SG11201704323XA - Wafer processing device and method therefor - Google Patents
Wafer processing device and method thereforInfo
- Publication number
- SG11201704323XA SG11201704323XA SG11201704323XA SG11201704323XA SG11201704323XA SG 11201704323X A SG11201704323X A SG 11201704323XA SG 11201704323X A SG11201704323X A SG 11201704323XA SG 11201704323X A SG11201704323X A SG 11201704323XA SG 11201704323X A SG11201704323X A SG 11201704323XA
- Authority
- SG
- Singapore
- Prior art keywords
- processing device
- wafer processing
- method therefor
- therefor
- wafer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/2026—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction
- G03F7/2028—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure for the removal of unwanted material, e.g. image or background correction of an edge bead on wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410697547.1A CN105632971B (en) | 2014-11-26 | 2014-11-26 | A kind of silicon wafer processing unit and method |
PCT/CN2015/095431 WO2016082746A1 (en) | 2014-11-26 | 2015-11-24 | Wafer processing device and method therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201704323XA true SG11201704323XA (en) | 2017-06-29 |
Family
ID=56047766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201704323XA SG11201704323XA (en) | 2014-11-26 | 2015-11-24 | Wafer processing device and method therefor |
Country Status (8)
Country | Link |
---|---|
US (1) | US10658214B2 (en) |
EP (1) | EP3226284B1 (en) |
JP (1) | JP6474143B2 (en) |
KR (1) | KR101981872B1 (en) |
CN (1) | CN105632971B (en) |
SG (1) | SG11201704323XA (en) |
TW (1) | TWI581356B (en) |
WO (1) | WO2016082746A1 (en) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3082155B1 (en) * | 2015-04-14 | 2023-08-30 | Ebara Corporation | Substrate processing apparatus and substrate processing method |
JP6444909B2 (en) * | 2016-02-22 | 2018-12-26 | 東京エレクトロン株式会社 | Substrate processing method, substrate processing apparatus, and computer-readable recording medium |
CN107561864B (en) | 2016-06-30 | 2019-10-25 | 上海微电子装备(集团)股份有限公司 | Edge exposure device and method |
CN108803245B (en) * | 2017-04-28 | 2020-04-10 | 上海微电子装备(集团)股份有限公司 | Silicon wafer processing device and method |
CN109427616B (en) * | 2017-09-05 | 2020-08-25 | 上海微电子装备(集团)股份有限公司 | Silicon wafer gluing and pre-alignment detection device and method |
CN107845598A (en) * | 2017-12-05 | 2018-03-27 | 通威太阳能(合肥)有限公司 | Rotating mechanism for rotating solar cell by 90 degrees |
CN110068989B (en) * | 2018-01-23 | 2021-03-02 | 上海微电子装备(集团)股份有限公司 | Silicon wafer processing device and method |
KR102219879B1 (en) * | 2018-05-17 | 2021-02-24 | 세메스 주식회사 | Substrate processing apparatus and substrate alignment method |
CN110231756A (en) * | 2018-08-10 | 2019-09-13 | 上海微电子装备(集团)股份有限公司 | Exposure device, exposure method, semiconductor devices and its manufacturing method |
CN110943021B (en) * | 2018-09-21 | 2022-05-31 | 上海微电子装备(集团)股份有限公司 | Pre-alignment device and method |
CN111106053B (en) * | 2018-10-25 | 2023-08-04 | 上海微电子装备(集团)股份有限公司 | Silicon wafer prealignment device and method |
CN111381451B (en) * | 2018-12-29 | 2021-12-17 | 上海微电子装备(集团)股份有限公司 | Pre-alignment system, pre-alignment method and photoetching equipment |
KR20210001315A (en) | 2019-06-27 | 2021-01-06 | 주식회사 쿠온솔루션 | Wafer processing system and cooling method in the same |
