stretch molding or by stretch molding, but is preferably obtained by stretch molding.

Even if surface treatment is given to the surface (hereinafter, simply referred to as "surface") on the side on which the pressure-sensitive adhesive layer 2 in the base material layer 1 is laminated, from the viewpoint of improving adhesion with the pressure-sensitive adhesive layer 2. do.

As the surface treatment, chemical methods such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, or oxidation treatment by physical methods or the like may be employed.

Further, as the surface treatment, coating treatment with a coating agent such as an anchor coating agent, a primer, or an adhesive may be performed.

On the side of the substrate layer 1 on which the pressure-sensitive adhesive layer 2 is not laminated (hereinafter, simply referred to as 'rear surface'), in order to improve peelability, a release agent (release agent) such as a silicone resin or a fluororesin, etc. The coating treatment may be performed by

The thickness of the substrate layer 1 is preferably 55 μm or more and 195 μm or less, more preferably 55 μm or more and 190 μm or less, still more preferably 55 μm or more and 170 μm or less, and optimally 60 μm or more and 160 μm or less. . The dicing tape 10 can be efficiently manufactured by making the thickness of the base material layer 1 into the above range.

In addition, the die bonding layer 3 of the dicing die bonding film 20 can be cut efficiently.

The thickness of the substrate layer 1 can be obtained by, for example, measuring the thickness of five randomly selected points using a dial gauge (model R-205 manufactured by PEACOCK) and arithmetic averaging these thicknesses. .

The dicing die bond film 20 according to the present embodiment is used as an auxiliary tool for manufacturing semiconductor integrated circuits, for example. Hereinafter, specific examples of use of the dicing die bond film 20 will be described.

Below, the example using the dicing die-bonding film 20 in which the base material layer 1 is one layer is demonstrated.

A method of manufacturing a semiconductor integrated circuit includes a half-cutting process of forming a groove in a semiconductor wafer to process the semiconductor wafer into chips (dies) by a cutting process, and a back to reduce the thickness by grinding the semiconductor wafer after the half-cutting process. Mounting step of fixing the semiconductor wafer to the dicing tape 10 by attaching one surface of the semiconductor wafer after the grinding step and the back-grinding step (eg, the surface on the opposite side to the circuit surface) to the die bond layer 3 And, the expand process of widening the gap between semiconductor chips, the kerf holding process of maintaining the gap between semiconductor chips, and the die bond layer 3 by separating between the die bond layer 3 and the pressure-sensitive adhesive layer 2 A pick-up step of taking out the semiconductor chip (die) in this attached state, and a die-bonding step of bonding the semiconductor chip (die) with the die-bonding layer 3 attached to an adherend. When performing these processes, the dicing tape (dicing die bond film) of this embodiment is used as a manufacturing auxiliary tool.

In the half-cutting process, as shown in Figs. 2A and 2B, a half-cutting process is performed to cut the semiconductor integrated circuit into small pieces (dies). In detail, the tape T for a wafer process is affixed to the surface on the opposite side to the circuit surface of the semiconductor wafer W (refer FIG. 2A). Further, the dicing ring R is attached to the tape T for wafer processing (see Fig. 2A). In the state where the tape T for a wafer process is stuck, the groove|channel for division|segmentation is formed (refer FIG. 2B). In the back grinding step, as shown in FIGS. 2C and 2D , the thickness of the semiconductor wafer is reduced by grinding. In detail, while the back grind tape G is affixed on the surface in which the groove was formed, the tape T for a wafer process affixed first is peeled off (refer to FIG. 2C). With the back grind tape G attached, grinding is performed until the semiconductor wafer W has a predetermined thickness (see Fig. 2D).

Further, in the back-grind process, when the thickness of the semiconductor wafer is particularly thin, such as 20 µm or more and 30 µm or less, in the pick-up process described later, when the semiconductor chip is pushed up using the pin member P, the semiconductor chip Although deformation or cracking tends to occur, since the dicing die-bonding film 20 according to the present embodiment is configured as described above, it is possible to relatively suppress deformation or cracking in the semiconductor chip in the pick-up process. can

In the mounting process, as shown in FIGS. 3A to 3B, after attaching the dicing ring R to the pressure-sensitive adhesive layer 2 of the dicing tape 10, the surface of the exposed die bond layer 3 , the semiconductor wafer W subjected to half-cut processing is attached (see Fig. 3A). Then, the back grind tape G is peeled from the semiconductor wafer W (refer to FIG. 3B).

