JP2019067996A - Pressure-sensitive adhesive tape for dicing and dicing/die bonding integrated tape - Google Patents

Abstract

To provide a dicing/die bonding integrated tape capable of achieving both of the severability of a semiconductor wafer and the pick up property of a semiconductor chip at a sufficiently high level in a semiconductor device manufacturing process including stealth dicing.SOLUTION: The dicing/die bonding integrated tape according to the present invention comprises: a base material layer; a pressure-sensitive adhesive layer; and an adhesive layer, in this order. The pressure-sensitive adhesive layer includes a (meth) acrylic resin, a photopolymerization initiator, and a crosslinking agent. The dicing/die bonding integrated tape before being cured by ultraviolet irradiation, has a storage elastic modulus at -15°C of 40 MPa or more, and after being subjected to curing treatment by ultraviolet irradiation, the dicing/die bonding integrated tape has a storage elastic modulus at 25°C of 100 MPa or more.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an adhesive tape for dicing and a dicing die bonding integrated tape.

  Conventionally, a semiconductor device is manufactured through the following steps. First, a semiconductor wafer is attached to a pressure-sensitive adhesive sheet for dicing, and in this state, the semiconductor wafer is singulated into semiconductor chips. Thereafter, an expanding step, a pickup step, a mounting step, a reflow step, a die bonding step, and the like are performed.

  In recent years, as a method of obtaining a semiconductor chip by dividing a semiconductor wafer, a process of processing a groove to be a fold without completely cutting the semiconductor wafer, or irradiating the inside of the semiconductor wafer on a planned cutting line Then, after carrying out the step of forming the modified region, there has been proposed a method of dividing the semiconductor wafer by applying an external force to the semiconductor wafer. The former is called half cut dicing, and the latter is called stealth dicing (see, for example, Patent Documents 1 and 2).

Patent 4358502 gazette JP, 2009-164556, A

  Patent Document 2 discloses an embodiment in which stealth dicing is performed using a wafer processing tape provided with an adhesive tape and an adhesive film. According to the invention described in Patent Document 2, by performing the expansion under a low temperature condition of −15 to 5 ° C., the adhesive film can be formed into individual chips while maintaining the separation property of the adhesive film in a high state. It is said that it can be divided appropriately accordingly. However, according to the study of the present inventors, when expanding is performed under a low temperature condition, the stretch of the pressure-sensitive adhesive tape tends to be insufficient and necking tends to occur. When necking occurs in the pressure-sensitive adhesive tape, the stretchability of the above-mentioned tape becomes non-uniform between the end portion and the central portion of the semiconductor wafer, and it becomes difficult to obtain a good dividing property. Moreover, the adhesive tape conventionally used for stealth dicing had room for improvement also about the pick-up property of a semiconductor chip.

  The present invention has been made in view of the above-mentioned problems, and is for dicing capable of achieving both of the dividing property of a semiconductor wafer and the pickup property of a semiconductor chip at a sufficiently high level in a manufacturing process of a semiconductor device including stealth dicing. An object of the present invention is to provide an adhesive tape and a dicing die bonding integrated tape.

  The present invention provides an adhesive tape for dicing. The pressure-sensitive adhesive tape comprises at least a base material layer and a pressure-sensitive adhesive layer provided on the base material layer, and the pressure-sensitive adhesive layer contains a (meth) acrylic resin, a photopolymerization initiator and a crosslinking agent. In addition, the storage elastic modulus at −15 ° C. is 40 MPa or more (condition 1) before the curing treatment by ultraviolet irradiation, and the storage elastic modulus at 25 ° C. is 100 MPa or more (condition 2) after the curing treatment by ultraviolet irradiation It is.

  According to the pressure-sensitive adhesive tape according to the present invention, the pressure-sensitive adhesive layer satisfies the above conditions (storage conditions 1 and 2) for storage elastic modulus, thereby separating the semiconductor wafer and the semiconductor in the manufacturing process of the semiconductor device including stealth dicing. Both chip pick-up properties can be achieved to a sufficiently high level.

  From the viewpoint of obtaining the above effects according to the present invention more stably, it is preferable that the (meth) acrylic resin have one or more aromatic rings. From the same viewpoint, it is preferable that the (meth) acrylic resin contains a chain-polymerizable functional group, and the functional group is at least one selected from an acryloyl group and a methacryloyl group.

  In the present invention, as the crosslinking agent, for example, a reaction product of a polyfunctional isocyanate having two or more isocyanate groups in one molecule and a polyhydric alcohol having three or more OH groups in one molecule can be adopted. In the present invention, for example, a photoradical polymerization initiator can be employed as the photopolymerization initiator.

  The present invention provides a dicing die bonding integrated tape. This integral-type tape is provided with the said adhesive sheet and the adhesive layer provided on the adhesive layer with which the said adhesive sheet is provided. According to this integral-type tape, the pressure-sensitive adhesive layer satisfies the above-described conditions (storage conditions 1 and 2) for storage elastic modulus, and in the manufacturing process of the semiconductor device including stealth dicing, the dividing property of the semiconductor wafer and the semiconductor chip Both pickup properties can be achieved to a sufficiently high level.

  According to the present invention, there is provided a pressure-sensitive adhesive tape for dicing and a dicing die-bonding integrated-type tape capable of achieving sufficiently high splitability of a semiconductor wafer and pickup performance of a semiconductor chip in a manufacturing process of semiconductor devices including stealth dicing. Provided.

FIG. 1 is a cross-sectional view schematically showing an embodiment of a dicing die bonding integrated tape according to the present invention. FIG. 2 is a cross-sectional view schematically showing an embodiment of the pressure-sensitive adhesive tape for dicing according to the present invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, the same or corresponding parts will be denoted by the same reference numerals and redundant description will be omitted. The present invention is not limited to the following embodiments. In the present specification, (meth) acrylic means acrylic or methacrylic.

  FIG. 1 is a cross-sectional view schematically showing a dicing die bonding integrated tape according to the present embodiment. The dicing die bonding integrated type tape 10 (hereinafter sometimes referred to simply as “tape 10”) shown in the same figure includes a base material layer 1, an adhesive layer 3 provided on the base material layer 1, and an adhesive And an adhesive layer 5 provided on the layer 3. The pressure-sensitive adhesive layer 3 exerts effects in the step of singulating a semiconductor wafer (in particular, the expanding step under a low temperature condition) and the pickup step in the manufacturing process of a semiconductor device including stealth dicing. The adhesive layer 5 is effective in the step of bonding a semiconductor chip obtained through stealth dicing to a substrate or the like.

