WO2017170436A1 - Adhesive sheet for semiconductor processing - Google Patents
Adhesive sheet for semiconductor processing Download PDFInfo
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- WO2017170436A1 WO2017170436A1 PCT/JP2017/012455 JP2017012455W WO2017170436A1 WO 2017170436 A1 WO2017170436 A1 WO 2017170436A1 JP 2017012455 W JP2017012455 W JP 2017012455W WO 2017170436 A1 WO2017170436 A1 WO 2017170436A1
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- copolymer
- styrene
- ethylene
- sensitive adhesive
- pressure
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Definitions
- the present invention relates to an adhesive sheet for semiconductor processing. More specifically, the present invention relates to a dicing adhesive tape suitable for fixing and holding a semiconductor wafer when dicing a semiconductor wafer into chips and a dicing adhesive tape used for semiconductor package processing. In particular, the present invention relates to a dicing adhesive tape suitable for high-density mounting semiconductor package processing.
- the dicing adhesive tape protects and fixes the wafer during the dicing process of separating the semiconductor wafer on which the circuit pattern is formed into chips. After the semiconductor wafer is fixed to the adhesive tape, it is diced with a rotary blade called a dicing blade to form semiconductor chips separated into chips. The semiconductor chip is held by the adhesive tape until the pickup process.
- the present invention is intended to solve the problems associated with the prior art as described above, and while reducing the occurrence of package fly that occurs during dicing, it can be quickly and reliably picked up by scraping after dicing. It aims at providing the adhesive sheet for semiconductor processing which can be peeled from an adhesive tape.
- the present inventors have studied in detail the content of the styrene-based copolymer with respect to the base resin and the loss coefficient of the pressure-sensitive adhesive sheet. As a result, the content of the styrene-based copolymer is small and the value of the loss coefficient Has been found to be important, and the present invention has been achieved. That is, the said subject of this invention is solved by the following means.
- a semiconductor processing pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on a substrate film Using a test piece obtained by processing the pressure-sensitive adhesive sheet for semiconductor processing into a width of 5 mm, the loss coefficient measured in a film shape with a dynamic viscoelasticity measuring apparatus is 0.08 or more and less than 0.15 when the frequency is 0.01 to 10 Hz.
- the base film is a single layer, and includes 5 to 39 parts by mass of a styrenic block copolymer with respect to 100 parts by mass of the base resin.
- the styrene block copolymer is a styrene-hydrogenated isoprene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a styrene-hydrogenated butadiene-styrene block copolymer, or a styrene-hydrogenated isoprene / butadiene.
- the base resin is polypropylene, high density polyethylene, low density polyethylene, linear low density polyethylene, ethylene / propylene copolymer, propylene copolymer, ethylene-propylene-diene copolymer vulcanizate, polybutene, polybutadiene, Methylpentene, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid methyl copolymer, ethylene- (meth) ethyl acrylate copolymer, polyvinyl chloride, Vinyl chloride-vinyl acetate copolymer, ethylene-vinyl chloride-vinyl acetate copolymer, polystyrene, polyurethane, polyamide, ionomer, nitrile rubber, butyl rubber, styrene isoprene rubber,
- the term “acrylic” includes methacrylic.
- the parenthesis part of “(meth)” means that it may or may not be present as in the case of (meth) acrylic system.
- (meth) acrylic system May be acrylic, methacrylic, or any of these.
- an adhesive sheet for semiconductor processing that can reduce the occurrence of package fly that occurs at the time of dicing and can be quickly and reliably peeled off from the adhesive tape even by pick-up by scraping or the like after dicing.
- FIG. 1 is a cross-sectional view showing an embodiment of the pressure-sensitive adhesive sheet for semiconductor processing of the present invention.
- FIG. 2 is a cross-sectional view illustrating a semiconductor wafer dicing step and a pickup step.
- FIG. 3 is a cross-sectional view illustrating a semiconductor wafer dicing step and a pickup step.
- FIG. 4 is a cross-sectional view illustrating a semiconductor wafer dicing step and a pickup step.
- FIG. 5 is a cross-sectional view illustrating a semiconductor wafer dicing step and a pickup step.
- the adhesive sheet 12 for semiconductor processing of this invention has the adhesive layer 2 on the at least one surface on the base film 1 like the schematic sectional drawing typically shown in FIG. First, it demonstrates in order from a base film.
- the base film is not a laminate in which a plurality of resin films are laminated, but consists of one layer, that is, a single resin film.
- the resin constituting the base film is not a single resin but a base resin and at least a styrene block copolymer.
- the styrene block copolymer is an elastomer and is also referred to as a styrene thermoplastic elastomer or a styrene elastomer.
- the styrenic block copolymer is preferably a styrene block copolymer composed of a hard segment polystyrene and a soft segment. Examples of the soft segment include polybutadiene, polyisobutylene, polyisoprene, and hydrogenated polybutadiene (that is, ethylene / propylene).
- Hydrogenated polyisobutylene ie, ethylene / butylene
- hydrogenated isoprene / butadiene ie, ethylene-ethylene / propylene
- butadiene rubber epoxidized polybutadiene, and the like.
- the base film becomes flexible and the adhesion to the semiconductor package can be increased. Also, the expansion can be easily performed.
- styrene-hydrogenated isoprene-styrene block copolymer SEPS
- SIS styrene-isoprene-styrene copolymer
- SEBS styrene-hydrogenated butadiene-styrene copolymer
- SEEPS hydrogenated isoprene / butadiene-styrene copolymers
- ⁇ means to connect in block units (one block), and “/” becomes one repeating unit, which is a block unit (one block).
- the styrene block copolymer may be used alone or in combination.
- the styrenic block copolymer is used together with the base resin, and in the present invention, it is contained in an amount of 5 to 39 parts by mass with respect to 100 parts by mass of the base resin, preferably 10 to 35 parts by mass.
- the content of the styrenic block copolymer is less than 5 parts by mass, the base film becomes rigid and the adhesion to the semiconductor package cannot be improved.
- the amount exceeds 39 parts by mass the package does not stand even if the adhesive sheet for semiconductor processing is bent by rubbing off.
- the base resin is a resin other than the styrenic block copolymer.
- a thermoplastic resin is preferable, a base film having excellent water resistance and heat resistance is more preferable, and a synthetic resin film is particularly preferable.
- Thermoplastic resins include polyolefin resin, polyamide resin, polyetheramide resin, thermoplastic polyimide resin, thermoplastic polyamideimide resin, polyurethane resin, urea resin, polyester resin, liquid crystal polyester resin, polyacetal resin, polycarbonate resin, polyphenylene ether ( (Including modified polyphenylene ether) resin, polysulfone resin, polyether sulfone resin, polyphenylene sulfide resin, polyether ether ketone (including modified polyether ether ketone) resin, polyether ketone resin, polyaryl ether ketone resin, polyarylate resin, Fluorine resin, polyphenylene oxide resin, polylactic acid, phenol resin, melamine resin, epoxy resin, phenoxy resin, silicon resin, etc. That. Of the thermoplastic resins, polyolefin resin is particularly preferable.
- the thermoplastic resin may be modified by acid modification or the like, and may be crystalline or amorphous.
- the polyolefin resin is a polyolefin resin obtained by polymerizing at least one olefin, and may be a homopolymer or a copolymer.
- olefins include ⁇ -olefins having 4 to 12 carbon atoms including ethylene, propylene, isobutylene, isobutene (1-butene), butadiene, isoprene, (meth) acrylic acid esters, and (meth) acrylic acid. , (Meth) acrylamide, vinyl alcohol, vinyl acetate, vinyl chloride, styrene, acrylonitrile and the like.
