MY186094A - Removable adhesive sheet for semiconductor processing - Google Patents

Removable adhesive sheet for semiconductor processing

Info

Publication number
MY186094A
MY186094A MYPI2018700844A MYPI2018700844A MY186094A MY 186094 A MY186094 A MY 186094A MY PI2018700844 A MYPI2018700844 A MY PI2018700844A MY PI2018700844 A MYPI2018700844 A MY PI2018700844A MY 186094 A MY186094 A MY 186094A
Authority
MY
Malaysia
Prior art keywords
styrene
block copolymer
removable adhesive
adhesive sheet
semiconductor processing
Prior art date
Application number
MYPI2018700844A
Inventor
Kawata Satoru
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY186094A publication Critical patent/MY186094A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A removable adhesive sheet for semiconductor processing, containing a removable adhesive layer provided on a base material film, in which a loss factor is 0.08 or more and less than 0.15 at a frequency of 0.01 to 10 Hz; the base material film is single-layered, and contains 5 to 39 mass parts of a styrene- based block copolymer with respect to 100 mass parts of a base resin; the styrene-based block copolymer is at least one kind of resin selected from the group consisting of a styrene-hydrogenated isoprene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a styrene-hydrogenated butadiene- styrene block copolymer, and a styrene-hydrogenated isoprene/butadiene- styrene block copolymer; and the base resin is at least one kind of resin selected from specific resins such as a polypropylene, a polyethylene, and the like.
MYPI2018700844A 2016-03-31 2017-03-27 Removable adhesive sheet for semiconductor processing MY186094A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016073263 2016-03-31
PCT/JP2017/012455 WO2017170436A1 (en) 2016-03-31 2017-03-27 Adhesive sheet for semiconductor processing

Publications (1)

Publication Number Publication Date
MY186094A true MY186094A (en) 2021-06-21

Family

ID=59965581

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018700844A MY186094A (en) 2016-03-31 2017-03-27 Removable adhesive sheet for semiconductor processing

Country Status (7)

Country Link
JP (1) JP6615223B2 (en)
KR (1) KR102355077B1 (en)
CN (1) CN108207116B (en)
MY (1) MY186094A (en)
SG (1) SG11201800285PA (en)
TW (1) TWI654242B (en)
WO (1) WO2017170436A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109536068B (en) * 2018-11-16 2021-08-17 宁波激智科技股份有限公司 High-viscosity protective film and preparation method thereof
KR20200141102A (en) 2019-06-10 2020-12-18 황진혁 moisture remover wiper
JP2021077861A (en) * 2019-11-07 2021-05-20 日東電工株式会社 Dicing tape and dicing die bond film
CN112048253B (en) * 2020-09-04 2022-04-12 浙江洁美电子科技股份有限公司 Self-adhesion type protection film
JP2023066587A (en) * 2021-10-29 2023-05-16 タキロンシーアイ株式会社 Base film for semiconductor manufacturing tape
JP2023066585A (en) * 2021-10-29 2023-05-16 タキロンシーアイ株式会社 Base film for semiconductor manufacturing tape

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5140910B2 (en) * 2005-08-30 2013-02-13 住友ベークライト株式会社 Film base and adhesive tape for semiconductor wafer processing
JP2007100064A (en) 2005-09-07 2007-04-19 Furukawa Electric Co Ltd:The Pressure-sensitive adhesive tape for dicing
JP5448430B2 (en) 2007-12-18 2014-03-19 古河電気工業株式会社 Wafer sticking sheet and wafer processing method
WO2011004825A1 (en) * 2009-07-08 2011-01-13 古河電気工業株式会社 Wafer-pasting adhesive sheet and wafer processing method using the same
JP2011216704A (en) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The Adhesive tape for semiconductor wafer processing
KR101397686B1 (en) * 2010-12-06 2014-05-22 제일모직주식회사 Base film and adhesive film for semiconductor devices using the same
JP5294365B1 (en) * 2012-09-27 2013-09-18 古河電気工業株式会社 Radiation curable adhesive tape for dicing
JP6107230B2 (en) * 2013-02-28 2017-04-05 住友ベークライト株式会社 Dicing film
JP6264126B2 (en) * 2014-03-20 2018-01-24 日立化成株式会社 Wafer processing tape

Also Published As

Publication number Publication date
CN108207116A (en) 2018-06-26
TW201800467A (en) 2018-01-01
JP6615223B2 (en) 2019-12-04
TWI654242B (en) 2019-03-21
JPWO2017170436A1 (en) 2019-02-07
KR20180127302A (en) 2018-11-28
CN108207116B (en) 2023-02-21
WO2017170436A1 (en) 2017-10-05
KR102355077B1 (en) 2022-01-25
SG11201800285PA (en) 2018-02-27

Similar Documents

Publication Publication Date Title
MY186094A (en) Removable adhesive sheet for semiconductor processing
MY186142A (en) Removable adhesive sheet for semiconductor processing
SG11201807052WA (en) Surface protective film
PH12018500421A1 (en) Adhesive agent composition and adhesive sheet
EP3207094A4 (en) Silicone composition and a pressure sensitive adhesive film having a pressure sensitive adhesive layer made from the composition
MX2010004307A (en) Rotating multi-clipper platform systems with cooperating adhesive seal modules, adhesive seal systems and associated devices and related methods.
PH12019500576A1 (en) Adhesive sheet for semiconductor processing
MX2015006479A (en) Multilayer film for resealable packaging having improved resealing.
EP3749721A4 (en) Polyethylene film compositions, laminates, and methods for making the same
TW201614284A (en) Polarizing plate with pressure-sensitive adhesive layer
MY190662A (en) Laminated coating film, coated article, and method for forming laminated coating film
MX2017011123A (en) Flexible fitment for flexible container.
MY188629A (en) Release film
SG11201910104UA (en) Temporary protective film for semiconductor sealing molding
MY183013A (en) Sheet for semiconductor processing
EP3489283A4 (en) Tearable non-stretched resin film and laminated film for packaging material using same
EP3950830A4 (en) Resin composition, and film for cover material
MX2018010899A (en) Face films and pressure sensitive laminates for printing.
BR112016024010A2 (en) shrink films with high tear strength and methods of making them
MX2020005017A (en) Heat-seal coatings.
BR112017018713A2 (en) stretch laminates
MY164338A (en) Dicing film
EP3904049A4 (en) Biaxially oriented polypropylene film
TW201612015A (en) Biaxial extension polypropylene film
PL3535119T3 (en) Inline coated biaxially oriented polypropylene film and method for the production thereof