CN113625528A - Adjustable double-workbench system of photoetching machine - Google Patents
Adjustable double-workbench system of photoetching machine Download PDFInfo
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- CN113625528A CN113625528A CN202110929391.5A CN202110929391A CN113625528A CN 113625528 A CN113625528 A CN 113625528A CN 202110929391 A CN202110929391 A CN 202110929391A CN 113625528 A CN113625528 A CN 113625528A
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- 238000001259 photo etching Methods 0.000 title claims abstract description 11
- 230000008859 change Effects 0.000 claims abstract description 7
- 235000012431 wafers Nutrition 0.000 claims description 61
- 238000001125 extrusion Methods 0.000 claims description 34
- 238000001459 lithography Methods 0.000 claims description 12
- 230000009977 dual effect Effects 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 abstract description 4
- 230000000875 corresponding effect Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
Abstract
The invention discloses an adjustable double-workbench system of a photoetching machine, which comprises an underframe, wherein the top of the underframe is connected with a top plate through a support rod, exposure equipment is arranged on two sides of the bottom surface of the top plate, a movable groove is arranged on the top surface of the underframe, and the bottom end of the exposure equipment is arranged corresponding to the movable groove. According to the invention, the first workbench and the second workbench are arranged and are mutually independent, the first workbench and the second workbench can simultaneously run through the conveyor belt and the connecting device, when a wafer of one workbench is exposed through the exposure equipment, the other workbench clamps the wafer through the clamping plates and correspondingly performs preparation work before exposure, and after exposure is completed, the first workbench and the second workbench can change positions and functions through the movable device, so that high yield of the wafer is realized in a circulating reciprocating manner, and the exposure efficiency of the wafer is increased.
Description
Technical Field
The invention belongs to the technical field of photoetching machine equipment, and particularly relates to an adjustable double-workbench system of a photoetching machine.
Background
The wafer refers to a silicon wafer used in the fabrication of silicon semiconductor integrated circuits, and various circuit device structures can be fabricated on the wafer to form IC chips with specific electrical functions. Among them, a photolithography machine is used in the manufacturing process of the chip.
The traditional photoetching machine only has one workpiece table, the wafer loading and unloading, the measurement, the alignment and the exposure are sequentially carried out, a large amount of time is consumed when the wafer is exposed, and the wafer exposure efficiency is reduced.
Therefore, it is necessary to provide an adjustable dual stage system of a lithography machine to solve the above problems.
Disclosure of Invention
In view of the above problems, the present invention provides an adjustable dual stage system of a lithography machine, so as to solve the problems mentioned in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: an adjustable double-workbench system of a photoetching machine comprises an underframe, wherein the top of the underframe is connected with a top plate through a support rod, exposure equipment is arranged on two sides of the bottom surface of the top plate, a movable groove is formed in the top surface of the underframe, and the bottom end of the exposure equipment is arranged corresponding to the movable groove;
the movable groove inner side is provided with places the board, it is provided with connecting device to place the board bottom, connecting device installs at the head surface, the head includes conveyer belt and a plurality of motorized pulley, and motorized pulley external power source equipment, and the conveyer belt cup joints in a plurality of motorized pulley outsides, and the connecting device bottom surface is fixed at the conveyer belt top.
Further, place the board and include first workstation and second workstation, first workstation and second workstation top surface flush with the chassis top surface, and first workstation and second workstation top surface all are provided with two and to the splint, first workstation and second workstation top surface are provided with and slide the first spout that corresponds with the splint, and first workstation and second workstation top surface all are provided with the wafer, and the wafer top corresponds the matching with the exposure equipment bottom.
Further, the top surface of the bottom frame is further provided with two cylinders, the two cylinders are respectively arranged on two sides of the movable groove, the output ends of the inner sides of the two cylinders are respectively connected with a push plate, and the two push plates and the two opposite clamping plates of the second workbench are correspondingly arranged.
