CN216793658U - Wafer clamping jig - Google Patents
Wafer clamping jig Download PDFInfo
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- CN216793658U CN216793658U CN202220317974.2U CN202220317974U CN216793658U CN 216793658 U CN216793658 U CN 216793658U CN 202220317974 U CN202220317974 U CN 202220317974U CN 216793658 U CN216793658 U CN 216793658U
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- wafer
- chuck
- upper chuck
- clamping jig
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Abstract
The utility model relates to the technical field of semiconductors, and particularly discloses a wafer clamping jig. The wafer clamping jig comprises a lower chuck and an upper chuck, the supporting area of the lower chuck is more than or equal to half of the area of the wafer, and an arc-shaped blocking piece matched with the wafer is arranged on one edge of the lower chuck; the upper chuck is arranged above the lower chuck, one side of the upper chuck is elastically connected with one side of the lower chuck, which is provided with a blocking piece, the upper chuck is an arc-shaped piece matched with the wafer, and the outer arc-shaped surface of the upper chuck is aligned with the inner arc-shaped surface of the blocking piece. The lower chuck can fully drag the wafer, the arc-shaped blocking piece can block the wafer and limit the wafer, the outer arc-shaped surface of the upper chuck is aligned with the inner arc-shaped surface of the blocking piece, the upper chuck and the lower chuck are matched to clamp the wafer, the area of the wafer clamping jig for clamping the wafer is increased, and the wafer is not easy to fall off in the moving process after being clamped; in addition, the upper chuck is contacted with a non-circuit area at the edge of the wafer, so that the circuit on the wafer is prevented from being damaged.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a wafer clamping jig.
Background
The key raw material of the silicon-based OLED is a wafer back plate, and the quality of the wafer is crucial to the quality of the finished product of the silicon-based OLED.
The wafer back plate is generally placed in a special wafer box, and if the wafer back plate needs to be taken out manually, a special wafer clamp is generally used for clamping in order to prevent the problems of scratching, collision, static electricity and the like of the wafer caused in the taking process. Since most of the wafer positions have the precision integrated circuits, the wafer can be clamped by the conventional wafer clamp only at a few positions on the edge, and the wafer is easy to fall off from the wafer clamp.
Therefore, it is desirable to provide a wafer clamping jig to solve the above-mentioned technical problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a wafer clamping jig to solve the problem that in the prior art, only a small number of positions at the edge of a wafer can be clamped, and the wafer is easy to fall off from a wafer clamp.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a wafer clamping jig comprises:
the supporting area of the lower chuck is more than or equal to half of the area of the wafer, and an arc-shaped blocking piece matched with the wafer is arranged on one edge of the lower chuck;
the upper chuck is arranged above the lower chuck, one side of the upper chuck is elastically connected with one side of the blocking piece arranged on the lower chuck, the upper chuck is an arc-shaped piece matched with the wafer, and the outer arc-shaped surface of the upper chuck is aligned with the inner arc-shaped surface of the blocking piece.
As an optional technical solution of the above wafer clamping jig, the upper chuck includes:
the first upper chuck is in an arc shape and is elastically connected with the lower chuck;
the two second upper chucks are arranged and are in arc shapes, and the two second upper chucks are arranged at two ends of the first upper chuck and can extend out or retract into the first upper chuck.
As an optional technical scheme of the above wafer clamping jig, a sliding groove is formed in one side, facing the lower chuck, of the first upper chuck, the second upper chuck is arranged in the sliding groove in a sliding manner, a plurality of first connecting pieces are arranged on the second upper chuck at intervals along the length direction of the second upper chuck, and second connecting pieces detachably connected with the first connecting pieces are arranged on the first upper chuck.
As an optional technical scheme of the above wafer clamping jig, the first connecting piece includes a connecting hole disposed on the second upper chuck, and the second connecting piece is inserted into the first upper chuck and detachably connected to the connecting hole.
As an optional technical scheme of the above wafer clamping jig, the second connecting member includes a locking bolt, and an inner thread connected to the locking bolt in a matching manner is disposed on a hole wall of the connecting hole.
