CN101640181A - Substrate alignment apparatus and substrate processing apparatus - Google Patents
Substrate alignment apparatus and substrate processing apparatus Download PDFInfo
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- CN101640181A CN101640181A CN200910159687A CN200910159687A CN101640181A CN 101640181 A CN101640181 A CN 101640181A CN 200910159687 A CN200910159687 A CN 200910159687A CN 200910159687 A CN200910159687 A CN 200910159687A CN 101640181 A CN101640181 A CN 101640181A
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Abstract
A substrate alignment apparatus for aligning a substrate with a reference point, comprises a plurality of columns configured to rotate about rotation axes parallel to respective axial directions thereof, a driving mechanism configured to synchronously rotate the plurality of columns through an identical angle in an identical direction, a detector configured to detect an amount of positional deviation of the substrate from the reference point, and support pins which are located on upper surfaces of the plurality of columns while being spaced apart from respective rotation axes of the pluralityof columns, and are configured to support the substrate, wherein the substrate is aligned by synchronously rotating the plurality of columns through the identical angle in the identical direction by the driving mechanism based on the amount of positional deviation detected by the detector.
Description
Technical field
[0001] the present invention relates to a kind of substrate aligning equipment and substrate processing apparatus of proofreading and correct substrate location.
Background technology
[0002] for example, patent documentation 1 (the Japan Patent spy opens No.9-181151) has illustrated a kind of by against substrate mechanical pressurization of abutment pin being proofreaied and correct the conventional method of substrate location, and described abutment pin is against the outer periphery surface of substrate.
[0003] patent documentation 2 (the Japan Patent spy opens No.8-008328) has illustrated a kind of known wafer orientation equipment, when substrate is installed on the X-Y stand that moves along orthogonal direction, and the position of described equipment calibration substrate.
[0004] patent documentation 3 (the Japan Patent spy opens No.2008-66367) has illustrated a kind of substrate transfer equipment, and this equipment is transfer substrate between the erecting bed of transfer arm that transmits substrate and installation substrate.The equipment of explanation is arranged around the axis of support of erecting bed in the patent documentation 3, and between this equipment and erecting bed spacing is arranged.This equipment comprises the base portion of a plurality of supporting pins and attaching supporting pin, and described a plurality of supporting pins are in its lower surface upper support substrate.This equipment also comprises vertical drive unit and horizontal drive apparatus, described vertical drive unit be used for driving vertically supporting pin by base portion promoting or to reduce substrate, described horizontal drive apparatus be used for flatly driving supporting pin by base portion to regulate the position of substrate along continuous straight runs.
[0005] the substrate location bearing calibration according to patent documentation 1 may produce particle, and this is because this method for example comes the abutment pin pressurization is mechanically promoted substrate by the side surface (outer periphery surface) against substrate, to proofread and correct the position of substrate.This method also causes following problem: owing to make basement movement when pressing abutment pin, the lower surface of substrate rubs on the supporting pin that substrate is installed in this process, produces particle through regular meeting.
[0006] though can solve above-mentioned because the friction of substrate produces the problem of particle according to the wafer orientation equipment of patent documentation 2, it needs the X-Y stand and along two drive systems of X and Y direction, so that drive the X-Y stand.In addition because must guarantee given space around the X-Y stand so that even when X-Y stand along continuous straight runs (X and Y direction) translation, can not interfere yet, so this equipment is unsuitable for being contained in the compact space.
[0007] the substrate transfer equipment needs according to patent documentation 3 form the gap in erecting bed, leave with the supporting pin that allows motion.If in the extra gap of the inner formation of erecting bed, described erecting bed for example is contained in and uses plasma to carry out in the substrate processing apparatus of base treatment, then this equipment can run into the problem that is associated with Temperature Distribution and RF inhomogeneities.Equally, if the mechanism that comprise above-mentioned parts relevant with base treatment with the substrate transfer is installed in internal vacuum chamber, then this may cause scattering and the relevant problem of degasification with installing space, lubricant and particle.
[0008] in order to make supporting pin in a vacuum vertically and horizontal direction (that is, X and Y direction) motion, drive system then must be set on atmospheric side and carry out these motions by vacuum wall.Bellows is generally used for vertical motion.At this moment, when bellows vertically when extend/retract and along continuous straight runs displacement simultaneously, load is applied on the weld zone of bellows, causes the life-span of substrate transfer equipment significantly to shorten.
Summary of the invention
[0009] the purpose of this invention is to provide a kind of generation that can suppress particle, substrate aligning equipment and substrate processing apparatus compact and/or that have longer life.
[0010] a first aspect of the present invention provides a kind of substrate aligning equipment that substrate is aimed at reference point of being used for, and this substrate aligning equipment comprises: a plurality of posts, and it is configured to around the rotation rotation parallel with corresponding axial direction; Driving mechanism, it is configured to a plurality of posts are synchronously rotated by identical angle along equidirectional; Detector, it is configured to detect the amount of the position deviation that substrate departs from from reference point; And supporting pin, it is positioned on the upper surface of a plurality of posts and is simultaneously spaced apart with the corresponding rotation of a plurality of posts, and be configured to support base, wherein based on amount by the detected position deviation of detector, by a plurality of posts are synchronously rotated by identical angle along equidirectional, and substrate is aimed at.
[0011] a second aspect of the present invention provides a kind of substrate processing apparatus, and it comprises the substrate aligning equipment of above definition.
[0012] according to the present invention, a kind of substrate alignment device can be provided, this substrate aligning equipment can suppress particle generation, be compact and/or have the long life-span that this is because this equipment is proofreaied and correct the position of substrate by the rotation supporting pin when substrate is installed on the supporting pin.
[0013] further feature of the present invention from following with reference to accompanying drawing the exemplary embodiments explanation and become clear.
