CN214978592U

CN214978592U - Laser cutting machine

Info

Publication number: CN214978592U
Application number: CN202121475228.8U
Authority: CN
Inventors: 杨硕; 章炬; 孙杰; 尹建刚; 覃艳; 高云峰
Original assignee: Han s Laser Technology Industry Group Co Ltd
Current assignee: Han s Laser Technology Industry Group Co Ltd
Priority date: 2021-06-30
Filing date: 2021-06-30
Publication date: 2021-12-03
Anticipated expiration: 2031-06-30

Abstract

The application provides a laser cutting machine, which comprises a base; the cutting carrying platform is arranged on the base and used for carrying a workpiece to be cut; the splinter carrying platform is arranged on the base and is used for bearing the cut workpiece; and a transfer device which is movably arranged between the cutting carrier and the splitting carrier along a first direction and is used for jacking up the workpiece on the cutting carrier so as to convey the workpiece onto the splitting carrier. The application provides a laser cutting machine can be with the work piece jack-up on the cutting microscope carrier in order to carry to the lobe of a leaf microscope carrier to realized the transport of work piece, and can not harm the protection film of work piece upper surface, avoided the wearing and tearing of work piece, and then can effectively improve product quality.

Description

Laser cutting machine

Technical Field

The application belongs to the technical field of laser cutting, and more specifically relates to a laser cutting machine.

Background

When the laser is used to cut large-format glass, the cutting operation is usually performed by a picosecond laser, and then the breaking operation is performed by a CO2 laser. In the related art, a suction cup is generally used to suck the upper surface of the glass, and then the glass is moved from the cutting station to the breaking station. However, since the upper surface of the glass is usually coated with the coating and the coating is very fragile, the coating is easily damaged in this way, which leads to abrasion of the glass.

SUMMERY OF THE UTILITY MODEL

An object of this application is to provide a laser cutting machine, solves the easy technical problem who wears out of product that exists among the prior art.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: provided is a laser cutting machine including:

a base;

the cutting carrying platform is arranged on the base and used for carrying a workpiece to be cut;

the splinter carrying platform is arranged on the base and is used for bearing the cut workpiece; and the number of the first and second groups,

and the transferring device is arranged between the cutting carrying platform and the splitting carrying platform in a movable mode along a first direction and is used for jacking the workpiece on the cutting carrying platform so as to convey the workpiece to the splitting carrying platform.

Further, the transfer device includes:

the mounting base is arranged between the cutting carrying platform and the splinter carrying platform;

the first motion mechanism comprises a moving seat which is movably arranged on the mounting seat along a first direction and a first driving component which is used for driving the moving seat to move along the first direction; and the number of the first and second groups,

the second movement mechanism comprises a material moving mechanism which is arranged on the moving seat in a movable mode along a second direction so as to jack up the workpiece on the cutting carrier, and a second driving assembly which is used for driving the material moving mechanism to move along the second direction.

Further, the material moving mechanism comprises an adsorption component, and the adsorption component is used for adsorbing and fixing the lower surface of the workpiece when the adsorption component is in contact with the workpiece.

Further, the cutting carrying platform and the splinter carrying platform both comprise;

the mounting frame is arranged on the base; and the number of the first and second groups,

the sucking discs are arranged on the mounting frame at intervals, a channel extending in the first direction is formed between every two adjacent sucking discs, and the transferring device can be movably arranged in the channel in the first direction.

Furthermore, each sucking disc is provided with an adsorption hole which is used for being communicated with an external air source, when the external air source is negative pressure, the adsorption hole adsorbs and fixes the workpiece, and when the external air source is positive pressure, the adsorption hole blows out air flow to enable the workpiece to be suspended on the cutting carrying table or the splinting carrying table.

Further, the sucker is a ceramic sucker.

Further, the cutting carrier and the splinter carrier further comprise a supporting column, one end of the supporting column is connected with the mounting frame, and the other end of the supporting column is connected with the sucker.