In the expand process, as shown in Figs. 4A to 4C, the dicing ring R is fixed to the holder H of the expander. The dicing die-bonding film 20 is stretched so as to be expanded in the plane direction by pushing up the dicing die-bonding film 20 from the lower side using the pushing member U provided in the expander (FIG. 4B). Reference). In this way, the half-cut semiconductor wafer W is cut under a specific temperature condition. The temperature conditions are, for example, -20 to 5°C, preferably -15 to 0°C, and more preferably -10 to -5°C. The expanded state is released by lowering the lifting member U (see FIG. 4C).

Further, in the expand step, as shown in FIGS. 5A and 5B , the dicing tape 10 is formed to expand the area under a higher temperature condition (for example, room temperature (23±2° C.)). stretch it In this way, the adjacent semiconductor chips that have been cut are separated in the plane direction of the film plane, further widening the interval.

In the cuff holding step, as shown in FIG. 6, hot air (for example, 100 to 130 ° C., shown by arrows) is blown onto the dicing tape 10 to heat-shrink the dicing tape 10, and then cooled and solidified. , a distance (kerf) between adjacent cut semiconductor chips is maintained.

In the pick-up process, as shown in FIG. 7 , the semiconductor chip in a state where the die bonding layer 3 is attached is peeled from the pressure-sensitive adhesive layer 2 of the dicing tape 10 . In detail, the pin member P is raised, and the semiconductor chip to be picked up is pushed up through the dicing tape 10 . The pushed-up semiconductor chip is held by a suction jig J.

In the dicing die-bonding film 20 according to the present embodiment, FTIR analysis is performed on each of the exposed portion of the pressure-sensitive adhesive layer 2 and the laminated portion with the die-bonding layer 3, and the The sum of all peak heights appearing in the range of 675 cm ^{-1 or more and 900 cm -1 or} less in the exposed portion is H1, and the range of 1600 cm ^-1 or more and 1800 cm ^-1 or less in the exposed portion of the pressure-sensitive adhesive layer (2) The peak height appearing in is T1, the sum of all peak heights appearing in the range of 675 cm ^{-1 or more and 900 cm -1 or} less in the laminated portion with the die bonding layer 3 is H2, and the die bonding layer (3 ), when the peak height appearing in the range of 1600 cm ^-1 or more and 1800 cm ^-1 or less in the laminated portion is T2, since the value of R calculated by the above formula (1) is 1.5 or less, the die bond layer (3 ), the pick-up step can be performed in a state where the peeling force of the pressure-sensitive adhesive layer 2 is sufficiently reduced.

That is, the pick-up process can be performed smoothly.

In the die bonding step, the semiconductor chip with the die bonding layer 3 attached thereto is bonded to an adherend.

Matters disclosed by this specification include the following.

(One)

A dicing tape in which an adhesive layer is laminated on a substrate layer;

A die bond layer laminated on the pressure-sensitive adhesive layer in a state in which a part of the pressure-sensitive adhesive layer is exposed,

The pressure-sensitive adhesive layer includes an acrylic polymer,

The die bond layer contains an aromatic compound,

FTIR analysis is performed on each of the exposed portion of the pressure-sensitive adhesive layer and the laminated portion with the die bond layer,

The sum of all peak heights appearing in the range of 675 cm ^{-1 or more and 900 cm -1 or} less in the exposed portion of the pressure-sensitive adhesive layer is H1,

The peak height appearing in the range of 1600 cm ^-1 or more and 1800 cm ^-1 or less in the exposed portion of the pressure-sensitive adhesive layer is T1,

The sum of all peak heights appearing in the range of 675 cm ^{-1 or more and 900 cm -1 or} less in the laminated portion with the die bond layer is H2,

When the peak height appearing in the range of 1600 cm ^-1 or more and 1800 cm ^-1 or less in the laminated portion with the die bond layer is T2,

The value of R calculated from the following formula (1) is 1.5 or less

Dicing die bond film.

According to this structure, when peeling the die-bonding layer from the pressure-sensitive adhesive layer, the peeling force of the pressure-sensitive adhesive layer with respect to the die-bonding layer can be sufficiently reduced.

Thereby, a pick-up process can be performed smoothly.