<Pressure-sensitive adhesive layer>
The pressure-sensitive adhesive layer 3 contains a (meth) acrylic resin, a photopolymerization initiator, and a crosslinking agent, and satisfies both the following conditions 1 and 2 with regard to storage elastic modulus.
(Condition 1)
The storage elastic modulus at −15 ° C. is 40 MPa or more before the curing treatment by ultraviolet irradiation.
(Condition 2)
After curing treatment by ultraviolet irradiation, the storage elastic modulus at 25 ° C. is 100 MPa or more.

  Regarding the condition 1, before the curing treatment by the ultraviolet irradiation to the pressure-sensitive adhesive layer 3, when the storage elastic modulus at -15 ° C is less than 40 MPa, the pressure-sensitive adhesive layer 3 is used as a dicing tape under low temperature conditions (eg -15) When the expanding step is carried out at .degree. C. to -5.degree. C., since the pressure-sensitive adhesive layer 3 is soft, necking easily occurs in the pressure-sensitive adhesive tape, and a part of the semiconductor wafer and the die bond film become undivided, resulting in pickup failure. The storage elastic modulus is preferably 40 to 200 MPa, more preferably 50 to 150 MPa, and still more preferably 60 to 100 MPa. Before curing treatment of the pressure-sensitive adhesive layer 3 by ultraviolet irradiation, if the storage elastic modulus at −15 ° C. is 200 MPa or more, peeling may occur between the pressure-sensitive adhesive layer 3 and the adhesive layer 5 during expansion. This phenomenon is referred to as "dif attach film (DAF)".

  Regarding the condition 2, after the storage elastic modulus at 25 ° C. is less than 100 MPa, the releasability of the adhesive layer 5 and the pressure-sensitive adhesive layer 3 becomes insufficient and the push-up occurs after curing treatment of the pressure-sensitive adhesive layer 3 by ultraviolet irradiation. The impact of the pin is absorbed, resulting in pickup failure. The storage elastic modulus is preferably 100 to 500 MPa, more preferably 120 to 300 MPa, and still more preferably 150 to 250 MPa.

  The pressure-sensitive adhesive layer 3 satisfying both the conditions 1 and 2 can be formed by using a pressure-sensitive adhesive composition containing a specific (meth) acrylic resin. Hereinafter, the components of the pressure-sensitive adhesive composition will be described in detail.

[(Meth) acrylic resin]
The (meth) acrylic resin can be obtained by synthesis using a known method. Examples of the synthesis method include solution polymerization, suspension polymerization, emulsion polymerization, bulk polymerization, precipitation polymerization, gas phase polymerization, plasma polymerization, and supercritical polymerization. Further, as the type of polymerization reaction, in addition to radical polymerization, cationic polymerization, anionic polymerization, living radical polymerization, living cationic polymerization, living anionic polymerization, coordination polymerization, imodal polymerization, etc., ATRP (atom transfer radical polymerization) and RAFT ( Methods such as reversible addition fragmentation chain transfer polymerization) can also be mentioned. Among these, synthesis by radical polymerization using a solution polymerization method can be blended using the resin solution obtained by the polymerization as it is, in addition to good economy, high reaction rate, ease of polymerization control, etc. And so on.

  Here, the method for synthesizing the (meth) acrylic resin will be described in detail, taking a method for obtaining the (meth) acrylic resin by radical polymerization using a solution polymerization method as an example.

  The monomer used when synthesizing the (meth) acrylic resin is not particularly limited as long as it has one (meth) acryloyl group in one molecule. Specific examples thereof include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, tert-butyl (meth) acrylate, butoxyethyl (meth) acrylate and isoamyl (meth) acrylate , Hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, heptyl (meth) acrylate, octyl heptyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, lauryl (meth) Acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, stearyl (meth) acrylate, (Meth) acrylate, methoxypolyethylene glycol (meth) acrylate, ethoxypolyethylene glycol (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, ethoxypolypropylene glycol (meth) acrylate, mono (2- (meth) acryloyloxyethyl) Aliphatic (meth) acrylates such as succinate; cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, isobornyl (meth) acrylate Mono (2- (meth) acryloyloxyethyl) tetrahydrophthalate, mono (2- (meth) acryloyloxyethyl) hexahydride Alicyclic (meth) acrylates such as phthalate; benzyl (meth) acrylate, phenyl (meth) acrylate, o-biphenyl (meth) acrylate, 1-naphthyl (meth) acrylate, 2-naphthyl (meth) acrylate, phenoxyethyl ( Meta) acrylate, p-cumyl phenoxyethyl (meth) acrylate, o-phenyl phenoxyethyl (meth) acrylate, 1-naphthoxyethyl (meth) acrylate, 2-naphthoxyethyl (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, nonyl Phenoxy polyethylene glycol (meth) acrylate, phenoxy polypropylene glycol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 2-hydro Xyl-3- (o-phenylphenoxy) propyl (meth) acrylate, 2-hydroxy-3- (1-naphthoxy) propyl (meth) acrylate, 2-hydroxy-3- (2-naphthoxy) propyl (meth) acrylate and the like Aromatic (meth) acrylates; heterocyclics such as 2-tetrahydrofurfuryl (meth) acrylate, N- (meth) acryloyloxyethyl hexahydrophthalimide, 2- (meth) acryloyloxyethyl-N-carbazole, etc. Meta) acrylates, caprolactone modified products thereof, ω-carboxy-polycaprolactone mono (meth) acrylate, glycidyl (meth) acrylate, α-ethyl glycidyl (meth) acrylate, α-propyl glycidyl (meth) acrylate, α-butyl glycidyl (Meta) Acri , 2-methyl glycidyl (meth) acrylate, 2-ethyl glycidyl (meth) acrylate, 2-propyl glycidyl (meth) acrylate, 3,4-epoxybutyl (meth) acrylate, 3,4-epoxyheptyl (meth) Acrylate, α-ethyl-6,7-epoxyheptyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, o-vinyl benzyl glycidyl ether, m-vinyl benzyl glycidyl ether, p-vinyl benzyl glycidyl ether, etc. Compounds having an ethylenically unsaturated group and an epoxy group; (2-ethyl-2-oxetanyl) methyl (meth) acrylate, (2-methyl-2-oxetanyl) methyl (meth) acrylate, 2- (2-ethyl-) 2-oxetanyl) ethyl ( Ta) Acrylate, 2- (2-methyl-2-oxetanyl) ethyl (meth) acrylate, 3- (2-ethyl-2-oxetanyl) propyl (meth) acrylate, 3- (2-methyl-2-oxetanyl) propyl Compounds having an ethylenically unsaturated group such as (meth) acrylate and an oxetanyl group; compounds having an ethylenically unsaturated group and an isocyanate group such as 2- (meth) acryloyloxyethyl isocyanate; 2-hydroxyethyl (meth) acrylate, Ethylenically unsaturated group and hydroxyl group such as 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate And compounds containing It is possible to obtain an appropriate combination for the purpose to (meth) acrylic resin.

