CN115258681A - Wafer carrying method, manipulator and dicing machine - Google Patents
Wafer carrying method, manipulator and dicing machine Download PDFInfo
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- CN115258681A CN115258681A CN202211068717.0A CN202211068717A CN115258681A CN 115258681 A CN115258681 A CN 115258681A CN 202211068717 A CN202211068717 A CN 202211068717A CN 115258681 A CN115258681 A CN 115258681A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2207/00—Indexing codes relating to constructional details, configuration and additional features of a handling device, e.g. Conveyors
- B65G2207/08—Adjustable and/or adaptable to the article size
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2207/00—Indexing codes relating to constructional details, configuration and additional features of a handling device, e.g. Conveyors
- B65G2207/40—Safety features of loads, equipment or persons
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer carrying method, a manipulator and a dicing saw, wherein the wafer carrying method adopts the manipulator with an anti-falling mechanism to grab a wafer, a support hook of the anti-falling mechanism comprises a connecting plate, a supporting plate and a guide limiting plate, the top surface of the supporting plate is horizontally arranged and is lower than the bottom of a vacuum chuck, the guide limiting plate is obliquely arranged on the top surface of the supporting plate, and the horizontal distance from the lower end of the guide limiting plate to the front end of the supporting plate is smaller than the horizontal distance from the upper end of the guide limiting plate to the front end of the supporting plate; after or while the vacuum chuck adsorbs the frame of the wafer, the supporting plate extends into the lower part of the frame of the wafer, so that even if the wafer falls off from the vacuum chuck, the wafer falling off from the vacuum chuck can be effectively supported by the group of supporting plates, thereby avoiding the falling damage of the wafer and ensuring the safety of the wafer; the plurality of guide limiting plates can position and limit the wafer so as to ensure the position accuracy of the wafer on the manipulator and further ensure the position accuracy of the wafer when the wafer moves to the next position.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer carrying method, a manipulator and a dicing saw.
Background
A dicing saw, a ring cutting machine, or the like is an important apparatus for processing a wafer, and in such an apparatus, a plurality of stations are generally included, and therefore, it is necessary to transfer a wafer between the different stations.
The structure disclosed in chinese patent application No. 202210076307.4 is a commonly used wafer transfer structure in which a vacuum chuck is used to suck the frame of the wafer and then the wafer is moved.
During vacuum adsorption, a vacuum generator is usually adopted to generate vacuum, the vacuum generator needs an air source to work, but when the vacuum generator is used on site, the condition that the air source is interrupted or the air source is insufficient can occur, the condition that the wafer cannot be stably adsorbed can occur due to insufficient vacuum of a vacuum chuck, and the wafer is easy to break if falling off from the vacuum chuck, so that great loss is caused.
For example, chinese utility model patent with application No. 2021217424.6 and publication No. CN215363767U discloses a structure in which four anti-falling support plates are driven by four linear motors to prevent the photoelectric display material adsorbed by the vacuum chuck from falling.
However, when the structure is applied to preventing the wafer from falling off, when the anti-falling supporting plates are located at anti-falling positions, a certain gap needs to be kept between the vertical plate of each anti-falling supporting plate and the wafer so that the wafer can effectively fall onto the flat plates of the anti-falling supporting plates, and thus when the wafer falls onto the flat plate of the anti-falling supporting plate, the position of the wafer is easy to deviate, namely the position of the wafer on the vacuum chuck is inconsistent with the position of the wafer on the flat plate of the anti-falling supporting plate, so that the position precision of the wafer after the wafer is placed is influenced.
Disclosure of Invention
The present invention is directed to solving the above problems in the prior art, and provides a wafer handling method, a robot and a dicing saw.