(2)

The acrylic polymer contains 13 mol% or more of a structural unit of an alkyl (meth)acrylate having an alkyl group having 9 or more carbon atoms.

The dicing die-bonding film according to (1) above.

According to this structure, when peeling the die-bonding layer from the pressure-sensitive adhesive layer, the peeling force of the pressure-sensitive adhesive layer to the die-bonding layer can be further sufficiently reduced.

Thereby, a pick-up process can be performed more smoothly.

(3)

The acrylic polymer includes a structural unit of an alkyl (meth) acrylate having an alkyl group having 12 or more carbon atoms.

The dicing die-bonding film according to (2) above.

According to this structure, when peeling the die-bonding layer from the pressure-sensitive adhesive layer, the peeling force of the pressure-sensitive adhesive layer to the die-bonding layer can be further sufficiently reduced.

Thereby, a pick-up process can be performed more smoothly.

(4)

The acrylic polymer contains 15 mol% or more of a structural unit of an alkyl (meth)acrylate having an alkyl group having 12 or more carbon atoms.

The dicing die-bonding film according to (3) above.

According to this structure, when peeling the die-bonding layer from the pressure-sensitive adhesive layer, the peeling force of the pressure-sensitive adhesive layer to the die-bonding layer can be further sufficiently reduced.

Thereby, a pick-up process can be performed more smoothly.

(5)

The acrylic polymer includes a structural unit of an alkyl (meth)acrylate having an alkyl group having 9 or more and 14 or less carbon atoms, and a structural unit of a hydroxyl group-containing (meth)acrylate.

The dicing die-bonding film according to any one of (1) to (4) above.

According to this structure, when peeling the die-bonding layer from the pressure-sensitive adhesive layer, the peeling force of the pressure-sensitive adhesive layer to the die-bonding layer can be further sufficiently reduced.

Thereby, a pick-up process can be performed more smoothly.

In addition, the dicing die bond film concerning this invention is not limited to the said embodiment. In addition, the dicing die-bonding film according to the present invention is not limited by the above-mentioned effects. The dicing die-bonding film according to the present invention can be modified in various ways without departing from the gist of the present invention.

Example

Next, the present invention will be described more specifically by way of examples. The following examples are intended to explain the present invention in more detail, but do not limit the scope of the present invention.

[Example 1]

<Synthesis of acrylic polymer>

In a reaction vessel equipped with a cooling tube, a nitrogen inlet tube, a thermometer, and a stirring device, a (meth)acrylic monomer was added at the blending ratio shown in Table 1 below, and benzoyl peroxide (hereinafter referred to as 'BPO') as a thermal polymerization initiator. ) was added in an amount of 0.2 parts by mass based on 100 parts by mass of the (meth)acrylic monomer, and toluene as a reaction solvent was added so that the concentration of the (meth)acrylic monomer was 52%, and then under a nitrogen stream, 62 Polymerization at °C for 4 hours and polymerization treatment at 78 °C for 2 hours were performed to obtain a first acrylic polymer as an intermediate.

To the solution containing this first acrylic polymer, a (meth)acrylic monomer was added at the blending ratio shown in Table 1 below, and 0.06 part by mass of dibutyltin dilaurylate was added with respect to 100 parts by mass of the first acrylic polymer A. Then, an addition reaction treatment was performed at 50° C. for 12 hours under an air flow to obtain an acrylic polymer according to Example 1.

Here, when obtaining the first acrylic polymer, 2-isocyanatoethyl methacrylate (hereinafter referred to as "MOI") is used as the (meth)acrylate monomer, but the MOI is addition polymerization with HEA. Therefore, it is not included in the mol% of the (meth)acrylate monomer.

In addition, as said MOI, the trade name "Karenz MOI (registered trademark)" by Showa Denko Corporation was used. "Karenz MOI (registered trademark)" is a polymerizable group-containing (meth)acrylate having an isocyanate group, and has a vinyl group as the polymerizable group.

<Preparation of adhesive solution>

To a solution containing the acrylic polymer according to Example 1, a polyisocyanate compound (trade name "Coronate L", manufactured by Nippon Polyurethane Co., Ltd.) as a crosslinking agent, and a photopolymerization initiator (trade name "Omnirad 127", manufactured by IGM Resins) were added, A pressure-sensitive adhesive solution according to Example 1 was prepared by adding in the blending ratio shown in Table 1 below.

