SG11201802518XA - Wafer inspection device and wafer inspection method - Google Patents
Wafer inspection device and wafer inspection methodInfo
- Publication number
- SG11201802518XA SG11201802518XA SG11201802518XA SG11201802518XA SG11201802518XA SG 11201802518X A SG11201802518X A SG 11201802518XA SG 11201802518X A SG11201802518X A SG 11201802518XA SG 11201802518X A SG11201802518X A SG 11201802518XA SG 11201802518X A SG11201802518X A SG 11201802518XA
- Authority
- SG
- Singapore
- Prior art keywords
- wafer inspection
- inspection device
- inspection method
- wafer
- inspection
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015194389A JP6652361B2 (en) | 2015-09-30 | 2015-09-30 | Wafer inspection apparatus and wafer inspection method |
| PCT/JP2016/071464 WO2017056654A1 (en) | 2015-09-30 | 2016-07-14 | Wafer inspection device and wafer inspection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201802518XA true SG11201802518XA (en) | 2018-04-27 |
Family
ID=58423507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201802518XA SG11201802518XA (en) | 2015-09-30 | 2016-07-14 | Wafer inspection device and wafer inspection method |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10557868B2 (en) |
| JP (1) | JP6652361B2 (en) |
| KR (1) | KR102013085B1 (en) |
| CN (1) | CN108140591B (en) |
| SG (1) | SG11201802518XA (en) |
| TW (1) | TWI703655B (en) |
| WO (1) | WO2017056654A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10840121B2 (en) | 2016-10-31 | 2020-11-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for unpacking semiconductor wafer container |
| JP6783185B2 (en) * | 2017-05-15 | 2020-11-11 | 東京エレクトロン株式会社 | Inspection equipment |
| JP6861580B2 (en) | 2017-06-05 | 2021-04-21 | 東京エレクトロン株式会社 | Inspection equipment and inspection system |
| JP6887332B2 (en) * | 2017-07-19 | 2021-06-16 | 東京エレクトロン株式会社 | Inspection system |
| JP2020009978A (en) * | 2018-07-12 | 2020-01-16 | 東京エレクトロン株式会社 | Circuit device, tester, inspection device, and method for adjusting warpage of circuit board |
| TWI666454B (en) * | 2018-07-13 | 2019-07-21 | 中華精測科技股份有限公司 | High frequency probe card device |
| JP2020047860A (en) * | 2018-09-20 | 2020-03-26 | 東京エレクトロン株式会社 | Inspection device and inspection method |
| JP7217636B2 (en) * | 2019-01-16 | 2023-02-03 | 東京エレクトロン株式会社 | Chuck top, inspection device, and chuck top recovery method |
| CN109633220B (en) * | 2019-01-29 | 2021-08-24 | 江阴佳泰电子科技有限公司 | Pre-blowing and washing type wafer probe station |
| CN112309889A (en) * | 2019-08-02 | 2021-02-02 | 合肥晶合集成电路股份有限公司 | Substrate detection device and detection method thereof |
| JP7458161B2 (en) * | 2019-09-24 | 2024-03-29 | 東京エレクトロン株式会社 | Inspection device control method and inspection device |
| JP7437991B2 (en) * | 2020-03-25 | 2024-02-26 | 東京エレクトロン株式会社 | Inspection device and chuck top position adjustment method |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3401801B2 (en) | 1992-06-17 | 2003-04-28 | 株式会社日立製作所 | Ion beam equipment |
| JPH0621166A (en) * | 1992-06-30 | 1994-01-28 | Mitsubishi Electric Corp | Wafer prober |
| JP3313085B2 (en) | 1998-06-02 | 2002-08-12 | 日本電産リード株式会社 | Substrate inspection apparatus and relative position adjustment method between substrate and inspection head in substrate inspection apparatus |
| JP4134289B2 (en) * | 2002-05-29 | 2008-08-20 | 東京エレクトロン株式会社 | Probe card transport device and adapter |
| JP4300003B2 (en) * | 2002-08-07 | 2009-07-22 | 東京エレクトロン株式会社 | Mounting table driving apparatus and probe method |
| CN101019473A (en) * | 2004-05-20 | 2007-08-15 | 纳米纳克斯公司 | High density interconnect system having rapid fabrication cycle |
| JP2006186130A (en) | 2004-12-28 | 2006-07-13 | Matsushita Electric Ind Co Ltd | Semiconductor test device |
| JP4685559B2 (en) * | 2005-09-09 | 2011-05-18 | 東京エレクトロン株式会社 | Method for adjusting parallelism between probe card and mounting table, inspection program storage medium, and inspection apparatus |
| US7365553B2 (en) * | 2005-12-22 | 2008-04-29 | Touchdown Technologies, Inc. | Probe card assembly |
| JP5295588B2 (en) * | 2008-02-28 | 2013-09-18 | 東京エレクトロン株式会社 | Probe card tilt adjustment method, probe card tilt detection method, and program recording medium recording probe card tilt detection method |
| CN102301462A (en) * | 2009-02-12 | 2011-12-28 | 株式会社爱德万测试 | Semiconductor Wafer Testing Apparatus |
| TWI402932B (en) * | 2009-05-27 | 2013-07-21 | Star Techn Inc | Probing apparatus with multiaxial stages for testing semiconductor devices |
| JP5889581B2 (en) * | 2010-09-13 | 2016-03-22 | 東京エレクトロン株式会社 | Wafer inspection equipment |
| JP6099347B2 (en) | 2012-10-03 | 2017-03-22 | 東京エレクトロン株式会社 | Wafer mounting method and wafer inspection apparatus |
-
2015
- 2015-09-30 JP JP2015194389A patent/JP6652361B2/en active Active
-
2016
- 2016-07-14 CN CN201680058180.6A patent/CN108140591B/en active Active
- 2016-07-14 SG SG11201802518XA patent/SG11201802518XA/en unknown
- 2016-07-14 US US15/763,723 patent/US10557868B2/en active Active
- 2016-07-14 KR KR1020187008287A patent/KR102013085B1/en active IP Right Grant
- 2016-07-14 WO PCT/JP2016/071464 patent/WO2017056654A1/en active Application Filing
- 2016-09-26 TW TW105131070A patent/TWI703655B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| KR102013085B1 (en) | 2019-08-21 |
| JP6652361B2 (en) | 2020-02-19 |
| JP2017069427A (en) | 2017-04-06 |
| WO2017056654A1 (en) | 2017-04-06 |
| TWI703655B (en) | 2020-09-01 |
| CN108140591B (en) | 2022-04-22 |
| TW201731000A (en) | 2017-09-01 |
| CN108140591A (en) | 2018-06-08 |
| US20180299487A1 (en) | 2018-10-18 |
| KR20180043815A (en) | 2018-04-30 |
| US10557868B2 (en) | 2020-02-11 |
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