CN115547915B - Wafer exposure clamp and exposure device - Google Patents
Wafer exposure clamp and exposure device Download PDFInfo
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- CN115547915B CN115547915B CN202211497707.9A CN202211497707A CN115547915B CN 115547915 B CN115547915 B CN 115547915B CN 202211497707 A CN202211497707 A CN 202211497707A CN 115547915 B CN115547915 B CN 115547915B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
A wafer exposure clamp and an exposure device belong to the technical field of wafer production equipment, the exposure clamp comprises a bottom plate and a mask frame, and a mask sheet is arranged on the bottom surface of the mask frame. The bottom of bottom plate has been seted up and has been run through the groove, runs through the front and back terminal surface of groove perpendicular to bottom plate, and the bar hole has all been seted up to the front and back terminal surface of bottom plate, and the bar hole with run through the groove intercommunication, the telescopic link is all worn to be equipped with perpendicularly in the both sides of bottom plate, the front end of telescopic link is located and runs through the inslot, the rear end of telescopic link has the draw-in groove, the extending direction of draw-in groove is parallel with running through the groove. On the bottom plate was located to the mask frame, the bottom surface of mask frame corresponded the telescopic link and all was equipped with connecting portion, and connecting portion sliding connection is in the back end of telescopic link, and the telescopic link removes the setting along length direction, drives the direction removal of mask frame along the perpendicular to bottom plate simultaneously. The exposure device comprises a feeding mechanism, a conveying mechanism and the exposure clamp of the exposure machine. The exposure clamp has good positioning and clamping effects on the wafer, and the exposure device can greatly improve the production efficiency.
Description
Technical Field
The invention belongs to the technical field of wafer production equipment, and particularly relates to a wafer exposure clamp and an exposure device.
Background
The wafer exposure is to transfer the image information on the mask to the surface of the wafer coated with the photosensitive material by using an exposure machine, so as to form a circuit pattern on the surface of the wafer. In the existing wafer exposure process, a negative pressure sucking disc is mainly used for sucking a wafer, then the relative position between the wafer and a mask is adjusted and calibrated manually, then the mask is completely covered on the wafer, finally, the sucking disc and the wafer are placed into an exposure machine together manually, after the wafer is exposed, the sucking disc and the wafer are taken out together manually, and the wafer is taken out manually by uncovering the mask manually. The whole process has high manual participation and low automatic production process, so that the production efficiency is too low; on the other hand, the wafer and the mask are adsorbed by negative pressure to fix the relative position between the wafer and the mask, so that once the air pressure changes, the relative position between the wafer and the mask is easily changed, and image position deviation and even the wafer is scrapped.
Disclosure of Invention
In order to solve the defects of the prior art, the invention provides the wafer exposure clamp and the exposure device, the exposure clamp has good positioning and clamping effects on the wafer, the position between the wafer and the mask can be effectively prevented from changing, the exposure device has higher automation degree, and the production efficiency can be greatly improved.
In order to realize the purpose of the invention, the following scheme is adopted:
a wafer exposure clamp comprises a bottom plate and a mask frame, wherein a mask sheet is arranged on the bottom surface of the mask frame. The bottom of bottom plate has been seted up and has been run through the groove for pass the part that shifts the wafer, run through the groove perpendicular to bottom plate terminal surface around, the bar hole has all been seted up to the terminal surface around the bottom plate, be used for through the wafer, and the bar hole with run through the groove intercommunication, the telescopic link is all worn to be equipped with perpendicularly in the both sides of bottom plate, the front end of telescopic link is located and runs through the inslot, the rear end of telescopic link has the draw-in groove, the extending direction and the running through groove of draw-in groove are parallel.
The top surface of bottom plate is located to the mask frame, and the bottom surface of mask frame corresponds the telescopic link and all is equipped with connecting portion, connecting portion sliding connection in the back end of telescopic link, and the telescopic link removes the setting along length direction to the telescopic link drives the direction removal of mask frame along the perpendicular to bottom plate when removing.
When the front end surface of the telescopic rod and the inner side wall of the through groove are in the same plane, the rear end surface of the telescopic rod is positioned in the side surface of the bottom plate, and the position of the mask sheet is higher than the height of the top surface of the strip-shaped hole; when the telescopic rod moves for a preset distance to the outer side of the bottom plate, the clamping groove protrudes out of the side face of the bottom plate, and the mask frame and the mask sheet move for a preset height together along the direction perpendicular to the bottom plate, so that the mask sheet compresses the wafer.
Further, the both sides of bottom plate are equipped with two telescopic links respectively, and link to each other through a horizontal pole with the front end of two telescopic links of one side, and the rear end of telescopic link links to each other through a shaped plate, and when the bar shaped plate was located the side of bottom plate, the horizontal pole was in the coplanar towards the outer wall that runs through groove one side and the inside wall that runs through the groove, and the bar shaped plate is L type structure, has the space between its upper segment and the rear end face of telescopic link, and this space is the draw-in groove.
