SG10201509466PA - Laser processing apparatus - Google Patents
Laser processing apparatusInfo
- Publication number
- SG10201509466PA SG10201509466PA SG10201509466PA SG10201509466PA SG10201509466PA SG 10201509466P A SG10201509466P A SG 10201509466PA SG 10201509466P A SG10201509466P A SG 10201509466PA SG 10201509466P A SG10201509466P A SG 10201509466PA SG 10201509466P A SG10201509466P A SG 10201509466PA
- Authority
- SG
- Singapore
- Prior art keywords
- processing apparatus
- laser processing
- laser
- processing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/035—Aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Robotics (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014243305A JP6388823B2 (en) | 2014-12-01 | 2014-12-01 | Laser processing equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201509466PA true SG10201509466PA (en) | 2016-07-28 |
Family
ID=56078576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201509466PA SG10201509466PA (en) | 2014-12-01 | 2015-11-17 | Laser processing apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US9724783B2 (en) |
JP (1) | JP6388823B2 (en) |
KR (1) | KR102027621B1 (en) |
CN (1) | CN105643094B (en) |
SG (1) | SG10201509466PA (en) |
TW (1) | TWI658664B (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101653524B1 (en) * | 2016-07-01 | 2016-09-01 | 이석준 | Laser 3d processing system |
JP6306659B1 (en) * | 2016-10-19 | 2018-04-04 | ファナック株式会社 | Beam distributor |
JP6870974B2 (en) * | 2016-12-08 | 2021-05-12 | 株式会社ディスコ | How to divide the work piece |
JP7032050B2 (en) * | 2017-03-14 | 2022-03-08 | 株式会社ディスコ | Laser processing equipment |
JP6882045B2 (en) * | 2017-04-13 | 2021-06-02 | 株式会社ディスコ | Focus point position detection method |
JP6912267B2 (en) * | 2017-05-09 | 2021-08-04 | 株式会社ディスコ | Laser processing method |
JP6938212B2 (en) | 2017-05-11 | 2021-09-22 | 株式会社ディスコ | Processing method |
JP6860429B2 (en) * | 2017-06-07 | 2021-04-14 | 株式会社ディスコ | Laser processing method and laser processing equipment |
JP2019015527A (en) * | 2017-07-04 | 2019-01-31 | 株式会社ミツトヨ | Image measurement device and program |
JP6910917B2 (en) * | 2017-10-17 | 2021-07-28 | 花王株式会社 | Processing method using laser light and laser light irradiation device |
JP6964945B2 (en) * | 2018-01-05 | 2021-11-10 | 株式会社ディスコ | Processing method |
CN108831850B (en) * | 2018-06-26 | 2020-11-27 | 潍坊华光光电子有限公司 | Binary splitting method of splitting bar for semiconductor laser |
JP2020090046A (en) * | 2018-12-06 | 2020-06-11 | Dgshape株式会社 | Image formation device and image formation method |
JP7368098B2 (en) * | 2019-04-17 | 2023-10-24 | 株式会社ディスコ | Wafer processing method |
JP7278178B2 (en) * | 2019-09-05 | 2023-05-19 | 株式会社ディスコ | How to check the optical axis of laser processing equipment |
JP7305273B2 (en) * | 2019-09-19 | 2023-07-10 | 株式会社ディスコ | LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS |
JP7313253B2 (en) | 2019-10-10 | 2023-07-24 | 株式会社ディスコ | Wafer processing method |
CN112809170A (en) * | 2019-10-29 | 2021-05-18 | 大族激光科技产业集团股份有限公司 | Silicon wafer cutting device and method |
JP2022077223A (en) * | 2020-11-11 | 2022-05-23 | 株式会社ディスコ | Laser beam machining apparatus |
CN113953659B (en) * | 2021-11-09 | 2022-06-24 | 西安电子科技大学 | Laser processing real-time imaging device and method based on pulse alternation method |
CN115922068B (en) * | 2022-12-29 | 2024-01-16 | 广东工业大学 | Feedback type laser pulse processing method and equipment for multilayer composite material |
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-
2014
- 2014-12-01 JP JP2014243305A patent/JP6388823B2/en active Active
-
2015
- 2015-10-30 TW TW104135799A patent/TWI658664B/en active
- 2015-11-17 SG SG10201509466PA patent/SG10201509466PA/en unknown
- 2015-11-26 CN CN201510836721.0A patent/CN105643094B/en active Active
- 2015-11-30 US US14/953,640 patent/US9724783B2/en active Active
- 2015-12-01 KR KR1020150169962A patent/KR102027621B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW201630287A (en) | 2016-08-16 |
TWI658664B (en) | 2019-05-01 |
JP2016104491A (en) | 2016-06-09 |
US9724783B2 (en) | 2017-08-08 |
US20160151857A1 (en) | 2016-06-02 |
CN105643094B (en) | 2019-11-29 |
KR102027621B1 (en) | 2019-10-01 |
CN105643094A (en) | 2016-06-08 |
KR20160065766A (en) | 2016-06-09 |
JP6388823B2 (en) | 2018-09-12 |
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