Further, connecting device includes the rotor plate, and rotor plate top surface both sides all are provided with the limiting plate, and limiting plate bottom and rotor plate fixed connection, and the limiting plate top is provided with the extrusion head, first workstation and second workstation bottom both sides face all are provided with the recess, the extrusion head tip corresponds the buckle with the recess, and the profile appearance of extrusion head tip and recess all sets up to isosceles trapezoid structure.
Furthermore, extrusion head bottom is provided with the second spout, and the inside gag lever post that is provided with of second spout, and gag lever post both ends respectively with second spout both ends fixed connection, the gag lever post top cup joints on the gag lever post surface, first spring is cup jointed on the gag lever post surface, first spring is in between two limiting plates.
Further, the top surface of the conveying belt is provided with two fixing frames, the rotating plate is arranged at the top of the inner side of each fixing frame, a screw rod is connected to the center of the top surface of the rotating plate in a penetrating mode, the top end of the screw rod is attached to the bottom surface of the placing plate, the bottom end of the screw rod is in threaded connection with the sleeve frame, and the sleeve frame is arranged inside the movable bin of the fixing frames.
Further, the bottom end of the screw rod penetrates through the top of the movable bin, a placing groove is formed in the center of the bottom of the inner side of the movable bin, the bottom of the sleeve frame is correspondingly matched with the placing groove, a second spring is sleeved at the bottom of the sleeve frame, and the bottom end of the second spring is located inside the placing groove.
Further, the cover frame both ends all are provided with the commentaries on classics board, commentaries on classics board one end is articulated with the cover frame side, and changes the board other end and correspond the setting with rotor plate bottom surface draw-in groove, it is provided with a groove to change the board surface, change the board and cup joint on the kelly surface through a groove, the kelly both ends are connected with two inside wall fixed surface in movable bin.
The invention has the technical effects and advantages that:
1. according to the invention, the first workbench and the second workbench are arranged and are mutually independent, the first workbench and the second workbench can simultaneously run through the conveyor belt and the connecting device, when a wafer of one workbench is exposed through the exposure equipment, the other workbench clamps the wafer through the clamping plates and correspondingly performs preparation work before exposure, and after exposure is completed, the first workbench and the second workbench can change positions and functions through the movable device, so that high yield of the wafer is realized in a circulating reciprocating manner, and the exposure efficiency of the wafer is increased.
2. After the exposure of the wafer is finished through the exposure equipment, the two clamping plates are pulled open, the wafer on the first workbench is taken down, one wafer is placed on the top surface of the first workbench again, the electric roller is started again, the first workbench and the second workbench move to the right through the connecting device by the conveyor belt, the electric roller stops working until the wafer on the second workbench corresponds to the bottom end of the exposure equipment on the right side, the exposure equipment on the right side exposes the wafer on the second workbench, the air cylinder limits the wafer on the top surface of the first workbench again through the push plate and the clamping plates, and the reciprocating working process of the placing plates is repeated, so that the effect of quickly processing the wafer is achieved.
3. According to the invention, the grooves of the first workbench and the second workbench begin to slide at the end part of the extrusion head by pulling the first workbench and the second workbench, the extrusion head extrudes the first spring through the limiting plate at the moment, after the grooves are separated from the extrusion head, the first spring rebounds until the top end of the limiting plate is correspondingly attached to the inner side end face of the second chute, then, a proper placing plate is arranged at the top of the rotating plate, the proper placing plate can be selected according to the appearance of the wafer, the stability of the placing plate is ensured by using the connecting device, meanwhile, the corresponding effect of the placing plate and the two cylinders is ensured, and the placing plate is convenient to replace.
