CN216902864U

CN216902864U - Sheet taking device applied to semiconductor wafer processing

Info

Publication number: CN216902864U
Application number: CN202220382651.1U
Authority: CN
Inventors: 吕可慧
Original assignee: Qingdao Istarwafer Technology Co ltd
Current assignee: Qingdao Istarwafer Technology Co ltd
Priority date: 2022-02-24
Filing date: 2022-02-24
Publication date: 2022-07-05
Anticipated expiration: 2032-02-24

Abstract

The utility model discloses a wafer taking device applied to semiconductor wafer processing, which comprises a wafer loading box, a wafer taking device and a wafer, wherein the wafer loading box comprises a first side edge and a second side edge, bottom plates are arranged at the bottoms of the first side edge and the second side edge and are in U-shaped surfaces, and loading grooves are formed in the first side edge and the second side edge; get piece device and include the sucking disc, the absorption hole has been seted up at the top of sucking disc, and one side of sucking disc outside is provided with the light sense device, and the inside of sucking disc is provided with the vacuum adsorption structure. Through with the sucking disc by lower extreme rebound, when the light sense device detected the top and had the wafer, the absorption hole adsorbs the wafer at the sucking disc top, just accomplishes the operation of getting the piece to the wafer, and the device reduces equipment required precision, avoids getting the piece that the in-process collision of piece caused, and the wafer loads the box and can use for a long time, need not worry the deformation problem to it is not high to require to the sucking disc material.

Description

Sheet taking device applied to semiconductor wafer processing

Technical Field

The utility model relates to the technical field of semiconductor wafer processing, in particular to a wafer taking device applied to semiconductor wafer processing.

Background

The semiconductor wafer is mostly a semiconductor silicon wafer, silicon is a gray, fragile and quadrivalent nonmetallic chemical element, 27.8% of earth crust components are composed of silicon elements, the second is oxygen elements, silicon is the most abundant element in nature, and after the semiconductor wafer is produced, reflectivity measurement, fluorescence measurement and the like are required to be carried out

In the course of automated processing of semiconductor wafers, the wafers must be removed from the wafer cassette and then carried to the next processing station. In the traditional wafer taking device, a fork arm directly extends into each layer of a clamping plug, and the fork arm is subjected to vacuum adsorption to suck and take out a wafer. Because the interval between the layers of the wafer loading box is smaller, especially when a first wafer at the lower end is taken and placed, the interval between the wafer loading box and the supporting cross beam at the lower end of the blocking box is smaller, and the lower end of the fork arm is easy to collide with the cross beam; and along with loading the deformation of long-time use of box, the original coordinate of setting for of yoke is no longer accurate, produces the collision more easily, consequently needs a novel piece device of getting.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a wafer taking device applied to semiconductor wafer processing.

In order to achieve the purpose, the utility model adopts the following technical scheme: the wafer taking device comprises a wafer loading box, a wafer taking device and a wafer, wherein the wafer loading box comprises a first side edge and a second side edge, bottom plates are arranged at the bottoms of the first side edge and the second side edge and are U-shaped surfaces, and loading grooves are formed in the first side edge and the second side edge;

get piece device and include the sucking disc, the absorption hole has been seted up at the top of sucking disc, one side of sucking disc outside is provided with the light sense device, the inside of sucking disc is provided with the vacuum adsorption structure.

Preferably, the top of the opposite side of the first side and the second side is provided with a connecting rod.

Preferably, the bottom of the sucker is provided with an operating handle.

Preferably, the number of the adsorption holes is at least four, and the adsorption holes are uniformly distributed on the top of the sucker.

Preferably, the connecting groove has all been seted up to the bottom on first side and second side, the top on first side and second side all is provided with the connecting block with connecting groove looks adaptation.

Compared with the prior art, the utility model has the beneficial effects that: in the utility model, the suction disc moves upwards from the lower end, when the light sensing device detects that the wafer is on the upper side, the adsorption holes adsorb the wafer on the top of the suction disc, so that the wafer taking operation is completed.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the utility model and together with the description serve to explain the utility model without limiting the utility model. In the drawings:

FIG. 1 is a schematic view of an appearance structure according to the present invention;

FIG. 2 is a schematic view of a wafer cassette according to the present invention;

FIG. 3 is a bottom view of a wafer cassette according to the present invention;

fig. 4 is a schematic structural diagram of a sheet taking device according to the present invention.

