CN220856530U - Auxiliary device for placing wafer into wafer box - Google Patents
Auxiliary device for placing wafer into wafer box Download PDFInfo
- Publication number
- CN220856530U CN220856530U CN202322491468.2U CN202322491468U CN220856530U CN 220856530 U CN220856530 U CN 220856530U CN 202322491468 U CN202322491468 U CN 202322491468U CN 220856530 U CN220856530 U CN 220856530U
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- China
- Prior art keywords
- wafer
- placing
- adjusting mechanism
- vacuum suction
- height adjusting
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- 235000012431 wafers Nutrition 0.000 claims abstract description 93
- 238000000034 method Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 238000012856 packing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses an auxiliary device for placing wafers into a wafer box, and belongs to the technical field of wafer taking and placing. The vacuum suction pen comprises a base and a height adjusting mechanism, wherein one end of the height adjusting mechanism is fixedly arranged at one end of the base, the other end of the height adjusting mechanism is connected with a connecting rod in a sliding mode, a moving rod is fixedly arranged on the connecting rod, and the moving rod is used for supporting the vacuum suction pen. The utility model is provided with the height adjusting mechanism, can adapt to wafer boxes with different sizes, and can place the vacuum suction pen on the moving rod to place the wafer by adjusting the position of the moving rod to the position of the corresponding wafer groove to be placed, thereby reducing the shake of the vacuum suction pen and avoiding the wafer from touching the wafer groove and the adjacent wafer in the process of placing and taking the wafer.
Description
Technical Field
The utility model relates to the technical field of wafer taking and placing, in particular to an auxiliary device for placing wafers into wafer boxes.
Background
During the production process, semiconductor wafer production and processing enterprises often need operators to take out or put in wafers from wafer boxes or move the wafers in different wafer boxes. Since the wafer is already very perfect on its surface at the end of processing and the wafer is relatively fragile, it is not allowed to directly contact the surface of the wafer by hand and must be handled by means of special tools. In the current production and processing process of semiconductor wafers, a vacuum suction pen is basically used, and the vacuum suction pen is made of special design and manufactured in material and shape, and is contacted with the back surface of the wafer, so that the wafer is not damaged or polluted. After the vacuum suction pen contacts the back surface of the wafer, the wafer is sucked by utilizing vacuum suction force, and then an operator can hold the handle of the vacuum suction pen to suck and move the wafer.
Wafer cassettes for storing wafers generally have 25 wafers placed in each cassette, a small gap between wafers, and a narrow slot, and even a skilled operator for many years, it is difficult to avoid the situation that the wafer surface touches the slot of the packing box when placing or taking out wafers from the packing box during the production operation, and this situation is more likely to occur when handling large-sized wafers. Patent CN214542174U discloses a wafer pick-and-place device, which comprises a mounting plate, wherein the mounting plate can be connected with a wafer placing box in a sliding way, and at least one guide hole which can enable a wafer and a vacuum suction pen to pass through is arranged on the mounting plate. When the wafer taking device is used, the mounting plate is pushed, the mounting plate slides to the guide hole of the mounting plate, after the wafer to be taken out in the wafer placing box is aligned, the wafer is adsorbed by the vacuum suction pen, then the wafer passes through the guide hole under the adsorption action of the vacuum suction pen, and the wafer taking action is completed.
Therefore, there is a need for an auxiliary device for placing wafers into a wafer cassette.
Disclosure of utility model
Based on the problems in the prior art, the utility model provides an auxiliary device for placing wafers into wafer boxes, and specifically discloses the following technical scheme:
the utility model provides an auxiliary device of wafer case is gone into to placing wafer, includes base and heightening mechanism, heightening mechanism one end fixed mounting in base one end, the other end sliding connection has the connecting rod, the fixed movable rod that is equipped with on the connecting rod, the movable rod is used for supporting the vacuum suction pen.
Further, the height-adjusting mechanism is two telescopic rods, the two fixed ends of the telescopic rods are respectively and fixedly arranged on two sides of one end of the base, and a connecting rod is connected between the telescopic ends in a sliding mode.
Further, the telescopic end of the telescopic rod is provided with a moving groove, and both ends of the connecting rod penetrate through the moving groove and are in sliding connection with the telescopic rod.
Further, a positioning groove is formed in the base and used for positioning the wafer box.