  The (meth) acrylic resin preferably has one or more aromatic rings from the viewpoint of easily obtaining the pressure-sensitive adhesive layer 3 satisfying the above conditions 1 and 2. In this case, as a monomer for synthesizing the (meth) acrylic resin, styrene, α-methylstyrene, α-ethylstyrene, α-propylstyrene, α-isopropylstyrene, α-butylstyrene, α-isobutylstyrene, α -Tert-Butylstyrene, 2-methylstyrene, 4-methylstyrene, 2-ethylstyrene, 4-ethylstyrene, 2-propylstyrene, 4-propylstyrene, 2-isopropylstyrene, 4-isopropylstyrene, 2-butylstyrene 4-butylstyrene, 2-isobutylstyrene, 4-isobutylstyrene, 2-tert-butylstyrene, 4-tert-butylstyrene, benzyl (meth) acrylate, phenyl (meth) acrylate, o-biphenyl (meth) acrylate, 1-naphthyl ( Ta) acrylate, 2-naphthyl (meth) acrylate, phenoxyethyl (meth) acrylate, p-cumyl phenoxyethyl (meth) acrylate, o-phenyl phenoxyethyl (meth) acrylate, 1-naphthoxyethyl (meth) acrylate, 2- Naphthoxyethyl (meth) acrylate, phenoxy polyethylene glycol (meth) acrylate, nonyl phenoxy polyethylene glycol (meth) acrylate, phenoxy polypropylene glycol (meth) acrylate, 2-hydroxy-3-phenoxy propyl (meth) acrylate, 2-hydroxy-3- (O-phenylphenoxy) propyl (meth) acrylate, 2-hydroxy-3- (1-naphthoxy) propyl (meth) acrylate, 2-hydroxy-3- It is preferable to use one type selected from (2-naphthoxy) propyl (meth) acrylate alone or in combination of two or more types.

  The (meth) acrylic resin preferably has at least one functional group selected from a hydroxyl group, a glycidyl group, an amino group and the like as a reaction point with a functional group introduced compound or a crosslinking agent described later. As a monomer for synthesizing a (meth) acrylic resin having a hydroxyl group, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 3-chloro-2 -Compounds having an ethylenically unsaturated group such as hydroxypropyl (meth) acrylate and 2-hydroxybutyl (meth) acrylate and a hydroxyl group are mentioned, and one of these may be used alone, or two or more of these may be used in combination Can.

  As a monomer for synthesizing a (meth) acrylic resin having a glycidyl group, glycidyl (meth) acrylate, α-ethyl glycidyl (meth) acrylate, α-propyl glycidyl (meth) acrylate, α-butyl glycidyl (meth) Acrylate, 2-methyl glycidyl (meth) acrylate, 2-ethyl glycidyl (meth) acrylate, 2-propyl glycidyl (meth) acrylate, 3,4-epoxybutyl (meth) acrylate, 3,4-epoxyheptyl (meth) acrylate Α-ethyl-6,7-epoxyheptyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, o-vinylbenzyl glycidyl ether, m-vinyl benzyl glycidyl ether, p-vinyl benzyl glycol Include compounds having an ethylenically unsaturated group and an epoxy group such as Gilles ether, it can be alone one, or combination of two or more.

  The (meth) acrylic resin synthesized from these monomers preferably contains a functional group capable of chain polymerization. The chain-polymerizable functional group is, for example, at least one selected from an acryloyl group and a methacryloyl group. The chain-polymerizable functional group is introduced into the (meth) acrylic resin, for example, by reacting the following compound (functional group introduced compound) with the (meth) acrylic resin synthesized as described above be able to. 2-methacryloyloxyethyl isocyanate, meta-isopropenyl-α, α-dimethylbenzyl isocyanate, methacryloyl isocyanate, allyl isocyanate, 1,1- (bisacryloyloxymethyl) ethyl isocyanate; specific examples of the functional group introduction compound Or an acryloyl monoisocyanate compound obtained by reaction of a polyisocyanate compound with hydroxyethyl (meth) acrylate or 4-hydroxybutylethyl (meth) acrylate; a diisocyanate compound or polyisocyanate compound, a polyol compound, and hydroxyethyl (meth) The acryloyl monoisocyanate compound etc. which are obtained by reaction with an acrylate are mentioned. Among these, 2-methacryloyloxyethyl isocyanate is particularly preferable. One of these compounds may be used alone, or two or more of these compounds may be used in combination.

[Photoinitiator]
The photopolymerization initiator is not particularly limited as long as it generates an active species capable of chain polymerization by irradiating at least one selected from ultraviolet light, electron beam and visible light, and for example, photo radical polymerization initiation Agents. Here, the active species capable of chain polymerization means those in which the polymerization reaction is initiated by reacting with the functional group capable of chain polymerization.

  As photo radical polymerization initiators, benzoin ketals such as 2,2-dimethoxy-1,2-diphenyl ethane-1-one; 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropane-1 -Hydroxy ketones such as 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one; 2-benzyl-2-dimethylamino-1- Α-amino ketones such as (4-morpholinophenyl) -butan-1-one, 1,2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one; 1- [4 Oxime esters such as-(phenylthio) phenyl] -1,2-octadione-2- (benzoyl) oxime; bis (2,4,6-trimethyl bene Phosphine oxides such as phenyl phosphine oxide, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentyl phosphine oxide, 2,4,6-trimethyl benzoyl diphenyl phosphine oxide; 2- (o-chlorophenyl) -4,5-Diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer Body, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer etc Dimer; Benzophenone, N, N'-Tetramethyl-4,4'-diaminobenzo Benzophenone compounds such as phenone, N, N'-tetraethyl-4,4'-diaminobenzophenone and 4-methoxy-4'-dimethylaminobenzophenone; 2-ethyl anthraquinone, phenanthrene quinone, 2-tert-butyl anthraquinone, octamethyl anthraquinone 1,2-benzoanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthra Quinone compounds such as quinone, 2-methyl-1,4-naphthoquinone, 2,3-dimethylanthraquinone; benzoin ethers such as benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether; Benzoin compounds such as in, methylbenzoin and ethylbenzoin; benzyl compounds such as benzyl dimethyl ketal; acridine compounds such as 9-phenylacridine and 1,7-bis (9,9'-acridinylheptane): N-phenylglycine And coumarin.

