CN217822735U

CN217822735U - Wafer clamp

Info

Publication number: CN217822735U
Application number: CN202222016506.4U
Authority: CN
Inventors: 柳威; 张峰; 孙荣兵; 孙剑; 高裕弟
Original assignee: Kunshan Mengxian Electronic Technology Co ltd
Current assignee: Kunshan Mengxian Electronic Technology Co ltd
Priority date: 2022-08-02
Filing date: 2022-08-02
Publication date: 2022-11-15
Anticipated expiration: 2032-08-02

Abstract

The utility model relates to the field of semiconductor technology, a wafer anchor clamps is specifically disclosed. The wafer clamp comprises a handle assembly, a first chuck and a second chuck; the handle assembly comprises a first clamping plate, a second clamping plate and a pushing piece, wherein one end of the first clamping plate and one end of the second clamping plate along the length direction are fixedly connected, and the other ends of the first clamping plate and the second clamping plate along the length direction are arranged at intervals; a limiting opening is formed in the pushing piece, and the first clamping plate and the second clamping plate can penetrate through the limiting opening along the length direction; meanwhile, the first chuck is arranged at the free end of the first clamping plate, and the second chuck is arranged at the free end of the second clamping plate. The utility model discloses well first chuck and second chuck can adjust the different positions of impeller on first splint and second splint to the dynamics of wafer centre gripping, and then avoided the centre gripping dynamics undersize to cause the landing of wafer or the too big damage that causes the wafer of centre gripping dynamics.

Description

Wafer clamp

Technical Field

The utility model relates to the field of semiconductor technology, especially, relate to a wafer clamp.

Background

In the semiconductor industry, wafers refer to silicon wafers used in the fabrication of silicon semiconductor integrated circuits, and are called wafers because they are circular in shape. Various circuit element structures can be processed on the silicon wafer, so that products with specific electrical functions can be formed.

In the production process of the wafer, the wafer needs to be inspected and transferred for multiple times, and in order to prevent the wafer from being polluted after a hand contacts the wafer in the taking process, a wafer clamp is used. However, in the process of clamping the wafer by the wafer clamp in the prior art, the handle needs to be pinched by the hand at any time to prevent the wafer from falling off, and the handle is easily pinched by the hand to cause uneven force, which may cause the wafer to slide down or damage the wafer.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wafer clamp to solve the in-process of the anchor clamps centre gripping wafer among the prior art, cause the problem of the landing of wafer or the damage of wafer easily.

In order to achieve the purpose, the utility model adopts the following technical proposal:

the utility model provides a wafer clamp for centre gripping wafer, above-mentioned wafer clamp includes:

a handle assembly including a first jaw, a second jaw, and a pusher; one end of the first clamping plate and one end of the second clamping plate are fixedly connected along the length direction, and the other end of the first clamping plate and the other end of the second clamping plate are arranged at intervals along the length direction; the pushing piece is provided with a limiting opening, and the first clamping plate and the second clamping plate can penetrate through the limiting opening along the length direction;

a first chuck and a second chuck, wherein the first chuck is arranged at the free end of the first clamping plate, and the second chuck is arranged at the free end of the second clamping plate; the pushing piece can slide on the first clamping plate and the second clamping plate to drive the first chuck and the second chuck to approach each other to clamp the wafer.

As an alternative of the wafer clamp, the stopper opening is divided into a first stopper opening and a second stopper opening, and the first clamp plate and the second clamp plate respectively pass through the first stopper opening and the second stopper opening along the length direction.

As an alternative to the wafer chuck, an end of the first chuck, which is away from the first clamping plate, is recessed inward to form an arc portion, and the arc portion is used for avoiding the effective area of the wafer.

As an alternative to the wafer chuck, a contact table is provided on a side of the first chuck facing the second chuck, the contact table being configured to contact the wafer.

As an alternative of the wafer clamp, a limiting column is disposed on one side of the second chuck facing the first chuck, and a sidewall of the limiting column is used for abutting and limiting the wafer.

As an alternative of the wafer clamp, the first chuck is provided with a guide hole, and the limit post can penetrate through the guide hole.

As an alternative of the wafer clamp, a non-slip pad is further disposed on a side of the second chuck facing the first chuck.

As an alternative to the wafer chuck, the first chuck may be detachably connected to the first clamp plate, and the second chuck may be detachably connected to the second clamp plate.

As an alternative to the above wafer chuck, the first clamping plate and the second clamping plate are both elastic plates.

As an alternative to the wafer chuck, the pushing member is further provided with an anti-slip protrusion.