4. According to the wafer clamping device, the air cylinders are started, the push plates are driven to move by the two air cylinders, the opposite clamping plates are pushed by the push plates to slide on the top of the first sliding groove, the two opposite clamping plates are used for clamping a wafer, the pushing lengths of the push plates are the same, the wafer is exactly clamped on the top surface center line of the first workbench or the second workbench by the two opposite clamping plates, when the conveying belt enables the placing plate to move in the movable groove through the connecting device, the wafer is limited by the opposite clamping plates, the wafer can be prevented from deviating from the top surface center line of the first workbench or the second workbench in the moving process of the placing plate, and the corresponding effect of the wafer is guaranteed.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of an adjustable dual stage system of a lithography machine according to an embodiment of the present invention;
FIG. 2 is a schematic top view of a placement board according to an embodiment of the present invention;
FIG. 3 shows an enlarged view of the portion A of FIG. 1 according to an embodiment of the present invention;
FIG. 4 is an enlarged view of the portion B of FIG. 1 according to an embodiment of the present invention;
in the figure: 1. a chassis; 2. a top plate; 3. an exposure device; 4. a movable groove; 5. a conveyor belt; 6. an electric roller; 7. a first table; 8. a second table; 9. aligning the clamping plates; 10. a first chute; 11. a wafer; 12. a cylinder; 13. pushing the plate; 14. a rotating plate; 15. a limiting plate; 16. an extrusion head; 17. a groove; 18. a second chute; 19. a limiting rod; 20. a first spring; 21. a fixed mount; 22. a screw; 23. sleeving a frame; 24. a movable bin; 25. a second spring; 26. rotating the plate; 27. a strip groove; 28. and (5) clamping the rod.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides an adjustable double-workbench system of a photoetching machine, which comprises an underframe 1, wherein the top of the underframe 1 is connected with a top plate 2 through a support rod, exposure equipment 3 is arranged on two sides of the bottom surface of the top plate 2, a movable groove 4 is arranged on the top surface of the underframe 1, and the bottom end of the exposure equipment 3 is arranged corresponding to the movable groove 4; the movable groove 4 inboard is provided with places the board, it is provided with connecting device to place the board bottom, connecting device installs at the head surface of the movable device, the movable device includes conveyer belt 5 and a plurality of motorized pulley 6, and motorized pulley 6 external power source equipment, and conveyer belt 5 cup joints in the 6 outsides of a plurality of motorized pulley, and the connecting device bottom surface is fixed at conveyer belt 5 top. First workstation 7 and second workstation 8 are independent each other, make first workstation 7 and second workstation 8 move simultaneously through conveyer belt 5 and connecting device, when the wafer 11 of a workstation exposes through exposure equipment 3, another workstation is through doing the preparation work before the exposure such as the centre gripping corresponds to wafer 11 to splint 9, after the exposure is accomplished, make first workstation 7 and second workstation 8 transform position and function through the head, so the high productivity of circulation reciprocal realization wafer 11 has increased the exposure efficiency of wafer 11.
As shown in fig. 2, the placing plate includes a first workbench 7 and a second workbench 8, top surfaces of the first workbench 7 and the second workbench 8 are flush with the top surface of the chassis 1, and the top surfaces of the first workbench 7 and the second workbench 8 are both provided with two butt clamp plates 9, top surfaces of the first workbench 7 and the second workbench 8 are provided with first sliding grooves 10 corresponding to the butt clamp plates 9 in a sliding manner, top surfaces of the first workbench 7 and the second workbench 8 are both provided with wafers 11, and top ends of the wafers 11 are correspondingly matched with the bottom end of the exposure device 3. The top surface of the base frame 1 is further provided with two cylinders 12, the two cylinders 12 are respectively arranged at two sides of the movable groove 4, the output ends of the inner sides of the two cylinders 12 are respectively connected with a push plate 13, and the two push plates 13 are correspondingly arranged with the two opposite clamping plates 9 of the second workbench 8. Starting cylinder 12, two cylinders 12 work makes push pedal 13 remove, push pedal 13 promotes to slide at first spout 10 top splint 9, utilize two to splint 9 carry out the centre gripping to wafer 11, push pedal 13's promotion length is the same this moment, two this moment just with wafer 11 centre gripping on first workstation 7 or second workstation 8's top surface central line to splint 9, when conveyer belt 5 makes through connecting device and places the board when 4 inside removals of movable groove, the utilization is injectd wafer 11 to splint 9, can avoid wafer 11 at the top surface central line of placing first workstation 7 of in-process skew or second workstation 8 that the board removed, guarantee wafer 11's the corresponding effect.
