SG11201707198YA - Wafer dryer apparatus and method - Google Patents

Wafer dryer apparatus and method

Info

Publication number
SG11201707198YA
SG11201707198YA SG11201707198YA SG11201707198YA SG11201707198YA SG 11201707198Y A SG11201707198Y A SG 11201707198YA SG 11201707198Y A SG11201707198Y A SG 11201707198YA SG 11201707198Y A SG11201707198Y A SG 11201707198YA SG 11201707198Y A SG11201707198Y A SG 11201707198YA
Authority
SG
Singapore
Prior art keywords
dryer apparatus
wafer dryer
wafer
dryer
Prior art date
Application number
SG11201707198YA
Inventor
Scott Tice
Original Assignee
Mei Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mei Llc filed Critical Mei Llc
Publication of SG11201707198YA publication Critical patent/SG11201707198YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
    • F26B15/02—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in the whole or part of a circle
    • F26B15/08—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in the whole or part of a circle in a vertical plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/02—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air
    • F26B3/04—Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air the gas or vapour circulating over or surrounding the materials or objects to be dried
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
SG11201707198YA 2015-03-10 2016-03-03 Wafer dryer apparatus and method SG11201707198YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562131172P 2015-03-10 2015-03-10
PCT/US2016/020764 WO2016144710A1 (en) 2015-03-10 2016-03-03 Wafer dryer apparatus and method

Publications (1)

Publication Number Publication Date
SG11201707198YA true SG11201707198YA (en) 2017-10-30

Family

ID=56878972

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201707198YA SG11201707198YA (en) 2015-03-10 2016-03-03 Wafer dryer apparatus and method

Country Status (8)

Country Link
US (2) US9829249B2 (en)
EP (1) EP3268986B1 (en)
KR (1) KR102506665B1 (en)
MY (1) MY177638A (en)
PH (1) PH12017501628A1 (en)
SG (1) SG11201707198YA (en)
TW (1) TWI723981B (en)
WO (1) WO2016144710A1 (en)

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US9829249B2 (en) * 2015-03-10 2017-11-28 Mei, Llc Wafer dryer apparatus and method
US10971354B2 (en) 2016-07-15 2021-04-06 Applied Materials, Inc. Drying high aspect ratio features
US10546762B2 (en) * 2016-11-18 2020-01-28 Applied Materials, Inc. Drying high aspect ratio features
JP7055467B2 (en) * 2017-09-08 2022-04-18 エーシーエム リサーチ （シャンハイ） インコーポレーテッド Cleaning method and cleaning equipment for semiconductor wafers
CA3018134C (en) * 2017-09-19 2023-10-31 Resource Rental Tools, LLC In-line mud screen manifold useful in downhole applications
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CN108831849A (en) * 2018-06-25 2018-11-16 清华大学 Wafer drying device and drying means based on hot kalimeris brother Buddhist nun effect
US10782742B1 (en) 2018-08-14 2020-09-22 Apple Inc. Electronic device that uses air pressure to remove liquid
US11923210B2 (en) * 2018-08-30 2024-03-05 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for in-situ Marangoni cleaning
US10767927B2 (en) * 2018-09-07 2020-09-08 Apple Inc. Systems for increased drying of speaker and sensor components that are exposed to moisture
US11221179B2 (en) * 2018-10-26 2022-01-11 E. & J. Gallo Winery Low profile design air tunnel system and method for providing uniform air flow in a refractance window dryer
CN111211043B (en) * 2020-02-27 2022-10-18 至微半导体(上海)有限公司 Drying method for improving wafer drying efficiency
CN111312581B (en) * 2020-02-27 2022-07-15 至微半导体(上海)有限公司 Exhaust method capable of improving wafer drying efficiency
CN111312580B (en) * 2020-02-27 2022-07-15 至微半导体(上海)有限公司 Micro-amplitude vibration method for high aspect ratio graphic wafer
CN111765724B (en) * 2020-07-13 2021-01-22 桐庐益乡源农产品有限公司 Processing system and processing technology for cleaned agricultural products
JP7458930B2 (en) * 2020-08-03 2024-04-01 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus
CN111983430A (en) * 2020-08-26 2020-11-24 西安奕斯伟硅片技术有限公司 Wafer surface treatment device and wafer surface anion and cation sampling method
CN112992656B (en) * 2021-02-09 2022-01-25 江苏亚电科技有限公司 Semiconductor wafer cleaning and drying method
CN114322468A (en) * 2022-03-10 2022-04-12 广州粤芯半导体技术有限公司 Wafer drying method
CN116313882A (en) * 2022-09-08 2023-06-23 上海至纯洁净系统科技股份有限公司 Liquid tension control method capable of improving wafer drying efficiency

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Also Published As

Publication number Publication date
KR20170122271A (en) 2017-11-03
EP3268986A1 (en) 2018-01-17
PH12017501628A1 (en) 2018-02-12
TW201637738A (en) 2016-11-01
US20160265846A1 (en) 2016-09-15
EP3268986B1 (en) 2020-04-22
WO2016144710A1 (en) 2016-09-15
TWI723981B (en) 2021-04-11
MY177638A (en) 2020-09-23
US9829249B2 (en) 2017-11-28
KR102506665B1 (en) 2023-03-07
US10473396B2 (en) 2019-11-12
US20180031317A1 (en) 2018-02-01
EP3268986A4 (en) 2018-11-07

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