CN214254364U - Tin ball removing device for packaging chip - Google Patents
Tin ball removing device for packaging chip Download PDFInfo
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- CN214254364U CN214254364U CN202120439618.3U CN202120439618U CN214254364U CN 214254364 U CN214254364 U CN 214254364U CN 202120439618 U CN202120439618 U CN 202120439618U CN 214254364 U CN214254364 U CN 214254364U
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- 238000004806 packaging method and process Methods 0.000 title claims description 22
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title abstract description 23
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 229910000679 solder Inorganic materials 0.000 claims description 49
- 241000252254 Catostomidae Species 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The embodiment of the utility model discloses a tin ball remove device for encapsulating chip. The utility model discloses a tin ball remove device, include: the supporting frame is provided with a supporting seat and a sliding rail, the ball screw is rotatably arranged on the supporting seat, the rotating handle is arranged at one end of the ball screw, the supporting plate is arranged on the supporting frame, the supporting plate is provided with a rectangular through hole for placing a chip, the fixing mechanism is provided with the supporting frame for fixing the chip, the push broach is arranged on the cutter holder, and the cutter holder can slide on the sliding rail and is meshed on the ball screw. The utility model discloses a tin ball remove device for encapsulating chip, ball screw's rotation drives blade holder and push-type broach and removes, and the push-type broach is shoveled the tin ball on the encapsulation chip fast when removing, and the tin ball height that shovels away is even, and the chip can not damaged, guarantees follow-up precision when detecting distortion and bow curve numerical value to the chip.
Description
Technical Field
The embodiment of the utility model provides a relate to chip technical field, concretely relates to tin ball remove device for encapsulating chip.
Background
With the progress of integration technology, the improvement of equipment and the use of deep submicron technology, the integration level of a silicon single chip is continuously improved, the number of I/O pins is sharply increased, the power consumption is increased, and the packaging requirements of integrated circuits are more strict. In order to meet the development requirement of integrated circuits, a new packaging mode, namely Ball Grid Array (BGA) packaging, is added on the basis of the original packaging variety.
BGA (ball grid array) chip products are in a cube shape, and after the chip packaging is finished, a heating distortion test is required to be carried out to detect the distortion and bow values of the chip. During detection, a projection ripple technology (Shadow Moire) is adopted, ripples appear on the surface of an object when light is irradiated through a grating grid, if the surface of the object is very flat, reflected ripples are equidistant concentric circles, if the surface of the object is not flat, an obtained graph is irregular, and the shapes and degrees of the distortion and the bow of the object can be accurately obtained through analysis of the graph, and specific values of the distortion and the bow can be obtained.
The inventor of the present application finds that in the prior art, in a BGA (ball grid array) chip product, a protruding solder ball is formed on a chip substrate on one side, and due to the influence of the height of the solder ball, the warpage and bow values of the chip during testing can be deviated, so that the solder ball on the packaged chip needs to be removed before accurate testing of the chip is performed. In the prior production, the solder balls on the packaged chips are generally removed by manually scraping with a blade, so that the problems of uneven height and low efficiency of the solder balls and the risk of scraping the chips are caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a tin ball remove device for encapsulating chip can get rid of the tin ball on the encapsulation chip fast.
An embodiment of the utility model provides a tin ball remove device for encapsulating chip, include: the device comprises a support frame, a ball screw, a rotating handle, a support plate, a fixing mechanism, a push broach and a cutter holder;
the support frame is provided with a support seat and a slide rail;
the support frame is fixedly arranged;
the ball screw is rotatably arranged on the supporting seat, and the ball screw and the sliding rail are arranged in parallel;
the rotating handle is arranged at one end of the ball screw and is used for driving the ball screw to rotate;
the support plate is arranged on the support frame and is provided with a rectangular through hole, and a chip is placed in the rectangular through hole;
the fixing mechanism is provided with the support frame and is used for fixing the chip in the rectangular through hole;
the push broach is arranged on the tool apron;
the tool apron is arranged on the sliding rail in a sliding mode, the tool apron is meshed with the ball screw, the ball screw is used for driving the tool apron and the push broach to slide along the sliding rail when rotating, and the push broach is used for removing the solder balls on the chip in the rectangular through hole when sliding.