Further, the mounting frame is movably arranged on the base along a first direction, and the cutting stage and the splitting stage further comprise a third driving assembly for driving the mounting frame to move along the first direction.

Further, the cutting stage further comprises at least two sets of coarse positioning mechanisms which are arranged oppositely along the first direction or the third direction to position the workpiece on the cutting stage, and each set of coarse positioning mechanisms comprises:

the push plate can be movably arranged on one side of the cutting carrier platform along a first direction or a third direction;

the fourth driving component is used for driving the push plate to move along the first direction or the third direction so as to enable the push plate to move along the direction close to the cutting carrier and abut against the workpiece, or the push plate moves along the direction far away from the cutting carrier so as to release the workpiece; and the number of the first and second groups,

and the fifth driving component is used for driving the push plate to move along the second direction so that the push plate extends out of the cutting carrier to position the workpiece.

Further, laser cutting machine still includes accurate positioning mechanism, accurate positioning mechanism includes visual detection device.

The application provides a laser cutting machine's beneficial effect lies in: through the arrangement of the transfer device, the transfer device is matched with the transfer device and can be movably arranged between the cutting carrier and the splitting carrier along the first direction, so that the workpiece on the cutting carrier is jacked up to be conveyed to the splitting carrier, the workpiece is conveyed, the protective film on the upper surface of the workpiece is not damaged, the abrasion of the workpiece is avoided, and the product quality can be effectively improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic perspective view of a laser cutting machine provided in an embodiment of the present application;

FIG. 2 is a schematic view of a portion of the structure of FIG. 1;

FIG. 3 is a schematic perspective view of FIG. 2 at another angle;

fig. 4 is a schematic perspective view of a lobe carrier and a transfer device used in the embodiment of the present application;

fig. 5 is a schematic perspective view of a cutting carrier employed in the embodiment of the present application.

Wherein, in the figures, the respective reference numerals:

10. a base; 20. cutting the carrying platform; 21. a mounting frame; 22. a suction cup; 23. a channel; 24. a support pillar; 30. carrying a splinter platform; 40. a transfer device; 41. a mounting seat; 42. a first movement mechanism; 421. a movable seat; 43. a second movement mechanism; 431. a material moving mechanism; 432. a second drive assembly; 50. a coarse positioning mechanism; 51. pushing the plate; 52. a fourth drive assembly; 53. a fifth drive assembly; 60. a fine positioning mechanism; 70. a cutting assembly; 80. a splinter mechanism; 100. and (5) a workpiece.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship illustrated in the drawings for convenience in describing the present application and to simplify description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1 and 2 together, the laser cutting machine provided in the present application will now be described. The application provides a laser cutting machine, including base 10, cutting microscope carrier 20, lobe of a leaf microscope carrier 30, move and carry device 40. The cutting stage 20 is disposed on the base 10 and is used for carrying a workpiece 100 to be cut. The workpiece 100 may be glass or the like. The splinter carrier 30 is disposed on the base 10 and used for carrying the cut workpiece 100. By arranging the cutting carrying platform 20 and the splinter carrying platform 30 at the same time, the cutting and splinter operations can be simultaneously carried out, so that the working efficiency can be improved. The transfer device 40 is provided between the cutting stage 20 and the splitting stage 30 so as to be movable in the first direction, and is configured to lift up the workpiece 100 on the cutting stage 20 and convey the workpiece onto the splitting stage 30. It should be noted that, in the present embodiment, the "first direction" refers to a direction along the Y axis in fig. 1, the "second direction" refers to a direction along the Z axis in fig. 1, and the "third direction" refers to a direction along the X axis in fig. 1. The X axis and the Y axis are two coordinate axes which are vertical to each other on the same horizontal plane, and the Z axis is a coordinate axis in the vertical direction.