- Examples of the ⁇ -olefin having 4 to 12 carbon atoms include 1-butene, 2-methyl-1-propene, 2-methyl-1-butene, 3-methyl-1-butene, 1-hexene, 2 -Ethyl-1-butene, 2,3-dimethyl-1-butene, 2-methyl-1-pentene, 3-methyl-1-pentene, 4-methyl-1-pentene, 3,3-dimethyl-1-butene 1-heptene, methyl-1-hexene, dimethyl-1-pentene, ethyl-1-pentene, trimethyl-1-butene, methylethyl-1-butene, 1-octene, methyl-1-pentene, ethyl-1- Hexene, dimethyl-1-hexene, propyl-1-heptene, methylethyl-1-heptene, trimethyl-1-pentene, propyl-1-pentene, diethyl-1-butene, 1-
- polystyrene resin examples include polyethylene resins, polypropylene resins, polyisobutylene resins, polyisobutene resins, polyisoprene resins, polybutadiene resins, (meth) acrylic resins (so-called allyl resins), vinyl resins such as polyvinyl chloride resins, poly (meth) ) Acrylamide resin, polystyrene resin, acrylonitrile / butadiene / styrene copolymer resin (ABS resin), ethylene / (meth) acrylate copolymer, ethylene / vinyl acetate copolymer, and the like.
- ABS resin acrylonitrile / butadiene / styrene copolymer resin
- ABS resin acrylonitrile / butadiene / styrene copolymer resin
- polyethylene resin examples include an ethylene homopolymer and an ethylene- ⁇ -olefin copolymer.
- ⁇ -olefin 1-butene, 1-pentene, 1-hexene and 1-octene are preferable.
- Examples of the ethylene- ⁇ -olefin copolymer include an ethylene-1-butene copolymer, an ethylene-1-pentene copolymer, an ethylene-1-hexene copolymer, and an ethylene-1-octene copolymer. Can be mentioned.
- high density polyethylene high density polyethylene
- LDPE low density polyethylene
- VLDPE very low density polyethylene
- LLDPE linear low density polyethylene
- UHMW-PE ultra high molecular weight polyethylene
- polypropylene resins examples include propylene homopolymer, propylene-ethylene random copolymer, propylene- ⁇ -olefin random copolymer, propylene-ethylene- ⁇ -olefin copolymer, propylene block copolymer (propylene homopolymer component) Or a copolymer component mainly composed of propylene and a copolymer obtained by copolymerizing propylene with at least one monomer selected from ethylene and ⁇ -olefin). These polypropylene resins may be used alone or in combination of two or more.
- the ⁇ -olefin used in the polypropylene resin is preferably 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, 1-octene, 1-decene, 1-butene, 1-hexene, 1-hexene, Octene is more preferred.
- propylene- ⁇ -olefin random copolymer examples include propylene-1-butene random copolymer, propylene-1-hexene random copolymer, propylene-1-octene random copolymer, and the like.
- propylene-ethylene- ⁇ -olefin copolymer examples include propylene-ethylene-1-butene copolymer, propylene-ethylene-1-hexene copolymer, propylene-ethylene-1-octene copolymer, and the like. It is done.
- propylene block copolymer examples include (propylene)-(propylene-ethylene) copolymer, (propylene)-(propylene-ethylene-1-butene) copolymer, (propylene)-(propylene-ethylene-1).
- propylene homopolymer propylene-ethylene random copolymer, propylene-1-butene random copolymer, propylene-ethylene-1-butene copolymer, and propylene block copolymer are preferable.
- the crystallinity of the polypropylene resin is determined by the melting temperature (melting point) and stereoregularity, depending on the quality required for the polyolefin resin composition of the present invention and the quality required for the molded product obtained by molding it, adjust.
- the stereoregularity is referred to as an isotactic index and a syndiotactic index.
- the isotactic index is determined by the 13 C-NMR method described in Macromolecules, Vol. 8, page 687 (1975). Specifically, the isotactic index of the polypropylene resin is determined as the area fraction of the mmmm peak in the total absorption peak of the methyl group carbon region in the 13 C-NMR spectrum. Those having a high isotactic index have high crystallinity, preferably 0.96 or more, more preferably 0.97 or more, and even more preferably 0.98 or more.
- syndiotactic index is J. Am. Chem. Soc. 110, 6255 (1988) and Angew. Chem. Int. Ed. Engl. , 1955, 34, 1143-1170, and those having a high syndiotactic index have high crystallinity.
- vinyl resins examples include vinyl chloride resins [vinyl chloride monomer homopolymers (polyvinyl chloride resin, etc.), vinyl chloride monomers and other monomers (vinyl chloride-vinyl acetate copolymer). Polymers, vinyl chloride- (meth) acrylic acid ester copolymers, etc.)], vinyl alcohol resins (such as homopolymers such as polyvinyl alcohol, copolymers such as ethylene-vinyl alcohol copolymer), polyvinyl formal, etc. A polyvinyl acetal resin etc. are mentioned. These vinyl resins can be used singly or in combination of two or more.
- the melt flow rate (MFR) of the polyolefin resin is usually from 0.01 to 400 g / 10 minutes, preferably from 1 to 400 g / 10 minutes, more preferably from the viewpoint of improving mechanical strength and production stability. Is 1 to 100 g / 10 min, and more preferably 1 to 50 g / 10 min.
- the melt flow rate (MFR) is a mass (g / 10 minutes) of a polymer flowing out per 10 minutes under a load of 190 ° C. and 2.16 kg in accordance with JIS K7210.
- the base resin is particularly preferably polypropylene.
- the surface of the base film in contact with the pressure-sensitive adhesive layer may be subjected to corona treatment or may be provided with other layers such as a primer.
- the thickness of the base film is not particularly limited, but is preferably 30 to 300 ⁇ m, more preferably 30 to 200 ⁇ m, and further preferably 50 to 150 ⁇ m. Further, in the present invention, those exceeding 100 ⁇ m are also preferable. In this case, it exceeds 100 ⁇ m and is preferably 300 ⁇ m or less, more preferably 110 to 300 ⁇ m, further preferably 110 to 250 ⁇ m, and particularly preferably 110 to 200 ⁇ m.
- the pressure-sensitive adhesive layer can be formed of various conventionally known pressure-sensitive adhesives.
- a pressure-sensitive adhesive is not limited at all, but for example, a pressure-sensitive adhesive based on rubber, acrylic, silicone, polyvinyl ether or the like is used. In the present invention, an acrylic pressure-sensitive adhesive is preferred.
- a crosslinking agent can be blended.
- the crosslinking agent include an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, a metal chelate-based crosslinking agent, an aziridine-based crosslinking agent, and an amine resin corresponding to the base polymer.
- the pressure-sensitive adhesive can contain various additive components as desired within the range in which the object of the present invention is not impaired.
- a radiation-curing type or heat-foaming type pressure-sensitive adhesive can also be used.
- a pressure-sensitive adhesive that is cured by ultraviolet rays, an electron beam, or the like and easily peels at the time of peeling can be used.
- a heat foaming type adhesive the adhesive which becomes easy to peel with a foaming agent or an expansion agent by heating can be used.
- the adhesive may be an adhesive that can be used for dicing and dyne bonding.
- the radiation curable pressure-sensitive adhesive for example, those described in JP-B-1-56112, JP-A-7-135189 and the like are preferably used, but are not limited thereto.
- an ultraviolet curable adhesive it is preferable to use an ultraviolet curable adhesive.
- a photopolymerizable compound a low molecular weight compound having a reactive carbon-carbon double bond
- a photopolymerizable compound a reactive carbon-carbon double bond
- the above rubber-based or acrylic base resins are natural rubber, rubber polymers such as various synthetic rubbers, or poly (meth) acrylic acid alkyl esters, (meth) acrylic acid alkyl esters, (meth) acrylic acid alkyl esters. And an acrylic polymer such as a copolymer of the above and other unsaturated monomer copolymerizable therewith.
- the initial adhesive strength can be set to an arbitrary value by mixing an isocyanate curing agent in the above-mentioned pressure-sensitive adhesive.
- an isocyanate curing agent include polyvalent isocyanate compounds such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane.
- an ultraviolet curable pressure-sensitive adhesive by mixing a photopolymerization initiator in the pressure-sensitive adhesive, it is possible to reduce the polymerization curing time and the amount of ultraviolet irradiation by ultraviolet irradiation.