Furthermore, the back end top of the telescopic rod is provided with a guide inclined plane, the guide inclined plane inclines towards the middle part above the bottom plate, the top surface of the guide inclined plane is provided with a T-shaped groove, the T-shaped groove is of an inclined structure, the upper section of the T-shaped groove inclines towards the upper part of the outer side of the bottom plate, the lower section of the T-shaped groove inclines towards the lower part of the middle part of the bottom plate, the connecting part comprises an inclined block, the bottom surface of the inclined block is arranged on the guide inclined plane in a sliding mode, a T-shaped sliding block is arranged at the bottom of the inclined block, and the T-shaped sliding block is arranged in the T-shaped groove in a sliding mode.
An exposure device comprises a feeding mechanism, a conveying mechanism and the exposure clamp of an exposure machine;
the conveying mechanism comprises a pair of rails which are arranged in parallel and used for conveying the exposure clamp, the through groove is parallel to the rails during conveying, the rails comprise a conveying part arranged below the exposure clamp and side walls on two sides, an avoiding groove is formed in the inner side of each side wall of each rail along the extending direction and used for accommodating telescopic rods protruding out of two sides of the bottom plate, a limiting strip is arranged on the inner top surface of each avoiding groove and used for being connected with a clamping groove, and a first notch is formed in the position, located at the front end of each rail, of each limiting strip and used for allowing the limiting strip to penetrate through the telescopic rods;
the exposure machine is arranged above the middle section of the track;
feeding mechanism includes the sucking disc, vision detector and adjustment mechanism, the orbital top is located to the vision detector corresponding first breach, orbital below is all located to sucking disc and adjustment mechanism corresponding first breach, the sucking disc is used for adsorbing the wafer, the bottom of sucking disc is the back taper structure, and the coaxial air duct that is equipped with of awl top department, the external diameter of air duct is less than the width that runs through the groove, and be less than the minimum interval between the bottom plate both sides telescopic link front end, the external diameter of sucking disc is greater than the external diameter of air duct, and be less than or equal to the biggest interval between the bottom plate both sides telescopic link front end, adjustment mechanism is used for controlling the sucking disc and removes.
Furthermore, the tail end of the avoiding groove does not penetrate through the rear end of the track, and a second notch is formed at the tail end of the limiting strip corresponding to the avoiding groove.
Furthermore, the junction of the side wall of the avoiding groove corresponding to the tail end of the second notch and the inner wall of the side wall of the track is provided with a transition inclined plane.
Further, conveying mechanism still includes windrow mechanism, it includes a pair of backup pad of elevating gear, the backup pad is the horizontality and locates two orbital tops respectively, the front end of backup pad is towards two track middle parts, and the bottom of backup pad front end is the inclined plane, the inclined plane slope is towards the below at two track middle parts, the second breach upwards runs through the top surface of track lateral wall, and the inner wall of second breach is in same vertical plane with the inside wall of dodging the groove, the inclined plane correspondence of backup pad front end locates the top of second breach, the backup pad removes the setting along the orbital extending direction of perpendicular to in the horizontal plane, elevating gear is located between a pair of backup pads, and be located the track below, be used for upwards jacking wafer exposure anchor clamps.
Further, the stacking mechanism further comprises a pair of groove-shaped plates, the groove-shaped plates are in a vertical state and are respectively arranged above the two rails corresponding to the second notches, the supporting plates respectively penetrate through the corresponding groove-shaped plates, an elastic piece is arranged between the rear ends of the supporting plates and the outer walls of the groove-shaped plates, and when the elastic piece is in a natural state, the front ends of the supporting plates are located between the side walls of the two rails.
The invention has the beneficial effects that:
the exposure device utilizes adjustment mechanism to carry out material loading and position control to the wafer to detect through the visual detector and compare the relative position between wafer and the mask piece, and when sucking disc and wafer separation, utilize the sucking disc to promote the telescopic link, make the mask piece compress tightly the wafer automatically, reduced the artifical process of placing the wafer, adjusting the wafer position, in order to improve production effect. During the conveying process of the wafer exposure clamp on the track, the limiting strips are always clamped in the clamping grooves, so that the mask sheet is prevented from loosening the wafer, the stability of the relative position of the wafer between the exposure clamp and the mask sheet during the conveying process is ensured, and the wafer exposure clamp is more stable relative to the principle of negative pressure adsorption.
Drawings
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Fig. 1 is a top view showing the overall structure of the wafer exposure jig of the present application.
Fig. 2 shows a partial exploded view of the wafer exposure jig of the present application.
Fig. 3 shows an overall exploded view of the wafer exposure jig of the present application.