The purpose of the invention is realized by the following technical scheme:
the wafer carrying method comprises the steps that a carrying robot carries wafers, the carrying robot comprises a manipulator and a moving mechanism for driving the manipulator to move horizontally and lift, the manipulator comprises a substrate, four vacuum chucks which are distributed in a rectangular mode are arranged on the substrate, an anti-falling mechanism is further arranged on the substrate, and the anti-falling mechanism comprises a group of support hooks and a support hook driving device for driving the support hooks to move horizontally towards the wafers adsorbed by the vacuum chucks;
the support hook comprises a connecting plate, a support plate and a guide limit plate, the connecting plate is connected with a support hook driving device, the top surface of the support plate is horizontally arranged and is lower than the bottom of the vacuum chuck, the guide limit plate is obliquely arranged on the top surface of the support plate, and the horizontal distance from the lower end of the guide limit plate to the front end of the support plate is smaller than the horizontal distance from the upper end of the guide limit plate to the front end of the support plate;
two ends of the base plate are respectively provided with a transverse plate in a vertical manner, each transverse plate is provided with two vacuum suckers symmetrically distributed on two sides of the base plate, each transverse plate is also provided with two support hooks symmetrically distributed on two sides of the base plate, each support hook is connected with a support hook driving device arranged on the transverse plate, and the support hook driving device drives the support hooks to move horizontally along the direction vertical to the transverse plates; the two transverse plates are connected with an adjusting mechanism arranged on the base plate, and the adjusting mechanism drives the two transverse plates to translate relative to the base plate so as to adjust the distance between the two transverse plates;
after the vacuum chuck moves downwards to contact with the frame of the wafer or the vacuum chuck adsorbs the frame of the wafer, the support hook driving device enables the front end of the support plate of the support hook to move from the outer side of the frame to the inner side of the frame, and then the moving mechanism drives the manipulator to move.
Preferably, the width of the supporting plate is 1.2 to 1.4 times of the width of the frame of the wafer.
Preferably, the height difference between the supporting plate and the wafer adsorbed by the vacuum chuck is between 1mm and 1.5 mm;
when the supporting plate is positioned on the outer side of the wafer, the distance between the supporting plate and the wafer is 2.5mm-3 mm;
when the front end of the supporting plate moves to the inner side of the wafer, the distance between the lower end of the guide limiting plate and the wafer is 0.5-0.8 mm.
Preferably, the included angle between the guide limit plate and the supporting plate is 105-110 degrees.
Preferably, the vacuum chuck is arranged on the transverse plate in a vertically movable manner, a spring positioned below the transverse plate is sleeved on the vacuum chuck, one end of the spring is connected to the transverse plate, and the other end of the spring abuts against the step surface of the vacuum chuck.
Preferably, the distance between the two support hooks on one transverse plate is 0.8-0.85 times of the side length of the wafer, and the two support hooks are symmetrically distributed on two sides of the substrate.
Preferably, the hook supporting driving device is at least one of an air cylinder, a linear motor and a servo linear module, and when the hook supporting driving device is the air cylinder, the working pressure of the air cylinder is between 0.18 and 0.2 Mpa.
The manipulator comprises a substrate, wherein four vacuum chucks are arranged on the substrate in a rectangular shape, an anti-falling mechanism is further arranged on the substrate, the anti-falling mechanism comprises a group of support hooks and a support hook driving device for driving the support hooks to translate, each support hook comprises a connecting plate, a support plate and a guide limiting plate, the connecting plate is connected with the support hook driving device, the top surfaces of the support plates are horizontally arranged and lower than the bottoms of the vacuum chucks, the guide limiting plates are obliquely arranged on the top surfaces of the support plates, and the horizontal distance from the lower ends of the guide limiting plates to the front ends of the support plates is smaller than the horizontal distance from the upper ends of the guide limiting plates to the front ends of the support plates; two ends of the base plate are respectively provided with a transverse plate in a vertical mode, each transverse plate is provided with two vacuum suckers symmetrically distributed on two sides of the base plate, each transverse plate is also provided with two support hooks symmetrically distributed on two sides of the base plate, each support hook is connected with a support hook driving device arranged on the transverse plate, and the support hook driving device drives the support hooks to move horizontally in a direction perpendicular to the transverse plates; the two transverse plates are connected with an adjusting mechanism arranged on the base plate, and the adjusting mechanism drives the two transverse plates to translate relative to the base plate so as to adjust the distance between the two transverse plates.
