CN206105604U - Chemical mechanical polishing system - Google Patents
Chemical mechanical polishing system Download PDFInfo
- Publication number
- CN206105604U CN206105604U CN201621056481.9U CN201621056481U CN206105604U CN 206105604 U CN206105604 U CN 206105604U CN 201621056481 U CN201621056481 U CN 201621056481U CN 206105604 U CN206105604 U CN 206105604U
- Authority
- CN
- China
- Prior art keywords
- polishing
- cleaning
- wafer
- unit
- platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a chemical mechanical polishing system, chemical mechanical polishing system includes: front end module, front end module is used for the storage and/or detects the wafer, a plurality of polishing units, it is a plurality of the polishing unit sets up side by side, and at least one is neighbouring front end module, throw the optomechanical hand, it establishes a plurality of to throw the optomechanical hand be used for transmitting the wafer between the polishing unit, back washing unit, back washing unit with the polishing unit with the front end module homogeneous phase even sets up as just that the wafer is put when wasing from north to south, the transfer manipulator, transfer machinery manual is in being in the wafer the polishing unit with transmit in order between the back washing unit. The utility model discloses a chemical mechanical polishing system, production efficiency is high, and process flow is more nimble, and the cleaning performance is better, and just back washing unit's is small, compact structure.
Description
Technical field
This utility model belongs to semiconductor process technique field, in particular to a kind of chemical-mechanical polishing system.
Background technology
The polishing unit and rear cleaning unit of the chemical-mechanical polishing system in correlation technique, only one group of serial, wafer
Working (machining) efficiency is low, and wafer is horizontal positioned in rear cleaning unit so that cleaning unit takes up an area space greatly afterwards, cleaning performance
, there is room for improvement in difference.
Utility model content
This utility model is intended at least to solve to a certain extent one of technical problem in correlation technique.For this purpose, this reality
It is the chemical-mechanical polishing system for proposing that a kind of production efficiency is high with a new purpose.
According to the chemical-mechanical polishing system of this utility model embodiment, including：Front-end module, the front-end module are used for
Storage and/or detection wafer；Multiple polishing units, multiple polishing units are arranged side by side, and at least one before described
End module；Polishing mechanical hand, the polishing mechanical hand are located between multiple polishing units to transmit wafer；Clean afterwards single
Unit, the rear cleaning unit are connected with the polishing unit and the front-end module, and it is longitudinal to be set to wafer during cleaning；In
Turn mechanical hand, the transfer mechanical hand is for wafer is sequentially transmitted between the polishing unit and the rear cleaning unit.
According to the chemical-mechanical polishing system of this utility model embodiment, the polishing unit with multi-set parallel, chemical machine
The production efficiency of mechanical polishing system is high, and the wafer in each submodule in rear cleaning unit is longitudinal, and wafer is in rear cleaning
Transmitted by mechanical hand in unit, technological process is more flexible, there is no impact each other, cleaning performance is more preferable, and it is rear clear
Wash the small volume of unit, compact conformation.
In addition, can also have following additional skill according to the chemical-mechanical polishing system of this utility model above-described embodiment
Art feature：
In some preferred embodiments of the present utility model, the rear cleaning unit is multiple, multiple rear cleanings
Unit is arranged side by side, and the transfer mechanical hand is located between multiple rear cleaning units.
Preferably, the rear cleaning unit is two, and two rear cleaning units are symmetrical with regard to the transfer mechanical hand
Arrange.
In some preferred embodiments of the present utility model, the rear cleaning unit includes cleaning manipulator and from close
The transfer mechanical hand is to the cleaning switching mechanism, cleaning caching platform, cleaning module being sequentially arranged away from the transfer mechanical hand
And irradiation modules, for transmitting wafer, the cleaning switching mechanism is used to overturn wafer so that wafer is vertical for the cleaning manipulator
Put, and switching mechanism is cleaned after being additionally provided between the irradiation modules and the front-end module.
Preferably, the rear cleaning unit includes multiple cleaning modules.
Specifically, multiple cleaning modules are set to using identical cleaning model or different cleaning models.
In some preferred embodiments of the present utility model, the front-end module includes：Wafer cassette plummer, wafer inspection
Survey platform and drying machinery handss, the drying machinery handss are in the wafer cassette plummer, the wafer detection platform, described
Wafer is transmitted between polishing unit and the rear cleaning unit.
