SG10201505187TA - Processing apparatus - Google Patents

Processing apparatus

Info

Publication number
SG10201505187TA
SG10201505187TA SG10201505187TA SG10201505187TA SG10201505187TA SG 10201505187T A SG10201505187T A SG 10201505187TA SG 10201505187T A SG10201505187T A SG 10201505187TA SG 10201505187T A SG10201505187T A SG 10201505187TA SG 10201505187T A SG10201505187T A SG 10201505187TA
Authority
SG
Singapore
Prior art keywords
processing apparatus
processing
Prior art date
Application number
SG10201505187TA
Inventor
Nagao Ryosuke
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201505187TA publication Critical patent/SG10201505187TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • B28D7/046—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
SG10201505187TA 2014-07-18 2015-06-30 Processing apparatus SG10201505187TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014147659A JP6340277B2 (en) 2014-07-18 2014-07-18 Processing equipment

Publications (1)

Publication Number Publication Date
SG10201505187TA true SG10201505187TA (en) 2016-02-26

Family

ID=55073840

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201505187TA SG10201505187TA (en) 2014-07-18 2015-06-30 Processing apparatus

Country Status (5)

Country Link
US (1) US9975274B2 (en)
JP (1) JP6340277B2 (en)
CN (1) CN105269705B (en)
SG (1) SG10201505187TA (en)
TW (1) TWI651164B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10271093B1 (en) 2016-06-27 2019-04-23 Amazon Technologies, Inc. Systems and methods for routing content to an associated output device
JP6792363B2 (en) * 2016-07-22 2020-11-25 株式会社ディスコ Grinding device
EP3680061A4 (en) * 2017-09-07 2021-06-09 Shinkoh Co., Ltd. Attachment tool
JP7102157B2 (en) * 2018-02-08 2022-07-19 Ｔｏｗａ株式会社 Cutting device and manufacturing method of cut products
JP7071783B2 (en) * 2018-04-26 2022-05-19 株式会社ディスコ Cutting equipment
JP7039134B2 (en) * 2018-06-04 2022-03-22 株式会社ディスコ Cutting equipment
JP7292164B2 (en) * 2019-09-25 2023-06-16 株式会社ディスコ processing equipment

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4422829A (en) * 1982-02-25 1983-12-27 Buchanan William T Sump drain system
JPH11320406A (en) * 1998-05-06 1999-11-24 Speedfam-Ipec Co Ltd Method and device for treating drainage and exhaust gas from polishing device
JP3275303B2 (en) * 1998-11-25 2002-04-15 株式会社東京精密 Dicing equipment
JP2002103262A (en) * 2000-09-27 2002-04-09 Nippei Toyama Corp Semiconductor wafer adsorbing device
JP4756295B2 (en) * 2000-11-09 2011-08-24 日本電気硝子株式会社 Adsorption holding device and adsorption holding method for glass plate
AU2003244207A1 (en) * 2003-07-04 2005-01-21 Japan Applied Microbiology Research Institute Ltd Ejector for aeration
EP3163375B1 (en) * 2003-08-29 2019-01-09 Nikon Corporation Exposure apparatus and exposure method
JP4785549B2 (en) * 2006-02-07 2011-10-05 アピックヤマダ株式会社 Adsorption device and cutting device
JP4582484B2 (en) * 2006-12-20 2010-11-17 Ｓｍｃ株式会社 Vacuum adsorption device
JP5436999B2 (en) * 2009-09-24 2014-03-05 株式会社ディスコ Workpiece holding device
JP5660903B2 (en) * 2011-01-19 2015-01-28 株式会社ディスコ Processing equipment
JP5795977B2 (en) * 2012-03-14 2015-10-14 株式会社荏原製作所 Polishing equipment
JP5957330B2 (en) * 2012-08-01 2016-07-27 株式会社ディスコ Wafer sticking device
JP2014034068A (en) * 2012-08-07 2014-02-24 Disco Abrasive Syst Ltd Processing device
KR101403614B1 (en) * 2012-09-17 2014-06-05 대우조선해양 주식회사 Gas and liquid seperating system
JP6076063B2 (en) * 2012-12-11 2017-02-08 株式会社ディスコ Processing equipment
JP6132547B2 (en) * 2012-12-25 2017-05-24 株式会社ディスコ Negative pressure generator
JP6331474B2 (en) * 2014-02-28 2018-05-30 ブラザー工業株式会社 Machine tool cleaning fluid filtration device

Also Published As

Publication number Publication date
JP2016022552A (en) 2016-02-08
US9975274B2 (en) 2018-05-22
TW201607684A (en) 2016-03-01
CN105269705A (en) 2016-01-27
JP6340277B2 (en) 2018-06-06
TWI651164B (en) 2019-02-21
CN105269705B (en) 2019-11-29
US20160016331A1 (en) 2016-01-21

Similar Documents

Publication Publication Date Title
HK1225227A1 (en) Apparatus
GB201416729D0 (en) Apparatus
SG10201502813TA (en) Substrate Processing Apparatus
GB201411922D0 (en) Waste processing apparatus
SG10201506677UA (en) Laser processing apparatus
SG10201504537YA (en) Processing apparatus
SG11201700012PA (en) Waste processing apparatus
SG10201700763VA (en) Processing apparatus
SG10201505187TA (en) Processing apparatus
GB201416110D0 (en) Signal processing apparatus
SG10201603207YA (en) Processing apparatus
SG10201502817UA (en) Substrate Processing Apparatus
GB201417753D0 (en) Apparatus
GB2534660B (en) Apparatus
GB2531031B (en) Apparatus
PL3523231T3 (en) Processing apparatus
PL2998064T3 (en) Processing device
GB2515915B (en) Apparatus
GB2526917B (en) Fail-safe processing apparatus
SG11201700015WA (en) Improved apparatus
GB201417926D0 (en) Signal processing apparatus
GB201402233D0 (en) Apparatus
GB2519222B (en) Apparatus
GB201508929D0 (en) Order processing apparatus
GB201417943D0 (en) Apparatus