During operation, firstly, a workpiece 100 to be cut is placed on the cutting stage 20 to be cut, and after the cutting of the workpiece 100 is completed, the moving and carrying device 40 moves to the position of the cutting stage 20, jacks up the workpiece 100 on the cutting stage 20, and then carries the workpiece 100 onto the splitting stage 30, so that the workpiece 100 is carried from the cutting stage 20 to the splitting stage 30, a protective film on the upper surface of the workpiece 100 is not damaged, and the abrasion of the workpiece 100 is avoided.

The application provides a laser cutting machine moves and carries device 40 through setting up to the cooperation moves and carries device 40 and can set up between cutting microscope carrier 20 and lobe of a leaf microscope carrier 30 along first direction movingly, thereby jack-up work piece 100 on cutting microscope carrier 20 is in order to carry to lobe of a leaf microscope carrier 30 on, thereby realized the transport of work piece 100, and can not harm the protection film of work piece 100 upper surface, avoided the wearing and tearing of work piece 100, and then can effectively improve product quality.

Further, referring to fig. 2 to 4, as an embodiment of the laser cutting machine provided by the present application, the transfer device 40 includes an installation base 41, a first movement mechanism 42, and a second movement mechanism 43. The mount 41 is provided between the dicing stage 20 and the splitting stage 30. The first motion mechanism 42 includes a movable base 421 and a first driving assembly (not shown). The movable base 421 is movably disposed on the mounting base 41 along a first direction. The first driving assembly is used for driving the movable base 421 to move along a first direction. The second moving mechanism 43 includes a material moving mechanism 431 and a second driving assembly 432. The material moving mechanism 431 is movably disposed on the moving base 421 along the second direction, and is used for lifting up the workpiece 100 on the cutting stage 20 to be conveyed onto the splitting stage 30. The second driving assembly 432 is used for driving the material moving mechanism 431 to move along the second direction.

When the workpiece 100 on the cutting stage 20 needs to be transported to the splitting stage 30, first, the moving base 421 is driven by the first driving component to move along the first direction, so that the moving base 421 is close to the cutting stage 20, and at this time, the material moving mechanism 431 is close to the cutting stage 20 along with the moving base 421; when the workpiece 100 is moved to the preset position, the second driving assembly 432 drives the material moving mechanism 431 to move in the second direction, so that the material moving mechanism 431 is lifted and jacks up the workpiece 100; next, the first driving assembly drives the movable base 421 to move reversely along the first direction, so as to approach the splinter carrier 30. When the workpiece 100 moves to the position of the splitting stage 30, the second driving assembly 432 drives the material moving mechanism 431 to move reversely along the second direction, so that the material moving mechanism 431 descends, and the workpiece 100 is placed on the splitting stage 30.

Further, referring to fig. 4, as an embodiment of the laser cutting machine provided by the present application, the material moving mechanism 431 includes an adsorption component for adsorbing and fixing the lower surface of the workpiece 100 when contacting the workpiece 100. By providing the suction component, the workpiece 100 can be sucked, and the workpiece 100 can be fixed, thereby preventing the workpiece 100 from shifting during transportation.

Further, please refer to fig. 4, as a specific embodiment of the laser cutting machine provided in the present application, the first driving assembly may include a driving and a lead screw module in transmission connection with the driving motor, and the transmission precision is high by using the lead screw transmission. The second driving assembly 432 may include a driving cylinder, and the driving thereof is simple and convenient by driving the movement of the material moving mechanism 431 with the cylinder.

