KR20210127093A - Dicing die-bonding film - Google Patents

Abstract

A dicing die-bonding film according to the present invention is provided with a dicing tape in which an adhesive layer is laminated on a base material layer, and a die bonding layer laminated in the adhesive layer of the dicing tape, wherein the adhesive layer comprises a photopolymerization initiator. A molecular weight distribution curve obtained by GPC measuring the adhesive layer before curing has a polydispersion Mw/Mn of 1.3 or higher which is a ratio of a mass average molecular weight Mw of a peak appearing on the highest molecular weight side to a number average molecular weight Mn of the peak appearing on the highest molecular weight side.

Description

Dicing die-bonding film {DICING DIE-BONDING FILM}

The present invention relates to a dicing die bond film.

DESCRIPTION OF RELATED ART Conventionally, in manufacture of a semiconductor device, in order to obtain the semiconductor chip for die bonding, it is known to use a dicing die-bonding film (for example, patent document 1).

The said dicing die-bonding film is equipped with the dicing tape by which the adhesive layer was laminated|stacked on the base material layer, and the die-bonding layer laminated|stacked so that peeling was possible on the adhesive layer of this dicing tape.

And, as a method of obtaining a semiconductor chip (die) for die bonding using the dicing die bonding film, a half-cut process of forming a groove in the semiconductor wafer to process the semiconductor wafer into a chip (die) by cutting process; , a backgrind process of grinding the semiconductor wafer after the half-cut process to make the thickness thin, and one surface (for example, the surface opposite to the circuit surface) of the semiconductor wafer after the backgrind process is attached to the die bond layer, and dicing A mounting process of fixing the semiconductor wafer to the tape, an expanding process of widening the gap between the half-cut semiconductor chips, a cuff holding process of maintaining the distance between the semiconductor chips, and peeling between the die bond layer and the adhesive layer It is known that a method having a pick-up process of taking out a semiconductor chip in a state where the die-bonding layer is affixed is employed.

And in the said pick-up process, the semiconductor chip (henceforth a die-bonding layer-equipped semiconductor chip) taken out in the state adhered to the die-bonding layer is adhere|attached to the wiring board which is a to-be-adhered body.

The pressure-sensitive adhesive layer is usually a resin such as a (meth)acrylic resin, a crosslinking agent that reacts with the resin to polymerize the resins, and an active species that enables chain polymerization of the resins by irradiating radiation such as ultraviolet rays. contains a photopolymerization initiator that generates In such an adhesive layer, when irradiated with radiation, such as an ultraviolet-ray, a hardening reaction advances, and since the peeling force between the said die-bonding layers falls, peeling of the said adhesive layer from the said die-bonding layer can be performed comparatively easily.

Japanese Patent Laid-Open No. 2019-9203 Japanese Patent Laid-Open No. 2019-67996

By the way, as mentioned above, although the said die-bonding layer peels (removes) from the said adhesive layer in the said pick-up process, before the said pick-up process, the said die-bonding layer and the said adhesive layer are in contact. is in

Therefore, when the said photoinitiator is contained in the said adhesive layer as mentioned above, the said photoinitiator may transfer to the said die-bonding layer from the said adhesive layer.

As described above, when the photopolymerization initiator transfers from the pressure-sensitive adhesive layer to the die-bonding layer, the pressure-sensitive adhesive layer may not satisfy the required properties or the die-bonding layer may not meet the required properties. Not desirable.

However, it is hard to say that sufficient examination is still made about suppressing the migration of the said photoinitiator from the said adhesive layer to the said die-bonding layer.

Then, this invention makes it a subject to provide the dicing die-bonding film which can comparatively suppress the migration of the photoinitiator from an adhesive layer to a die-bonding layer.

The dicing die-bonding film according to the present invention comprises:

A dicing tape in which an adhesive layer is laminated on a base material layer;

A die-bonding layer laminated on the pressure-sensitive adhesive layer of the dicing tape,

The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive and a photopolymerization initiator,

In the molecular weight distribution curve obtained by GPC measurement of the pressure-sensitive adhesive layer before curing, polydispersity Mw/Mn, which is the ratio of the mass average molecular weight Mw of the peak appearing on the highest molecular weight side to the number average molecular weight Mn of the peak appearing on the highest molecular weight side This is 1.3 or more.

In the dicing die bond film,

In the molecular weight distribution curve obtained by performing GPC measurement of the said adhesive layer before hardening, it is preferable that the value of the peak top molecular weight of the peak appearing most on the high molecular weight side is 33,000 or less.

In the dicing die bond film,

It is preferable that the said adhesive layer before hardening contains less than 32 mass % of sol components.

In the dicing die bond film,

It is preferable that the peeling force of the said die-bonding layer with respect to the said adhesive layer is less than 0.18N/20mm after hardening of the said adhesive layer.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows the structure of the dicing die-bonding film which concerns on one Embodiment of this invention.
Fig. 2A is a cross-sectional view schematically showing a mode of half-cut processing in a method for manufacturing a semiconductor integrated circuit;
It is sectional drawing which shows typically the aspect of the half-cut process in the manufacturing method of a semiconductor integrated circuit.
Fig. 2C is a cross-sectional view schematically showing an aspect of a backgrind process in a method for manufacturing a semiconductor integrated circuit.
It is sectional drawing which shows typically the aspect of the back-grind process in the manufacturing method of a semiconductor integrated circuit.
Fig. 3A is a cross-sectional view schematically showing an aspect of a mounting step in a method for manufacturing a semiconductor integrated circuit;
Fig. 3B is a cross-sectional view schematically showing a mode of a mounting step in a method for manufacturing a semiconductor integrated circuit;
Fig. 4A is a cross-sectional view schematically showing an aspect of an expand step at a low temperature in a method for manufacturing a semiconductor integrated circuit;
Fig. 4B is a cross-sectional view schematically showing an aspect of an expand step at a low temperature in a method for manufacturing a semiconductor integrated circuit;
Fig. 4C is a cross-sectional view schematically showing an aspect of an expand step at a low temperature in a method for manufacturing a semiconductor integrated circuit;
Fig. 5A is a cross-sectional view schematically showing a mode of an expand step at room temperature in a method for manufacturing a semiconductor integrated circuit;
Fig. 5B is a cross-sectional view schematically showing a mode of an expand step at room temperature in a method for manufacturing a semiconductor integrated circuit;
Fig. 6 is a cross-sectional view schematically showing a mode of a cuff holding step in a method for manufacturing a semiconductor integrated circuit;
It is sectional drawing which shows typically the aspect of the pick-up process in the manufacturing method of a semiconductor integrated circuit.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment of this invention is described.

[Dicing Die Bond Film]

As shown in FIG. 1 , the dicing die-bonding film 20 according to the present embodiment includes a dicing tape 10 in which an adhesive layer 2 is laminated on a base material layer 1 , and a dicing tape 10 . ) and a die-bonding layer (3) laminated on the pressure-sensitive adhesive layer (2).

In the dicing die-bonding film 20 , a semiconductor wafer is affixed on the die-bonding layer 3 .

In cutting the semiconductor wafer using the dicing die-bonding film 20, the die-bonding layer 3 is also cut together with the semiconductor wafer. The die-bonding layer 3 is cut into a size corresponding to the size of a plurality of individualized semiconductor chips. Thereby, the semiconductor chip provided with the die-bonding layer 3 can be obtained.

In the dicing die-bonding film 20 according to the present embodiment, the pressure-sensitive adhesive layer 2 contains an pressure-sensitive adhesive and a photopolymerization initiator. The adhesive layer 2 is hold|maintained by sticking the semiconductor wafer for segmentation into a semiconductor chip.

As said adhesive, what can reduce adhesive force by the action|action from the outside in the use process of the dicing tape 10 (henceforth an adhesive reduction type adhesive) is mentioned.

When a pressure-sensitive adhesive is used as the pressure-sensitive adhesive, in the process of using the dicing tape 10, the pressure-sensitive adhesive layer 2 exhibits a relatively high adhesive strength (hereinafter referred to as a high-adhesion state) and a relatively low adhesive strength. The indicated state (hereinafter, referred to as a low-adhesion state) can be used separately.

For example, when the semiconductor wafer affixed to the dicing tape 10 is provided for cleavage, it is suppressed that a plurality of semiconductor chips separated into pieces by cleavage of the semiconductor wafer are lifted or peeled from the pressure-sensitive adhesive layer 2 . To do this, a high-adhesion state is used.

On the other hand, in order to pick up a some semiconductor chip separated into pieces after cutting|disconnection of a semiconductor wafer, in order to make it easy to pick up a some semiconductor chip from the adhesive layer 2, the low adhesive state is used.

As said adhesive reduction type adhesive, the adhesive (henceforth radiation hardening adhesive) which can be hardened by radiation in the use process of the dicing tape 10 is mentioned, for example.

As said radiation hardening adhesive, the adhesive of the type hardened|cured by irradiation of an electron beam, an ultraviolet-ray, alpha ray, beta ray, gamma ray, or X-ray is mentioned, for example. Among these, it is preferable to use the adhesive (ultraviolet hardening adhesive) hardened|cured by ultraviolet irradiation.

Examples of the radiation-curing pressure-sensitive adhesive include a base polymer as a main component, and a radiation-polymerizable monomer component or radiation-polymerizable oligomer component having a functional group such as a radiation-polymerizable carbon-carbon double bond. have.

It is preferable to use an acryl-type polymer as said base polymer.

As said acrylic polymer, the thing containing the monomer unit derived from (meth)acrylic acid ester is mentioned. As (meth)acrylic acid ester, meth)acrylic acid alkylester, (meth)acrylic acid cycloalkyl ester, (meth)acrylic acid aryl ester, etc. are mentioned, for example.

Examples of the acrylic polymer include 2-hydroxyethyl acrylate (HEA), ethyl acrylate (EA), butyl acrylate (BA), 2-ethylhexyl acrylate (2EHA), and isononyl acrylate (INA). , lauryl acrylate (LA), 4-acryloylmorpholine (AMCO), 2-isocyanatoethyl = methacrylate (MOI), etc. are preferably used.

These acrylic polymers may be used only by 1 type, and may be used in combination of 2 or more type.

Examples of the radiation polymerizable monomer component include urethane (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipenta and erythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and 1,4-butanediol di(meth)acrylate.

As said radiation polymerizable oligomer component, various oligomers, such as a urethane type, a polyether type, a polyester type, a polycarbonate type, a polybutadiene type, are mentioned, for example.

The content rate of the said radiation-polymerizable monomer component and the said radiation-polymerizable oligomer component in the said radiation-curing adhesive is selected from the range which reduces the adhesiveness of the adhesive layer 2 suitably.

Examples of the photopolymerization initiator contained in the pressure-sensitive adhesive layer 2 include α-ketol compounds, acetophenone compounds, benzoin ether compounds, ketal compounds, aromatic sulfonyl chloride compounds, photoactive oxime compounds, and benzophenes. Non-type compounds, thioxanthone-type compounds, camphorquinone, halogenated ketones, acylphosphine oxides, acyl phosphonates, etc. are mentioned.

