CN211350604U - Automatic wafer loading and unloading device - Google Patents
Automatic wafer loading and unloading device Download PDFInfo
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- CN211350604U CN211350604U CN202020394874.0U CN202020394874U CN211350604U CN 211350604 U CN211350604 U CN 211350604U CN 202020394874 U CN202020394874 U CN 202020394874U CN 211350604 U CN211350604 U CN 211350604U
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- guide rail
- work
- motor
- unloading device
- crane
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses an automatic change unloader on wafer in the semiconductor manufacturing field, sliding connection has the removal base on guide rail one, installs the motor on the motor cabinet, and the cover is equipped with the gear on the output shaft of motor, and wheel and rack meshes mutually, be provided with the mount pad on the removal base, the vertical grudging post that is provided with on the mount pad, sliding connection has the crane on the guide rail two on grudging post right side, is provided with guide rail three along length direction on the crane, has the work or material rest through three sliding connection of guide rail on the crane, and the work or material rest bottom corresponds guide rail three and is provided with the spout, and the left and right sides of crane all is provided with the cylinder, and the piston rod of cylinder is parallel with the length direction of work or material rest, and the piston rod of two cylinders stretches out the end and is. The utility model discloses can improve the last unloading efficiency of wafer.
Description
Technical Field
The utility model belongs to the semiconductor manufacturing field, in particular to automatic change unloader on wafer.
Background
In the prior art, in the process of manufacturing gold bumps of lcd driving chips in semiconductor packaging and manufacturing industry, the conventional process is to sputter bump barrier (UBM), define the bump position by a yellow photoresist process, deposit gold on the wafer by chemical plating or electroless plating to form gold bumps, and remove the photoresist and the excess bump barrier by wet etching. The wafer refers to a substrate (also called a substrate) for manufacturing a semiconductor transistor or an integrated circuit, and is called a wafer because it is a crystalline material and its shape is circular. After the wafer is processed and manufactured, if the wafer needs to be processed, the wafer is generally manually carried, so that the loading and unloading efficiency of the wafer is low, and the processing efficiency is finally affected.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an automatic change unloader on wafer can realize removing a plurality of wafers simultaneously and carry the relevant position, improves the last unloading efficiency of wafer.
The purpose of the utility model is realized like this: an automatic wafer loading and unloading device comprises a first guide rail transversely arranged, a moving base is connected to the first guide rail in a sliding mode, a motor base is integrally arranged on the moving base, the plane where the motor base is located below the plane where the moving base is located, a motor is mounted on the motor base, a gear is sleeved on an output shaft of the motor, a rack is arranged on one side face of the guide rail corresponding to the gear in the length direction, the gear is meshed with the rack, a mounting seat is arranged on the moving base, a vertical frame is vertically arranged on the mounting seat, a second guide rail is vertically arranged in the middle of the right side of the vertical frame, a horizontal lifting frame is connected to the second guide rail in a sliding mode through a sliding block, rotatable lead screws are vertically arranged on the front side and the rear side of the second guide rail on the vertical frame, lead screw nuts on the two lead screws are in transmission connection with one side corresponding to the, the material rack is connected to the lifting frame through the guide rail III in a sliding mode, a sliding groove is formed in the bottom of the material rack and corresponds to the guide rail III, air cylinders are arranged on the left side and the right side of the lifting frame, piston rods of the air cylinders are parallel to the length direction of the material rack, the extending ends of the piston rods of the two air cylinders are connected with the left side and the right side of the material rack through connecting pieces respectively, and the front end of the material rack is.
When the utility model works, the motor drives the gear to rotate, the gear rolls along the rack, and the movable base is driven to move along the first guide rail; the screw rod rotates, and the lifting frame is driven to lift along the second guide rail through the screw rod nut; the two cylinders jointly drive the material rack to move along the guide rail III; the material sucking assembly can move freely, and each vacuum chuck on the material sucking assembly can suck and fix a plurality of wafers. Compared with the prior art, the beneficial effects of the utility model reside in that: the wafer conveying device can move and convey a plurality of wafers to corresponding positions simultaneously, and the wafer feeding and discharging efficiency is improved.
As a further improvement, the material sucking component comprises a plurality of mutually parallel transverse rods, a plurality of longitudinal connecting rods are arranged between the two adjacent transverse rods, and a plurality of vacuum suckers are arranged on the lower side of the transverse rods at intervals along the length direction in sequence. The vacuum chuck adsorbs and fixes the wafer, and the wafer is not damaged.