In some preferred embodiments of the present utility model, the front-end module, the polishing unit, the rear cleaning
Joint face between unit is formed as " T " font.
In some preferred embodiments of the present utility model, two adjacent polishing units are symmetrical with regard to joint face
Arrange.
In some preferred embodiments of the present utility model, the polishing unit includes that polishing disk, rubbing head, handling are flat
Platform, polishing caching platform and polishing switching mechanism, the loading/unloading platform and polishing caching platform of multiple polishing units are in
The distribution of line shape, and the translation direction of the polishing mechanical hand is flat with the distribution arrangement of the loading/unloading platform and polishing caching platform
OK.
Description of the drawings
Of the present utility model above-mentioned and/or additional aspect and advantage will from the description with reference to accompanying drawings below to embodiment
Become obvious and easy to understand, wherein：
Fig. 1 is the structural representation of the chemical-mechanical polishing system according to this utility model embodiment；
Fig. 2 is the structural representation of the front-end module according to this utility model embodiment；
Fig. 3 is the structural representation of the polishing unit according to this utility model embodiment；
Fig. 4 is the structural representation of the rear cleaning unit according to this utility model embodiment.
Reference：
Front-end module 101, wafer cassette plummer 201, wafer detection platform 202, front-end module framework 203, drying machinery
Handss 204；
First polishing unit 102, the second polishing unit 103, the 3rd polishing unit 104, the 4th polishing unit 105, polishing
Underframe 301, mounting platform 302, polishing upper frame 303, suspension platform 304, rubbing head 305, polishing disk 306, polishing fluid is defeated
Arm 307, dresser 308, loading/unloading platform 309, polishing is sent to cache platform 310, rubbing head drive component 311, suspension assembly 312 are led
Rail 313, translational drive mechanism 314 polish switching mechanism 320；
First polishing mechanical hand 107, the second polishing mechanical hand 109；
Cleaning unit 108 after first, cleaning unit 110 after second, cleaning framework 401, the second irradiation modules 402, the 6th
Cleaning module 403, the 5th cleaning module 404, the 4th cleaning module 405, the second cleaning caching platform 406, the second cleaning tipper
Structure 407, transfer mechanical hand 408, the first cleaning switching mechanism 409, the first cleaning caching platform 410, the 3rd cleaning module 411, the
Two cleaning modules 412, the first cleaning module 413, the first irradiation modules 414 clean switching mechanism 415, the second cleaning machinery afterwards
Handss 416, the first cleaning manipulator 417.
Specific embodiment
Embodiment of the present utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein ad initio
Same or similar element or the element with same or like function are represented to same or similar label eventually.Below by ginseng
The embodiment for examining Description of Drawings is exemplary, it is intended to for explaining this utility model, and it is not intended that to this utility model
Restriction.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
Example ", or the description of " some examples " etc. mean specific features with reference to the embodiment or example description, structure, material or spy
Point is contained at least one embodiment of the present utility model or example.In this manual, the schematic table to above-mentioned term
State.And, the specific features of description, structure, material or feature can be with
Combined in any one or more embodiments or example in an appropriate manner.Additionally, in the case of not conflicting, this area
Technical staff the feature of the different embodiments or example described in this specification and different embodiment or example can be entered
Row is combined and is combined.
Below with reference to the accompanying drawings and in conjunction with the embodiments describing this utility model in detail.
As Figure 1-Figure 4, chemical-mechanical polishing system includes front-end module 101, multiple polishing units, polishing mechanical
Handss, rear cleaning unit and transfer mechanical hand 408.
Wherein, front-end module 101 is used to store and/or detect wafer.
Alternatively, with reference to Fig. 2, front-end module 101 includes front-end module framework 203, the inspection of wafer cassette plummer 201, wafer
Survey platform 202 and drying machinery handss 204.
Wafer cassette plummer 201 is used to support wafer cassette, and wafer cassette is used for storing wafer, and wafer cassette plummer 201 can be with
For multiple, the wafer cassette on multiple wafer cassette plummers 201 may be respectively used for depositing the qualified wafer of polishing and polished
Wafer.Wafer detection platform 202 can be detected to the wafer quality before and after polishing.