Fig. 4 is a schematic view showing a preferred connection structure of the mask frame and the telescopic rod.
Fig. 5 shows a partial enlarged view at a in fig. 4.
Figure 6 shows a partial cross-sectional view of the bottom of the wafer exposure chuck of the present application with the chuck slot hidden in the base plate.
Fig. 7 shows a partial enlarged view at B in fig. 6.
Fig. 8 is a partial cross-sectional view of the bottom of the wafer exposure chuck of the present application with the chuck slots protruding from both sides of the base plate.
Fig. 9 is a bottom view showing the entire structure of the wafer exposure jig of the present application.
Fig. 10 is a schematic view showing the top structure of the exposure apparatus of the present application.
Fig. 11 shows a partial enlarged view at C in fig. 10.
Fig. 12 shows a schematic structural view of a preferred embodiment of the adjustment mechanism.
Fig. 13 is a schematic view showing the bottom structure of the exposure apparatus of the present application.
Fig. 14 is a schematic view showing a state in which the wafer exposure jig is transported in the track.
Fig. 15 shows a partial enlarged view at D in fig. 14.
Fig. 16 shows a schematic structural diagram of a second notch and an excessive slope of the rear section of the track.
Fig. 17 shows a schematic diagram of the structure and position relationship between the stacking mechanism and the rail.
The labels in the figure are: the device comprises a bottom plate-1, a through groove-11, a strip-shaped hole-12, an expansion link-13, a clamping groove-131, a cross bar-132, a strip-shaped plate-133, a guide inclined plane-134, a T-shaped groove-135, a mask frame-2, a mask sheet-21, a connecting part-22, an inclined block-221, a T-shaped slider-222, a feeding mechanism-3, a suction cup-31, an air guide pipe-311, a visual detector-32, an adjusting mechanism-33, a conveying mechanism-4, a rail-41, an avoiding groove-411, a limiting strip-412, a first notch-413, a transition inclined plane-414, a second notch-415, an exposure machine-5, a stacking mechanism-6, a supporting plate-61, a lifting device-62, a groove-shaped plate-63 and an elastic element-64.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
Example 1
As shown in fig. 1 to 3, a wafer exposure jig includes a base plate 1 and a mask frame 2, and a mask sheet 21 is disposed on a bottom surface of the mask frame 2.
Specifically, as shown in fig. 2, fig. 3, fig. 6 and fig. 8, through groove 11 has been seted up to bottom plate 1's bottom, a part for passing the transfer wafer, the distance between through groove 11 and the 1 both sides face of bottom plate is the same, through groove 11 perpendicular to bottom plate 1's front and back terminal surface, bar hole 12 has all been seted up to bottom plate 1's front and back terminal surface, a part for passing through the wafer, and bar hole 12 with pass through groove 11 intercommunication, bottom plate 1's both sides are all worn to be equipped with telescopic link 13 perpendicularly, telescopic link 13's front end is located through groove 11, telescopic link 13's rear end has draw-in groove 131, the extending direction of draw-in groove 131 is parallel with through groove 11.
Specifically, as shown in fig. 1 to 4, the top surface of the bottom plate 1 is located to the mask frame 2, and the bottom surface of the mask frame 2 is provided with a connecting portion 22 corresponding to the telescopic rod 13, the connecting portion 22 is slidably connected to the rear section of the telescopic rod 13, the telescopic rod 13 is arranged to move along the length direction, and the telescopic rod 13 drives the mask frame 2 to move along the direction perpendicular to the bottom plate 1.
More specifically, when the telescopic bar 13 moves toward the middle of the base plate 1, the mask frame 2 moves toward the upper side of the base plate 1 to loosen the wafer, and when the telescopic bar 13 moves toward the outer side of the base plate 1, the mask frame 2 moves toward the lower side of the base plate 1 to press the wafer with the mask sheet 21. The specific sliding connection can adopt the following structure, one of them, set up the chute in the back end side of telescopic link 13, the chute is the slope setting, and the upper end slope of chute is towards the top of bottom plate 1 both sides, and the lower extreme slope of chute is towards bottom plate 1 middle part below, and the terminal sliding connection of connecting portion 22 is in the chute, through making telescopic link 13 remove along length direction, alright simultaneous control mask frame 2 removes along the direction of perpendicular to bottom plate 1.
Specifically, as shown in fig. 2 and 6, when the front end surface of the telescopic rod 13 is in the same plane as the inner side wall of the through groove 11, the rear end surface of the telescopic rod 13 is located in the side surface of the base plate 1, and the position of the mask sheet 21 is higher than the height of the top surface of the strip-shaped hole 12.
