SG10201508119XA - Substrate processing apparatus and processing method - Google Patents
Substrate processing apparatus and processing methodInfo
- Publication number
- SG10201508119XA SG10201508119XA SG10201508119XA SG10201508119XA SG10201508119XA SG 10201508119X A SG10201508119X A SG 10201508119XA SG 10201508119X A SG10201508119X A SG 10201508119XA SG 10201508119X A SG10201508119X A SG 10201508119XA SG 10201508119X A SG10201508119X A SG 10201508119XA
- Authority
- SG
- Singapore
- Prior art keywords
- processing apparatus
- processing method
- substrate
- substrate processing
- processing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
- H01L21/02065—Cleaning during device manufacture during, before or after processing of insulating layers the processing being a planarization of insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014204739A JP6426965B2 (en) | 2014-10-03 | 2014-10-03 | Processing component, processing module, and processing method |
JP2014207872A JP6445298B2 (en) | 2014-10-09 | 2014-10-09 | Polishing apparatus and processing method |
JP2014258716A JP2016119406A (en) | 2014-12-22 | 2014-12-22 | Substrate processing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201508119XA true SG10201508119XA (en) | 2016-05-30 |
Family
ID=55633296
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201508119XA SG10201508119XA (en) | 2014-10-03 | 2015-09-30 | Substrate processing apparatus and processing method |
SG10201810852TA SG10201810852TA (en) | 2014-10-03 | 2015-09-30 | Substrate processing apparatus and processing method |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201810852TA SG10201810852TA (en) | 2014-10-03 | 2015-09-30 | Substrate processing apparatus and processing method |
Country Status (5)
Country | Link |
---|---|
US (3) | US20160099156A1 (en) |
KR (2) | KR102202331B1 (en) |
CN (2) | CN105479324B (en) |
SG (2) | SG10201508119XA (en) |
TW (2) | TWI787555B (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10160090B2 (en) * | 2015-11-12 | 2018-12-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing method |
JP6606017B2 (en) * | 2016-06-07 | 2019-11-13 | 株式会社荏原製作所 | Substrate processing equipment |
US10741381B2 (en) * | 2016-12-15 | 2020-08-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | CMP cleaning system and method |
US11059145B2 (en) * | 2017-08-10 | 2021-07-13 | Tokyo Electron Limited | Dressing apparatus and dressing method for substrate rear surface polishing member |
US11103970B2 (en) * | 2017-08-15 | 2021-08-31 | Taiwan Semiconductor Manufacturing Co, , Ltd. | Chemical-mechanical planarization system |
SG11201908968QA (en) * | 2017-10-17 | 2019-10-30 | Sumco Corp | Method of polishing silicon wafer |
JP6887371B2 (en) * | 2017-12-20 | 2021-06-16 | 株式会社荏原製作所 | A storage medium that stores a board processing device, a control method for the board processing device, and a program. |
US11414748B2 (en) * | 2019-09-25 | 2022-08-16 | Intevac, Inc. | System with dual-motion substrate carriers |
JP7160725B2 (en) * | 2019-03-06 | 2022-10-25 | 株式会社荏原製作所 | Substrate processing equipment |
US11791173B2 (en) | 2019-03-21 | 2023-10-17 | Samsung Electronics Co., Ltd. | Substrate cleaning equipment, substrate treatment system including the same, and method of fabricating semiconductor device using the substrate cleaning equipment |
CN110653671B (en) * | 2019-09-24 | 2021-06-25 | 广州大学 | Brushing type metal workpiece surface reinforced grinding processing equipment and method |
JP7220648B2 (en) * | 2019-12-20 | 2023-02-10 | 株式会社荏原製作所 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
JP7402698B2 (en) * | 2020-01-21 | 2023-12-21 | 東京エレクトロン株式会社 | Substrate cleaning equipment and substrate cleaning method |
JP7387471B2 (en) * | 2020-02-05 | 2023-11-28 | 株式会社荏原製作所 | Substrate processing equipment and substrate processing method |