Description of drawings
[0014] Fig. 1 is the perspective view that illustrates according to the substrate aligning equipment of the first embodiment of the present invention;
[0015] Fig. 2 A to 2H is the view that is used for the position correction process of the substrate aligning equipment shown in the key-drawing 1;
[0016] Fig. 3 is the view that is used to explain the substrate location deviation detecting method;
[0017] Fig. 4 is the view that is used to explain the substrate location correction;
[0018] Fig. 5 is the view that the example of supporting pin driving mechanism is shown;
[0019] Fig. 6 is the perspective schematic view that the example of the synchronous rotating mechanism that is used for synchronously rotating three posts is shown;
[0020] Fig. 7 A to 7D is the view that the example of supporting pin is shown;
[0021] Fig. 8 is the perspective view that the layout of substrate aligning equipment according to a second embodiment of the present invention is shown;
[0022] Fig. 9 A to 9I is the view that is used for the position correction process of the substrate aligning equipment shown in the key-drawing 8;
[0023] Figure 10 is the view of layout that the substrate aligning equipment of a third embodiment in accordance with the invention is shown;
[0024] Figure 11 A to 11G is the view that is used to explain the position correction process of the substrate aligning equipment shown in Figure 10;
[0025] Figure 12 H to 12K is the view that is used to explain the position correction process of the substrate aligning equipment shown in Figure 10;
[0026] Figure 13 is the perspective schematic view that illustrates according to the substrate processing apparatus of the first embodiment of the present invention;
[0027] Figure 14 is the conceptual view that detects according to the substrate in the substrate processing apparatus of the first embodiment of the present invention;
[0028] Figure 15 is the view that is used to explain the layout of optical displacement sensor, and described optical displacement sensor is used in the substrate processing apparatus according to the first embodiment of the present invention;
[0029] Figure 16 be observed from the top of substrate, by the vertical view that detects the substrate location deviation according to the optical displacement sensor of substrate processing apparatus of the present invention;
[0030] Figure 17 A illustrates the schematic diagram that optical displacement sensor detects the state of substrate location deviation;
[0031] Figure 17 B illustrates the schematic diagram that optical displacement sensor detects another state of substrate location deviation;
[0032] Figure 17 C illustrates the schematic diagram that optical displacement sensor detects another state of substrate location deviation;
[0033] Figure 17 D illustrates the schematic diagram that optical displacement sensor detects another state of substrate location deviation;
[0034] Figure 18 is the perspective schematic view that substrate processing apparatus according to a second embodiment of the present invention is shown;
[0035] Figure 19 A and 19B are the views that is used to explain the layout of transmission optics displacement transducer, and described transmission optics displacement transducer is used in according to a second embodiment of the present invention the substrate processing apparatus;
[0036] Figure 20 is used to explain the view that uses the transmission optics displacement transducer to detect the substrate location deviation;
[0037] Figure 21 is a vertical view observed from substrate top, detected the substrate location deviation by the transmission optics displacement transducer.
Embodiment
[0038] is used to carry out optimal mode of the present invention hereinafter with reference to the accompanying drawing detailed description.
(first embodiment)
[0039] Fig. 1 is the perspective view that illustrates according to the substrate aligning equipment of the first embodiment of the present invention.Substrate aligning equipment according to the present invention makes the substrate along continuous straight runs motion of horizontal support, so that substrate is aimed at predetermined reference point, and proofreaies and correct the substrate location deviation, and substrate accurately is installed on substrate frame thus.
[0040] substrate aligning equipment 100 (for example comprises the installation substrate, semiconductor wafer) substrate frame 105 of W and a plurality of post 103 are (promptly, 103a, 103b and 103c), these posts are arranged in the substrate frame 105 and are configured to and can freely rotate in support base W and can vertically move.A plurality of posts 103 are around the rotation of their corresponding rotations, the normal parallel of described rotation and substrate W to be supported.
[0041] a plurality of posts 103 comprise supporting pin 101a, 101b and 101c on their upper surface (surface of revolution), and these supporting pins are positioned at the position with respect to the corresponding rotation off-centre of a plurality of posts 103.Substrate aligning equipment 100 also comprises the annular cover 107 of protecting substrate frame 105.Though Fig. 1 only illustrates according to substrate aligning equipment of the present invention, in fact this substrate aligning equipment is installed in the substrate processing apparatus that uses plasma to carry out base treatment.
[0042] in this embodiment, post 103a, 103b and 103c are arranged in the annular cover 107.Substrate aligning equipment 100 is arranged in the vacuum chamber (not shown) that constitutes substrate processing apparatus.Though the quantity of post 103 can be three, it is not limited, and can use the post 103 of any amount, as long as they can flatly keep substrate W.
[0043] post 103a, 103b and 103c comprise three supporting pin 101a, 101b and 101c on their upper surface (surface of revolution), and these supporting pins are positioned at the position with respect to the eccentric same radius of corresponding rotation of post 103a, 103b and 103c.That is, three supporting pins 101 are positioned at the spaced apart preset distance of rotation (pivot) (identical distance) with post 103 on the surface of revolution of post 103.Though the surface of revolution of post 103 can have disc-shape, they are not limited, and can have for example square shape or rectangular shape.
[0044] explains the process of using substrate aligning equipment according to the present invention to carry out the substrate location correction with reference to Fig. 2 A to 2H.At first, substrate W is transferred in the vacuum chamber by the substrate transport mechanisms (not shown), and is installed on post 103a, the 103b and 103c that is positioned at raised position, as shown in Fig. 2 A (substrate loading).
[0045] mounted substrate W may have position deviation this moment, so following proofreading and correct like that of will explaining.Substrate W is installed on the substrate frame 105 by synchronously reducing post 103a, 103b and 103c, as shown in Fig. 2 B (substrate is provided with temporarily).
[0046] after the interim setting of substrate W is finished, carries out the position correction of substrate W by the amount that detects the substrate location deviation and prepare (Fig. 2 C).To explain the method that detects the position deviation that is installed in the substrate W on the substrate frame 105 at this.The method of the position deviation of multiple detection substrate W all is available.For example, determine the center X of substrate W based on the data of being caught from substrate W top, as shown in Figure 3 by the CCD camera.
