SG10201602836QA - Laser processing apparatus - Google Patents
Laser processing apparatusInfo
- Publication number
- SG10201602836QA SG10201602836QA SG10201602836QA SG10201602836QA SG10201602836QA SG 10201602836Q A SG10201602836Q A SG 10201602836QA SG 10201602836Q A SG10201602836Q A SG 10201602836QA SG 10201602836Q A SG10201602836Q A SG 10201602836QA SG 10201602836Q A SG10201602836Q A SG 10201602836QA
- Authority
- SG
- Singapore
- Prior art keywords
- processing apparatus
- laser processing
- laser
- processing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015099843A JP6553940B2 (en) | 2015-05-15 | 2015-05-15 | Laser processing equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201602836QA true SG10201602836QA (en) | 2016-12-29 |
Family
ID=57208920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201602836QA SG10201602836QA (en) | 2015-05-15 | 2016-04-11 | Laser processing apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US10668569B2 (en) |
JP (1) | JP6553940B2 (en) |
KR (1) | KR102437902B1 (en) |
CN (1) | CN106141444B (en) |
DE (1) | DE102016107709A1 (en) |
SG (1) | SG10201602836QA (en) |
TW (1) | TWI670131B (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6559074B2 (en) * | 2016-01-28 | 2019-08-14 | 株式会社ディスコ | Package wafer processing method |
JP6666173B2 (en) * | 2016-03-09 | 2020-03-13 | 株式会社ディスコ | Laser processing equipment |
JP2018094596A (en) * | 2016-12-13 | 2018-06-21 | 株式会社ディスコ | Laser processing device |
JP2018121031A (en) * | 2017-01-27 | 2018-08-02 | 株式会社ディスコ | Laser processing device |
JP6893730B2 (en) * | 2017-04-10 | 2021-06-23 | 株式会社ディスコ | Processing method of work piece |
JP6912267B2 (en) * | 2017-05-09 | 2021-08-04 | 株式会社ディスコ | Laser processing method |
JP6934381B2 (en) * | 2017-09-28 | 2021-09-15 | 株式会社ディスコ | Laser processing equipment |
JP7066368B2 (en) * | 2017-10-24 | 2022-05-13 | 住友重機械工業株式会社 | Laser machining machine control device, laser machining method, and laser machining machine |
JP7013276B2 (en) * | 2018-02-23 | 2022-01-31 | 株式会社ディスコ | Processing equipment |
JP2020113678A (en) * | 2019-01-15 | 2020-07-27 | 株式会社ディスコ | Workpiece unit |
JP7269090B2 (en) * | 2019-05-14 | 2023-05-08 | 株式会社ディスコ | Workpiece division method |
JP7478945B2 (en) * | 2020-01-17 | 2024-05-08 | 株式会社東京精密 | Wafer processing system and wafer processing method |
JP2022138338A (en) * | 2021-03-10 | 2022-09-26 | 株式会社ディスコ | Processing device |
CN113118637A (en) * | 2021-03-29 | 2021-07-16 | 上海燊星机器人科技有限公司 | Automatic distance measurement laser lithography method |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54111757A (en) * | 1978-02-22 | 1979-09-01 | Hitachi Ltd | Dicing method |
JP3248646B2 (en) * | 1994-01-17 | 2002-01-21 | 株式会社東京精密 | Dicing method and apparatus |
US6324298B1 (en) * | 1998-07-15 | 2001-11-27 | August Technology Corp. | Automated wafer defect inspection system and a process of performing such inspection |
US6676878B2 (en) * | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
US7157038B2 (en) * | 2000-09-20 | 2007-01-02 | Electro Scientific Industries, Inc. | Ultraviolet laser ablative patterning of microstructures in semiconductors |
US20060091126A1 (en) * | 2001-01-31 | 2006-05-04 | Baird Brian W | Ultraviolet laser ablative patterning of microstructures in semiconductors |
US6527965B1 (en) * | 2001-02-09 | 2003-03-04 | Nayna Networks, Inc. | Method for fabricating improved mirror arrays for physical separation |
US6706999B1 (en) * | 2003-02-24 | 2004-03-16 | Electro Scientific Industries, Inc. | Laser beam tertiary positioner apparatus and method |
WO2006066135A2 (en) * | 2004-12-19 | 2006-06-22 | Ade Corporation | System and method for signal processing for a workpiece surface inspection |
