CN110676204A - Wafer positioning mechanism - Google Patents
Wafer positioning mechanism Download PDFInfo
- Publication number
- CN110676204A CN110676204A CN201910917750.8A CN201910917750A CN110676204A CN 110676204 A CN110676204 A CN 110676204A CN 201910917750 A CN201910917750 A CN 201910917750A CN 110676204 A CN110676204 A CN 110676204A
- Authority
- CN
- China
- Prior art keywords
- clamping
- wafer
- positioning mechanism
- positioning
- wafer positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 210000000078 claw Anatomy 0.000 claims abstract description 15
- 235000012431 wafers Nutrition 0.000 claims description 49
- 230000001154 acute effect Effects 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229940095676 wafer product Drugs 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer positioning mechanism, which comprises a clamping cylinder and a protective clamping jaw, wherein the clamping cylinder comprises a cylinder body and two gas claw chucks slidably arranged on the cylinder body, the protective clamping jaw comprises two clamping components, each clamping component is fixed on one gas claw chuck, each clamping component is provided with a coarse positioning clamping surface and a fine positioning clamping surface, the coarse positioning clamping surfaces and the fine positioning clamping surfaces are connected, a wafer is clamped on the coarse positioning clamping surfaces of the two clamping components to be coarsely positioned and then slides to the fine positioning clamping surfaces to be finely positioned, only the side edge of the wafer touches the coarse positioning clamping surfaces and the fine positioning clamping surfaces in the whole positioning process, and a smooth facet is not contacted and is pollution-free.
Description
Technical Field
The present invention relates to wafer industry, and more particularly, to a wafer positioning mechanism.
Background
Generally, after the silicon is crystallized into a large, cylindrical shape over most of its length, the columnar crystalline material is cut into thin, circular pieces that become silicon wafers, which may also be referred to as wafers (wafers) because of their circular shape. Various circuit device structures can be further fabricated on the wafer, thereby forming an integrated circuit product with specific electrical functions.
The fragile nature of the wafer product and the inability of the optical facets to make direct contact with other objects to avoid contamination results in positioning difficulties during wafer processing.
Disclosure of Invention
To overcome the deficiencies of the prior art, it is an object of the present invention to provide a wafer positioning mechanism that is contamination free and does not contact the optical facet.
The purpose of the invention is realized by adopting the following technical scheme:
the utility model provides a wafer positioning mechanism, includes die clamping cylinder and protection clamping jaw, die clamping cylinder include cylinder main part and two slidable mounting in the gas claw chuck of cylinder main part, the protection clamping jaw includes two centre gripping subassemblies, each the centre gripping subassembly is fixed in one the gas claw chuck, each the centre gripping subassembly is equipped with thick location clamping face and smart location clamping face, thick location clamping face reaches smart location clamping face connects, and the wafer centre gripping is in two thick location clamping face of centre gripping subassembly carries out after the thick location landing extremely smart location clamping face carries out the smart location.
Further, the rough positioning clamping surface is an arc surface.
Furthermore, the fine positioning clamping surface is an inclined surface and forms an acute included angle with the horizontal surface.
Furthermore, the sections of the rough positioning clamping surface and the fine positioning clamping surface form an obtuse included angle.
Furthermore, the number of the coarse positioning clamping surfaces and the number of the fine positioning clamping surfaces on each clamping assembly are two, and the distance between the two coarse positioning clamping surfaces and the corresponding coarse positioning clamping surface on the other clamping assembly is different, so that the protective clamping jaws can clamp wafers with different sizes.
Furthermore, each clamping component comprises a connecting plate and a clamping piece, the connecting plate is fixed on the air claw chuck, and the clamping piece is fixed on the connecting plate.
Further, the rough positioning clamping surface and the fine positioning clamping surface are arranged on the clamping piece.
Further, a gap is formed between the two connecting plates, an accommodating space is formed between the two clamping pieces, and the gap is communicated with the accommodating space.
Further, the moving directions of the two air claw clamping heads are opposite.
Further, the wafer positioning mechanism further comprises an installation plate, and the clamping cylinder is fixed on the installation plate.