[0047] the center X of substrate W and predetermined reference point X ' compare, so that obtain the amount of exercise L (absolute value X-X ') and the direction of motion (vector XX ') of substrate W.The outward flange that should be noted that substrate W can replace the center of substrate W and move to its corresponding reference point.
[0048] calculates supporting pin 101a, 101b and the 101c that post 103a, 103b and 103c are substrate aligning equipment 100 and rotate angle 2 θ that pass through around corresponding post center, as shown in Figure 4.
[0049] because when detecting the amount of substrate location deviation, just determine the direction of motion and amount of exercise L, so we can obtain the relation between amount of exercise L and angle 2 θ:
sinθ＝L/2R
θ＝sin
-1(L/2R)
2θ＝2sin
-1(L/2R)
Wherein R is the distance between the center of the rotation (pivot) of post 103 and supporting pin 101, as shown in Figure 4; And θ is the angle that forms between dotted line I and the straight line m, described dotted line I is with vertical by the basement movement direction of the arrow among Fig. 4 indication and through the pivot of post 103, described straight line m through supporting pin 101 one of at centers of motion front and back with the pivot of post 103.Supporting pin has identical angle θ and is axisymmetric around dotted line I in the motion front-back direction, and described dotted line I is vertical with the basement movement direction and through the pivot of post 103.
[0050] computing circuit for example uses the CPU (not shown) to carry out aforementioned calculation.
[0051] supposes when post does not contact with substrate W with the vertical dotted line I of the direction of motion of substrate W and be used for each post 103, as shown in Fig. 2 C.Post 103a, 103b and 103c are that supporting pin 101a, 101b and 101c rotate to motion supporting pin position before around its corresponding center, and described supporting pin position forms angle θ with respect to dotted line I.
[0052] this is to be that the position correction of substrate W is prepared by made supporting pin 101 motions before substrate W is aimed at.That is, supporting pin 101 moves to these supporting pins had not before had the position of support base W (before the motion), as shown in Figure 4.
[0053] like this, supporting pin 101a, 101b and 101c with respect to dotted line I around the corresponding rotation of supporting pin become angle θ fixing in position in.Under this state, when substrate W was supported by supporting pin 101a, 101b and 101c, three post 103a, 103b and 103c synchronously rose, as shown in Fig. 2 D (substrate lifting).
[0054] under this state, three post 103a, 103b synchronously rotate by identical angle 2 θ, as shown in Fig. 2 E along same direction with 103c.By this operation, the substrate W that is supported by supporting pin 101 is along the direction of proofreading and correct the substrate W position deviation amount of exercise L (substrate location correction) that moved.In this case, the supporting pin 101 amount of exercise L that moved from the position before the supporting pin motion arrives position after the supporting pin motion, as shown in Figure 4.By such aligning, the position of substrate W is corrected into and makes the center X of the substrate W shown in Fig. 3 aim at predetermined reference point X '.
[0055] by in support base W, reducing post 103 substrate W is installed on the substrate frame 105, as shown in Fig. 2 F (substrate setting), and the completing place correct operation.In this bearing calibration, the largest motion scope of substrate determines according to the radius of post, and when 2 θ=180 ° this range of movement maximum.Therefore, optimal radius only needs to select according to position deviation amount to be corrected, so that meet the specific requirement of substrate processing apparatus.
[0056] produces plasma by the plasma generating unit (not shown) in the vacuum chamber of substrate processing apparatus and handle substrate W, as shown in Fig. 2 G.For substrate W being unloaded to for example another vacuum chamber, substrate feel trim actuator (not shown) is the unloading substrate W after post 103 rises, as shown in Fig. 2 H.
[0057] Fig. 5 illustrates the example of the driving mechanism of post 103.In Fig. 5, represent identical parts with Reference numeral identical among Fig. 1, and followingly will not provide its explanation.One end of post 103 is connected to positioning motor 509, so that column spinner 103.But post 103 is connected to the vertical cylinder 507 of vertical motion.
[0058] magnetic fluid seal (or magnetic coupling seal) 505 places between post 103 and the positioning motor 509, so that under the situation of not destroying vacuum actuating force is applied in the chamber by locular wall 501.That is, magnetic fluid seal (or magnetic coupling seal) 505 makes indoor vacuum and air insulated.Though Fig. 5 only illustrates the Drive Structure of a post 103, identical driving mechanism can be applied to a plurality of posts 103.With reference to Fig. 5, Reference numeral 503 expression bellowss.
[0059] Fig. 6 is the perspective schematic view that an example of rotary drive mechanism is shown, and described rotary drive mechanism is used for three post 103a, 103b are synchronously rotated by identical angle along same direction with 103c, describes with reference to Fig. 2 E.In Fig. 6, represent identical parts with Reference numeral identical among Fig. 1.Single synchronously with 601 ends that drive among three post 103a, 103b and the 103c each, as shown in Figure 6.This mechanism comprises the positioning motor 603 that is used to rotate synchronously with 601.Three post 103a, 103b can rotate synchronously by driving positioning motor 603 with 103c and synchronously rotate by identical angle along same direction with 601.
[0060] Fig. 7 A to 7D illustrates the shape applicable to supporting pin 101 of the present invention.Fig. 7 A illustrates the example that supporting pin 101 has conical far-end.Fig. 7 B illustrates the example that supporting pin 101 has semi-spherical shape.Perhaps, supporting pin 101 can have the cylindrical structural that takies minimum area, as shown in Fig. 7 C.That is, Fig. 7 C far-end that supporting pin is shown drops on the structure in the zone on the post 103.
[0061] Fig. 7 D illustrates the example that supporting pin 101 has cylindrical structural, and this cylindrical structural can be freely around the rotation rotation parallel with the axial direction of supporting pin 101.Structure shown in Fig. 7 D is effective especially aspect the generation that prevents any particle, this be because this structure can reduce and substrate W between frictional force.