- a photopolymerization initiator include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, ⁇ -chloranthraquinone and the like can be mentioned.
- the mass average molecular weight of the base polymer of the acrylic pressure-sensitive adhesive is preferably 100,000 or more, more preferably 200,000 or more, further preferably 250,000 or more, particularly preferably 300,000 or more, and most preferably 400,000 or more.
- the upper limit of the mass average molecular weight is preferably 2 million or less, more preferably 1.5 million or less, further preferably 1 million or less, and particularly preferably 800,000 or less.
- 100,000 to 2,000,000 is mentioned as a preferable range
- 250,000 to 2,000,000 is mentioned as a more preferable range.
- Another example of the range is, for example, a range of 200,000 to 1,500,000.
- the weight average molecular weight is obtained by standard polystyrene conversion by gel permeation chromatography (GPC).
- the thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably 4 to 30 ⁇ m, particularly preferably 5 to 25 ⁇ m.
- a loss factor (tan ⁇ ) measured in a film form by a dynamic viscoelasticity measuring device by a method according to JIS K7244 has a frequency of 0.01 to 10 Hz. Sometimes it is 0.08 or more and less than 0.15.
- the loss factor (tan ⁇ ) is preferably 0.1 to 0.13.
- loss factor (tan ⁇ ) is less than 0.08, the risk of package fly increases, and if it is 39 or more, the risk that chips will remain on the adhesive sheet for semiconductor processing with a scraping pickup increases.
- the loss factor can be measured with a dynamic viscoelasticity measuring apparatus (for example, Rhegel-E4000 manufactured by UBM).
- a test piece having a width of 5 mm and a length of 10 mm is cut out from an adhesive sheet for semiconductor processing, and the test piece is fixed to a dynamic viscoelasticity measuring apparatus with a supporting jig, at a temperature of 23 ° C. and a frequency of 0.01 to 10 Hz. It is the value obtained by measuring with.
- the loss coefficient within the above range, it can be adjusted by the types and blending amounts of the base resin, the styrene block copolymer and the pressure sensitive adhesive.
- the semiconductor wafer is bonded to the semiconductor processing pressure-sensitive adhesive sheet of the present invention, and the wafer can be diced and picked up as shown in FIGS.
- the semiconductor wafer processing method using the adhesive sheet for semiconductor processing of the present invention not cutting the base film reduces the cutting resistance of the dicing blade, smoothes the semiconductor wafer cutting, and reduces chipping. Therefore, it is preferable.
- the setting of the cutting depth of the dicing apparatus to be used may be appropriately changed according to the manual.
- the bare wafer used in the present invention is not particularly limited, and can be appropriately selected from any conventionally used bare wafer.
- SEPS Styrene-hydrogenated isoprene-styrene block copolymer
- PP homopropylene
- Base film C Styrene-hydrogenated butadiene-styrene copolymer SEBS [trade name: Septon 8104, manufactured by Kuraray Co., Ltd.] and homopropylene (PP) [trade name: J-105G, manufactured by Ube Industries, Ltd.] It mixed by the compounding ratio shown in following Table 1, and it processed by the film extrusion molding at about 200 degreeC with the biaxial kneader, and manufactured the base film C with a thickness of 150 micrometers.
- SEBS Styrene-hydrogenated butadiene-styrene copolymer
- PP homopropylene
- Base film D Tylene-hydrogenated isoprene / butadiene-styrene copolymer (SEEPS) [trade name: Septon Septon 4033, manufactured by Kuraray Co., Ltd.] and homopropylene (PP) [trade name: J-105G, Ube Industries, Ltd. Manufactured] was mixed at a blending ratio shown in Table 1 below, and processed by film extrusion at about 200 ° C. with a twin-screw kneader to produce a substrate film D having a thickness of 150 ⁇ m.
- SEEPS Tylene-hydrogenated isoprene / butadiene-styrene copolymer
- PP homopropylene
- Polyisocyanate compound [trade name: Coronate] in 100 parts by mass of acrylic base polymer (copolymer consisting of 2-ethylhexyl acrylate, methyl acrylate, 2-hydroxyethyl acrylate, mass average molecular weight 400,000, glass transition temperature: -35 ° C.) L, manufactured by Nippon Polyurethane Industry Co., Ltd.] 3 parts by weight, 50 parts by weight of tetramethylolmethane tetraacrylate as a compound having a photopolymerizable carbon-carbon double bond, and 1 part by weight of ⁇ -hydroxycyclohexyl phenyl ketone as a photopolymerization initiator Part was added and mixed.
- acrylic base polymer copolymer consisting of 2-ethylhexyl acrylate, methyl acrylate, 2-hydroxyethyl acrylate, mass average molecular weight 400,000, glass transition temperature: -35 ° C.
- L glass transition temperature:
- Examples 1 to 3 and Comparative Example 1 The pressure-sensitive adhesive is coated on one surface of the base film A to a thickness of 20 ⁇ m to form a pressure-sensitive adhesive layer, and the semiconductor processing pressure-sensitive adhesive sheets of Examples 1 to 3 and Comparative Example 1 are manufactured. did.
- Example 4 A pressure-sensitive adhesive sheet for semiconductor processing was produced in the same manner as in Example 1 except that the base film B was used.
- Example 5 A pressure-sensitive adhesive sheet for semiconductor processing was produced in the same manner as in Example 1 except that the base film C was used.
- Example 6 A pressure-sensitive adhesive sheet for semiconductor processing was produced in the same manner as in Example 1 except that the base film D was used.
- the loss factor (tan ⁇ ), package fly, and pickup success rate were evaluated for each of these semiconductor processing adhesive sheets as follows.
- a test piece having a width of 5 mm and a length of 10 mm was cut out from the adhesive sheet for semiconductor processing.
- a test piece was fixed to a dynamic viscoelasticity measuring apparatus (UBE, Rheogel-E4000) with a supporting jig by a method according to JISK7244, and the measurement was performed at a temperature of 23 ° C. and a frequency of 0.01 to 10 Hz.
- a loss coefficient (tan ⁇ loss elastic modulus E ′′ / storage elastic modulus E ′) within this frequency range was obtained.
- the adhesive sheets for semiconductor processing of Examples 1 to 6 all have a loss coefficient value of 0.08 or more and less than 0.15, and no package fly occurs. It was good.
- the semiconductor processing pressure-sensitive adhesive sheet of Comparative Example 1 had a large amount of elastomer component and a high loss factor. As a result, package fly did not occur. Since all packages did not stand up even if the board was bent, chips that could not be scraped off remained on the adhesive sheet for semiconductor processing.
- the pressure-sensitive adhesive sheet for semiconductor processing of Comparative Example 2 had a small elastomer component and a low loss factor. As a result, the pressure-sensitive adhesive sheet for semiconductor processing could not absorb the vibration during dicing, and package fly occurred.
Abstract
Description
さらに詳しくは、詳細には、半導体ウェハをチップにダイシングする際などにおける半導体ウェハの固定保持に適したダイシング用粘着テープおよび半導体パッケージ加工に使用されるダイシング用粘着テープについて関するものである。特に、高密度実装半導体パッケージ加工用として好適なダイシング用粘着テープに関するものである。 The present invention relates to an adhesive sheet for semiconductor processing.
More specifically, the present invention relates to a dicing adhesive tape suitable for fixing and holding a semiconductor wafer when dicing a semiconductor wafer into chips and a dicing adhesive tape used for semiconductor package processing. In particular, the present invention relates to a dicing adhesive tape suitable for high-density mounting semiconductor package processing.
しかしながら、このような柔軟な粘着剤を使用することにより、ダイシングによるパッケージ側面への粘着剤付着やパッケージに捺印されているレーザーマークが剥がれるという問題が生じている。 Thereafter, when a plurality of semiconductor chips are collectively molded with a resin and individually separated to form individual semiconductor packages, the semiconductor packages are attached and fixed to a dicing tape, and dicing is performed with a rotary blade called a dicing blade. Thus, in the dicing process of the package collectively sealed with the resin, the load at the time of cutting is large, and the package resin contains a release agent and the resin surface has a structure with minute irregularities. For this reason, the adhesive used in the semiconductor processing tape can hold the package firmly, and the package does not hold when dicing and is not scattered (hereinafter referred to as “package fly”). So flexible adhesive is used.