CN111451932B (en) * | 2020-03-23 | 2021-09-07 | 中国科学院上海光学精密机械研究所 | Optical processing clamp and processing method for large-caliber special-shaped planar element |
CN111673607B (en) * | 2020-04-28 | 2021-11-26 | 北京烁科精微电子装备有限公司 | Chemical mechanical planarization equipment |
CN111906684A (en) * | 2020-08-10 | 2020-11-10 | 泉芯集成电路制造(济南)有限公司 | Grinding method |
CN112428138B (en) * | 2020-11-20 | 2022-07-29 | 西安奕斯伟材料科技有限公司 | Single-side polishing device and method |
CN112548845B (en) * | 2021-02-19 | 2021-09-14 | 清华大学 | Substrate processing method |
JP2022147778A (en) * | 2021-03-23 | 2022-10-06 | 株式会社Screenホールディングス | Substrate processing device, substrate processing system, and substrate processing method |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100390293B1 (en) * | 1993-09-21 | 2003-09-02 | 가부시끼가이샤 도시바 | Polishing device |
JP3114156B2 (en) | 1994-06-28 | 2000-12-04 | 株式会社荏原製作所 | Cleaning method and apparatus |
JP3447869B2 (en) * | 1995-09-20 | 2003-09-16 | 株式会社荏原製作所 | Cleaning method and apparatus |
JPH1071562A (en) * | 1996-05-10 | 1998-03-17 | Canon Inc | Mechano-chemical polishing device and method |
KR100264228B1 (en) * | 1996-05-10 | 2000-12-01 | 미다라이 후지오 | Chemical mechanical polishing apparatus and method |
JP3891641B2 (en) * | 1997-06-06 | 2007-03-14 | 株式会社荏原製作所 | Polishing device |
US6036582A (en) * | 1997-06-06 | 2000-03-14 | Ebara Corporation | Polishing apparatus |
JP2000108024A (en) * | 1998-10-02 | 2000-04-18 | Toshiba Mach Co Ltd | Cmp polishing device |
US6354922B1 (en) * | 1999-08-20 | 2002-03-12 | Ebara Corporation | Polishing apparatus |
JP4127346B2 (en) | 1999-08-20 | 2008-07-30 | 株式会社荏原製作所 | Polishing apparatus and method |
JP3847500B2 (en) * | 1999-10-08 | 2006-11-22 | 株式会社日立製作所 | Semiconductor wafer flattening processing method and flattening processing apparatus |
US6379235B1 (en) * | 1999-10-27 | 2002-04-30 | Strausbaugh | Wafer support for chemical mechanical planarization |
TW467804B (en) * | 2000-03-15 | 2001-12-11 | Taiwan Semiconductor Mfg | Multi-zone polishing pad conditioning device and method for CMP system |
US6585572B1 (en) * | 2000-08-22 | 2003-07-01 | Lam Research Corporation | Subaperture chemical mechanical polishing system |
JP2002219645A (en) * | 2000-11-21 | 2002-08-06 | Nikon Corp | Grinding device, method for manufacturing semiconductor device using it and semiconductor device manufactured thereby |
JP2002177911A (en) * | 2000-12-14 | 2002-06-25 | Dainippon Screen Mfg Co Ltd | Apparatus and method for cleaning substrate |
US6561881B2 (en) * | 2001-03-15 | 2003-05-13 | Oriol Inc. | System and method for chemical mechanical polishing using multiple small polishing pads |
US20040248415A1 (en) * | 2002-02-20 | 2004-12-09 | Yutaka Wada | Polishing method and polishing liquid |
JP2005136068A (en) * | 2003-10-29 | 2005-05-26 | Seiko Epson Corp | Cleaning station and method for manufacturing semiconductor device |
JP2007168039A (en) * | 2005-12-22 | 2007-07-05 | Ebara Corp | Polishing surface washing mechanism of polishing table and polishing device |
JP4894674B2 (en) * | 2007-08-08 | 2012-03-14 | 東京エレクトロン株式会社 | Coating, developing device, coating, developing method, and storage medium |
JP5444596B2 (en) * | 2007-08-31 | 2014-03-19 | 富士通セミコンダクター株式会社 | Manufacturing method of semiconductor device |
JP5744382B2 (en) | 2008-07-24 | 2015-07-08 | 株式会社荏原製作所 | Substrate processing apparatus and substrate processing method |
CN102124545B (en) * | 2008-08-14 | 2013-11-06 | 应用材料公司 | Chemical mechanical polisher having movable slurry dispensers and method |
US8597084B2 (en) * | 2008-10-16 | 2013-12-03 | Applied Materials, Inc. | Textured platen |
KR101004435B1 (en) * | 2008-11-28 | 2010-12-28 | 세메스 주식회사 | Substrate polishing apparatus and method of polishing substrate using the same |
CN101992421B (en) * | 2009-08-14 | 2012-10-03 | 中芯国际集成电路制造(上海)有限公司 | Chemical-mechanical polishing method in copper interconnection process |