In addition, the parts by mass of the crosslinking agent and parts by mass of the photopolymerization initiator shown in Table 1 below are values relative to 100 parts by mass of the acrylic polymer according to Example 1.

<Production of dicing tape>

The pressure-sensitive adhesive solution according to Example 1 was applied using an applicator on the silicone release-treated surface of a PET separator (thickness: 50 μm) having a silicone release-treated side, and dried at 120° C. for 2 minutes to obtain a thickness of 30 μm. An adhesive layer was formed. Thereafter, a polyolefin film (trade name "RB-0192", thickness: 120 µm) manufactured by Kurabo Co., Ltd. as a substrate layer was bonded onto the pressure-sensitive adhesive layer, stored at 50°C for 24 hours, and a dicing tape according to Example 1 was obtained. got it

<Production of die bond layer>

210 parts by mass of an epoxy resin (trade name "EPPN 501HY", manufactured by Nippon Kayaku Co., Ltd.), phenol resin 1 with respect to 100 parts by mass of an acrylic resin (trade name "SG-N80", manufactured by Nagase ChemteX Co., Ltd., glass transition temperature -23°C) (Brand name "LVR8210-DL", manufactured by Kunei Chemical Co., Ltd.) 100 parts by mass, phenol resin 2 (brand name "HF-1M", manufactured by Maywa Kasei Co., Ltd.) 33 parts by mass, spherical silica (brand name "SE2050-MCV", ad Made by Matex Co., Ltd., average particle size 500 nm) 440 parts by mass (in terms of spherical silica), 3 parts by mass of a silane coupling agent (trade name "KBM-303", manufactured by Shin-Etsu Chemical Co., Ltd.) and a thermosetting catalyst (trade name "TPP-K", Hokko Kagaku Co., Ltd.) 0.5 parts by mass was added to methyl ethyl ketone and mixed to prepare an adhesive composition according to Example 1.

Next, the adhesive composition according to Example 1 was applied using an applicator on the silicone release-treated surface of a PET separator (thickness: 50 μm) having a silicone release-treated surface to form a coating film, and the coating film was heated at 130 ° C. Desolvation treatment was performed for 2 minutes. As a result, a die-bonding layer having a thickness (average thickness) of 40 μm was prepared on the PET separator (a PET separator provided with a die-bonding layer was produced).

Then, after the die-bonding layers were superimposed on the PET separator having two sets of die-bonding layers (after the PET separators were overlapped so that the outer side was overlapped), one of the PET separators was peeled to expose the die-bonding layer, and then the die-bonding layer was exposed. A die bond layer of a PET separator having a further set of die bond layers was overlaid on the die bond layer. After overlapping the three die-bonding layers in this way, bonding was performed using a roll laminator to produce a die-bonding layer having a thickness of 120 μm.

In addition, bonding using a roll laminator was performed under conditions of a bonding speed of 10 mm/sec, a temperature of 90°C, and a pressure of 0.15 MPa.

<Production of dicing die bond film>

First, a die-bonding layer to which PET separators were bonded on both sides was punched into a circular shape of 330 mmφ.

Next, the PET separator is removed from the dicing tape according to Example 1 to expose one side of the pressure-sensitive adhesive layer, and the PET separator is removed from one side of the die-bonding layer in which the PET separators are bonded to both sides to form a die-bonding layer. After exposing one side, the exposed surface of the die bond layer and the exposed surface of the pressure-sensitive adhesive layer were overlapped at room temperature (23±2° C.).

And the dicing die-bonding film concerning Example 1 was obtained by bonding using the roll laminator.

That is, the dicing tape according to Example 1 was constituted by laminating a polyolefin film, an adhesive layer, a die bond layer, and a PET separator in this order.

In addition, bonding using a roll laminator was performed under conditions of a bonding speed of 10 mm/sec, a temperature of 23±2° C., and a pressure of 0.15 MPa.

[Example 2]

<Synthesis of acrylic polymer>

An acrylic monomer according to Example 2 was obtained in the same manner as in Example 1, except that the (meth)acrylic monomer was adjusted to the blending ratio shown in Table 1 below.

<Preparation of adhesive solution>

An adhesive solution according to Example 2 was obtained in the same manner as in Example 1 using the acrylic monomer according to Example 2.