  The content of the photopolymerization initiator in the pressure-sensitive adhesive composition is, for example, 0.1 to 30 parts by mass and 0.3 to 10 parts by mass with respect to 100 parts by mass of the (meth) acrylic resin. Is preferable, and 0.5 to 5 parts by mass is more preferable. If the content of the photopolymerization initiator is less than 0.1 parts by mass, curing of the pressure-sensitive adhesive layer 3 becomes insufficient after irradiation with ultraviolet light, and pickup defects easily occur. When the content of the photopolymerization initiator exceeds 30 parts by mass, contamination to the adhesive layer (transfer of the photopolymerization initiator to the adhesive layer) tends to occur.

[Crosslinking agent]
The crosslinking agent is used, for example, to control the elastic modulus and / or the tackiness of the pressure-sensitive adhesive layer 3. The crosslinking agent may be a compound having two or more functional groups capable of reacting with at least one functional group selected from the hydroxyl group, glycidyl group, amino group, etc. of the (meth) acrylic resin described above. . An ester bond, an ether bond, an amide bond, an imide bond, a urethane bond, a urea bond etc. are mentioned as a bond formed by reaction of a crosslinking agent and (meth) acrylic-type resin.

  In the present embodiment, it is preferable to use a compound having two or more isocyanate groups in one molecule as the crosslinking agent. When such a compound is used, it can be easily reacted with a hydroxyl group, a glycidyl group, an amino group and the like which the above (meth) acrylic resin has, and a strong crosslinked structure can be formed.

  As compounds having two or more isocyanate groups in one molecule, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4 , 4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, lysine isocyanate And isocyanate compounds such as

  As the crosslinking agent, a reaction product of an isocyanate compound described above and a polyhydric alcohol having two or more OH groups in one molecule (isocyanate group-containing oligomer) may be employed. Examples of polyhydric alcohols having two or more OH groups in one molecule include ethylene glycol, propylene glycol, butylene glycol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, 1,11-undecanediol, 1,12-dodecanediol, glycerin, pentaerythritol, dipentaerythritol, 1,4-cyclohexanediol, 1,3-cyclohexanediol.

  Among these, as a crosslinking agent, a reaction product of a polyfunctional isocyanate having two or more isocyanate groups in one molecule and a polyhydric alcohol having three or more OH groups in one molecule (isocyanate group-containing oligomer) It is further desirable that By using such an isocyanate group-containing oligomer as a crosslinking agent, the pressure-sensitive adhesive layer 3 forms a dense cross-linked structure, whereby the adhesion of the pressure-sensitive adhesive to the adhesive layer 5 can be sufficiently suppressed in the pickup step. .

  The content of the crosslinking agent in the pressure-sensitive adhesive composition may be appropriately set according to the cohesion and the elongation at break required for the pressure-sensitive adhesive layer 3, the adhesion to the adhesive layer 5, and the like. Specifically, the content of the crosslinking agent is, for example, 3 to 30 parts by mass, and preferably 5 to 15 parts by mass, with respect to 100 parts by mass of the (meth) acrylic resin. More preferably, it is 10 parts by mass. By setting the content of the crosslinking agent in the above-described range, it is possible to balance the characteristics required for the pressure-sensitive adhesive layer 3 in the dicing step and the characteristics required for the pressure-sensitive adhesive layer 3 in the die bonding step with good balance. , Excellent pick-up can also be achieved.

  If the content of the crosslinking agent is less than 3 parts by mass with respect to 100 parts by mass of the (meth) acrylic resin, the formation of the crosslinked structure tends to be insufficient, and due to this, in the pickup step, adhesion Defects are likely to occur at the time of pickup without sufficiently reducing the interfacial adhesion with the agent layer 5. On the other hand, when the content of the crosslinking agent exceeds 30 parts by mass with respect to the content of 100 parts by mass of the (meth) acrylic resin, the pressure-sensitive adhesive layer 3 is likely to be excessively hard. The semiconductor chip is easily peeled off.

  The thickness of the pressure-sensitive adhesive layer 3 may be appropriately set according to the conditions (temperature, tension, etc.) of the expanding step, and is, for example, 1 to 200 μm, preferably 5 to 50 μm, and 10 to 20 μm. Is more preferred. When the thickness of the pressure-sensitive adhesive layer 3 is less than 1 μm, the adhesiveness tends to be insufficient, and when it exceeds 200 μm, the parting tends to be insufficient at the time of cool expansion.

  The pressure-sensitive adhesive layer 3 is formed on the base material layer 1. A known method can be employed as a method of forming the pressure-sensitive adhesive layer 3. For example, a laminate of the base material layer 1 and the pressure-sensitive adhesive layer 3 may be formed by a two-layer extrusion method, or a varnish for forming the pressure-sensitive adhesive layer 3 is prepared and coated on the surface of the base material layer 1 Alternatively, the pressure-sensitive adhesive layer 3 may be formed on a processed or release-treated film and transferred to the base layer 1.

  The varnish for forming the pressure-sensitive adhesive layer 3 is preferably prepared using an organic solvent capable of dissolving the (meth) acrylic resin, the photopolymerization initiator and the crosslinking agent, which volatilizes by heating. Specific examples of the organic solvent include aromatic hydrocarbons such as toluene, xylene, mesitylene, cumene and p-cymene; cyclic ethers such as tetrahydrofuran and 1,4-dioxane; methanol, ethanol, isopropanol, butanol, ethylene glycol and propylene Alcohols such as glycols; Ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, etc .; methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, γ-butyrolactone etc. Esters; carbonates such as ethylene carbonate and propylene carbonate; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol Cole dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, etc. Alcohol alkyl ether; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoether Polyhydric alcohol alkyl ether acetates such as ethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate; Amides such as N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone and the like.

  Among these, from the viewpoint of solubility and boiling point, for example, toluene, methanol, ethanol, isopropanol, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methyl acetate, ethyl acetate, butyl acetate, ethylene glycol monomethyl ether, ethylene glycol mono Ethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol dimethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, and N, N-dimethylacetamide are preferable. One of these organic solvents may be used alone, or two or more thereof may be used in combination. It is preferable that the solid content concentration of a varnish is 10-60 mass% normally.

<Base layer>
A known polymer sheet or film can be used as the substrate layer 1, and there is no particular limitation as long as it can carry out the expanding step under low temperature conditions. Specifically, as the base material layer 1, crystalline polypropylene, amorphous polypropylene, high density polyethylene, medium density polyethylene, low density polyethylene, ultra low density polyethylene, low density linear polyethylene, polybutene, polymethylpentene, etc. Polyolefin, ethylene-vinyl acetate copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-butene copolymer, ethylene- Hexene copolymer, polyurethane, polyester such as polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyetheretherketone, polyimide, polyetherimide, polyamide, wholly aromatic polyamide, polyphenyl sulfide, ara B (paper), glass, glass cloth, fluorocarbon resin, polyvinyl chloride, polyvinylidene chloride, cellulose resin, silicone resin, or a mixture of these with a plasticizer, or curing cured by electron beam irradiation The thing is mentioned.