The dicing saw comprises the mechanical arm.
The technical scheme of the invention has the advantages that:
the wafer grabbing device adopts the manipulator with the anti-falling mechanism to grab the wafer, and the support plate extends into the lower part of the wafer after or while the vacuum chuck adsorbs the wafer, so that the wafer can be supported by the group of support plates even when the wafer falls off from the vacuum chuck in the air, the wafer is prevented from continuously falling and being damaged, and the safety of the wafer is ensured; meanwhile, the guide limiting plate on the supporting hook can guide, position and limit the wafer falling onto the supporting hook, so that the position precision of the wafer on the manipulator can be guaranteed, the position precision of the wafer when the wafer moves to the next position is further guaranteed, and the wafer cleaning device is particularly suitable for enabling the wafer to move between a cutting station and a cleaning station and enabling the wafer to move between the cleaning station and a degumming station.
According to the invention, through the design of a plurality of parameters such as the included angle between the guide limit plate and the supporting plate, the distance between the guide limit plate and the wafer when the guide limit plate contracts, the width of the supporting plate, the distance between the support hooks, the transverse distance between the supporting plate and the wafer, the height difference and the like, the stable support and the accurate positioning of the supporting plate on the wafer can be effectively ensured, so that the manipulator can be ensured to carry out the transfer of the wafer quickly, effectively, stably and accurately.
The vacuum chuck is connected with the elastic structure, so that the impact on the wafer during wafer adsorption and blanking can be effectively reduced, the safety of the wafer is ensured, and meanwhile, the spring can effectively seal the vacuum chuck and the wafer during wafer adsorption, so that the adsorption stability is ensured.
The vacuum chuck and the support hook are arranged on the transverse plates in pairs, the transverse plates are connected with the adjusting mechanism, and the adjusting mechanism can conveniently adjust the distance between the two transverse plates, so that the vacuum chuck and the support hook can synchronously move to meet the transferring requirements of wafers with different sizes.
Drawings
Fig. 1 is a partial perspective view of a transfer robot of the present invention;
FIG. 2 is a bottom view of the robot of the present invention showing only the wafer's rim;
FIG. 3 is a partial side view of a robot arm of the present invention with a hook positioned outside of a wafer;
FIG. 4 is a partial side view of the pallet of the hook of the robot of the present invention moving under the rim of the wafer;
figure 5 is a top view of the robot of the present invention with the vacuum chuck, support hook and support hook drive removed.
Detailed Description
Objects, advantages and features of the present invention will be illustrated and explained by the following non-limiting description of preferred embodiments. These embodiments are merely exemplary embodiments applying the technical solutions of the present invention, and all technical solutions formed by adopting equivalents or equivalent changes fall within the scope of the claims of the present invention.
In the description of the schemes, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the embodiment, the operator is used as a reference, and the direction close to the operator is a proximal end, and the direction away from the operator is a distal end.
Example 1
The following describes a wafer transportation method disclosed by the present invention with reference to the accompanying drawings, as shown in fig. 1 to fig. 4, the wafer transportation method transports a wafer by using a transportation robot, the transportation robot includes a robot arm 100 and a moving mechanism 200 for driving the robot arm 100 to move horizontally and lift up and down, the robot arm 100 includes a substrate 1, four vacuum chucks 2 arranged in a rectangular distribution are arranged on the substrate 1, an anti-drop mechanism is further arranged on the substrate 1, the anti-drop mechanism includes a set of hooks 3 and a hook driving device 4 for driving each hook 3 to move horizontally towards the wafer adsorbed by the vacuum chuck 2, the hooks 3 include a connecting plate 31, a pallet 32 and a guiding limit plate 33, the connecting plate 31 is connected to the hook driving device 4, the pallet 32 and the connecting plate 31 are L-shaped, although they may be in other feasible forms, the top surface of the pallet 32 is arranged horizontally and lower than the bottom of the vacuum chuck 2, the guiding limit plate 33 is arranged obliquely on the top surface of the pallet 32, and the horizontal distance from the lower end of the guiding limit plate 33 to the front end of the pallet 32 is smaller than the horizontal distance from the upper end of the guiding limit plate 33 to the front end of the pallet 32;
before the vacuum chuck 2 is moved down, as shown in fig. 3, the front end (end facing the wafer) of the blade 32 is located outside the wafer. After the vacuum chuck 2 moves down to contact with the frame 300 of the wafer or the vacuum chuck 2 sucks the frame 300 of the wafer, as shown in fig. 4, the hook driving device 4 moves the front ends of the blades 32 of the group of hooks 3 from the outer side of the frame to the inner side of the frame, and then the moving mechanism 200 drives the robot 100 to move.