<Production of dicing tape>

A dicing tape according to Example 2 was obtained in the same manner as in Example 1 using the pressure-sensitive adhesive solution according to Example 2.

<Production of die bond layer>

In the same manner as in Example 1, a die bond layer according to Example 2 was obtained.

<Production of dicing die bond film>

A dicing die-bonding film according to Example 2 was obtained in the same manner as in Example 1, using the dicing tape according to Example 2 and the die-bonding layer according to Example 2.

[Example 3]

<Synthesis of acrylic polymer>

An acrylic monomer according to Example 3 was obtained in the same manner as in Example 1, except that the (meth)acrylic monomer was adjusted to the blending ratio shown in Table 1 below.

<Preparation of adhesive solution>

An adhesive solution according to Example 3 was obtained in the same manner as in Example 1 using the acrylic monomer according to Example 3.

<Production of dicing tape>

A dicing tape according to Example 3 was obtained in the same manner as in Example 1 using the pressure-sensitive adhesive solution according to Example 3.

<Production of die bond layer>

In the same manner as in Example 1, a die bond layer according to Example 3 was obtained.

<Production of dicing die bond film>

A dicing die-bonding film according to Example 3 was obtained in the same manner as in Example 1, using the dicing tape according to Example 3 and the die-bonding layer according to Example 3.

[Example 4]

<Synthesis of acrylic polymer>

An acrylic monomer according to Example 4 was obtained in the same manner as in Example 1, except that the (meth)acrylic monomer was adjusted to the blending ratio shown in Table 1 below.

<Preparation of adhesive solution>

An adhesive solution according to Example 4 was obtained in the same manner as in Example 1 using the acrylic monomer according to Example 4.

<Production of dicing tape>

A dicing tape according to Example 4 was obtained in the same manner as in Example 1 using the pressure-sensitive adhesive solution according to Example 4.

<Production of die bond layer>

In the same manner as in Example 1, a die bond layer according to Example 4 was obtained.

<Production of dicing die bond film>

A dicing die bond film according to Example 4 was obtained using the dicing tape according to Example 4 and the die bond layer according to Example 4.

[Example 5]

<Synthesis of acrylic polymer>

An acrylic monomer according to Example 5 was obtained in the same manner as in Example 1, except that the (meth)acrylic monomer was adjusted to the blending ratio shown in Table 1 below.

<Preparation of adhesive solution>

An adhesive solution according to Example 5 was obtained in the same manner as in Example 1 using the acrylic monomer according to Example 5.

<Production of dicing tape>

A dicing tape according to Example 5 was obtained in the same manner as in Example 1 using the pressure-sensitive adhesive solution according to Example 5.

<Production of die bond layer>

In the same manner as in Example 1, a die bond layer according to Example 5 was obtained.

<Production of dicing die bond film>

A dicing die bond film according to Example 5 was obtained using the dicing tape according to Example 5 and the die bond layer according to Example 5.

[Example 6]

<Synthesis of acrylic polymer>

An acrylic monomer according to Example 6 was obtained in the same manner as in Example 1, except that the (meth)acrylic monomer was adjusted to the blending ratio shown in Table 1 below.

<Preparation of adhesive solution>

Adhesive according to Example 6 in the same manner as in Example 1, except that the acrylic polymer according to Example 6 was used and the crosslinking agent (Coronate L) and the photopolymerization initiator (Omnirad 127) were mixed in the mixing ratios shown in Table 1 below. got a solution.

<Production of dicing tape>

A dicing tape according to Example 6 was obtained in the same manner as in Example 1 using the pressure-sensitive adhesive solution according to Example 6.

<Production of die bond layer>

In the same manner as in Example 1, a die bond layer according to Example 6 was obtained.

<Production of dicing die bond film>

A dicing die bond film according to Example 6 was obtained using the dicing tape according to Example 6 and the die bond layer according to Example 6.

[Comparative Example 1]

<Synthesis of acrylic polymer>

An acrylic polymer according to Comparative Example 1 was obtained in the same manner as in Example 1, except that the (meth)acrylic monomer was adjusted to the blending ratio shown in Table 1 below.

<Preparation of adhesive solution>

Adhesive according to Comparative Example 1 in the same manner as in Example 1, except that the acrylic polymer according to Comparative Example 1 was used, and the crosslinking agent (Coronate L) and the photopolymerization initiator (Omnirad 127) were mixed in the mixing ratios shown in Table 1 below. got a solution.