As shown in fig. 3 and 4, connecting device includes rotor plate 14, and 14 top surfaces both sides of rotor plate all are provided with limiting plate 15, and 15 bottom and 14 fixed connection of rotor plate of limiting plate, and 15 tops of limiting plate are provided with extrusion head 16, first workstation 7 and 8 bottom both sides of second workstation all are provided with recess 17, extrusion head 16 tip corresponds the buckle with recess 17, and the profile appearance of extrusion head 16 tip and recess 17 all sets up to isosceles trapezoid structure. The bottom of the extrusion head 16 is provided with a second chute 18, a limiting rod 19 is arranged inside the second chute 18, two ends of the limiting rod 19 are respectively fixedly connected with two ends of the second chute 18, the top of the limiting plate 15 is sleeved on the surface of the limiting rod 19, a first spring 20 is sleeved on the surface of the limiting rod 19, and the first spring 20 is located between the two limiting plates 15. When first workstation 7 and second workstation 8 need be changed, stimulate first workstation 7 and second workstation 8, the recess 17 of first workstation 7 and second workstation 8 begins to slide at extrusion head 16 tip, extrusion head 16 extrudees first spring 20 through limiting plate 15 this moment, after recess 17 and extrusion head 16 separation, first spring 20 elasticity kick-backs, it is corresponding the laminating with second spout 18 medial surface to reach limiting plate 15 top, then install suitable board of placing at rotor plate 14 top again, can select suitable board of placing according to 11 appearances of wafer, utilize connecting device to guarantee to place the stability of board, ensure to place the corresponding effect of board and two cylinders 12 simultaneously.
As shown in fig. 1 and 4, two fixing frames 21 are disposed on the top surface of the conveyor belt 5, the rotating plate 14 is located at the top of the inner side of the fixing frames 21, a screw rod 22 is connected to the center of the top surface of the rotating plate 14 in a penetrating manner, the top end of the screw rod 22 is attached to the bottom surface of the placing plate, the bottom end of the screw rod 22 is in threaded connection with a sleeve frame 23, and the sleeve frame 23 is located inside a movable bin 24 of the fixing frames 21. The bottom end of the screw rod 22 penetrates through the top of the movable bin 24, a placing groove is formed in the center of the bottom of the inner side of the movable bin 24, the bottom of the sleeve frame 23 is correspondingly matched with the placing groove, the bottom of the sleeve frame 23 is sleeved with a second spring 25, and the bottom end of the second spring 25 is located inside the placing groove. When the first workbench 7 and the second workbench 8 move downwards, the first workbench 7 and the second workbench 8 can extrude the screw rod 22, at the moment, the screw rod 22 moves downwards at the center of the rotating plate 14, the bottom end of the screw rod 22 drives the sleeve frame 23 to move downwards, the sleeve frame 23 pressurizes the second spring 25, the rotating plate 14 is limited by downward pressing of the sleeve frame 23, the first workbench 7 and the second workbench 8 are prevented from rotating in the working process, and the stability of the first workbench 7 and the second workbench 8 is ensured. When the first workbench 7 and the second workbench 8 are taken down from the rotating plate 14, the second spring 25 rebounds, the sleeve frame 23 moves upwards on the inner side of the movable bin 24 at the moment, one end of the rotating plate 26 moves upwards along with the sleeve frame 23, the other end of the rotating plate 26 is separated from the clamping groove, the rotating plate 26 rotates by taking the clamping rod 28 as a circle center, the rotating plate 26 slides on the surface of the clamping rod 28 through the strip groove 27 until the top surface of the sleeve frame 23 is attached to the top surface of the inner side of the movable bin 24, and the first workbench 7 and the second workbench 8 which are matched can be installed.