It is preferable to use an optical radical generator as said photoinitiator. A photoradical generating agent generate|occur|produces a radical by irradiating an active energy ray (For example, an electron beam, an ultraviolet-ray, alpha-ray, a beta-ray, a gamma-ray, or X-ray).

As an optical radical generator, 2-hydroxy-1-(4-(4-(2-hydroxy-2methylpropionyl)benzoyl)phenyl)-2-methylpropan-1-one (as a commercial item, IGM Resins make of Omnirad 127), 2,2-dimethoxy-1,2-diphenylethan-1-one (as a commercially available product, Omnirad 651 manufactured by IGM Resins), 1-hydroxy-cyclohexylphenyl ketone (as a commercially available product, IGM Resins) Omnirad 184 manufactured by the company), 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one (as a commercial product, Omnirad 2959 manufactured by IGM Resins) , 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 (as a commercial item, Omnirad 369E manufactured by IGM Resins), bis(2,4,6-trimethylbenzoyl)-phenyl Phosphine oxide (as a commercial item, Omnirad 819 manufactured by IGM Resins), ethanone-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(O-acetyl) oxime) (as a commercial item, OXE02 by Irgacure company) etc. are mentioned.

Among these, 2-hydroxy-1-(4-(4-(2-hydroxy-2methylpropionyl)benzoyl)phenyl)-2-methylpropan-1-one (as a commercial product, Omnirad 127 manufactured by IGM Resins) was used. It is preferable to use

It is preferable that the adhesive layer 2 contains 0.1 mass part or more and 10 mass parts or less of the said photoinitiator.

In the dicing die-bonding film 20 according to the present embodiment, in the molecular weight distribution curve obtained by measuring the pressure-sensitive adhesive layer 2 before curing by GPC (gel permeation chromatography), the number average molecular weight of the peak appearing on the highest molecular weight side The polydispersity Mw/Mn, which is the ratio of the mass average molecular weight Mw of the peak appearing on the highest molecular weight side to Mn, is 1.3 or more.

When the polydispersity Mw/Mn is 1.3 or more, the low-molecular component is appropriately arranged between the polymer components in the pressure-sensitive adhesive layer 2 , so the photopolymerization initiator is transferred from the pressure-sensitive adhesive layer 2 to the die-bonding layer 3 . can be relatively suppressed.

Moreover, it is preferable that the said polydispersity Mw/Mn is 2.0 or more. When the polydispersity Mw/Mn is 2.0 or more, the transfer of the photopolymerization initiator from the pressure-sensitive adhesive layer 2 to the die-bonding layer 3 can be relatively suppressed, and the die-bonding layer 3 described later. In the pick-up process of peeling between and the adhesive layer 2 and taking out a semiconductor chip in the state which the die-bonding layer 3 was affixed WHEREIN: Peeling the die-bonding layer 3 from the adhesive layer 2 more easily can do it

Further, the polydispersity Mw/Mn is preferably 10 or less, preferably 5 or less, and more preferably 3 or less.

In addition, in this specification, the molecular weight distribution curve means a differential molecular weight distribution curve.

The GPC measurement of the adhesive layer 2 before hardening can be performed by employ|adopting the following measurement conditions with respect to the measurement sample prepared according to the following procedure, using HLC-8220GPC by Tosoh Corporation as an analysis apparatus.

[Preparation of measurement samples]

(1) About 0.2 g of a sample is acquired from the adhesive layer 2 before hardening.

(2) After the sample is wrapped in a mesh-like sheet, it is immersed in about 30 mL of toluene at room temperature (23±2° C.) for 1 week.

(3) The mesh-like sheet is taken out from the toluene, the toluene-insoluble content contained in the mesh-like sheet is removed, and a toluene solution containing a toluene-dissolving component is obtained.

(4) The toluene solution is treated at a temperature of 45° C. or lower under reduced pressure, toluene is removed from the toluene solution, and a solid substance of a toluene-dissolving component is obtained.

(5) After dissolving the said solid material in tetrahydrofuran (THF) so that a density|concentration may be 0.2 mass % and setting it as a THF solution, it is left to stand overnight.

(6) The THF solution left overnight is filtered through a 0.45 µm membrane filter, and the resulting filtrate is used as a measurement sample.

[Measuring conditions]

ㆍColumn: One TSKgel quaudcolumn SuperHZ-L (hereinafter referred to as the first column) manufactured by Tosoh Corporation, and;

Two TSKgel SuperHZM-M (hereinafter referred to as the second column) manufactured by Tosoh Corporation

Each of the columns is arranged in the analysis device such that two of the second columns are connected in series to the downstream side of the first column, and the eluent described later flows from the side of the first column.

ㆍColumn temperature: 40℃

ㆍEluent: tetrahydrofuran (THF)

ㆍFlow: Sample pump flow rate 0.3mL/min

Reference pump flow rate 1.0 mL/min

ㆍInjection amount: 10μL

ㆍDetector: Differential refractive index detector (RI)

In addition, in order to obtain a molecular weight distribution curve (differential molecular weight distribution curve) based on the measurement result of the measurement sample, each standard polystyrene manufactured by Tosoh Corporation was weighed so as to have a compounding mass shown in Table 1 below, and weighed. Each standard polystyrene is dissolved in 100 mL of THF to obtain a standard polystyrene solution STD1 and a standard polystyrene solution STD2, and also for these, GPC measurement is performed under the above measurement conditions using the above measuring apparatus.

The result of GPC measurement of the said measurement sample, the said STD1, and the said STD2 is data-analyzed using the analysis software GPC-8020 Model II (data management Version 5.10) manufactured by Tosoh Corporation.

In data analysis using the above analysis software, first, calibration curves for STD1 and STD2 (a calibration curve with the horizontal axis as time (min) and the vertical axis as the logarithm of the mass average molecular weight) are created, and these calibration curves are Based on the data analysis on the molecular weight of the measurement sample. The data analysis on the molecular weight of the measurement sample is performed after obtaining a molecular weight distribution curve for the peak P1 (the peak on the highest molecular weight side) detected earliest on the chromatogram. The number average molecular weight Mn and the mass average molecular weight Mw regarding the peak P1 can be obtained by performing data analysis about the molecular weight distribution curve concerning the peak P1.

In addition, when an overlap is confirmed between the falling portion of the peak P1 detected earliest and the rising portion of the peak P2 detected next to the peak P1, the baseline is drawn so as to extend in the horizontal direction from the rising start portion of the peak P1 as a starting point. A line is drawn vertically from the baseline toward the valley (the most concave part) that occurs between the falling part of the peak P1 and the rising part of the peak P2, and from the rising start part of the peak P1 to the valley part and , The number average molecular weight Mn and the mass average molecular weight Mw can be obtained for the peak P1 by analyzing the base line and the region demarcated by a line drawn perpendicularly from the baseline to the valley portion.

In the molecular weight distribution curve obtained by GPC measurement of the pressure-sensitive adhesive layer 2 before curing, the value of the peak top molecular weight of the peak appearing on the highest molecular weight side is preferably 33,000 or less, and more preferably 25,000 or less. When the value of the peak top molecular weight of the peak appearing on the highest molecular weight side is within the above numerical range, since the space in the vicinity of the molecular chain of the polymer component contained in the pressure-sensitive adhesive layer 2 can be made relatively small, the pressure-sensitive adhesive layer (2) It is possible to further suppress the migration of the photopolymerization initiator from the to the die bond layer 3 .

Moreover, in the molecular weight distribution curve obtained by GPC measurement of the adhesive layer 2 before hardening, it is preferable that it is 4,000 or more, and, as for the value of the peak top molecular weight of the peak which appears on the highest molecular weight side, it is more preferable that it is 8,000 or more. When the value of the peak top molecular weight of the peak appearing on the highest molecular weight side exists in the said numerical range, the space which arises between the polymer components contained in the adhesive layer 2 can be made comparatively small. Thereby, migration of the said photoinitiator from the adhesive layer 2 to the die-bonding layer 3 can be suppressed further.

It is preferable that the adhesive layer 2 before hardening contains less than 32 mass % of sol components.

Although it is thought that the said photoinitiator transfers from the adhesive layer 2 to the die-bonding layer 3 through a sol component, by making a sol component into the said numerical range, from the adhesive layer 2 to the die-bonding layer 3 migration of the photoinitiator can be further suppressed.

Moreover, it is preferable that the adhesive layer 2 before the said hardening contains 23 mass % or less of sol components.

By setting it as the said numerical range of a sol component, the transfer of the said photoinitiator from the adhesive layer 2 to the die-bonding layer 3 can be suppressed further, and the die-bonding layer 3 and the adhesive layer 2 The pick-up process of peeling between and taking out a semiconductor chip in the state in which the die-bonding layer 3 was stuck WHEREIN: The die-bonding layer 3 can be peeled further easily from the adhesive layer 2 .

In addition, as described in the measurement of the mass ratio of a sol component with a sol component in this specification, about 0.2 g of a sample is acquired from the adhesive layer 2 before hardening, and the sample is mixed with about 30 mL of toluene. It means the component which melt|dissolves in the said toluene after being immersed in the said toluene for 1 week.

The mass ratio of the sol component in the adhesive layer 2 before hardening can be calculated|required as follows.

[Measurement of mass ratio of sol components]

(1) About 0.2 g of a sample is acquired from the adhesive layer 2 before hardening.

(2) The sample is wrapped in a mesh-like sheet and then immersed in about 30 mL of toluene at room temperature for 1 week.

(3) The mesh-like sheet is taken out from the toluene, and the toluene-insoluble content contained in the mesh-like sheet is removed.

(4) After drying the toluene-insoluble content at 130° C. under normal pressure for about 2 hours, the toluene-insoluble content is weighed.

(5) The mass ratio of the gel component is calculated according to the following formula (1), and the mass ratio of the sol component is calculated according to the following formula (2) based on the calculated value of the mass ratio of the gel fraction.

Mass ratio (mass %) of gel component = [(weight value of toluene-insoluble content)/mass of acquisition sample] x 100... (One)

Mass ratio of the sol component (mass %) = 100 - The mass ratio of the gel component calculated by the above formula (1)... (2)

After curing of the pressure-sensitive adhesive layer 2, the peel force of the die-bonding layer 3 to the pressure-sensitive adhesive layer 2 is preferably less than 0.18 N/20 mm, more preferably 0.15 N/20 mm or less, and 0.07 It is more preferable that it is N/20 mm or less.

By making the peeling force of the die-bonding layer 3 with respect to the adhesive layer 2 after hardening of the adhesive layer 2 into the said numerical range, said pick-up process WHEREIN: From the adhesive layer 2 to the die-bonding layer. (3) can be peeled off more easily.

