SG11201709412PA - Workpiece processing apparatus - Google Patents
Workpiece processing apparatusInfo
- Publication number
- SG11201709412PA SG11201709412PA SG11201709412PA SG11201709412PA SG11201709412PA SG 11201709412P A SG11201709412P A SG 11201709412PA SG 11201709412P A SG11201709412P A SG 11201709412PA SG 11201709412P A SG11201709412P A SG 11201709412PA SG 11201709412P A SG11201709412P A SG 11201709412PA
- Authority
- SG
- Singapore
- Prior art keywords
- processing apparatus
- workpiece processing
- workpiece
- processing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015119338A JP6304132B2 (en) | 2015-06-12 | 2015-06-12 | Workpiece processing equipment |
| PCT/JP2016/001740 WO2016199333A1 (en) | 2015-06-12 | 2016-03-25 | Workpiece machining device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201709412PA true SG11201709412PA (en) | 2017-12-28 |
Family
ID=57503434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201709412PA SG11201709412PA (en) | 2015-06-12 | 2016-03-25 | Workpiece processing apparatus |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10335918B2 (en) |
| JP (1) | JP6304132B2 (en) |
| KR (1) | KR102291381B1 (en) |
| CN (1) | CN107614199B (en) |
| DE (1) | DE112016002162T5 (en) |
| SG (1) | SG11201709412PA (en) |
| TW (1) | TWI682832B (en) |
| WO (1) | WO2016199333A1 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6829467B2 (en) | 2017-04-05 | 2021-02-10 | スピードファム株式会社 | Double-sided polishing device |
| KR101941769B1 (en) * | 2017-04-19 | 2019-01-23 | 에스케이실트론 주식회사 | Double side polishing apparatus of the wafer |
| KR101941768B1 (en) * | 2017-04-19 | 2019-01-23 | 에스케이실트론 주식회사 | Double side polishing apparatus of the wafer |
| KR101993515B1 (en) * | 2017-05-11 | 2019-06-26 | 에스케이실트론 주식회사 | Double side polishing apparatus of the wafer |
| JP6451825B1 (en) * | 2017-12-25 | 2019-01-16 | 株式会社Sumco | Wafer double-side polishing method |
| CN108481185A (en) * | 2018-06-14 | 2018-09-04 | 东莞金研精密研磨机械制造有限公司 | A kind of twin grinder |
| JP2020171996A (en) * | 2019-04-11 | 2020-10-22 | 信越半導体株式会社 | Double-sided polishing method |
| KR20200127328A (en) * | 2019-05-02 | 2020-11-11 | 삼성전자주식회사 | Conditioner, chemical mechanical polishing apparatus including the same and method of manufacturing a semiconductor device using the apparatus |
| JP7308074B2 (en) * | 2019-05-14 | 2023-07-13 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
| US11801580B1 (en) | 2019-12-16 | 2023-10-31 | Arc Specialties, Inc. | Dual airbag compliance device for ball and seat lapping |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5946667U (en) * | 1982-09-16 | 1984-03-28 | 株式会社東芝 | Polisher polishing cloth brushing device |
| JP2535089B2 (en) * | 1990-04-27 | 1996-09-18 | 昭和アルミニウム株式会社 | Polishing method and polishing apparatus |
| JPH0425372A (en) * | 1990-05-17 | 1992-01-29 | Seiko Electronic Components Ltd | Double face polishing device |
| JP3808156B2 (en) | 1997-02-24 | 2006-08-09 | 不二越機械工業株式会社 | Double-side polishing equipment |
| JPH11254308A (en) * | 1998-03-06 | 1999-09-21 | Fujikoshi Mach Corp | Both face grinding device |
| JP2984263B1 (en) * | 1998-10-23 | 1999-11-29 | システム精工株式会社 | Polishing method and polishing apparatus |
| JP2001038603A (en) * | 1999-08-04 | 2001-02-13 | Speedfam Co Ltd | Dresser, grinding device with the dresser, and dressing method |
| JP2002154049A (en) * | 2000-11-15 | 2002-05-28 | Fujikoshi Mach Corp | Polishing method |
| EP1459844B1 (en) * | 2001-12-26 | 2011-08-17 | Koyo Machine Industries Co., Ltd. | Truing method for grinding wheels and grinding machine |
| DE102007056628B4 (en) * | 2007-03-19 | 2019-03-14 | Siltronic Ag | Method and apparatus for simultaneously grinding a plurality of semiconductor wafers |
| DE102009038942B4 (en) * | 2008-10-22 | 2022-06-23 | Peter Wolters Gmbh | Device for machining flat workpieces on both sides and method for machining a plurality of semiconductor wafers simultaneously by removing material from both sides |
| JP5399115B2 (en) * | 2009-03-31 | 2014-01-29 | Ｈｏｙａ株式会社 | Polishing apparatus, glass substrate polishing method and glass substrate manufacturing method |
| JP5533355B2 (en) * | 2010-07-01 | 2014-06-25 | 旭硝子株式会社 | Glass substrate for magnetic recording medium, double-side polishing apparatus, glass substrate polishing method, and glass substrate manufacturing method |
| KR20140083317A (en) * | 2012-12-26 | 2014-07-04 | 주식회사 엘지실트론 | Sun gear and apparatus for polishing wafer including the same |
-
2015
- 2015-06-12 JP JP2015119338A patent/JP6304132B2/en active Active
-
2016
- 2016-03-25 SG SG11201709412PA patent/SG11201709412PA/en unknown
- 2016-03-25 WO PCT/JP2016/001740 patent/WO2016199333A1/en active Application Filing
- 2016-03-25 US US15/572,747 patent/US10335918B2/en active Active
- 2016-03-25 KR KR1020177034812A patent/KR102291381B1/en active IP Right Grant
- 2016-03-25 CN CN201680029025.1A patent/CN107614199B/en active Active
- 2016-03-25 DE DE112016002162.3T patent/DE112016002162T5/en active Pending
- 2016-03-28 TW TW105109674A patent/TWI682832B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| DE112016002162T5 (en) | 2018-02-15 |
| JP6304132B2 (en) | 2018-04-04 |
| KR102291381B1 (en) | 2021-08-20 |
| CN107614199B (en) | 2019-10-25 |
| US20180117729A1 (en) | 2018-05-03 |
| JP2017001151A (en) | 2017-01-05 |
| KR20180017004A (en) | 2018-02-20 |
| WO2016199333A1 (en) | 2016-12-15 |
| US10335918B2 (en) | 2019-07-02 |
| CN107614199A (en) | 2018-01-19 |
| TW201710027A (en) | 2017-03-16 |
| TWI682832B (en) | 2020-01-21 |
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