Further, referring to fig. 2, 4 to 5, as an embodiment of the laser cutting machine provided by the present application, the cutting stage 20 and the splitting stage 30 each include a mounting frame 21 and a plurality of suction cups 22. The mounting frame 21 is disposed on the base 10. The plurality of suction cups 22 are arranged on the mounting frame 21 at intervals, a channel 23 extending along the first direction is formed between two adjacent suction cups 22, and the transferring device 40 is arranged in the channel 23. When the transfer device 40 does not operate, the height of the transfer device 40 is lower than the dicing stage 20 or the crack stage 30 at this time, and interference between the dicing stage 20 and the crack stage 30 is prevented. When the workpiece 100 needs to be supported and fixed, the second driving assembly 432 drives the material moving mechanism 431 to move along the second direction so as to extend out of the stage, and thus the workpiece 100 can be supported. The structure is simple and compact, and the volume is favorably reduced. And through setting up a plurality of sucking discs 22, the levelness of single sucking disc 22 can be adjusted alone to can improve the plane degree of cutting microscope carrier 20 and lobe of a leaf microscope carrier 30, guarantee the accuracy of cutting and lobe of a leaf.

Further, as an embodiment of the laser cutting machine provided in the present application, each suction cup 22 is provided with an adsorption hole (not shown) for communicating with an external air source, and when the external air source is a negative pressure, the adsorption hole adsorbs and fixes the workpiece 100. When the external air source is positive pressure, the suction holes blow air flow to enable the workpiece 100 to be suspended on the cutting stage 20 or the splitting stage 30, so that a space is formed between the workpiece 100 and the cutting stage 20 or the splitting stage 30, the moving device 40 can conveniently move the workpiece 100, and the workpiece 100 is prevented from being damaged by friction with the cutting stage 20 or the splitting stage 30 when the workpiece 100 moves.

Further, as one embodiment of the laser cutting machine provided herein, the suction cup 22 is a ceramic suction cup 22. The suction cup 22 made of ceramic has high heat resistance, chemical resistance, insulation, and wear resistance, and can be used for a long period of time to increase the service life.

Further, referring to fig. 4 to 5, as an embodiment of the laser cutting machine provided by the present application, the cutting stage 20 and the splitting stage 30 further include a supporting column 24, one end of the supporting column 24 is connected to the mounting frame 21, and the other end of the supporting column 24 is connected to the suction cup 22. Through setting up support column 24 to can live sucking disc 22, make sucking disc 22 and mounting bracket 21 interval setting, conveniently set up and carry the device 40.

Further, referring to fig. 2 to 3, as an embodiment of the laser cutting machine provided by the present application, the mounting frame 21 is movably disposed on the base 10 along the first direction, and each of the cutting stage 20 and the splitting stage 30 further includes a third driving assembly (not shown) for driving the mounting frame 21 to move along the first direction. By providing the third driving assembly, the cutting stage 20 or the splinter stage 30 can be driven to move in the first direction.

Further, referring to fig. 2, fig. 3 and fig. 5, as an embodiment of the laser cutting machine provided by the present application, the laser cutting machine further includes at least two sets of coarse positioning mechanisms 50. At least two sets of coarse positioning mechanisms 50 are disposed opposite each other in the first direction or the third direction to position both sides of the workpiece 100 on the cutting stage 20. In one embodiment of the present application, the coarse positioning mechanisms 50 are provided in two sets, respectively disposed on two opposite sides of the cutting stage 20 along the first direction, for positioning two sides of the workpiece 100 on the cutting stage 20 in the first direction. In another embodiment of the present application, coarse positioning mechanisms 50 are respectively disposed on opposite sides of the cutting stage 20 along the third direction for positioning the workpiece 100 on the cutting stage 20 in the third direction. In another embodiment of the present application, the coarse positioning mechanisms 50 may be further provided in four sets, respectively disposed around the cutting stage 20 along the first direction and the third direction, for positioning four sides of the workpiece 100.