Wafer cassette plummer 201 and wafer detection platform 202 may be mounted at the same side of front-end module framework 203, and
Wafer cassette plummer 201 and wafer detection platform 202 can be arranged side by side along the length direction of front-end module framework 203.
Drying machinery handss 204 are for single in wafer cassette plummer 201, wafer detection platform 202, polishing unit and rear cleaning
Wafer is transmitted between unit.
Alternatively, with reference to Fig. 2, polishing unit can include polishing upper frame 303, mounting platform 302, polishing underframe
301st, suspension platform 304, rubbing head 305, polishing disk 306, polishing fluid conveying arm 307, dresser 308, loading/unloading platform 309, throwing
Optical buffer platform 310, rubbing head drive component 311, suspension assembly 312, guide rail 313, translational drive mechanism 314 and polishing tipper
Structure 320.
Polishing underframe 301 supports mounting platform 302, polishing upper frame 303 to be arranged on above mounting platform 302, polishing
303 supported and suspended platform 304 of upper frame, polishing disk 306, polishing fluid conveying arm 307, dresser 308, loading/unloading platform 309 and throwing
Optical buffer platform 310 is installed in above mounting platform 302.Dresser 308, polishing fluid conveying arm 307 and loading/unloading platform 309 are arranged
Around polishing disk 306, dresser 308 and polishing fluid conveying arm 307 are separately mounted in polishing disk 306 and loading/unloading platform 309
The both sides of heart line, polishing caching platform 310 are arranged on the side of loading/unloading platform 309, polishing caching platform 310 and loading/unloading platform 309
The line of centres with it is multiple polishing units distribution arrangements it is parallel.Guide rail 313 and translational drive mechanism 314 are arranged on suspension platform
The direction of 304 upper surface, guide rail 313 and translational drive mechanism 314 connects along the center of polishing disk 306 and loading/unloading platform 309
Line, suspension assembly 312 have horizontal plate and two risers, and the upper end of riser is connected with horizontal plate, inverted U-shaped to be formed, horizontal plate
On the slide block of guide rail 313, translational drive mechanism 314 drives suspension assembly 312 to translate along guide rail 313, and rubbing head drives
Component 311 is arranged on the lower end of 312 riser of suspension assembly, and rubbing head 305 is arranged on the lower end of main shaft.
Polishing switching mechanism 320 is arranged on below suspension platform 304, and polishing switching mechanism 320 is used to overturn polishing caching
Wafer on platform 310, it is to be understood that from face-up, the polishing switching mechanism 320 of the wafer of the transmission of front-end module 101
It is face down that wafer can be overturn, and then polished 305 clamping the polishing on polishing disk 306.
Multiple polishing units can be arranged side by side, and at least one polishing unit adjacent front end module 101, for description
It is convenient, it is the first polishing from close front-end module 101 to the order number consecutively away from front-end module 101 by multiple polishing units
Unit 102, second polishes unit 103 ..., the neighbouring polishing of the first polishing unit 102 cache platform 310 side can with it is front
The side away from wafer cassette plummer 201 of end module 101 connects, and so, is easy to wafer in front-end module 101 and the first polishing
Transmit between unit 102, the second polishing unit 103 is located at the side away from front-end module 101 of the first polishing unit 102.
Preferably, two adjacent polishing units can be symmetrical arranged with regard to the joint face of the two polishing units.To throw
As a example by light unit is four, with reference to Fig. 1, the polishing caching platform 310 of the first polishing unit 102 is located near front-end module 101
Side, the loading/unloading platform 309 of the first polishing unit 102 are located remotely from the side of front-end module 101, the second polishing unit 103
Loading/unloading platform 309 is located near the side of the first polishing unit 102, and the second polishing caching platform 310 for polishing unit 103 is located at remote
From the polishing disk 306 and rubbing head of one of polishing unit in the side of the first polishing unit 102, the two polishing units
305 turn clockwise, 306 rotate counterclockwise of rubbing head 305 and polishing disk of another polishing unit；3rd polishing unit 104
Polishing caching platform 310 be located near second polishing unit 103 side, the 3rd polishing unit 104 loading/unloading platform 309 be located at
Away from the side of the second polishing unit 103, the loading/unloading platform 309 of the 4th polishing unit 105 is located near the 3rd polishing unit 104
Side, the 4th polishing unit 105 polishing caching platform 310 be located remotely from the 3rd polishing unit 104 side, the two polishing
In unit, the polishing disk 306 and rubbing head 305 of one of polishing unit turns clockwise, the rubbing head of another polishing unit
305 and 306 rotate counterclockwise of polishing disk.Certainly, it can also be two, three etc. to polish unit, its distribution mode and four classes
Seemingly, will not be described here.