  The base material layer 1 has a surface mainly composed of at least one resin selected from polyethylene, polypropylene, polyethylene-polypropylene random copolymer, and polyethylene-polypropylene block copolymer, and this surface and the pressure-sensitive adhesive layer 3 Are preferably in contact with each other. These resins are good substrates from the viewpoints of properties such as Young's modulus, stress relaxation property and melting point, and also in terms of cost and recycling of waste materials after use. Although the base material layer 1 may be a single layer, it may have a multilayer structure in which layers made of different materials are laminated as necessary. In order to control adhesion with the pressure-sensitive adhesive layer 3, the surface of the base material layer 1 may be subjected to surface roughening treatment such as matting treatment or corona treatment.

<Adhesive layer>
An adhesive composition that constitutes a known die bonding tape can be applied to the adhesive layer 5. Specifically, the adhesive composition constituting the adhesive layer 5 preferably contains an epoxy group-containing acrylic copolymer, an epoxy resin and an epoxy resin curing agent. The adhesive layer 5 containing these components is excellent in adhesion between chips / substrates and between chips / chips, and can also provide electrode embeddability, wire embeddability, etc., and adhesion at a low temperature in the die bonding process. This method is preferable because it has excellent characteristics such as excellent curing in a short time and excellent reliability after molding with a sealant.

  As an epoxy resin, for example, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, alicyclic epoxy resin, aliphatic chain epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, Bisphenol A novolac type epoxy resin, diglycidyl ether of biphenol, diglycidyl ether of naphthalenediol, diglycidyl ether of phenol, diglycidyl ether of alcohols, and alkyl-substituted products of these, halides And bifunctional epoxy resins such as a hydrogen additive, and novolac epoxy resins. In addition, other generally known epoxy resins such as polyfunctional epoxy resins and heterocycle-containing epoxy resins may be applied. These can be used alone or in combination of two or more. In addition, components other than an epoxy resin may be contained as an impurity in the range which does not impair a characteristic.

  Examples of the epoxy resin curing agent include those such as phenol resins which can be obtained by reacting a phenol compound and a xylylene compound which is a divalent linking group in the presence of a non-catalyst or an acid catalyst. As a phenol compound used for manufacture of phenol resin, phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, p-ethylphenol, o-n-propylphenol, m-n-propylphenol, p-n-propylphenol, o-isopropylphenol, m-isopropylphenol, p-isopropylphenol, o-n-butylphenol, m-n-butylphenol, p-n-butylphenol, o-isobutylphenol, m-isobutylphenol, p-isobutylphenol, octylphenol, nonylphenol, 2,4-xylenol, 2,6-xylenol, 3,5-xylenol, 2,4,6-trimethylphenol, resorcin, catechol, hydroquinone, 4 Methoxyphenol, o-phenylphenol, m-phenylphenol, p-phenylphenol, p-cyclohexylphenol, o-allylphenol, p-allylphenol, o-benzylphenol, p-benzylphenol, o-chlorophenol, p- Chlorophenol, o-bromophenol, p-bromophenol, o-iodophenol, p-iodophenol, o-fluorophenol, m-fluorophenol, p-fluorophenol and the like are exemplified. These phenol compounds may be used alone or in combination of two or more. As a xylylene compound which is a bivalent coupling group used for manufacture of a phenol resin, xylylene dihalide, xylylene diglycol, and its derivative (s) shown next can be used. That is, α, α′-dichloro-p-xylene, α, α′-dichloro-m-xylene, α, α′-dichloro-o-xylene, α, α′-dibromo-p-xylene, α, α ′ -Dibromo-m-xylene, α, α'-dibromo-o-xylene, α, α'-diiodo-p-xylene, α, α'-diiodo-m-xylene, α, α'-diiodo-o-xylene Α, α'-dihydroxy-p-xylene, α, α'-dihydroxy-m-xylene, α, α'-dihydroxy-o-xylene, α, α'-dimethoxy-p-xylene, α, α'-. Dimethoxy-m-xylene, α, α′-dimethoxy-o-xylene, α, α′-diethoxy-p-xylene, α, α′-diethoxy-m-xylene, α, α′-diethoxy-o-xylene, α, α'-di-n-propoxy-p-xylene, α, α'-di-n Propoxy-m-xylene, α, α′-di-n-propoxy-o-xylene, α, α′-di-isopropoxy-p-xylene, α, α′-diisopropoxy-m-xylene, α, α, α′-di-isopropoxy-p-xylene α′-diisopropoxy-o-xylene, α, α′-di-n-butoxy-p-xylene, α, α′-di-n-butoxy-m-xylene, α, α′-di-n-x-ylene Butoxy-o-xylene, α, α′-diisobutoxy-p-xylene, α, α′-diisobutoxy-m-xylene, α, α′-diisobutoxy-o-xylene, α, α′-di-tert-butoxy- p-xylene, α, α'-di-tert-butoxy-m-xylene, α, α'-di-tert-butoxy-o-xylene can be mentioned. These can be used alone or in combination of two or more.

  When the above-mentioned phenol compound and xylylene compound are reacted, mineral acids such as hydrochloric acid, sulfuric acid, phosphoric acid and polyphosphoric acid; organic substances such as dimethyl sulfuric acid, diethyl sulfuric acid, p-toluenesulfonic acid, methanesulfonic acid and ethanesulfonic acid Carboxylic acids; Super strong acids such as trifluoromethane sulfonic acid; Strong acid ion exchange resins such as alkane sulfonic acid type ion exchange resins; Super strong ion exchange resins such as perfluoroalkane sulfonic acid type ion exchange resins Resins (trade name: Nafion, Nafion, Du Pont, "Nafion" is a registered trademark); Natural and synthetic zeolites; Activated clay (acid clay) using acid catalysts such as, substantially at 50 to 250 ° C It is obtained by the reaction until the xylylene compound which is the raw material disappears and the reaction composition becomes constant. The reaction time depends on the raw materials and the reaction temperature, but is about 1 hour to 15 hours, and may be determined while tracking the reaction composition by GPC (gel permeation chromatography) or the like.