Moreover, it is preferable that the peeling force of the die-bonding layer 3 with respect to the adhesive layer 2 is 0.01 N/20mm or more after hardening of the adhesive layer 2 .

Moreover, by making the peeling force of the die-bonding layer 3 with respect to the adhesive layer 2 after hardening of the adhesive layer 2 into 0.07 N/20 mm or less, an above-mentioned pick-up process WHEREIN: The adhesive layer 2 ), the die bond layer 3 can be particularly easily peeled off.

The cured pressure-sensitive adhesive layer 2 is formed by irradiating radiation with a predetermined intensity (for example, ultraviolet rays of 150 J/cm 2 ) from the dicing tape 10 of the dicing die-bonding film 20 to which the backing tape is bonded. can be obtained

The peeling force of the die-bonding layer 3 with respect to the adhesive layer 2 after hardening of the adhesive layer 2 can be measured by a T-type peeling test. In the T-type peeling test, a radiation of a predetermined intensity is applied to a dicing die-bonding film 20 in which a backing tape (for example, “ELP BT315” manufactured by Nitto Denko Corporation) is bonded to the exposed surface of the die-bonding layer 3 . After curing the pressure-sensitive adhesive layer 2 by irradiation, a tensile tester (for example, a trade name “TG-1kN” ", Minebea Mitsumi Co., Ltd.), temperature 25 degreeC, it can carry out under the conditions of 300 mm/min of tensile speed|rate.

Before hardening of the adhesive layer 2, it is preferable that the peeling force of the die-bonding layer 3 with respect to the adhesive layer 2 is 0.3 N/20 mm or more.

In the pressure-sensitive adhesive layer 2 before curing, by making the peeling force of the die-bonding layer 3 with respect to the pressure-sensitive adhesive layer 2 in the numerical range as described above, the die-bonding layer 3 from the pressure-sensitive adhesive layer 2 is properly applied. can hold and support. Thereby, it is possible to further suppress the floating of the chip that occurs after the die-bonding layer 3 is separated into pieces.

Moreover, it is preferable that the peeling force of the die-bonding layer 3 with respect to the adhesive layer 2 is 5.0 N/20mm or less before hardening of the adhesive layer 2 .

The peeling force of the die-bonding layer 3 with respect to the adhesive layer 2 before hardening of the adhesive layer 2 can be measured by a T-type peeling test. In the T-type peeling test, from the dicing die-bonding film 20 in which a backing tape (for example, "ELP BT315" manufactured by Nitto Denko Co., Ltd.) was bonded to the exposed surface of the die-bonding layer 3, a width of 20 mm × Using a tensile tester (for example, trade name "TG-1kN", manufactured by Minebea Mitsumi Co., Ltd.), using a tensile tester (for example, trade name "TG-1kN", manufactured by Minebea Mitsumi), using a sample cut out to a dimension of 120 mm in length, under conditions of a temperature of 25°C and a tensile rate of 300 mm/min. can be done with

The pressure-sensitive adhesive layer 2 may contain an external crosslinking agent. Any external crosslinking agent can be used as long as it can react with a base polymer (eg, an acrylic polymer) to form a crosslinked structure. As such an external crosslinking agent, a polyisocyanate compound, an epoxy compound, a polyol compound, an aziridine compound, a melamine type crosslinking agent, etc. are mentioned, for example.

When the adhesive layer 2 contains an external crosslinking agent, it is preferable that the adhesive layer 2 contains 0.1 mass part or more and 3 mass parts or less of the said external crosslinking agent.

As mentioned above, the adhesive layer 2 may contain coloring agents, such as a tackifier (tackifier), antioxidant, a crosslinking promoter, an antioxidant, a pigment, or dye other than a component as mentioned above.

It is preferable that they are 1 micrometer or more and 50 micrometers or less, as for the thickness of the adhesive layer 2, it is more preferable that they are 2 micrometers or more and 30 micrometers or less, It is more preferable that they are 5 micrometers or more and 25 micrometers or less.

The thickness of the pressure-sensitive adhesive layer 2 can be obtained by, for example, measuring the thickness of five randomly selected points using a dial gauge (manufactured by PEACOCK, model R-205), and arithmetic average of these thicknesses. have.

The base material layer 1 supports the adhesive layer 2 . The base material layer 1 is produced using a resin film. Examples of the resin contained in the resin film include polyolefin, polyester, polyurethane, polycarbonate, polyether ether ketone, polyimide, polyether imide, polyamide, wholly aromatic polyamide, polyvinyl chloride, polyvinylidene chloride, Polyphenyl sulfide, a fluororesin, a cellulose resin, a silicone resin, etc. are mentioned.

Examples of the polyolefin include α-olefin homopolymers, copolymers of two or more α-olefins, block polypropylene, random polypropylene, and copolymers of one or two or more α-olefins with other vinyl monomers. can

The homopolymer of α-olefin is preferably a homopolymer of α-olefin having 2 or more and 12 or less carbon atoms. Examples of such a homopolymer include ethylene, propylene, 1-butene, and 4-methyl-1-pentene.

As the copolymer of two or more α-olefins, ethylene/propylene copolymer, ethylene/1-butene copolymer, ethylene/propylene/1-butene copolymer, ethylene/C5 or more and α-olefin copolymer with 12 or less carbon atoms, propylene /ethylene copolymer, propylene/1-butene copolymer, propylene/C5 or more and α-olefin copolymer with 12 or less, etc. are mentioned.

An ethylene-vinyl acetate copolymer (EVA) etc. are mentioned as a copolymer of 1 type, or 2 or more types of alpha-olefin, and another vinyl monomer.

The polyolefin may be what is called an α-olefin thermoplastic elastomer. Examples of the α-olefin thermoplastic elastomer include a combination of a propylene/ethylene copolymer and a propylene homopolymer, or a propylene/ethylene/C4 or more α-olefin terpolymer.

As a commercial item of (alpha)-olefin type thermoplastic elastomer, Vistamax 3980 (made by ExxonMobil Chemicals) which is a propylene type elastomer resin is mentioned, for example.

The resin film may contain 1 type of said resin, and may contain 2 or more types of above-mentioned resin.

Moreover, when the adhesive layer 2 contains the ultraviolet curing adhesive mentioned later, it is preferable that the resin film which produces the base material layer 1 is comprised so that it may have ultraviolet transmission.

A single layer structure may be sufficient as the base material layer 1, and a laminated structure may be sufficient as it. Although the base material layer 1 may be obtained by non-stretch molding and may be obtained by stretch molding, it is preferable that it is obtained by stretch molding. When the substrate layer 1 has a laminated structure, the substrate layer 1 has a layer containing an elastomer (hereinafter referred to as an elastomer layer) and a layer containing a non-elastomer (hereinafter referred to as a non-elastomeric layer). desirable.

When the base material layer 1 has an elastomer layer and a non-elastomeric layer, the elastomer layer can function as a stress relieving layer for relieving tensile stress. That is, since the tensile stress which arises in the base material layer 1 can be made comparatively small, it can be made comparatively easy to extend|stretch the base material layer 1, having moderate hardness.

Thereby, the cleavability from a semiconductor wafer to a some semiconductor chip can be improved.

Moreover, it can suppress that the base material layer 1 is torn and damaged at the time of cutting in an expand process.

In addition, in this specification, an elastomer layer means the low elastic modulus layer whose tensile storage elastic modulus at room temperature is low compared with a non-elastomeric layer. Examples of the elastomer layer include those having a tensile storage elastic modulus of 10 Mpa or more and 200 MPa or less at room temperature, and examples of the non-elastomeric layer include those having a tensile storage elastic modulus of 200 Mpa or more and 500 MPa or less at room temperature.

The elastomer layer may contain one elastomer or two or more elastomers, but preferably contains an α-olefin thermoplastic elastomer or EVA (ethylene-vinyl acetate copolymer).

The non-elastomer layer may contain one type of non-elastomer or may contain two or more types of non-elastomer, but preferably contains the metallocene PP described later.

When the base layer 1 has an elastomeric layer and a non-elastomeric layer, the base layer 1 has an elastomer layer as a central layer, and has a three-layer structure (ratio) It is preferably formed of an elastomer layer/elastomer layer/non-elastomeric layer).

In addition, as described above, in the cuff holding step, hot air (eg, 100 to 130° C.) is blown to the dicing die-bonding film maintained in an expanded state at room temperature (eg, 23° C.), and the die In order to solidify by cooling after heat-shrinking a shing die-bonding film, it is preferable that the outermost layer of the base material layer 1 contains resin which has a melting|fusing point close to the temperature of the hot air shot by the dicing tape. Thereby, the outermost layer melt|dissolved by shooting hot air can be solidified more rapidly.

As a result, in the cuff holding step, it is possible to more fully hold the cuff.

When the base layer 1 has a laminated structure of an elastomer layer and a non-elastomeric layer, the elastomer layer contains an α-olefin-based thermoplastic elastomer, and the non-elastomeric layer contains a polyolefin such as metallocene PP, which will be described later, The elastomer layer preferably contains 50 mass% or more and 100 mass% or less of α-olefin thermoplastic elastomer with respect to the total mass of the elastomer forming the elastomer layer, and contains 70 mass% or more and 100 mass% or less It is more preferable that it contains 80 mass % or more and 100 mass % or less, more preferably contains 90 mass % or more and 100 mass % or less, especially preferably contains 95 mass % or more and 100 mass % or less. am. When the α-olefin thermoplastic elastomer is included in the above range, the affinity between the elastomer layer and the non-elastomer layer is increased, so that the base layer 1 can be extrusion-molded relatively easily. Moreover, since the elastomer layer can act as a stress relaxation layer, the semiconductor wafer affixed to the dicing tape can be cut|disconnected efficiently.

When the base layer 1 has a laminated structure of an elastomer layer and a non-elastomer layer, the base layer 1 is formed by coextrusion of the elastomer and the non-elastomer to form a laminated structure of the elastomer layer and the non-elastomer layer. It is preferable to obtain As co-extrusion molding, any suitable co-extrusion molding generally performed in the manufacture of a film, a sheet, etc. can be employ|adopted. It is preferable to employ|adopt the inflation method and the coextrusion T-die method from a point which can obtain the base material layer 1 efficiently and inexpensively among co-extrusion molding.

When the base layer 1 constituting the laminate structure is obtained by co-extrusion molding, the elastomer layer and the non-elastomer layer are in contact with each other in a heated and molten state. Since the application of excessive heat to either the elastomer or the non-elastomer having a low melting point is suppressed by the small melting point difference, a by-product is generated by thermal deterioration of the elastomer or the non-elastomer having a low melting point. can be restrained In addition, it is also possible to suppress the occurrence of lamination failure between the elastomer layer and the non-elastomer layer due to excessive decrease in the viscosity of either the elastomer or the non-elastomer having a low melting point. It is preferable that they are 0 degreeC or more and 70 degrees C or less, and, as for the melting|fusing point difference of the said elastomer and the said non-elastomer, it is more preferable that they are 0 degreeC or more and 55 degrees C or less.