The beneficial effects of the utility model are that:

the wafer chuck includes a handle assembly, a first chuck and a second chuck. The handle assembly comprises a first clamping plate, a second clamping plate and a pushing piece, wherein the first clamping plate is fixedly connected with one end of the second clamping plate along the length direction, and the other end of the first clamping plate and the other end of the second clamping plate along the length direction are arranged at intervals, so that the first chuck and the second chuck can form a V-shaped structure. Wherein, seted up spacing mouth on the impeller, first splint and second splint homoenergetic are passed spacing mouth along length direction for the impeller is located on first splint and the second splint through spacing mouthful cover. Meanwhile, the first chuck is arranged at the free end of the first clamping plate, the second chuck is arranged at the free end of the second clamping plate, the pushing piece can slide on the first clamping plate and the second clamping plate to drive the first chuck and the second chuck to approach each other to clamp the wafer, and therefore the clamping force of the first chuck and the second chuck on the wafer can be adjusted through different positions of the pushing piece on the first clamping plate and the second clamping plate, and the wafer is prevented from slipping down due to too small clamping force or being damaged due to too large clamping force.

Drawings

Fig. 1 is a schematic structural diagram of a wafer chuck according to an embodiment of the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

fig. 3 is a partially enlarged view of fig. 1 at B.

In the figure:

1. a handle assembly; 11. a first splint; 12. a second splint; 13. a pusher member; 131. a first limit port; 132. a second limit port; 133. anti-skid protrusions; 2. a first chuck; 21. an arc-shaped portion; 22. a butting table; 23. a guide hole; 3. a second chuck; 31. a limiting post.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Where the terms "first position" and "second position" are two different positions, and where a first feature is "over", "above" and "on" a second feature, the first feature is directly over and obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

The present embodiment provides a wafer chuck for clamping a wafer.

As shown in fig. 1 to 3, the wafer chuck includes a handle assembly 1, a first chuck 2, and a second chuck 3. The handle assembly 1 comprises a first clamping plate 11, a second clamping plate 12 and a pushing piece 13, wherein one end of the first clamping plate 11 and one end of the second clamping plate 12 along the length direction are fixedly connected, and the other end of the first clamping plate 11 and the other end of the second clamping plate 12 along the length direction are arranged at intervals, so that the first chuck 2 and the second chuck 3 can form a V-shaped structure. Wherein, set up spacing mouth on the impeller 13, first splint 11 and second splint 12 all can pass spacing mouth along length direction for impeller 13 is located on first splint 11 and the second splint 12 through spacing mouthful cover.

Meanwhile, the first chuck 2 is arranged at the free end of the first clamping plate 11, the second chuck 3 is arranged at the free end of the second clamping plate 12, the pushing piece 13 can slide on the first clamping plate 11 and the second clamping plate 12 to drive the first chuck 2 and the second chuck 3 to approach each other to clamp the wafer, and therefore the clamping force of the first chuck 2 and the second chuck 3 on the wafer can be adjusted through different positions of the pushing piece 13 on the first clamping plate 11 and the second clamping plate 12, and further the wafer is prevented from being damaged due to the fact that the wafer slips or the clamping force is too large due to too small clamping force, the wafer clamp is simple in structure and convenient to manufacture in batches.

As shown in fig. 1 and 2, the limiting opening is divided into a first limiting opening 131 and a second limiting opening 132, the first clamping plate 11 and the second clamping plate 12 respectively pass through the first limiting opening 131 and the second limiting opening 132 along the length direction, so that a spacing portion is formed between the first limiting opening 131 and the second limiting opening 132, and during the sliding process of the pushing member 13, the sliding range of the pushing member 13 can be limited by the spacing portion, thereby preventing the pushing member 13 from being separated from the two ends of the first chuck 2 and the second chuck 3. Optionally, the pushing member 13 is provided with an anti-slip protrusion 133, and the anti-slip protrusion 133 can play an anti-slip role, so that the worker can limit the pushing member 13 at a predetermined position when the wafer is clamped by the wafer clamp. Further, the first chuck 2 is detachably connected with the first clamping plate 11, and the second chuck 3 is detachably connected with the second clamping plate 12, so that the types of the first chuck 2 and the second chuck 3 can be conveniently replaced by detaching the first chuck and the second chuck, the wafer clamp is suitable for different types of wafers, and the pushing piece 13 can be conveniently mounted.

Wherein, first splint 11 and second splint 12 are the elastic plate to first splint 11 and second splint 12 are after producing elastic deformation, and the distance between first chuck 2 and the second chuck 3 can enlarge or reduce, with this grip function who realizes wafer anchor clamps, and simultaneously, first splint 11 and second splint 12 can also resume original shape, in order to make things convenient for the clamp of next time to get.