  The epoxy group-containing acrylic copolymer is preferably a copolymer obtained by using glycidyl acrylate or glycidyl methacrylate as a raw material in an amount of 0.5 to 6% by mass with respect to the obtained copolymer. When the amount is 0.5% by mass or more, high adhesive strength can be easily obtained, and when the amount is 6% by mass or less, gelation can be suppressed. As the remainder, alkyl acrylate having an alkyl group having 1 to 8 carbon atoms such as methyl acrylate and methyl methacrylate, alkyl methacrylate, and a mixture of styrene, acrylonitrile and the like can be used. Among these, ethyl (meth) acrylate and / or butyl (meth) acrylate are particularly preferable. The mixing ratio is preferably adjusted in consideration of the Tg of the copolymer. If the Tg is less than -10 ° C, the tackiness of the adhesive layer 5 in the B-stage state tends to be large, and the handleability tends to be deteriorated. In addition, the upper limit of the glass transition point (Tg) of an epoxy-group-containing acrylic copolymer is 30 degreeC, for example. The polymerization method is not particularly limited, and examples thereof include pearl polymerization and solution polymerization. Examples of commercially available epoxy group-containing acrylic copolymers include HTR-860P-3 (trade name, manufactured by Nagase ChemteX Co., Ltd.).

  The weight average molecular weight of the epoxy group-containing acrylic copolymer is at least 100,000, and the adhesion and heat resistance are high when it is in this range, preferably 300,000 to 3,000,000, and 500,000 to 2,000,000. Is more preferred. It can suppress that the fillability between a semiconductor chip and the board | substrate which supports this falls that a weight average molecular weight is 3 million or less. The weight average molecular weight is a polystyrene conversion value using a calibration curve with standard polystyrene in gel permeation chromatography (GPC).

  The adhesive layer 5 may further contain a curing accelerator such as tertiary amines, imidazoles and quaternary ammonium salts, as necessary. Specific examples of the curing accelerator include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole and 1-cyanoethyl-2-phenylimidazolium trimellitate. One of these may be used alone, or two or more may be used in combination.

  The adhesive layer 5 may further contain an inorganic filler, if necessary. Specific examples of the inorganic filler include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate, aluminum borate, boron nitride, Examples include crystalline silica and amorphous silica. One of these may be used alone, or two or more may be used in combination.

  The thickness of the adhesive layer 5 is, for example, 1 to 300 μm, preferably 5 to 150 μm, and more preferably 10 to 100 μm. If the thickness of the adhesive layer 5 is less than 1 μm, the adhesion tends to be insufficient, while if it exceeds 300 μm, the parting ability and pick-up property at the time of expansion tend to be insufficient.

  As mentioned above, although embodiment of this invention was described in detail, this invention is not limited to the said embodiment. For example, in the above embodiment, the dicing die bonding integrated tape 10 including the base material layer 1, the pressure-sensitive adhesive layer 3, and the adhesive layer 5 in this order is illustrated, but an embodiment not including the adhesive layer 5 It may be FIG. 2 is a cross-sectional view schematically showing an embodiment of the pressure-sensitive adhesive tape for dicing according to the present invention. The dicing pressure-sensitive adhesive tape 20 shown in FIG. 1 includes a base material layer 1 and a pressure-sensitive adhesive layer 3 provided on the base material layer 1. Moreover, the tapes 10 and 20 may further be provided with a cover tape (not shown) which protects the outermost layer on the opposite side to the base material layer 1. That is, the tape 10 may further include a cover tape covering the adhesive layer 5, and the tape 20 may further include a cover tape covering the adhesive layer 3.

  Hereinafter, the present invention will be more specifically described based on examples, but the present invention is not limited to these examples. All chemicals used reagents unless otherwise noted.

Example 1
[Synthesis of Acrylic Resin (Production Example 1)]
The following components were placed in a 2000 ml flask equipped with a three-one motor, a stirrer, and a nitrogen inlet tube.
-Ethyl acetate (solvent): 635 g
-2-ethylhexyl acrylate: 395 g
-2-hydroxyethyl acrylate: 100 g
-5g of methacrylic acid
・ Azobisisobutyro nitrile: 0.2 g

  After stirring the contents until it became uniform, bubbling was carried out at a flow rate of 500 ml / min for 60 minutes to degas the dissolved oxygen in the system. The temperature was raised to 78 ° C. over 1 hour, and polymerization was carried out for 6 hours after the temperature rise. Next, the reaction solution is transferred to a pressure vessel with a capacity of 2000 ml equipped with a three-one motor, a stirring blade, and a nitrogen introduction pipe, heated at 120 ° C. and 0.28 MPa for 4.5 hours, and then room temperature (25 ° C., and so forth) Cooled).

  Next, 490 g of ethyl acetate was added and stirred and diluted. To this, 0.025 g of methoquinone as a polymerization inhibitor and 0.10 g of dioctyltin dilaurate as a urethanization catalyst are added, then 81 g of 2-methacryloxyethyl isocyanate (Karenz MOI (trade name) manufactured by Showa Denko KK) The reaction was added, reacted at 70 ° C. for 6 hours, and cooled to room temperature. Subsequently, ethyl acetate was added to adjust the non-volatile content in the acrylic resin solution to be 35% by mass, and a solution containing a chain polymerizable (A) acrylic resin (Production Example 1) was obtained. .

  The solution containing (A) acrylic resin obtained as described above was vacuum dried at 60 ° C. overnight. The solid content obtained thereby was subjected to elemental analysis by a fully automatic elemental analyzer (manufactured by Elemental Co., Ltd., product surface: varioEL), and the content of introduced 2-methacryloxyethyl isocyanate was calculated from the nitrogen content. , 0.89 mmol / g.

  Moreover, the polystyrene conversion weight average molecular weight of (A) acrylic resin was calculated | required using the following apparatuses. That is, SD-8022 / DP-8020 / RI-8020 manufactured by Tosoh Corp. is used, Gelpack GL-A150-S / GL-A160-S manufactured by Hitachi Chemical Co., Ltd. is used for the column, and tetrahydrofuran is used for the eluent. GPC measurement was performed. As a result, the weight average molecular weight in terms of polystyrene was 280,000. The hydroxyl value and the acid value measured according to the method described in JIS K 0070 were 32.8 mg KOH / g and 6.5 mg KOH / g. These results are summarized in Table 1 below.

[Preparation of dicing tape (adhesive layer)]
A varnish for pressure-sensitive adhesive layer formation was prepared by mixing the following components (see Table 2). The amount of ethyl acetate (solvent) was adjusted so that the total solid content of the varnish was 25% by mass.
-(A) Acrylic resin solution (Production Example 1): 100 g (solid content)
-(B) Photopolymerization initiator (1-hydroxycyclohexyl phenyl ketone, manufactured by Ciba Specialty Chemicals Ltd., Irgacure 184, "Irgacure" is a registered trademark): 0.8 g
・ (B) Photopolymerization initiator (Bis (2,4,6-trimethyl benzoyl) -phenyl phosphine oxide, manufactured by Ciba Specialty Chemicals Inc., Irgacure 819, “Irgacure” is a registered trademark): 0.2 g
· (C) Crosslinking agent (polyfunctional isocyanate, manufactured by Nippon Polyurethane Industry Co., Ltd., Coronate L, solid content: 75%): 8.0 g (solid content)
-Ethyl acetate (solvent)

  A polyethylene terephthalate film (width 450 mm, length 500 mm, thickness 38 μm) whose release treatment was performed on one side was prepared. After applying the varnish for adhesive layer formation using the applicator on the surface to which the mold release process was performed, it dried at 80 degreeC for 5 minutes. Thus, a laminate (dicing tape) comprising a polyethylene terephthalate film and a 10 μm thick adhesive layer formed thereon was obtained.