The melting points of the elastomer and the non-elastomer may be measured by differential scanning calorimetry (DSC) analysis. For example, using a differential scanning calorimeter device (manufactured by TA Instruments, model DSC Q2000), the temperature is raised to 200° C. at a temperature increase rate of 5° C./min under a nitrogen gas stream, and the peak temperature of the endothermic peak is measured. can

The thickness of the base layer 1 is preferably 55 µm or more and 195 µm or less, more preferably 55 µm or more and 190 µm or less, still more preferably 55 µm or more and 170 µm or less, and it is optimal that it is 60 µm or more and 160 µm or less. . By making the thickness of the base material layer 1 into the said range, a dicing tape can be manufactured efficiently and the semiconductor wafer affixed to the dicing tape can be cut|disconnected efficiently.

The thickness of the base material layer 1 can be obtained by, for example, measuring the thickness of five randomly selected points using a dial gauge (manufactured by PEACOCK, Model R-205), and arithmetic average of these thicknesses. have.

In the base material layer (1) in which the elastomer layer and the non-elastomeric layer are laminated, the ratio of the thickness of the non-elastomeric layer to the thickness of the elastomer layer is preferably 1/25 or more and 1/3 or less, and 1/25 or more and 1/ It is more preferably 3.5 or less, more preferably 1/25 or more and 1/4, particularly preferably 1/22 or more and 1/4 or less, and optimally 1/20 or more and 1/4 or less. By making ratio of the thickness of the non-elastomeric layer with respect to the thickness of an elastomer layer into the said range, the semiconductor wafer affixed to the dicing tape can be cut|disconnected more efficiently.

A single-layer (one-layer) structure may be sufficient as an elastomer layer, and a laminated structure may be sufficient as it. It is preferable that an elastomer layer has a 1 - 5 layer structure, It is more preferable that it is a 1 - 3 layer structure, It is still more preferable that it is a 1 layer - 2 layer structure, It is optimal that it is a 1 layer structure. When an elastomer layer has a laminated structure, all the layers may contain the same elastomer, and at least two layers may contain the different elastomer.

A single-layer (one-layer) structure may be sufficient as a non-elastomeric layer, and a laminated structure may be sufficient as it. It is preferable that a non-elastomeric layer has a 1-layer thru|or 5 layer structure, It is more preferable that it is a 1-layer thru|or 3 layer structure, It is still more preferable that it has a 1 layer thru|or 2-layer structure, It is optimal that it is a 1-layer structure. When the non-elastomer layer has a laminated structure, all the layers may contain the same non-elastomer, or at least two layers may contain the different non-elastomer.

The non-elastomer layer preferably contains a polypropylene resin (hereinafter referred to as metallocene PP) which is a polymerization product by a metallocene catalyst as a non-elastomer. Examples of the metallocene PP include a propylene/α-olefin copolymer that is a polymerization product of a metallocene catalyst. When the non-elastomeric layer contains metallocene PP, a dicing tape can be efficiently manufactured and the semiconductor wafer affixed to the dicing tape can be cut efficiently.

Moreover, as metallocene PP marketed, Wintech WFX4M (made by a Japanese polypro company) is mentioned.

Here, the metallocene catalyst refers to a transition metal compound (so-called metallocene compound) of Group 4 of the Periodic Table containing a ligand having a cyclopentadienyl skeleton, and the metallocene compound by reacting with the metallocene compound. It is a catalyst which consists of a cocatalyst which can be activated in a stable ionic state, and contains an organoaluminum compound as needed. The metallocene compound is a cross-linked metallocene compound that enables stereoregular polymerization of propylene.

Among the propylene/α-olefin copolymers that are polymerized products of the metallocene catalyst, propylene/α-olefin random copolymers that are polymerized products of metallocene catalysts are preferable, and propylene/α-olefin copolymers that are polymerized products of the metallocene catalyst are preferred. Among the olefin random copolymers, propylene/carbon 2 α-olefin random copolymers that are metallocene catalyst polymerization products, propylene/carbon 4 α-olefin random copolymers that are metallocene catalyst polymerization products, and metallocene catalysts It is preferable to select from random copolymers of propylene/C5 ?-olefins, which are polymerized products, and among these, propylene/ethylene random copolymers, which are polymerized products of a metallocene catalyst, are most suitable.

The propylene/α-olefin random copolymer, which is a polymerization product of the metallocene catalyst, has a melting point of 80°C or more and 140°C or less, In particular, it is preferable that it is 100 degreeC or more and 130 degrees C or less.

The melting point of the propylene/α-olefin random copolymer, which is a polymerization product of the metallocene catalyst, can be measured by the above method.

Here, when the said elastomer layer is arrange|positioned in the outermost layer of the base material layer 1, when the base material layer 1 is made into a roll body, the said elastomer layers arrange|positioned in the outermost layer become easy to block (it becomes easy to stick). ). Therefore, it becomes difficult to rewind the base material layer 1 from a roll body. On the other hand, in the preferred embodiment of the substrate layer 1 having the above-described laminated structure, the non-elastomeric layer/elastomer layer/non-elastomeric layer, that is, the non-elastomeric layer is disposed on the outermost layer, so that the substrate layer 1 of such an aspect Silver becomes a thing excellent in blocking resistance. Thereby, it can suppress that manufacture of the semiconductor device using the dicing tape 10 is delayed by blocking.

It is preferable that the said non-elastomeric layer contains resin which has melting|fusing point of 100 degreeC or more and 130 degrees C or less, and whose molecular weight dispersion degree (mass average molecular weight/number average molecular weight) is 5 or less. Metallocene PP is mentioned as such resin.

When the non-elastomeric layer contains the resin as described above, the non-elastomeric layer can be cooled and solidified more rapidly in the cuff holding step. Therefore, after heat-shrinking a dicing tape, it can suppress more fully that the base material layer 1 shrink|contracts.

Thereby, in the cuff holding step, it is possible to more fully hold the cuff.

It is preferable that the die-bonding layer 3 has thermosetting. Thermosetting can be imparted to the die-bonding layer 3 by including at least one of a thermosetting resin and a thermoplastic resin having a thermosetting functional group in the die-bonding layer 3 .

When the die bond layer 3 contains a thermosetting resin, examples of the thermosetting resin include an epoxy resin, a phenol resin, an amino resin, an unsaturated polyester resin, a polyurethane resin, a silicone resin, and a thermosetting polyimide resin. can be heard Among these, it is preferable to use an epoxy resin.

Examples of the epoxy resin include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolak type, orthocresol novolak type, tris hydroxyphenylmethane type, tetraphenylolethane type, hydantoin type, trisglycidyl isocyanurate type, and glycidylamine type epoxy resin.

As a phenol resin as a hardening|curing agent of an epoxy resin, polyoxystyrene, such as a novolak-type phenol resin, a resol-type phenol resin, and polyparaoxystyrene, is mentioned, for example.

When the die bonding layer 3 contains the thermoplastic resin which has a thermosetting functional group, as such a thermoplastic resin, a thermosetting functional group containing acrylic resin is mentioned, for example. As an acrylic resin in a thermosetting functional group containing acrylic resin, the thing containing the monomer unit derived from (meth)acrylic acid ester is mentioned.

In the thermosetting resin which has a thermosetting functional group, a hardening|curing agent is selected according to the kind of thermosetting functional group.

The die-bonding layer 3 may contain the thermosetting catalyst (hardening accelerator) from a viewpoint of fully advancing the hardening reaction of a resin component, or raising a hardening reaction rate. Examples of the thermosetting catalyst include an imidazole-based compound, a triphenylphosphine-based compound, an amine-based compound, and a trihalogenborane-based compound.

The die-bonding layer 3 may contain a thermoplastic resin. The thermoplastic resin functions as a binder. Examples of the thermoplastic resin include natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, thermoplasticity. polyimide resins, polyamide resins such as polyamide 6 and polyamide 6 and 6, phenoxy resins, acrylic resins, saturated polyester resins such as PET and PBT, polyamideimide resins, and fluororesins. As for the said thermoplastic resin, only 1 type may be used and 2 or more types may be combined and used for it. As said thermoplastic resin, since there are few ionic impurities and heat resistance is high, from a viewpoint that the connection reliability by a die-bonding layer becomes easy to ensure, an acrylic resin is preferable.

It is preferable that the said acrylic resin is a polymer which contains the monomer unit derived from (meth)acrylic acid ester as a monomer unit with most by mass ratio. As (meth)acrylic acid ester, meth)acrylic acid alkylester, (meth)acrylic acid cycloalkyl ester, (meth)acrylic acid aryl ester, etc. are mentioned, for example. The said acrylic resin may contain the monomer unit derived from the other component copolymerizable with (meth)acrylic acid ester. Examples of the other components include a carboxyl group-containing monomer, an acid anhydride monomer, a hydroxyl group-containing monomer, a glycidyl group-containing monomer, a sulfonic acid group-containing monomer, a phosphoric acid group-containing monomer, acrylamide, a functional group-containing monomer such as acrylnitrile, and various polyfunctionalities. A monomer etc. are mentioned. From the viewpoint of realizing high cohesive force in the die-bonding layer, the acrylic resin is a (meth)acrylic acid ester (especially (meth)acrylic acid alkylester having 4 or less carbon atoms in the alkyl group), a carboxyl group-containing monomer, and a nitrogen atom-containing monomer It is preferable that it is a copolymer of polyfunctional monomer (especially polyglycidyl polyfunctional monomer), and copolymerization of ethyl acrylate, butyl acrylate, acrylic acid, acrylonitrile, and polyglycidyl (meth) acrylate Chain is more preferable.

The die-bonding layer 3 may contain 1 type, or 2 or more types of other components as needed. As another component, a flame retardant, a silane coupling agent, and an ion trap agent are mentioned, for example.

Although the thickness of the die-bonding layer 3 is not specifically limited, For example, they are 1 micrometer or more and 200 micrometers or less. 3 micrometers or more and 150 micrometers or less may be sufficient as such a thickness, and 5 micrometers or more and 100 micrometers or less may be sufficient as them.

The dicing die-bonding film 20 according to the present embodiment is used, for example, as an auxiliary tool for manufacturing a semiconductor integrated circuit. Hereinafter, the specific example of use of the dicing die-bonding film 20 is demonstrated.

Below, the example in which the dicing die-bonding film 20 of which the base material layer 1 is one layer is used is demonstrated.

A method of manufacturing a semiconductor integrated circuit includes a half-cut process of forming a groove in a semiconductor wafer in order to process the semiconductor wafer into a chip (die) by a cutting process, and a bag of grinding the semiconductor wafer after the half-cut process to reduce the thickness A grinding process and a mounting process of attaching one surface (for example, the surface opposite to the circuit surface) of the semiconductor wafer after the backgrinding process to the die bond layer 3 and fixing the semiconductor wafer to the dicing tape 10 . and an expand step of widening the gap between the half-cut semiconductor chips, a cuff holding step of maintaining the gap between the semiconductor chips, and a die-bonding layer by peeling the die-bonding layer 3 and the pressure-sensitive adhesive layer 2 from each other It has a pick-up process of taking out the semiconductor chip (die) in the state in which (3) was stuck, and a die-bonding process of adhering the semiconductor chip (die) in the state to which the die-bonding layer 3 was affixed to a to-be-adhered body. When implementing these processes, the dicing tape (dicing die-bonding film) of this embodiment is used as a manufacturing auxiliary tool.