The loading/unloading platforms 309 and polishing caching platform 310 of multiple polishing units can be in the distribution of line shape, and polishing mechanical hand
Translation direction is parallel with the distribution arrangement of loading/unloading platform 309 and polishing caching platform 310, and polishing mechanical hand is located at multiple polishing units
Between to transmit wafer.
Be the embodiment of four in polishing unit, polishing mechanical hand can be two, for convenience of description by this two
It is the first polishing mechanical hand 107 and the second polishing mechanical hand 109 that individual polishing mechanical hand is numbered respectively, the first polishing mechanical hand 107
It is located between the first polishing unit 102 and the second polishing unit 103, in the first polishing unit 102 and the second polishing unit
Wafer is transmitted between 103 loading/unloading platform 309 and polishing caching platform 310, the second polishing mechanical hand 109 is located at the 3rd polishing unit
104 and the 4th polish between unit 105, for the loading/unloading platform 309 in the 3rd polishing unit 104 and the 4th polishing unit 105
Wafer is transmitted and polishing caching platform 310 between.
In polishing unit is the embodiment of four, the first polishing unit 102 can be held respectively with the second polishing unit 103
Row rough polishing and essence throwing, such as from the first rough polishing on the first polishing unit 102 of wafer of the transmission of front-end module 101, throw through first
The wafer of 102 rough polishing of light unit passes to 103 essence of the second polishing unit again and throws, and the second polishing unit 103 is again by the crystalline substance after essence throwing
Circle passes to rear cleaning unit；In the same manner, the 4th polishing unit 105 and the 3rd polishing unit 104 can perform rough polishing and essence respectively
Throw, such as first rough polishing on unit 105 is polished the 4th from the wafer of the transmission of front-end module 101, it is thick through the 4th polishing unit 105
The wafer of throwing passes to 104 essence of the 3rd polishing unit again and throws, and the 3rd polishing unit 104 is clear after again pass to the wafer after smart throwing
Wash unit.
It should be noted that the combining form of multiple polishing units has various, the such as one polishing unit pair for being used for rough polishing
Answer two for essence throw polishing unit, one be used for polishing unit two polishing units etc. for rough polishing of correspondence that essence is thrown
Deng combination can be allocated according to the man-hour of each operation in actual application.
Thus, wafer can be polished between polishing unit parallel, and the polishing efficiency of wafer is high.
Cleaning unit can be connected with polishing unit and front-end module 101 afterwards, and rear cleaning unit could be arranged to clearly
When washing, wafer is longitudinal.
With reference to Fig. 4, rear cleaning unit can include：Cleaning framework 401, cleaning manipulator, cleaning switching mechanism, cleaning are slow
Deposit platform, cleaning module and irradiation modules, cleaning manipulator, cleaning switching mechanism, cleaning caching platform, cleaning module and irradiation modules
It is installed in cleaning framework 401, and cleaning manipulator is located at cleaning switching mechanism, cleaning caching platform, cleaning module and drying
The top of module, cleaning switching mechanism, cleaning caching platform, cleaning module and irradiation modules near transfer mechanical hand 408 to remote
It is sequentially arranged from transfer mechanical hand 408, cleaning switching mechanism is used to overturn wafer so that wafer is longitudinal, cleaning manipulator is used to press from both sides
Wafer is held, and wafer is transmitted in cleaning switching mechanism, cleaning caching platform, between cleaning module and irradiation modules, irradiation modules
Switching mechanism 415 is cleaned after being additionally provided between front-end module 101, switching mechanism 415 is cleaned afterwards for by after cleaning-drying
Wafer upset is the face-up of level and wafer, is then delivered to wafer detection platform 202 by drying machinery handss 204.