As shown in fig. 1 and fig. 3, one end of the first chuck 2 away from the first clamping plate 11 is recessed inward to form an arc portion 21, and the arc portion 21 is used to avoid an effective area of the wafer, so as to prevent the first chuck 2 from damaging the effective area on the wafer, which causes a defect on the wafer. Wherein, the first chuck 2 is provided with a butt joint platform 22 towards one side of the second chuck 3, the butt joint platform 22 is used for butt joint the wafer, thereby the contact area between the first chuck 2 and the wafer can be reduced to the maximum extent by using the butt joint platform 22. Alternatively, the abutment table 22 may be provided in plural, and the plural abutment tables 22 may be provided on the first chuck 2 at intervals.

Further, one side of the second chuck 3 facing the first chuck 2 is provided with a limiting column 31, and the side wall of the limiting column 31 is used for abutting against a limiting wafer, so that the length of the wafer extending into the space between the first chuck 2 and the second chuck 3 is limited by the limiting column 31, the wafer is prevented from extending into the effective area of the wafer due to the overlong length between the first chuck 2 and the second chuck 3, and the effective area of the wafer is prevented from being scratched. Optionally, the first chuck 2 is provided with a guide hole 23, and the limit column 31 can pass through the guide hole 23, so that the limit column 31 and the guide hole 23 can guide the first chuck 2 and the second chuck 3 to approach each other, thereby preventing the first chuck 2 and the second chuck 3 from inclining obliquely in the clamping process and causing clamping damage to the wafer. Further optionally, an anti-slip pad is further disposed on one side of the second chuck 3 facing the first chuck 2, and the anti-slip pad has an anti-slip function, so that the wafer can be prevented from slipping off when the wafer is moved by the wafer clamp. Specifically, the first chuck 2 holds the front surface of the wafer, and the second chuck 3 holds the back surface of the wafer.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A wafer chuck for holding a wafer, the wafer chuck comprising:

a handle assembly (1), the handle assembly (1) comprising a first jaw (11), a second jaw (12), and a pusher (13); one end of the first clamping plate (11) and one end of the second clamping plate (12) along the length direction are fixedly connected, and the other end of the first clamping plate (11) and the other end of the second clamping plate (12) along the length direction are arranged at intervals; a limiting opening is formed in the pushing piece (13), and the first clamping plate (11) and the second clamping plate (12) can penetrate through the limiting opening along the length direction;

the clamping device comprises a first clamping head (2) and a second clamping head (3), wherein the first clamping head (2) is arranged at the free end of a first clamping plate (11), and the second clamping head (3) is arranged at the free end of a second clamping plate (12); the pushing piece (13) can slide on the first clamping plate (11) and the second clamping plate (12) to drive the first chuck (2) and the second chuck (3) to approach each other to clamp the wafer.

2. The wafer chuck according to claim 1, wherein the limiting opening is divided into a first limiting opening (131) and a second limiting opening (132), and the first clamping plate (11) and the second clamping plate (12) respectively pass through the first limiting opening (131) and the second limiting opening (132) along the length direction.

3. The wafer holder as claimed in claim 1, characterized in that the end of the first chuck (2) remote from the first clamping plate (11) is recessed inwardly to form an arcuate portion (21), the arcuate portion (21) being adapted to clear the active area of the wafer.

4. Wafer holder according to claim 1, characterized in that the side of the first chuck (2) facing the second chuck (3) is provided with an abutment table (22), the abutment table (22) being intended for abutment against the wafer.

5. The wafer holder according to claim 1, characterized in that a side of the second chuck (3) facing the first chuck (2) is provided with a restraining post (31), and a side wall of the restraining post (31) is used for abutting and restraining the wafer.

6. The wafer holder according to claim 5, wherein the first chuck (2) is provided with a guide hole (23), and the limiting post (31) can pass through the guide hole (23).

7. The wafer holder according to claim 1, characterized in that the second chuck (3) is further provided with a non-slip pad on the side facing the first chuck (2).

8. The wafer holder according to claim 1, characterized in that the first chuck (2) is detachably connected to the first clamping plate (11) and the second chuck (3) is detachably connected to the second clamping plate (12).

9. The wafer holder according to claim 1, characterized in that the first clamping plate (11) and the second clamping plate (12) are both elastic plates.

10. The wafer holder as claimed in claim 1, wherein the urging member (13) is further provided with an anti-slip projection (133).