Specifically, as shown in fig. 8 and 9, when the extension bar 13 moves to the outer side of the base plate 1 by a predetermined distance, the clamping groove 131 protrudes from the side surface of the base plate 1, and the mask frame 2 and the mask sheet 21 move together by a predetermined height in a direction perpendicular to the base plate 1, so that the mask sheet 21 presses the wafer. Then, as shown in fig. 15, the stopper strips 412 disposed on both sides of the bottom plate 1 may be caught in the catching grooves 131, and the extending direction of the stopper strips 412 is the same as the extending direction of the catching grooves 131. When the exposure clamp moves along the limiting strips 412, the telescopic rods 13 are prevented from moving towards the middle of the bottom plate 1 through the limiting strips 412, so that the mask sheet 21 is prevented from loosening the wafer, the position consistency of the wafer in the moving process of the exposure clamp is ensured, and the wafer is prevented from moving relative to the mask sheet 21.
During the use, utilize the hypomere to be conical or have the sucking disc of inclined plane to adsorb firmly the wafer, drive the sucking disc through transfer mechanism and move to exposure anchor clamps, the sucking disc passes from running through groove 11, the wafer gets into anchor clamps from bar hole 12, then move down the sucking disc, make the wafer bear on bottom plate 1, the in-process that the sucking disc moved down utilizes the conical surface or the inclined plane of hypomere to promote telescopic link 13 to the both sides of bottom plate 1, so that mask frame 2 moves down, thereby compress tightly the wafer through mask piece 21, and after the sucking disc released telescopic link 13 to the both sides of bottom plate 1, draw-in groove 131 will be in bottom plate 1's both sides outside, so that make draw-in groove 131 be connected with spacing 412, thereby avoid mask frame 2 not hard up.
More specifically, as shown in fig. 2 to 4 and 6, and fig. 8, two telescopic rods 13 are respectively disposed on two sides of the base plate 1 to increase a connection portion of the mask frame 2, so that the mask frame 2 is more stably installed and moved, front ends of the two telescopic rods 13 on the same side are connected by a cross rod 132, rear ends of the telescopic rods 13 are connected by a strip-shaped plate 133, when the strip-shaped plate 133 is located on a side surface of the base plate 1, the cross rod 132 faces an outer wall on one side of the through groove 11 and an inner side wall of the through groove 11 and is on the same plane, the strip-shaped plate 133 is in an L-shaped structure, a gap is formed between an upper section thereof and the rear end surface of the telescopic rod 13, the gap is a clamping groove 131, the two telescopic rods 13 on the same side of the base plate 1 are connected into a whole by the strip-shaped plate 133 and the cross rod 132 to form a rectangular frame structure, so that stability of the telescopic rod 13 when the telescopic rod 13 integrally moves can be increased, the cross rod 132 is connected with the telescopic rod 13 from the bottom surface by a screw, so as to facilitate assembly, and the strip-shaped plate 133 is connected to the rear end surface of the telescopic rod 13 from the outer side wall by a screw.
Preferably, as shown in fig. 4 to 8, the top of the rear section of the telescopic rod 13 has a guide inclined plane 134, the guide inclined plane 134 inclines toward the middle of the upper side of the base plate 1, the top surface of the guide inclined plane 134 is provided with a T-shaped groove 135, the T-shaped groove 135 is of an inclined structure, the upper section of the guide inclined plane inclines toward the upper side of the outer side of the base plate 1, the lower section of the guide inclined plane inclines toward the lower side of the middle of the base plate 1, the connecting portion 22 includes an inclined block 221, the bottom surface of the inclined block 221 is slidably disposed on the guide inclined plane 134, the bottom of the inclined block 221 is provided with a T-shaped slider 222, the T-shaped slider 222 is slidably disposed in the T-shaped groove 135, and by the above sliding connection structure, the telescopic rod 13 is moved while the mask frame 2 is controlled to move in the direction perpendicular to the base plate 1.
Example 2
As shown in fig. 10 and 13, an exposure apparatus includes a feeding mechanism 3, a conveying mechanism 4, an exposure machine 5, and the wafer exposure jig disclosed in embodiment 1.