Preferably, rear cleaning unit can be multiple, and multiple rear cleaning units can be arranged side by side, and transfer mechanical hand
408 are located between multiple rear cleaning units, and with reference to Fig. 4, specifically, rear cleaning unit can be two, cleaning unit after two
Can be symmetrical arranged with regard to transfer mechanical hand 408, each rear cleaning unit can include multiple cleaning modules, every in such as Fig. 4
Individual rear cleaning unit can include 3 cleaning modules.In some optional embodiments, multiple cleaning modules could be arranged to adopt
Identical cleaning model is used, these cleaning modules can be used parallel, in other optional embodiments, multiple cleaning modules
Could be arranged to using different cleaning models, these cleaning modules can be used with serial or parallel use, after such as polishing
Wafer can be cleaned in this multiple cleaning module successively.
Describe that to number cleaning unit after two respectively be that cleaning is single after cleaning unit 108 and second after first for convenience
Unit 110.
After first, cleaning unit 108 can be clear including first cleaning manipulator the 417, first cleaning switching mechanism 409, first
Caching platform 410, the first cleaning module 413, the second cleaning module 412, the 3rd cleaning module 411 and the first irradiation modules 414 are washed,
Switching mechanism 415 is cleaned after being provided between first irradiation modules 414 and front-end module 101.
After second, cleaning unit 110 can be clear including second cleaning manipulator the 416, second cleaning switching mechanism 407, second
Wash caching platform 406, the 4th cleaning module 405, the 5th cleaning module 404, the 6th cleaning module 403 and the second irradiation modules 402.
After first, after the cleaning framework 401 and second of cleaning unit 108, the cleaning framework 401 of cleaning unit 110 can collect
It is integrally formed, transfer mechanical hand 408 is cached between platform 406 positioned at the first cleaning caching platform 410 and the second cleaning, the first cleaning machine
Tool handss 417 can transmit wafer, second cleaning manipulator between rear cleaning switching mechanism 415 in the second cleaning caching platform 406
416 can transmit wafer between the second irradiation modules 402 and the first cleaning caching platform 410.
Transfer mechanical hand 408 will be thrown from the polishing caching platform 310 of the first polishing unit 102 or the second polishing unit 103
The wafer of light passes to the first cleaning switching mechanism 409 or the second cleaning switching mechanism 407, the first cleaning 409 He of switching mechanism
The upset of the wafer of level can be longitudinal by the second cleaning switching mechanism 407, and the first cleaning manipulator 417 can be from the first cleaning
Wafer is clamped on switching mechanism 409 or the second cleaning switching mechanism 407, it is possible to which wafer is temporarily stored in into the first cleaning caching platform
In 410 or it is directly placed in each cleaning module, the wafer that cleaning is completed can also be put into the by the first cleaning manipulator 417
One irradiation modules 414, and dried wafer is put into into cleaning upset after the first cleaning caching platform 410 is kept in or is directly passed to
Mechanism 415, the first cleaning manipulator 417 can also be stored into the first cleaning caching platform 410 or the second cleaning caches the dry of platform 406
Wafer after dry cleans switching mechanism 415 after passing to.In the same manner, the second cleaning manipulator 416 can be in the first cleaning caching platform
410 and second transmit wafer between irradiation modules 402.
Thus, wafer can be cleaned between rear cleaning unit parallel, and the cleaning efficiency of wafer is high, and wafer is longitudinal clear
Wash, the cleaning performance of wafer is good.
With reference to Fig. 1, the joint face between front-end module 101, polishing unit, rear cleaning unit can be formed as " T " font,
That is, polishing unit and rear cleaning unit are easy to drying machinery close to the drying machinery handss 204 of front-end module 101
The operation of handss 204.It should be noted that drying machinery handss 204 can will detect that underproof wafer re-enters polishing unit.
According to the chemical machine mechanical polishing system of this utility model embodiment, the polishing unit with multi-set parallel and rear clear
Unit is washed, the production efficiency of chemical machine mechanical polishing system is high, and the wafer in each submodule in rear cleaning unit is longitudinal,
Wafer is transmitted by mechanical hand in rear cleaning unit, and technological process is more flexible, there is no impact, cleaning performance each other
More preferably, and rear cleaning unit small volume, compact conformation.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include at least one this feature.In description of the present utility model, " multiple " are meant that at least two, such as two
It is individual, three etc., unless otherwise expressly limited specifically.