Compared with the prior art, the wafer positioning mechanism comprises the clamping cylinder and the protection clamping jaw, the clamping cylinder comprises a cylinder body and two gas claw chucks which are slidably mounted on the cylinder body, the protection clamping jaw comprises two clamping components, each clamping component is fixed on one gas claw chuck, each clamping component is provided with a coarse positioning clamping surface and a fine positioning clamping surface, the coarse positioning clamping surfaces and the fine positioning clamping surfaces are connected, a wafer is clamped on the coarse positioning clamping surfaces of the two clamping components to be coarsely positioned and then slides to the fine positioning clamping surfaces to be finely positioned, and only the side edge of the wafer touches the coarse positioning clamping surfaces and the fine positioning clamping surfaces in the whole positioning process, so that the smooth facet is not contacted and is pollution-free.
Drawings
FIG. 1 is a perspective view of a wafer positioning mechanism according to the present invention;
FIG. 2 is an exploded view of the wafer positioning mechanism of FIG. 1;
FIG. 3 is a perspective view of a clamping cylinder of the wafer positioning mechanism of FIG. 2;
FIG. 4 is a front view of a protective jaw of the wafer positioning mechanism of FIG. 2;
FIG. 5 is a perspective view of the wafer positioning mechanism of FIG. 1 in use;
FIG. 6 is a front view of the wafer positioning mechanism of FIG. 1 in use;
FIG. 7 is a front view of the wafer positioning mechanism of FIG. 6 showing a protective jaw in use;
fig. 8 is an enlarged view of the protective jaw of fig. 7 at a.
In the figure: 30. a wafer positioning mechanism; 31. mounting a plate; 32. a clamping cylinder; 320. a cylinder main body; 321. a chute; 322. a gas claw clamp; 323. a gas pipe joint; 33. a protective jaw; 330. a clamping assembly; 331. a connecting plate; 3310. an avoidance part; 332. a clamping member; 3320. roughly positioning a clamping surface; 3321. finely positioning the clamping surface; 333. a gap; 334. an accommodating space; 200. and (5) a wafer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present, secured by intervening elements. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly disposed on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 8, the wafer positioning mechanism 30 of the present invention is used for positioning a wafer 200, and the wafer positioning mechanism 30 includes a mounting plate 31, a clamping cylinder 32 and a protective clamping jaw 33.
The clamp cylinder 32 includes a cylinder body 320, two gas jaw clamps 322, and a gas tube connector 323. The cylinder body 320 is provided with a sliding slot 321, and the two gas claw clamps 322 are slidably mounted on the sliding slot 321. The air pipe joint 323 is fixed to the cylinder body 320 and connected to the air jaw chuck 322.
The protective jaw 33 includes two clamping assemblies 330, and each clamping assembly 330 includes a connecting plate 331 and a clamping member 332. The connecting plate 331 is fixed to the gas claw grip 322. The connecting plate 331 has an avoiding portion 3310, and the avoiding portion 3310 is L-shaped. The clamp 332 is fixed to the connection plate 331. The clamping member 332 has two rough positioning clamping surfaces 3320 and two fine positioning clamping surfaces 3321. A rough positioning clamping surface 3320 and a fine positioning clamping surface 3321 are connected to form a clamping portion. The coarse positioning and clamping surface 3320 is cambered. The fine positioning clamping surface 3321 is an inclined surface and forms an acute included angle with the horizontal surface. The rough positioning clamping surface 3320 and the fine positioning clamping surface 3321 form an obtuse included angle with each other. The distance between the two rough positioning clamping surfaces 3320 on the same clamping assembly 330 and the corresponding rough positioning clamping surface 3320 on the other clamping assembly 330 is different, so as to clamp wafers 200 with different sizes. A gap 333 is formed between the connecting plates 331, an accommodating space 334 is formed between the clamping members 332, and the accommodating space 334 is used for accommodating the wafer 200.
When the wafer positioning mechanism 30 is used, the two air gripper chucks 322 of the clamping cylinder 32 move towards each other to drive the two clamping members 332 to clamp the wafer 200. At this time, the side edge of the wafer 200 contacts the rough positioning holding surface 3320, and the photolithography surface faces downward. The external force on the wafer 200 is removed, the wafer 200 slides to the fine positioning holding surface 3321, and only the edge of the wafer 200 contacts with the holding member 332 during the sliding process, so that no pollution is caused.
Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes should fall within the scope of the claims of the present invention.
Claims (10)
1. The utility model provides a wafer positioning mechanism, includes die clamping cylinder and protection clamping jaw, its characterized in that: the clamping cylinder includes cylinder main part and two slidable mounting in the gas claw chuck of cylinder main part, the protection clamping jaw includes two centre gripping subassemblies, each the centre gripping subassembly is fixed in one the gas claw chuck, each the centre gripping subassembly is equipped with thick location clamping face and smart location clamping face, thick location clamping face reaches smart location clamping face is connected, and the wafer centre gripping is in two the thick location clamping face of centre gripping subassembly carries out after the thick location landing extremely smart location clamping face carries out the smart location.
2. The wafer positioning mechanism of claim 1, wherein: the coarse positioning clamping surface is an arc surface.
3. The wafer positioning mechanism of claim 2, wherein: the fine positioning clamping surface is an inclined surface and forms an acute included angle with the horizontal surface.
4. The wafer positioning mechanism of claim 3, wherein: the sections of the coarse positioning clamping surface and the fine positioning clamping surface form an obtuse included angle.
5. The wafer positioning mechanism of claim 4, wherein: the number of the coarse positioning clamping surfaces and the number of the fine positioning clamping surfaces on each clamping assembly are two respectively, and the distances between the coarse positioning clamping surfaces and the corresponding coarse positioning clamping surfaces on the other clamping assembly are different, so that the protection clamping jaws can clamp wafers with different sizes.
6. The wafer positioning mechanism of claim 1, wherein: each clamping assembly comprises a connecting plate and a clamping piece, the connecting plate is fixed on the gas claw chuck, and the clamping piece is fixed on the connecting plate.
7. The wafer positioning mechanism of claim 6, wherein: the rough positioning clamping surface and the fine positioning clamping surface are arranged on the clamping piece.
8. The wafer positioning mechanism of claim 6, wherein: a gap is formed between the two connecting plates, an accommodating space is formed between the two clamping pieces, and the gap is communicated with the accommodating space.
9. The wafer positioning mechanism of claim 1, wherein: the moving directions of the two air claw clamping heads are opposite.
10. The wafer positioning mechanism of claim 1, wherein: the wafer positioning mechanism further comprises a mounting plate, and the clamping cylinder is fixed on the mounting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910917750.8A CN110676204A (en) | 2019-09-26 | 2019-09-26 | Wafer positioning mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910917750.8A CN110676204A (en) | 2019-09-26 | 2019-09-26 | Wafer positioning mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110676204A true CN110676204A (en) | 2020-01-10 |
Family
ID=69079395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910917750.8A Withdrawn CN110676204A (en) | 2019-09-26 | 2019-09-26 | Wafer positioning mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110676204A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113625528A (en) * | 2021-08-13 | 2021-11-09 | 苏州耀佳金属科技有限公司 | Adjustable double-workbench system of photoetching machine |
| CN114551328A (en) * | 2020-11-26 | 2022-05-27 | 宁波润华全芯微电子设备有限公司 | Multi-size compatible wafer clamping mechanism |
| CN115184714A (en) * | 2022-09-13 | 2022-10-14 | 广东电网有限责任公司肇庆供电局 | Insulator resistance measuring device and measuring method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1533590A (en) * | 2001-07-25 | 2004-09-29 | ���������ƴ���ʽ���� | Processing apparatus and processing method |