According to the above technical scheme, the utility model discloses a tin ball remove device for encapsulating chip, through setting up support frame, ball screw, twist grip, support plate, fixed establishment, push-type broach and blade holder, the support frame is equipped with supporting seat and slide rail, and the rotatable setting of ball screw is on the supporting seat, and the support plate setting is equipped with the rectangle through-hole of placing the chip on the support frame, and the chip passes through fixed establishment fixedly, and the push-type broach setting is on the blade holder, and blade holder slidable sets up on the slide rail. The utility model discloses a tin ball remove device for encapsulating chip, ball screw's rotation drives the broach and removes, and the broach is shoveled the tin ball on the encapsulating chip fast when removing, and the tin ball height that shovels is even, and the chip can not damaged, guarantees follow-up precision when detecting distortion and bow numerical value to the chip.
In one possible solution, the fixing mechanism comprises: a vacuum chuck and a vacuum generator;
the vacuum chuck is arranged on the support frame and is positioned below the rectangular through hole;
the vacuum generator is connected with the vacuum chuck, and the vacuum chuck is used for adsorbing the chip in the rectangular through hole.
In a feasible scheme, the tool apron is provided with an installation clamping groove, and the tool apron is provided with a first threaded hole at the installation clamping groove;
the push broach is provided with a mounting through hole;
the push broach is clamped in the mounting clamping groove and fixed on the tool apron through a connecting bolt and a butterfly nut.
In one possible embodiment, the method further comprises: a micrometer and a return spring;
the tool apron is provided with fixing lugs on two sides of the mounting clamping groove;
the push broach includes: a blade body part and a blade part;
the mounting through hole is a long hole and is arranged on the knife body part;
the knife body part is clamped in the mounting clamping groove, and the knife edge part is clamped between the fixing lugs;
the reset spring is arranged on the fixed lug, and the top end of the reset spring is abutted against the knife body;
the micrometer is arranged on the tool apron and located above the push broach, the micrometer is used for pushing the push broach to move downwards when rotating, and the reset spring is used for enabling the push broach to reset upwards.
In a feasible scheme, the fixing lug is provided with a first accommodating groove, and the cutter body part is provided with a second accommodating groove;
the first containing groove and the second containing groove are respectively used for embedding the bottom end and the top end of the reset spring.
In a possible scheme, the supporting frame is provided with a second threaded hole;
the support plate is provided with a mounting hole, so that the support plate is detachably arranged on the support frame through a bolt;
the thickness of the carrier plate corresponds to the thickness of the chip, so that the solder balls on the chip protrude out of the top surface of the carrier plate.
In a possible solution, the carrier plate is provided with notch grooves on two sides of the rectangular through hole.
In one possible solution, the carrier plate and the vacuum chuck are provided in plurality;
the plurality of carrier plates are linearly arranged on the support frame;
the plurality of suckers are respectively arranged at the plurality of carrier plates and are respectively connected with the vacuum generator.
In one possible solution, there are two push knives;
the plurality of carrier plates are arranged on two sides of the ball screw in two rows;
the two push knives are arranged on the knife holder and respectively correspond to the two rows of the carrier plates.
In one possible embodiment, the method further comprises: a solder ball collecting mechanism;
the solder ball collecting mechanism comprises: a collection container, a vacuum pump and a suction hose;
the collecting container is fixedly arranged and connected with the vacuum pump, and the vacuum pump is used for generating vacuum negative pressure in the collecting container;
the suction hose is connected with the collection container and is used for sucking the solder balls into the collection container.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a schematic front view of a solder ball removing device according to an embodiment of the present invention;
FIG. 2 is a schematic top view of a solder ball removing device according to an embodiment of the present invention;
FIG. 3 is a perspective view of a solder ball removing device in an embodiment of the present invention;
fig. 4 is an enlarged view of a point a in fig. 3 in an embodiment of the present invention;
FIG. 5 is a partial enlarged view of the tool holder according to an embodiment of the present invention;
fig. 6 is a schematic view of a push broach in an embodiment of the present invention;
fig. 7 is a schematic view of the installation of the push broach according to the embodiment of the present invention.
