SG11201800285PA - Removable adhesive sheet for semiconductor processing - Google Patents
Removable adhesive sheet for semiconductor processingInfo
- Publication number
- SG11201800285PA SG11201800285PA SG11201800285PA SG11201800285PA SG11201800285PA SG 11201800285P A SG11201800285P A SG 11201800285PA SG 11201800285P A SG11201800285P A SG 11201800285PA SG 11201800285P A SG11201800285P A SG 11201800285PA SG 11201800285P A SG11201800285P A SG 11201800285PA
- Authority
- SG
- Singapore
- Prior art keywords
- adhesive sheet
- semiconductor processing
- removable adhesive
- removable
- semiconductor
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016073263 | 2016-03-31 | ||
| PCT/JP2017/012455 WO2017170436A1 (en) | 2016-03-31 | 2017-03-27 | Adhesive sheet for semiconductor processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201800285PA true SG11201800285PA (en) | 2018-02-27 |
Family
ID=59965581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201800285PA SG11201800285PA (en) | 2016-03-31 | 2017-03-27 | Removable adhesive sheet for semiconductor processing |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP6615223B2 (en) |
| KR (1) | KR102355077B1 (en) |
| CN (1) | CN108207116B (en) |
| MY (1) | MY186094A (en) |
| SG (1) | SG11201800285PA (en) |
| TW (1) | TWI654242B (en) |
| WO (1) | WO2017170436A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109536068B (en) * | 2018-11-16 | 2021-08-17 | 宁波激智科技股份有限公司 | High-viscosity protective film and preparation method thereof |
| KR20200141102A (en) | 2019-06-10 | 2020-12-18 | 황진혁 | moisture remover wiper |
| JP2021077861A (en) * | 2019-11-07 | 2021-05-20 | 日東電工株式会社 | Dicing tape and dicing die bond film |
| CN112048253B (en) * | 2020-09-04 | 2022-04-12 | 浙江洁美电子科技股份有限公司 | Self-adhesion type protection film |
| JP2023066587A (en) * | 2021-10-29 | 2023-05-16 | タキロンシーアイ株式会社 | Base film for semiconductor manufacturing tape |
| JP2023066585A (en) * | 2021-10-29 | 2023-05-16 | タキロンシーアイ株式会社 | Base film for semiconductor manufacturing tape |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5140910B2 (en) * | 2005-08-30 | 2013-02-13 | 住友ベークライト株式会社 | Film base and adhesive tape for semiconductor wafer processing |
| JP2007100064A (en) | 2005-09-07 | 2007-04-19 | Furukawa Electric Co Ltd:The | Pressure-sensitive adhesive tape for dicing |
| JP5448430B2 (en) * | 2007-12-18 | 2014-03-19 | 古河電気工業株式会社 | Wafer sticking sheet and wafer processing method |
| MY154860A (en) * | 2009-07-08 | 2015-08-14 | Furukawa Electric Co Ltd | Adhesive sheet for wafer bonding and method of processing a wafer by using the same |
| JP2011216704A (en) * | 2010-03-31 | 2011-10-27 | Furukawa Electric Co Ltd:The | Adhesive tape for semiconductor wafer processing |
| KR101397686B1 (en) * | 2010-12-06 | 2014-05-22 | 제일모직주식회사 | Base film and adhesive film for semiconductor devices using the same |
| JP5294365B1 (en) | 2012-09-27 | 2013-09-18 | 古河電気工業株式会社 | Radiation curable adhesive tape for dicing |
| JP6107230B2 (en) * | 2013-02-28 | 2017-04-05 | 住友ベークライト株式会社 | Dicing film |
| JP6264126B2 (en) * | 2014-03-20 | 2018-01-24 | 日立化成株式会社 | Wafer processing tape |
-
2017
- 2017-03-27 KR KR1020187010108A patent/KR102355077B1/en active IP Right Grant
- 2017-03-27 SG SG11201800285PA patent/SG11201800285PA/en unknown
- 2017-03-27 JP JP2017554095A patent/JP6615223B2/en active Active
- 2017-03-27 MY MYPI2018700844A patent/MY186094A/en unknown
- 2017-03-27 CN CN201780003496.XA patent/CN108207116B/en active Active
- 2017-03-27 WO PCT/JP2017/012455 patent/WO2017170436A1/en active Application Filing
- 2017-03-31 TW TW106110947A patent/TWI654242B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017170436A1 (en) | 2017-10-05 |
| JP6615223B2 (en) | 2019-12-04 |
| TWI654242B (en) | 2019-03-21 |
| CN108207116A (en) | 2018-06-26 |
| TW201800467A (en) | 2018-01-01 |
| CN108207116B (en) | 2023-02-21 |
| JPWO2017170436A1 (en) | 2019-02-07 |
| KR102355077B1 (en) | 2022-01-25 |
| MY186094A (en) | 2021-06-21 |
| KR20180127302A (en) | 2018-11-28 |
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