[0062], when substrate W is installed on the supporting pin, proofreaies and correct the position of substrate W by the rotation supporting pin according to first embodiment.Can for example reduce the friction between substrate W and the supporting pin like this, and therefore suppress the generation of any particle.Because the correction position deviation does not need the space of broad, so can access compact aligning equipment so yet.In addition, can not be shorter than the life-span of the substrate transfer equipment described in the patent documentation 3 according to life-span of the substrate aligning equipment of this embodiment.
(second embodiment)
[0063] next with reference to the layout of Fig. 8 explanation substrate aligning equipment according to a second embodiment of the present invention.In Fig. 8, represent identical parts with Reference numeral identical among Fig. 1, and will not provide its explanation.Though the essential structure of the substrate aligning equipment shown in Fig. 8 is identical with the structure shown in Fig. 1, post 103a, 103b and 103c are arranged on the outside of substrate frame 105, so that upwards promote annular cover 107 in this embodiment.
[0064] inner rim of annular cover 107 is less than the neighboring of substrate W.For this reason, along with a plurality of post 103a, 103b and 103c rise, substrate W also rises with annular cover 107.Substrate frame 105 attachings have the pin of lifting 901a, 901b and 901c, are used for upwards promoting substrate W.Lifting/following descending mechanism (not shown) can make and promote pin 901 motion vertically, indicates as the double-headed arrow among Fig. 8.Supporting pin 101a, 101b and 101c are positioned on the surface of revolution of post 103a, 103b and 103c, and the spaced apart preset distance of its corresponding rotation of while, in the situation as shown in FIG. 1.
[0065] like this, at outer setting post 103a, 103b and the 103c of substrate frame 105, avoided basad support 105 to be provided for making the needs of post 103 rotations and the complex mechanism that moves vertically.This is highly effective when temperature control device and static clamping body for example must basad support 105 be provided, and described temperature control device is used to control substrate and has uniform temperature, and described static clamping body is used for keeping substrate by electrostatic attraction.
[0066] equally in this embodiment, the driving mechanism of post 103 can be at the driving mechanism shown in Fig. 5, and the rotary drive mechanism that three posts 103 are synchronously rotated by identical angle along same direction can be the rotary drive mechanism shown in Fig. 6.Supporting pin 101 can have the some shapes shown in Fig. 7 A to 7D as required.
[0067] explains that with reference to Fig. 9 A to 9I the substrate aligning equipment that uses according to this embodiment carries out the process that substrate location is proofreaied and correct.At first, substrate W is transferred in the vacuum chamber by the substrate transport mechanisms (not shown), and is installed on lifting pin 901a, the 901b and 901c that is positioned at raised position, as shown in Fig. 9 A.
[0068] mounted substrate W can have position deviation this moment, thus the amount of position deviation, i.e. the amount of exercise L and the direction of motion of substrate W, the method for the position deviation by detecting substrate W detects, and with reference to Fig. 3 this method has been described.
[0069] calculate supporting pin 101a, 101b and the 101c that post 103a, 103b and 103c are substrate aligning equipment 100 and rotate angle 2 θ that pass through around the rotation (post center) of post 103a, 103b and 103c, this is with reference to describing among Fig. 4.
[0070] supposes when post 103a, 103b do not contact with annular cover 107 with 103c with the vertical dotted line I of the direction of motion of substrate W and be used for each post 103a, 103b and 103c, as in the described situation of reference Fig. 2 C.Post 103a, 103b and 103c are that supporting pin 101a, 101b and 101c rotate to motion supporting pin position before around its corresponding center, and described supporting pin position forms angle θ with respect to dotted line I.
[0071] like this, supporting pin 101a, 101b and 101c with respect to dotted line I around its corresponding rotation become angle θ fixing in position in.Under this state, when annular cover 107 and substrate W were supported by supporting pin 101a, 101b and 101c, three post 103a, 103b and 103c synchronously rose, as shown in Fig. 9 B.At this moment, post 103 is thus lifted to substrate W and promotes pin 901 positions that are separated from each other.
[0072] under this state, three post 103a, 103b synchronously rotate by identical angle 2 θ, as shown in Fig. 9 C along same direction with 103c.By this operation, annular cover 107 that is supported by supporting pin 101a, 101b and 101c and substrate W are along the direction of the position deviation of the proofreading and correct substrate W amount of exercise L that moved.This operation is identical with the operation shown in Fig. 2 E.
[0073] three post 103a, 103b and 103c synchronously drop to substrate W and are installed in the position that promotes on the pin 901, as shown in Fig. 9 D.Post 103a, 103b and 103c further synchronously drop to the position that substrate W and annular cover 107 are separated from each other.
[0074] annular cover 107 is got back to its initial position by three post 103a, 103b and 103c are synchronously rotated to be rotated into by identical angle (2 θ) along same direction, as shown in Fig. 9 E.In addition, annular cover 107 is installed on the substrate frame 105 by synchronously reducing by three post 103a, 103b and 103c, as shown in Fig. 9 F.Then, substrate W is installed on the substrate frame 105 by reducing lifting pin 901a, 901b and 901c, as shown in Fig. 9 G.
[0075] after this, in vacuum chamber, produce plasma, be used to handle substrate W, as shown in Fig. 9 H.For substrate W being unloaded to for example another vacuum chamber, substrate feel trim actuator (not shown) unloads this substrate W, as shown in Fig. 9 I again promoting substrate W after its transmission location by rising lifting pin 901.
[0076], can for example reduce the friction between substrate W and the supporting pin, and therefore suppress the generation of any particle, as first embodiment according to this second embodiment.Can also realize compact aligning equipment.In addition, do not need the interior zone of substrate frame 105 is provided for that post 103 is rotated and the complex mechanism of vertical motion.When temperature control device and static clamping body for example must be provided the interior zone of substrate frame 105, this was highly effective.