Specifically, as shown in fig. 10 to 15, the conveying mechanism 4 includes a pair of parallel rails 41, and is used for conveying the exposure fixture, the through groove 11 is parallel to the rails 41 during conveying, the rails 41 include a conveying portion below the exposure fixture and side walls on two sides, the conveying portion adopts belt conveying or sets the conveying portion into a flat plate structure, and a pushing device is arranged below the rails 41, for example, an air cylinder, and pushes the wafer exposure fixture to move along the rails 41, the inner side of the side wall of the rails 41 is provided with an avoiding groove 411 along the extending direction, and is used for accommodating the telescopic rods 13 protruding from two sides of the bottom plate 1, and the inner top surface of the avoiding groove 411 is provided with a limiting strip 412 for connecting the clamping groove 131. When the exposure fixture moves on the track 41, the clamping grooves 131 protrude from the side surface of the base plate 1, and the limiting strips 412 are clamped in the clamping grooves 131, at this time, the mask sheet 21 presses the wafer, the limiting strips 412 prevent the telescopic rod 13 from moving towards the middle of the base plate 1, so that the mask sheet 21 is prevented from loosening the wafer in the process of conveying the exposure fixture, the stability of the wafer clamping position is ensured, the relative position between the wafer and the mask sheet 21 is prevented from changing, when the wafer exposure fixture is conveyed along the track 41 and is output from the tail end of the track 41, the limiting strips 412 can be separated from the clamping grooves 131, when the wafer exposure fixture is completely moved out of the track 41, the telescopic rods 13 are pressed towards the middle from two sides of the base plate 1, so that the telescopic rods 13 can move towards the middle, and the mask frame 2 is driven to move towards the upper side of the base plate, so that the mask sheet 21 loosens the wafer, and then the wafer can be discharged from the strip-shaped hole 12, as shown in fig. 11, the first notches 413 are formed at the front ends of the limiting strips 412, which are located on the track 41, and are used for penetrating through the telescopic rods 13.
As shown in fig. 10 and 13, the exposure device 5 is provided above the middle section of the rail 41 and exposes the wafer.
As shown in fig. 10, 12 and 3, the feeding mechanism 3 includes a suction cup 31, a vision detector 32 and an adjusting mechanism 33, the vision detector 32 is disposed above the track 41 corresponding to the first notch 413, and the vision detector 32 detects whether the wafer is aligned with the mask sheet 21 by comparing the pattern images; the suction cup 31 and the adjusting mechanism 33 are both disposed below the track 41 corresponding to the first notch 413, and the suction cup 31 is used for sucking the wafer.
More specifically, as shown in fig. 6, 8, 9 and 14, the bottom of the suction cup 31 is an inverted cone structure, the inverted cone is a cone or a polygonal pyramid, and the top of the cone is coaxially provided with an air duct 311, the outer diameter of the air duct 311 is smaller than the width of the through groove 11 and smaller than the minimum distance between the front ends of the telescopic rods 13 on the two sides of the bottom plate 1, the outer diameter of the suction cup 31 is larger than the outer diameter of the air duct 311 and smaller than or equal to the maximum distance between the front ends of the telescopic rods 13 on the two sides of the bottom plate 1, and the adjusting mechanism 33 is used for controlling the suction cup 31 to move so as to load the wafer into the exposure jig and adjust the relative position between the wafer and the mask 21. The adjusting mechanism 33 includes a telescopic device moving along the X, Y, Z directions, and a rotating device rotating around the Z axis, the telescopic device is a cylinder or a linear motor, and the rotating device is a motor. As shown in fig. 10 and 12, the positional accuracy of the wafer with respect to the mask sheet 21 is adjusted by adjusting the movement of the chuck 31 in the X, Y, and Z directions and the rotation around the Z axis by the adjusting mechanism 33; in the present embodiment, the X direction is defined as a direction parallel to the track 41, the Y direction is defined as a direction perpendicular to the track 41, the Y direction and the X direction are in the same horizontal plane, and the Z direction is defined as a vertical direction. When the adjustment mechanism 33 drives the suction cup 31 to move toward the wafer exposure jig along the X direction, as shown in fig. 14, the air duct 311 can pass through the through groove 11, and the suction cup 31 can pass through the strip hole 12 into the wafer exposure jig with the wafer. As shown in fig. 8 and 9, when the adjusting mechanism 33 carries the suction cup 31 to move downward along the Z-axis, the suction cup 31 can be moved downward out of the wafer exposure jig, the wafer is supported by the base plate 1 during the downward movement of the suction cup 31, and at the same time, the expansion rods 13 on both sides of the base plate 1 are pushed to move toward the outer side of the base plate 1 by the inverted cone structure at the bottom of the suction cup 31, and the mask frame 2 moves toward the lower side of the base plate 1 to gradually press toward the wafer. In the process, only when the suction cup 31 is completely positioned between the front end faces of the telescopic rods 13 on the two sides, the top face of the suction cup 31 can be flush with the surface of the bottom plate 1 for supporting the wafer, at the moment, the suction cup 31 pushes the telescopic rods 13 to the outer side of the bottom plate 1 to a preset position, at the moment, the mask sheet 21 presses the wafer onto the bottom plate 1, and the suction cup 31 can be separated from the bottom of the wafer exposure clamp by continuously moving the suction cup 31 downwards. Then, the adjusting mechanism 33 drives the chuck 31 to move along the X direction to a position for loading a wafer, and re-adsorbs a next wafer, in this embodiment, the position for placing the wafer is set at the front end of the track.