In this utility model, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection ", " Gu
It is fixed " etc. term should be interpreted broadly, it is for example, it may be fixedly connected, or be detachably connected or integral；Can be
It is mechanically connected, or electrically connects；Can be joined directly together, it is also possible to be indirectly connected to by intermediary, can be two
The connection of element internal or the interaction relationship of two elements, unless otherwise clearly restriction.For the common skill of this area
For art personnel, concrete meaning of the above-mentioned term in this utility model can be understood as the case may be.
Although embodiment of the present utility model has been shown and described above, it is to be understood that above-described embodiment is
Exemplary, it is impossible to it is interpreted as to restriction of the present utility model, one of ordinary skill in the art is in scope of the present utility model
It is interior above-described embodiment to be changed, be changed, being replaced and modification.
Claims (10)
1. a kind of chemical-mechanical polishing system, it is characterised in that include：
Front-end module, the front-end module are used to store and/or detect wafer；
Multiple polishing units, multiple polishing units are arranged side by side, and at least one adjacent to the front-end module；
Polishing mechanical hand, the polishing mechanical hand are located between multiple polishing units to transmit wafer；
Cleaning unit afterwards, the rear cleaning unit are connected with the polishing unit and the front-end module, and are set to cleaning
Shi Jingyuan is longitudinal；
Transfer mechanical hand, the transfer mechanical hand for by wafer it is described polishing unit and the rear cleaning unit between sequentially
Transmission.
2. chemical-mechanical polishing system according to claim 1, it is characterised in that the rear cleaning unit be it is multiple, it is many
The individual rear cleaning unit is arranged side by side, and the transfer mechanical hand is located between multiple rear cleaning units.
3. chemical-mechanical polishing system according to claim 2, it is characterised in that the rear cleaning unit is two, two
The individual rear cleaning unit is symmetrical arranged with regard to the transfer mechanical hand.
4. chemical-mechanical polishing system according to claim 1, it is characterised in that the rear cleaning unit includes cleaning machine
Tool handss and near the transfer mechanical hand to be sequentially arranged away from the transfer mechanical hand cleaning switching mechanism, cleaning caching
Platform, cleaning module and irradiation modules, the cleaning manipulator are used to transmit wafer, and the cleaning switching mechanism is used to overturn wafer
So that wafer is longitudinal, and switching mechanism is cleaned after being additionally provided between the irradiation modules and the front-end module.
5. chemical-mechanical polishing system according to claim 4, it is characterised in that the rear cleaning unit includes multiple clear
Mold cleaning block.
6. chemical-mechanical polishing system according to claim 5, it is characterised in that multiple cleaning modules are set to adopt
With identical cleaning model or different cleaning models.
7. chemical-mechanical polishing system according to claim 1, it is characterised in that the front-end module includes：Wafer cassette
Plummer, wafer detection platform and drying machinery handss, the drying machinery handss are in the wafer cassette plummer, the wafer
Wafer is transmitted between detection platform, the polishing unit and the rear cleaning unit.
8. chemical-mechanical polishing system according to claim 1, it is characterised in that the front-end module, the polishing list
Joint face between first, described rear cleaning unit is formed as " T " font.
9. chemical-mechanical polishing system according to claim 1, it is characterised in that two adjacent polishing units are closed
It is symmetrical arranged in joint face.