With the manipulator 100 of such a structure, after or while the vacuum chuck 2 adsorbs the wafer, the support plate 32 extends below the wafer, and even when the wafer is suspended in the air and the vacuum chuck 2 is not stably adsorbed or has no suction force, the wafer falling from the vacuum chuck 2 can be effectively supported by the group of support plates 32, so that the wafer is prevented from falling and being damaged, and the safety of the wafer is ensured; meanwhile, the plurality of guiding limit plates 33 can guide and limit the wafer, so that the position accuracy of the wafer on the manipulator 100 is ensured, and the position accuracy of the subsequent wafer when reaching the next position is further ensured.
As shown in fig. 3, in order to make the support plate 32 smoothly enter the lower part of the wafer adsorbed by the vacuum chuck 2, the height difference L2 between the support plate 32 and the wafer adsorbed by the vacuum chuck 2 is between 1mm and 1.5mm, and the design of the distance can make the falling height of the wafer very small, so as to avoid the wafer from colliding with the support plate 32 and damaging the wafer when the wafer falls on the support plate 32, and ensure the safety of the wafer.
As shown in fig. 3, when the support plate 32 is located outside the frame 300 of the wafer, the distance L1 between the support plate 32 and the wafer is between 2.5mm and 3 mm; due to the design of the distance, when the manipulator 100 adsorbs the wafer, the supporting plate 32 can be smoothly moved from the upper part of the wafer to the lower part of the wafer, and interference between the product and the wafer or the workbench when the product placement position deviates is avoided. Meanwhile, the moving stroke of the pallet 32 can be effectively shortened.
In order to ensure that the supporting plate 32 has as large a contact area with the wafer as possible so that the hook 3 can effectively support and limit the wafer, the width of the supporting plate 32 is 1.2-1.4 times the width of the frame 300 of the wafer.
In order to ensure that the guide limit plates 33 can sufficiently limit the wafer and simultaneously avoid the wafer from being damaged due to the clamping force generated by the guide limit plates 33 when moving towards the wafer, when the front end of the supporting plate 32 moves towards the inner side of the wafer, the distance between the lower end of the guide limit plate 33 and the wafer is controlled to be 0.5mm-0.8mm, and the distance can effectively ensure the consistency of the positions of the wafer on the plurality of supporting hooks 3 and the positions of the wafer on the vacuum chuck 2.
As shown in fig. 3, due to the different lengths of the air supply lines and the different periods of use of the vacuum chucks 2, when the wafer is sucked, a portion of the vacuum chucks 2 may be unstably sucked, which may cause the wafer to tilt and drop, and at this time, the position of the wafer after dropping may shift. In order to make the guiding and positioning requirements of wafers with different inclination states as possible satisfied by the guiding and positioning plate 33, the angle a between the guiding and positioning plate 33 and the supporting plate 32 is 105-110 degrees.
As shown in fig. 2-4, the substrate 1 may be a large plate, and the vacuum chuck 2 may be vertically disposed directly on the substrate 1. More preferably, base plate 1 is a rectangular slab, the both ends of base plate 1 are provided with a diaphragm 5 respectively, every diaphragm 5 the length direction with the length direction of base plate 1 is perpendicular, every be provided with two vacuum chuck 2 on the diaphragm 5, every two on the diaphragm 5 vacuum chuck 2 symmetry sets up the both sides of base plate 1.