The exposure device utilizes the adjusting mechanism 33 to carry out feeding and position adjustment on the wafer, detects and compares the relative position between the wafer and the mask sheet 21 through the visual detector 32, and utilizes the suction cup 31 to push the telescopic rod 13 when the suction cup 31 is separated from the wafer, so that the mask sheet 21 automatically compresses the wafer, the processes of manually placing the wafer and adjusting the position of the wafer are reduced, and the production effect is improved. In the conveying process of the wafer exposure clamp on the track 41, the limiting strips 412 are always clamped in the clamping grooves 131, so that the mask sheet 21 is prevented from loosening, the stability of the relative position between the wafer and the mask sheet 21 in the exposure and conveying processes is ensured, and the principle of negative pressure adsorption is more stable.
Preferably, as shown in fig. 16, the end of the escape slot 411 does not penetrate through the rear end of the rail 41, and the end of the escape slot 411 is used to block the telescopic rod 13, so as to prevent the wafer exposure jig from being directly discharged from the end of the rail, thereby preventing the wafer exposure jig from falling down. A second notch 415 is formed at the end of the limiting strip 412 corresponding to the avoiding groove 411, the second notch 415 is used for separating the connection between the limiting strip 412 and the clamping groove 131, when the telescopic rod 13 is located at the second notch 415, a pushing mechanism can be arranged on the outer sides of the two rails 41 and used for pushing the telescopic rod 13 to the middle of the bottom plate 1, so that the rear end of the telescopic rod 13 is hidden into the bottom plate 1, the wafer exposure fixture can be conveniently taken out from the upper side or along the end of the rail 41, and the pushing mechanism is added here to prevent the wafer exposure fixture from being directly discharged from the end of the rail; the pushing mechanism can be realized by adopting an air cylinder, the air cylinder is arranged on the outer wall of the track 41, then a movable rod of the air cylinder penetrates through the side wall of the track 41, and the movable rod of the air cylinder is used for pushing the telescopic rod 13; the telescopic rod 13 moves towards the middle of the bottom plate 1 and simultaneously drives the mask frame 2 to move upwards, so that the mask sheet 21 loosens the wafer, and the wafer is conveniently pushed out from the wafer exposure fixture along the strip-shaped holes 12.
Further preferably, as shown in fig. 16, an excessive inclined plane 414 is disposed at a boundary between the sidewall of the avoiding groove 411 corresponding to the end of the second notch 415 and the sidewall of the rail 41, a distance between the sidewalls of the two rails 41 is smaller than a distance between the sidewalls of the avoiding groove 411, and when the wafer exposure jig continues to move toward the rear end of the rail 41, when the telescopic rod 13 passes through the excessive inclined plane 414, the excessive inclined plane 414 guides the telescopic rod 13 to move toward the middle of the base plate 1, and at the same time, the telescopic rod 13 drives the mask frame 2 to move upward, so that the mask sheet 21 releases the wafer, so as to push the wafer out of the wafer exposure jig along the strip-shaped hole 12. Specifically, the opening and closing structure can be set to be a rotary opening and closing structure or a telescopic opening and closing structure, the rotary opening and closing structure is similar to a door plate structure and can be opened and closed from two sides or from top to bottom, and the telescopic opening and closing structure can utilize a telescopic device, such as an air cylinder, to control the extension and the recovery of a baffle plate so as to achieve the opening and closing purpose.
More specifically, as shown in fig. 17, the conveying mechanism 4 further includes a stacking mechanism 6, which includes a lifting device 62 and a pair of supporting plates 61, the supporting plates 61 are disposed above the two rails 41 in a horizontal state, the front ends of the supporting plates 61 face the middle portions of the two rails 41, the bottom portions of the front ends of the supporting plates 61 are inclined planes, the inclined planes are inclined towards the lower portions of the middle portions of the two rails 41, the second notches 415 upwardly penetrate the top surfaces of the side walls of the rails 41, the inner walls of the second notches 415 and the inner side walls of the avoiding grooves 411 are located on the same vertical plane, the inclined planes of the front ends of the supporting plates 61 are correspondingly disposed above the second notches 415, the supporting plates 61 are movably disposed in the horizontal plane along the extending direction perpendicular to the rails 41, and the lifting device 62 is located between the pair of supporting plates 61 and below the rails 41 and is used for lifting up the wafer exposure fixture. During the use, wafer exposure anchor clamps move to the rear end of track 41, and when telescopic link 13 was in second breach 415, through elevating gear 62 with the upwards jack-up of wafer exposure anchor clamps, wafer exposure anchor clamps will move upwards, elevating gear 62 includes lift cylinder and installs the support piece in lift cylinder expansion end, support piece is used for supporting bottom plate 1. The telescopic rod 13 moves upwards along the second notch 415, the inclined surface at the bottom of the front end of the supporting plate 61 is firstly in sliding contact with the top edge of the bottom plate 1, and the bottom plate 1 pushes the supporting plate 61 towards the outer side of the track 41; after the wafer exposure fixture continues to rise, when the two sides of the telescopic rod 13, which protrude out of the bottom plate 1, are in contact with the inclined plane at the bottom of the front end of the supporting plate 61, under the guiding action of the inclined plane at the front end of the supporting plate 61, the telescopic rod 13 moves towards the middle of the bottom plate 1, and the telescopic rod 13 drives the mask frame 2 to move upwards, so that the mask sheet 21 loosens the wafer; finally, after the wafer exposure jig is completely moved to the upper side of the support plate 61, the support plate 61 will move towards the inner side of the rail 41, the bottom surface of the bottom plate 1 will be supported on the top surface of the support plate 61, and the stacking of the wafer exposure jig is completed by the support plate 61; the support plate 61 can be controlled by a motor or a cylinder to achieve the movement. The stacking and collecting work of the wafer exposure clamp can be automatically carried out by utilizing the stacking mechanism 6, so that the automation degree of the device is further improved, and the production efficiency is improved.
