CN215731606U

CN215731606U - Wafer support for dry cleaning equipment

Info

Publication number: CN215731606U
Application number: CN202121762552.8U
Authority: CN
Inventors: 任殿胜; 刘宇; 王建利; 张华�
Original assignee: Baoding Tongmei Crystal Manufacturing Co ltd
Current assignee: Baoding Tongmei Crystal Manufacturing Co ltd
Priority date: 2021-07-30
Filing date: 2021-07-30
Publication date: 2022-02-01
Anticipated expiration: 2031-07-30

Abstract

The utility model relates to a wafer support for a dry cleaning device, wherein the wafer support comprises: a base plate having a mounting surface; a plurality of holders mounted to the base plate, and mounting positions of the holders on the base plate being adjustable; and a plurality of supports, each of which is fixed to the mounting surface of the base plate and whose supporting surface for supporting the wafer is an arc-shaped surface, and each of which is equipped with at least two holders.

Description

Wafer support for dry cleaning equipment

Technical Field

The utility model relates to the technical field of semiconductor process equipment, in particular to a wafer support for dry cleaning equipment.

Background

Semiconductor wafers refer mainly to high value added products in the form of sheets (round) produced and processed from semiconductor materials, commonly referred to as wafers, such as Si sheets, GaAs sheets, Ge sheets, InP sheets, etc., and are widely used in the semiconductor industry.

Because the wafer has higher requirement on cleanliness, the wafer cleaning is the most important and most frequent part in the semiconductor manufacturing process, and the process quality directly influences the yield, performance and reliability of devices, the cleaning process is continuously researched by various companies, research institutions and the like at home and abroad. It is known that dry cleaning techniques, such as plasma cleaning or ozone cleaning, are commonly used in semiconductor manufacturing processes to effectively remove organic contaminants from the wafer surface and to activate surface properties.

The existing dry cleaning (such as plasma) equipment has the following problems when cleaning wafers: (1) directly placing the wafer on a quartz table in the equipment cavity, so that the back surface of the wafer directly contacts the quartz table, and the back surface of the wafer can be scratched or damaged; (2) because the surfaces of the wafer and the quartz platform are smooth, the wafer is easy to be absorbed on the quartz platform, and therefore, the wafer is difficult to take down after cleaning is finished; (3) the cleaning equipment needs to be vacuumized in the operation process, and in the process, because the quartz table is not provided with a device for fixing the wafer, the wafer can slide on the surface of the quartz table under the action of vacuum, and the back of the wafer can be scratched or damaged; (4) only one wafer can be cleaned at a time, and the cleaning efficiency is low.

Although some research has been done on wafer carriers, for example: a utility model named as a wafer boat and wafer carrying device (patent application number: 201720947526.X) provides a wafer boat and wafer carrying device, which can detect the wafer breaking condition; the utility model named "wafer carrier" (patent application number: 201820800876.8) provides a wafer carrier made of plastic which can reduce the falling of dust particles on the wafer; the utility model entitled "wafer tray and wafer support" (patent application No. 201621167918.6) provides a wafer tray and support, which solves the problems of easy wafer slipping, wafer cracking, etc., but the above mentioned wafer tray or support is not suitable for plasma cleaning equipment due to the limitation of specific structure and process characteristics of the plasma cleaning equipment.

Therefore, a need exists for a wafer support for a dry cleaning apparatus.

SUMMERY OF THE UTILITY MODEL

In order to solve the above-mentioned defects in the prior art, the present invention provides a wafer support for a dry cleaning apparatus, which can prevent a wafer from being scratched and damaged.

Specifically, the utility model provides a wafer support for a dry cleaning device, comprising:

a base plate having a mounting surface;

a plurality of holders mounted to the base plate, and mounting positions of the holders on the base plate being adjustable; and

a plurality of supports, each of which is fixed to the mounting surface of the base plate and a supporting surface of each of which for supporting a wafer is an arc-shaped surface, and each of which is equipped with at least two holders.

In a preferred embodiment of the present invention, each support member is provided at an outer side thereof with at least two mounting grooves, and the holder is mounted to the corresponding mounting groove and is movable along the mounting groove. Advantageously, by moving the retaining members along the mounting slot, the distance between the retaining members can be varied, thereby accommodating wafers of different sizes.

