CN217534646U - Silicon chip moves and carries device - Google Patents
Silicon chip moves and carries device Download PDFInfo
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- CN217534646U CN217534646U CN202221359109.0U CN202221359109U CN217534646U CN 217534646 U CN217534646 U CN 217534646U CN 202221359109 U CN202221359109 U CN 202221359109U CN 217534646 U CN217534646 U CN 217534646U
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Abstract
The utility model relates to a solar cell production facility technical field specifically discloses a silicon chip moves and carries device. The utility model provides a silicon chip moves and carries device is used for moving and carry the silicon chip between delivery track and technology support plate, adsorb and carry the unit and be equipped with the adsorption component of two at least absorption silicon chips, move and carry to the technology support plate or move from the technology support plate and carry to the delivery track from the delivery track with the realization that can adsorb multiseriate silicon chip simultaneously, the efficiency of transportation has been improved, and the position of adsorption component in the X direction can be adjusted, when the interval with the adjacent two lists silicon chip on the delivery track is inequality with the interval with the adjacent two lists silicon chip on the technology support plate, realize the smooth transportation of silicon chip, the flexibility that the silicon chip moved and carries the device and use has been improved; the X-axis driving unit enables the adsorption transfer unit to be switched between the conveying track and the process carrier plate, the Z-axis driving unit drives the adsorption transfer unit to ascend and descend so as to adsorb or place down the silicon wafer, the adsorption positioning precision requirement is low, and the silicon wafer is not easy to damage in the transfer process.
Description
Technical Field
The utility model relates to a solar cell production facility technical field especially relates to a silicon chip moves and carries device.
Background
The silicon wafer is a basic element of the solar cell, when the solar cell is produced and manufactured, the silicon wafer processed in the previous process section needs to be conveyed to the next process section, and in the transfer process, the silicon wafer needs to be transferred from the silicon wafer conveying runway to the process carrier plate and from the process carrier plate to the conveying track.
In the prior art, the silicon wafer transferring device cannot simultaneously transfer the silicon wafers on the plurality of conveying rails onto the process carrier plate, and cannot simultaneously transfer the silicon wafers on the process carrier plate to the plurality of conveying rails, so that the transferring efficiency is low, and the use cost is high. And if the manipulator structure is used for transferring the silicon wafer, the structure is complex, and the risk of damage to the silicon wafer is also existed in the transferring process.
Therefore, it is desirable to provide a silicon wafer transferring apparatus to solve the above-mentioned problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a silicon chip moves and carries device can move simultaneously between a plurality of delivery track and technology support plate and carry multiseriate silicon chip, transports efficiently, and can not cause the damage to the silicon chip moving the in-process.
To achieve the purpose, the utility model adopts the following technical proposal:
a silicon chip transfer device is used for transferring silicon chips between a conveying track and a process carrier plate, the conveying track and the process carrier plate are distributed below the silicon chip transfer device at intervals along an X direction, the conveying track conveys the silicon chips along a Y direction, and the silicon chip transfer device comprises:
the adsorption transfer unit comprises at least two adsorption assemblies, each adsorption assembly is provided with a plurality of adsorption parts for adsorbing the silicon wafers along the Y direction, and the position of each adsorption assembly in the X direction can be adjusted;
the Z-axis driving unit is connected with the adsorption transfer unit and is configured to drive the adsorption transfer unit to ascend and descend so as to adsorb or release the silicon wafer;
an X-axis driving unit connected with the Z-axis driving unit, wherein the X-axis driving unit is configured to drive the Z-axis driving unit to move along an X direction so as to switch between the conveying track and the process carrier plate.
As an optional aspect of the above silicon wafer transfer apparatus, the adsorption transfer unit further includes:
the two ends of the cross beam are connected with the Z-axis driving units, and each Z-axis driving unit is connected with an X-axis driving unit;
and the mounting bracket is connected with the cross beam, and the adsorption component is adjustably arranged on the mounting bracket along the X direction.