As an optional technical scheme of the above wafer clamping jig, the lower chuck is connected with the upper chuck through an elastic handle, one end of the handle is connected with the lower chuck, and the other end of the handle is bent and connected with the upper chuck.
As an optional technical solution of the above wafer clamping jig, the handle is in a V shape or a U shape.
As an optional technical solution of the above wafer clamping jig, a distance from a middle position of the arc-shaped surface of the inner side of the blocking member to a side of the lower chuck opposite to the blocking member is a radius of the wafer.
As an optional technical solution of the above wafer clamping jig, the lower chuck is square.
As an optional technical solution of the above wafer clamping jig, the lower chuck and the upper chuck are made of antistatic materials with impedance of 10E-5 to 10E-9.
The utility model has the beneficial effects that:
according to the wafer clamping jig provided by the utility model, the area of the lower chuck is large, the wafer can be fully dragged, the arc-shaped blocking piece can block the wafer and has a limiting effect on the wafer, the arc-shaped surface of the outer side of the upper chuck is aligned with the arc-shaped surface of the inner side of the blocking piece, and the upper chuck and the lower chuck are matched to clamp the wafer, so that the area of the wafer clamping jig for clamping the wafer is increased, and the wafer is not easy to drop in the moving process after being clamped; in addition, the upper chuck is an arc-shaped piece matched with the wafer, and the upper chuck is contacted with a non-circuit area at the edge of the wafer, so that the circuit on the wafer is prevented from being damaged.
Drawings
Fig. 1 is a schematic view of an overall structure of a wafer clamping jig according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an upper clamp according to an embodiment of the present invention;
figure 3 is a cross-sectional view of an upper clamp provided by an embodiment of the present invention.
In the figure:
1. a lower chuck; 2. a blocking member; 3. an upper chuck; 4. a handle;
31. a first upper chuck; 32. a second upper clamp; 33. a chute; 34. a first connecting member; 35. a second connecting member.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
To the problem that in the prior art, the conventional wafer clamp can only clamp a small number of positions at the edge, and the wafer is easy to fall off from the wafer clamp, the embodiment provides a wafer clamping jig to solve the above technical problem.
Specifically, as shown in fig. 1, the wafer clamping jig provided in this embodiment includes a lower chuck 1 and an upper chuck 3, a supporting area of the lower chuck 3 is greater than or equal to half of an area of a wafer, and an arc-shaped blocking member 2 matched with the wafer is disposed on an edge of the lower chuck 1. The upper chuck 3 is arranged above the lower chuck 1, one side of the upper chuck 3 is elastically connected with one side of the lower chuck 1, which is provided with the blocking piece 2, the upper chuck 3 is an arc-shaped piece matched with the wafer, and the outer arc-shaped surface of the upper chuck 3 is aligned with the inner arc-shaped surface of the blocking piece 2.
The area of the lower chuck 1 is large, the wafer can be fully dragged, the arc-shaped blocking piece 2 can block the wafer and limit the wafer, the outer arc-shaped surface of the upper chuck 3 is aligned with the inner arc-shaped surface of the blocking piece 2, the upper chuck 3 and the lower chuck 1 are matched to clamp the wafer, the area of the wafer clamping jig for clamping the wafer is increased, and the wafer is not easy to drop in the moving process after being clamped; in addition, the upper chuck 3 is an arc-shaped piece matched with the wafer, and the upper chuck 3 is contacted with a non-circuit area at the edge of the wafer, so that the circuit on the wafer is prevented from being damaged.
In this embodiment, the lower chuck 1 is connected to the upper chuck 3 through a handle 4 having elasticity, one end of the handle 4 is connected to the lower chuck 1, and the other end of the handle 4 is bent to be connected to the upper chuck 3. The handle 4 is pinched by hand to enable the upper chuck 3 and the lower chuck 1 to approach each other to clamp the wafer, and the handle 4 is released to enable the upper chuck 3 and the lower chuck 1 to separate from each other to release the wafer.
