SG10201502817UA - Substrate Processing Apparatus - Google Patents

Substrate Processing Apparatus

Info

Publication number
SG10201502817UA
SG10201502817UA SG10201502817UA SG10201502817UA SG10201502817UA SG 10201502817U A SG10201502817U A SG 10201502817UA SG 10201502817U A SG10201502817U A SG 10201502817UA SG 10201502817U A SG10201502817U A SG 10201502817UA SG 10201502817U A SG10201502817U A SG 10201502817UA
Authority
SG
Singapore
Prior art keywords
processing apparatus
substrate processing
substrate
processing
Prior art date
Application number
SG10201502817UA
Inventor
Mitsunori Sugiyama
Kunimasa Matsushita
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201502817UA publication Critical patent/SG10201502817UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007—Cleaning of grinding wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
SG10201502817UA 2014-04-10 2015-04-10 Substrate Processing Apparatus SG10201502817UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014081013A JP2015201598A (en) 2014-04-10 2014-04-10 Substrate processor

Publications (1)

Publication Number Publication Date
SG10201502817UA true SG10201502817UA (en) 2015-11-27

Family

ID=54264320

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201502817UA SG10201502817UA (en) 2014-04-10 2015-04-10 Substrate Processing Apparatus

Country Status (6)

Country Link
US (1) US9737973B2 (en)
JP (1) JP2015201598A (en)
KR (1) KR20150117601A (en)
CN (1) CN104979244A (en)
SG (1) SG10201502817UA (en)
TW (1) TW201601877A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6727044B2 (en) * 2016-06-30 2020-07-22 株式会社荏原製作所 Substrate processing equipment
US10096460B2 (en) * 2016-08-02 2018-10-09 Semiconductor Components Industries, Llc Semiconductor wafer and method of wafer thinning using grinding phase and separation phase
US10500691B2 (en) * 2016-08-29 2019-12-10 Ebara Corporation Substrate processing apparatus and substrate processing method
CN206105604U (en) * 2016-09-14 2017-04-19 天津华海清科机电科技有限公司 Chemical mechanical polishing system
CN108857858A (en) * 2017-05-15 2018-11-23 株式会社荏原制作所 Device and method, Wafer Backside Cleaning device and the substrate board treatment at the back side of cleaning base plate

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6213853B1 (en) * 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
US6244941B1 (en) * 1999-03-30 2001-06-12 Speedfam - Ipec Corporation Method and apparatus for pad removal and replacement
WO2004006299A2 (en) * 2002-07-03 2004-01-15 Tokyo Electron Limited Method for dynamic sensor configuration and runtime execution
US7249992B2 (en) * 2004-07-02 2007-07-31 Strasbaugh Method, apparatus and system for use in processing wafers
JP2007227781A (en) * 2006-02-24 2007-09-06 Tokyo Electron Ltd Misregistration inspection mechanism of substrate, processing system, and misregistration inspection method of substrate
JP5511190B2 (en) 2008-01-23 2014-06-04 株式会社荏原製作所 Operation method of substrate processing apparatus
US20100076729A1 (en) * 2008-09-19 2010-03-25 Applied Materials, Inc. Self-diagnostic semiconductor equipment
US8459922B2 (en) * 2009-11-13 2013-06-11 Brooks Automation, Inc. Manipulator auto-teach and position correction system
JP5575507B2 (en) * 2010-03-02 2014-08-20 株式会社日立国際電気 Substrate processing apparatus, substrate transport method, semiconductor device manufacturing method, and substrate processing apparatus maintenance method
JP6216193B2 (en) * 2013-09-11 2017-10-18 株式会社荏原製作所 Unit control panel, substrate transfer test method, and substrate processing apparatus
TWI645446B (en) * 2014-01-07 2018-12-21 荏原製作所股份有限公司 Control device for substrate treatment apparatus, substrate treatment apparatus, and display control device
JP6250406B2 (en) * 2014-01-15 2017-12-20 株式会社荏原製作所 Abnormality detection apparatus for substrate processing apparatus and substrate processing apparatus
JP2015134393A (en) * 2014-01-17 2015-07-27 株式会社荏原製作所 Calibration device, and substrate processing apparatus
JP6370084B2 (en) * 2014-04-10 2018-08-08 株式会社荏原製作所 Substrate processing equipment

Also Published As

Publication number Publication date
KR20150117601A (en) 2015-10-20
US9737973B2 (en) 2017-08-22
JP2015201598A (en) 2015-11-12
CN104979244A (en) 2015-10-14
TW201601877A (en) 2016-01-16
US20150290767A1 (en) 2015-10-15

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