CN220821515U

CN220821515U - Automatic handling equipment for wafer transmission

Info

Publication number: CN220821515U
Application number: CN202322615272.XU
Authority: CN
Inventors: 旷贤国; 李佳晖
Original assignee: Wuxi Xinyun Intelligent Technology Co ltd
Current assignee: Wuxi Xinyun Intelligent Technology Co ltd
Filing date: 2023-09-26
Publication date: 2024-04-19
Anticipated expiration: 2033-09-26

Abstract

The utility model relates to an automatic wafer transmission handling device, comprising: the machine frame is provided with an adsorption table, the upper surface of the machine frame is provided with a positioning groove, the machine frame is provided with a plurality of adsorption holes, the adsorption holes are used for being connected with a vacuumizing system, and the positioning groove is also provided with a plurality of positioning holes; the adsorption table is in power connection with the driving motor through a belt transmission mechanism and moves along the horizontal guide rail; the support columns are used for being matched with the positioning holes, the bottom ends of the support columns are connected with the support plates, springs are sleeved on the support columns, one ends of the springs are connected with the bottom surface of the adsorption table, and the other ends of the springs are connected with the support plates; the bottom of the jacking plate is connected with the output end of the jacking mechanism, and the top of the jacking plate is positioned below the supporting plate; the contact switch is arranged below the supporting plate and is in signal connection with a controller of the vacuumizing system; the manipulator, the execution end is sheet structure, and its controller is connected with contact switch signal. The precision of picking, placing and positioning in the wafer movement process is realized, the time is saved, and the efficiency is improved.

Description

Automatic handling equipment for wafer transmission

Technical Field

The utility model relates to the technical field of wafer processing devices, in particular to automatic wafer conveying equipment.

Background

In the prior art, as the wafer size becomes smaller and thinner, the wafer is easily bent when the wafer handling device fixes the wafer edge through the clamping head. In contrast, the wafer is integrally lifted up and put down like a shovel by using the manipulator executing end of the sheet-shaped structure, so that the problem that the wafer is bent under the action of gravity due to the clamping edge can be prevented. However, when the "spade" scoops the wafer, a receiving space for receiving the "spade" needs to be provided between the wafer and the positioning table. The space can lead to the fact that the 'spade' cannot be accurately positioned when the wafer is placed, so that automatic wafer conveying and carrying equipment is required to be designed, and accurate taking, placing and positioning of the wafer are facilitated.

Disclosure of utility model

Aiming at the defects of the prior art, the utility model provides automatic wafer transmission carrying equipment, which realizes the precision of picking, placing and positioning in the wafer movement process, so as to save time and improve efficiency.

The technical scheme adopted by the utility model is as follows:

An automatic wafer transfer handling apparatus comprising:

The vacuum suction device comprises a frame, wherein an adsorption table is arranged on the frame, a positioning groove is formed in the upper surface of the adsorption table, the positioning groove is round, a plurality of adsorption holes are formed in the positioning groove, the adsorption holes are used for being connected with a vacuum pumping system, and a plurality of positioning holes are further formed in the positioning groove;

The support columns are used for being matched with the positioning holes, the bottom ends of the support columns are connected with the support plates, springs are sleeved on the support columns, one ends of the springs are connected with the bottom surface of the adsorption table, and the other ends of the springs are connected with the support plates;

The bottom of the jacking plate is connected with the output end of the jacking mechanism, and the top of the jacking plate is positioned below the supporting plate;

The contact switch is arranged below the supporting plate and is in signal connection with a controller of the vacuumizing system;

The adsorption table is in power connection with the driving motor through a belt transmission mechanism and moves along the horizontal guide rail;

and the execution tail end of the manipulator is of a sheet structure, and the manipulator controller is in signal connection with the contact switch.

The further technical scheme is as follows:

The upper surface of the positioning groove is also provided with a diversion trench, the bottom of the diversion trench is lower than that of the positioning groove, and the orifice of the adsorption hole is positioned in the diversion trench.

The diversion trench comprises a plurality of coaxial annular grooves which are distributed at intervals along the radial direction, and a linear groove which communicates the annular grooves.

And a positioning sheet is arranged on one side of the horizontal guide rail, the positioning sheet is driven by an air cylinder to perform linear movement, and the moving direction is perpendicular to the moving direction of the adsorption table, so that the position of the adsorption table perpendicular to the moving direction is finely adjusted.

Photoelectric switches are respectively arranged at the two ends and the middle of the frame, which are close to the moving path of the adsorption table.

The support column is made of PEEK.

And a yielding groove is formed in the upper surface of the adsorption table, and the depth of the yielding groove is greater than that of the positioning groove.

The beneficial effects of the utility model are as follows:

According to the utility model, the automatic accurate taking, placing and positioning of the wafer are realized by using the mechanical arm, the supporting column and the lifting mechanism, the adsorption of the wafer is realized by using the vacuum system, the transportation is realized by using the adsorption table, and the wafer with the applicable size of 6 inches, 8 inches and 12 inches can be transported and processed each time, so that the process time is shortened and the working efficiency is improved.