However, the use of such a flexible pressure-sensitive adhesive causes problems such as adhesion of the pressure-sensitive adhesive to the side surface of the package by dicing and peeling of the laser mark printed on the package.
例えば、粘着剤層に(メタ)アルキル酸エステルを用いた粘着テープが提案されている(特許文献1参照)。
しかしながら、近年ますますパッケージの小型化により、パッケージが粘着テープに保持される面積が小さくなりパッケージフライがより発生しやすくなっている。このため、粘着剤を改良しているだけではパッケージフライを抑制するには不十分であった。
また、半導体ウェハの振動を抑制するため、粘着シートの基材面にエラストマーを入れることでダイシング時のチッピングを抑制することが提案されている(特許文献2参照)。このように粘着剤だけでなく、基材側を柔軟にすることで、パッケージとの密着性を上げられるため好ましい。一方で、市場ではパッケージの小サイズ化が進行し、従来のピン突き上げによるピックアップ方法では、ピックアップに非常に時間がかかるようになっている。そのため、ピンセット等によりテープの背面を擦ることによりテープを撓ませて、パッケージを一気に落とす(以下、擦り落としという)ことでピックアップを行うようになってきた。
しかしながら、粘着シートの基材面にエラストマーを入れて基材側を柔軟にすると、柔軟なために、逆に、擦り落としによりテープを撓ませてもパッケージが立たないため擦り落としがうまくいかないという課題があった。 In order to reduce such package fly, studies have been made conventionally.
For example, an adhesive tape using a (meth) alkyl acid ester for an adhesive layer has been proposed (see Patent Document 1).
However, with the recent miniaturization of the package, the area where the package is held on the adhesive tape becomes smaller and package fly is more likely to occur. For this reason, simply improving the pressure-sensitive adhesive is insufficient to suppress package fly.
Moreover, in order to suppress the vibration of the semiconductor wafer, it has been proposed to suppress chipping during dicing by putting an elastomer on the base material surface of the pressure-sensitive adhesive sheet (see Patent Document 2). In this way, not only the pressure-sensitive adhesive but also the base material side is made flexible so that the adhesiveness with the package can be increased, which is preferable. On the other hand, the size of the package has been reduced in the market, and the pick-up method using the conventional pin push-up has become very time consuming. Therefore, picking up has been performed by bending the tape by rubbing the back surface of the tape with tweezers or the like and dropping the package at a stroke (hereinafter referred to as scraping).
However, if an elastomer is put on the base material surface of the adhesive sheet to make the base material side flexible, the problem is that the package will not stand up even if the tape is bent by rubbing, and the scrub will not work well. there were.
すなわち、本発明の上記課題は以下の手段によって解決される。 As a result of diligent study, the present inventors have studied in detail the content of the styrene-based copolymer with respect to the base resin and the loss coefficient of the pressure-sensitive adhesive sheet. As a result, the content of the styrene-based copolymer is small and the value of the loss coefficient Has been found to be important, and the present invention has been achieved.
That is, the said subject of this invention is solved by the following means.
前記半導体加工用粘着シートを幅5mmに加工した試験片を用いて、動的粘弾性測定装置によりフィルム状で測定した損失係数が、周波数0.01~10Hzの時に0.08以上0.15未満であり、
前記基材フィルムが、1層であって、ベース樹脂100質量部に対してスチレン系ブロック共重合体5~39質量部を含み、
前記スチレン系ブロック共重合体が、スチレン-水添イソプレン-スチレンブロック共重合体、スチレン-イソプレン-スチレンブロック共重合体、スチレン-水添ブタジエン-スチレンブロック共重合体およびスチレン-水添イソプレン/ブタジエン-スチレンブロック共重合体から選択される少なくとも1種の樹脂であり、
前記ベース樹脂が、ポリプロピレン、高密度ポリエチレン、低密度ポリエチレン、直鎖低密度ポリエチレン、エチレン・プロピレン共重合体、プロピレン共重合体、エチレン-プロピレン-ジエン共重合体加硫物、ポリブテン、ポリブタジエン、ポリメチルペンテン、エチレン-酢酸ビニル共重合体、エチレン-(メタ)アクリル酸共重合体、エチレン-(メタ)アクリル酸メチル共重合体、エチレン-(メタ)アクリル酸エチル共重合体、ポリ塩化ビニル、塩化ビニル-酢酸ビニル共重合体、エチレン-塩化ビニル-酢酸ビニル共重合体、ポリスチレン、ポリウレタン、ポリアミド、アイオノマー、ニトリルゴム、ブチルゴム、スチレンイソプレンゴム、スチレンブタジエンゴム、天然ゴムおよびその水添加物もしくは変性物から選択される少なくとも1種の樹脂であることを特徴とする半導体加工用粘着シート。
〔2〕前記ベース樹脂が、ポリプロピレンであることを特徴とする〔1〕に記載の半導体加工用粘着シート。
〔3〕前記粘着剤層を形成する粘着剤が、アクリル系粘着剤であることを特徴とする〔1〕または〔2〕に記載の半導体加工用粘着シート。
〔4〕前記スチレン系ブロック共重合体が、ベース樹脂100質量部に対して10~35質量部であることを特徴とする〔1〕~〔3〕のいずれか1項に記載の半導体加工用粘着シート。
〔5〕半導体パッケージのダイシングに用いられることを特徴とする〔1〕~〔4〕のいずれか1項に記載の半導体加工用粘着シート。 [1] A semiconductor processing pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on a substrate film,
Using a test piece obtained by processing the pressure-sensitive adhesive sheet for semiconductor processing into a width of 5 mm, the loss coefficient measured in a film shape with a dynamic viscoelasticity measuring apparatus is 0.08 or more and less than 0.15 when the frequency is 0.01 to 10 Hz. And
The base film is a single layer, and includes 5 to 39 parts by mass of a styrenic block copolymer with respect to 100 parts by mass of the base resin.
The styrene block copolymer is a styrene-hydrogenated isoprene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a styrene-hydrogenated butadiene-styrene block copolymer, or a styrene-hydrogenated isoprene / butadiene. -At least one resin selected from styrene block copolymers;
The base resin is polypropylene, high density polyethylene, low density polyethylene, linear low density polyethylene, ethylene / propylene copolymer, propylene copolymer, ethylene-propylene-diene copolymer vulcanizate, polybutene, polybutadiene, Methylpentene, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid methyl copolymer, ethylene- (meth) ethyl acrylate copolymer, polyvinyl chloride, Vinyl chloride-vinyl acetate copolymer, ethylene-vinyl chloride-vinyl acetate copolymer, polystyrene, polyurethane, polyamide, ionomer, nitrile rubber, butyl rubber, styrene isoprene rubber, styrene butadiene rubber, natural rubber and its water additives or modifications Selected from things Adhesive sheet for semiconductor processing, wherein the at least one resin.
[2] The adhesive sheet for semiconductor processing according to [1], wherein the base resin is polypropylene.
[3] The pressure-sensitive adhesive sheet for semiconductor processing according to [1] or [2], wherein the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is an acrylic pressure-sensitive adhesive.
[4] The semiconductor processing device according to any one of [1] to [3], wherein the styrene block copolymer is 10 to 35 parts by mass with respect to 100 parts by mass of the base resin. Adhesive sheet.
[5] The adhesive sheet for semiconductor processing as set forth in any one of [1] to [4], which is used for dicing a semiconductor package.
また、アクリル系をより明確にするため、(メタ)アクリル系のように、「(メタ)」の括弧部分は、これがあってもなくてもよいことを意味し、例えば、(メタ)アクリル系は、アクリル系、メタクリル系もしくはこれらを含む場合のいずれでも構わない。 In the present invention, the term “acrylic” includes methacrylic.