10. chemical-mechanical polishing system according to claim 1, it is characterised in that the polishing unit include polishing disk,
Rubbing head, loading/unloading platform, polishing caching platform and polishing switching mechanism, multiple polishing loading/unloading platforms of units and described
Polishing caching platform is in the distribution of line shape, and the translation direction of the polishing mechanical hand and the loading/unloading platform and the polishing cache platform
Distribution arrangement it is parallel.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621056481.9U CN206105604U (en) | 2016-09-14 | 2016-09-14 | Chemical mechanical polishing system |
| CN201780003705.0A CN108698193A (en) | 2016-09-14 | 2017-09-13 | Chemical-mechanical polishing system |
| PCT/CN2017/101583 WO2018050069A1 (en) | 2016-09-14 | 2017-09-13 | Chemical mechanical polishing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621056481.9U CN206105604U (en) | 2016-09-14 | 2016-09-14 | Chemical mechanical polishing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206105604U true CN206105604U (en) | 2017-04-19 |
Family
ID=58519894
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621056481.9U Active CN206105604U (en) | 2016-09-14 | 2016-09-14 | Chemical mechanical polishing system |
| CN201780003705.0A Pending CN108698193A (en) | 2016-09-14 | 2017-09-13 | Chemical-mechanical polishing system |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780003705.0A Pending CN108698193A (en) | 2016-09-14 | 2017-09-13 | Chemical-mechanical polishing system |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN206105604U (en) |
| WO (1) | WO2018050069A1 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018050069A1 (en) * | 2016-09-14 | 2018-03-22 | 清华大学 | Chemical mechanical polishing system |
| CN108326731A (en) * | 2017-12-30 | 2018-07-27 | 铜陵日科电子有限责任公司 | A kind of silica wafers grinder |
| CN109227359A (en) * | 2018-10-19 | 2019-01-18 | 清华大学 | The post-processing unit of chemical-mechanical polishing system and method, wafer |
| CN109732474A (en) * | 2019-01-30 | 2019-05-10 | 杭州众硅电子科技有限公司 | A kind of chemical-mechanical polisher and its wafer exchange mechanism and wafer transfer method |
| CN110039441A (en) * | 2019-01-14 | 2019-07-23 | 杭州众硅电子科技有限公司 | A kind of based CMP apparatus |
| WO2020048311A1 (en) * | 2018-09-07 | 2020-03-12 | 杭州众硅电子科技有限公司 | Chemical-mechanical planarization device, wafer transfer method and wafer planarization unit |
| CN111524833A (en) * | 2020-04-28 | 2020-08-11 | 华海清科股份有限公司 | Chemical mechanical polishing system and chemical mechanical polishing method |
| TWI717119B (en) * | 2019-06-04 | 2021-01-21 | 大陸商杭州眾硅電子科技有限公司 | Chemical mechanical planarization wafer transfer equipment and its use method |
| TWI732244B (en) * | 2019-07-11 | 2021-07-01 | 昇陽國際半導體股份有限公司 | Wafer polishing method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109366257A (en) * | 2018-12-29 | 2019-02-22 | 肇庆威尼托机械有限公司 | A kind of quartzite slate polishing production line |
| CN109848827B (en) * | 2019-03-04 | 2024-04-30 | 天通日进精密技术有限公司 | Wafer edge polishing mechanism and wafer edge polishing device |
| CN111341700A (en) * | 2020-03-10 | 2020-06-26 | 北京烁科精微电子装备有限公司 | Shared cleaning module, polishing equipment and integrated circuit manufacturing system |
| CN115132623A (en) * | 2022-06-20 | 2022-09-30 | 北京烁科精微电子装备有限公司 | Wafer grinding and polishing device and transmission method |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6309279B1 (en) * | 1999-02-19 | 2001-10-30 | Speedfam-Ipec Corporation | Arrangements for wafer polishing |
| JP2005203729A (en) * | 2003-12-19 | 2005-07-28 | Ebara Corp | Substrate polishing apparatus |
| US7229339B2 (en) * | 2004-07-02 | 2007-06-12 | Novellus Systems, Inc. | CMP apparatus and method |
| KR20070112397A (en) * | 2005-05-12 | 2007-11-23 | 어플라이드 머티어리얼스, 인코포레이티드 | Method and apparatus for vertical transfer of semiconductor substrates in a cleaning module |
| US8129279B2 (en) * | 2008-10-13 | 2012-03-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polish process control for improvement in within-wafer thickness uniformity |
| CN101992422B (en) * | 2009-08-25 | 2012-07-25 | 中芯国际集成电路制造(上海)有限公司 | Process control method and system of copper chemical mechanical polishing |
| JP2015201598A (en) * | 2014-04-10 | 2015-11-12 | 株式会社荏原製作所 | Substrate processor |
| JP2015205359A (en) * | 2014-04-18 | 2015-11-19 | 株式会社荏原製作所 | Substrate treatment device |
| CN206105604U (en) * | 2016-09-14 | 2017-04-19 | 天津华海清科机电科技有限公司 | Chemical mechanical polishing system |
-
2016