(the 3rd embodiment)
[0077] next the layout of the substrate aligning equipment of a third embodiment in accordance with the invention is described with reference to Figure 10.In Figure 10, represent identical parts with Reference numeral identical in Fig. 1 and 8, and will not provide its explanation.The essential structure of the substrate aligning equipment shown in Figure 10 is identical with the structure shown in Fig. 1 and 8.In this embodiment, supporting pin 101 (that is, 101a, 101b and 101c) can freely rotate around the rotation parallel with its axial direction, and post 103 (that is, 103a, 103b and 103c) can be freely around the rotation rotation parallel with its axial direction.And supporting pin 101 (that is, 101a, 101b and 101c) is connected to annular cover 107.Supporting pin 101a, 101b and 101c are the structures shown in Fig. 7 D with respect to the structure that post 103a, 103b and 103c can freely rotate respectively.
[0078] in another example, supporting pin 101 (promptly, 101a, 101b and 101c) can freely rotate around the rotation parallel with respect to annular cover 107 with the axial direction of supporting pin 101, and can be connected to post 103 (that is, 103a, 103b and 103c).
[0079] in this structure, corresponding post (comprising supporting pin) and annular cover interconnect or engage.Therefore, the substrate aligning equipment shown in Figure 10 allows the precision of substrate location correction to be higher than the precision of the substrate location correction of the substrate aligning equipment shown in Fig. 8.
[0080] also in this embodiment, the driving mechanism of post 103 can be the driving mechanism shown in Fig. 5, and the rotary drive mechanism that three posts 103 are synchronously rotated by identical angle along same direction can be the rotary drive mechanism shown in Fig. 6.
[0081] explains that with reference to Figure 11 A to 11G and 12H to 12K the substrate aligning equipment that uses according to this embodiment carries out the process that substrate location is proofreaied and correct.Trimming process lasts till 12H to 12K from Fig. 1 IA to 11G.At first, substrate W is transferred in the vacuum chamber by the substrate transport mechanisms (not shown), and is installed on lifting pin 901a, the 901b and 901c that is positioned at raised position, as shown in Figure 11 A.
[0082] mounted substrate W may have position deviation this moment, thus the amount of position deviation, i.e. the amount of exercise L and the direction of motion of substrate W, the method for the position deviation by detecting substrate W detects, and with reference to Fig. 3 this method has been described.
[0083] calculates angle 2 θ that post 103a, 103b and 103c (being supporting pin 101a, 101b and the 101c of substrate aligning equipment 100) pass through around the rotation of the center of post 103a, 103b and 103c, with reference to describing among Fig. 4.
[0084] three post 103a, 103b and 103c synchronously rise to such position, and in described position, annular cover 107 disengagings that are connected with 101c with supporting pin 101a, 101b contact with substrate W and substrate frame 105, as shown in Figure 11 b.The dotted line I supposition vertical with the direction of motion of substrate W is used for each post 103a, 103b and 103c, as in the described situation of reference Fig. 2 C.
[0085] yet, should be noted that supporting pin 101a, 101b and 101c and annular cover 107 interconnect in this case.Post 103 is that supporting pin 101a, 101b and 101c rotate to motion supporting pin position before around its corresponding center, and described supporting pin position forms angle θ with respect to dotted line I, as shown in Figure 11 C.
[0086] like this, supporting pin 101a, 101b and 101c with respect to dotted line I around its corresponding center become angle θ fixing in position in.Under this state, when substrate W was supported by the annular cover 107 that is connected with 101c with supporting pin 101a, 101b, three post 103a, 103b and 103c synchronously promoted, as shown in Figure 11 D.At this moment, post 103 is thus lifted to substrate W and promotes pin 901 positions that are separated from each other.
[0087] under this state, three post 103a, 103b synchronously rotate by identical angle 2 θ, as shown in Figure 11 E along same direction with 103c.By this operation, the substrate W that is supported by the annular cover 107 that is connected with 101c with supporting pin 101a, 101b is along the direction of the correction substrate W position deviation amount of exercise L that moved.This operation is identical with the operation shown in Fig. 2 E.
[0088] three post 103a, 103b and 103c synchronously drop to substrate W and are installed in the position that promotes on the pin 901.Three post 103a, 103b and 103c further synchronously drop to the position that substrate W and annular cover 107 are separated from each other, as shown in Figure 11 F.These positions can be identical with the position in the state shown in Figure 11 b.
[0089] three post 103a, 103b synchronously rotate by identical angle along same direction with 103c, so that position is before prepared in the position correction that these posts are got back among Figure 11 C, that is, make annular cover 107 get back to its initial position, as shown in Figure 11 G.In addition, annular cover 107 is installed on the substrate frame 105 by synchronously reducing by three post 103a, 103b and 103c, as shown in Figure 12 H.Then, substrate W is installed on the substrate frame 105 by reducing lifting pin 901a, 901b and 901c, as shown in Figure 12 I.
[0090] after this, in vacuum chamber, produce plasma, be used to handle substrate W, as shown in Figure 12 J.For substrate W being unloaded to for example another vacuum chamber, substrate feel trim actuator (not shown) unloads this substrate W, as shown in Figure 12 K again promoting substrate W after its transmission location by rising lifting pin 901.
[0091], do not need the interior zone of substrate frame 105 is provided for that post 103 is rotated and the complex mechanism of vertical motion, as second embodiment according to the 3rd embodiment.When temperature control device and static clamping body for example must be provided the interior zone of substrate frame 105, this was highly effective.
[0092] in addition, the substrate aligning equipment according to this embodiment has following structure: corresponding post (comprising supporting pin) and annular cover interconnect or engage.Therefore, the substrate aligning equipment shown in Figure 10 allows the precision of substrate location correction to be higher than the precision of the substrate location correction of the substrate aligning equipment shown in Fig. 8.
(first embodiment)
[0093] though before the method that detects the position deviation of substrate W had been described, will provide more detailed explanation at this with reference to Fig. 2 C.Use the layout of substrate processing apparatus of the present invention hereinafter with reference to Figure 13 and 14 explanation.