As shown in fig. 3 and fig. 4, in order to avoid that the wafer is damaged by a large impact when the vacuum chuck 2 adsorbs and releases the wafer, the vacuum chuck 2 is preferably a side-inlet vacuum chuck, and the vacuum chuck 2 is disposed on the horizontal plate 5 so as to be capable of moving up and down, a baffle plate disposed above the horizontal plate 5 is disposed on the vacuum chuck 2, a spring 6 disposed below the horizontal plate 5 is sleeved on the vacuum chuck 2, one end of the spring 6 is connected below the horizontal plate 5, and the other end of the spring 6 abuts against a step surface of the vacuum chuck 2. Therefore, when the vacuum chuck 2 moves downwards to contact with the frame 300 of the wafer, the vacuum chuck 2 can move upwards and compress the spring 6 for buffering, meanwhile, the reaction force of the spring 6 can enable the vacuum chuck 2 to be tightly pressed with the frame 300 of the wafer, and the sealing performance between the vacuum chuck 2 and the wafer is ensured.
The support hooks 3 are preferably four and distributed in a rectangular shape, in one embodiment, the support hooks 3 may be distributed on four sides of the wafer, in this case, the wafer may be square or circular.
As shown in fig. 2, the number of the support hooks 3 is four and is divided into two pairs, each pair of the support hooks 3 is arranged on one horizontal plate 5, that is, a pair of the support hooks 3 is respectively arranged on two horizontal plates 5, the distance between the two support hooks 3 on one horizontal plate 5 is 0.8-0.85 times of the side length of a round-corner square wafer, and the two support hooks 3 on one horizontal plate 5 are symmetrically distributed on two sides of the substrate 1 and are located on the outer sides of the two vacuum chucks 2, which can effectively meet the requirements of stable support and limit of a square wafer.
As shown in fig. 2 to 4, each of the support hooks 3 is connected to a support hook driving device 4, the support hook driving device 4 is disposed on the horizontal plate 5, the support hook driving device 4 drives the support hook 3 to move in a direction perpendicular to the horizontal plate 5, the support hook driving device 4 is at least one of an air cylinder, a linear motor and a servo linear module, when the support hook driving device 4 is the air cylinder, the air cylinder is provided with an L-shaped baffle 7 covering the top and the outer side of the air cylinder, and the working pressure of the air cylinder is between 0.18 Mpa and 0.2Mpa, such a working pressure can effectively avoid a situation that the vacuum chuck 2 cannot stably adsorb the wafer due to an excessive impact during the operation of the air cylinder, and such a working pressure can still enable the air cylinder to stably operate at the air pressure, further, the air cylinder can be a known air cylinder with an air-break self-locking function, and the specific structure of the self-locking air cylinder is a known technology, which is not described herein.
Further, since the wafer has a plurality of different sizes, the positions of the vacuum chuck 2 and the support hook 3 need to be adjusted to meet the grabbing requirements of wafers with different sizes.
As shown in fig. 5, two horizontal plates 5 are connected to an adjusting mechanism 8 disposed on the base plate 1, and the adjusting mechanism 8 drives the two horizontal plates 5 to translate relative to the base plate 1 to adjust the distance between the two horizontal plates 5, so as to realize the movement of the vacuum chuck 2 and the hook driving device 4 disposed thereon.
As shown in fig. 5, the horizontal plate 5 is slidably disposed on the guide rail 9 of the substrate 1, the adjusting mechanism 8 may be two linear motors or servo linear modules, and each linear motor or servo linear module is connected to one horizontal plate 5, so that the two linear motors or servo linear modules can drive the two horizontal plates 5 to move oppositely to reduce the distance between the two horizontal plates 5, and correspondingly, the distance between the vacuum chuck 2 and the support hook 3 on the two horizontal plates 5 can be correspondingly reduced, and at this time, the small-sized wafer can be adsorbed. When two linear electric motors or servo linear module drive two when diaphragm 5 moves dorsad, two the interval between diaphragm 5 increases, and the vacuum chuck 2 on two corresponding diaphragms 5 and the interval between towing hook 3 can corresponding increase, can carry out the absorption of large size wafer this moment.
