CN210073803U

CN210073803U - Irregular wafer fixing device

Info

Publication number: CN210073803U
Application number: CN201920618478.9U
Authority: CN
Inventors: 黎浩; 吴继清; 许海明
Original assignee: Hubei Light Allen Technology Co Ltd
Current assignee: Hubei guanganlun chip Co.,Ltd.
Priority date: 2019-04-30
Filing date: 2019-04-30
Publication date: 2020-02-14
Anticipated expiration: 2029-04-30

Abstract

The utility model belongs to the technical field of semiconductor chip handles, specifically provide an irregular wafer fixing device, including the wafer base, remove fastener and spacing buckle group, spacing buckle group and wafer base fixed connection, remove fastener slidable and connect on the wafer base, and be equipped with the spring between wafer base and removal fastener, make its relative spacing buckle group keep away from alright place irregular wafer through pressing down the removal fastener, also extrude the spring when pressing down, then loosen one's hand, thereby make the removal fastener be close to the wafer clamp tightly to spacing buckle group under the restoring force effect of spring. The device has the advantages of good safety performance, firm positioning, convenient and fast taking and placing of irregular wafers, long-term repeated use and capability of preventing the wafers from drifting when being fixed; on the other hand, the pressure adjustable type fixing clamp solves the problems that when a traditional clamp adopts double-sided conductive adhesive to fix a wafer, the wafer is not firm and easy to drift, and the wafer is easy to damage and pollute due to inconvenient operation of taking and placing the wafer.

Description

Irregular wafer fixing device

Technical Field

The utility model belongs to the technical field of semiconductor chip handles, concretely relates to irregular wafer fixing device.

Background

In the production and manufacturing process of semiconductor devices, in order to ensure the effectiveness of circuits on the front surface of a wafer, a series of procedures such as glue spreading, exposure, development and the like are used for carrying out multi-level complex process treatment on the front surface of the wafer so as to provide chips meeting the product requirements, and the wafer is frequently required to be manually divided into irregular shapes for carrying out process treatment in the process production process, particularly 1/4 wafers and 1/2 wafers. After the wafer is processed to a certain degree through the process flow, the size of the front pattern of the wafer needs to be measured and the microscopic morphology of the surface of the wafer needs to be observed under a scanning electron microscope, and when the wafer is placed into the scanning electron microscope, the wafer cannot be simply placed, but a special device needs to be used for positioning and clamping the wafer, so that the quality of a shot picture is ensured. The mode of fixing irregular wafer under scanning electron microscope in trade at present is to paste the wafer back on the microscope carrier through two-sided conducting resin, because the wafer needs inclination in scanning electron microscope vacuum column, two-sided conducting resin can not be fixed the wafer completely, and the wafer very easily takes place to drift under the influence of gravity, leads to scanning electron microscope blurred, the inaccurate problem of measurement size when shooing the positive image of wafer. Meanwhile, in the process of taking the wafer off the carrying platform after the measurement is finished, due to the fact that the double-sided conductive adhesive has certain viscosity and the specific physical properties of the wafer, the wafer is easily damaged and polluted when the wafer is taken.

Disclosure of Invention

The utility model aims at overcoming the fixed inconvenient problem of irregular wafer processing among the prior art.

Therefore, the utility model provides a

The utility model has the advantages that: the utility model provides an irregular wafer fixing device, including the wafer base, remove fastener and spacing buckle group, spacing buckle group and wafer base fixed connection, remove fastener slidable and connect on the wafer base, and be equipped with the spring between wafer base and removal fastener, make its relative spacing buckle group keep away from through pressing down the removal fastener alright place irregular wafer, also extrude the spring when pressing down, then loose hand, thereby make the removal fastener be close to with the wafer clamp tight to spacing buckle group under the restoring force effect of spring. The device is convenient for taking and placing the wafer by clamping and fixing the irregular wafer on the wafer base, has good safety performance, firm positioning, convenient taking and placing of the irregular wafer, can be repeatedly used for a long time, and can prevent the wafer from drifting when being fixed; on the other hand, the pressure adjustable fixing device solves the problems that when a common wafer fixing clamp adopts double-sided conductive adhesive to fix a wafer, the wafer is not firm and easy to drift, and the wafer is easy to damage and pollute due to inconvenient operation of taking and placing the wafer.

The present invention will be described in further detail with reference to the accompanying drawings.