[0094] Figure 13 is the perspective schematic view that illustrates according to the substrate processing apparatus 110 of the first embodiment of the present invention.Figure 14 is the conceptual view that detects according to the substrate in the substrate processing apparatus 110 of the first embodiment of the present invention.Substrate processing apparatus 110 according to this embodiment comprises the base treatment chamber 100 that is used for handling in a vacuum substrate.Base treatment chamber 100 accommodates static chucking platform 107, and described static chucking platform 107 keeps substrate W by using the electrostatic attraction chucking.Static chucking platform 107 comprises hoisting mechanism 105, and described hoisting mechanism 105 comprises the lifting pin that attaching becomes can promote.The position deviation detecting unit that is used to detect the position deviation of substrate W is arranged in the outside of base treatment chamber 100.The position deviation detecting unit can have the optical axis that the surface with substrate W extends in parallel.In this embodiment, the two or more optical displacement sensors 101 and 103 such as the optical laser displacement transducer are used as the position deviation detecting unit.Each optical displacement sensor 101 and 103 all comprises light projecting unit and light receiving unit, and as the reflection of light optical displacement sensor that detects by the substrate W reflection.Substrate processing apparatus 110 also comprises control device 200 (referring to Figure 14), this control device 200 is issued substrate transmission unit 202 with the substrate location corrective command, thereby eliminates the position deviation amount between the position of the reference position of substrate W and the substrate W that measured by the position deviation detecting unit.
[0095] when substrate W was positioned at the substrate load/unload position place of static chucking platform 107 tops, hoisting mechanism 105 supported substrate W and be installed on the static chucking platform 107.In contrast, when substrate W was installed on the static chucking platform 107, hoisting mechanism 105 removed substrate W from static chucking platform 107, and promotes this substrate W to the substrate load/unload position.
[0096] in this embodiment, at least two optical displacement sensors 101 and 103 are arranged in the outside of base treatment chamber 100, and measure the position of substrate W by the observation window (not shown), and described observation window is formed in the wall of base treatment chamber 100.Prevent following problem like this: the problem that transducer can damage when running into plasma and handling gas, and the gas of discharging from transducer influences the problem that sticks to suprabasil film unfriendly.The expectation observation window during film forming is handled by movable guard shield or baffle plate protection, so that avoid following situation: along with film adheres on the observation window and during shielded from light, measurement can not be carried out because film forming is handled during measuring. Optical displacement sensor 101 and 103 is arranged such that the light beam 111 from these transducers is oriented surperficial parallel with substrate W.
[0097] should be noted that if each substrate W all has identical external diameter, then only need to use two optical displacement sensors, if but each substrate W has different external diameters, then need to use three or more optical displacement sensors.Though have mutually orthogonal optical axis and never penetrate the time such as the position of the groove of the edge of the substrate of wafer or directed par when two optical displacement sensors are arranged in the light beam 111 that makes from these optical displacement sensors, these two optical displacement sensors can be measured substrate location with full accuracy, but the layout of two optical displacement sensors is not limited.
[0098] optical displacement sensor 101 and 103 is electrically connected to control device 200, as shown in Figure 14.According in advance the storage substrate W reference position information with by optical displacement sensor 101 and 103 measurements the positional information pieces between deviation, control device 200 is dealt into substrate transmission unit 202 with the position correction order.
[0099] explains optical displacement sensor with reference to Figure 15.Each optical displacement sensor 101 and 103 all adopts triangulation, and comprise the combination of light projecting unit and light receiving unit, described smooth projecting unit comprises photocell, and described light receiving unit comprises optical position detecting element (PSD), as shown in Figure 15.Semiconductor laser 301 is as photocell.Light by semiconductor laser 301 emissions is assembled via light projection lens 303, and is guided Measuring Object (substrate) 304, and described semiconductor laser 301 drives by drive circuit 302.By Measuring Object 304 diffusions or regularly beam reflected form focus on optical position detecting element 306 tops ground via optical receiver lens 305.Because focus is with the motion campaign of Measuring Object 304,307 can determine by detecting the focal position to the displacement of Measuring Object 304 from the reference position.Detected thus substrate location information is by signal amplification circuit 308 amplifications and send to control device 200 (referring to Figure 14).
[0100] Figure 16 is the vertical view from the observed substrate processing apparatus in top of substrate W.The substrate W that is positioned at physical location 310 places and the substrate W that is positioned at 309 places, reference position ' depart from, as shown in Figure 16.Control device 200 impels substrate transmission unit 202 transmission substrate W, thereby proofreaies and correct fixed position deviation amount.
[0101] optical displacement sensor 101 and 103 has the optical axis that extends abreast with the surface of substrate W.Needn't advance at grade by optical displacement sensor 101 and 103 emitted light beams 111 always.
[0102] explains when substrate W with reference to Figure 17 A, 17B and 17C and tighten the operation of the position that is used to detect substrate W when platform 107 removes from static.
[0103] optical displacement sensor 101 and 103 is launched light beam 111 always, as shown in Figure 17 A.In this state, hoisting mechanism 105 is being lower than the height place standby that static chucking platform 107 is used for the surface of substrate W.In this state, static chucking platform 107 just produces electrostatic attraction when applying voltage equally.Carrying out film forming when substrate W is kept by this electrostatic attraction and passes through the rotation of rotating mechanism (not shown) handles.After film forming is finished dealing with, also finish to apply voltage to static chucking platform 107.
[0104] hoisting mechanism 105 is activated and rises when keeping substrate W, as shown in Figure 17 B.At this moment, when the substrate W that removes from static chucking platform 107 arrived position by an optical displacement sensor 101 emitted light beams 111, optical displacement sensor 101 was just measured the position of substrate W with respect to transducer 101 in the light time that receives by the reflection of the periphery surface of substrate W.
[0105] when the substrate W that removes from static chucking platform 107 arrives position by another optical displacement sensor 103 emitted light beams 111, optical displacement sensor 103 is just measured the position of substrate W with respect to transducer 103 in the light time that receives by the reflection of the periphery surface of substrate W, as shown in Figure 17 C.
[0106] control device 200 is based on the position that can determine substrate W by optical displacement sensor 101 and the 103 relative position information pieces of measuring.