  A polyolefin film (width 450 mm, length 500 mm, thickness 100 μm) of which one surface was subjected to corona treatment was prepared. The surface subjected to the corona treatment and the adhesive layer of the laminate were bonded at room temperature. Then, the pressure-sensitive adhesive layer was transferred to the polyolefin film (cover film) by pressing with a rubber roll. Then, the dicing tape with a cover film was obtained by leaving it to stand at room temperature for 3 days.

[Preparation of die bonding tape (adhesive layer)]
First, cyclohexanone (solvent) was added to the following composition, the mixture was stirred and mixed, and the mixture was further kneaded using a bead mill for 90 minutes.
Epoxy resin (YDCN-703 (trade name), manufactured by Nippon Steel Sumikin Chemical Co., Ltd., cresol novolac epoxy resin, epoxy equivalent 210, molecular weight 1200, softening point 80 ° C.): 55 parts by mass Phenolic resin (MILEX XLC-LL ( Trade name) Mitsui Chemicals, Inc., Phenolic resin, hydroxyl equivalent 175, water absorption 1.8%, weight loss 4% at 350 ° C: 45 parts by mass Silane coupling agent (NUC A-189 (product Name), NUC Co., Ltd., γ-mercaptopropyltrimethoxysilane: 1.7 parts by mass Silane coupling agent (NUCA-1160 (trade name), Nippon Unicar Co., Ltd., γ-ureidopropyltriethoxysilane) : 3.2 parts by mass, filler (Aerosil R 972 (trade name), manufactured by Nippon Aerosil Co., Ltd., Mo, average particle diameter 0.016 μm): 32 parts by mass Incidentally, “Aerosil R 972” is a filler having an organic group such as a methyl group on the surface of a silica particle, and the surface of the silica particle is coated with dimethyldichlorosilane It was obtained by hydrolyzing dimethyldichlorosilane in a 400 ° C. reactor.

The following components were added to the composition obtained as described above, and through the steps of stirring and mixing and vacuum degassing, a varnish for forming an adhesive layer was obtained.
Epoxy-containing acrylic copolymer (HTR-860P-3 (trade name), Nagase ChemteX Co., Ltd., weight average molecular weight 800,000): 280 parts by mass Curing accelerator (Cuazole 2PZ-CN (trade name), Shikoku Kasei Kogyo Co., Ltd., 1-cyanoethyl-2-phenylimidazole, "cuazole" is a registered trademark 0.5 part by mass

  The polyethylene terephthalate film (35 micrometers in thickness) in which the release process was performed to one side was prepared. After applying the varnish for adhesive-layer formation using the applicator on the surface in which the mold release process was performed, it heat-dried at 140 degreeC for 5 minutes. Thus, a laminate (die bonding tape) comprising a polyethylene terephthalate film (carrier tape) and an adhesive layer (B stage state) with a thickness of 10 μm formed thereon was obtained.

[Production of dicing die bonding integrated tape]
The die bonding tape consisting of the adhesive layer and the carrier film was cut into a circle having a diameter of 335 mm together with the carrier tape. After sticking the dicing tape which peeled the polyethylene terephthalate film to this at room temperature, it was left to stand at room temperature for 1 day. Thereafter, the dicing tape was cut into a circle having a diameter of 370 mm. Thus, a dicing die bonding integrated tape according to Example 1 was obtained.

(1) Measurement of storage elastic modulus of pressure-sensitive adhesive layer (before curing by ultraviolet irradiation)
The storage elastic modulus of the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer was measured as follows using a dynamic viscoelasticity measuring device manufactured by UBM Corporation. By sequentially laminating the pressure-sensitive adhesive layer of the above-mentioned dicing tape (a laminate of a polyethylene terephthalate film and a pressure-sensitive adhesive layer having a thickness of 10 μm), a sample consisting of a pressure-sensitive adhesive composition having a thickness of 150 μm was obtained. The measurement conditions were a distance between chucks of 20 mm, a frequency of 1 Hz, and a temperature rising rate of 3 ° C./min, and storage elastic modulus up to -70 ° C. to 100 ° C. was measured. From this measurement result, the storage elastic modulus at -15.degree. C. before curing treatment by ultraviolet irradiation was determined.

(2) Measurement of storage elastic modulus of pressure-sensitive adhesive layer (after curing treatment by ultraviolet irradiation)
The storage elasticity at -70 ° C. to 100 ° C. of the pressure-sensitive adhesive composition is the same as in the above (1) except that a 150 μm-thick sample consisting of the pressure-sensitive adhesive composition irradiated with ultraviolet light is targeted for measurement. The rate was measured. From this measurement result, the storage elastic modulus at 25 ° C. after curing treatment by ultraviolet irradiation was determined. The sample was irradiated with ultraviolet light (light source: metal halide lamp, main wavelength: 365 nm) using a conveyor UV irradiation apparatus CS60 (manufactured by GS Yuasa Corporation). The ultraviolet light was irradiated for 3 seconds at an illuminance of 70 mW / cm ² .

(3) Evaluation of stealth dicing property After forming the modified region by irradiating the semiconductor wafer with a laser, the stealth dicing property (wafer dividing property and adhesive layer dividing property) was evaluated by performing the expanding step. . That is, a semiconductor wafer (silicon wafer, thickness 50 μm, outer diameter 12 inches) was prepared. The adhesive layer was exposed by peeling the polyethylene terephthalate film from the dicing die bonding integrated tape. A dicing die bonding integrated tape was attached to the semiconductor wafer such that the adhesive layer was in close contact with one surface of the semiconductor wafer.