In the half-cut process, as shown to FIG. 2A and FIG. 2B, the half-cut process for cutting a semiconductor integrated circuit into small pieces (die) is implemented. In detail, the tape T for a wafer process is affixed on the surface on the opposite side to the circuit surface of the semiconductor wafer W (refer FIG. 2A). Furthermore, a dicing ring R is attached to the tape T for wafer processing (refer FIG. 2A). In the state in which the tape T for a wafer process was affixed, the groove|channel for division|segmentation is formed (refer FIG. 2B). In the backgrind process, as shown to FIG. 2C and FIG. 2D, a semiconductor wafer is grinded and thickness is made thin. In detail, while affixing the backgrind tape G on the surface in which the groove|channel was formed, the tape T for wafer processing affixed initially is peeled (refer FIG. 2C). With the backgrind tape G stuck, grinding is performed until the semiconductor wafer W has a predetermined thickness (refer to Fig. 2D).

In addition, in the backgrind process, when the thickness of a semiconductor wafer is especially thin 20 micrometers or more and 30 micrometers or less, in the pick-up process mentioned later, when a semiconductor chip is pushed up using the pin member P, it deforms into the said semiconductor chip. Although the dicing die-bonding film 20 according to the present embodiment is constituted as described above, it is possible to relatively suppress the occurrence of deformation or cracks in the semiconductor chip in the pick-up process.

In a mounting process, as shown to FIG. 3A - FIG. 3B, after attaching the dicing ring R to the adhesive layer 2 of the dicing tape 10, it is half-cut to the surface of the die-bonding layer 3 exposed. The processed semiconductor wafer W is affixed (refer FIG. 3A). Then, the backgrind tape G is peeled from the semiconductor wafer W (refer FIG. 3B).

In the expand step, as shown in Figs. 4A to 4C, the dicing ring R is fixed to the holder H of the expand device. By pushing up the dicing die-bonding film 20 from the lower side using the pushing-up member U with which the expand apparatus is equipped, the dicing die-bonding film 20 is stretched so that it may spread in the planar direction (refer FIG. 4B). . Thereby, the semiconductor wafer W by which the half-cut process was carried out is cut|disconnected in a specific temperature condition. The temperature condition is, for example, -20 to 5°C, preferably -15 to 0°C, more preferably -10 to -5°C. The expanded state is released by lowering the push-up member U (see Fig. 4C).

In the expand step, as shown in Figs. 5A to 5B, under a higher temperature condition (for example, room temperature (23±2° C.)), the dicing tape 10 is held to widen the area. stretch Thereby, the cut|disconnected adjacent semiconductor chips are set apart in the surface direction of a film surface, and the space|interval is further widened.

In the cuff holding step, as shown in FIG. 6 , hot air (for example, 100 to 130° C.) is blown to the dicing tape 10, the dicing tape 10 is heat-shrinked, then cooled and solidified, and the cut adjacent adjacent The distance (kerf) between semiconductor chips is maintained.

At a pick-up process, as shown in FIG. 7, the semiconductor chip of the state to which the die-bonding layer 3 was affixed is peeled from the adhesive layer 2 of the dicing tape 10. As shown in FIG. In detail, the pin member P is raised, and the semiconductor chip to be picked up is pushed up through the dicing tape 10. The pushed up semiconductor chip is held by the suction jig J.

In a die bonding process, the semiconductor chip in the state to which the die bonding layer 3 was affixed is adhere|attached to a to-be-adhered body.

Matters disclosed by this specification include the following.

(One)

A dicing tape in which an adhesive layer is laminated on a base material layer;

A die-bonding layer laminated on the pressure-sensitive adhesive layer of the dicing tape,

The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive and a photopolymerization initiator,

In the molecular weight distribution curve obtained by GPC measurement of the pressure-sensitive adhesive layer before curing, polydispersity Mw/Mn, which is the ratio of the mass average molecular weight Mw of the peak appearing on the highest molecular weight side to the number average molecular weight Mn of the peak appearing on the highest molecular weight side This, a dicing die bond film of 1.3 or more.

According to such a structure, migration of the said photoinitiator from the said adhesive layer to the said die-bonding layer can be suppressed comparatively.

(2)

The polydispersity Mw/Mn is 2.0 or more

The dicing die-bonding film according to (1) above.

According to this structure, in addition to being able to relatively suppress the migration of the photoinitiator from the pressure-sensitive adhesive layer to the die-bonding layer, the die-bonding layer is peeled off between the die-bonding layer and the pressure-sensitive adhesive layer, and the die-bonding layer is stuck. The pick-up process of taking out a semiconductor chip WHEREIN: The said die-bonding layer can be peeled further easily from the said adhesive layer.

(3)

The polydispersity Mw/Mn is 10 or less

The dicing die-bonding film according to (1) or (2) above.

(4)

The polydispersity Mw/Mn is 5 or less

The dicing die-bonding film according to (1) or (2) above.

(5)

The polydispersity Mw/Mn is 3 or less

The dicing die-bonding film according to (1) or (2) above.

(6)

In the molecular weight distribution curve obtained by GPC measurement of the said adhesive layer before hardening, the value of the peak top molecular weight of the peak appearing on the highest molecular weight side is 33,000 or less

The dicing die-bonding film according to any one of (1) to (5) above.

(7)

In the molecular weight distribution curve obtained by GPC measurement of the said adhesive layer before hardening, the value of the peak top molecular weight of the peak appearing at the highest molecular weight side is 25,000 or less

The dicing die-bonding film according to any one of (1) to (6).

According to this structure, migration of the said photoinitiator from the said adhesive layer to the said die-bonding layer can be suppressed further.

(8)

In the molecular weight distribution curve obtained by GPC measurement of the said adhesive layer before hardening, the value of the peak top molecular weight of the peak appearing at the highest molecular weight side is 4,000 or more

The dicing die-bonding film according to (6) or (7) above.

(9)

In the molecular weight distribution curve obtained by GPC measurement of the said adhesive layer before hardening, the value of the peak top molecular weight of the peak which appears on the highest molecular weight side is 8,000 or more

The dicing die-bonding film according to (6) or (7) above.

(10)

The said adhesive layer before hardening contains less than 32 mass % of sol components

The dicing die-bonding film according to any one of (1) to (9) above.

According to this structure, migration of the said photoinitiator from the said adhesive layer to the said die-bonding layer can be suppressed further.

(11)

The said adhesive layer before hardening contains 23 mass % or less of sol components

The dicing die-bonding film according to any one of (1) to (10).

According to this configuration, in addition to being able to further suppress the migration of the photopolymerization initiator from the pressure-sensitive adhesive layer to the die-bonding layer, the die-bonding layer is peeled off between the pressure-sensitive adhesive layer and the die-bonding layer is affixed. The pick-up process of taking out a semiconductor chip in a state WHEREIN: The said die-bonding layer can be peeled further easily from the said adhesive layer.

(12)

The peeling force of the said die-bonding layer with respect to the said adhesive layer is less than 0.18N/20mm after hardening of the said adhesive layer.

The dicing die-bonding film according to any one of (1) to (11) above.

(13)

The peeling force of the said die-bonding layer with respect to the said adhesive layer is 0.15N/20mm or less after hardening of the said adhesive layer.

The dicing die-bonding film according to any one of (1) to (12) above.

(14)

The peeling force of the said die-bonding layer with respect to the said adhesive layer is after hardening of the said adhesive layer, WHEREIN: 0.07N/20mm or less

The dicing die-bonding film according to any one of (1) to (13) above.

According to such a structure, in the pick-up process of peeling between the said die-bonding layer and the said adhesive layer, and taking out a semiconductor chip in the state which the said die-bonding layer was stuck, WHEREIN: can be peeled off.

(15)

Peeling force of the said die-bonding layer with respect to the said adhesive layer after hardening of the said adhesive layer WHEREIN: 0.01 N/20 mm or more

The dicing die-bonding film according to any one of (12) to (14) above.

(16)

Peeling force of the said die-bonding layer with respect to the said adhesive layer before hardening of the said adhesive layer WHEREIN: 0.3N/20mm or more

The dicing die-bonding film according to any one of (1) to (15).

According to this structure, it becomes possible to hold|maintain the said die-bonding layer suitably in the said adhesive layer. Thereby, it is possible to further suppress the floating of the chip that occurs after the die-bonding layer is separated into pieces.

(17)

The peeling force of the said die-bonding layer with respect to the said adhesive layer is 5.0N/20mm or less before hardening of the said adhesive layer.

The dicing die-bonding film according to (16) above.

In addition, the dicing die-bonding film which concerns on this invention is not limited to the said embodiment. In addition, the dicing die-bonding film which concerns on this invention is not limited by the above-mentioned effect, either. The dicing die-bonding film which concerns on this invention can be variously changed in the range which does not deviate from the summary of this invention.

[Example]

Next, an Example is given and this invention is demonstrated more concretely. The following examples are provided to illustrate the present invention in more detail, and do not limit the scope of the present invention.

[Example 1]

<Production of dicing tape>

In a reaction vessel equipped with a cooling tube, a nitrogen introduction tube, a thermometer, and a stirring device, 11 parts by mass of 2-hydroxyethyl acrylate (hereinafter referred to as HEA) as a monomer, isononyl acrylate (hereinafter referred to as INA) 89 0.2 parts by mass of azobisisobutyronitrile (hereinafter referred to as AIBN) is added as a mass part and thermal polymerization initiator;

Furthermore, after adding butyl acetate as a reaction solvent so that the density|concentration of the said monomer might be 38 %, polymerization process was performed at 62 degreeC for 4 hours and 75 degreeC polymerization treatment at 75 degreeC under nitrogen stream, and the acrylic polymer A was obtained.

To this acrylic polymer A, 12 parts by mass of 2-methacryloyloxyethyl isocyanate (hereinafter referred to as MOI) and 0.06 parts by mass of dibutyltin dilaurate were added, and an addition reaction treatment was carried out at 50° C. for 12 hours under an air stream. Thus, acrylic polymer A' was obtained.

Next, with respect to 100 parts by mass of the acrylic polymer A', 0.8 parts by mass of a polyisocyanate compound (trade name "Coronate L", manufactured by Nippon Polyurethane Co., Ltd.) as an external crosslinking agent and a photopolymerization initiator (trade name "Omnirad 127", manufactured by IGM Resins) 2 A mass part was added, 0.01 mass part of antioxidant (trade name "Irganox1010", the BASF Japan company make) was added, and the adhesive solution (henceforth adhesive solution A may be called) was produced.