JP5511600B2 (en) * | 2010-09-09 | 2014-06-04 | 株式会社荏原製作所 | Polishing equipment |
JP5722065B2 (en) * | 2011-02-10 | 2015-05-20 | 株式会社ディスコ | Polishing equipment |
TWI663018B (en) * | 2012-09-24 | 2019-06-21 | 日商荏原製作所股份有限公司 | Grinding method and grinding device |
JP2014167996A (en) * | 2013-02-28 | 2014-09-11 | Ebara Corp | Polishing device and polishing method |
CN203305047U (en) * | 2013-04-27 | 2013-11-27 | 株式会社荏原制作所 | Grinding device |
CN203282328U (en) * | 2013-04-28 | 2013-11-13 | 株式会社荏原制作所 | Polishing device and base plate processing device |
-
2015
- 2015-09-30 SG SG10201508119XA patent/SG10201508119XA/en unknown
- 2015-09-30 SG SG10201810852TA patent/SG10201810852TA/en unknown
- 2015-09-30 KR KR1020150137387A patent/KR102202331B1/en active IP Right Grant
- 2015-09-30 CN CN201510640665.3A patent/CN105479324B/en active Active
- 2015-09-30 CN CN202010986718.8A patent/CN112091809B/en active Active
- 2015-10-01 TW TW108140123A patent/TWI787555B/en active
- 2015-10-01 TW TW104132378A patent/TWI678750B/en active
- 2015-10-01 US US14/872,342 patent/US20160099156A1/en not_active Abandoned
-
2020
- 2020-09-29 US US17/036,555 patent/US20210013071A1/en not_active Abandoned
-
2021
- 2021-01-06 KR KR1020210001228A patent/KR102263992B1/en active IP Right Grant
-
2023
- 2023-07-10 US US18/349,666 patent/US20230352326A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN112091809B (en) | 2022-11-29 |
US20230352326A1 (en) | 2023-11-02 |
US20160099156A1 (en) | 2016-04-07 |
CN105479324B (en) | 2020-11-06 |
TW202006858A (en) | 2020-02-01 |
KR102202331B1 (en) | 2021-01-13 |
SG10201810852TA (en) | 2019-01-30 |
TW201622040A (en) | 2016-06-16 |
TWI678750B (en) | 2019-12-01 |
CN112091809A (en) | 2020-12-18 |
TWI787555B (en) | 2022-12-21 |
KR20210007008A (en) | 2021-01-19 |
KR102263992B1 (en) | 2021-06-11 |
KR20160040428A (en) | 2016-04-14 |
CN105479324A (en) | 2016-04-13 |
US20210013071A1 (en) | 2021-01-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201604456TA (en) | Substrate processing apparatus and substrate processing method | |
GB2558842B (en) | Processing apparatus and methods | |
SG10201508119XA (en) | Substrate processing apparatus and processing method | |
GB2545607B (en) | Apparatus and method for vector processing | |
KR102342131B9 (en) | Substrate treatment apparatus and substrate treatment method | |
HK1245417B (en) | Substrate processing method and substrate-processing apparatus | |
SG10201510372PA (en) | Etching Method And Etching Apparatus | |
EP2991268A4 (en) | Data processing method and apparatus | |
SG11201704323XA (en) | Wafer processing device and method therefor | |
SG11201609855WA (en) | Information processing apparatus and information processing method | |
SG11201610951UA (en) | Information processing apparatus and information processing method | |
HK1219315A1 (en) | Method for processing application and device thereof | |
SG11201609143TA (en) | Plasma processing method and plasma processing apparatus | |
GB201500628D0 (en) | Information processing apparatus and information processing method | |
SG11201607004QA (en) | Substrate processing system and substrate processing method | |
TWI562216B (en) | Substrate cleaning method and substrate cleaning apparatus | |
HK1216560A1 (en) | Picture processing method and apparatus | |
SG11201702404XA (en) | Plasma processing method and plasma processing apparatus | |
SG10201502813TA (en) | Substrate Processing Apparatus | |
GB201405662D0 (en) | Apparatus and method | |
GB201414750D0 (en) | Data processing apparatus and method | |
SG10201508329UA (en) | Buffing apparatus and substrate processing apparatus | |
GB2533597B (en) | Material processing apparatus and method | |
SG11201605673VA (en) | Workpiece processing apparatus and workpiece processing method | |
PT3110210T (en) | Data processing apparatus and method |