Reference numbers in the figures:
1. a support frame; 11. a supporting seat; 12. a slide rail; 21. a ball screw; 22. rotating the handle; 3. a carrier plate; 31. a rectangular through hole; 32. mounting holes; 33. a notch groove; 41. a vacuum chuck; 42. a vacuum conduit; 5. pushing a cutter; 501. a blade body portion; 502. a knife edge part; 51. mounting a through hole; 6. a tool apron; 61. installing a clamping groove; 62. a first threaded hole; 63. fixing the bump; 64. a first accommodating groove; 7. a butterfly bolt; 81. A micrometer; 82. a return spring.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
In the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as a fixed connection, a detachable connection, or an integral part; the connection can be mechanical connection, electrical connection or communication connection; either directly or indirectly through intervening media, either internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
The technical solution of the present invention will be described in detail with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
Fig. 1 is the embodiment of the present invention provides a schematic view of a tin ball removing device, fig. 2 is the embodiment of the present invention provides a schematic view of a tin ball removing device, fig. 3 is the embodiment of the present invention provides a perspective view of a tin ball removing device, fig. 4 is the embodiment of the present invention provides an enlarged view of a position a in fig. 3, fig. 5 is the embodiment of the present invention provides a local enlarged view of a tool holder, fig. 6 is the embodiment of the present invention provides a schematic view of a push broach, fig. 7 is the embodiment of the present invention provides an installation schematic view of a push broach. As shown in fig. 1 to 7, the solder ball removing apparatus for a packaged chip of the present embodiment includes: the device comprises a support frame 1, a ball screw 21, a rotating handle 22, a support plate 3, a fixing mechanism, a push broach 5 and a tool apron 6.
The support frame 1 is fixedly arranged on the workbench, the left side and the right side of a top plate of the support frame 1 are provided with support seats 11, and the front side and the rear side of the top plate of the support frame 1 are provided with slide rails 12.
The ball screw 21 is rotatably arranged on the support seat 11 of the support frame 1, and the ball screw 21 and the slide rail 12 on the support frame 1 are arranged in parallel.
The rotating handle 22 is fixedly arranged at one end of the ball screw 21, and the rotating handle 22 is rotated, so that the rotating handle 22 drives the ball screw 21 to rotate when rotating.
The carrier plate 3 is fixedly arranged on the top plate of the support frame 1, a rectangular through hole 31 is formed in the middle of the carrier plate 3, and the rectangular through hole 31 in the carrier plate 3 corresponds to the size of a chip to be detected. The chip is placed in the rectangular through hole 31 of the carrier plate 3, so that the chip is positioned on the top plate of the support frame 1.
The fixing mechanism is provided with a support frame 1, and after the chip is placed, the chip is fixed in the rectangular through hole 31 of the support plate 3 through the fixing mechanism.
The push broach 5 is arranged on the tool holder 6.
The two sides of the bottom of the tool apron 6 are provided with sliders 601, the tool apron 6 is slidably arranged on a slide rail 12 arranged on the support frame 1 through the bottom sliders 601, the tool apron 6 is engaged with a ball screw 21 on the support frame 1, the ball screw 21 drives the tool apron 6 and the push broach 5 to slide along the slide rail 12 on the support frame 1 when rotating, and the push broach 5 removes solder balls on a chip placed in the rectangular through hole 31 of the support plate 3 when sliding.
Through the above, it is not difficult to find that the tin ball removing device for packaging the chip of the embodiment is provided with the supporting seat and the sliding rail on the supporting frame by arranging the supporting frame, the ball screw, the rotating handle, the supporting plate, the fixing mechanism, the push broach and the tool apron, the ball screw is rotatably arranged on the supporting seat, the supporting plate is arranged on the supporting frame, the supporting plate is provided with the rectangular through hole for placing the chip, the chip is fixed by the fixing mechanism, the push broach is arranged on the tool apron, and the tool apron is slidably arranged on the sliding rail. The tin ball removing device for the packaged chip of the embodiment has the advantages that the rotation of the ball screw drives the push broach to move, the push broach quickly removes tin balls on the packaged chip when moving, the removed tin balls are highly uniform, the chip cannot be damaged, and the follow-up accuracy in detecting the distortion and bow values of the chip is guaranteed.