<Production of dicing tape>

A dicing tape according to Comparative Example 1 was obtained in the same manner as in Example 1 using the pressure-sensitive adhesive solution according to Comparative Example 1.

<Production of die bond layer>

In the same manner as in Example 1, a die bond layer according to Comparative Example 1 was obtained.

<Production of dicing die bond film>

A dicing die bond film according to Comparative Example 1 was obtained using the dicing tape according to Comparative Example 1 and the die bond layer according to Comparative Example 1.

[Comparative Example 2]

<Synthesis of acrylic polymer>

An acrylic polymer according to Comparative Example 2 was obtained in the same manner as in Example 1, except that the (meth)acrylic monomer was adjusted to the blending ratio shown in Table 1 below.

<Preparation of adhesive solution>

Adhesive according to Comparative Example 2 in the same manner as in Example 1 except that the acrylic polymer according to Comparative Example 2 was used and the crosslinking agent (Coronate L) and the photopolymerization initiator (Omnirad 127) were mixed in the mixing ratios shown in Table 1 below. got a solution.

<Production of dicing tape>

A dicing tape according to Comparative Example 2 was obtained in the same manner as in Example 1 using the pressure-sensitive adhesive solution according to Comparative Example 2.

<Production of die bond layer>

In the same manner as in Example 1, a die bond layer according to Comparative Example 2 was obtained.

<Production of dicing die bond film>

A dicing die bond film according to Comparative Example 2 was obtained using the dicing tape according to Comparative Example 2 and the die bond layer according to Comparative Example 2.

In Table 1 below, LA means lauryl acrylate (alkyl (meth)acrylate having an alkyl group having 12 or more carbon atoms), and INA means isononyl acrylate (alkyl (meth)acrylate having an alkyl group having 9 or more carbon atoms). ) acrylate) means, 2EHA means 2-ethylhexyl acrylate, BA means butyl acrylate, EA means ethyl acrylate, HEA means 2-hydroxyethyl acrylate means a rate (hydroxyl group-containing (meth)acrylate).

(FTIR analysis)

For the dicing die-bonding film according to each example, FTIR analysis was performed on each of the exposed portion of the pressure-sensitive adhesive layer and the laminated portion with the die-bonding layer as described in the section of the above embodiment, and the exposed portion of the pressure-sensitive adhesive layer and data on each of the laminated portions with the die bond layer were acquired.

Next, the obtained data is plotted on a graph in which the horizontal axis is the wave number (unit: cm ^-1 ) and the vertical axis is the detected intensity (abs), and then a curve connecting the plotted data for each data series drew

And, based on the above curve, the sum H1 of all peak heights appearing in the range of 675 cm ^{-1 or more and 900 cm -1 or} less in the exposed part of the pressure-sensitive adhesive layer, 1600 cm ^-1 or more 1800 cm in the exposed part of the pressure-sensitive adhesive layer. In the peak height T1 appearing in the range of ^-1 or less, the sum of all peak heights H2 appearing in the range of 675 cm ^{-1 or more and 900 cm -1 or} less in the lamination portion with the die bond layer, and the lamination portion with the die bond layer The peak height T2 appearing in the range of 1600 cm ^-1 or more and 1800 cm ^-1 or less of was determined.

In addition, the sum of all peak heights H1 and H2, and the peak heights T1 and T2 were obtained as described in the section of the above embodiment.

In addition, the value of R was obtained using the following formula (1).

For each example, the values of H1, H2, T1, T2, and R obtained as described above are shown in Table 2 below.

(peel force)

With respect to the dicing die-bonding film according to each example, the peel force of the die-bonding layer with respect to the pressure-sensitive adhesive layer was measured. The peeling force of the die-bonding layer with respect to the pressure-sensitive adhesive layer was measured after curing the pressure-sensitive adhesive layer.

The peeling force of the die-bonding layer with respect to the pressure-sensitive adhesive layer was measured by a T-shaped peeling test.