As an optional technical scheme of the silicon wafer transfer device, an adsorption linear transmission assembly is arranged on the mounting bracket, the adsorption linear transmission assembly comprises a plurality of moving pairs capable of moving along the X direction, and the adsorption assembly is connected with the moving pairs.
As an optional technical solution of the above silicon wafer transfer apparatus, the adsorption linear transmission assembly is a multi-rotor linear motor module.
As an optional aspect of the above silicon wafer transfer apparatus, the Z-axis driving unit includes:
a Z-axis linear drive;
and the Z-axis linear transmission assembly is connected with the adsorption transfer unit, and the Z-axis linear driver drives the moving pair to lift so as to drive the adsorption transfer unit to lift.
As an optional technical solution of the above silicon wafer transferring device, the Z-axis linear transmission assembly includes:
the screw rod is in driving connection with the Z-axis linear driver;
the screw is arranged on the screw rod, and the adsorption transfer unit is connected with the screw.
As an optional aspect of the above silicon wafer transfer apparatus, the X-axis driving unit includes:
an X-axis linear drive;
the X-axis linear transmission assembly is connected with the Z-axis driving unit through a moving pair, and the X-axis linear driver drives the moving pair to move so as to drive the Z-axis driving unit to move along the X direction.
As an optional technical solution of the above silicon wafer transfer apparatus, the X-axis linear transmission assembly includes:
the X-axis linear driver and the Z-axis driving unit are both arranged on the mounting seat;
a rack extending in the X direction;
and the gear is in driving connection with the X-axis linear driver and is meshed with the rack.
As an optional solution of the above silicon wafer transfer apparatus, the X-axis driving unit further includes a guiding component configured to guide the mount to move along the X direction.
As an optional technical scheme of the silicon wafer transfer device, the guide assembly comprises a support guide rail, and a slide block is arranged on the mounting seat and is arranged on the support guide rail in a sliding manner.
The utility model has the advantages that:
the utility model provides a silicon chip moves and carries device is used for moving and carry the silicon chip between delivery track and technology support plate, adsorb and carry the unit and be equipped with the adsorption component of two at least absorption silicon chips, move and carry to the technology support plate or move from the technology support plate and carry to the delivery track from the delivery track with the realization that can adsorb multiseriate silicon chip simultaneously, the efficiency of transportation has been improved, and the position of adsorption component in the X direction can be adjusted, when the interval with the adjacent two lists silicon chip on the delivery track is inequality with the interval with the adjacent two lists silicon chip on the technology support plate, realize the smooth transportation of silicon chip, the flexibility that the silicon chip moved and carries the device and use has been improved; the X-axis driving unit enables the adsorption transfer unit to be switched between the conveying rail and the process carrier plate, the Z-axis driving unit drives the adsorption transfer unit to ascend and descend so as to adsorb or place down the silicon wafer, the silicon wafer transfer device is arranged above the conveying rail and the process carrier plate, the conveying rail is not influenced to convey the silicon wafer, the adsorption transfer unit adsorbs the upper surface of the silicon wafer, the adsorption area is large, the adsorption stability is good, the requirement on adsorption positioning accuracy is low, and the silicon wafer is not easy to damage in the transfer process.
Drawings
Fig. 1 is a schematic view of an overall structure of a silicon wafer transferring device according to an embodiment of the present invention;
fig. 2 is a schematic partial structure diagram of a silicon wafer transferring device according to an embodiment of the present invention;
FIG. 3 is an enlarged view of a portion A of FIG. 2;
fig. 4 is a schematic structural diagram of an adsorption transfer unit according to an embodiment of the present invention;
fig. 5 is a schematic view of a part of the enlarged structure at B of fig. 4.