Optionally, as shown in fig. 1 and 4, in the solder ball removing apparatus for packaging a chip in this embodiment, the fixing mechanism includes: a vacuum chuck 41 and a vacuum generator.
The vacuum chuck 41 is disposed in the receiving groove of the top plate of the supporting frame 1 and below the rectangular through hole 31 of the carrier plate 3.
A vacuum generator (not shown) is provided on one side of the support frame 1 and is connected to the vacuum chuck 41 via a vacuum conduit 42. When the vacuum generator is turned on, the vacuum chuck 41 forms a vacuum negative pressure, and the vacuum chuck 41 adsorbs the chip placed in the rectangular through hole 31 of the carrier plate 3, so that the chip is fixed on the top plate of the support frame 1.
Optionally, as shown in fig. 5, 6, and 7, in the solder ball removing apparatus for packaging a chip in this embodiment, a mounting slot 61 is disposed on a side surface of the tool post 6, and the tool post 6 is provided with a first threaded hole 62 at the mounting slot 61.
The push broach 5 is provided with a mounting through hole 51.
The push broach 5 is clamped in the mounting clamping groove 61 of the tool apron 6, the butterfly bolt 7 penetrates through the mounting through hole 51 of the push broach 5 and is engaged in the first threaded hole 62 of the tool apron 6, and the butterfly bolt 7 fixes the push broach 5 on the tool apron 6 when being screwed.
Further, the solder ball removing apparatus for a packaged chip in this embodiment further includes: a micrometer 81 and a return spring 82.
The tool apron 6 is provided with fixing projections 63 at both sides of the lower end of the mounting slot 61.
The push broach 5 includes: a blade portion 501 and a blade portion 502.
The mounting through hole 51 of the push broach 5 is a long hole and is provided in the blade portion 501 of the push broach 5.
The blade portion 501 of the push broach 5 is clamped in the mounting slot 61 of the holder 6, and the blade portion 502 of the push broach 5 is clamped between the two fixing protrusions 63 of the holder 6.
The return spring 82 is provided on the fixing projection 63 of the holder 6, and the tip of the return spring 82 abuts against the blade portion 501 of the push broach 5.
The micrometer 81 is arranged at the top of the tool apron 6 through a fixing block and is positioned above the push broach 5. Rotating the micrometer 81, and pushing the push broach 5 to move downwards when an ejector rod of the micrometer 81 moves downwards; when the ejector rod of the micrometer 81 moves upward, the return spring 82 pushes the push broach 5 to move upward for return.
In the embodiment, the micrometer and the return spring are arranged, so that the push broach can slide up and down on the tool apron to adjust the height of the push broach; and the height of the push broach can be accurately adjusted by rotating the micrometer to push the push broach, so that the solder balls on the chip are completely removed.
Further, in the solder ball removing apparatus for packaging a chip in this embodiment, the top of the fixing bump 63 on the tool post 6 is provided with a first receiving groove 64, and the bottom of the blade portion 501 of the push broach 5 is provided with a second receiving groove (not shown).
The bottom end of the return spring 82 is inserted into the first receiving groove 64 of the fixing protrusion 63, and the top end of the return spring 82 is inserted into the second receiving groove of the blade portion 501 of the push broach 5, so as to prevent the return spring 82 from sliding off the holder 6.
Further, as shown in fig. 4, in the solder ball removing apparatus for packaging a chip in this embodiment, a top plate of the supporting frame 1 is provided with a second threaded hole.
Mounting holes 32 are formed at four top corners of the support plate 3, and fixing bolts pass through the mounting holes 32 of the support plate 3 and are meshed in second threaded holes of the support frame 1, so that the support plate 3 is detachably arranged on the top plate of the support frame 1.
The thickness of the carrier plate 3 corresponds to the design thickness of the chip, the chip is placed in the rectangular through hole 31 of the carrier plate 3, the chip is completely embedded in the rectangular through hole 31 of the carrier plate 3, and the solder balls on the chip completely protrude out of the top surface of the carrier plate 3. The height of the push broach 5 is adjusted by the micrometer 81 so that the bottom surface of the blade portion 502 abuts against the top surface of the carrier plate 3. The rotating handle is rotated, and the push broach completely eradicates the solder balls on the chip when moving.