- 2016-09-14 CN CN201621056481.9U patent/CN206105604U/en active Active
-
2017
- 2017-09-13 CN CN201780003705.0A patent/CN108698193A/en active Pending
- 2017-09-13 WO PCT/CN2017/101583 patent/WO2018050069A1/en active Application Filing
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018050069A1 (en) * | 2016-09-14 | 2018-03-22 | 清华大学 | Chemical mechanical polishing system |
| CN108326731A (en) * | 2017-12-30 | 2018-07-27 | 铜陵日科电子有限责任公司 | A kind of silica wafers grinder |
| WO2020048311A1 (en) * | 2018-09-07 | 2020-03-12 | 杭州众硅电子科技有限公司 | Chemical-mechanical planarization device, wafer transfer method and wafer planarization unit |
| CN109227359A (en) * | 2018-10-19 | 2019-01-18 | 清华大学 | The post-processing unit of chemical-mechanical polishing system and method, wafer |
| CN110039441A (en) * | 2019-01-14 | 2019-07-23 | 杭州众硅电子科技有限公司 | A kind of based CMP apparatus |
| CN109732474A (en) * | 2019-01-30 | 2019-05-10 | 杭州众硅电子科技有限公司 | A kind of chemical-mechanical polisher and its wafer exchange mechanism and wafer transfer method |
| TWI717119B (en) * | 2019-06-04 | 2021-01-21 | 大陸商杭州眾硅電子科技有限公司 | Chemical mechanical planarization wafer transfer equipment and its use method |
| TWI732244B (en) * | 2019-07-11 | 2021-07-01 | 昇陽國際半導體股份有限公司 | Wafer polishing method |
| CN111524833A (en) * | 2020-04-28 | 2020-08-11 | 华海清科股份有限公司 | Chemical mechanical polishing system and chemical mechanical polishing method |
| CN111524833B (en) * | 2020-04-28 | 2023-04-21 | 华海清科股份有限公司 | Chemical mechanical polishing system and chemical mechanical polishing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108698193A (en) | 2018-10-23 |
| WO2018050069A1 (en) | 2018-03-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206105604U (en) | Chemical mechanical polishing system | |
| TW308713B (en) | ||
| CN201895002U (en) | Ultrasonic cleaning device | |
| CN108202066B (en) | A kind of can cleaning device in can processing equipment | |
| CN206123405U (en) | Photo holder frame raw material plates throws optical equipment | |
| CN111524833B (en) | Chemical mechanical polishing system and chemical mechanical polishing method | |
| US20230245915A1 (en) | Wafer transfer device, wafer transfer method and cleaning module of chemical mechanical planarization machine | |
| CN105642570B (en) | Photovoltaic module scraper plate cleaning method and device | |
| CN109037101A (en) | Wafer processing | |
| CN108857754A (en) | A kind of self-clean type glass polishing machine | |
| CN203076276U (en) | Silicon wafer two-faced scrubbing machine | |
| CN114054454A (en) | Test tube cleaning equipment for biotechnology experiment | |
| CN110575989B (en) | Cleaning machine for chip silicon production process and using method thereof | |
| CN207887555U (en) | A kind of cleaning device for mechanical fitting | |
| CN111957110A (en) | Oil-water separation filter element treatment process | |
| CN106229526A (en) | A kind of button cell cleans detection sabot all-in-one | |
| CN114308889B (en) | PCBA face is clean and check out test set | |
| CN109926359A (en) | A kind of cleaning device of circuit board | |
| CN212821291U (en) | Cleaning device for precise quartz glass | |
| CN108382621B (en) | Full-automatic can filling machine | |
| CN112238092A (en) | Ultrasonic cleaner is used in production of medical optic fibre of double flute formula | |
| CN110523733A (en) | A kind of liquid crystal module edge clean machine | |
| CN107497719B (en) | A kind of welding wire storage cleaning device | |
| CN203918749U (en) | Crystal blank automatic grinding and polishing system and loading and unloading machinery thereof | |
| CN207841016U (en) | A kind of hard disk driving frame polishing machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Chemical mechanical polishing system and method therefor Effective date of registration: 20180206 Granted publication date: 20170419 Pledgee: Tsinghua Holdings Co., Ltd. Pledgor: TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.) Registration number: 2018120000004 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20191022 Granted publication date: 20170419 Pledgee: Tsinghua Holdings Co., Ltd. Pledgor: TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.) Registration number: 2018120000004 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Co-patentee after: TSINGHUA University Patentee after: Huahaiqingke Co.,Ltd. Address before: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Co-patentee before: TSINGHUA University Patentee before: TSINGHUA University |
|
| CP01 | Change in the name or title of a patent holder |