As a further improvement of the utility model, with inhale the material subassembly and be provided with the process chamber correspondingly, rotationally be provided with vertical pivot in the process chamber, be provided with a plurality of carousels along axial interval in the pivot, the carousel is mutually perpendicular with the pivot, is provided with a plurality of rows of wafer microscope carriers on the carousel, lies in each wafer microscope carrier symmetric distribution of both sides around the pivot on the carousel, and each wafer microscope carrier and each vacuum chuck one-to-one of carousel front side or rear side set up. The rotating shaft can drive the rotating disc to rotate, each vacuum sucker on the material suction assembly firstly sends a plurality of wafers to the front side of the rotating disc, then the rotating disc rotates for 180 degrees to enable the wafer carrying platform which is arranged on the rear side of the rotating disc and is empty to rotate to the front side, and the material suction assembly sends a plurality of wafers to the rest wafer carrying platform of the rotating disc.
As a further improvement of the utility model, be provided with on the motor cabinet and run through the groove, the gear downside is located and runs through the groove below.
As a further improvement, the right side of the slider is provided with a supporting seat, and the lifting frame is arranged on the supporting seat.
In order to more stably provide guidance for the material rack, two guide rails are symmetrically arranged on the left side and the right side of the three guide rails.
Drawings
Fig. 1 is a top view of the present invention and a process chamber.
Fig. 2 is a top view of the present invention.
Fig. 3 is a front view of the present invention.
Fig. 4 is a cross-sectional view along AA of fig. 3.
Fig. 5 is a bottom view of the suction assembly.
The automatic vacuum processing device comprises a first guide rail, a second moving base, a motor base 2a, a motor 3, a gear 3a, a rack 4, a mounting base 5, a vertical frame 6, a second guide rail 7, a sliding block 8, a lifting frame 9, a screw rod 10, a screw nut 10a, a third guide rail 11, a material frame 12, an air cylinder 13, a connecting piece 14, a transverse rod 15, a longitudinal connecting rod 16, a vacuum sucker 17, a processing chamber 18, a rotating shaft 19, a rotating disc 20, a wafer carrying platform 21, a penetrating groove 22 and a supporting seat 23.
Detailed Description
As shown in fig. 1-5, an automatic wafer loading and unloading device comprises a first guide rail 1 transversely arranged, a moving base 2 is slidably connected on the first guide rail 1, a motor base 2a is integrally arranged on the moving base 2, the plane of the motor base 2a is located below the plane of the moving base 2, a motor 3 is arranged on the motor base 2a, a gear 3a is sleeved on an output shaft of the motor 3, a rack 4 is arranged on the side surface of the first guide rail 1 along the length direction corresponding to the gear 3a, the gear 3a is meshed with the rack 4, a mounting base 5 is arranged on the moving base 2, a vertical frame 6 is vertically arranged on the mounting base 5, a second guide rail 7 is vertically arranged in the middle of the right side of the vertical frame 6, a horizontal lifting frame 9 is slidably connected on the second guide rail 7 through a slide block 8, rotatable lead screws 10 are vertically arranged on the vertical frame 6 at the front side and the rear side of the second guide rail 7, lead screw nuts 10a of the, the length direction of crane 9 is perpendicular with the length direction of guide rail 1, be provided with guide rail three 11 along length direction on crane 9, there is work or material rest 12 through guide rail three 11 sliding connection on crane 9, work or material rest 12 bottom corresponds guide rail three 11 and is provided with the spout, crane 9's the left and right sides all is provided with cylinder 13, cylinder 13's piston rod is parallel with the length direction of work or material rest 12, the piston rod of two cylinders 13 stretches out the end and is connected with the left and right sides of work or material rest 12 through connecting piece 14 respectively, the front end of work or material rest 12 corresponds carousel 20 and is provided with and inha. The material sucking assembly comprises a plurality of parallel transverse rods 15, a plurality of longitudinal connecting rods 16 are arranged between every two adjacent transverse rods 15, and a plurality of vacuum suckers 17 are sequentially arranged on the lower sides of the transverse rods 15 at intervals along the length direction. The processing chamber 18 is arranged corresponding to the material suction assembly, a vertical rotating shaft 19 is rotatably arranged in the processing chamber 18, a plurality of rotating discs 20 are axially arranged on the rotating shaft 19 at intervals, the rotating discs 20 are perpendicular to the rotating shaft 19, a plurality of rows of wafer carrying platforms 21 are arranged on the rotating discs 20, the wafer carrying platforms 21 on the front side and the rear side of the rotating shaft 19 are symmetrically distributed, and the wafer carrying platforms 21 on the front side or the rear side of the rotating discs 20 are arranged in one-to-one correspondence with the vacuum chucks 17. The motor base 2a is provided with a through groove 22, and the lower side of the gear 3a is positioned below the through groove 22. The right side of the sliding block 8 is provided with a supporting seat 23, and the lifting frame 9 is arranged on the supporting seat 23. The third guide rail 11 is symmetrically provided with two left and right guide rails.