In this embodiment, support plate detachable sets up on the support frame, to the chip of different thickness and shape, only need to change the support plate that corresponds the size with the chip adaptation, can detect the chip of different specifications, has increased the suitability and the adaptability of device.
Further, in the solder ball removing apparatus for packaging a chip in this embodiment, the carrier plate 3 is provided with a gap groove 33 at the inner walls of two sides of the rectangular through hole 31. After the solder balls on the packaged chip are removed, the fingers extend into the notch 33 of the carrier plate 3, so that the chip in the rectangular through hole 31 can be conveniently taken out. Of course, the chip with the solder balls removed can also be sucked out from the rectangular through hole of the carrier plate through the vacuum suction pen.
Optionally, in the solder ball removing apparatus for packaging a chip in this embodiment, a plurality of carrier plates 3 may be provided, the plurality of carrier plates 3 are linearly disposed on the top plate of the supporting frame 1, and a straight line formed by the plurality of carrier plates 3 is parallel to the sliding rail 12 on the supporting frame 1.
The fixing mechanisms are also provided with a plurality of vacuum suction cups 41 which are respectively arranged at the rectangular through holes 31 of the plurality of carrier plates 3 and are respectively connected with the vacuum emitters through vacuum guide pipes 42.
The rotation of the ball screw drives the tool apron and the push broach to move, and the push broach sequentially removes the solder balls on the chips on the plurality of loading plates which are arranged in a straight line when moving.
Further, in the solder ball removing apparatus for packaging a chip in this embodiment, two push knives 5 are provided.
The plurality of carrier plates 3 are arranged on the support frame 1 in two rows, and the two rows of carrier plates 3 are arranged on the front side and the rear side of the ball screw 21 in mirror symmetry.
The two push knives 5 are arranged on the knife holder 6, and the two push knives 5 respectively correspond to the two rows of support plates 3 on the support frame 1. The rotation of the ball screw drives the tool apron to move, and the two push knives respectively remove the solder balls on the chips which are arranged in a straight line on the corresponding side when moving.
Further, the solder ball removing apparatus for a packaged chip in this embodiment further includes: tin ball collecting mechanism.
The solder ball collection mechanism (not shown) includes: a collection vessel, a vacuum pump and a suction hose.
The collecting container is arranged on one side of the supporting frame and is connected with a vacuum pump, and the vacuum pump enables vacuum negative pressure to be generated in the collecting container when the vacuum pump is started.
One end of the suction hose is hermetically connected with the collection container, and after the solder balls on the chip are removed, the other end of the suction hose is placed on the support plate, so that the removed and fallen solder balls are sucked into the collection container, and the collection treatment of the fallen solder balls is completed.
In the present application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first feature or the second feature or indirectly contacting the first feature or the second feature through an intermediate.
Also, a first feature "on," "above," and "over" a second feature may mean that the first feature is directly above or obliquely above the second feature, or that only the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lower level than the second feature.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example" or "some examples," or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. A solder ball removing device for a packaged chip is characterized by comprising: the device comprises a support frame, a ball screw, a rotating handle, a support plate, a fixing mechanism, a push broach and a cutter holder;
the support frame is provided with a support seat and a slide rail;
the support frame is fixedly arranged;
the ball screw is rotatably arranged on the supporting seat, and the ball screw and the sliding rail are arranged in parallel;
the rotating handle is arranged at one end of the ball screw and is used for driving the ball screw to rotate;
the support plate is arranged on the support frame and is provided with a rectangular through hole, and a chip is placed in the rectangular through hole;
the fixing mechanism is provided with the support frame and is used for fixing the chip in the rectangular through hole;
the push broach is arranged on the tool apron;
the tool apron is arranged on the sliding rail in a sliding mode, the tool apron is meshed with the ball screw, the ball screw is used for driving the tool apron and the push broach to slide along the sliding rail when rotating, and the push broach is used for removing the solder balls on the chip in the rectangular through hole when sliding.