In order to facilitate the operation, the handle 4 should be as long as possible within a reasonable range, and the operation is labor-saving. Preferably, the handle 4 is V-shaped or U-shaped, and the structure is simple. The handle 4 is preferably made of a metal material having elasticity.
The area of the lower chuck 1 is increased to drag the wafer, so that the supporting surface of the wafer is increased, and the wafer is prevented from falling off from the wafer clamping jig in the clamping and moving process. In this embodiment, the lower chuck 1 is square, which is convenient for processing and increases the clamping area of the wafer. In order to facilitate positioning of the wafer, an edge of the lower chuck 1 is provided with an arc-shaped blocking member 2, and the wafer is placed on the lower chuck 1 at a side opposite to the blocking member 2 and abuts against an inner arc-shaped surface of the blocking member 2.
Preferably, the distance from the middle position of the inner side arc-shaped surface of the blocking part 2 to one side of the lower chuck 1 opposite to the blocking part 2 is the radius of the wafer, so that a half wafer can be supported, the stability of clamping the wafer is improved, and the volume of the wafer clamping jig cannot be increased.
In this embodiment, the length of the upper chuck 3 may be varied to accommodate gripping of wafers of different sizes. Specifically, as shown in fig. 2 and 3, the upper cartridge 3 includes a first upper cartridge 31 and a second upper cartridge 32. The first upper chuck 31 and the second upper chuck 32 are arc-shaped to accommodate gripping of the edge of the wafer. The first upper jaw 31 is elastically connected to the lower jaw 1, and specifically, the first upper jaw 31 is connected to the lower jaw 1 through the handle 4. Two second upper chucks 32 are provided, and the two second upper chucks 32 are provided at both ends of the first upper chuck 31 and can be extended or retracted from the first upper chuck 31. The structure not only can be suitable for clamping wafers with different sizes, but also can extend the second upper clamping head 32 for wafers with more invalid circuits at the edge so as to increase the clamping area of the wafers and improve the firmness of clamping the wafers.
Furthermore, a sliding groove 33 is formed in one side, facing the lower chuck 1, of the first upper chuck 31, the second upper chuck 32 is slidably disposed in the sliding groove 33, a plurality of first connecting pieces 34 are arranged on the second upper chuck 32 at intervals along the length direction of the second upper chuck 32, and a second connecting piece 35 detachably connected with the first connecting pieces 34 is arranged on the first upper chuck 31. When the wafer clamping jig is used, the length of the second upper chuck 32 extending out of the first upper chuck 31 is adjusted according to the size of the wafer, and then the second connecting member 35 is connected with the corresponding first connecting member 34 to fix the second upper chuck 32 on the first upper chuck 31. When gripping the wafer, the second upper chuck 32 and the first upper chuck 31 are in contact with the wafer.
The first connecting member 34 includes a connecting hole disposed on the second upper clamp 32, and the second connecting member 35 is detachably connected to the connecting hole through the first upper clamp 31 so as to adjust the position of the second upper clamp 32. The connection hole is preferably a blind hole to prevent the second connection member 35 from contacting the wafer through the connection hole and damaging the wafer.
To facilitate the adjustment of the position of the second upper clamp 32, in this embodiment, the second connecting member 35 includes a locking bolt, and the hole wall of the connecting hole is provided with an internal thread matching with the locking bolt.
In another embodiment, the first connecting member 34 and the second connecting member 35 are connected to each other by a clamping structure, specifically, the first connecting member 34 is a clamping hole formed on the second upper clamping head 32, the clamping hole is provided with a clamping groove along the circumferential direction of the hole wall, the second connecting member 35 is a clamping member capable of being clamped in the clamping groove of the clamping hole, and an end portion of the clamping member clamped in the clamping groove of the clamping hole can be elastically deformed so as to be separated from the clamping hole or connected in the clamping hole. Preferably, the tip of joint spare is equipped with the rubber spare, and the diameter of rubber spare is greater than the aperture in joint hole, and with the size phase-match in joint groove, when exerting the power to the joint spare, enables the rubber spare and warp and get into the joint inslot, exerts the power of outwards extracting again to the joint spare, and the rubber spare warp and breaks away from the joint groove to break away from the joint hole.
