SG11201802520YA - Wafer inspection method and wafer inspection device - Google Patents

Wafer inspection method and wafer inspection device

Info

Publication number
SG11201802520YA
SG11201802520YA SG11201802520YA SG11201802520YA SG11201802520YA SG 11201802520Y A SG11201802520Y A SG 11201802520YA SG 11201802520Y A SG11201802520Y A SG 11201802520YA SG 11201802520Y A SG11201802520Y A SG 11201802520YA SG 11201802520Y A SG11201802520Y A SG 11201802520YA
Authority
SG
Singapore
Prior art keywords
wafer inspection
inspection device
inspection method
wafer
inspection
Prior art date
Application number
SG11201802520YA
Inventor
Hiroshi Yamada
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG11201802520YA publication Critical patent/SG11201802520YA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects
    • G01R31/287—Procedures; Software aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
SG11201802520YA 2015-09-30 2016-07-11 Wafer inspection method and wafer inspection device SG11201802520YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015194390A JP6515007B2 (en) 2015-09-30 2015-09-30 Wafer inspection method and wafer inspection apparatus
PCT/JP2016/070923 WO2017056643A1 (en) 2015-09-30 2016-07-11 Wafer inspection method and wafer inspection device

Publications (1)

Publication Number Publication Date
SG11201802520YA true SG11201802520YA (en) 2018-04-27

Family

ID=58423417

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201802520YA SG11201802520YA (en) 2015-09-30 2016-07-11 Wafer inspection method and wafer inspection device

Country Status (7)

Country Link
US (1) US10416229B2 (en)
JP (1) JP6515007B2 (en)
KR (1) KR102012608B1 (en)
CN (1) CN108140590B (en)
SG (1) SG11201802520YA (en)
TW (1) TWI720019B (en)
WO (1) WO2017056643A1 (en)

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FR3052869B1 (en) * 2016-06-17 2018-06-22 Unity Semiconductor DEVICE FOR POSITIONING AN INTEGRATED CIRCUIT PLATE, AND APPARATUS FOR INSPECTING AN INTEGRATED CIRCUIT PLATE COMPRISING SUCH A POSITIONING DEVICE
US10840121B2 (en) 2016-10-31 2020-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for unpacking semiconductor wafer container
KR102367037B1 (en) * 2017-06-21 2022-02-24 도쿄엘렉트론가부시키가이샤 inspection system
JP7174316B2 (en) * 2018-02-26 2022-11-17 株式会社東京精密 load distribution plate
JP2020047860A (en) * 2018-09-20 2020-03-26 東京エレクトロン株式会社 Inspection device and inspection method
JP7101577B2 (en) * 2018-09-21 2022-07-15 株式会社日本マイクロニクス Inspection method and inspection system
JP7257880B2 (en) * 2019-05-23 2023-04-14 東京エレクトロン株式会社 Test Wafer and Test Method
JP7267111B2 (en) * 2019-05-31 2023-05-01 東京エレクトロン株式会社 Positioning mechanism and positioning method
JP6906128B2 (en) * 2019-06-26 2021-07-21 末晴 宮川 Wafer test equipment
JP7281981B2 (en) 2019-06-27 2023-05-26 東京エレクトロン株式会社 How to preheat the prober and probe card
JP7458161B2 (en) * 2019-09-24 2024-03-29 東京エレクトロン株式会社 Inspection device control method and inspection device
JP7412208B2 (en) * 2020-02-17 2024-01-12 東京エレクトロン株式会社 Conveyance device, processing system and conveyance method
KR20210115439A (en) 2020-03-13 2021-09-27 손서용 Shuttlecock automatic collection and stacking device

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
JP3219844B2 (en) * 1992-06-01 2001-10-15 東京エレクトロン株式会社 Probe device
JPH0621166A (en) * 1992-06-30 1994-01-28 Mitsubishi Electric Corp Wafer prober
JPH11251379A (en) * 1998-02-27 1999-09-17 Toshiba Microelectronics Corp Wafer probing device
WO2002103775A1 (en) * 2001-06-18 2002-12-27 Advantest Corporation Probe contact system having plane adjusting mechanism
JP2006258687A (en) * 2005-03-18 2006-09-28 Koyo Technos:Kk Inspection device
US7764076B2 (en) * 2007-02-20 2010-07-27 Centipede Systems, Inc. Method and apparatus for aligning and/or leveling a test head
JP5295588B2 (en) * 2008-02-28 2013-09-18 東京エレクトロン株式会社 Probe card tilt adjustment method, probe card tilt detection method, and program recording medium recording probe card tilt detection method
JP5889581B2 (en) * 2010-09-13 2016-03-22 東京エレクトロン株式会社 Wafer inspection equipment
JP2013175572A (en) * 2012-02-24 2013-09-05 Tokyo Electron Ltd Probe device and parallelism adjustment mechanism of probe card
JP6031292B2 (en) * 2012-07-31 2016-11-24 東京エレクトロン株式会社 Board contact method to probe card
JP6099347B2 (en) 2012-10-03 2017-03-22 東京エレクトロン株式会社 Wafer mounting method and wafer inspection apparatus
JP2014115115A (en) * 2012-12-06 2014-06-26 Advantest Corp Correction device, probe device and test device
CN104280651B (en) * 2013-07-10 2018-08-17 晶豪科技股份有限公司 Test system and semiconductor element
JP5737536B2 (en) * 2013-11-21 2015-06-17 株式会社東京精密 Prober
JP6423660B2 (en) * 2014-09-09 2018-11-14 東京エレクトロン株式会社 Method for determining pressure setting value for inspection in wafer inspection apparatus
JP5747428B2 (en) * 2015-02-06 2015-07-15 株式会社東京精密 Positioning and fixing device
US9927463B2 (en) * 2015-10-20 2018-03-27 International Business Machines Corporation Wafer probe alignment

Also Published As

Publication number Publication date
TWI720019B (en) 2021-03-01
KR102012608B1 (en) 2019-08-20
KR20180043814A (en) 2018-04-30
US10416229B2 (en) 2019-09-17
WO2017056643A1 (en) 2017-04-06
CN108140590A (en) 2018-06-08
CN108140590B (en) 2022-05-17
JP2017069428A (en) 2017-04-06
TW201727242A (en) 2017-08-01
US20180275192A1 (en) 2018-09-27
JP6515007B2 (en) 2019-05-15

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