As shown in fig. 5, in order to reduce the power source, the adjusting mechanism 8 may include a driving wheel 81, a driven wheel 82, a belt 83, a motor 84 and two connecting members 85, the driving wheel 81 may be connected to the motor 84 for driving the driving wheel to rotate, the motor 84 may be a speed reducing motor and disposed above the substrate 1, a rotating shaft of the motor is directly connected to the driving wheel 81 and drives the driving wheel to rotate, of course, the driving wheel 81 may also be rotatably disposed on the substrate 1, and the driving wheel 81 may be connected to the motor 84 through a known gear transmission mechanism or a known synchronous belt transmission mechanism 86.
The axes of the driving wheel 81 and the driven wheel 82 are perpendicular to the base plate 1, the driven wheel 82 is rotatably disposed on the base plate 1, the driving wheel 81 and the driven wheel 82 are sleeved with the belt 83, the two connecting pieces 85 are connected to the first straight belt segment 831 and the second straight belt segment 832 of the belt 83, and each connecting piece 85 is connected to one of the transverse plates 5, so that when the motor 84 drives the driving wheel 81 to rotate, the two connecting pieces 85 can be driven by the belt 83 to move back to back or move towards each other to adjust the distance between the two transverse plates 5.
As shown in fig. 1, the specific structure of the moving mechanism 200 is a known structure, and may be a structure formed by a transverse servo linear module 210 and a longitudinal cylinder 220, that is, the longitudinal cylinder 220 is disposed on a moving block of the transverse servo linear module 210 through an L-shaped connecting member 230, and the longitudinal cylinder 220 is connected to the robot 100 through a connecting frame 240. The specific structure of the servo linear mold is known in the art and will not be described herein. Of course, the moving mechanism 200 may be a four-axis robot, a six-axis robot, or the like.
Example 2
The present embodiment discloses a dicing saw including the robot 100 of the above embodiment.
The invention has various embodiments, and all technical solutions formed by adopting equivalent transformation or equivalent transformation are within the protection scope of the invention.
Claims (9)
1. The wafer carrying method is characterized in that a carrying robot carries wafers, the carrying robot comprises a mechanical arm and a moving mechanism for driving the mechanical arm to move horizontally and lift up and down, the mechanical arm comprises a base plate, four vacuum chucks which are distributed in a rectangular mode are arranged on the base plate, an anti-falling mechanism is further arranged on the base plate, the anti-falling mechanism comprises a group of support hooks and a support hook driving device for driving the support hooks to move horizontally to the wafers adsorbed by the vacuum chucks, and the wafer carrying method is characterized in that:
the support hook comprises a connecting plate, a support plate and a guide limit plate, the connecting plate is connected with a support hook driving device, the top surface of the support plate is horizontally arranged and is lower than the bottom of the vacuum chuck, the guide limit plate is obliquely arranged on the top surface of the support plate, and the horizontal distance from the lower end of the guide limit plate to the front end of the support plate is smaller than the horizontal distance from the upper end of the guide limit plate to the front end of the support plate;
two ends of the base plate are respectively provided with a transverse plate in a vertical mode, each transverse plate is provided with two vacuum suckers symmetrically distributed on two sides of the base plate, each transverse plate is also provided with two support hooks symmetrically distributed on two sides of the base plate, each support hook is connected with a support hook driving device arranged on the transverse plate, and the support hook driving device drives the support hooks to move horizontally in a direction perpendicular to the transverse plates; the two transverse plates are connected with an adjusting mechanism arranged on the base plate, and the adjusting mechanism drives the two transverse plates to translate relative to the base plate so as to adjust the distance between the two transverse plates;
after the vacuum chuck moves downwards to contact with the frame of the wafer or the vacuum chuck adsorbs the frame of the wafer, the support hook driving device enables the front ends of the support plates of the support hooks to move from the outer side of the frame to the inner side of the frame, and then the moving mechanism drives the manipulator to move.