The lower chuck 1 and the upper chuck 3 are both made of antistatic materials with impedance of 10E-5 to 10E-9, so that the problem of static electricity is prevented when the wafer is taken.
When the wafer clamping jig provided by the embodiment is used, a wafer to be clamped is placed on the lower chuck 1 and abuts against the arc-shaped surface of the blocking member 2, and the upper chuck 3 and the lower chuck 1 are moved towards each other to fix the wafer.
Further, before clamping the wafer, the position of the second upper chuck 32 can be adjusted according to the size of the wafer, so as to improve the clamping firmness of the wafer.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A wafer clamping jig is characterized by comprising:
the wafer clamping device comprises a lower chuck (1), wherein the supporting area of the lower chuck (1) is more than or equal to half of the area of a wafer, and an arc-shaped blocking piece (2) matched with the wafer is arranged on one edge of the lower chuck (1);
the upper chuck (3) is arranged above the lower chuck (1), one side of the upper chuck (3) is elastically connected with one side of the blocking piece (2) arranged on the lower chuck (1), the upper chuck (3) is an arc-shaped piece matched with the wafer, and the outer arc-shaped surface of the upper chuck (3) is aligned with the inner arc-shaped surface of the blocking piece (2).
2. The wafer clamping jig according to claim 1, wherein the upper chuck (3) comprises:
the first upper chuck (31) is arc-shaped and is elastically connected with the lower chuck (1);
and the two second upper chucks (32) are arranged and are in arc shapes, and the two second upper chucks (32) are arranged at two ends of the first upper chuck (31) and can extend out or retract into the first upper chuck (31).
3. The wafer clamping jig as claimed in claim 2, wherein a sliding groove (33) is formed in one side of the first upper chuck (31) facing the lower chuck (1), the second upper chuck (32) is slidably disposed in the sliding groove (33), a plurality of first connecting members (34) are disposed on the second upper chuck (32) at intervals along a length direction of the second upper chuck (32), and a second connecting member (35) detachably connected to the first connecting members (34) is disposed on the first upper chuck (31).
4. The wafer clamping jig as claimed in claim 3, wherein the first connecting member (34) includes a connecting hole disposed on the second upper chuck (32), and the second connecting member (35) is inserted through the first upper chuck (31) and detachably connected to the connecting hole.
5. The wafer clamping jig as claimed in claim 4, wherein the second connecting member (35) comprises a locking bolt, and the hole wall of the connecting hole is provided with an internal thread in matching connection with the locking bolt.
6. The wafer clamping jig as claimed in claim 1, wherein the lower chuck (1) is connected to the upper chuck (3) through a handle (4) having elasticity, one end of the handle (4) is connected to the lower chuck (1), and the other end of the handle (4) is bent to be connected to the upper chuck (3).
7. The wafer clamping jig as claimed in claim 6, wherein the handle (4) is V-shaped or U-shaped.
8. The wafer clamping jig according to claim 1, wherein a distance from a middle position of an inner arc-shaped surface of the blocking member (2) to a side of the lower chuck (1) opposite to the blocking member (2) is a radius of the wafer.
9. The wafer clamping jig according to claim 1, wherein the lower chuck (1) has a square shape.
10. The wafer clamping jig according to claim 1, wherein the lower chuck (1) and the upper chuck (3) are made of antistatic material having impedance of 10E-5 to 10E-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220317974.2U CN216793658U (en) | 2022-02-17 | 2022-02-17 | Wafer clamping jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220317974.2U CN216793658U (en) | 2022-02-17 | 2022-02-17 | Wafer clamping jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216793658U true CN216793658U (en) | 2022-06-21 |
Family
ID=82017290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220317974.2U Active CN216793658U (en) | 2022-02-17 | 2022-02-17 | Wafer clamping jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216793658U (en) |
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2022
- 2022-02-17 CN CN202220317974.2U patent/CN216793658U/en active Active
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