In order to make the acrylic system clearer, the parenthesis part of “(meth)” means that it may or may not be present as in the case of (meth) acrylic system. For example, (meth) acrylic system May be acrylic, methacrylic, or any of these.
本発明の上記および他の特徴および利点は、適宜添付の図面を参照して、下記の記載からより明らかになるであろう。 According to the present invention, it is possible to provide an adhesive sheet for semiconductor processing that can reduce the occurrence of package fly that occurs at the time of dicing and can be quickly and reliably peeled off from the adhesive tape even by pick-up by scraping or the like after dicing. .
The above and other features and advantages of the present invention will become more apparent from the following description, with reference where appropriate to the accompanying drawings.
本発明の半導体加工用粘着シート12は、図1で模式的に示す概略断面図のように、基材フィルム1上の少なくとも一方の面に粘着剤層2を有する。
最初に、基材フィルムから順に説明する。 << Semiconductor processing adhesive sheet >>
The
First, it demonstrates in order from a base film.
本発明では、基材フィルムは複数の樹脂フィルムが積層された積層体でなく、1層、すなわち、単一の樹脂フィルムからなる。
基材フィルムを構成する樹脂は、単一の樹脂ではなく、ベース樹脂と少なくとも、スチレン系ブロック共重合体からなる。 <Base film>
In the present invention, the base film is not a laminate in which a plurality of resin films are laminated, but consists of one layer, that is, a single resin film.
The resin constituting the base film is not a single resin but a base resin and at least a styrene block copolymer.
スチレン系ブロック共重合体は、エラストマーであり、スチレン系熱可塑性エラストマーもしくはスチレン系エラストマーとも称される。
スチレン系ブロック共重合体は、ハードセグメントのポリスチレンとソフトセグメントからなるスチレンブロック共重合体が好ましく、ソフトセグメントとしては、例えば、ポリブタジエン、ポリイソブチレン、ポリイソプレン、水素添加ポリブタジエン(すなわち、エチレン/プロピレン)、水素添加ポリイソブチレン(すなわち、エチレン/ブチレン)、水素添加イソプレン/ブタジエン(すなわち、エチレン-エチレン/プロピレン)、ブタジエンラバー、エポキシ化ポリブタジエンなどが挙げられる。 (Styrene block copolymer)
The styrene block copolymer is an elastomer and is also referred to as a styrene thermoplastic elastomer or a styrene elastomer.
The styrenic block copolymer is preferably a styrene block copolymer composed of a hard segment polystyrene and a soft segment. Examples of the soft segment include polybutadiene, polyisobutylene, polyisoprene, and hydrogenated polybutadiene (that is, ethylene / propylene). Hydrogenated polyisobutylene (ie, ethylene / butylene), hydrogenated isoprene / butadiene (ie, ethylene-ethylene / propylene), butadiene rubber, epoxidized polybutadiene, and the like.
スチレン系ブロック共重合体の含有量が5質量部未満であると、基材フィルムが剛直になり、半導体パッケージとの密着性を高めることができなくなる。逆に、39質量部を超えると、擦り落としにより半導体加工用粘着シートを撓ませてもパッケージが立たないため、擦り落としがうまくいかない。 The styrenic block copolymer is used together with the base resin, and in the present invention, it is contained in an amount of 5 to 39 parts by mass with respect to 100 parts by mass of the base resin, preferably 10 to 35 parts by mass.
When the content of the styrenic block copolymer is less than 5 parts by mass, the base film becomes rigid and the adhesion to the semiconductor package cannot be improved. On the other hand, if the amount exceeds 39 parts by mass, the package does not stand even if the adhesive sheet for semiconductor processing is bent by rubbing off.
本発明において、ベース樹脂は、スチレン系ブロック共重合体以外の樹脂である。
ベース樹脂としては、熱可塑性樹脂が好ましく、基材フィルムの耐水性および耐熱性に優れているものがより好ましく、特に合成樹脂フィルムが好ましい。 (Base resin)
In the present invention, the base resin is a resin other than the styrenic block copolymer.
As the base resin, a thermoplastic resin is preferable, a base film having excellent water resistance and heat resistance is more preferable, and a synthetic resin film is particularly preferable.
熱可塑性樹脂のうち、ポリオレフィン樹が特に好ましい。
なお、熱可塑性樹脂は、酸変性など、変性されていてもよく、結晶性でも非晶性でも構わない Thermoplastic resins include polyolefin resin, polyamide resin, polyetheramide resin, thermoplastic polyimide resin, thermoplastic polyamideimide resin, polyurethane resin, urea resin, polyester resin, liquid crystal polyester resin, polyacetal resin, polycarbonate resin, polyphenylene ether ( (Including modified polyphenylene ether) resin, polysulfone resin, polyether sulfone resin, polyphenylene sulfide resin, polyether ether ketone (including modified polyether ether ketone) resin, polyether ketone resin, polyaryl ether ketone resin, polyarylate resin, Fluorine resin, polyphenylene oxide resin, polylactic acid, phenol resin, melamine resin, epoxy resin, phenoxy resin, silicon resin, etc. That.
Of the thermoplastic resins, polyolefin resin is particularly preferable.
The thermoplastic resin may be modified by acid modification or the like, and may be crystalline or amorphous.
ポリオレフィン樹脂は、少なくとも1種のオレフィンを重合してなるポリオレフィン樹脂であり、単独重合体であっても共重合体であっても構わない。
このようなオレフィンとしては、例えば、エチレン、プロピレン、イソブチレン、イソブテン(1-ブテン)を含む炭素原子数4~12のα-オレフィン、ブタジエン、イソプレン、(メタ)アクリル酸エステル、(メタ)アクリル酸、(メタ)アクリルアミド、ビニルアルコール、酢酸ビニル、塩化ビニル、スチレン、アクリロニトリルなどが挙げられる。 (Polyolefin resin)
The polyolefin resin is a polyolefin resin obtained by polymerizing at least one olefin, and may be a homopolymer or a copolymer.
Examples of such olefins include α-olefins having 4 to 12 carbon atoms including ethylene, propylene, isobutylene, isobutene (1-butene), butadiene, isoprene, (meth) acrylic acid esters, and (meth) acrylic acid. , (Meth) acrylamide, vinyl alcohol, vinyl acetate, vinyl chloride, styrene, acrylonitrile and the like.
なお、立体規則性はアイソタクチックインデックス、シンジオタクチックインデックスと称される。 The crystallinity of the polypropylene resin is determined by the melting temperature (melting point) and stereoregularity, depending on the quality required for the polyolefin resin composition of the present invention and the quality required for the molded product obtained by molding it, adjust.
The stereoregularity is referred to as an isotactic index and a syndiotactic index.
アイソタクチックインデックスが高いものは、結晶性が高く、0.96以上が好ましく、0.97以上がより好ましく、0.98以上がさらに好ましい。 The isotactic index is determined by the 13 C-NMR method described in Macromolecules, Vol. 8, page 687 (1975). Specifically, the isotactic index of the polypropylene resin is determined as the area fraction of the mmmm peak in the total absorption peak of the methyl group carbon region in the 13 C-NMR spectrum.
Those having a high isotactic index have high crystallinity, preferably 0.96 or more, more preferably 0.97 or more, and even more preferably 0.98 or more.
なお、本発明では、メルトフローレート(MFR)は、JIS K7210に準拠し、190℃、2.16kg荷重下で10分間あたりに流出するポリマーの質量(g/10分)である。 The melt flow rate (MFR) of the polyolefin resin is usually from 0.01 to 400 g / 10 minutes, preferably from 1 to 400 g / 10 minutes, more preferably from the viewpoint of improving mechanical strength and production stability. Is 1 to 100 g / 10 min, and more preferably 1 to 50 g / 10 min.
In the present invention, the melt flow rate (MFR) is a mass (g / 10 minutes) of a polymer flowing out per 10 minutes under a load of 190 ° C. and 2.16 kg in accordance with JIS K7210.