Specifically, the coarse positioning mechanism 50 includes a push plate 51, a fourth driving assembly 52, and a fifth driving assembly 53. The push plate 51 is movably disposed on one side of the cutting stage 20 in the first direction or the third direction. The fourth drive assembly 52 is configured to drive the push plate 51 to move in the first direction or the third direction, such that the push plate 51 moves in a direction close to the cutting stage 20 and abuts against the workpiece 100, or the push plate 51 moves in a direction away from the cutting stage 20 to release the workpiece 100. The fifth driving assembly 53 is configured to drive the push plate 51 to move in the second direction, so that the push plate 51 extends out of the cutting stage 20 to position the workpiece 100. When positioning is needed, the fifth driving assembly 53 drives the push plate 51 to move along the second direction so as to extend out of the cutting stage 20, and then the fourth driving assembly 52 drives the push plate 51 to move to a specified position along a direction close to the cutting stage 20, so that mechanical coarse positioning of the workpiece 100 is realized. When the positioning is not needed, the fourth driving assembly 52 drives the push plate 51 to move in a direction away from the cutting stage 20, and the fifth driving assembly 53 drives the push plate 51 to move in the second direction to retract into the cutting stage 20, so as to avoid interfering with other operations of the cutting stage 20.

Further, referring to fig. 1, as a specific embodiment of the laser cutting machine provided in the present application, the laser cutting machine further includes a fine positioning mechanism 60, and the fine positioning mechanism 60 includes a visual detection device. The vision inspection device may be a CCD vision inspection device, which may achieve accurate positioning of the workpiece 100.

Further, referring to fig. 1, as a specific embodiment of the laser cutting machine provided in the present application, the laser cutting machine further includes a cutting assembly 70, and the cutting assembly 70 is disposed on the base 10 and is used for cutting a workpiece 100 to be cut on the cutting stage 20. The workpiece 100 can be cut efficiently.

Further, referring to fig. 1, as a specific implementation manner of the laser cutting machine provided in the present application, the laser cutting machine further includes a splitting mechanism 80, in one embodiment of the present application, the splitting mechanism 80 includes four groups, which split four sides of the workpiece 100 respectively and simultaneously, so as to improve splitting efficiency.

Further, as a specific implementation of the laser cutting machine provided by the present application, the base 10 is a marble base 10, and the stability thereof is high, so that the processing precision is improved.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A laser cutting machine, characterized by comprising:

a base;

2. The laser cutter according to claim 1, characterized in that: the transfer device includes:

3. The laser cutter according to claim 2, characterized in that: the material moving mechanism comprises an adsorption component, and the adsorption component is used for adsorbing and fixing the lower surface of the workpiece when the adsorption component is in contact with the workpiece.

4. The laser cutter according to claim 1, characterized in that: the cutting carrying platform and the splinter carrying platform both comprise;

5. The laser cutter according to claim 4, characterized in that: and each sucking disc is provided with an adsorption hole which is used for being communicated with an external air source, when the external air source is negative pressure, the adsorption hole adsorbs and fixes the workpiece, and when the external air source is positive pressure, the adsorption hole blows out air flow so that the workpiece is suspended on the cutting carrying platform or the splinting carrying platform.

6. The laser cutter according to claim 4, characterized in that: the sucking disc is a ceramic sucking disc.

7. The laser cutter according to claim 4, characterized in that: the cutting carrier and the splinter carrier further comprise a supporting column, one end of the supporting column is connected with the mounting frame, and the other end of the supporting column is connected with the sucking disc.

8. The laser cutter according to claim 4, characterized in that: the mounting frame can be movably arranged on the base along a first direction, and the cutting carrier and the splitting carrier further comprise a third driving assembly for driving the mounting frame to move along the first direction.

9. The laser cutting machine according to any one of claims 1 to 8, wherein: the laser cutting machine further comprises at least two groups of rough positioning mechanisms which are oppositely arranged along the first direction or the third direction so as to position the workpiece on the cutting carrying platform, and each group of rough positioning mechanisms comprises:

10. The laser cutting machine according to any one of claims 1 to 8, wherein: the laser cutting machine further comprises a fine positioning mechanism, and the fine positioning mechanism comprises a visual detection device.