SG10202011613YA - Substrate processing apparatus - Google Patents
Substrate processing apparatusInfo
- Publication number
- SG10202011613YA SG10202011613YA SG10202011613YA SG10202011613YA SG10202011613YA SG 10202011613Y A SG10202011613Y A SG 10202011613YA SG 10202011613Y A SG10202011613Y A SG 10202011613YA SG 10202011613Y A SG10202011613Y A SG 10202011613YA SG 10202011613Y A SG10202011613Y A SG 10202011613YA
- Authority
- SG
- Singapore
- Prior art keywords
- processing apparatus
- substrate processing
- substrate
- processing
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/145—Swabs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
- B08B3/123—Cleaning travelling work, e.g. webs, articles on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Paper (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016130900A JP6727044B2 (en) | 2016-06-30 | 2016-06-30 | Substrate processing equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202011613YA true SG10202011613YA (en) | 2021-01-28 |
Family
ID=60806393
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202011613YA SG10202011613YA (en) | 2016-06-30 | 2017-06-20 | Substrate processing apparatus |
SG10201705081PA SG10201705081PA (en) | 2016-06-30 | 2017-06-20 | Substrate processing apparatus |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201705081PA SG10201705081PA (en) | 2016-06-30 | 2017-06-20 | Substrate processing apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US10688622B2 (en) |
JP (1) | JP6727044B2 (en) |
KR (4) | KR102389190B1 (en) |
CN (2) | CN107564835B (en) |
SG (2) | SG10202011613YA (en) |
TW (2) | TWI773673B (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5390807B2 (en) * | 2008-08-21 | 2014-01-15 | 株式会社荏原製作所 | Polishing method and apparatus |
CN106856664B (en) * | 2014-09-05 | 2019-11-19 | 日商乐华股份有限公司 | The atmosphere method of replacing of load port and load port |
JP6895341B2 (en) | 2017-08-10 | 2021-06-30 | 株式会社荏原製作所 | Board processing equipment |
JP7054364B2 (en) | 2018-05-18 | 2022-04-13 | 株式会社荏原製作所 | Board processing equipment |
JP7114393B2 (en) * | 2018-08-02 | 2022-08-08 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING APPARATUS AND CONTROL METHOD THEREOF |
CN109226010A (en) * | 2018-09-28 | 2019-01-18 | 昆山市和博电子科技有限公司 | A kind of substrate cleaning machine and basal plate cleaning system |
JP7160725B2 (en) * | 2019-03-06 | 2022-10-25 | 株式会社荏原製作所 | Substrate processing equipment |
JP7394821B2 (en) * | 2020-06-30 | 2023-12-08 | 株式会社荏原製作所 | Substrate processing equipment |
USD973116S1 (en) * | 2020-11-17 | 2022-12-20 | Applied Materials, Inc. | Mainframe of substrate processing system |
USD973737S1 (en) | 2020-11-17 | 2022-12-27 | Applied Materials, Inc. | Mainframe of substrate processing system |
JP6892176B1 (en) * | 2020-11-19 | 2021-06-23 | 不二越機械工業株式会社 | Work cleaning device |
CN113102778B (en) * | 2021-04-06 | 2022-07-01 | 哈尔滨工业大学 | Three-dimensional synchronous loading device for ultrasonic-assisted laser melting deposition forming of large-volume parts |
JP2023006220A (en) | 2021-06-30 | 2023-01-18 | 株式会社荏原製作所 | Liquid supply device and polishing device |
CN114055330B (en) * | 2021-11-23 | 2022-11-29 | 大连理工大学 | Multi-degree-of-freedom vortex complex curved surface chemical mechanical polishing device |