In the figure:
100. a conveying track; 200. carrying out a process carrier plate; 300. a silicon wafer;
1. an adsorption transfer unit; 2. a Z-axis drive unit; 3. an X-axis drive unit; 4. a base;
11. an adsorption component; 111. a sucker mounting bracket; 112. a suction cup; 12. a cross beam; 13. mounting a bracket; 14. adsorbing the linear transmission assembly;
21. a Z-axis linear drive;
31. an X-axis linear drive; 32. an X-axis linear transmission assembly; 321. a mounting seat; 322. a rack; 323. a gear; 33. a guide assembly; 331. supporting the guide rail; 332. a slide block.
Detailed Description
In order to make the technical problem solved by the present invention, the technical solutions adopted by the present invention and the technical effects achieved by the present invention clearer, the following will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by the skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.
Aiming at the problems that in the prior art, the silicon wafer transferring device cannot simultaneously transfer the silicon wafers on the plurality of conveying rails onto the process carrier plate, and cannot simultaneously transfer the silicon wafers on the process carrier plate onto the plurality of conveying rails, the transferring efficiency is low, and the use cost is high. And if use manipulator structure to transport the silicon chip, not only the structure is complicated, still has the problem to cause the risk of damage to the silicon chip in the transportation, and this embodiment provides a silicon chip and moves and carry device in order to solve above-mentioned technical problem.
As shown in fig. 1 and 2, the X direction, the Y direction, and the Z direction described below in the present embodiment are vertically arranged two by two in the spatial structure.
Specifically, the silicon wafer transferring device provided in this embodiment is used for transferring the silicon wafers 300 between the conveying rails 100 and the process carrier 200, the conveying rails 100 and the process carrier 200 are spaced below the silicon wafer transferring device along the X direction, and the conveying rails 100 convey the silicon wafers 300 along the Y direction. The silicon wafer transfer device includes an adsorption transfer unit 1, a Z-axis drive unit 2, and an X-axis drive unit 3. The adsorption transfer unit 1 comprises at least two adsorption assemblies 11, each adsorption assembly 11 is provided with a plurality of adsorption parts for adsorbing the silicon wafers 300 along the Y direction, so as to realize simultaneous adsorption of a plurality of silicon wafers 300 which are placed on the conveying rail 100 and conveyed along the Y direction or a row of silicon wafers 300 arranged along the Y direction on the process carrier plate 200, and realize simultaneous adsorption of a plurality of rows of silicon wafers 300 transferred from the conveying rail 100 to the process carrier plate 200 or transferred from the process carrier plate 200 to the conveying rail 100, thereby improving the transfer efficiency. The position of the adsorption assembly 11 in the X direction can be adjusted, so that when the distance between two adjacent rows of silicon wafers 300 on the conveying track 100 is different from the distance between two adjacent rows of silicon wafers 300 on the process carrier plate 200, smooth transfer of the silicon wafers 300 is realized, and the flexibility of use of the silicon wafer transferring device is improved. The Z-axis drive unit 2 is connected to the suction transfer unit 1, and the Z-axis drive unit 2 is configured to drive the suction transfer unit 1 to move up and down to suck or discharge the silicon wafer 300. The X-axis driving unit 3 is connected to the Z-axis driving unit 2, and the X-axis driving unit 3 is configured to drive the Z-axis driving unit 2 to move in the X direction to switch between the conveying rail 100 and the process carrier board 200. The silicon wafer transferring device is arranged above the conveying track 100 and the process carrier plate 200, the conveying track 100 is not influenced to convey the silicon wafers 300, the adsorption transferring unit 1 adsorbs the upper surfaces of the silicon wafers 300, the adsorption area is large, the adsorption stability is good, the adsorption positioning precision requirement is low, and the silicon wafers 300 are not easy to damage in the transferring process.
In this embodiment, the adsorption transfer unit 1 further includes a beam 12, a mounting bracket 13 is disposed on the beam 12, the adsorption component 11 is disposed on the mounting bracket 13, and the adsorption component 11 is adjustably disposed on the mounting bracket 13 along the X direction. Both ends of crossbeam 12 all are connected with Z axle drive unit 2, and two Z axle drive unit 2 simultaneous workings drive crossbeam 12 go up and down, and then realize driving adsorption component 11 and go up and down, and set up two Z axle drive unit 2, have reduced unilateral drive and have the problem of jamming when going up and down, have improved the stability and the repeated positioning's of adsorption component 11 lift precision.