Additional features and advantages of the utility model will be set forth in the description which follows, or may be learned by practice of the utility model.

Drawings

Fig. 1 is a schematic perspective view of the present utility model.

Fig. 2 is an enlarged view of a portion a in fig. 1.

Fig. 3 is another view of fig. 1.

In the figure: 1. an adsorption table; 2. a positioning sheet; 3. a drive belt; 4. a horizontal guide rail; 5. a cylinder; 6. a first photoelectric switch; 7. a second photoelectric switch; 8. a positioning groove; 9. a diversion trench; 10. adsorption holes; 11. a manipulator; 12. a relief groove; 13. positioning holes; 14. a support column; 15. a support plate; 16. a jacking mechanism; 17. a jacking plate; 18. a contact switch; 19. a driving motor; 20. a third photoelectric switch; 21. a frame.

Detailed Description

The following describes specific embodiments of the present utility model with reference to the drawings.

As shown in fig. 1, 2 and 3, the wafer transfer automatic conveyance apparatus of the present embodiment includes:

The machine frame 21 is provided with an adsorption table 1, the upper surface of the adsorption table 1 is provided with a positioning groove 8, the positioning groove 8 is round, a plurality of adsorption holes 10 are formed in the positioning groove 8, the adsorption holes 10 are used for being connected with a vacuumizing system, and the positioning groove 8 is also provided with a plurality of positioning holes 13;

the support columns 14 are used for being matched with the positioning holes 13, the bottom ends of the support columns 14 are connected with the support plates 15, springs are sleeved on the support columns 14, one ends of the springs are connected with the bottom surface of the adsorption table 1, and the other ends of the springs are connected with the support plates 15;

The bottom of the jacking plate 17 is connected with the output end of the jacking mechanism 16, and the top of the jacking plate 17 is positioned below the supporting plate 15;

The contact switch 18 is arranged below the supporting plate 15, and the contact switch 18 is in signal connection with a controller of the vacuumizing system;

the controller of the manipulator 11 is in signal connection with a contact switch 18.

Specifically, referring to fig. 1, the upper surface of the positioning groove 8 is further provided with a diversion trench 9, and the orifice of the adsorption hole 10 is located in the diversion trench 9. The bottom of the diversion trench 9 is lower than the bottom of the positioning trench 8, and the orifice of the adsorption hole 10 is positioned at the bottom of the diversion trench 9.

The diversion trench 9 specifically includes a plurality of coaxial annular grooves distributed at intervals in the radial direction, and linear grooves communicating the annular grooves.

In the automatic wafer conveying and conveying device of this embodiment, when in operation, in an automatic mode, (the end effector of) the manipulator 11 is placed above the vacuum adsorption table 1, in an initial state, the lifting mechanism 16 (a lifting cylinder may be adopted) pushes the lifting plate 17 to move upwards, the lifting plate 17 moves upwards by a certain distance to enable the support plate 15 to move upwards, the support columns 14 extend out of the positioning holes 13, the support columns 14 are made of PEEK and can be directly contacted with the wafer, the manipulator places the wafer on the four support columns 14, the lifting mechanism 16 moves downwards, the lifting plate 17 is separated from the support plates 15, and the support columns 14 descend under the action of gravity of the support columns and the deformation force of springs until the wafer falls into the positioning grooves. The shape and size of the positioning groove are matched with those of the wafer, and the general grooving depth is 400 microns, so that the wafer can be positioned and aligned correctly when being placed. The wafer falls into the positioning groove 8, when the supporting plate 15 moves downwards along with the supporting column 14 to be in contact with the contact switch 18, the controller of the vacuumizing system is started, vacuum is formed in the diversion groove 9, the wafer is pressed into the positioning groove 8, and the bottom surface of the wafer is completely attached to the bottom surface of the positioning groove 8. Then, the suction table 1 moves to transport the wafer.

After the conveying is finished, when the vacuum is broken, a diversion channel is formed below the bottom surface of the wafer due to the design of the diversion trench, so that air can quickly enter the diversion trench, and the quick vacuum breaking is realized. The problem of wafer breakage caused by untimely vacuum breaking (the top surface of the wafer is still under the atmospheric pressure) is prevented, and the supporting columns 14 jack up the wafer under the action of the restoring force of the springs.

The execution tail end of the manipulator 11 is of a sheet-shaped structure, after vacuum breaking, the supporting plate 15 is lifted and moved upwards, the supporting column 14 ejects the wafer out of the positioning groove, and the execution tail end of the sheet-shaped manipulator can scoop up the wafer like a shovel.

In particular, the sheet-like structure of the actuation end of the manipulator 11 has a Y-shaped or U-shaped profile.

Specifically, referring to fig. 1, a horizontal guide rail 4 is provided on a frame 21, and the adsorption table 1 is in power connection with a driving motor 19 through a belt transmission mechanism and moves along the horizontal guide rail 4.