In the T-shaped peel test, a dicing die-bonding film in which a reinforcing tape (trade name "ELP BT315, manufactured by Nitto Denko") was bonded to the exposed surface of the die-bonding layer was subjected to a trade name "UM-810" (trade name manufactured by Nitto Seiki) (high pressure A mercury lamp, 60 mW/cm 2 ) was used to irradiate ultraviolet light with an intensity of 150 J/cm 2 from the side of the dicing tape to cure the adhesive layer, and then cut out a sample having a width of 50 mm × length of 120 mm as a sample for measurement, and a tensile tester. (For example, trade name "TG-1kN", manufactured by Minebea Mitsumi Co., Ltd.) was used, and the temperature was 25°C and the tensile strength was 300 mm/min.

The peel force measured as described above is shown in Table 2 below.

(pickup)

Pick-up properties were evaluated for semiconductor chips provided with a die bond layer in a cut state.

A semiconductor chip having a die bond layer in a cut state was obtained according to the following procedure.

(1) For a 12-inch bare wafer (diameter: 300 mm, thickness: 55 µm) on which splitting grooves (10 mm x 10 mm) were formed by half-cutting, a back grind tape was applied to the surface on which the dividing grooves were formed.

(2) Using a back grinder (model DGP8760 manufactured by DISCO), the 12-inch bare wafer was ground to a thickness of 25 μm from the side opposite to the side to which the back grind tape was attached, and back-ground the bare wafer get

(3) The die bond layer of the dicing die bond film according to each example is attached to the side opposite to the pasting surface of the back grind tape in the back ground bare wafer, thereby obtaining a bare wafer having a dicing die bond film .

(4) Dicing A bare wafer with a die bond was obtained by expanding it using a die separator device (trade name "Die Separator DDS3200", manufactured by Disco).

In addition, the expand using a die separator was performed in a state where the back grind tape was separated from the bare wafer.

In the expand using a die separator, room temperature expand was performed after cool expand was performed.

Cool expand was performed according to the following procedure.

(1) A ring frame made of SUS (manufactured by Disco) having a diameter of 12 inches is affixed at room temperature to the frame bonding area on the pressure-sensitive adhesive layer of the dicing die bonding film affixed to the bare wafer.

(2) A bare wafer with a ring frame made of SUS attached thereto is mounted on a die separating device, and the dicing tape of the dicing die bond film is expanded by a cool expander unit of the die separating device.

(3) Cool expand is performed under conditions of an expand temperature of -15°C, an expand speed of 100 mm/sec, and an expand amount of 7 mm.

In addition, after the cool expand, the semiconductor wafer was singulated into a plurality of semiconductor chips, and the die bond layer was also singulated into a size corresponding to the semiconductor chip, so that a semiconductor chip having a plurality of die bond layers was obtained.

Room-temperature expand was performed by expanding the dicing tape of the dicing die-bonding film using the room-temperature expand unit of the said die-separating apparatus after cool expand.

Room-temperature expand was performed under conditions of an expand temperature of 23±2° C., an expand speed of 1 mm/sec, and an expand amount of 10 mm.

Heat shrinkage treatment was performed on the dicing tape after normal temperature expansion. The heat shrinkage treatment was performed under conditions of a temperature of 200°C and a time of 20 seconds.

After heat-shrinking the dicing tape, a pick-up test was conducted on a semiconductor chip having a die-bonding layer cut into pieces using a device having a pick-up mechanism (trade name "Die Bonder SPA-300", manufactured by Shinkawa Co., Ltd.). .

In the device having the above pick-up mechanism, the pushing speed by the pin member was 1 mm/sec, and the pushing amount was 2000 µm.

The pick-up test was carried out after curing the pressure-sensitive adhesive layer by irradiating ultraviolet rays with an intensity of 150 J/cm 2 from the dicing tape side using a trade name "UM-810" (high pressure mercury lamp, 60 mW/cm 2 ) manufactured by Nitto Seiki Co., Ltd. did

The pick-up test was performed on a semiconductor chip having five die bond layers, and pick-up properties were judged according to the following criteria.

Excellent: All semiconductor chips with five die bond layers can be picked up.

Good: 3 or 4 of semiconductor chips having 5 die bond layers can be picked up.

Possible: One or two of the semiconductor chips with five die bond layers can be picked up.

Impossible: All semiconductor chips with five die bond layers cannot be picked up.

With respect to the results of evaluating pick-up properties, it is shown in Table 2 below.