As shown in fig. 4, the two ends of the sleeve frame 23 are both provided with a rotating plate 26, one end of the rotating plate 26 is hinged to the side edge of the sleeve frame 23, the other end of the rotating plate 26 is arranged corresponding to the clamping groove on the bottom surface of the rotating plate 14, the surface of the rotating plate 26 is provided with a strip groove 27, the rotating plate 26 is sleeved on the surface of a clamping rod 28 through the strip groove 27, and the two ends of the clamping rod 28 are fixedly connected with the surfaces of the two inner side walls of the movable bin 24. When the sleeve frame 23 moves downwards, the sleeve frame 23 moves downwards to the end portion of the rotating plate 26, and when the rotating plate 26 rotates by taking the clamping rod 28 as a circle center, the rotating plate 26 slides on the surface of the rotating plate 26 through the strip groove 27, the other end of the rotating plate 26 rotates in the fixing frame 21 until the other end of the rotating plate 26 is buckled in the clamping groove in the bottom surface of the rotating plate 14, at the moment, the extruding head 16 and the groove 17 are buckled in a matched mode, the sleeve frame 23 limits the rotating plate 14 through the rotating plate 26, and installation of the first workbench 7 and the second workbench 8 is completed. The proper placing plate can be selected according to the requirement of the wafer 11, the sleeve frame 23 is limited to the rotating plate 14 through the rotating plate 26 by utilizing the clamping buckles of the extrusion head 16 and the groove 17, the connecting device is convenient to adapt to the placing plates with different shapes, and the adaptability of the whole photoetching machine equipment to different placing plates is ensured.
The working principle of the invention is as follows:
referring to fig. 1-4 of the specification, before the whole lithography machine is used to expose the wafer 11, the first workbench 7 and the second workbench 8 need to be assembled, and the top surface of the selected placing plate needs to be provided with a pair of clamping plates 9 corresponding to the pushing plate 13.
Before the first workbench 7 and the second workbench 8 are assembled, the rotating plate 14 is limited, the rotating plate 14 is placed at the top of the inner side of the fixed frame 21, the screw rod 22 penetrates through the center of the rotating plate 14 until the bottom end of the screw rod 22 corresponds to the top of the sleeve frame 23, the screw rod 22 is rotated, the screw effect of the screw rod 22 and the sleeve frame 23 enables the screw rod 22 and the sleeve frame 23 to be fixedly connected, and the elastic force of the second spring 25 is transmitted to the screw rod 22 through the sleeve frame 23.
Placing a first workbench 7 and a second workbench 8 on the top of a rotating plate 14, firstly, after a pair of clamping plates 9 on which the top surfaces of the plates are placed correspond to a push plate 13, rotating the rotating plate 14 according to the position of a groove 17, wherein the rotating plate 14 rotates by taking a screw 22 as the center of a circle, the rotating plate 14 drives an extrusion head 16 to rotate through a limiting plate 15, when the extrusion head 16 is in a position corresponding to the groove 17, stopping rotating the rotating plate 14, the inclined planes on the two sides of the bottoms of the first workbench 7 and the second workbench 8 are correspondingly attached to the trapezoidal end part of the extrusion head 16, then pulling the extrusion head 16, when the extrusion head 16 slides on the top of the limiting plate 15, the top end of the corresponding limiting plate 15 slides on the surface of a limiting rod 19, the limiting plate 15 and the extrusion head 16 are matched to extrude a first spring 20, the first spring 20 is stressed to contract and deform, so that the two extrusion heads 16 are far away from each other, and pressing the first workbench 7 and the second workbench 8, the inclined surface slides on the end surface of the extrusion head 16, after the extrusion head 16 is correspondingly arranged outside the groove 17, the extrusion head 16 is released, the first spring 20 rebounds, so that the end part of the extrusion head 16 is clamped inside the groove 17, and the first workbench 7 and the second workbench 8 are limited on the top of the rotating plate 14 by the cooperation of the extrusion head 16 and the groove 17.