| US20080267747A1 (en) * | 2007-04-27 | 2008-10-30 | Brooks Automation, Inc. | Inertial wafer centering end effector and transport apparatus |
| CN105047585A (en) * | 2014-04-30 | 2015-11-11 | 东京毅力科创株式会社 | Substrate processing apparatus, and substrate detection method of substrate processing apparatus |
| JP2017228801A (en) * | 2017-09-20 | 2017-12-28 | 株式会社東京精密 | Wafer delivery apparatus |
| CN108109951A (en) * | 2016-11-25 | 2018-06-01 | 沈阳芯源微电子设备有限公司 | It is a kind of can centering wafer transfer device |
| CN210866145U (en) * | 2019-09-26 | 2020-06-26 | 长园启华智能科技(珠海)有限公司 | Wafer positioning mechanism |
-
2019
- 2019-09-26 CN CN201910917750.8A patent/CN110676204A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1533590A (en) * | 2001-07-25 | 2004-09-29 | ���������ƴ���ʽ���� | Processing apparatus and processing method |
| US20080267747A1 (en) * | 2007-04-27 | 2008-10-30 | Brooks Automation, Inc. | Inertial wafer centering end effector and transport apparatus |
| CN105047585A (en) * | 2014-04-30 | 2015-11-11 | 东京毅力科创株式会社 | Substrate processing apparatus, and substrate detection method of substrate processing apparatus |
| CN108109951A (en) * | 2016-11-25 | 2018-06-01 | 沈阳芯源微电子设备有限公司 | It is a kind of can centering wafer transfer device |
| JP2017228801A (en) * | 2017-09-20 | 2017-12-28 | 株式会社東京精密 | Wafer delivery apparatus |
| CN210866145U (en) * | 2019-09-26 | 2020-06-26 | 长园启华智能科技(珠海)有限公司 | Wafer positioning mechanism |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114551328A (en) * | 2020-11-26 | 2022-05-27 | 宁波润华全芯微电子设备有限公司 | Multi-size compatible wafer clamping mechanism |
| CN113625528A (en) * | 2021-08-13 | 2021-11-09 | 苏州耀佳金属科技有限公司 | Adjustable double-workbench system of photoetching machine |
| CN115184714A (en) * | 2022-09-13 | 2022-10-14 | 广东电网有限责任公司肇庆供电局 | Insulator resistance measuring device and measuring method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110676204A (en) | Wafer positioning mechanism | |
| US8292279B2 (en) | Clamp | |
| CN210866145U (en) | Wafer positioning mechanism | |
| US8931772B2 (en) | Method and apparatus for securing a workpiece to a fixture plate using an adjustable, low-profile, light-duty workpiece clamp | |
| US7661183B2 (en) | Blade changing tool | |
| CN210866144U (en) | Wafer overturning and positioning device | |
| EP0392516A3 (en) | Plasma processing device | |
| CN110690155A (en) | Wafer overturning and positioning device | |
| WO1990002633A3 (en) | Clamping device | |
| CN210897239U (en) | Wafer protection clamping jaw | |
| CN108766926B (en) | Wafer chuck and working method thereof | |
| US8905691B2 (en) | Arc surface milling assistant processing device | |
| CN211517533U (en) | Clamping jaw mechanism | |
| CN204997391U (en) | Portable presss from both sides dress construction installation equipment fast | |
| TW201900365A (en) | Workpiece holding device | |
| JPH0111404Y2 (en) | ||
| CN110612020B (en) | Hand for connecting connector and hand system | |
| JP2017132009A (en) | Workpiece holding device, and dovetail groove slide stage equipped with workpiece holding device | |
| CN217822735U (en) | Wafer clamp | |
| CN218110810U (en) | Manipulator clamping device | |
| CN218556156U (en) | Multifunctional material claw assembling module | |
| CN211545100U (en) | Universal double-station robot workstation | |
| CN211332315U (en) | Machining clamp | |
| CN212769362U (en) | Wire rod clamping device | |
| CN219788057U (en) | Buffering clamping tool for glass production |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 519000 5th floor, building 3 (R & D building), No.5, Keji 8th Road, high tech Zone, Zhuhai City, Guangdong Province Applicant after: Changyuan semiconductor equipment (Zhuhai) Co.,Ltd. Address before: 519080 rooms 301 and 302, unit 1, 3rd floor, convention and Exhibition Center, No.1 Software Park Road, Tangjiawan Town, Zhuhai City, Guangdong Province Applicant before: Changyuan Qihua Intelligent Technology (Zhuhai) Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200110 |
|
| WW01 | Invention patent application withdrawn after publication |