In a preferred embodiment of the present invention, a plurality of sets of mounting holes are provided on an outer side of each of the supporting members, and the holder is mounted to the corresponding mounting hole. Advantageously, each set of mounting holes corresponds to one size of wafer, and the holder can be adapted to hold wafers of different sizes by selectively mounting the holder in the corresponding mounting hole.

In a preferred embodiment of the utility model, the holder comprises a holding rod and a holding head which can be rotated relative to the holding rod or moved along the holding rod. Advantageously, by adjusting the position of the retaining head, the operating space of the wafer can be increased, which facilitates the handling of the wafer.

In a preferred embodiment of the present invention, a handle is provided on the base plate. Advantageously, the operator can move the base plate by means of a handle.

In a preferred embodiment of the present invention, the bottom surface of the base plate opposite to the mounting surface is an uneven surface. Advantageously, providing the base plate with a rough surface may further increase the stability.

In a preferred embodiment of the utility model, the distance between the support surface and the mounting surface is in the range of 1.5cm to 5 cm. Advantageously, the distance between the support surface and the mounting surface allows the vacuum wand to pick and place the wafer while plasma cleaning the wafer.

In a preferred embodiment of the utility model, the support is a U-shaped bar.

According to the wafer support for the dry cleaning equipment, the back surface of the wafer can be prevented from being scratched or damaged in the dry cleaning process, the wafer is convenient to take and place, and the wafer cleaning efficiency is improved.

Drawings

Advantages and features of the present invention will now be described in detail with reference to the accompanying drawings, wherein the various parts are not necessarily drawn to scale, and wherein:

FIG. 1 is a schematic view of a wafer support according to one embodiment of the present invention;

FIG. 2 is a schematic view of a wafer support according to another embodiment of the present invention;

fig. 3 is a schematic view of the wafer carrier of fig. 1 carrying a wafer.

Wherein, 1, a bottom plate; 2. a support member; 3. a holder; 4. mounting holes; 5. a handle; 11. A mounting surface; 31. a holding head; 32. a holding rod; 100. and a wafer support.

It is to be understood that the drawings are designed solely for the purposes of illustration and not as a definition of the limits of the utility model.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. It is to be understood that the following embodiments are illustrative only and are not limiting of the utility model. The scope of the utility model is defined by the claims. It should also be understood that not all of the features of the embodiments described below need be included in the practice of the present invention, and that various combinations of these features are possible.

Referring to fig. 1 to 3, a wafer support 100 includes: a base plate 1, a support 2 and a holder 3. The base plate 1 has a mounting surface 11 and a bottom surface opposite to the mounting surface 11. The support 2 is fixed (e.g. by welding or form-fitting) on the mounting surface 11 of the base plate 1, and the holder 3 is mounted to the base plate 1 around the support 2. As shown in fig. 1, the wafer support 100 includes 3 supports 2, and each support 2 is equipped with 4 holders. It is to be understood that the wafer support 100 may be provided with 2 (see fig. 2), 4, 5 or more supports 2, and each support 2 is equipped with at least two holders 3 so that the wafer is held in at least two directions to prevent the wafer from sliding or flipping with respect to the support 2.

As shown in the embodiment of fig. 1, the outer side of each support member 2 is provided with a plurality of sets of mounting holes 4, preferably 3 sets of mounting holes 4, and the holder member 3 is detachably mounted in one set of the mounting holes 4. Here, each set of mounting holes 4 corresponds to one size of wafer. For example, a set of mounting holes 4 closest to support 2, i.e., a first set of mounting holes, corresponds to a 2, 3 inch wafer, a set of mounting holes 4 furthest from support 2, i.e., a third set of mounting holes, corresponds to a 6 inch wafer, and a second set of mounting holes between the first set of mounting holes and the third set of mounting holes corresponds to a 4 inch wafer. The mounting hole 4 is preferably a blind hole for receiving the holder 3. When holder 3 is mounted to the first set of mounting holes, it is adapted to hold 2, 3 "wafers, and similarly, when holder 3 is mounted to the second and third sets of mounting holes, it is adapted to hold 4" and 6 "wafers, respectively. Alternatively, there may be more than 3 sets of mounting holes, and the holder 3 may be adapted to hold wafers of different sizes by selectively fitting the holder 3 into the corresponding mounting holes. Alternatively, the support 2 may support wafers of different sizes, for example, a 2 inch wafer, a 3 inch wafer, a 4 inch wafer, and a 6 inch wafer may be placed simultaneously in one wafer holder.