Further preferably, as shown in fig. 17, the mounting structure of the supporting plate 61 is that the stacking mechanism 6 further includes a pair of groove plates 63, the groove plates 63 are vertically disposed above the two rails 41 corresponding to the second notches 415, the supporting plate 61 passes through the corresponding groove plates 63, an elastic member 64 is disposed between the rear end of the supporting plate 61 and the outer wall of the groove plates 63, when the elastic member 64 is in a natural state, the front end of the supporting plate 61 is located between the side walls of the two rails 41, and the elastic member 64 is a spring. The structure can automatically move the supporting plate 61, when the wafer exposure clamp moves upwards, the automatic movement of the supporting plate 61 is utilized to realize the avoidance of the bottom plate 1, and simultaneously, the resilience force of the elastic piece 64 is utilized to enable the front end of the supporting plate 61 to be always tightly attached to the side wall of the bottom plate 1, so that the telescopic rod 13 is pushed to prevent the supporting plate 61 from continuously moving outwards; after the wafer exposure jig is moved to the position above the supporting plate 61, the supporting plate 61 is rapidly moved to the position below the wafer exposure jig under the resilience of the elastic member 64, so as to support the wafer exposure jig.
The above description is only a preferred embodiment of the invention and is not intended to be exhaustive or to limit the invention to the precise form disclosed. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the scope of the invention.
Claims (8)
1. The utility model provides a wafer exposure anchor clamps, including bottom plate (1) and mask frame (2), the bottom surface of mask frame (2) is equipped with mask piece (21), a serial communication port, the bottom of bottom plate (1) has been seted up and has been run through groove (11), a part for passing the transfer wafer, run through groove (11) perpendicular to the front and back terminal surface of bottom plate (1), strip hole (12) have all been seted up to the front and back terminal surface of bottom plate (1), a wafer is used for passing through, and strip hole (12) and run through groove (11) intercommunication, telescopic link (13) have all been worn to be equipped with perpendicularly in the both sides of bottom plate (1), the front end of telescopic link (13) is located and runs through groove (11), the rear end of telescopic link (13) has draw-in groove (131), the extending direction and the run through groove (11) of draw-in groove (131) are parallel;
the mask frame (2) is arranged on the top surface of the bottom plate (1), the bottom surface of the mask frame (2) is provided with connecting parts (22) corresponding to the telescopic rods (13), the connecting parts (22) are connected to the rear sections of the telescopic rods (13) in a sliding mode, the telescopic rods (13) are arranged in a moving mode along the length direction, and the mask frame (2) is driven to move along the direction perpendicular to the bottom plate (1) when moving;
when the front end face of the telescopic rod (13) and the inner side wall of the through groove (11) are in the same plane, the rear end face of the telescopic rod (13) is positioned in the side face of the bottom plate (1), and the position of the mask sheet (21) is higher than the height of the top face of the strip-shaped hole (12); when the telescopic rod (13) moves a preset distance to the outer side of the bottom plate (1), the clamping groove (131) protrudes out of the side face of the bottom plate (1), and the mask frame (2) and the mask sheet (21) move together for a preset height along the direction vertical to the bottom plate (1) so that the mask sheet (21) can tightly press the wafer.
2. The wafer exposure jig of claim 1, wherein two telescopic rods (13) are respectively arranged on two sides of the bottom plate (1), the front ends of the two telescopic rods (13) on the same side are connected through a cross rod (132), the rear ends of the telescopic rods (13) are connected through a strip-shaped plate (133), when the strip-shaped plate (133) is positioned in the side surface of the bottom plate (1), the outer wall of one side of the cross rod (132) facing the through groove (11) and the inner side wall of the through groove (11) are positioned on the same plane, the strip-shaped plate (133) is of an L-shaped structure, a gap is formed between the upper section of the strip-shaped plate and the rear end surface of the telescopic rods (13), and the gap is a clamping groove (131).