Drawings

Fig. 1 is a schematic perspective view of an irregular wafer fixing device according to the present invention;

fig. 2 is a schematic side view of the irregular wafer fixing device of the present invention;

FIG. 3 is a schematic cross-sectional view A-A of the irregular wafer holder of the present invention;

fig. 4 is a schematic longitudinal sectional view of an irregular wafer fixing device according to the present invention.

Description of reference numerals: the wafer comprises a wafer 100, a wafer base 101, a sliding buckle 102, a limit buckle group 103, a sliding plate 104, a spring 105, a screw 106, a guide rod 107, a positioning hole 108 and a threaded hole 109.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of the present invention, "a plurality" means two or more unless otherwise specified.

The utility model provides an irregular wafer fixing device, which comprises a wafer base (101), a movable clamping piece group and a limiting clamping piece group (103), wherein the limiting clamping piece group (103) is fixedly connected with the wafer base (101); the movable clamp group comprises a sliding clamp (102), a sliding plate (104), a spring (105) and a guide rod (107), the sliding clamp (102) is fixedly connected with the sliding plate (104) through the guide rod (107), the guide rod (107) is slidably connected with the wafer base (101), the sliding plate (104) is connected with the wafer base (101) through the spring, and a clamping surface which clamps the irregular wafer (100) together with the limiting clamp group (103) is arranged on the sliding clamp (102).

Therefore, as shown in fig. 1 to 4, the limit buckle set 103 is connected to the wafer pedestal 101 through a bolt, the lower portion of the slide buckle 102 is fixedly connected to the guide rod 107 through a screw 106, the upper portion of the slide buckle 102 is buckled to the surface of the wafer pedestal 101, so that the guide rod 107 can drive the slide buckle 102 to move together when sliding in the inner chute of the wafer pedestal 101, the other end of the guide rod 107 is connected to the sliding plate 104 through a screw, the sliding plate 104 is buckled to the side surface of the wafer pedestal 101, and one end of the sliding plate 104 is abutted to the wafer pedestal 101 through a spring 105, so that the guide rod 107 has two limit positions when sliding in the wafer pedestal 101, one limit position is limited through the slide buckle 102, and the other limit position is limited through the sliding plate 104. In the using process, the sliding plate 104 is pressed to enable the guide rod 107 to slide and drive the sliding buckle 102 to move away from the limiting buckle group 103, so that the clamping space between the sliding buckle 102 and the limiting buckle group 103 is enlarged, then the irregular wafer 100 is placed in the clamping space, the sliding plate 104 is loosened, the sliding plate 104 is pushed outwards under the restoring force of the spring 105, the sliding plate 104 drives the guide rod 107 and the sliding buckle 102 to move, the irregular wafer 100 is clamped and fixed, the above steps are repeated when the irregular wafer 100 needs to be taken down, and the principle is the same and is not repeated.

Preferably, the limiting buckle group (103) comprises two limiting buckles symmetrically arranged on two sides of the guide rod (107), and an included angle between the two limiting buckles is 90 degrees or 180 degrees. Therefore, as shown in fig. 1, a triangular positioning structure is formed between the two limit fasteners and the slide fastener 102 to fix the irregular wafer 100. The angle here can also be other angles, and different mounting positions of the limit buckle group 103 can be realized through different mounting holes.

Preferably, the sliding buckle (102) is fixedly connected with the guide rod (107) through a screw (106). It can be seen that, as shown in fig. 2 and 3, the screw 106 is first inserted through the light hole of the sliding buckle 102, and then the screw 106 is rotated to engage with the threaded hole of the guide rod 107, so as to press the sliding buckle 102 against the end of the guide rod 107. Similarly, the sliding plate 104 and the guide bar 107 are connected by the same principle to form a screw connection.

Preferably, a plurality of bolt holes are formed in the wafer base (101), and the limiting buckle group (103) is connected with the wafer base (101) through bolts. As shown in fig. 3, the clamping space can be adjusted by installing the limit fastener group 103 on different bolt holes, so as to clamp and fix more wafers 100 of different sizes, where the bolt holes in the figure are not limited to the four shown above, and more bolt holes can be designed according to the size and shape of irregular wafers to be fixed as required.

Preferably, a stepped through hole is formed in the wafer base (101), one end of the spring (105) abuts against the stepped hole, and the other end of the spring abuts against the side wall of the sliding plate (104). Accordingly, as shown in fig. 3 and 4, a plurality of springs 105 are disposed between the wafer base 101 and the sliding plate 104 to form a pressing state for clamping the wafer.