[0107] after this, the substrate W that has arrived the substrate transferring position is transferred to the outside of base treatment chamber 100 by substrate transmission unit 202, shift by carrying out substrate at described substrate transferring position place, as shown in Figure 17 D such as the substrate transmission unit 202 of transmission manipulator.
[0108] at this moment, if the positional information of the substrate W of determining by above-mentioned control device 200 and reference substrate position deviation predetermined threshold or more, then substrate transmission unit 202 just stops preventing any fault, for example owing to the fault in substrate is shifted causes substrate to fall.Yet, if the positional information of the substrate W of being determined by control device 200 is so not many with the reference substrate position deviation, then control device 200 can use substrate transmission unit 202 obtain substrate W substrate is transferred to substrate transmission unit 202 by the position of proofreading and correct substrate.
[0109] though optical displacement sensor 101 and 103 is arranged in the outside of base treatment chamber 100 in the above-described embodiments, the layout of these transducers is not limited, and can be arranged in the inside of base treatment chamber 100.
(second embodiment)
[0110] adopt transmission optics displacement transducer 201 and 203 as the example that is used for position deviation detecting unit of the present invention with reference to Figure 18,19,20 and 21 explanations.Should be noted that with above-mentioned first embodiment in identical Reference numeral represent same composed component in a second embodiment, and will not provide its detailed description.
[0111] Figure 18 is the perspective view that base treatment chamber 100 is shown.Optical displacement sensor 201 and 203 is arranged in the outside of base treatment chamber 100, as shown in Figure 18.Pass the window (not shown) that is formed in the base treatment chamber 100 by the light projecting unit 201a of optical displacement sensor 201 and 203 and the linear light beam 222 of 203a emission, and the space by static chucking platform 107 tops enters collimated ray transducer 201b and 203b, and described collimated ray transducer 201b and 203b are as the light receiving unit of optical displacement sensor 201 and 203.Cross linear light beam 222 by the substrate W that hoisting mechanism 105 is upwards mentioned, detect the position of substrate W thus, as the foregoing description.
[0112] explains with in this embodiment optical displacement sensor 201 and 203 measuring principle with reference to Figure 19 A and 19B.Each optical displacement sensor 201 and 203 all comprises the light receiving unit 810 that is used to throw the light projecting unit 815 of linear light beam and is used for receiving beam, shown in Figure 19 A and 19B.
[0113] is collimated into even, parallel, linear light beam at the light projection window by rectangle 816 during with collimator lens 504 by the light of the laser diode in the light projecting unit 815 (semiconductor Laser device) 502 emission, and is guided Measuring Object 801 and light receiving unit 810.At this moment, shade imaging on one dimension imageing sensor (that is the linear transducer) 602 of light receiving unit 810 of throwing by Measuring Object 801.One dimension imageing sensor 602 for example comprises a plurality of photodiodes or CCD (charge coupled device), and the amount of the light that output is received as the signal of telecommunication, and described photodiode or CCD form by arranging a plurality of light receiving units (pixel) linearly.In the situation of Figure 19 A and 19B, light receiving unit (pixel) comprises N pixel.
[0114] signal of exporting from the pixel of one dimension imageing sensor 602 sends to the signal processing circuit (not shown) by amplifier 813 subsequently.Signal processing circuit detects the edge E1 of Measuring Object 801 and the position of E2 based on the distribution according to the resulting light quantity of exporting from one dimension imageing sensor 602 of signal.Signal processing circuit is determined the size A1 of Measuring Object 801 with reference to edge E1 and E2.
[0115] size of the optical receiving region on the one dimension imageing sensor 602 for example approximately is 35mm width * 7 μ m height.Two edge E1 and E2 can be detected being used for the less Measuring Object 801 shown in Figure 19 A, and an edge can be only detected to be used for bigger substrate (external diameter) with 300mm.In addition, the detection of substrate location needs to measure along two different directions at least.
[0116] these collimated ray transducers needed to be arranged on light projection side and the light-receiving side both sides before using, and this is opposite with above-mentioned anacamptics displacement transducer.Yet these collimating optical fibre transducers can combine with the vertical operation of the substrate surface that uses hoisting mechanism 105, detect the periphery surface of substrate reliably and are not subjected to the influence of surface state of the periphery surface of substrate.
[0117] optical displacement sensor 201 is applied to light receiving unit 201b with linear light beam 222 from light projecting unit 201a always constantly, as shown in Figure 20.When hoisting mechanism 105 lifting/reduction substrate W, linear light beam 222 is mapped to the edge of substrate W at certain some place during operation, and is partly shielded, and makes only unscreened light beam 222a arrive light receiving unit 201b.Based on the information of the light quantity distribution of resultant light beam and measure from the lateral reference position (or edge) of linear light beam to the distance of substrate W.
[0118] Figure 21 is from the vertical view of the observed substrate W in substrate top when two optical displacement sensors 201 and 203 detection position deviations.The substrate W that is positioned at actual base position 803 and the substrate W that is positioned at reference substrate position 802 ' depart from, as shown in Figure 21.Control device 200 impels substrate transmission unit 202 transmission substrate W, thereby proofreaies and correct the amount of fixed position deviation.Should be noted that the periphery surface in the substrate W at 802 places, reference substrate position is positioned at the position of aiming at the outer surface of linear light beam 222.
[0119] in this embodiment, be applied to the linear light beam 222 of light receiving unit 201b and needn't advance at grade always from light projecting unit 201a from the linear light beam 222 that collimated ray transducer 203a is applied to collimated ray transducer 203b.
[0120] though is arranged in the light beam that makes from optical displacement sensor 201 and 203 when having mutually orthogonal optical axis and never penetrating when two optical displacement sensors in the groove of the edge of substrate or the position on the directed par, optical displacement sensor 201 and 203 can be measured substrate location with full accuracy, but not limited by the direction relations between the linear light beam 222 of optical displacement sensor 201 and 203 emissions.