The Z-axis driving units 2 are connected to the X-axis driving units 3, and on the premise that two Z-axis driving units 2 are provided, preferably, one X-axis driving unit 3 is provided for each Z-axis driving unit 2. Two X axle drive unit 3 simultaneous working drive two Z axle drive unit 2 and move along the X direction, have reduced unilateral drive and have the problem of jamming when moving along the X direction, have improved the stability and the precision of repeated location that adsorption component 11 moved along the X direction. The conveying rail 100 and the process carrier 200 are disposed between the two X-axis driving units 3, and the mounting bracket 13 is disposed at the middle of the cross beam 12, so that the adsorption assembly 11 is mounted on the mounting bracket 13.
In this embodiment, referring to fig. 2 and fig. 3, the X-axis driving unit 3 includes an X-axis linear driver 31 and an X-axis linear driving assembly 32, a moving pair of the X-axis linear driving assembly 32 is connected to the Z-axis driving unit 2, and the X-axis linear driver 31 drives the moving pair to move so as to drive the Z-axis driving unit 2 to move along the X direction, thereby realizing the movement of the adsorption transfer unit 1 between the conveying track 100 and the process carrier 200.
Further, in this embodiment, the silicon wafer transferring apparatus further includes a base 4 (see fig. 1), and the X-axis linear actuator 32 is mounted on the base 4.
The X-axis linear drive assembly 32 includes a rack 322, the rack 322 extending in the X-direction, preferably the rack 322 is mounted on the base 4. The X-axis linear transmission assembly 32 further comprises a mounting seat 321 and a gear 323, the X-axis linear driver 31 and the Z-axis driving unit 2 are both mounted on the mounting seat 321, the gear 323 is in driving connection with the X-axis linear driver 31, and the gear 323 is meshed with the rack 322. In operation, the X-axis linear actuator 31 drives the gear 323 to rotate and move along the rack 322, thereby driving the mounting base 321 to move along the X direction. The X-axis linear transmission assembly 32 provided by the embodiment is simple in structure, high in repeated positioning precision and good in running stability. The X-axis linear drive 31 is a motor.
In other embodiments, the X-axis linear actuator assembly 32 may be a synchronous belt transmission structure, a chain transmission structure, a linear motor, etc., which are not described in detail herein since they are all conventional structures.
In order to improve the operation stability of the mounting seat 321 and support the mounting seat 321, the Z-axis driving unit 2 and the suction transferring unit 1, in the present embodiment, the X-axis driving unit 3 further includes a guiding component 33, and the guiding component 33 is configured to guide the mounting seat 321 to move along the X direction.
Optionally, the guide assembly 33 includes a support rail 331, the support rail 331 extends along the X direction, specifically, the support rail 331 is installed on the base 4, the slider 332 is disposed on the mounting seat 321, and the slider 332 is slidably disposed on the support rail 331, which is simple in structure, improves the stability of the movement of the mounting seat 321, and provides an effective supporting force for the operation of the mounting seat 321.
In other embodiments, the guiding assembly 33 includes a supporting rail 331, the supporting rail 331 extends along the X direction, and the mounting seat 321 is provided with a pulley slidably disposed on the supporting rail 331.
The Z-axis driving unit 2 comprises a Z-axis linear driver 21 and a Z-axis linear transmission assembly, the moving pair of the Z-axis linear transmission assembly is connected with the adsorption transfer unit 1, the Z-axis linear driver 21 drives the moving pair to lift so as to drive the adsorption transfer unit 1 to lift, and then the adsorption or the transfer of the silicon wafer 300 is realized.