Next, the pressure-sensitive adhesive solution A was applied using an applicator on the silicone release-treated side of a PET separator (50 μm thick) having a silicone release-treated side, dried at 120° C. for 2 minutes, and had a thickness of 10 μm. An adhesive layer was formed. Then, on the said adhesive layer, Gunze made polyolefin film (brand name "Funcle NED#125", thickness 125 micrometers) as a base material layer was bonded, and it preserve|saved at 50 degreeC for 24 hours, and obtained the dicing tape A. .

<Production of die bond layer>

200 parts by mass of epoxy resin (trade name "KI-3000-4", manufactured by Toto Kasei Kogyo Co., Ltd.) per 100 parts by mass of acrylic resin (trade name "Teisan Resin SG-70L", manufactured by Nagase Chemtex Corporation, mass average molecular weight 900,000) , 200 parts by mass of phenolic resin (trade name "MEHC-7851SS", manufactured by Meiwa Chemicals Co., Ltd.), silica filler (trade name "SE2050-MCV", manufactured by Admatex, Inc., average particle diameter of 500 nm, 350 parts by mass (in terms of silica filler) and curing Adhesive composition A used as 30 mass % of solid content concentration was prepared other than methyl ethyl ketone in 2 mass parts of accelerators (trade name "Curesol 2PHZ-PW", the Shikoku Kasei Kogyo Co., Ltd. make).

Next, on the silicone release-treated surface of a PET separator (thickness 50 µm) having a silicone release-treated surface, the adhesive composition A is applied using an applicator to form a coating film, and a coating film is formed on this coating film at 120° C. for 2 minutes was subjected to solvent removal treatment. Thereby, a die-bonding layer having a thickness (average thickness) of 10 µm was produced on the PET separator.

<Production of dicing die-bonding film>

A PET separator with a die-bonding layer of 330 mm phi was obtained by punching a PET separator with a die-bonding layer produced therein (hereinafter referred to as a PET separator with a die-bonding layer) into a circular shape of 330 mm phi.

Next, the PET separator is removed from the dicing tape A to expose one side of the pressure-sensitive adhesive layer, and then, using a laminator, the exposed surface of the die-bonding layer is brought into contact with the exposed surface of the pressure-sensitive adhesive layer at room temperature (23±2° C.) ), the dicing die-bonding film A was obtained by bonding the PET separator with a die-bonding layer to the dicing tape A.

That is, as for the dicing tape A which concerns on Example 1, the polyolefin film, an adhesive layer, a die-bonding layer, and a PET separator were laminated|stacked in this order, and was comprised.

[Example 2]

<Production of dicing tape>

In Example 1, 16 parts by mass of HEA as a monomer, 84 parts by mass of butyl acrylate (hereinafter referred to as BA), and 0.2 parts by mass of AIBN as a thermal polymerization initiator were added in the same reaction vessel as described in Example 1, and the concentration of the monomer After butyl acetate as a reaction solvent was added so that the content of the reaction solvent was 32%, polymerization was performed at 62°C for 4 hours and polymerization at 75°C for 2 hours under a nitrogen stream to obtain an acrylic polymer B.

17 mass parts of MOI and 0.09 mass parts of dibutyltin dilaurylate were added to this acrylic polymer B, the addition reaction process was performed at 50 degreeC in air stream for 12 hours, and acrylic polymer B' was obtained.

Next, with respect to 100 parts by mass of acrylic polymer B', 0.8 parts by mass of a polyisocyanate compound (trade name "Coronate L", manufactured by Nippon Polyurethane Co., Ltd.) as an external crosslinking agent and a photopolymerization initiator (trade name "Omnirad 127", manufactured by IGM Resins) 2 A mass part was added, 0.01 mass part of antioxidant (trade name "Irganox1010", the BASF Japan company make) was added, and the adhesive solution (henceforth adhesive solution B may be mentioned) was produced.

Next, the pressure-sensitive adhesive solution B was applied using an applicator on the silicone release-treated side of a PET separator (50 μm thick) having a silicone release-treated side, dried at 120° C. for 2 minutes, and had a thickness of 10 μm. An adhesive layer was formed. Then, on the said adhesive layer, the Gunze polyolefin film (brand name "Funcle NED#125", thickness 125 micrometers) was bonded as a base material layer, and it preserve|saved at 50 degreeC for 24 hours, and obtained the dicing tape B. .

<Production of die bond layer>

It carried out similarly to Example 1, and produced it.

<Production of dicing die-bonding film>

After carrying out similarly to Example 1 and obtaining the PET separator with a die-bonding layer of 330 mmphi, the PET separator was removed from the dicing tape B, one side of an adhesive layer was exposed, using a laminator, the exposed surface of a die-bonding layer The dicing die-bonding film B was obtained by bonding PET separator with a die-bonding layer to the dicing tape B at room temperature so that it may contact|contact with the exposed surface of this adhesive layer.

[Example 3]

<Production of dicing tape>

In Example 1, 11 parts by mass of HEA, 89 parts by mass of 2-ethylhexyl acrylate (hereinafter referred to as 2EHA) as a monomer, and 0.2 parts by mass of AIBN as a thermal polymerization initiator were added in the same reaction vessel as described in Example 1, and further, After adding butyl acetate as a reaction solvent so that the density|concentration of a monomer might be 36 %, the polymerization process was performed at 62 degreeC for 4 hours and 75 degreeC polymerization treatment for 2 hours under nitrogen stream, and the acrylic polymer C was obtained.

13 mass parts of MOI and 0.07 mass parts of dibutyltin dilaurate were added to this acrylic polymer C, the addition reaction process was carried out at 50 degreeC in air stream for 12 hours, and the acrylic polymer C' was obtained.

Next, with respect to 100 parts by mass of the acrylic polymer C', 0.8 parts by mass of a polyisocyanate compound (trade name "Coronate L", manufactured by Nippon Polyurethane Co., Ltd.) as an external crosslinking agent and a photopolymerization initiator (trade name "Omnirad 127", manufactured by IGM Resins) 2 A mass part was added, 0.01 mass part of antioxidant (trade name "Irganox1010", the BASF Japan company make) was added, and the adhesive solution (henceforth adhesive solution C may be mentioned) was produced.

Next, the pressure-sensitive adhesive solution C was applied using an applicator on the silicone release-treated side of a PET separator (50 μm thick) having a silicone release-treated side, dried at 120° C. for 2 minutes, and had a thickness of 10 μm. An adhesive layer was formed. Then, on the said adhesive layer, Gunze made polyolefin film (brand name "Funcle NED#125", thickness 125 micrometers) as a base material layer was bonded, and it preserve|saved at 50 degreeC for 24 hours, and obtained the dicing tape C. .

<Production of die bond layer>

It carried out similarly to Example 1, and produced it.

<Production of dicing die-bonding film>

After carrying out similarly to Example 1 and obtaining the PET separator with a die-bonding layer of 330 mmphi, the PET separator was removed from the dicing tape C, one side of an adhesive layer was exposed, using a laminator, the exposed surface of a die-bonding layer The dicing die-bonding film C was obtained by bonding PET separator with a die-bonding layer to the dicing tape C at room temperature so that it might contact|abut with the exposed surface of this adhesive layer.

[Example 4]

<Production of dicing tape>

In Example 1, in the same reaction vessel as described above, 16 parts by mass of HEA, 84 parts by mass of INA, and 0.2 parts by mass of AIBN as a thermal polymerization initiator were added as a monomer, and acetic acid as a reaction solvent so that the concentration of the monomer was 32%. After butyl was added, polymerization was performed at 62°C for 4 hours and at 75°C for 2 hours under a nitrogen stream to obtain acrylic polymer D.

17 mass parts of MOI and 0.12 mass parts of dibutyltin dilaurate were added to this acrylic polymer D, the addition reaction process was carried out at 50 degreeC in air stream for 12 hours, and the acrylic polymer D' was obtained.

Next, with respect to 100 parts by mass of the acrylic polymer D', 0.8 parts by mass of a polyisocyanate compound (trade name "Coronate L", manufactured by Nippon Polyurethane Co., Ltd.) as an external crosslinking agent and a photopolymerization initiator (trade name "Omnirad 127", manufactured by IGM Resins) 2 A mass part was added, 0.01 mass part of antioxidant (trade name "Irganox1010", BASF Japan company make) was added, and the adhesive solution (henceforth adhesive solution D may be mentioned) was produced.

Next, the pressure-sensitive adhesive solution D was applied using an applicator on the silicone release-treated side of a PET separator (50 μm thick) having a silicone release-treated side, dried at 120° C. for 2 minutes, and had a thickness of 10 μm. An adhesive layer was formed. Then, on the said adhesive layer, Gunze made polyolefin film (brand name "Funcle NED#125", thickness 125 micrometers) as a base material layer was bonded, and it preserve|saved at 50 degreeC for 24 hours, and obtained the dicing tape D. .

<Production of die bond layer>

It carried out similarly to Example 1, and produced it.

<Production of dicing die-bonding film>

After carrying out similarly to Example 1 and obtaining the PET separator with a die-bonding layer of 330 mmphi, the PET separator was removed from the dicing tape D, one side of an adhesive layer was exposed, using a laminator, the exposed surface of a die-bonding layer The dicing die-bonding film D was obtained by bonding PET separator with a die-bonding layer to the dicing tape D at room temperature so that it may contact|contact with the exposed surface of this adhesive layer.

[Example 5]

<Production of dicing tape>

9 parts by mass of HEA as a monomer, 91 parts by mass of lauryl acrylate (hereinafter referred to as LA), and 0.2 parts by mass of AIBN as a thermal polymerization initiator were added in the same reaction vessel as described in Example 1, and further, the monomer After adding butyl acetate as a reaction solvent so that a density|concentration might be 30 %, the polymerization process was performed at 62 degreeC for 4 hours and 75 degreeC polymerization treatment for 2 hours under nitrogen stream, and the acrylic polymer E was obtained.

10 parts by mass of MOI and 0.21 parts by mass of dibutyltin dilaurylate were added to this acrylic polymer E, and addition reaction treatment was carried out at 50°C for 12 hours under an air stream to obtain acrylic polymer E'.

Next, with respect to 100 parts by mass of acrylic polymer E', 0.8 parts by mass of a polyisocyanate compound (trade name "Coronate L", manufactured by Nippon Polyurethane Co., Ltd.) as an external crosslinking agent and a photopolymerization initiator (trade name "Omnirad 127", manufactured by IGM Resins) 2 Add mass parts, add 0.01 mass parts of antioxidant (trade name "Irganox1010", BASF Japan company make) and 5 mass parts of terpene phenol resins (brand name "YS Polystar S145", Yasuhara Chemicals make) as tackifiers are added, and adhesive solution (Hereinafter, it may be called adhesive solution E) was produced.