USD1029066S1 (en) * | 2022-03-11 | 2024-05-28 | Applied Materials, Inc. | Mainframe of dual-robot substrate processing system |
JP2023174274A (en) | 2022-05-27 | 2023-12-07 | 株式会社荏原製作所 | Polishing device and polishing method |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100390293B1 (en) * | 1993-09-21 | 2003-09-02 | 가부시끼가이샤 도시바 | Polishing device |
JP3592771B2 (en) * | 1994-12-07 | 2004-11-24 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
US5904611A (en) * | 1996-05-10 | 1999-05-18 | Canon Kabushiki Kaisha | Precision polishing apparatus |
JPH10284457A (en) * | 1997-04-04 | 1998-10-23 | Tokyo Electron Ltd | Washing system |
JP2001284433A (en) * | 2000-01-28 | 2001-10-12 | Sony Corp | Substrate transfer apparatus and method for transferring substrate |
US6817923B2 (en) * | 2001-05-24 | 2004-11-16 | Applied Materials, Inc. | Chemical mechanical processing system with mobile load cup |
JP2003133274A (en) * | 2001-10-22 | 2003-05-09 | Ebara Corp | Polishing apparatus |
JP4197103B2 (en) | 2002-04-15 | 2008-12-17 | 株式会社荏原製作所 | Polishing equipment |
WO2004088741A1 (en) * | 2003-03-28 | 2004-10-14 | Hirata Corporation | Wafer transportation system |
WO2007030779A2 (en) * | 2005-09-09 | 2007-03-15 | Inopla Inc. | Apparatus and method for polishing objects using object cleaners |
KR101075053B1 (en) * | 2006-02-22 | 2011-10-21 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate processing apparatus, substrate transfer apparatus, substrate clamp apparatus, and chemical liquid treatment apparatus |
JP2008294233A (en) * | 2007-05-24 | 2008-12-04 | Tokyo Seimitsu Co Ltd | Cleaning device |
US20080035181A1 (en) * | 2006-08-09 | 2008-02-14 | Tokyo Seimitsu Co., Ltd. | Cleaning apparatus |
JP4750773B2 (en) * | 2007-10-01 | 2011-08-17 | 忠弘 大見 | Substrate processing system |
JP4887266B2 (en) * | 2007-10-15 | 2012-02-29 | 株式会社荏原製作所 | Flattening method |
JP5511190B2 (en) * | 2008-01-23 | 2014-06-04 | 株式会社荏原製作所 | Operation method of substrate processing apparatus |
JP5422143B2 (en) * | 2008-06-04 | 2014-02-19 | 株式会社荏原製作所 | Substrate gripping mechanism |
JP5744382B2 (en) * | 2008-07-24 | 2015-07-08 | 株式会社荏原製作所 | Substrate processing apparatus and substrate processing method |
US8795032B2 (en) | 2008-06-04 | 2014-08-05 | Ebara Corporation | Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method |
KR101905399B1 (en) * | 2012-02-15 | 2018-10-10 | 주식회사 케이씨텍 | Apparatus for polishing semiconductor wafers |
TWI625814B (en) | 2012-07-27 | 2018-06-01 | 荏原製作所股份有限公司 | Workpiece transport device |
JP2014082470A (en) * | 2012-09-27 | 2014-05-08 | Ebara Corp | Substrate processing apparatus |
JP6250924B2 (en) * | 2012-10-02 | 2017-12-20 | 株式会社荏原製作所 | Substrate cleaning apparatus and polishing apparatus |
JP5956324B2 (en) * | 2012-12-13 | 2016-07-27 | 東京エレクトロン株式会社 | Transport base and transport system |
CN203282328U (en) * | 2013-04-28 | 2013-11-13 | 株式会社荏原制作所 | Polishing device and base plate processing device |
JP6093328B2 (en) * | 2013-06-13 | 2017-03-08 | 東京エレクトロン株式会社 | Substrate processing system, substrate processing method, program, and computer storage medium |
JP2015201598A (en) * | 2014-04-10 | 2015-11-12 | 株式会社荏原製作所 | Substrate processor |
JP2015207602A (en) * | 2014-04-17 | 2015-11-19 | 株式会社荏原製作所 | Drainage mechanism and substrate processing apparatus including the same |
JP6587379B2 (en) * | 2014-09-01 | 2019-10-09 | 株式会社荏原製作所 | Polishing equipment |