Preferably, the supporting surface of the support 2 for supporting the wafer is a smooth arc surface, and when the wafer is placed on the supporting surface of the support 2, a line contact is formed between the wafer and the top of the supporting surface to reduce the contact area of the wafer and the support 2, thereby preventing a large area scratch due to an accidental sliding of the wafer. In the embodiment shown, the support 2 is made of quartz, and is preferably in the form of a U-shaped bar. Alternatively, the support 2 may be made of marble and may be shaped as a frame structure whose support surface for supporting the wafer is preferably a smooth arc-shaped surface.

In another preferred embodiment, each support member 2 is provided at its outer side with at least two mounting slots, into which the holder 3 is fitted and can move along. Similar to the above embodiment, the holder is fixed at different mounting positions by moving the holder along the mounting groove, thereby being suitable for holding wafers of different sizes.

In a preferred embodiment, the holder 3 comprises a holding head 31 and a holding rod 32, the holding head 31 being mounted on the holding rod 32, the holder 3 being mounted in the mounting hole 4, or in the mounting groove, by means of the holding rod 32. Alternatively, the retaining head 31 and the retaining rod 32 are both cylindrical, and the retaining head 31 projects radially with respect to the retaining rod 32, forming a projection. The wafer can be pressed against the support 2 by means of the projections of the retaining head 31. Alternatively, the holding head 31 may be provided with receiving recesses for receiving the wafers to hold them in place. Still alternatively, the holding head 31 may be a lip projecting with respect to the holding rod 31, by means of which the wafer is pressed against the support 2. Preferably, the holding head 31 is movable relative to the holding bar 32, for example may rotate relative to the holding bar 32, or may move along the holding bar 32 to make room for placing the wafer. The position of the retaining head 31 may be adjusted during wafer handling, thereby increasing the operating space of the wafer handling device (e.g., vacuum chuck), which facilitates wafer handling.

In a preferred embodiment, the base plate 1 may be provided with a handle 5, preferably on one side of the base plate 1, to facilitate movement of the base plate 1 by an operator.

In a preferred embodiment, the bottom surface of the base plate 1 opposite to the mounting surface 11 is an uneven surface, for example formed by etching, so as to increase the roughness of the bottom surface of the base plate 1 to further avoid slipping of the base plate 1 during dry cleaning.

In a preferred embodiment, the distance between the supporting surface of the support 2 and the mounting surface 11 of the base plate 1 is in the range of 1.5cm to 5 cm. Preferably, the distance between the support surface of the support 2 and the mounting surface 11 of the base plate 1 is in the range of 3cm to 5 cm. In this way, the wafer is prevented from being adsorbed on the bottom plate 1, and an operation space for the vacuum suction pen to take and place the wafer is formed.

Considering that dry cleaning equipment, particularly plasma cleaning equipment, may involve high-energy operation, the base plate 1, the support member 2, the holder 3, and the handle 5, etc. are preferably made of an inorganic compound material having high stability, for example, silicon carbide, silica (such as quartz, marble), etc., and more preferably, the base plate 1, the support member 2, the holder 3, and the handle 5 are all made of a high-purity silicon material.

It is to be understood that various modifications or alterations may readily occur to those skilled in the art, in light of the above disclosure of the present invention. However, any improvements, variations or modifications to the present invention without departing from the true spirit thereof are intended to be included within the scope of the following claims.

Claims

1. A wafer support for a dry cleaning apparatus, the wafer support comprising:

a base plate having a mounting surface;

2. The wafer support according to claim 1, wherein each support member is provided at an outer side thereof with at least two mounting grooves, and the holder member is mounted in the corresponding mounting groove and is movable along the mounting groove.

3. The wafer carrier as claimed in claim 1, wherein each support member is provided with a plurality of sets of mounting holes on an outer side thereof, and the holder member is mounted in the corresponding mounting hole.

4. The wafer holder according to any of claims 1-3, wherein the holder comprises a holding rod and a holding head, the holding head being rotatable relative to the holding rod or movable along the holding rod.

5. The wafer carrier as claimed in any one of claims 1 to 3, wherein a handle is provided on the base plate.

6. A wafer support according to any one of claims 1 to 3, wherein the underside of the base opposite the mounting surface is a rugged surface.

7. The wafer support of any of claims 1-3, wherein a distance between the support surface and the mounting surface is in a range of 1.5cm to 5 cm.

8. The wafer carrier as claimed in any one of claims 1 to 3, wherein the support is a U-shaped bar.