2. The solder ball removing apparatus for packaging chip of claim 1, wherein the fixing mechanism comprises: a vacuum chuck and a vacuum generator;
the vacuum chuck is arranged on the support frame and is positioned below the rectangular through hole;
the vacuum generator is connected with the vacuum chuck, and the vacuum chuck is used for adsorbing the chip in the rectangular through hole.
3. The solder ball removing apparatus for packaging a chip as claimed in claim 1, wherein the tool holder is provided with a mounting slot, and the tool holder is provided with a first threaded hole at the mounting slot;
the push broach is provided with a mounting through hole;
the push broach is clamped in the mounting clamping groove and fixed on the tool apron through a butterfly bolt.
4. The solder ball removing apparatus for packaging chip as claimed in claim 3, further comprising: a micrometer and a return spring;
the tool apron is provided with fixing lugs on two sides of the mounting clamping groove;
the push broach includes: a blade body part and a blade part;
the mounting through hole is a long hole and is arranged on the knife body part;
the knife body part is clamped in the mounting clamping groove, and the knife edge part is clamped between the fixing lugs;
the reset spring is arranged on the fixed lug, and the top end of the reset spring is abutted against the knife body;
the micrometer is arranged on the tool apron and located above the push broach, the micrometer is used for pushing the push broach to move downwards when rotating, and the reset spring is used for enabling the push broach to reset upwards.
5. The solder ball removing apparatus for packaging chip as claimed in claim 4, wherein the fixing protrusion has a first receiving groove, and the blade portion has a second receiving groove;
the first containing groove and the second containing groove are respectively used for embedding the bottom end and the top end of the reset spring.
6. The solder ball removing apparatus for packaging chip as claimed in claim 1, wherein said supporting frame is provided with a second threaded hole;
the support plate is provided with a mounting hole, so that the support plate is detachably arranged on the support frame through a bolt;
the thickness of the carrier plate corresponds to the thickness of the chip, so that the solder balls on the chip protrude out of the top surface of the carrier plate.
7. The apparatus of claim 6, wherein the carrier has a notch on both sides of the rectangular through hole.
8. The solder ball removing apparatus for packaging chip as claimed in claim 2, wherein a plurality of said carrier plate and said vacuum chuck are provided;
the plurality of carrier plates are linearly arranged on the support frame;
the plurality of suckers are respectively arranged at the plurality of carrier plates and are respectively connected with the vacuum generator.
9. The solder ball removing apparatus for packaging a chip as claimed in claim 8, wherein there are two push blades;
the plurality of carrier plates are arranged on two sides of the ball screw in two rows;
the two push knives are arranged on the knife holder and respectively correspond to the two rows of the carrier plates.
10. The solder ball removing apparatus for a packaged chip according to any one of claims 1 to 9, further comprising: a solder ball collecting mechanism;
the solder ball collecting mechanism comprises: a collection container, a vacuum pump and a suction hose;
the collecting container is fixedly arranged and connected with the vacuum pump, and the vacuum pump is used for generating vacuum negative pressure in the collecting container;
the suction hose is connected with the collection container and is used for sucking the solder balls into the collection container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120439618.3U CN214254364U (en) | 2021-03-01 | 2021-03-01 | Tin ball removing device for packaging chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120439618.3U CN214254364U (en) | 2021-03-01 | 2021-03-01 | Tin ball removing device for packaging chip |
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| CN214254364U true CN214254364U (en) | 2021-09-21 |
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| CN202120439618.3U Active CN214254364U (en) | 2021-03-01 | 2021-03-01 | Tin ball removing device for packaging chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117007420A (en) * | 2023-10-08 | 2023-11-07 | 苏州锐杰微科技集团有限公司 | Push-pull force testing machine for chip ball placement and working method |
-
2021
- 2021-03-01 CN CN202120439618.3U patent/CN214254364U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117007420A (en) * | 2023-10-08 | 2023-11-07 | 苏州锐杰微科技集团有限公司 | Push-pull force testing machine for chip ball placement and working method |
| CN117007420B (en) * | 2023-10-08 | 2024-01-05 | 苏州锐杰微科技集团有限公司 | Push-pull force testing machine for chip ball placement and working method |
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