JP6447328B2 (en) * | 2015-04-07 | 2019-01-09 | 東京エレクトロン株式会社 | Heating device |
KR101813943B1 (en) * | 2016-05-03 | 2018-01-02 | 주식회사 케이씨텍 | Substrate processing system |
JP6640041B2 (en) | 2016-06-27 | 2020-02-05 | 株式会社荏原製作所 | Cleaning device and substrate processing device |
-
2016
- 2016-06-30 JP JP2016130900A patent/JP6727044B2/en active Active
-
2017
- 2017-06-06 US US15/615,375 patent/US10688622B2/en active Active
- 2017-06-13 TW TW106119624A patent/TWI773673B/en active
- 2017-06-13 TW TW111123475A patent/TWI831261B/en active
- 2017-06-20 SG SG10202011613YA patent/SG10202011613YA/en unknown
- 2017-06-20 SG SG10201705081PA patent/SG10201705081PA/en unknown
- 2017-06-29 KR KR1020170082255A patent/KR102389190B1/en active IP Right Grant
- 2017-06-30 CN CN201710520934.1A patent/CN107564835B/en active Active
- 2017-06-30 CN CN202310668331.1A patent/CN116487302A/en active Pending
-
2022
- 2022-04-18 KR KR1020220047444A patent/KR102432238B1/en active IP Right Grant
- 2022-08-09 KR KR1020220098971A patent/KR102614540B1/en active IP Right Grant
-
2023
- 2023-12-12 KR KR1020230179331A patent/KR20230170896A/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR20220115902A (en) | 2022-08-19 |
KR102389190B1 (en) | 2022-04-21 |
KR102432238B1 (en) | 2022-08-16 |
JP2018006549A (en) | 2018-01-11 |
CN107564835A (en) | 2018-01-09 |
US10688622B2 (en) | 2020-06-23 |
KR102614540B1 (en) | 2023-12-19 |
US20180001440A1 (en) | 2018-01-04 |
KR20220052893A (en) | 2022-04-28 |
TWI831261B (en) | 2024-02-01 |
TWI773673B (en) | 2022-08-11 |
KR20230170896A (en) | 2023-12-19 |
SG10201705081PA (en) | 2018-01-30 |
TW201808533A (en) | 2018-03-16 |
CN116487302A (en) | 2023-07-25 |
KR20180003457A (en) | 2018-01-09 |
TW202239530A (en) | 2022-10-16 |
JP6727044B2 (en) | 2020-07-22 |
CN107564835B (en) | 2023-06-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201705081PA (en) | Substrate processing apparatus | |
SG10201604456TA (en) | Substrate processing apparatus and substrate processing method | |
SG10201508119XA (en) | Substrate processing apparatus and processing method | |
HK1245417B (en) | Substrate processing method and substrate-processing apparatus | |
SG10201700915XA (en) | Wafer processing method | |
SG10201701397QA (en) | Substrate imaging apparatus | |
SG10201701086SA (en) | Wafer processing method | |
SG10201502813TA (en) | Substrate Processing Apparatus | |
HUE057676T2 (en) | Conveyance apparatus | |
SG11201912566WA (en) | Plasma processing apparatus | |
SG10201700763VA (en) | Processing apparatus | |
SG11201709412PA (en) | Workpiece processing apparatus | |
SG10201705501WA (en) | Substrate processing apparatus | |
SG11201912567RA (en) | Plasma processing apparatus | |
SG10201504537YA (en) | Processing apparatus | |
KR102039240B9 (en) | Substrate processing apparatus | |
SG10201505187TA (en) | Processing apparatus | |
SG11201912655XA (en) | Plasma processing apparatus | |
SG10201700072UA (en) | Wafer processing method | |
SG11201912564VA (en) | Plasma processing apparatus | |
SG10201603207YA (en) | Processing apparatus | |
SG11201912569UA (en) | Plasma processing apparatus | |
SG10201707289XA (en) | Substrate polishing apparatus | |
SG10201508329UA (en) | Buffing apparatus and substrate processing apparatus | |
SG10201502817UA (en) | Substrate Processing Apparatus |