The belt transmission mechanism comprises a main driving wheel, a driven driving wheel and a transmission belt 3 connected between the main driving wheel and the driven driving wheel, the transmission belt 3 is specifically connected with the bottom surfaces of the two sides of the adsorption table 1, and the output end of a driving motor 19 is connected with the main driving wheel.

Specifically, referring to fig. 1, a positioning plate 2 is disposed on one side of a horizontal guide rail 4, the positioning plate 2 is driven by an air cylinder 5 to perform linear movement, and the movement direction is perpendicular to the movement direction of the adsorption table 1, so that the position of the adsorption table 1 perpendicular to the movement direction is finely adjusted.

Because the cooperation between adsorption table 1 and horizontal guide rail 4 has certain fit clearance, adsorption table 1 is at the same position in the position of perpendicular to direction of movement at every turn in the removal in-process, and the material loading position of manipulator is fixed, leads to the material loading position inconsistent. When the positioning sheet 2 moves to the set position, the side surface of the adsorption table 1 is propped against, and the position of the adsorption table can be adjusted.

Referring to fig. 1 and 3, the frame 21 is provided with photoelectric switches near both ends and the middle of the moving path of the adsorption table 1, and the photoelectric switches include a first photoelectric switch 6, a second photoelectric switch 7 and a third photoelectric switch 20.

The first photoelectric switch 6 and the second photoelectric switch 7 are respectively used for sensing whether the adsorption table 7 moves to two ends of a stroke, so that a start-stop instruction is sent to a driving motor 19 controller. The third photoelectric switch 20 is used for sensing whether the adsorption table 7 moves to the middle position of the stroke, namely, to the middle of the frame 21, so as to send a speed regulation command to the controller of the driving motor 19 to reduce the speed of the adsorption table.

Referring to fig. 2, the upper surface of the adsorption table 1 is provided with a relief groove 12, and the depth of the relief groove 12 is greater than that of the positioning groove 8. The giving way 12 is used for providing giving way for fingers to take and put conveniently when the wafer is taken and put manually.

According to the embodiment, the jacking mechanism and the supporting columns are utilized to realize automatic positioning of the wafer on the adsorption table, the vacuum system is utilized to realize adsorption of the wafer, the adsorption table is utilized to realize transportation, and the applicable sizes are 6 inches, 8 inches and 12 inches of wafer are transported, so that one wafer can be transported and processed each time, the process time is shortened, and the working efficiency is improved.

Those of ordinary skill in the art will appreciate that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. An automatic wafer transfer handling apparatus, comprising:

The vacuum suction device comprises a frame (21), wherein an adsorption table (1) is arranged on the frame, a positioning groove (8) is formed in the upper surface of the adsorption table (1), the positioning groove (8) is round, a plurality of adsorption holes (10) are formed in the positioning groove, the adsorption holes (10) are used for being connected with a vacuum suction system, and a plurality of positioning holes (13) are formed in the positioning groove (8);

The support columns (14) are matched with the positioning holes (13), the bottom ends of the support columns (14) are connected with the support plates (15), springs are sleeved on the support columns (14), one ends of the springs are connected with the bottom surface of the adsorption table (1), and the other ends of the springs are connected with the support plates (15);

The bottom of the jacking plate (17) is connected with the output end of the jacking mechanism (16), and the top of the jacking plate (17) is positioned below the supporting plate (15);

The contact switch (18) is arranged below the supporting plate (15) and is in signal connection with a controller of the vacuumizing system;

the horizontal guide rail (4) is arranged on the frame (21), and the adsorption table (1) is in power connection with the driving motor (19) through the belt transmission mechanism and moves along the horizontal guide rail (4);

And the execution tail end of the manipulator (11) is of a sheet-shaped structure, and a controller of the manipulator (11) is in signal connection with the contact switch (18).

2. The automatic wafer transfer handling equipment according to claim 1, wherein the upper surface of the positioning groove (8) is further provided with a diversion groove (9), the groove bottom of the diversion groove (9) is lower than the groove bottom of the positioning groove (8), and the orifice of the adsorption hole (10) is positioned in the diversion groove (9).

3. Wafer transfer robot as claimed in claim 2, characterized in that the flow guide groove (9) comprises a plurality of coaxial, radially spaced annular grooves and a rectilinear groove communicating the annular grooves.

4. The automatic wafer transfer and handling equipment according to claim 1, wherein a positioning sheet (2) is arranged on one side of the horizontal guide rail (4), the positioning sheet (2) is driven by an air cylinder (5) to perform linear movement, and the movement direction is perpendicular to the movement direction of the adsorption table (1), so that the position of the adsorption table (1) perpendicular to the movement direction is finely adjusted.

5. The automatic wafer transfer and handling apparatus according to claim 1, wherein photoelectric switches are provided at both ends and in the middle of the frame (21) near the movement path of the suction table (1), respectively.

6. The automatic wafer transfer handling apparatus according to claim 1, wherein the support column (14) is made of PEEK.

7. The automatic wafer transfer handling apparatus according to claim 1, wherein a relief groove (12) is provided on the upper surface of the suction table (1), and the depth of the relief groove (12) is greater than the depth of the positioning groove (8).