Preferably, the guide rods (107) comprise a plurality of guide rods, and each guide rod (107) is symmetrically arranged on two sides of the symmetry axis of the wafer base (101). It can be seen that there are two or more guide rods 107 as shown in fig. 3, and that the plurality of guide rods can improve the stability of the slide.

Preferably, the spring (105) comprises a plurality of springs, and each guide rod (107) penetrates through each spring (105). It can be seen that the plurality of springs 105 increase the strength of the restoring force, so that the irregular wafer 100 is clamped more tightly, and the guide rods 107 passing through the springs 105 can prevent the springs from being biased radially.

Preferably, the wafer base (101) is provided with a threaded hole (108) for fixing with a microscope. Therefore, as shown in fig. 3 and 4, the center of the bottom end of the wafer base 101 is provided with a threaded hole 108, and after the irregular wafer 100 is clamped and fixed on the wafer base 101, the wafer base 101 is fixed on the scanning electron microscope stage through the first threaded hole 108, and the pattern sizes of different positions on the front surface of the wafer are sequentially measured and the micro-topography of the surface of the wafer is observed, so that the scanning and the measurement of the wafer are completed.

The operating process principle of the fixing device is as follows: placing the wafer base 101 on a hand with one hand, pressing the sliding plate 104 to the bottom by using fingers, then flatly placing the irregular wafer 100 with the front side facing upwards on the circular platform of the wafer base 101, when placing, enabling the arc edge of the irregular wafer 100 to be close to the clamping end of the sliding buckle 102, then slowly loosening the fingers, enabling the sliding buckle 102 to clamp and fix the irregular wafer 100 in a triangular enclosure formed by the sliding buckle 102 and the limiting buckle under the action of the elastic force of the spring 105, at the moment, enabling the arc edge of the irregular wafer 100 to be tangent to the arc edge of the sliding buckle 102, enabling the right-angle edges to be tangent to the straight edges of the two limiting buckles respectively, aligning a first threaded hole 108 on the back side of the wafer base 101 with a screw rod on a scanning electron microscope carrier, screwing and fixing the wafer base 101 on the scanning electron microscope carrier clockwise, moving the carrier to a vacuum column of the, and sequentially measuring the pattern sizes of different positions on the front surface of the irregular wafer and observing the microscopic morphology of the surface of the wafer to complete the scanning and measurement of the whole irregular wafer.

The above examples are merely illustrative of the present invention and do not limit the scope of the present invention, and all designs identical or similar to the present invention are within the scope of the present invention.

Claims

1. An irregular wafer fixing device is characterized in that: the wafer positioning device comprises a wafer base (101), a movable clamping piece group and a limiting clamping group (103), wherein the limiting clamping group (103) is fixedly connected with the wafer base (101);

the movable clamp group comprises a sliding clamp (102), a sliding plate (104), a spring (105) and a guide rod (107), the sliding clamp (102) is fixedly connected with the sliding plate (104) through the guide rod (107), the guide rod (107) is slidably connected with the wafer base (101), the sliding plate (104) is connected with the wafer base (101) through the spring, and a clamping surface which clamps the irregular wafer (100) together with the limiting clamp group (103) is arranged on the sliding clamp (102).

2. The irregular wafer fixture according to claim 1, wherein: the limiting buckle group (103) comprises two limiting buckles symmetrically arranged on two sides of the guide rod (107), and an included angle between the two limiting buckles is 90 degrees or 180 degrees.

3. The irregular wafer fixture according to claim 1, wherein: the sliding buckle (102) is fixedly connected with the guide rod (107) through a screw (106).

4. The irregular wafer fixture according to claim 1, wherein: the wafer base (101) is provided with a plurality of bolt holes, and the limiting buckle group (103) is connected with the wafer base (101) through bolts.

5. The irregular wafer fixture according to claim 1, wherein: the wafer base (101) is provided with a step through hole, one end of the spring (105) abuts against the step through hole, and the other end of the spring abuts against the side wall of the sliding plate (104).

6. The irregular wafer fixture according to claim 1, wherein: the guide rods (107) comprise a plurality of guide rods, and the guide rods (107) are symmetrically arranged on two sides of a symmetry axis of the wafer base (101).

7. The irregular wafer fixture according to claim 6, wherein: the spring (105) comprises a plurality of springs, and each guide rod (107) penetrates through each spring (105).

8. The irregular wafer fixture according to claim 1, wherein: and a threaded hole (108) for fixing the wafer base (101) with a microscope is formed in the wafer base.