[0121] operation of the position probing among this embodiment is identical with first embodiment basically.Briefly, when two optical displacement sensors 201 and 203 emission linear light beams 222, hoisting mechanism 105 is activated and rises in support base W, as shown in Figure 18.When the substrate W that removes from static chucking platform 107 arrived the height of the linear light beam of being launched by the light projecting unit of an optical displacement sensor 201 222, the light receiving unit of optical displacement sensor 201 was measured the position of the periphery surface of substrate W with respect to linear light beam 222.
[0122] when the substrate W that removes from static chucking platform 107 further rose and arrives the height of the linear light beam of being launched by another collimating optics displacement transducer 203 222, optical displacement sensor 203 was measured the position of the periphery surface of substrate W with respect to linear light beam 222.
[0123] control device 200 can be determined the position of substrate W based on the relative position information piece of the substrate that measures by optical displacement sensor 201 and 203.
[0124] after this, the substrate W that has arrived the substrate transferring position is transferred to the outside of base treatment chamber 100 by substrate transmission unit 202, shifts by carrying out substrates such as the substrate transmission unit 202 of transmission manipulator at described substrate transferring position place.
[0125] at this moment, if positional information and the reference substrate position deviation of the substrate W of being determined by above-mentioned control device 200 are very big, then substrate transmission unit 202 stops preventing fault, for example owing to the fault in the substrate transfer causes substrate to fall.Yet, if the positional information of the substrate W of being determined by control device 200 is so not many with the reference substrate position deviation, then control device 200 can use substrate transmission unit 202 obtain substrate W substrate is transferred to substrate transmission unit 202 by the position of proofreading and correct substrate.
[0126] though, is to be understood that the present invention is not limited by disclosed exemplary embodiments with reference to exemplary embodiments explanation the present invention.The scope of following claim will be consistent with broad interpretation, thereby comprise all such modifications and equivalent structure and function.
Claims (10)
1. one kind is used for substrate aligning equipment that substrate is aimed at reference point, and this equipment comprises:
A plurality of posts, it is configured to around the rotation rotation parallel with corresponding axial direction;
Driving mechanism, it is configured to make described a plurality of post synchronously to rotate by identical angle along equidirectional;
Detector, it is configured to detect the amount of the position deviation that described substrate departs from from described reference point; And
Supporting pin, it is positioned on the upper surface of described a plurality of posts and is simultaneously spaced apart with the corresponding rotation of described a plurality of posts, and is configured to support described substrate,
Wherein, synchronously rotate by identical angle along equidirectional, and described substrate is aimed at by make described a plurality of post by described driving mechanism based on amount by the detected position deviation of described detector.
2. equipment according to claim 1, wherein
Described detector configurations becomes to detect the direction of motion and the amount of exercise L of described substrate, and
Suppose described supporting pin before motion with the post exercise position around vertical with the described direction of motion and be axisymmetric through the dotted line of the pivot of described post, aim at by make described substrate with lower angle by making described a plurality of post rotation:
2θ＝2sin
-1(L/2R)
Wherein R is the distance between the center of the rotation of described post and described supporting pin, and θ is the angle that forms between described dotted line and the following straight line, described straight line through described supporting pin before motion and the center of one of post exercise center and described post.
3. equipment according to claim 2, wherein before the aligning of described substrate, each in described a plurality of posts all rotates to the position of described supporting pin under the situation that does not support described substrate before the motion, and described position and described dotted line form angle θ.
4. equipment according to claim 1, wherein said supporting pin has one of hemispheric far-end and conical far-end.
5. equipment according to claim 1, the two can both freely rotate wherein said supporting pin and described post around the rotation parallel with the axial direction of described supporting pin.
6. equipment according to claim 1, wherein said supporting pin is positioned at the zone on the described post.
7. equipment according to claim 1 also comprises:
Substrate frame, it is configured to keep described substrate, and
Annular cover, it is configured to protect described substrate frame,
Wherein said a plurality of post is positioned at the outside of described substrate frame, and described annular cover is configured to rise according to the rise of described a plurality of posts when supporting described substrate, so that aim at described substrate by described annular cover.
8. equipment according to claim 1 also comprises:
Substrate frame, it is configured to keep described substrate, and
Annular cover, it is configured to protect described substrate frame,
Wherein
Described a plurality of post is positioned at the outside of described substrate frame,
Described a plurality of supporting pin can be freely around the rotation rotation parallel with its axial direction, and described a plurality of post can be freely around the rotation rotation parallel with its axial direction, and
Described a plurality of supporting pin is connected to described annular cover, and described annular cover is configured to rise according to the rise of described a plurality of posts when supporting described substrate, so that aim at described substrate by described annular cover.
9. equipment according to claim 1 also comprises:
Substrate frame, it is configured to keep described substrate, and
Annular cover, it is configured to protect described substrate frame,
Wherein
Described a plurality of post is positioned at the outside of described substrate frame,
Described a plurality of supporting pin can freely rotate with respect to described annular cover,
Described a plurality of supporting pin is connected to described a plurality of post, and
Described annular cover is configured to rise according to the rise of described a plurality of posts when supporting described substrate, so that aim at described substrate by described annular cover.
10. a substrate processing apparatus comprises substrate aligning equipment according to claim 1.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008197603 | 2008-07-31 | ||
| JP2008197603 | 2008-07-31 | ||
| JP2008228343 | 2008-09-05 | ||
| JP2009156298 | 2009-06-30 |
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| Publication Number | Publication Date |
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| CN101640181A true CN101640181A (en) | 2010-02-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910159687A Pending CN101640181A (en) | 2008-07-31 | 2009-07-31 | Substrate alignment apparatus and substrate processing apparatus |
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| CN101996919A (en) * | 2009-08-25 | 2011-03-30 | 佳能安内华股份有限公司 | Substrate holding apparatus, mask alignment method, and vacuum processing apparatus |
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| CN105609449A (en) * | 2016-02-29 | 2016-05-25 | 京东方科技集团股份有限公司 | Machine for automatically calibrating substrate position and semiconductor processing equipment |
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