Next, the pressure-sensitive adhesive solution E was applied using an applicator on the silicone release-treated side of a PET separator (50 μm thick) having a silicone release-treated side, dried at 120° C. for 2 minutes, and had a thickness of 10 μm. An adhesive layer was formed. Then, on the said adhesive layer, Gunze's polyolefin film (brand name "Funcle NED#125", thickness 125 micrometers) was bonded as a base material layer, and it preserve|saved at 50 degreeC for 24 hours, and obtained the dicing tape E. .

<Production of die bond layer>

It carried out similarly to Example 1, and produced it.

<Production of dicing die-bonding film>

After carrying out similarly to Example 1 and obtaining the PET separator with a die-bonding layer of 330 mmphi, the PET separator was removed from the dicing tape E, one side of an adhesive layer was exposed, using a laminator, the exposed surface of a die-bonding layer The dicing die-bonding film E was obtained by bonding PET separator with a die-bonding layer to the dicing tape E at room temperature so that it might contact|contact with the exposed surface of this adhesive layer.

[Example 6]

<Production of dicing tape>

In the same reaction vessel as described in Example 1, 9 parts by mass of HEA, 91 parts by mass of LA, and 0.2 parts by mass of AIBN as a thermal polymerization initiator were added as a monomer, and acetic acid as a reaction solvent so that the concentration of the monomer was 34%. After butyl was added, polymerization was performed at 62°C for 4 hours and at 75°C for 2 hours under a nitrogen stream to obtain an acrylic polymer F.

10 parts by mass of MOI and 0.08 parts by mass of dibutyltin dilaurylate were added to the acrylic polymer F, and an addition reaction treatment was performed at 50° C. for 12 hours under an air stream to obtain an acrylic polymer F'.

Next, with respect to 100 parts by mass of the acrylic polymer F', 0.8 parts by mass of a polyisocyanate compound (trade name "Coronate L", manufactured by Nippon Polyurethane Co., Ltd.) as an external crosslinking agent and 2 mass parts of a photoinitiator (trade name "Omnirad 127" manufactured by IGM Resins) The part was added, 0.01 mass part of antioxidant (trade name "Irganox1010", the BASF Japan company make) was added, and the adhesive solution (henceforth adhesive solution F may be mentioned) was produced.

Next, the pressure-sensitive adhesive solution F was applied using an applicator on the silicone release-treated side of a PET separator (50 μm thick) having a silicone release-treated side, dried at 120° C. for 2 minutes, and had a thickness of 10 μm. An adhesive layer was formed. Then, on the said adhesive layer, Gunze made polyolefin film (brand name "Funcle NED#125", thickness 125 micrometers) as a base material layer was bonded, and it preserve|saved at 50 degreeC for 24 hours, and obtained the dicing tape F. .

<Production of die bond layer>

It carried out similarly to Example 1, and produced it.

<Production of dicing die-bonding film>

After carrying out similarly to Example 1 and obtaining the PET separator with a die-bonding layer of 330 mmφ, the PET separator was removed from the dicing tape F to expose one side of the pressure-sensitive adhesive layer, and using a laminator, the exposed surface of the die-bonding layer The dicing die-bonding film F was obtained by bonding PET separator with a die-bonding layer to the dicing tape F at room temperature so that it might contact|abut the exposed surface of this adhesive layer.

[Comparative Example 1]

<Production of dicing tape>

In Example 1, 19 parts by mass of HEA as a monomer, 81 parts by mass of ethyl acrylate (hereinafter referred to as EA), and 0.2 parts by mass of AIBN as a thermal polymerization initiator were added in the same reaction vessel as described in Example 1, and the concentration of the monomer After butyl acetate as a reaction solvent was added so that the content of the reaction solution became 42%, polymerization was performed at 62°C for 4 hours and polymerization at 75°C for 2 hours under a nitrogen stream to obtain an acrylic polymer G.

21 mass parts of MOI and 0.03 mass parts of dibutyltin dilaurate were added to this acrylic polymer G, the addition reaction process was carried out at 50 degreeC in air stream for 12 hours, and the acrylic polymer G' was obtained.

Next, with respect to 100 parts by mass of acrylic polymer G', 0.8 parts by mass of a polyisocyanate compound (trade name "Coronate L", manufactured by Nippon Polyurethane Co., Ltd.) as an external crosslinking agent and 2 mass parts of a photoinitiator (trade name "Omnirad 127" manufactured by IGM Resins) The part was added, 0.01 mass part of antioxidant (trade name "Irganox1010", the BASF Japan company make) was added, and the adhesive solution (henceforth adhesive solution G may be mentioned) was produced.

Next, the pressure-sensitive adhesive solution G was applied using an applicator on the silicone release-treated side of a PET separator (50 μm thick) having a silicone release-treated side, dried at 120° C. for 2 minutes, and had a thickness of 10 μm. An adhesive layer was formed. Then, on the said adhesive layer, Gunze made polyolefin film (brand name "Funcle NED#125", thickness 125 micrometers) as a base material layer was bonded, and it preserve|saved at 50 degreeC for 24 hours, and obtained the dicing tape G. .

<Production of die bond layer>

It carried out similarly to Example 1, and produced it.

<Production of dicing die-bonding film>

After carrying out similarly to Example 1 and obtaining the PET separator with a die-bonding layer of 330 mmphi, the PET separator is removed from the dicing tape G, one side of an adhesive layer is exposed, using a laminator, the exposed surface of a die-bonding layer The dicing die-bonding film G was obtained by bonding PET separator with a die-bonding layer to the dicing tape G at room temperature so that it may contact|contact with the exposed surface of this adhesive layer.

(mass ratio of sol component)

About the adhesive layer before hardening of the dicing die-bonding film which concerns on each example, according to the following procedure, the mass ratio of a sol component was calculated|required.

(1) A sample of about 0.2 g is obtained from the pressure-sensitive adhesive layer before curing.

(2) After wrapping the sample in a mesh sheet, it is immersed in about 30 mL of toluene at room temperature for 1 week.

(3) The mesh-like sheet is taken out from the toluene, and the toluene-insoluble content contained in the mesh-like sheet is removed.

(4) After drying the toluene-insoluble content at 130°C at atmospheric pressure for about 2 hours, the toluene-insoluble content is weighed.

(5) According to the following formula (1), the mass ratio of the gel component is calculated, and based on the calculated value of the mass ratio of the gel component, the mass ratio of the sol component is calculated according to the following formula (2).

The results are shown in Table 2 below.

Mass ratio (mass %) of gel component = [(weight value of toluene-insoluble content)/mass of acquisition sample] x 100... (One)

Mass ratio of the sol component (mass %) = 100 - The mass ratio of the gel component calculated by the above formula (1)... (2)

(GPC measurement)

For the pressure-sensitive adhesive layer before curing of the dicing die-bonding film according to each example, using HLC-8220GPC manufactured by Tosoh Corporation as an analysis device, GPC measurement was performed according to the following procedure, and the result of GPC measurement obtained according to the following procedure was analyzed to obtain information on molecular weight.

[Preparation of measurement samples]

(1) A sample of about 0.2 g is obtained from the pressure-sensitive adhesive layer before curing.

(2) The sample is wrapped in a mesh-like sheet and then immersed in about 30 mL of toluene at room temperature for 1 week.

(3) The mesh-like sheet is taken out from the toluene, the toluene-insoluble content contained in the mesh-like sheet is removed, and a toluene solution containing a toluene-dissolving component is obtained.

(4) The toluene solution is treated at a temperature of 45° C. or lower under reduced pressure, toluene is removed from the toluene solution, and a solid substance of a toluene-dissolving component is obtained.

(5) After dissolving the said solid material in tetrahydrofuran (THF) so that a density|concentration may become 0.2 mass % and setting it as a THF solution, it is left to stand overnight.

(6) The THF solution left overnight is filtered through a 0.45 µm membrane filter, and the resulting filtrate is used as a measurement sample.

[Measuring conditions]

ㆍColumn: One TSKgel quaudcolumn SuperHZ-L (hereinafter referred to as the first column) manufactured by Tosoh Corporation, and;

Two TSKgel SuperHAM-M (hereinafter referred to as the second column) manufactured by Tosoh Corporation

Each of the columns was arranged in the analysis device such that two of the second columns were connected in series to the downstream side of the first column, and the eluent described later was introduced from the side of the first column.

ㆍColumn temperature: 40℃

ㆍEluent: tetrahydrofuran (THF)

ㆍFlow: Sample pump flow rate 0.3mL/min

Reference pump flow rate 1.0 mL/min

ㆍInjection amount: 10μL

ㆍDetector: Differential refractive index detector (RI)

In addition, in order to obtain a molecular weight distribution curve based on the measurement result of the measurement sample, each standard polystyrene manufactured by Tosoh Corporation was weighed so as to have a compounding mass shown in Table 1 above, and each measured standard polystyrene was 100 mL was dissolved in THF to obtain a standard polystyrene solution STD1 and a standard polystyrene solution STD2, and GPC measurement was also performed on these under the above measurement conditions using the above measurement apparatus.

The results of GPC measurement of the measurement sample, the STD1, and the STD2 were analyzed using the analysis software GPC-8020 Model II (Data Management Version 5.10) manufactured by Tosoh Corporation.

In data analysis using the above analysis software, first, calibration curves for STD1 and STD2 (a calibration curve with the horizontal axis as time (min) and the vertical axis as the logarithm of the mass average molecular weight) are created, and these calibration curves are Based on this, data analysis was performed regarding the molecular weight of the measurement sample. Data analysis regarding the molecular weight of the measurement sample was performed after obtaining a molecular weight distribution curve relating to the peak P1 (the peak on the highest molecular weight side) detected earliest on the chromatogram. The number average molecular weight Mn and the mass average molecular weight Mw concerning the peak P1 were obtained by performing data analysis about the molecular weight distribution curve concerning the peak P1.

In addition, in any of the measurement samples obtained from the pressure-sensitive adhesive layer of the dicing die-bonding film according to each example, overlap is confirmed between the falling portion of the peak P1 detected earliest and the rising portion of the peak P2 detected after the peak P1. Therefore, a baseline is drawn so as to extend in the horizontal direction from the starting point of the rising of the peak P1 as a starting point, and toward the trough (the most concave part) that occurs between the falling part of the peak P1 and the rising part of the peak P2. By drawing a line vertically from the line and interpreting the area demarcated by a line drawn vertically from the rising start portion of the peak P1 to the valley portion, the base line, and the valley portion from the baseline, to the peak P1 As a result, number average molecular weight Mn and mass average molecular weight Mw were obtained.

In Table 2 below, the ratio of the mass average molecular weight Mw of the peak P1 to the number average molecular weight Mn of the peak P1, the mass average molecular weight Mw of the peak P1, and the number average molecular weight Mn of the peak P1 is shown.

In addition, in Table 2 below, the value of the peak top molecular weight of the peak P1 is also shown.

(Transition rate of photoinitiator)

About the dicing die-bonding film which concerns on each example, the transfer rate of the photoinitiator from an adhesive layer to a die-bonding layer was measured.