3. The wafer exposure fixture according to claim 1, wherein the top of the rear section of the telescopic rod (13) is provided with a guide inclined plane (134), the guide inclined plane (134) inclines towards the middle part above the bottom plate (1), the top surface of the guide inclined plane (134) is provided with a T-shaped groove (135), the T-shaped groove (135) is of an inclined structure, the upper section of the T-shaped groove inclines towards the upper part of the outer side of the bottom plate (1), the lower section of the T-shaped groove inclines towards the lower part of the middle part of the bottom plate (1), the connecting part (22) comprises an inclined block (221), the bottom surface of the inclined block (221) is slidably arranged on the guide inclined plane (134), the bottom of the inclined block (221) is provided with a T-shaped slider (222), and the T-shaped slider (222) is slidably arranged in the T-shaped groove (135).
4. An exposure apparatus characterized by comprising a feed mechanism (3), a transport mechanism (4), an exposure machine (5) and the wafer exposure jig of any one of claims 1 to 3;
the conveying mechanism (4) comprises a pair of rails (41) arranged in parallel, the rails are used for conveying exposure fixtures, the penetrating grooves (11) are parallel to the rails (41) during conveying, the rails (41) comprise conveying parts arranged below the exposure fixtures and side walls on two sides, the inner sides of the side walls of the rails (41) are provided with avoidance grooves (411) along the extending direction, the avoidance grooves are used for accommodating telescopic rods (13) protruding out of two sides of the bottom plate (1), the inner top surfaces of the avoidance grooves (411) are provided with limiting strips (412) used for being connected with the clamping grooves (131), and the front ends, located at the rails (41), of the limiting strips (412) are provided with first notches (413) used for penetrating through the telescopic rods (13);
the exposure machine (5) is arranged above the middle section of the track (41);
feeding mechanism (3) are including sucking disc (31), vision detector (32) and adjustment mechanism (33), the top of track (41) is located to first breach (413) is corresponded in vision detector (32), the below of track (41) is located to first breach (413) all corresponding in sucking disc (31) and adjustment mechanism (33), sucking disc (31) are used for adsorbing the wafer, the bottom of sucking disc (31) is the back taper structure, and conical crown department is coaxial and is equipped with air duct (311), the external diameter of air duct (311) is less than the width that runs through groove (11), and be less than the minimum interval between bottom plate (1) both sides telescopic link (13) front end, the external diameter of sucking disc (31) is greater than the external diameter of air duct (311), and be less than or equal to the maximum interval between bottom plate (1) both sides (13) front end, adjustment mechanism (33) are used for controlling sucking disc (31) and remove.
5. The exposure apparatus according to claim 4, wherein the end of the avoiding groove (411) does not penetrate through the rear end of the track (41), and the end of the limiting strip (412) corresponding to the avoiding groove (411) is provided with a second notch (415).
6. An exposure apparatus according to claim 5, wherein the avoiding groove (411) has an excessive slope (414) corresponding to the intersection of the side wall at the end of the second notch (415) and the inner wall of the side wall of the rail (41).
7. The exposure apparatus according to claim 5, wherein the conveying mechanism (4) further comprises a stacking mechanism (6), the stacking mechanism (6) comprises a lifting device (62) and a pair of support plates (61), the support plates (61) are respectively disposed above the two rails (41) in a horizontal state, front ends of the support plates (61) face middle portions of the two rails (41), bottom portions of the front ends of the support plates (61) are inclined surfaces, the inclined surfaces are inclined towards lower portions of the middle portions of the two rails (41), the second notches (415) upwardly penetrate top surfaces of side walls of the rails (41), inner walls of the second notches (415) and inner side walls of the avoiding grooves (411) are located on the same vertical plane, the inclined surfaces of the front ends of the support plates (61) are correspondingly disposed above the second notches (415), the support plates (61) are movably disposed in a horizontal plane along a direction perpendicular to an extending direction of the rails (41), and the lifting device (62) is located between the pair of support plates (61) and located below the rails (41) and used for lifting the wafer exposure jig upwards.
8. The exposure apparatus according to claim 7, wherein the stacking mechanism (6) further comprises a pair of groove plates (63), the groove plates (63) are vertically disposed above the two rails (41) corresponding to the second notches (415), the support plates (61) respectively pass through the corresponding groove plates (63), an elastic member (64) is disposed between the rear end of the support plate (61) and the outer wall of the groove plate (63), and when the elastic member (64) is in a natural state, the front end of the support plate (61) is located between the side walls of the two rails (41).
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| CN202211497707.9A CN115547915B (en) | 2022-11-28 | 2022-11-28 | Wafer exposure clamp and exposure device |
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| CN202211497707.9A CN115547915B (en) | 2022-11-28 | 2022-11-28 | Wafer exposure clamp and exposure device |
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