When the first workbench 7 and the second workbench 8 move downwards, the first workbench 7 and the second workbench 8 extrude the screw rod 22, at this time, the screw rod 22 moves downwards at the center of the rotating plate 14, the bottom end of the screw rod 22 drives the sleeve frame 23 to move downwards, and the sleeve frame 23 pressurizes the second spring 25. When the sleeve frame 23 moves downwards, the sleeve frame 23 moves downwards to the end portion of the rotating plate 26, and when the rotating plate 26 rotates by taking the clamping rod 28 as a circle center, the rotating plate 26 slides on the surface of the rotating plate 26 through the strip groove 27, the other end of the rotating plate 26 rotates in the fixing frame 21 until the other end of the rotating plate 26 is clamped in the clamping groove in the bottom surface of the rotating plate 14, at the moment, the extrusion head 16 and the groove 17 are matched and clamped, the sleeve frame 23 limits the rotating plate 14 through the rotating plate 26, and installation of the first workbench 7 and the second workbench 8 is completed.
The proper placing plate can be selected according to the requirement of the wafer 11, the sleeve frame 23 is limited to the rotating plate 14 through the rotating plate 26 by utilizing the clamping buckles of the extrusion head 16 and the groove 17, the connecting device is convenient to adapt to the placing plates with different shapes, and the adaptability of the whole photoetching machine equipment to different placing plates is ensured.
After the board installation of placing to lithography machine equipment is accomplished, place two wafers 11 respectively at first workstation 7 and 8 tops of second workstation earlier, first workstation 7 is in between two cylinders 12 this moment, start cylinder 12 simultaneously, two cylinders 12 work makes push pedal 13 remove, push pedal 13 promotes to slide at first spout 10 top to splint 9, utilize two to carry out the centre gripping to wafer 11 to splint 9, push pedal 13's promotion length is the same this moment, two are just with wafer 11 centre gripping on first workstation 7 top surface central line to splint 9 this moment, cylinder 12 work makes push pedal 13 retrieve. And then starting the motorized pulley 6, enabling the motorized pulley 6 to move the conveyor belt 5, enabling the first workbench 7 and the second workbench 8 to move to the left through the conveyor belt 5 by virtue of a connecting device, stopping the motorized pulley 6 after the wafer 11 of the first workbench 7 corresponds to the bottom end of the left exposure device 3, starting the two air cylinders 12 again, utilizing the push plate 13 to be matched with the clamping plate 9 so as to limit the wafer 11 on the top surface of the second workbench 8, and enabling the left exposure device 3 to perform exposure processing on the wafer 11 of the first workbench 7. After the exposure of the wafer 11 is completed, pull open two and to splint 9, take off the wafer 11 of first workstation 7, place a wafer 11 on the top surface of first workstation 7 again, restart motorized pulley 6, conveyer belt 5 makes first workstation 7 and second workstation 8 move to the right through connecting device, until the wafer 11 of second workstation 8 corresponds the back with the exposure equipment 3 bottom on right side, motorized pulley 6 stop work, the exposure equipment 3 on right side exposes to light to the wafer 11 of second workstation 8, cylinder 12 is injectd the wafer 11 of first workstation 7 top surface again through push pedal 13 and to splint 9, repeat the above-mentioned round trip working process of placing the board, reach the effect of rapid processing wafer 11.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. An adjustable double-workbench system of a photoetching machine comprises an underframe (1), and is characterized in that: the top of the bottom frame (1) is connected with the top plate (2) through a support rod, exposure equipment (3) is arranged on two sides of the bottom surface of the top plate (2), a movable groove (4) is arranged on the top surface of the bottom frame (1), and the bottom end of the exposure equipment (3) is arranged corresponding to the movable groove (4);
the movable groove (4) inboard is provided with places the board, it is provided with connecting device to place the board bottom, connecting device installs at the head surface, the head includes conveyer belt (5) and a plurality of motorized pulley (6), and motorized pulley (6) external power source equipment, and the conveyer belt (5) cup joints in a plurality of motorized pulley (6) outsides, and the connecting device bottom surface is fixed at conveyer belt (5) top.