The migration rate of the photoinitiator is the mass ratio (first mass ratio) of the photoinitiator contained in the sample collected from the portion of the pressure-sensitive adhesive layer that does not overlap the die-bonding layer, and in the sample collected from the portion of the die-bonding layer overlapping with the pressure-sensitive adhesive layer. It computed from the mass ratio (2nd mass ratio) of the photoinitiator contained.

The said 1st mass ratio was calculated|required according to the following procedure.

(1) About the dicing die-bonding film which concerns on each example, the die-bonding layer is not laminated|stacked, and about 0.1 g of adhesive layer parts spaced apart 1 cm or more from the die-bonding layer are sample|collected.

(2) After adding the extract|collected adhesive layer in 4 mL of chloroform, by shaking overnight (about 16 hours) in a cool and dark place, the photoinitiator in an adhesive layer is extracted in chloroform.

(3) Add 7 mL of methanol to the chloroform solution after extraction of the photopolymerization initiator, reprecipitate components other than the photopolymerization initiator, filter the reprecipitated components through a membrane filter, and filter the photopolymerization initiator solution (mixture of chloroform and methanol) solution) is obtained. Let this be a measurement sample.

(4) The measurement sample is analyzed by HPLC, and the concentration (unit: µg/mL) of the photopolymerization initiator in the measurement sample is measured.

(5) The concentration of the photoinitiator is multiplied by 11 mL of the volume of a mixed solvent (a mixed solvent of chloroform and methanol) in which the photoinitiator is dissolved, and the mass of the photoinitiator in the measurement sample (unit is μg) ) is calculated.

(6) By dividing the mass of the said photoinitiator in the said measurement sample by the mass of the extract|collected adhesive layer, the mass ratio of the said photoinitiator in an adhesive layer is computed, and let this be a 1st mass ratio.

The said 2nd mass ratio was calculated|required according to the following procedure. In addition, all of the following (1)-(4) were performed in a dark cow.

(1) About 0.1g of a die-bonding layer is peeled and obtained on an adhesive layer.

(2) After adding the die-bonding layer obtained by peeling in 4 mL of chloroform, a photoinitiator is extracted in chloroform by shaking in a cool and dark place overnight (about 16 hours).

(3) Add 7 mL of methanol to the chloroform solution after extraction of the photopolymerization initiator, reprecipitate components other than the photopolymerization initiator, filter the reprecipitated components through a membrane filter, and filter the photopolymerization initiator solution (mixture of chloroform and methanol) solution) is obtained. Let this be a measurement sample.

(4) The measurement sample is analyzed by HPLC, and the concentration (unit: µg/mL) of the photopolymerization initiator in the measurement sample is measured.

(5) The concentration of the photoinitiator is multiplied by 11 mL of the volume of a mixed solvent (a mixed solvent of chloroform and methanol) in which the photoinitiator is dissolved, and the mass of the photoinitiator in the measurement sample (unit is μg) ) is calculated.

(6) By dividing the mass of the photoinitiator in the measurement sample by the mass of the sampled die bonding layer, the mass ratio of the photoinitiator in the die bonding layer is calculated, and this is used as the second mass ratio. .

In addition, the analysis by HPLC was performed on condition of the following.

analysis device

Waters, Acquity HPLC

Measuring conditions

ㆍStandard solution: A solution in which Omnirad was dissolved in a mixed solution of chloroform and methanol at a concentration of 5.54 μg/mL (first standard solution), a solution obtained by dissolving at a concentration of 55.4 μg/mL (second standard solution) and a concentration of 166.2 μg/mL 3 types of solutions (third standard solution) dissolved in mL

ㆍColumn: GL Science, Inertsil (registered trademark) (2.1mmφ×10cm, average particle diameter of carrier 1.7㎛)

ㆍColumn temperature: 40℃

ㆍColumn flow rate: 0.8mL/min

ㆍEluent composition: gradient conditions of ultrapure water/acetonitrile

ㆍInjection amount: 10μL

ㆍDetector: PDA detector

ㆍDetection wavelength: 260nm

The transfer ratio of the photoinitiator was computed by substituting the value of the said 1st mass ratio and the value of the said 2nd mass ratio into following formula (3). The results are shown in Table 2 below.

Transition ratio (mass %) of photoinitiator = - 2nd mass ratio / 1st mass ratio x 100... (3)

(peel force)

About the dicing die-bonding film which concerns on each example, the peeling force of the die-bonding layer with respect to an adhesive layer was measured. The peeling force of the die-bonding layer with respect to an adhesive layer was measured, after hardening an adhesive layer.

The peeling force of the die-bonding layer with respect to an adhesive layer was measured by the T-type peeling test.

In the T-type peeling test, a PET separator is peeled from the die-bonding layer, an exposed surface is formed on the die-bonding layer, and a dicing die-bonding tape (trade name "ELP BT315", manufactured by Nitto Denko Corporation) is bonded to the exposed surface. After curing the pressure-sensitive adhesive layer by irradiating the film with ultraviolet rays having an intensity of 150 J/cm 2 from the dicing tape side using the trade name “UM-810” (high pressure mercury lamp, 60 mW/cm 2 ) manufactured by Nitto Seiki Co., Ltd., a width of 50 mm A sample cut out to a dimension of x length 120 mm was used as a measurement sample, and a tensile tester (for example, trade name "TG-1kN", manufactured by Minebea Mitsumi Co., Ltd.) was used at a temperature of 25°C and a tensile rate of 300 mm/min. conditions were carried out.

The peel force measured as described above is shown in Table 2 below.

(pick-up)

The pick-up property was evaluated about the semiconductor chip with a die-bonding layer in a cleaved state. A semiconductor chip with a die-bonding layer in a cleaved state is a 12-inch bare wafer (300 mm in diameter, 55 µm thick) in which a dividing groove (10 mm x 10 mm) is formed by half-cut, on the side on which the dividing groove is formed. After affixing the backgrind tape to the substrate, using a back grinder (manufactured by DISCO, model DGP8760), the 12-inch bare wafer was ground to a thickness of 25 µm from the side opposite to the side on which the backgrind tape was pasted, and back A ground bare wafer is obtained, and the die bonding layer of the dicing die bonding film according to each example is attached on the opposite side to the pasting surface of the backgrind tape of the backgrinded bare wafer, and the bare wafer with a dicing die bonding film is affixed. It obtained and obtained this bare wafer with a dicing die-bonding film by expanding using the die-separator (brand name "die separator DDS3200, Disco Corporation make").

In addition, the expand using the die-separation apparatus was performed in the state which peeled the said backgrind tape from a bare wafer.

In the expand using a die-separator apparatus, after performing cool expansion, room temperature expansion was performed.

In the cool expand, a ring frame made of SUS (manufactured by Disco Corporation) having a diameter of 12 inches is affixed at room temperature on the frame bonding area on the pressure-sensitive adhesive layer of the dicing die-bonding film affixed to the bare wafer, and then the ring frame made of SUS is affixed. It performed by mounting a bare wafer in a die-separating apparatus, and expanding the dicing tape of a dicing die-bonding film with the cool expand unit of this die-separating apparatus. The cool expand was performed under the conditions of an expand temperature of -15°C, an expand speed of 100 mm/sec, and an expand amount of 7 mm.

In addition, after the cool expand, the semiconductor wafer is divided into a plurality of semiconductor chips, and the die bonding layer is also divided into pieces corresponding to the size of the semiconductor chip, thereby obtaining a semiconductor chip with a plurality of die bonding layers.

Normal temperature expand was performed by expanding the dicing tape of a dicing die-bonding film using the normal temperature expand unit of the said die-separating apparatus after cool expand. Normal temperature expansion was performed under the conditions of an expand temperature of 23±2°C, an expand speed of 1 mm/sec, and an expand amount of 10 mm.

The dicing tape after normal temperature expansion was subjected to heat shrinkage treatment. Heat shrinkage treatment was performed under conditions of a temperature of 200°C and a time of 20 seconds.

After heating and shrinking the dicing tape, the pick-up test of the semiconductor chip with a die-bonding layer divided into pieces was done using the apparatus (brand name "die bonder SPA-300", Shinkawa make) which has a pick-up mechanism. The apparatus which has the said pick-up mechanism WHEREIN: The pushing-up speed by a pin member was 1 mm/sec, and the pushing-up amount was 2000 micrometers.

The pick-up test was performed after curing the pressure-sensitive adhesive layer by irradiating ultraviolet rays with an intensity of 150 J/cm 2 from the dicing tape side using a trade name "UM-810" (high pressure mercury lamp, 60 mW/cm 2 ) manufactured by Nitto Seiki. .

The pick-up test was performed with respect to five die-bonding layer-equipped semiconductor chips, and the pick-up property was judged on the following reference|standard.

◎ All of the five die-bonding layer-equipped semiconductor chips can be picked up.

○ 3 or 4 of the 5 die-bond layer-equipped semiconductor chips can be picked up.

All of the x 5 die-bonding layer-equipped semiconductor chips cannot be picked up.

In Table 2, in the dicing die-bonding film according to Examples 1 to 6, compared with the dicing die-bonding film according to Comparative Example 1, the transfer ratio of the photopolymerization initiator from the pressure-sensitive adhesive layer to the die-bonding layer was low, and the radiation It turned out that it is fully falling also about the adhesive force after irradiation.

Moreover, also with respect to the pick-up property, it turns out that in the dicing die-bonding film concerning Examples 1-6, what was favorable as (circle) or (double-circle), in the dicing die-bonding film which concerns on the comparative example 1, it turns out that it is bad as x.

1: base layer
2: adhesive layer
3: die bond layer
10: dicing tape
20: dicing die bond film
G: Backgrind tape
H: maintenance
J: adsorption jig
P: no pin
R: dicing ring
T: Tape for wafer processing
U: Push-up member
W: semiconductor wafer

Claims (4)

A dicing tape in which an adhesive layer is laminated on a base material layer;
A die-bonding layer laminated on the pressure-sensitive adhesive layer of the dicing tape,
The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive and a photopolymerization initiator,
In the molecular weight distribution curve obtained by GPC measurement of the pressure-sensitive adhesive layer before curing, polydispersity Mw/Mn, which is the ratio of the mass average molecular weight Mw of the peak appearing on the highest molecular weight side to the number average molecular weight Mn of the peak appearing on the highest molecular weight side This, 1.3 or higher
Dicing die bond film. The molecular weight distribution curve obtained by GPC measurement of the said adhesive layer before hardening WHEREIN: The value of the peak top molecular weight of the peak which appears on the highest molecular weight side is 33,000 or less.
Dicing die bond film. The said adhesive layer before hardening contains less than 32 mass % of sol components according to claim 1 or 2
Dicing die bond film. The peeling force of the said die-bonding layer with respect to the said adhesive layer is less than 0.18N/20mm after hardening of the said adhesive layer.
Dicing die bond film.

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