Stealth dicing was performed on a laminate including a semiconductor wafer (semiconductor wafer / adhesive layer / adhesive layer / substrate layer) using a laser dicing apparatus (MAHOHDICING MACHINE, manufactured by Tokyo Seimitsu Co., Ltd.). The conditions were as follows.
Laser light source: semiconductor laser pumped Nd (YAG laser)
Wavelength: 1064 nm
Laser beam spot cross section: 3.14 × 10 ^-8 cm ²
Oscillation type: Q switch pulse Repetition frequency: 100 kHz
Pulse width: 30 ns
Power: 20 μJ / pulse laser light quality: TEM00
Polarization characteristics: Linear polarization · Focusing lens magnification: 50 times · NA: 0.55
・ Transmittance for laser light wavelength: 60%
Movement speed of the table on which the semiconductor wafer is placed: 100 mm / sec

The laminate (semiconductor wafer / adhesive layer / adhesive layer / substrate layer) including the semiconductor wafer after formation of the modified region was fixed to the expand device. Next, the adhesive layer and the semiconductor wafer were divided by expanding a dicing tape (pressure-sensitive adhesive layer / substrate layer) under the following conditions. Thus, a semiconductor chip with adhesive pieces was obtained. In addition, although expand was implemented on condition of the following in this test example, expand conditions ("height", "speed", etc.) may be suitably adjusted according to the physical property of a base film, temperature conditions, etc.
Device: DDS 2300 (Fully Automatic Die Separator) manufactured by Disco Corporation
Cool expand conditions:
Temperature: -15 ° C, Height (Height): 9 mm, Cooling time: 60 seconds Speed: 300 mm / sec, Waiting time: 0 seconds

The expanded semiconductor wafer and adhesive layer were observed from the semiconductor wafer side with a microscope to evaluate whether the semiconductor wafer and adhesive layer were divided at predetermined positions. Microscopic observation was performed on the peripheral and central portions of the wafer, and the severability was evaluated according to the following criteria.
A: The severability of the wafer and the adhesive layer was 95% or more and 100% or less.
B: F splitability of the wafer and the adhesive layer was 90% or more and less than 95%.
C: The severability of the wafer and the adhesive layer was 30% or more and less than 90%.
D: The severability of the wafer and the adhesive layer was less than 30%.
The division (unit:%) is a ratio of the number of lines that can be divided to the total number of lines to be divided.

(4) Evaluation of Pickup Property The semiconductor wafer (semiconductor chip) after the expanding step was irradiated with ultraviolet light for 3 seconds at an illuminance of 70 mW / cm ² from the base material layer side. The pickup properties of the semiconductor chip were evaluated using a flexible die bonder DB-730 (trade name) manufactured by Renesas East Japan Semiconductor Company. For the pickup collet, RUBBER TIP 13-087E-33 (trade name, size: 5 × 5 mm) manufactured by Micromechanics, Inc. was used. As a push-up pin, EJECTOR NEEDLE SEN 2-83-05 (trade name, diameter: 0.7 mm, tip shape: semicircle having a diameter of 350 μm) manufactured by Micromechanics, Inc. was used. Five push-up pins were arranged at a pin center interval of 4.2 mm. The pick-up property was evaluated under the conditions of 10 mm / sec of push-up speed of pin at pick-up and 200 μm of push-up height, and the pick-up property was evaluated according to the following criteria.
A: 100 chips were continuously picked up, and chip breakage or pickup errors did not occur.
B: 100 chips were continuously picked up, and the ratio of occurrence of chip breakage or pickup error was more than 0% and 5% or less.
C: 100 chips were continuously picked up, and the rate of occurrence of chip breakage or pickup error was 5% or more.

<Examples 2 to 7 and Comparative Examples 1 to 3>
[Synthesis of Acrylic Resin (Production Examples 2 to 9)]
A solution of (A) acrylic resin according to Production Examples 2 to 9 was obtained using the same method as Production Example 1 except that the monomers shown in Table 1 were used. In the same manner as in Example 1 except that the composition of the pressure-sensitive adhesive layer is as shown in Tables 2 and 3, a dicing die bonding integrated type tape according to Examples 2 to 7 and Comparative Examples 1 to 3 is produced. And made various evaluations.

  As shown in Table 2, the dicing die bonding integrated type tape according to Examples 1 to 7 is excellent in the dividing property of the semiconductor wafer and the adhesive layer after stealth dicing, and even if the pushing height is as low as 200 μm. It is possible to pick up.

  Comparative Example 1 is a comparative example in which the amount of the crosslinking agent is smaller than that of Example 1 although the acrylic resin according to Production Example 1 is used. In Comparative Example 1, undivided adhesive layer particularly occurred after stealth dicing, and the pick-up property was also insufficient. It is inferred that these are caused by the low storage elastic modulus at -15 [deg.] C. before the curing treatment by UV irradiation (before UV).

  Comparative Example 2 is a comparative example using an acrylic resin (using 4-hydroxybutyl acrylate as a part of the raw material) according to Production Example 8. In Comparative Example 2, undivided semiconductor wafer and adhesive layer were generated after stealth dicing, and the subsequent pickup could not be performed.

  Comparative Example 3 is a comparative example using the acrylic resin according to Production Example 9 (an acrylic resin having a smaller number of functional groups capable of chain transfer as compared to Production Example 2). In Comparative Example 3, the pickup could not be performed. This is presumed to be due to the low storage elastic modulus before the curing treatment (after UV) by ultraviolet irradiation.

  According to the present invention, there is provided a pressure-sensitive adhesive tape for dicing and a dicing die-bonding integrated-type tape capable of achieving sufficiently high splitability of a semiconductor wafer and pickup performance of a semiconductor chip in a manufacturing process of semiconductor devices including stealth dicing. Provided.

DESCRIPTION OF SYMBOLS 1 ... base material layer, 3 ... adhesive layer, 5 ... adhesive layer, 10 ... dicing die bonding integrated tape, 20 ... adhesive tape for dicing

Claims (6)

A substrate layer,
A pressure-sensitive adhesive layer provided on the substrate layer,
An adhesive tape for dicing comprising at least
The pressure-sensitive adhesive layer contains a (meth) acrylic resin, a photopolymerization initiator, and a crosslinking agent, and has a storage elastic modulus at −15 ° C. of 40 MPa or more before curing treatment by ultraviolet irradiation, and The adhesive tape whose storage elastic modulus in 25 degreeC is 100 Mpa or more after the hardening process by ultraviolet irradiation.   The pressure-sensitive adhesive tape according to claim 1, wherein the (meth) acrylic resin has one or more aromatic rings. The (meth) acrylic resin contains a functional group capable of chain polymerization,
The pressure-sensitive adhesive tape according to claim 1, wherein the functional group is at least one selected from an acryloyl group and a methacryloyl group.   The cross-linking agent is a reaction product of a polyfunctional isocyanate having two or more isocyanate groups in one molecule and a polyhydric alcohol having three or more OH groups in one molecule. The adhesive tape as described in or.   The pressure-sensitive adhesive tape according to any one of claims 1 to 4, wherein the photopolymerization initiator is a photoradical polymerization initiator. The pressure-sensitive adhesive tape according to any one of claims 1 to 5,
An adhesive layer provided on the adhesive layer of the adhesive tape;
A dicing die bonding integrated tape comprising:

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