2. The adjustable dual stage system of a lithography machine according to claim 1, wherein: the placing plate comprises a first workbench (7) and a second workbench (8), the top surfaces of the first workbench (7) and the second workbench (8) are flush with the top surface of the bottom frame (1), two clamping plates (9) are arranged on the top surfaces of the first workbench (7) and the second workbench (8), first sliding grooves (10) corresponding to the clamping plates (9) in a sliding mode are formed in the top surfaces of the first workbench (7) and the second workbench (8), wafers (11) are arranged on the top surfaces of the first workbench (7) and the second workbench (8), and the top ends of the wafers (11) are correspondingly matched with the bottom end of the exposure equipment (3).
3. The adjustable dual stage system of a lithography machine according to claim 2, wherein: the top surface of the base frame (1) is further provided with two cylinders (12), the two cylinders (12) are respectively arranged on two sides of the movable groove (4), the output ends of the inner sides of the two cylinders (12) are respectively connected with a push plate (13), and the two push plates (13) and the two opposite clamping plates (9) of the second workbench (8) are correspondingly arranged.
4. The adjustable dual stage system of a lithography machine according to claim 2, wherein: connecting device includes rotor plate (14), and rotor plate (14) top surface both sides all are provided with limiting plate (15), and limiting plate (15) bottom and rotor plate (14) fixed connection, and limiting plate (15) top is provided with extrusion head (16), first workstation (7) and second workstation (8) bottom both sides face all is provided with recess (17), extrusion head (16) tip corresponds the buckle with recess (17), and the section appearance of extrusion head (16) tip and recess (17) all sets up to isosceles trapezoid structure.
5. The adjustable dual stage system of a lithography machine according to claim 4, wherein: the extrusion head (16) bottom is provided with second spout (18), and second spout (18) inside is provided with gag lever post (19), and gag lever post (19) both ends respectively with second spout (18) both ends fixed connection, gag lever post (15) top cup joints gag lever post (19) surface, gag lever post (19) surface cup joints first spring (20), first spring (20) are in between two limiting plates (15).
6. The adjustable dual stage system of a lithography machine according to claim 4, wherein: conveyer belt (5) top surface is provided with two mount (21), rotor plate (14) are in mount (21) inboard top, rotor plate (14) top surface center department through connection has screw rod (22), and screw rod (22) top with place the laminating of board bottom surface, screw rod (22) bottom and cover frame (23) threaded connection, cover frame (23) are in inside movable bin (24) of mount (21).
7. The adjustable dual stage system of a lithography machine according to claim 6, wherein: the bottom end of the screw rod (22) penetrates through the top of the movable bin (24), a placing groove is formed in the center of the bottom of the inner side of the movable bin (24), the bottom of the sleeve frame (23) is correspondingly matched with the placing groove, a second spring (25) is sleeved at the bottom of the sleeve frame (23), and the bottom end of the second spring (25) is located inside the placing groove.
8. The adjustable dual stage system of a lithography machine according to claim 6, wherein: the utility model discloses a card pole, including cover frame (23), commentaries on classics board (26) one end and cover frame (23) side are articulated, and change board (26) other end and rotor plate (14) bottom surface draw-in groove and correspond the setting, it is provided with strip groove (27) to change board (26) surface, change board (26) and cup joint on kelly (28) surface through strip groove (27), kelly (28) both ends and two inside wall fixed surface in movable bin (24) are connected.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110929391.5A CN113625528A (en) | 2021-08-13 | 2021-08-13 | Adjustable double-workbench system of photoetching machine |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110929391.5A CN113625528A (en) | 2021-08-13 | 2021-08-13 | Adjustable double-workbench system of photoetching machine |
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| CN113625528A true CN113625528A (en) | 2021-11-09 |
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| CN202110929391.5A Pending CN113625528A (en) | 2021-08-13 | 2021-08-13 | Adjustable double-workbench system of photoetching machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115547915A (en) * | 2022-11-28 | 2022-12-30 | 四川上特科技有限公司 | Wafer exposure clamp and exposure device |
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