基材フィルムの厚さは特に制限されるものではないが、30~300μmが好ましく、30~200μmがより好ましく、50~150μmがさらに好ましい。
また、本発明では、100μmを超えるものも好ましく、この場合、100μmを超え300μm以下が好ましく、110~300μmがより好ましく、110~250μmがさらに好ましく、110~200μmが特に好ましい。 In order to improve the adhesion, the surface of the base film in contact with the pressure-sensitive adhesive layer may be subjected to corona treatment or may be provided with other layers such as a primer.
The thickness of the base film is not particularly limited, but is preferably 30 to 300 μm, more preferably 30 to 200 μm, and further preferably 50 to 150 μm.
Further, in the present invention, those exceeding 100 μm are also preferable. In this case, it exceeds 100 μm and is preferably 300 μm or less, more preferably 110 to 300 μm, further preferably 110 to 250 μm, and particularly preferably 110 to 200 μm.
粘着剤層は、従来より公知の種々の粘着剤により形成され得る。このような粘着剤としては、何ら限定されるものではないが、例えばゴム系、アクリル系、シリコーン系、ポリビニルエーテル系等をベースポリマーとした粘着剤が用いられる。
本発明では、アクリル系粘着剤が好ましい。 <Adhesive, adhesive layer>
The pressure-sensitive adhesive layer can be formed of various conventionally known pressure-sensitive adhesives. Such a pressure-sensitive adhesive is not limited at all, but for example, a pressure-sensitive adhesive based on rubber, acrylic, silicone, polyvinyl ether or the like is used.
In the present invention, an acrylic pressure-sensitive adhesive is preferred.
架橋剤としては、ベースポリマーに対応して、例えばイソシアネート系架橋剤、エポキシ系架橋剤、金属キレート系架橋剤、アジリジン系架橋剤、アミン樹脂などが挙げられる。さらに粘着剤には、本発明の目的が損なわれない範囲で、所望により、各種添加成分を含有させることができる。 In order to add cohesion to these base polymers, a crosslinking agent can be blended.
Examples of the crosslinking agent include an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, a metal chelate-based crosslinking agent, an aziridine-based crosslinking agent, and an amine resin corresponding to the base polymer. Further, the pressure-sensitive adhesive can contain various additive components as desired within the range in which the object of the present invention is not impaired.
放射線硬化型の粘着剤としては、紫外線、電子線等で硬化し、剥離時には剥離しやすくなる粘着剤を使用することができる。また、加熱発泡型の粘着剤としては、加熱により発泡剤や膨張剤により剥離しやすくなる粘着剤を使用することができる。さらに、粘着剤としてはダイシング・ダインボンディング兼用可能な接着剤であってもよい。放射線硬化型粘着剤としては、例えば、特公平1-56112号公報、特開平7-135189号公報等に記載のものが好ましく使用されるがこれらに限定されることはない。本発明においては、紫外線硬化型粘着剤を用いることが好ましい。その場合には、放射線により硬化し三次元網状化する性質を有すればよく、例えば通常のゴム系あるいはアクリル系の感圧性ベース樹脂(ポリマー)に対して、分子中に少なくとも2個の光重合性炭素-炭素二重結合を有する低分子量化合物(以下、光重合性化合物という)および光重合開始剤が配合されてなるものが使用される。 A radiation-curing type or heat-foaming type pressure-sensitive adhesive can also be used.
As the radiation-curable pressure-sensitive adhesive, a pressure-sensitive adhesive that is cured by ultraviolet rays, an electron beam, or the like and easily peels at the time of peeling can be used. Moreover, as a heat foaming type adhesive, the adhesive which becomes easy to peel with a foaming agent or an expansion agent by heating can be used. Furthermore, the adhesive may be an adhesive that can be used for dicing and dyne bonding. As the radiation curable pressure-sensitive adhesive, for example, those described in JP-B-1-56112, JP-A-7-135189 and the like are preferably used, but are not limited thereto. In the present invention, it is preferable to use an ultraviolet curable adhesive. In that case, it is only necessary to have a property of being cured by radiation to form a three-dimensional network. For example, at least two photopolymerizations in a molecule relative to a normal rubber-based or acrylic pressure-sensitive base resin (polymer). And a low molecular weight compound having a reactive carbon-carbon double bond (hereinafter referred to as a photopolymerizable compound) and a photopolymerization initiator are used.
このような光重合開始剤としては、具体的には、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、ベンジルジフェニルサルファイド、テトラメチルチウラムモノサルファイド、アゾビスイソブチロニトリル、ジベンジル、ジアセチル、β-クロールアンスラキノンなどが挙げられる。 In the case of an ultraviolet curable pressure-sensitive adhesive, by mixing a photopolymerization initiator in the pressure-sensitive adhesive, it is possible to reduce the polymerization curing time and the amount of ultraviolet irradiation by ultraviolet irradiation.
Specific examples of such a photopolymerization initiator include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, β-chloranthraquinone and the like can be mentioned.
本発明では、例えば、10万~200万が好ましい範囲として挙げられ、25万~200万がより好ましい範囲として挙げられる。別の範囲例を示せば、例えば、20万~150万の範囲も挙げられる。
質量平均分子量は、ゲル浸透クロマトグラフィー(GPC)により、標準ポリスチレン換算して得られたものである。 The mass average molecular weight of the base polymer of the acrylic pressure-sensitive adhesive is preferably 100,000 or more, more preferably 200,000 or more, further preferably 250,000 or more, particularly preferably 300,000 or more, and most preferably 400,000 or more. The upper limit of the mass average molecular weight is preferably 2 million or less, more preferably 1.5 million or less, further preferably 1 million or less, and particularly preferably 800,000 or less.
In the present invention, for example, 100,000 to 2,000,000 is mentioned as a preferable range, and 250,000 to 2,000,000 is mentioned as a more preferable range. Another example of the range is, for example, a range of 200,000 to 1,500,000.
The weight average molecular weight is obtained by standard polystyrene conversion by gel permeation chromatography (GPC).
半導体加工用粘着シートを幅5mmに加工した試験片を用いて、JISK7244に準拠した方法で、動的粘弾性測定装置によりフィルム状で測定した損失係数(tanδ)が、周波数0.01~10Hzの時に0.08以上0.15未満である。
本発明では、損失係数(tanδ)は、0.1~0.13が好ましい。
なお、損失係数(tanδ)は、tanδ=損失弾性率E’’/ 貯蔵弾性率 E’で表され、数字が大きいほど柔らかい材料となる。 <Loss coefficient of adhesive sheet for semiconductor processing>
Using a test piece obtained by processing a semiconductor processing pressure-sensitive adhesive sheet to a width of 5 mm, a loss factor (tan δ) measured in a film form by a dynamic viscoelasticity measuring device by a method according to JIS K7244 has a frequency of 0.01 to 10 Hz. Sometimes it is 0.08 or more and less than 0.15.
In the present invention, the loss factor (tan δ) is preferably 0.1 to 0.13.
The loss coefficient (tan δ) is expressed by tan δ = loss elastic modulus E ″ / storage elastic modulus E ′, and the larger the number, the softer the material.
本発明では、半導体加工用粘着シートから幅5mm×長さ10mmの試験片を切り出し、動的粘弾性測定装置に試験片を支持用治具で固定し、温度23℃、周波数0.01~10Hzで測定して得られた値である。 The loss factor can be measured with a dynamic viscoelasticity measuring apparatus (for example, Rhegel-E4000 manufactured by UBM).
In the present invention, a test piece having a width of 5 mm and a length of 10 mm is cut out from an adhesive sheet for semiconductor processing, and the test piece is fixed to a dynamic viscoelasticity measuring apparatus with a supporting jig, at a temperature of 23 ° C. and a frequency of 0.01 to 10 Hz. It is the value obtained by measuring with.