2. The wafer handling method of claim 1, wherein: the width of the supporting plate is 1.2-1.4 times of the width of the frame.
3. The wafer handling method of claim 1, wherein:
the height difference between the supporting plate and the wafer adsorbed by the vacuum chuck is 1mm-1.5 mm;
when the supporting plate is positioned on the outer side of the wafer, the distance between the supporting plate and the wafer is 2.5mm-3 mm;
when the front end of the supporting plate moves to the inner side of the wafer, the distance between the lower end of the guide limiting plate and the wafer is 0.5-0.8 mm.
4. The wafer handling method of claim 1, wherein: the included angle between the guide limit plate and the supporting plate is 105-110 degrees.
5. The wafer handling method of claim 1, wherein: the vacuum chuck is arranged on the transverse plate in a vertically movable mode, a spring located below the transverse plate is sleeved on the vacuum chuck, one end of the spring is connected to the transverse plate, and the other end of the spring abuts against the step surface of the vacuum chuck.
6. The wafer handling method of claim 1, wherein: the distance between the two supporting hooks on one transverse plate is 0.8-0.85 times of the side length of the wafer.
7. The wafer handling method of any of claims 1 to 6, wherein: the hook supporting driving device is at least one of an air cylinder, a linear motor and a servo linear module, and when the hook supporting driving device is the air cylinder, the working pressure of the air cylinder is between 0.18 and 0.2 Mpa.
8. The manipulator comprises a substrate, four vacuum chuck are arranged on the substrate in a rectangular mode, an anti-falling mechanism is further arranged on the substrate and comprises a group of support hooks and a group of drive hooks, and the support hook driving device for the horizontal movement of the support hooks is characterized in that: the support hook comprises a connecting plate, a support plate and a guide limit plate, the connecting plate is connected with the support hook driving device, the top surface of the support plate is horizontally arranged and is lower than the bottom of the vacuum chuck, the guide limit plate is obliquely arranged on the top surface of the support plate, and the horizontal distance from the lower end of the guide limit plate to the front end of the support plate is smaller than the horizontal distance from the upper end of the guide limit plate to the front end of the support plate; two ends of the base plate are respectively provided with a transverse plate in a vertical manner, each transverse plate is provided with two vacuum suckers symmetrically distributed on two sides of the base plate, each transverse plate is also provided with two support hooks symmetrically distributed on two sides of the base plate, each support hook is connected with a support hook driving device arranged on the transverse plate, and the support hook driving device drives the support hooks to move horizontally along the direction vertical to the transverse plates; two the diaphragm is connected the guiding mechanism who sets up on the base plate, the guiding mechanism drive is two the diaphragm is relative the base plate translation is in order to adjust two interval between the diaphragm.
9. Scribing machine, its characterized in that: comprising the robot hand of claim 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211068717.0A CN115258681A (en) | 2022-09-02 | 2022-09-02 | Wafer carrying method, manipulator and dicing machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211068717.0A CN115258681A (en) | 2022-09-02 | 2022-09-02 | Wafer carrying method, manipulator and dicing machine |
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| CN115258681A true CN115258681A (en) | 2022-11-01 |
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| CN202211068717.0A Pending CN115258681A (en) | 2022-09-02 | 2022-09-02 | Wafer carrying method, manipulator and dicing machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117096088A (en) * | 2023-10-17 | 2023-11-21 | 和研半导体设备(沈阳)有限公司 | Wafer handling device |
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2022
- 2022-09-02 CN CN202211068717.0A patent/CN115258681A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117096088A (en) * | 2023-10-17 | 2023-11-21 | 和研半导体设备(沈阳)有限公司 | Wafer handling device |
| CN117096088B (en) * | 2023-10-17 | 2024-02-02 | 和研半导体设备(沈阳)有限公司 | Wafer handling device |
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