Further, the Z-axis linear transmission assembly comprises a screw rod and a nut, the screw rod is in driving connection with the Z-axis linear driver 21, the nut is arranged on the screw rod, and the adsorption transfer unit 1 is connected with the nut. Specifically, the cross beam 12 of the adsorption transfer unit 1 is connected with a screw, the Z-axis linear driver 21 drives the screw to rotate, the screw goes up and down along the screw, the cross beam 12 is driven to go up and down, and then the lifting of the adsorption component 11 is realized. The lifting of the adsorption component 11 is realized by using a screw rod and nut structure, the transmission efficiency is high, and the repeated positioning precision is high. The Z-axis linear actuator 21 is a motor.
In other embodiments, the Z-axis linear driving assembly may also be a synchronous belt driving structure, a sprocket driving structure, a rack and pinion driving structure, or a linear motor, which is not limited herein.
The adsorption component 11 is adjustably arranged on the mounting bracket 13 along the X direction, specifically, as shown in fig. 4 and 5, an adsorption linear transmission component 14 is arranged on the mounting bracket 13, the adsorption linear transmission component 14 includes a plurality of sliding pairs capable of moving along the X direction, and the adsorption component 11 is connected with the sliding pairs. The position of the suction unit 11 in the X direction is adjustable to accommodate the change in the X-axis direction of the transfer positions of the adjacent silicon wafers 300 of the transport rail 100 and the process carrier 200. The adsorption linear transmission assembly 14 comprises a plurality of moving pairs, so that the structure of the adsorption assembly 11 with adjustable position in the X direction is simplified, and the compactness of the whole structure of the adsorption transfer unit 1 is improved.
In the present embodiment, the absorption linear actuator assembly 14 is a multi-mover linear motor module. The multi-rotor linear motor module comprises a plurality of moving pairs. The number of the sliding pairs is set according to the number of the conveying rails 100, and the number of the adsorption assemblies 11 corresponds to the number of the conveying rails 100. For example, in the present embodiment, four conveying rails 100 are provided, that is, four conveying rails 100 can convey the silicon wafer 300, and correspondingly, four suction assemblies 11 are provided, so that four moving pairs are required to connect with the suction assemblies 11.
In the embodiment, the suction assembly 11 includes a suction cup mounting bracket 111, the suction part is a suction cup 112, the suction cups 112 are mounted on the mounting bracket 111, the number of the suction cups 112 is the same as the number of the silicon wafers 300 arranged along the Y direction of the process carrier 200, so as to ensure that the silicon wafers 300 on the process carrier 200 are taken away at one time or the process carrier 200 is filled with the silicon wafers 300 at one time.
When the silicon wafer transfer apparatus of the present embodiment is used, if the silicon wafer 300 on the conveying rail 100 is transferred to the process carrier 200, the adsorption transfer unit 1 is driven by the X-axis driving unit 3 to move to the upper side of the conveying rail 100, the Z-axis driving unit 2 drives the adsorption transfer unit 1 to descend, the adsorption transfer unit 1 adsorbs the silicon wafer 300, the Z-axis driving unit 2 drives the adsorption transfer unit 1 to ascend, the X-axis driving unit 3 drives the adsorption transfer unit 1 to move to the upper side of the process carrier 200, and then the Z-axis driving unit 2 drives the adsorption transfer unit 1 to descend, so as to place the silicon wafer 300 on the process carrier 200, and the position of the adsorption assembly 11 in the X direction needs to be adaptively adjusted when the silicon wafer 300 is adsorbed from the conveying rail 100 or the silicon wafer 300 is placed on the process carrier 200. If the silicon wafer 300 on the process carrier 200 is placed on the conveying track 100, the working process is the reverse of the above, and will not be described in detail here.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. This need not be, nor should it be exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A silicon wafer transfer device is used for transferring a silicon wafer (300) between a conveying rail (100) and a process carrier plate (200), the conveying rail (100) and the process carrier plate (200) are distributed below the silicon wafer transfer device at intervals along the X direction, the conveying rail (100) conveys the silicon wafer (300) along the Y direction, and the silicon wafer transfer device is characterized by comprising:
an adsorption transfer unit (1) comprising at least two adsorption assemblies (11), wherein each adsorption assembly (11) is provided with a plurality of adsorption parts for adsorbing the silicon wafers (300) along the Y direction, and the position of the adsorption assembly (11) in the X direction can be adjusted;
a Z-axis driving unit (2) connected to the adsorption transfer unit (1), wherein the Z-axis driving unit (2) is configured to drive the adsorption transfer unit (1) to move up and down to adsorb or release the silicon wafer (300);
an X-axis driving unit (3) connected with the Z-axis driving unit (2), wherein the X-axis driving unit (3) is configured to drive the Z-axis driving unit (2) to move along the X direction so as to switch between the conveying track (100) and the process carrier plate (200).