JP4630692B2 (en) | 2005-03-07 | 2011-02-09 | 株式会社ディスコ | Laser processing method |
JP4755839B2 (en) * | 2005-03-23 | 2011-08-24 | 株式会社ディスコ | Laser processing equipment |
JP4942313B2 (en) | 2005-07-07 | 2012-05-30 | 株式会社ディスコ | Wafer laser processing method |
US20070127807A1 (en) * | 2005-12-06 | 2007-06-07 | Avis Corporation | Defect inspection method, defect inspection system, defect inspection program, and memory medium with that program memorized in it |
JP2007173475A (en) * | 2005-12-21 | 2007-07-05 | Disco Abrasive Syst Ltd | Method for dividing wafer |
JP2008262983A (en) * | 2007-04-10 | 2008-10-30 | Disco Abrasive Syst Ltd | Dicing method |
JP5826027B2 (en) * | 2008-03-21 | 2015-12-02 | イムラ アメリカ インコーポレイテッド | Laser-based material processing method and system |
TW201002466A (en) * | 2008-04-10 | 2010-01-16 | Applied Materials Inc | Laser-scribing platform |
TWI594828B (en) | 2009-05-28 | 2017-08-11 | 伊雷克托科學工業股份有限公司 | Acousto-optic deflector applications in laser processing of features in a workpiece, and related laser processing method |
JP2011151117A (en) * | 2010-01-20 | 2011-08-04 | Disco Abrasive Syst Ltd | Processing device |
JP5558129B2 (en) * | 2010-02-05 | 2014-07-23 | 株式会社ディスコ | Processing method of optical device wafer |
JP5686545B2 (en) * | 2010-07-26 | 2015-03-18 | 株式会社ディスコ | Cutting method |
JP2012151225A (en) * | 2011-01-18 | 2012-08-09 | Disco Abrasive Syst Ltd | Method for measuring cut groove |
JP2012238746A (en) * | 2011-05-12 | 2012-12-06 | Disco Abrasive Syst Ltd | Division method of optical device wafer |
JP5904720B2 (en) * | 2011-05-12 | 2016-04-20 | 株式会社ディスコ | Wafer division method |
JP5846764B2 (en) * | 2011-06-01 | 2016-01-20 | 株式会社ディスコ | Wafer processing method |
US8781070B2 (en) | 2011-08-11 | 2014-07-15 | Jordan Valley Semiconductors Ltd. | Detection of wafer-edge defects |
JP5829455B2 (en) * | 2011-08-11 | 2015-12-09 | 株式会社ディスコ | Processing equipment |
JP6029271B2 (en) * | 2011-09-28 | 2016-11-24 | 株式会社ディスコ | Processing equipment |
TWI520199B (en) * | 2012-02-18 | 2016-02-01 | 先進科技新加坡有限公司 | Method and apparatus for scribing a substantially planar semiconductor substrate with on-the-fly control of scribing alignment |
JP6104025B2 (en) * | 2013-04-11 | 2017-03-29 | 株式会社ディスコ | Laser processing apparatus and laser processing method |
JP6438209B2 (en) * | 2014-04-07 | 2018-12-12 | 株式会社荏原製作所 | Control device for generating timing signal for imaging device in inspection device, and method for transmitting timing signal to imaging device |
JP6501530B2 (en) * | 2015-01-21 | 2019-04-17 | 株式会社ディスコ | Laser processing equipment |
JP6494382B2 (en) * | 2015-04-06 | 2019-04-03 | 株式会社ディスコ | Wafer generation method |
-
2015
- 2015-05-15 JP JP2015099843A patent/JP6553940B2/en active Active
-
2016
- 2016-04-07 TW TW105110906A patent/TWI670131B/en active
- 2016-04-11 SG SG10201602836QA patent/SG10201602836QA/en unknown
- 2016-04-26 DE DE102016107709.7A patent/DE102016107709A1/en active Pending
- 2016-04-28 KR KR1020160052103A patent/KR102437902B1/en active IP Right Grant
- 2016-05-06 US US15/148,495 patent/US10668569B2/en active Active
- 2016-05-13 CN CN201610318008.1A patent/CN106141444B/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20160332260A1 (en) | 2016-11-17 |
US10668569B2 (en) | 2020-06-02 |
TWI670131B (en) | 2019-09-01 |
DE102016107709A1 (en) | 2016-11-17 |
KR20160134494A (en) | 2016-11-23 |
CN106141444B (en) | 2019-09-17 |
JP2016219492A (en) | 2016-12-22 |
CN106141444A (en) | 2016-11-23 |
TW201641204A (en) | 2016-12-01 |
KR102437902B1 (en) | 2022-08-29 |
JP6553940B2 (en) | 2019-07-31 |
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