CN113467202B (en) * | 2020-03-30 | 2023-02-07 | 上海微电子装备(集团)股份有限公司 | Photoetching equipment and silicon wafer pre-alignment method |
CN112051708A (en) * | 2020-09-15 | 2020-12-08 | 青岛天仁微纳科技有限责任公司 | Centering feeding device and nano-imprinting equipment |
CN112366165A (en) * | 2020-10-28 | 2021-02-12 | 中国电子科技集团公司第五十五研究所 | Height-adjustable wafer centering and edge-leveling wafer carrying mechanism |
KR102535354B1 (en) * | 2021-06-04 | 2023-05-26 | (주)이오테크닉스 | Wafer aligning apparatus |
US20230036587A1 (en) * | 2021-07-29 | 2023-02-02 | Changxin Memory Technologies, Inc. | Wafer alignment device, wafer alignment method and wafer alignment system |
CN113932734B (en) * | 2021-11-23 | 2023-08-18 | 浙江海纳半导体股份有限公司 | Wafer edge contour tester |
CN117219552A (en) * | 2022-06-02 | 2023-12-12 | 华为技术有限公司 | Wafer processing apparatus and wafer processing method |
CN115063432B (en) * | 2022-08-22 | 2022-11-11 | 合肥新晶集成电路有限公司 | Method and device for identifying alignment mark pattern, computer equipment and storage medium |
CN115732380B (en) * | 2022-10-08 | 2023-11-24 | 吉姆西半导体科技(无锡)有限公司 | Wafer eccentricity adjustment method, device and storage medium |
CN115547915B (en) * | 2022-11-28 | 2023-02-14 | 四川上特科技有限公司 | Wafer exposure clamp and exposure device |
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KR101414830B1 (en) | 2011-11-30 | 2014-07-03 | 다이닛뽕스크린 세이조오 가부시키가이샤 | Alignment method, transfer method, and transfer apparatus |
CN202434487U (en) * | 2011-12-13 | 2012-09-12 | 昆山中辰矽晶有限公司 | Wafer edge searching and positioning device and etching machine station |
JP6023451B2 (en) * | 2012-04-05 | 2016-11-09 | キヤノン株式会社 | Illumination optical system, exposure apparatus, and device manufacturing method |
CN103472680B (en) * | 2012-06-08 | 2016-03-30 | 上海微电子装备有限公司 | Silicon wafer pre-alignment device |
CN103811387B (en) * | 2012-11-08 | 2016-12-21 | 沈阳新松机器人自动化股份有限公司 | Wafer pre-alignment method and device |
US9879977B2 (en) * | 2012-11-09 | 2018-01-30 | Kla-Tencor Corporation | Apparatus and method for optical metrology with optimized system parameters |
CN203472680U (en) | 2013-08-05 | 2014-03-12 | 北京汽车股份有限公司 | Vehicle rear view field auxiliary system |
JP6360287B2 (en) | 2013-08-13 | 2018-07-18 | キヤノン株式会社 | Lithographic apparatus, alignment method, and article manufacturing method |
-
2014
- 2014-11-26 CN CN201410697547.1A patent/CN105632971B/en active Active
-
2015
- 2015-11-24 US US15/531,320 patent/US10658214B2/en active Active
- 2015-11-24 SG SG11201704323XA patent/SG11201704323XA/en unknown
- 2015-11-24 KR KR1020177017434A patent/KR101981872B1/en active IP Right Grant
- 2015-11-24 JP JP2017527867A patent/JP6474143B2/en active Active
- 2015-11-24 EP EP15863383.4A patent/EP3226284B1/en active Active
- 2015-11-24 WO PCT/CN2015/095431 patent/WO2016082746A1/en active Application Filing
- 2015-11-26 TW TW104139314A patent/TWI581356B/en active
Also Published As
Publication number | Publication date |
---|---|
KR20170106306A (en) | 2017-09-20 |
CN105632971B (en) | 2019-06-25 |
EP3226284B1 (en) | 2020-12-16 |
JP2018503973A (en) | 2018-02-08 |
TW201622046A (en) | 2016-06-16 |
US10658214B2 (en) | 2020-05-19 |
TWI581356B (en) | 2017-05-01 |
EP3226284A4 (en) | 2018-07-18 |
CN105632971A (en) | 2016-06-01 |
JP6474143B2 (en) | 2019-02-27 |
US20170345696A1 (en) | 2017-11-30 |
KR101981872B1 (en) | 2019-05-23 |
EP3226284A1 (en) | 2017-10-04 |
WO2016082746A1 (en) | 2016-06-02 |
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