2. The silicon wafer transfer apparatus according to claim 1, wherein the suction transfer unit (1) further comprises:
the two ends of the cross beam (12) are connected with the Z-axis driving units (2), and each Z-axis driving unit (2) is connected with an X-axis driving unit (3);
and the mounting bracket (13) is connected with the cross beam (12), and the adsorption component (11) is adjustably arranged on the mounting bracket (13) along the X direction.
3. The silicon wafer transfer device according to claim 2, wherein the mounting rack (13) is provided with a suction linear transmission assembly (14), the suction linear transmission assembly (14) comprises a plurality of moving pairs capable of moving along the X direction, and the suction assembly (11) is connected with the moving pairs.
4. The silicon wafer transfer apparatus according to claim 3, wherein the adsorption linear actuator assembly (14) is a multi-mover linear motor module.
5. The silicon wafer transfer apparatus according to claim 1, wherein the Z-axis drive unit (2) comprises:
a Z-axis linear actuator (21);
the Z-axis linear transmission assembly is connected with the adsorption transfer unit (1) in a moving pair, and the Z-axis linear driver (21) drives the moving pair to lift so as to drive the adsorption transfer unit (1) to lift.
6. The silicon wafer transfer apparatus according to claim 5, wherein the Z-axis linear actuator assembly comprises:
the screw rod is in driving connection with the Z-axis linear driver (21);
the screw is arranged on the screw rod, and the adsorption transfer unit (1) is connected with the screw.
7. The silicon wafer transfer apparatus according to claim 1, wherein the X-axis drive unit (3) comprises:
an X-axis linear actuator (31);
the X-axis linear transmission assembly (32), a moving pair of the X-axis linear transmission assembly (32) is connected with the Z-axis driving unit (2), and the X-axis linear driver (31) drives the moving pair to move so as to drive the Z-axis driving unit (2) to move along the X direction.
8. The silicon wafer transfer apparatus according to claim 7, wherein the X-axis linear actuator assembly (32) comprises:
the mounting seat (321), the X-axis linear driver (31) and the Z-axis driving unit (2) are mounted on the mounting seat (321);
a rack (322) extending in the X direction;
a gear (323) in driving connection with the X-axis linear driver (31), wherein the gear (323) is meshed with the rack (322).
9. The silicon wafer transfer apparatus according to claim 8, wherein the X-axis drive unit (3) further comprises a guide member (33), and the guide member (33) is configured to guide the mount (321) to move in the X-direction.
10. The silicon wafer transfer apparatus according to claim 9, wherein the guide member (33) comprises a support rail (331), the mounting base (321) is provided with a slider (332), and the slider (332) is slidably disposed on the support rail (331).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221359109.0U CN217534646U (en) | 2022-06-01 | 2022-06-01 | Silicon chip moves and carries device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221359109.0U CN217534646U (en) | 2022-06-01 | 2022-06-01 | Silicon chip moves and carries device |
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| Publication Number | Publication Date |
|---|---|
| CN217534646U true CN217534646U (en) | 2022-10-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221359109.0U Active CN217534646U (en) | 2022-06-01 | 2022-06-01 | Silicon chip moves and carries device |
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| Country | Link |
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| CN (1) | CN217534646U (en) |
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2022
- 2022-06-01 CN CN202221359109.0U patent/CN217534646U/en active Active
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