From Table 2, in the dicing die-bonding films according to Examples 1 to 6, the values of R are all 1.5 or less, and the peel force (peel force of the die-bonding layer with respect to the pressure-sensitive adhesive layer) is 0.3 N or less. It can be seen that it is set to a sufficiently low value.

And, in the dicing die bond films according to Examples 1 to 6, it can be seen that all have good pick-up properties (good or excellent).

In particular, in the dicing die bond films according to Examples 2 and 5, the peel force was sufficiently lowered to 0.14 N, and it was found that the pick-up property was excellent and particularly good.

On the contrary, in the dicing die-bonding film according to Comparative Example 1, the peel force showed a high value of 0.48 N, and in the dicing die-bonding film according to Comparative Example 2, the peel force showed a particularly high value of 1.75 N. It can be known that there is

And, in the dicing die-bonding film according to Comparative Example 1, it was found that the pickup property was slightly poor (possible), and in the dicing die-bonding film according to Comparative Example 2, the pick-up property was poor (unavailable). can

From these results, FTIR analysis was performed on each of the exposed portion of the pressure-sensitive adhesive layer and the laminated portion of the die-bonding layer in the dicing die-bonding film, and 675 cm ^-1 or more 900 cm ^- at the exposed portion of the pressure-sensitive adhesive layer The sum of all peak heights appearing in the range of ¹ or less is H1, the peak height appearing in the range of 1600 cm ^-1 or more and 1800 cm ^-1 or less in the exposed portion of the pressure-sensitive adhesive layer is T1, and the die bond layer and H2 is the sum of all peak heights appearing in the range of 675 cm ^{-1 or more and 900 cm -1 or} less in the laminated portion of 1600 cm ^-1 or more and 1800 cm ^-1 or less in the laminated portion with the die bond layer When the peak height appearing in the range is set to T2, when the value of R calculated in the formula (1) is 1.5 or less, when the die-bonding layer is separated from the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer is separated from the die-bonding layer. It can be seen that the power can be reduced sufficiently.

In addition, it can be seen that since the peeling force of the adhesive layer with respect to the die bond layer is sufficiently lowered, the pick-up property is improved, so that the pick-up process can be smoothly performed.

1: base layer
2: adhesive layer
3: die bond layer
10: dicing tape
20: dicing die bond film
G: Backgrind tape
H: holding support
J: adsorption jig
P: no pin
R: dicing ring
T: tape for wafer processing
U: Push-up member
W: semiconductor wafer

Claims (5)

A dicing tape in which an adhesive layer is laminated on a substrate layer;
A die bond layer laminated on the pressure-sensitive adhesive layer in a state in which a part of the pressure-sensitive adhesive layer is exposed,
The pressure-sensitive adhesive layer includes an acrylic polymer,
The die bond layer contains an aromatic compound,
FTIR analysis is performed on each of the exposed portion of the pressure-sensitive adhesive layer and the laminated portion with the die bond layer,
The sum of all peak heights appearing in the range of 675 cm ^{-1 or more and 900 cm -1 or} less in the exposed portion of the pressure-sensitive adhesive layer is H1,
The peak height appearing in the range of 1600 cm ^-1 or more and 1800 cm ^-1 or less in the exposed portion of the pressure-sensitive adhesive layer is T1,
The sum of all peak heights appearing in the range of 675 cm ^{-1 or more and 900 cm -1 or} less in the laminated portion with the die bond layer is H2,
When the peak height appearing in the range of 1600 cm ^-1 or more and 1800 cm ^-1 or less in the laminated portion with the die bond layer is T2,
The value of R calculated from the following formula (1) is 1.5 or less
Dicing die bond film.

According to claim 1,
The acrylic polymer contains 13 mol% or more of a structural unit of an alkyl (meth)acrylate having an alkyl group having 9 or more carbon atoms.
Dicing die bond film. According to claim 2,
The acrylic polymer includes a structural unit of an alkyl (meth) acrylate having an alkyl group having 12 or more carbon atoms.
Dicing die bond film. According to claim 3,
The acrylic polymer contains 15 mol% of a structural unit of an alkyl (meth)acrylate having an alkyl group having 12 or more carbon atoms.
Dicing die bond film. According to claim 1 or 2,
The acrylic polymer includes a structural unit of an alkyl (meth)acrylate having an alkyl group having 9 or more and 14 or less carbon atoms, and a structural unit of a hydroxyl group-containing (meth)acrylate.
Dicing die bond film.

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