Number in the figure: 1. a wafer loading cassette; 101. a first side edge; 102. a second side edge; 103. a base plate; 104. a loading slot; 2. a connecting rod; 3. a film taking device; 301. a suction cup; 302. an adsorption hole; 303. a light sensing device; 4. an operating handle; 5. a wafer; 6. connecting grooves; 7. and (4) connecting the blocks.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Example (b): referring to fig. 1-4, a wafer taking device applied to semiconductor wafer processing includes a wafer loading box 1, a wafer taking device 3 and a wafer 5, where the wafer loading box 1 includes a first side 101 and a second side 102, bottom plates 103 are disposed at bottoms of the first side 101 and the second side 102, the bottom plates 103 are disposed in a U-shaped manner, and loading grooves 104 are disposed inside the first side 101 and the second side 102; get piece device 3 and include sucking disc 301, absorption hole 302 has been seted up at the top of sucking disc 301, sucking disc 301 outside one side is provided with light sense device 303, sucking disc 301's inside is provided with the vacuum adsorption structure, through with sucking disc 301 by lower extreme rebound, when light sense device 303 detects the top has wafer 5, the inside vacuum adsorption structure of sucking disc 301 starts, thereby adsorb wafer 5 through absorption hole 302, just accomplish the operation of getting piece to wafer 5, the device reduces equipment required precision, avoid getting the piece that the piece in-process collision caused, wafer loading box 1 can be used for a long time, needn't worry the deformation problem, and it is not high to expect the sucking disc 301 material.

In the present invention, the top of the opposite sides of the first side 101 and the second side 102 is provided with the connecting rod 2, so that the first side 101 and the second side 102 are stably connected.

In the utility model, the bottom of the suction cup 301 is provided with the operating handle 4, and the arrangement of the operating handle 4 is convenient for a worker to operate the suction cup 301.

In the utility model, the number of the suction holes 302 is at least four, and the suction holes are uniformly distributed on the top of the suction cup 301, so that the wafer 5 can be well sucked on the top of the suction cup 301, and the wafer taking effect of the suction cup 301 on the wafer 5 is improved.

In the utility model, the connecting grooves 6 are respectively arranged at the bottoms of the first side 101 and the second side 102, the connecting blocks 7 matched with the connecting grooves 6 are respectively arranged at the tops of the first side 101 and the second side 102, and when a plurality of wafer loading boxes 1 are stacked through the connecting grooves 6 and the connecting blocks 7, the connecting blocks 7 at the tops of the wafer loading boxes 1 at the bottom are correspondingly inserted into the connecting grooves 6 at the bottoms of the wafer loading boxes 1 at the top, so that the stable placement among the wafer loading boxes 1 is improved.

The working principle is as follows: in the use of the present invention, when a plurality of wafer cassettes 1 are stacked, the connection block 7 located at the top of the bottom wafer cassette 1 is inserted into the connection groove 6 located at the bottom of the top wafer cassette 1, the bottom plate 103 is located at the bottom, the loading groove 104 is used for placing the wafer 5, when taking out the wafer 5, the suction cup 301 is extended into the wafer loading cassette 1 from the bottom to the top by the operation handle 4, and when taking out the wafer, the suction cup 301 is moved upward from the lower end, when the photo sensor 303 detects that there is a wafer 5 on the wafer, the vacuum structure inside the chuck 301 is activated, and as the chuck 301 slowly moves upward, when the chuck 301 contacts the wafer 5, the vacuum structure reaches a certain value, thereby sucking the wafer 5 through the sucking hole 302, sucking the wafer 5 on the top of the suction cup 301, then drawing the handle 4 and the suction cup 301 outward, taking out the wafer 5 and putting it into the next station.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims

1. A take piece device for semiconductor wafer processing, includes wafer loading box (1), takes piece device (3) and wafer (5), its characterized in that: the wafer loading box (1) comprises a first side edge (101) and a second side edge (102), bottom plates (103) are arranged at the bottoms of the first side edge (101) and the second side edge (102), the bottom plates (103) are arranged in a U-shaped surface, and loading grooves (104) are formed in the first side edge (101) and the second side edge (102);

get piece device (3) and include sucking disc (301), absorption hole (302) have been seted up at the top of sucking disc (301), one side of sucking disc (301) outside is provided with light sense device (303), the inside of sucking disc (301) is provided with the vacuum adsorption structure.

2. The wafer taking device applied to semiconductor wafer processing as claimed in claim 1, wherein: and the top parts of the opposite sides of the first side edge (101) and the second side edge (102) are provided with connecting rods (2).

3. The wafer taking device applied to semiconductor wafer processing as claimed in claim 1, wherein: the bottom of the sucker (301) is provided with an operating handle (4).

4. The wafer taking device applied to semiconductor wafer processing as claimed in claim 1, wherein: the number of the adsorption holes (302) is at least four, and the adsorption holes are uniformly distributed on the top of the sucker (301).

5. The wafer taking device applied to semiconductor wafer processing as claimed in claim 1, wherein: connecting groove (6) have all been seted up to the bottom of first side (101) and second side (102), the top of first side (101) and second side (102) all is provided with connecting block (7) with connecting groove (6) looks adaptation.