1)基材フィルムA
スチレン-水添イソプレン-スチレンブロック共重合体(SEPS)〔商品名:セプトンKF-2104、(株)クラレ社製〕とホモプロピレン(PP)〔商品名:J-105G、宇部興産(株)社製〕を下記表1に示す配合比で混合し、2軸混練機で、約200℃でフィルム押出成形にて加工し、厚さ150μmの基材フィルムAを製造した。 <Manufacture of base film>
1) Base film A
Styrene-hydrogenated isoprene-styrene block copolymer (SEPS) [trade name: Septon KF-2104, manufactured by Kuraray Co., Ltd.] and homopropylene (PP) [trade name: J-105G, Ube Industries, Ltd. Manufactured] was mixed at a blending ratio shown in Table 1 below, and processed by film extrusion at about 200 ° C. with a biaxial kneader to produce a substrate film A having a thickness of 150 μm.
スチレン-イソプレン-スチレン共重合体(SIS)〔商品名:ハイブラー5127、(株)クラレ社製〕とホモプロピレン(PP)〔商品名:J-105G、宇部興産(株)社製〕を下記表1に示す配合比で混合し、2軸混練機で、約200℃でフィルム押出成形にて加工し、厚さ150μmの基材フィルムBを製造した。 2) Base film B
Styrene-isoprene-styrene copolymer (SIS) [trade name: Hybler 5127, manufactured by Kuraray Co., Ltd.] and homopropylene (PP) [trade name: J-105G, manufactured by Ube Industries, Ltd.] The mixture was mixed at a blending ratio shown in FIG. 1 and processed by film extrusion at about 200 ° C. with a twin-screw kneader to produce a substrate film B having a thickness of 150 μm.
スチレン-水添ブタジエン-スチレン共重合体(SEBS)〔商品名:セプトン8104、(株)クラレ社製〕とホモプロピレン(PP)〔商品名:J-105G、宇部興産(株)社製〕を下記表1に示す配合比で混合し、2軸混練機で、約200℃でフィルム押出成形にて加工し、厚さ150μmの基材フィルムCを製造した。 3) Base film C
Styrene-hydrogenated butadiene-styrene copolymer (SEBS) [trade name: Septon 8104, manufactured by Kuraray Co., Ltd.] and homopropylene (PP) [trade name: J-105G, manufactured by Ube Industries, Ltd.] It mixed by the compounding ratio shown in following Table 1, and it processed by the film extrusion molding at about 200 degreeC with the biaxial kneader, and manufactured the base film C with a thickness of 150 micrometers.
チレン-水添イソプレン/ブタジエン-スチレン共重合体(SEEPS)〔商品名:セプトンセプトン4033、(株)クラレ社製〕とホモプロピレン(PP)〔商品名:J-105G、宇部興産(株)社製〕を下記表1に示す配合比で混合し、2軸混練機で、約200℃でフィルム押出成形にて加工し、厚さ150μmの基材フィルムDを製造した。 4) Base film D
Tylene-hydrogenated isoprene / butadiene-styrene copolymer (SEEPS) [trade name: Septon Septon 4033, manufactured by Kuraray Co., Ltd.] and homopropylene (PP) [trade name: J-105G, Ube Industries, Ltd. Manufactured] was mixed at a blending ratio shown in Table 1 below, and processed by film extrusion at about 200 ° C. with a twin-screw kneader to produce a substrate film D having a thickness of 150 μm.
アクリル系ベースポリマー(2-エチルヘキシルアクリレート、メチルアクリレート、2-ヒドロキシエチルアクリレートからなる共重合体、質量平均分子量40万、ガラス転移温度:-35℃)100質量部にポリイソシアネート化合物〔商品名:コロネートL、日本ポリウレタン工業(株)社製〕3質量部、光重合性炭素-炭素二重結合を有する化合物としてテトラメチロールメタンテトラアクリレート50質量部、光重合開始剤としてα-ヒドロキシシクロヘキシルフェニルケトン1質量部を添加し、混合して得た。 <Preparation of adhesive>
Polyisocyanate compound [trade name: Coronate] in 100 parts by mass of acrylic base polymer (copolymer consisting of 2-ethylhexyl acrylate, methyl acrylate, 2-hydroxyethyl acrylate, mass average molecular weight 400,000, glass transition temperature: -35 ° C.) L, manufactured by Nippon Polyurethane Industry Co., Ltd.] 3 parts by weight, 50 parts by weight of tetramethylolmethane tetraacrylate as a compound having a photopolymerizable carbon-carbon double bond, and 1 part by weight of α-hydroxycyclohexyl phenyl ketone as a photopolymerization initiator Part was added and mixed.
上記基材フィルムAの一方の表面に、上記の粘着剤を厚さ20μmに塗工して、粘着剤層を形成し、実施例1~3および比較例1の各半導体加工用粘着シートを製造した。 Examples 1 to 3 and Comparative Example 1
The pressure-sensitive adhesive is coated on one surface of the base film A to a thickness of 20 μm to form a pressure-sensitive adhesive layer, and the semiconductor processing pressure-sensitive adhesive sheets of Examples 1 to 3 and Comparative Example 1 are manufactured. did.
上記基材フィルムBを用いた以外は実施例1と同様にして半導体加工用粘着シートを製造した。 Example 4
A pressure-sensitive adhesive sheet for semiconductor processing was produced in the same manner as in Example 1 except that the base film B was used.
上記基材フィルムCを用いた以外は実施例1と同様にして半導体加工用粘着シートを製造した。 Example 5
A pressure-sensitive adhesive sheet for semiconductor processing was produced in the same manner as in Example 1 except that the base film C was used.
上記基材フィルムDを用いた以外は実施例1と同様にして半導体加工用粘着シートを製造した。 Example 6
A pressure-sensitive adhesive sheet for semiconductor processing was produced in the same manner as in Example 1 except that the base film D was used.
半導体加工用粘着シートから幅5mm×長さ10mmの試験片を切り出した。
JISK7244に準拠した方法で、動的粘弾性測定装置(UBM社製、Rheogel-E4000)に試験片を支持用治具で固定し、温度23℃、周波数0.01~10Hzで測定した。この周波数範囲内での損失係数(tanδ=損失弾性率E’’/ 貯蔵弾性率 E’)を得た。 (Loss factor)
A test piece having a width of 5 mm and a length of 10 mm was cut out from the adhesive sheet for semiconductor processing.
A test piece was fixed to a dynamic viscoelasticity measuring apparatus (UBE, Rheogel-E4000) with a supporting jig by a method according to JISK7244, and the measurement was performed at a temperature of 23 ° C. and a frequency of 0.01 to 10 Hz. A loss coefficient (tan δ = loss elastic modulus E ″ / storage elastic modulus E ′) within this frequency range was obtained.
各半導体加工用粘着シートにQFNパッケージ(60mm×150mm、厚さ0.95mm)を貼合した。ダイサー〔(株)DISCO社製 DFD6340〕にて、ブレード回転数20000rpm、切削速度30mm/min、粘着シートへの切り込み量60μmの条件で、チップサイズ1mm×1mmとなるようダイシングした。
ダイシング後、以下の評価基準で評価した。 (Package fly)
A QFN package (60 mm × 150 mm, thickness 0.95 mm) was bonded to each semiconductor processing adhesive sheet. Dicing was performed with a dicer (DFD6340 manufactured by DISCO Corporation) at a blade rotation speed of 20000 rpm, a cutting speed of 30 mm / min, and a cutting depth of 60 μm into the pressure-sensitive adhesive sheet so as to obtain a chip size of 1 mm × 1 mm.
After dicing, the following evaluation criteria were used for evaluation.
○:チップが全て半導体加工用粘着シート上に残っている
×:チップが1つ以上飛んだ Evaluation criteria ○: All chips remain on the adhesive sheet for semiconductor processing ×: One or more chips flew
以下の擦り落としによる方法で評価を行った。
ダイシング後に紫外線照射(200mJ/cm2)し、半導体加工用粘着シートの背面をピンセットで擦り、チップを落とした。 (Pickup success rate)
Evaluation was performed by the following scrubbing method.
After dicing, ultraviolet irradiation (200 mJ / cm 2 ) was performed, the back surface of the semiconductor processing adhesive sheet was rubbed with tweezers, and the chip was dropped.
なお、表中、ブランクは、未使用であることを意味する。 The obtained results are summarized in Table 1 below.
In the table, a blank means unused.
これに対して、比較例1の半導体加工用粘着シートは、エラストマー成分が多く、損失係数の値が高くなった結果、パッケージフライは発生しなかったものの、擦り落としピックアップ時に、半導体加工用粘着シートを撓ませても全てのパッケージが立たなかったため、擦り落としがうまくいかないチップが半導体加工用粘着シート上に残ってしまった。
一方、比較例2の半導体加工用粘着シートは、エラストマー成分が少なく、損失係数が低くなった結果、ダイシング時の振動を半導体加工用粘着シートが吸収しきれず、パッケージフライが発生してしまった。 From Table 1 above, the adhesive sheets for semiconductor processing of Examples 1 to 6 all have a loss coefficient value of 0.08 or more and less than 0.15, and no package fly occurs. It was good.
In contrast, the semiconductor processing pressure-sensitive adhesive sheet of Comparative Example 1 had a large amount of elastomer component and a high loss factor. As a result, package fly did not occur. Since all packages did not stand up even if the board was bent, chips that could not be scraped off remained on the adhesive sheet for semiconductor processing.
On the other hand, the pressure-sensitive adhesive sheet for semiconductor processing of Comparative Example 2 had a small elastomer component and a low loss factor. As a result, the pressure-sensitive adhesive sheet for semiconductor processing could not absorb the vibration during dicing, and package fly occurred.
2 粘着剤層
11 ホルダー
12 半導体加工用粘着シート
13 半導体ウェハ
14 半導体チップ
15 実線矢印方向
16 エキスパンダー
17 点線矢印方向 DESCRIPTION OF
Claims (5)
- 基材フィルム上に粘着剤層を有する半導体加工用粘着シートであって、
前記半導体加工用粘着シートを幅5mmに加工した試験片を用いて、動的粘弾性測定装置によりフィルム状で測定した損失係数が、周波数0.01~10Hzの時に0.08以上0.15未満であり、
前記基材フィルムが、1層であって、ベース樹脂100質量部に対してスチレン系ブロック共重合体5~39質量部を含み、
前記スチレン系ブロック共重合体が、スチレン-水添イソプレン-スチレンブロック共重合体、スチレン-イソプレン-スチレンブロック共重合体、スチレン-水添ブタジエン-スチレンブロック共重合体およびスチレン-水添イソプレン/ブタジエン-スチレンブロック共重合体から選択される少なくとも1種の樹脂であり、
前記ベース樹脂が、ポリプロピレン、高密度ポリエチレン、低密度ポリエチレン、直鎖低密度ポリエチレン、エチレン・プロピレン共重合体、プロピレン共重合体、エチレン-プロピレン-ジエン共重合体加硫物、ポリブテン、ポリブタジエン、ポリメチルペンテン、エチレン-酢酸ビニル共重合体、エチレン-(メタ)アクリル酸共重合体、エチレン-(メタ)アクリル酸メチル共重合体、エチレン-(メタ)アクリル酸エチル共重合体、ポリ塩化ビニル、塩化ビニル-酢酸ビニル共重合体、エチレン-塩化ビニル-酢酸ビニル共重合体、ポリスチレン、ポリウレタン、ポリアミド、アイオノマー、ニトリルゴム、ブチルゴム、スチレンイソプレンゴム、スチレンブタジエンゴム、天然ゴムおよびその水添加物もしくは変性物から選択される少なくとも1種の樹脂であることを特徴とする半導体加工用粘着シート。 A pressure-sensitive adhesive sheet for semiconductor processing having a pressure-sensitive adhesive layer on a base film,
Using a test piece obtained by processing the pressure-sensitive adhesive sheet for semiconductor processing into a width of 5 mm, the loss coefficient measured in a film shape with a dynamic viscoelasticity measuring apparatus is 0.08 or more and less than 0.15 when the frequency is 0.01 to 10 Hz. And
The base film is a single layer, and includes 5 to 39 parts by mass of a styrenic block copolymer with respect to 100 parts by mass of the base resin.
The styrene block copolymer is a styrene-hydrogenated isoprene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a styrene-hydrogenated butadiene-styrene block copolymer, or a styrene-hydrogenated isoprene / butadiene. -At least one resin selected from styrene block copolymers;
The base resin is polypropylene, high density polyethylene, low density polyethylene, linear low density polyethylene, ethylene / propylene copolymer, propylene copolymer, ethylene-propylene-diene copolymer vulcanizate, polybutene, polybutadiene, Methylpentene, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid methyl copolymer, ethylene- (meth) ethyl acrylate copolymer, polyvinyl chloride, Vinyl chloride-vinyl acetate copolymer, ethylene-vinyl chloride-vinyl acetate copolymer, polystyrene, polyurethane, polyamide, ionomer, nitrile rubber, butyl rubber, styrene isoprene rubber, styrene butadiene rubber, natural rubber and its water additives or modifications Selected from things Adhesive sheet for semiconductor processing, wherein the at least one resin. - 前記ベース樹脂が、ポリプロピレンであることを特徴とする請求項1に記載の半導体加工用粘着シート。 2. The adhesive sheet for semiconductor processing according to claim 1, wherein the base resin is polypropylene.
- 前記粘着剤層を形成する粘着剤が、アクリル系粘着剤であることを特徴とする請求項1または2に記載の半導体加工用粘着シート。 3. The pressure-sensitive adhesive sheet for semiconductor processing according to claim 1, wherein the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is an acrylic pressure-sensitive adhesive.
- 前記スチレン系ブロック共重合体が、ベース樹脂100質量部に対して10~35質量部であることを特徴とする請求項1~3のいずれか1項に記載の半導体加工用粘着シート。 The pressure-sensitive adhesive sheet for semiconductor processing according to any one of claims 1 to 3, wherein the styrene block copolymer is 10 to 35 parts by mass with respect to 100 parts by mass of the base resin.
- 半導体パッケージのダイシングに用いられることを特徴とする請求項1~4のいずれか1項に記載の半導体加工用粘着シート。 The pressure-sensitive adhesive sheet for semiconductor processing according to any one of claims 1 to 4, which is used for dicing a semiconductor package.
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KR1020187010108A KR102355077B1 (en) | 2016-03-31 | 2017-03-27 | Adhesive sheet for semiconductor processing |
SG11201800285PA SG11201800285PA (en) | 2016-03-31 | 2017-03-27 | Removable adhesive sheet for semiconductor processing |
CN201780003496.XA CN108207116B (en) | 2016-03-31 | 2017-03-27 | Adhesive sheet for semiconductor processing |
MYPI2018700844A MY186094A (en) | 2016-03-31 | 2017-03-27 | Removable adhesive sheet for semiconductor processing |
JP2017554095A JP6615223B2 (en) | 2016-03-31 | 2017-03-27 | Adhesive sheet for semiconductor processing |
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WO2023074153A1 (en) * | 2021-10-29 | 2023-05-04 | タキロンシーアイ株式会社 | Base film for semiconductor manufacturing tape |
WO2023074152A1 (en) * | 2021-10-29 | 2023-05-04 | タキロンシーアイ株式会社 | Base film for semiconductor manufacturing tape |
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CN109536068B (en) * | 2018-11-16 | 2021-08-17 | 宁波激智科技股份有限公司 | High-viscosity protective film and preparation method thereof |
KR20200141102A (en) | 2019-06-10 | 2020-12-18 | 황진혁 | moisture remover wiper |
JP2021077861A (en) * | 2019-11-07 | 2021-05-20 | 日東電工株式会社 | Dicing tape and dicing die bond film |
CN112048253B (en) * | 2020-09-04 | 2022-04-12 | 浙江洁美电子科技股份有限公司 | Self-adhesion type protection film |
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JP6615223B2 (en) | 2019-12-04 |
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CN108207116B (en) | 2023-02-21 |
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