When the utility model works, the motor 3 drives the gear 3a to rotate, the gear 3a rolls along the rack 4, and the movable base 2 is driven to move along the guide rail I1; the screw rod 10 rotates, and the lifting frame 9 is driven to lift along the second guide rail 7 through the screw rod nut 10 a; the two cylinders 13 jointly drive the material rack 12 to move along the guide rail III 11; the sucking assembly can move freely, and each vacuum chuck 17 on the sucking assembly can suck and fix a plurality of wafers. The utility model has the advantages that: the wafer conveying device can move and convey a plurality of wafers to corresponding positions simultaneously, and the wafer feeding and discharging efficiency is improved.
The present invention is not limited to the above embodiments, and based on the technical solutions disclosed in the present invention, those skilled in the art can make some replacements and transformations for some technical features without creative labor according to the disclosed technical contents, and these replacements and transformations are all within the protection scope of the present invention.
Claims (6)
1. An automatic wafer loading and unloading device is characterized by comprising a first guide rail which is transversely arranged, a moving base is connected to the first guide rail in a sliding mode, a motor base is integrally arranged on the moving base, the plane where the motor base is located below the plane where the moving base is located, a motor is installed on the motor base, a gear is sleeved on an output shaft of the motor, a rack is arranged on one side face of the guide rail corresponding to the gear in the length direction, the gear is meshed with the rack, an installation base is arranged on the moving base, a vertical frame is vertically arranged on the installation base, a second guide rail is vertically arranged in the middle of the right side of the vertical frame, a horizontal lifting frame is connected to the second guide rail in a sliding mode through a sliding block, rotatable lead screws are vertically arranged on the front side and the rear side of the second guide rail on the vertical frame, lead screw nuts on the two lead screws, be provided with guide rail three along length direction on the crane, there is the work or material rest through three sliding connection of guide rail on the crane, the work or material rest bottom corresponds guide rail three and is provided with the spout, and the left and right sides of crane all is provided with the cylinder, and the piston rod of cylinder is parallel with the length direction of work or material rest, and the piston rod of two cylinders stretches out the end and is connected with the left and right sides of work or material rest through the connecting piece respectively, and the front end of work or material rest corresponds.
2. The automatic wafer loading and unloading device as claimed in claim 1, wherein the material sucking assembly comprises a plurality of parallel transverse rods, a plurality of longitudinal connecting rods are arranged between two adjacent transverse rods, and a plurality of vacuum chucks are sequentially arranged at intervals along the length direction at the lower side of each transverse rod.
3. The automatic wafer loading and unloading device as claimed in claim 2, wherein a processing chamber is provided corresponding to the material suction assembly, a vertical rotating shaft is rotatably provided in the processing chamber, a plurality of rotating discs are axially arranged on the rotating shaft at intervals, the rotating discs are perpendicular to the rotating shaft, a plurality of rows of wafer carrying platforms are provided on the rotating discs, the wafer carrying platforms on the rotating discs on the front and back sides of the rotating shaft are symmetrically distributed, and the wafer carrying platforms on the front side or the back side of the rotating discs are provided in one-to-one correspondence with the vacuum chucks.
4. The automatic wafer loading and unloading device as claimed in any one of claims 1-3, wherein the motor base is provided with a through slot, and the lower side of the gear is located below the through slot.
5. The automatic wafer loading and unloading device as claimed in any one of claims 1-3, wherein a support seat is arranged at the right side of the slide block, and the lifting frame is arranged on the support seat.
6. The automatic wafer loading and unloading device as claimed in any one of claims 1-3, wherein two guide rails are symmetrically arranged on the left and right of the three guide rails.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020394874.0U CN211350604U (en) | 2020-03-25 | 2020-03-25 | Automatic wafer loading and unloading device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020394874.0U CN211350604U (en) | 2020-03-25 | 2020-03-25 | Automatic wafer loading and unloading device |
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| Publication Number | Publication Date |
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| CN211350604U true CN211350604U (en) | 2020-08-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020394874.0U Active CN211350604U (en) | 2020-03-25 | 2020-03-25 | Automatic wafer loading and unloading device |
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| CN (1) | CN211350604U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022048023A1 (en) * | 2020-09-03 | 2022-03-10 | 苏州艾科瑞思智能装备股份有限公司 | Vertical automatic wafer loading/unloading device |
-
2020
- 2020-03-25 CN CN202020394874.0U patent/CN211350604U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022048023A1 (en) * | 2020-09-03 | 2022-03-10 | 苏州艾科瑞思智能装备股份有限公司 | Vertical automatic wafer loading/unloading device |
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