The utility model has the beneficial effects that:
The wafer box is provided with the height adjusting mechanism, so that the wafer box can adapt to wafer boxes with different sizes, and the vacuum suction pen is leaned against the moving rod to pick and place wafers by adjusting the position of the moving rod to the position of the corresponding wafer slot to be picked and placed, so that the shake of the vacuum suction pen is reduced, and the wafer box is prevented from touching the wafer slot and the adjacent wafers in the wafer picking and placing process; the base is provided with a positioning groove for positioning the wafer box.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present utility model, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of an auxiliary device for placing wafers into a wafer box according to the present utility model.
Fig. 2 is a schematic structural view of a wafer cassette according to the present utility model.
Wherein, in the figure:
1. A base; 2. a positioning groove; 3. a telescopic rod; 4. a connecting rod; 5. a moving rod; 6. a wafer box; 61. and (5) positioning blocks.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-2, the utility model provides an auxiliary device for placing wafers into wafer boxes, which comprises a base 1 and a height adjusting mechanism, wherein one end of the height adjusting mechanism is fixedly arranged at one end of the base 1, the other end of the height adjusting mechanism is connected with a connecting rod 4 in a sliding manner, a movable rod 5 is fixedly arranged on the connecting rod 4, and the movable rod 5 is used for supporting a vacuum suction pen. The height of the connecting rod 4 can be adjusted through the height adjusting mechanism so as to adapt to wafer boxes with different sizes, and the vacuum suction pen is leaned against the moving rod 5 to pick and place wafers by adjusting the position of the moving rod 5 to the position of preparing to pick and place corresponding wafer grooves, so that the shake of the vacuum suction pen is reduced, and the wafer picking and placing process is prevented from touching the wafer grooves and adjacent wafers.
The height-adjusting mechanism is two telescopic rods 3, the telescopic rods 3 are electric telescopic rods, the fixed ends of the two telescopic rods 3 are respectively and fixedly arranged on two sides of one end of the base 1, a connecting rod 4 is connected between the telescopic ends in a sliding mode, and the height of the connecting rod 4 can be adjusted.
The telescopic end of the telescopic rod 3 is provided with a moving groove, two ends of the connecting rod 4 penetrate through the moving groove and are in sliding connection with the telescopic rod 3, and the connecting rod 4 can slide along the moving groove, so that the position of the moving rod 5 is adjusted.
The base 1 is provided with a positioning groove 2, the bottom of the wafer box 6 is provided with a positioning block 61, and the positioning groove 2 is adapted to the positioning block 61 and is used for placing and accurately positioning the wafer box 6.
The working principle of the utility model is as follows:
When an operator uses the vacuum suction pen to take and put wafers from the wafer box, the lifting rod can be adjusted to a proper height so as to adapt to the wafer boxes with different sizes; and then adjusting the position of the moving rod to the position of the corresponding wafer groove to be taken and placed, and placing the vacuum suction pen against the moving rod to take and place the wafer. Because of the limit of the movable rod, the shake of the suction pen is reduced by leaning on the movable rod, and the wafer can not touch the wafer groove and the adjacent wafer in the process of taking and placing.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (4)
1. The auxiliary device for placing the wafer into the wafer box is characterized by comprising a base (1) and a height adjusting mechanism, wherein one end of the height adjusting mechanism is fixedly arranged at one end of the base (1), the other end of the height adjusting mechanism is connected with a connecting rod (4) in a sliding mode, a movable rod (5) is fixedly arranged on the connecting rod (4), and the movable rod (5) is used for supporting a vacuum suction pen.
2. The auxiliary device for placing wafers into the wafer box according to claim 1, wherein the height adjusting mechanism comprises two telescopic rods (3), the fixed ends of the two telescopic rods (3) are respectively and fixedly arranged on two sides of one end of the base (1), and a connecting rod (4) is slidably connected between the telescopic ends.
3. An auxiliary device for placing wafers into a wafer box according to claim 2, wherein the telescopic end of the telescopic rod (3) is provided with a moving groove, and both ends of the connecting rod (4) penetrate through the moving groove and are in sliding connection with the telescopic rod (3).
4. An auxiliary device for placing wafers into a wafer box according to claim 1, wherein the base (1) is provided with a positioning groove (2) for positioning the wafer box (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322491468.2U CN220856530U (en) | 2023-09-14 | 2023-09-14 | Auxiliary device for placing wafer into wafer box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322491468.2U CN220856530U (en) | 2023-09-14 | 2023-09-14 | Auxiliary device for placing wafer into wafer box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220856530U true CN220856530U (en) | 2024-04-26 |
Family
ID=90787690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322491468.2U Active CN220856530U (en) | 2023-09-14 | 2023-09-14 | Auxiliary device for placing wafer into wafer box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220856530U (en) |
-
2023
- 2023-09-14 CN CN202322491468.2U patent/CN220856530U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |