CN114005772A - Wafer heating source coating machine - Google Patents
Wafer heating source coating machine Download PDFInfo
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- CN114005772A CN114005772A CN202111352459.4A CN202111352459A CN114005772A CN 114005772 A CN114005772 A CN 114005772A CN 202111352459 A CN202111352459 A CN 202111352459A CN 114005772 A CN114005772 A CN 114005772A
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Coating Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer heating source coating machine, which comprises a rack, wherein a material placing mechanism, a conveying mechanism, a solvent coating mechanism, a rotating mechanism, a magnetic stirrer, a heating mechanism and a material receiving mechanism are sequentially arranged above the rack from left to right; according to the automatic coating machine, the automatic coating of the wafer is realized, the complete drying and cooling of the wafer after the coating of the wafer are realized through the arrangement of the heating mechanism, the product quality is ensured, the automatic placement of the wafer is realized through the third carrying mechanism and the turnover mechanism, the manual carrying is avoided, and the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of wafer production equipment, in particular to a wafer heating source coating machine.
Background
In the semiconductor process, wafers need to pass through the processing process of various machines, a blank surface coating source is needed before boron diffusion production in the production process of the semiconductor wafers, operations such as coating source, baking, collecting and the like are needed before cleaned wafers are subjected to boron diffusion, at present, the coating source is mainly formed by dipping a diffusion source by a worker with a brush pen, then the wafers are fully coated, the uniformity of the boron source on the surfaces of the wafers is influenced by manually coating the source with the brush pen, the production efficiency is low, and the quality is uncontrollable; in the prior art, a drying module is arranged on a wafer coating machine, but in the continuous production process of wafers, a single drying module is difficult to completely dry the wafers, and the wafers need to be cooled and collected after being dried, so that the conventional wafer coating machine is difficult to cool and collect the wafers while completely drying the wafers on one device, and the quality of the wafers is influenced.
Disclosure of Invention
The present invention is directed to a wafer heating source coating machine to solve the above problems.
In order to achieve the purpose, the invention provides the following technical scheme:
a wafer heating source coating machine comprises a rack, wherein a protective cover is arranged above the rack, and the rack consists of a first supporting table, a second supporting table and a third supporting table which are sequentially connected from left to right;
a feeding mechanism, a conveying mechanism, a solvent coating mechanism, a rotating mechanism, a magnetic stirrer, a heating mechanism and a material receiving mechanism are sequentially arranged above the rack from left to right, a solvent bottle for containing a diffusion source is placed on the magnetic stirrer, a first carrying mechanism is arranged on one side of the feeding mechanism and one side of the conveying mechanism, a second carrying mechanism is arranged on one side of the conveying mechanism, one side of the solvent coating mechanism, one side of the rotating mechanism, one side of the magnetic stirrer and one side of the heating mechanism, a third carrying mechanism is arranged on the right end of the heating mechanism and one side of the material receiving mechanism, and a turn-over mechanism is arranged on the other side of the heating mechanism;
the feeding mechanism, the conveying mechanism, the first carrying mechanism, the solvent coating mechanism, the rotating mechanism, the magnetic stirrer and the second carrying mechanism are arranged on the first supporting platform, the heating mechanism is arranged on the second supporting platform, and the receiving mechanism, the third carrying mechanism and the turn-over mechanism are arranged on the third supporting platform;
the feeding mechanism and the receiving mechanism are used for storing wafers, the conveying mechanism comprises a conveyor, a supporting leg, a material receiving box, a material blocking rod and a material blocking cylinder, the conveyor is fixed on the supporting leg, the material receiving box is obliquely arranged on the outer side of the middle section of the conveyor, the material blocking rod is connected with the material blocking cylinder, and the material blocking cylinder is fixed on the conveyor and is opposite to the material receiving box;
the first conveying mechanism is used for conveying the wafer from the material placing mechanism to the conveying mechanism, the second conveying mechanism is used for conveying the wafer from the conveying mechanism to the rotating mechanism, then conveying the wafer from the rotating mechanism to the heating mechanism, and the third conveying mechanism is used for conveying the wafer from the heating mechanism to the material receiving mechanism;
the solvent coating mechanism comprises a writing brush clamping head for fixing a writing brush, the writing brush clamping head is fixed on the rotary lifting mechanism, and the rotary lifting mechanism is used for driving the writing brush to dip the diffusion source in the solvent bottle and then driving the writing brush to move above the rotating mechanism;
the rotating mechanism comprises a coating source disc, a rotating disc, a first synchronous belt wheel, a second synchronous belt wheel and a third motor, the rotating disc is concentrically arranged in the coating source disc, a mounting shaft at the lower end of the rotating disc is rotatably mounted in the coating source disc, the first synchronous belt wheel is fixed on the mounting shaft of the coating source disc and is in transmission connection with the second synchronous belt wheel through a synchronous belt, and the second synchronous belt wheel is fixed on a motor shaft of the third motor;
the heating mechanism comprises an installation section, heating tables, cooling tables, a material receiving rod, a groove, a second air cylinder, a connecting pin, a slide rail, a guide block, a connecting block and a third air cylinder, wherein the plurality of heating tables are arranged at the upper end of the installation section at equal intervals, the plurality of cooling tables are also arranged at the upper end of the installation section at equal intervals, the cooling tables are arranged at the right ends of the heating tables, the heating tables and the cooling tables have the same structure, all set up flutedly on it, the recess is used for placing the wafer and connects the material pole, connect material pole parallel arrangement to have two, both ends are fixed respectively on the connecting block about two material poles, and the connecting block is fixed respectively on the output of third cylinder, and the lower extreme fixed mounting of installation section bar has the slide rail, and slide rail horizontal sliding mounting is in the guide block, and guide block and second cylinder are fixed on the second brace table, and the piston rod of second cylinder is through connecting foot and installation section bar fixed connection.
Preferably, the first conveying mechanism, the second conveying mechanism and the third conveying mechanism are arranged at the center of the rack, and the emptying mechanism, the conveying mechanism, the solvent coating mechanism, the rotating mechanism, the magnetic stirrer, the heating mechanism and the receiving mechanism are arranged in two groups and symmetrically arranged at the front side and the rear side of the first conveying mechanism, the second conveying mechanism and the third conveying mechanism.
Preferably, the discharging mechanism comprises a fourth motor, a placing plate, a fixed plate, an installation rod, an air nozzle, a positioning rod, a top disc, a screw rod and top columns, the fixed plate is fixed on the first supporting table, the placing plate is arranged above the fixed plate in parallel, the lower end of the fixed plate is fixedly provided with the fourth motor, a motor shaft of the fourth motor is connected with the screw rod, the two top columns are respectively arranged on two sides of the screw rod in parallel, the lower ends of the two top posts are fixedly arranged on an adjusting plate, the center of the adjusting plate is provided with a screw hole matched with the screw rod, the two top posts are arranged on the fixing plate in a vertical sliding manner, the upper end of the top tray is fixed at the lower end of the top tray, the top tray is arranged at the center of the placing plate, the upper end of the top tray is used for stacking wafers, a plurality of positioning rods distributed in a circular array are fixedly installed at the upper end of the placing plate, two installing rods are symmetrically fixed at the upper end of the placing plate, and air nozzles are fixed above the installing rods.
Preferably, the receiving mechanism and the discharging mechanism have the same structure.
Preferably, the first carrying mechanism comprises a mounting box, a guide rail, a first air cylinder, a sucker mounting seat and a sucker, the guide rail is arranged in the mounting box, the first air cylinder is fixed on the outer side of the mounting box, a piston rod of the first air cylinder extends into the mounting box and is fixedly connected with a slider, the slider is slidably mounted on the guide rail left and right, the sucker mounting seat is fixed on the outer side of the slider, and the sucker for adsorbing wafers is fixedly mounted at the lower end of the sucker mounting seat.
Preferably, the rotary lifting mechanism comprises a first mounting plate fixed on the rack, a threaded sleeve is rotatably mounted on the first mounting plate, a screw rod is mounted in the threaded sleeve through threads, a first belt wheel is mounted on the screw rod, the first belt wheel is in transmission connection with a second belt wheel through a belt, the second belt wheel is fixed on a motor shaft of a first motor, the lower end of the threaded sleeve is fixedly connected with a third belt wheel, the third belt wheel is in transmission connection with a fourth belt wheel through a belt, the fourth belt wheel is fixed on a motor shaft of a second motor, and the first motor and the second motor are both fixed on the first mounting plate.
Preferably, the turnover mechanism comprises a third linear module, a rotary cylinder and a fourth mounting plate, the rotary cylinder is fixedly mounted on the moving end of the third linear module, the fourth mounting plate is fixedly mounted on the output end of the rotary cylinder, and a wafer clamping mechanism is mounted on the fourth mounting plate.
Preferably, the second carrying mechanism comprises a first linear module, a moving block, a fourth cylinder and a second mounting plate, the moving block is fixedly mounted at the output end of the first linear module, the fourth cylinder is fixed at the outer side of the moving block, the output end of the fourth cylinder is fixedly connected with the second mounting plate, and a wafer clamping mechanism is mounted at each of the left end and the right end of the lower end of the second mounting plate.
Preferably, the third carrying mechanism comprises a second linear module, a fifth cylinder and a third mounting plate, the fifth cylinder is fixedly mounted on the moving end of the second linear module, the third mounting plate is fixedly mounted on the output end of the fifth cylinder, and a wafer clamping mechanism is mounted at the lower end of the third mounting plate.
Preferably, the wafer clamping mechanism comprises a double-head cylinder, a fifth mounting plate and clamping rods, the fifth mounting plate is mounted at two output ends of the double-head cylinder respectively, and the two clamping rods are symmetrically mounted at the lower end of the fifth mounting plate.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the automatic coating of the wafer is realized through the arrangement of the conveying mechanism, the solvent coating mechanism, the rotating mechanism and the magnetic stirrer, the complete drying and cooling of the wafer after coating are realized through the arrangement of the heating mechanism, the product quality is ensured, the automatic arrangement of the wafer is realized through the third carrying mechanism and the turn-over mechanism, the efficiency is improved, meanwhile, the manual carrying is avoided, the workload of workers is reduced, and the production efficiency is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
FIG. 3 is a schematic top view of the internal structure of the present invention;
FIG. 4 is a schematic structural view of the mechanism above the first supporting table according to the present invention;
FIG. 5 is a schematic structural view of a discharging mechanism of the present invention;
FIG. 6 is a schematic structural view of a conveying mechanism and a first carrying mechanism of the present invention;
FIG. 7 is a schematic view of the solvent application mechanism of the present invention;
FIG. 8 is a schematic structural view of a rotating mechanism according to the present invention;
FIG. 9 is a schematic view of the heating mechanism of the present invention;
FIG. 10 is an enlarged view of the area A of the present invention;
FIG. 11 is a structural view of a second carrying mechanism according to the present invention;
FIG. 12 is a schematic structural view of a third carrying mechanism and a turnover mechanism of the present invention;
FIG. 13 is a structural view of a third carrying mechanism according to the present invention;
FIG. 14 is a schematic view of the turn-over mechanism of the present invention;
FIG. 15 is a schematic view of a wafer clamping mechanism according to the present invention.
In the figure: 1 rack, 101 first supporting table, 102 second supporting table, 103 third supporting table, 2 discharging mechanism, 21 fourth motor, 22 placing plate, 23 fixing plate, 24 mounting rod, 25 air nozzles, 26 positioning rod, 27 top disc, 28 screw rod, 29 top column, 3 conveying mechanism, 31 conveyer, 32 supporting legs, 33 material receiving box, 34 material blocking rod, 35 material blocking cylinder, 4 first conveying mechanism, 41 mounting box, 42 guide rail, 43 first cylinder, 44 suction cup mounting seat, 45 suction cup, 5 solvent coating mechanism, 501 first mounting plate, 502 screw rod, 503 threaded sleeve, 504 first belt wheel, 505 second belt wheel, 506 first motor, 507 third belt wheel, 508 fourth belt wheel, 509 second motor, 510 brush pen clamping head, 511 brush pen, 6 rotating mechanism, 61 coating source disc, 62 rotating disc, 63 first synchronous belt wheel, 64 second synchronous belt wheel, 65 third motor, 7 magnetic stirrer, 8 heating mechanism, 801 mounting section bar, 802 heating table, 803 cooling table, 804 material receiving rod, 805 groove, 806 second air cylinder, 807 connecting pin, 808 slide rail, 809 guiding block, 810 connecting block, 811 third air cylinder, 9 second carrying mechanism, 91 first linear module, 92 moving block, 93 fourth air cylinder, 94 second mounting plate, 10 material receiving mechanism, 11 third carrying mechanism, 111 second linear module, 112 fifth air cylinder, 113 third mounting plate, 12 turnover mechanism, 121 third linear module, 122 rotary air cylinder, 123 fourth mounting plate, 13 wafer, 14 solvent bottle, 15 wafer clamping mechanism, 151 double-head air cylinder, 152 fifth mounting plate, 153 clamping rod and 16 protective cover.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-15, the present invention provides a technical solution:
a wafer heating source coating machine comprises a machine frame 1, wherein a protective cover 16 is arranged above the machine frame 1, and the machine frame 1 is composed of a first supporting table 101, a second supporting table 102 and a third supporting table 103 which are sequentially connected from left to right.
The discharging mechanism 2, the conveying mechanism 3, the solvent coating mechanism 5, the rotating mechanism 6, the magnetic stirrer 7, the heating mechanism 8 and the receiving mechanism 10 are sequentially arranged above the rack 1 from left to right, the solvent bottle 14 used for containing a diffusion source is placed on the magnetic stirrer 7, the diffusion source in the solvent bottle 14 is stirred through the magnetic stirrer 7, the diffusion source is kept uniform, and the coating quality is guaranteed. A first conveying mechanism 4 is arranged on one side of the discharging mechanism 2 and the conveying mechanism 3, a second conveying mechanism 9 is arranged on one side of the conveying mechanism 3, the solvent coating mechanism 5, the rotating mechanism 6, the magnetic stirrer 7 and the heating mechanism 8, a third conveying mechanism 11 is arranged on the right end of the heating mechanism 8 and one side of the receiving mechanism 10, and a turn-over mechanism 12 is arranged on the other side of the third conveying mechanism.
The first conveying mechanism 4, the second conveying mechanism 9 and the third conveying mechanism 11 are arranged at the center of the rack 1, and the material discharging mechanism 2, the conveying mechanism 3, the solvent coating mechanism 5, the rotating mechanism 6, the magnetic stirrer 7, the heating mechanism 8 and the material receiving mechanism 10 are arranged in two groups and symmetrically arranged at the front side and the rear side of the first conveying mechanism 4, the second conveying mechanism 9 and the third conveying mechanism 11.
The discharge mechanism 2, the conveying mechanism 3, the first conveying mechanism 4, the solvent coating mechanism 5, the rotating mechanism 6, the magnetic stirrer 7 and the second conveying mechanism 9 are arranged on a first support table 101, the heating mechanism 8 is arranged on a second support table 102, and the receiving mechanism 10, the third conveying mechanism 11 and the turn-over mechanism 12 are arranged on a third support table 103.
The discharging mechanism 2 and the receiving mechanism 10 are used for storing the wafers 13, and the receiving mechanism 10 and the discharging mechanism 2 have the same structure. The material placing mechanism 2 comprises a fourth motor 21, a placing plate 22, a fixing plate 23, a mounting rod 24, an air nozzle 25, positioning rods 26, a top disc 27, a screw rod 28 and top pillars 29, the fixing plate 23 is fixed on the first supporting table 101, the placing plate 22 is arranged above the fixing plate 23 in parallel, the lower end of the fixing plate 23 is fixedly provided with the fourth motor 21, a motor shaft of the fourth motor 21 is connected with the screw rod 28, the two top pillars 29 are respectively arranged on two sides of the screw rod 28 in parallel, the lower ends of the two top pillars are both fixedly arranged on an adjusting plate, the center of the adjusting plate is provided with a screw hole matched with the screw rod 28, the two top pillars 29 are vertically and slidably arranged on the fixing plate 23, the upper ends of the two top pillars are fixed on the lower end of the top disc 27, the top disc 27 is arranged in the center of the placing plate 22, the upper end of the top disc 27 is used for stacking wafers 13, the upper end of the placing plate 22 is fixedly provided with a plurality of positioning rods 26 distributed in a circular array, two mounting rods 24 are also symmetrically fixed on the upper end of the base, and air nozzles 25 are fixed above the mounting rods 24. The wafer 13 without coating source is placed on the top disc 27, the position of the wafer 13 without coating source is restrained by the four positioning rods 26, air is blown to the uppermost wafer 13 without coating source through the air nozzles 25, the suction disc 45 only sucks one wafer 13 at a time, the screw rod 28 is driven to rotate through the fourth motor 21, the adjusting plate moves up and down under the action of threads, and during operation, the adjusting plate pushes the top disc 27 to ascend through the two top posts 29, so that the uppermost wafer 13 without coating source is always at the same height, and the first carrying mechanism 4 is convenient to carry.
The conveying mechanism 3 comprises a conveyor 31, supporting legs 32, a material receiving box 33, a material blocking rod 34 and a material blocking cylinder 35, the conveyor 31 is fixed on the supporting legs 32, the material receiving box 33 is obliquely arranged on the outer side of the middle section of the conveyor 31, the material blocking rod 34 is connected with the material blocking cylinder 35, and the material blocking cylinder 35 is fixed on the conveyor 31 and is opposite to the material receiving box 33; the uncoated source wafers 13 are conveyed to the conveyor 31 through the first conveying mechanism 4, whether the wafers 13 are single or double is detected through a sensor in the left-to-right conveying process of the wafers 13, if the wafers 13 are double or multiple, the material blocking cylinder 35 extends out to drive the material blocking rod 34 to ascend, two or more than two wafers 13 which are overlapped together are separated, and redundant wafers are blown into the material collecting box 33, so that only one uncoated source wafer 13 is transferred to the right end of the conveyor 31 at each time.
The first conveying mechanism 4 is used for conveying the wafer 13 from the material placing mechanism 2 to the conveying mechanism 3, the first conveying mechanism 4 comprises a mounting box 41, a guide rail 42, a first air cylinder 43, a sucker mounting seat 44 and a sucker 45, in the embodiment, the guide rail 42, the first air cylinder 43, the sucker mounting seat 44 and the sucker 45 are all provided with two, and the wafer 13 which is not coated with the source and is arranged on the front side and the rear side of the conveying mechanism 4 can be conveyed. The guide rail 42 is arranged in the mounting box 41, the first air cylinder 43 is fixed on the outer side of the mounting box 41, a piston rod of the first air cylinder extends into the mounting box 41 and is fixedly connected with the slider, the slider is arranged on the guide rail 42 in a left-right sliding manner, the outer side of the slider is fixedly provided with the sucker mounting seat 44, the lower end of the sucker mounting seat 44 is fixedly provided with a sucker 45 used for adsorbing the wafer 13, and the sucker 45 is driven to move left and right through the extension and contraction of the piston rod of the first air cylinder 43, so that the wafer 13 is conveyed.
The second conveying mechanism 9 is configured to convey the wafer 13 from the conveying mechanism 3 to the rotating mechanism 6, and then convey the wafer 13 from the rotating mechanism 6 to the heating mechanism 8, as shown in fig. 7, the solvent coating mechanism 5 includes a writing brush holding head 510 for fixing a writing brush 511, the writing brush holding head 510 is fixed on a rotary lifting mechanism, and the rotary lifting mechanism is configured to drive the writing brush 511 to dip the diffusion source in the solvent bottle 14, and then drive the writing brush 511 to move above the rotating mechanism 6.
The rotary lifting mechanism comprises a first mounting plate 501 fixed on the frame 1, a threaded sleeve 503 is rotatably mounted on the first mounting plate 501, a screw 502 is mounted in the threaded sleeve 503 through threads, a first belt wheel 504 is mounted on the screw 502, the first belt wheel 504 is in transmission connection with a second belt wheel 505 through a belt, the second belt wheel 505 is fixed on a motor shaft of a first motor 506, and the screw 502 is driven to rotate through the arrangement of the first motor 506, the first belt wheel 504 and the second belt wheel 505, so that the rotary swing of the screw 502 is realized; the lower end of the threaded sleeve 503 is fixedly connected with a third belt wheel 507, the third belt wheel 507 is in transmission connection with a fourth belt wheel 508 through a belt, the fourth belt wheel 508 is fixed on a motor shaft of a second motor 509, the first motor 506 and the second motor 509 are both fixed on the first mounting plate 501, the threaded sleeve 503 is driven to rotate through the second motor 509, the third belt wheel 507 and the fourth belt wheel 508, and the threaded sleeve 503 and the screw 502 are installed through threads, so that the screw 502 can ascend or descend in the rotating process of the threaded sleeve 503.
The rotating mechanism 6 comprises a coating source disc 61, a rotating disc 62, a first synchronous pulley 63, a second synchronous pulley 64 and a third motor 65, wherein the rotating disc 62 is concentrically arranged in the coating source disc 61, a mounting shaft at the lower end of the rotating disc 62 is rotatably arranged in the coating source disc 61, the first synchronous pulley 63 is fixed on the mounting shaft of the coating source disc 61 and is in transmission connection with the second synchronous pulley 64 through a synchronous belt, and the second synchronous pulley 64 is fixed on a motor shaft of the third motor 65. The second conveying mechanism 9 conveys the wafer 13 without source coating from the conveying mechanism 3 to the turntable 62 of the rotating mechanism 6, the rotating and lifting mechanism rotates the writing brush 511 to the upper part of the solvent bottle 14, then drives the writing brush 511 to move downwards to dip the diffusion source, then the writing brush 511 rises and rotates to the upper part of the center of the wafer 13 without source coating, the third motor 65, the first synchronous pulley 63 and the second synchronous pulley 64 drive the turntable 62 and the wafer 13 without source coating above the turntable 62 to rotate, then the rotating and lifting mechanism drives the writing brush 511 to swing towards the outer side of the wafer 13 to realize source coating on the wafer 13, after the source coating is finished, the rotating and lifting mechanism drives the writing brush 511 to return to the upper part of the solvent bottle 14, and the source coating is uniform through the rotation of the turntable 62 and the swing of the writing brush 511.
The second conveying mechanism 9 includes a first linear module 91, a moving block 92, a fourth cylinder 93, and a second mounting plate 94, and two sets of the second conveying mechanism 9 are symmetrically provided in front and rear in this embodiment. A moving block 92 is fixedly mounted on the output end of the first linear module 91, a fourth cylinder 93 is fixed on the outer side of the moving block 92, the output end of the fourth cylinder is fixedly connected with a second mounting plate 94, and a wafer clamping mechanism 15 is mounted at each of the left and right ends of the lower end of the second mounting plate 94. By mounting the two wafer chucking mechanisms 15 on the lower end of the second mounting plate 94, the wafer 13 can be transferred from the transport mechanism 3 to the rotation mechanism 6 and the wafer 13 can be transferred from the rotation mechanism 6 to the heating mechanism 8 at the same time, so that the transfer time can be saved and the interference of the wafer 12 on the transport mechanism 3, the rotation mechanism 6 and the heating mechanism 8 can be prevented.
The heating mechanism 8 comprises an installation section 801, a heating table 802, a cooling table 803, a material receiving rod 804, a groove 805, a second air cylinder 806, a connecting pin 807, a sliding rail 808, a guide block 809, a connecting block 810 and a third air cylinder 811, wherein the plurality of heating tables 802 are equidistantly arranged at the upper end of the installation section 801, the plurality of cooling tables 803 are equidistantly arranged at the upper end of the installation section 801, and the cooling tables 803 are arranged at the right end of the heating tables 802. In this embodiment, 14 heating stages 802 are provided, 4 cooling stages 803 are provided, and the cooling stage is provided above the third support stage 103. The heating table 802 and the cooling table 803 have the same structure, grooves 805 are formed in the heating table 802 and the cooling table 803, the grooves 805 are used for placing wafers 13 and receiving rods 804, the receiving rods 804 are arranged in parallel, the left end and the right end of each receiving rod 804 are fixed to a connecting block 810, the two connecting blocks 810 are fixed to the upper end of the output end of a third air cylinder 811, a sliding rail 808 is fixedly installed at the lower end of the installation section 801, the sliding rail 808 is installed in a guide block 809 in a sliding mode from left to right, the guide block 809 and a second air cylinder 806 are fixed to a second supporting table 102, and a piston rod of the second air cylinder 806 is fixedly connected with the installation section 801 through a connecting pin 807.
The second conveying mechanism 9 conveys the wafer 13 after coating from the rotating mechanism 6 to the position above the heating table 81 at the leftmost end of the heating mechanism 8, the third air cylinder 811 is started, the piston rod of the third air cylinder 811 extends upwards, the material receiving rod 804 is driven by the connecting block 810 to ascend until the material receiving rod 804 reaches the position below the wafer 13 after coating, the second conveying mechanism 9 releases the wafer 13 after coating, and the piston rod of the third air cylinder 85 contracts downwards, so that the wafer 13 after coating reaches the heating table 81 to be dried. Before the wafer 13 after the next coating reaches the upper part of the heating table 81 at the leftmost end, the second air cylinder 806 is started, under the action of the slide rail 808 and the guide block 809, the mounting profile 801 is pushed to move rightwards by the distance of one heating table 81, when the wafer 13 after the next coating reaches the upper part of the heating table 81 at the leftmost end, the third air cylinder 811 is started, the piston rod of the third air cylinder 811 extends upwards, the second air cylinder 806 contracts to drive the mounting profile 801 to reset, the material receiving rod 804 and the wafer 13 after the first coating ascend, the third air cylinder 811 resets after the wafer 13 after the second coating is received, the wafer 13 after the first coating reaches the heating table 81 at the leftmost end to be dried on the heating table 81 at the second left side, and so on, the wafers 13 after the coating sequentially reach 14 heating tables 81 from left to be dried, and then sequentially reach 4 cooling tables 803, in the process of transferring the wafer 13 from the coating source to the receiving material, the wafer 13 is dried on the heating table 81 for a longer time, so that the complete drying of the wafer 13 is realized, and meanwhile, the cooling table 804 is arranged to realize the cooling of the dried wafer 13, so that the receiving material storage is facilitated.
The third conveying mechanism 11 is used for conveying the wafer 13 from the cooling table 803 at the rightmost end of the heating mechanism 8 to the receiving mechanism 10, the third conveying mechanism 11 comprises a second linear module 111, a fifth air cylinder 112 and a third mounting plate 113, the fifth air cylinder 112 is fixedly mounted on the moving end of the second linear module 111, the third mounting plate 113 is fixedly mounted on the output end of the fifth air cylinder, and the lower end of the third mounting plate 113 is provided with a wafer clamping mechanism 15.
The turnover mechanism 12 comprises a third linear module 121, a rotary cylinder 122 and a fourth mounting plate 123, the rotary cylinder 122 is fixedly mounted on the moving end of the third linear module 121, the fourth mounting plate 123 is fixedly mounted on the output end of the rotary cylinder 122, and a wafer clamping mechanism 15 is mounted on the fourth mounting plate 123.
The working principle of the invention is as follows:
the wafer 13 without coating source is conveyed to the conveying mechanism 3 from the material placing mechanism 2 through the first conveying mechanism 4, the conveying mechanism 3 conveys the wafer 13 without coating source from the left end to the right end, and the wafer 13 without coating source stuck together is separated through the material blocking rod 34 and the material blocking cylinder 35 in the conveying process, so that only one wafer 13 without coating source is ensured to be conveyed to the right end of the conveyor 31 at each time; then, the wafer 13 without source is conveyed to the rotating mechanism 6 from the conveying mechanism 3 through the second conveying mechanism 9, the solvent coating mechanism 5 drives the writing brush 511 to dip the diffusion source into the solvent bottle 14, then drives the writing brush 511 to move to the upper part of the rotating mechanism 6 to coat the wafer 13 without source, after coating is completed, the second conveying mechanism 9 conveys the wafer 13 with source coated to the heating mechanism 8 from the rotating mechanism 6, and simultaneously conveys a new wafer 13 without source coated into the rotating mechanism 6; the heating mechanism 8 realizes complete drying and cooling of the wafer 13 after source coating; after the drying and cooling are completed, the third carrying mechanism 11 carries the wafer 13 from the heating mechanism 8 to the material receiving mechanism 10 for storage, and in addition, the invention is also provided with the turnover mechanism 12 which can take out the dried wafer 13 and turn over the wafer 13, and the third carrying mechanism 11 is matched to carry the wafer 13 into the material receiving mechanism 10, so that the arrangement of the wafer 13 can be conveniently set according to the requirements of customers.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a source machine is scribbled in wafer heating, its includes frame (1), and the top of frame (1) is provided with protection casing (16), frame (1) comprises first brace table (101), second brace table (102) and third brace table (103) that from left to right connect gradually, its characterized in that:
a discharging mechanism (2), a conveying mechanism (3), a solvent coating mechanism (5), a rotating mechanism (6), a magnetic stirrer (7), a heating mechanism (8) and a material receiving mechanism (10) are sequentially arranged above the rack (1) from left to right, a solvent bottle (14) for containing a diffusion source is placed on the magnetic stirrer (7), a first carrying mechanism (4) is arranged on one side of the discharging mechanism (2) and one side of the conveying mechanism (3), one side of the solvent coating mechanism (5), one side of the rotating mechanism (6), one side of the magnetic stirrer (7) and one side of the heating mechanism (8) are provided with a second carrying mechanism (9), a third carrying mechanism (11) is arranged on the right end of the heating mechanism (8) and one side of the material receiving mechanism (10), and a turn-over mechanism (12) is arranged on the other side of the heating mechanism;
the feeding mechanism (2), the conveying mechanism (3), the first conveying mechanism (4), the solvent coating mechanism (5), the rotating mechanism (6), the magnetic stirrer (7) and the second conveying mechanism (9) are arranged on a first supporting platform (101), the heating mechanism (8) is arranged on a second supporting platform (102), and the receiving mechanism (10), the third conveying mechanism (11) and the turn-over mechanism (12) are arranged on a third supporting platform (103);
the feeding mechanism (2) and the receiving mechanism (10) are used for storing wafers (13), the conveying mechanism (3) comprises a conveyor (31), supporting legs (32), a receiving box (33), a material blocking rod (34) and a material blocking cylinder (35), the conveyor (31) is fixed on the supporting legs (32), the material receiving box (33) is obliquely arranged on the outer side of the middle section of the conveyor (31), the material blocking rod (34) is connected with the material blocking cylinder (35), and the material blocking cylinder (35) is fixed on the conveyor (31) and is opposite to the material receiving box (33);
the first conveying mechanism (4) is used for conveying the wafer (13) from the material discharging mechanism (2) to the conveying mechanism (3), the second conveying mechanism (9) is used for conveying the wafer (13) from the conveying mechanism (3) to the rotating mechanism (6) and then conveying the wafer (13) from the rotating mechanism (6) to the heating mechanism (8), and the third conveying mechanism (11) is used for conveying the wafer (13) from the heating mechanism (8) to the material receiving mechanism (10);
the solvent coating mechanism (5) comprises a writing brush clamping head (510) used for fixing a writing brush (511), the writing brush clamping head (510) is fixed on a rotary lifting mechanism, and the rotary lifting mechanism is used for driving the writing brush (511) to dip a diffusion source in a solvent bottle (14) and then driving the writing brush (511) to move to the upper part of the rotating mechanism (6);
the rotating mechanism (6) comprises a coating source disc (61), a rotating disc (62), a first synchronous pulley (63), a second synchronous pulley (64) and a third motor (65), the rotating disc (62) is concentrically arranged in the coating source disc (61), a mounting shaft at the lower end of the rotating disc (62) is rotatably mounted in the coating source disc (61), the first synchronous pulley (63) is fixed on the mounting shaft of the coating source disc (61) and is in transmission connection with the second synchronous pulley (64) through a synchronous belt, and the second synchronous pulley (64) is fixed on a motor shaft of the third motor (65);
the heating mechanism (8) comprises an installation section bar (801), a heating table (802), cooling tables (803), material receiving rods (804), grooves (805), a second air cylinder (806), connecting pins (807), a sliding rail (808), a guide block (809), a connecting block (810) and a third air cylinder (811), wherein the heating tables (802) are equidistantly arranged at the upper end of the installation section bar (801), the cooling tables (803) are equidistantly arranged at the right end of the heating table (802), the heating table (802) and the cooling table (803) are identical in structure and are respectively provided with the grooves (805), the grooves (805) are used for placing wafers (13) and the material receiving rods (804), the material receiving rods (804) are parallelly arranged in two numbers, the left ends and the right ends of the two material receiving rods (804) are respectively fixed on the connecting block (810), the connecting block (810) is fixed at the upper end of the output end of the third air cylinder (811), a sliding rail (808) is fixedly installed at the lower end of the installation section bar (801), the sliding rail (808) is installed in a guide block (809) in a left-right sliding mode, the guide block (809) and the second air cylinder (806) are fixed on the second supporting table (102), and a piston rod of the second air cylinder (806) is fixedly connected with the installation section bar (801) through a connecting pin (807).
2. The wafer coating machine according to claim 1, wherein: the automatic feeding device is characterized in that the first carrying mechanism (4), the second carrying mechanism (9) and the third carrying mechanism (11) are arranged at the center of the rack (1), the discharging mechanism (2), the conveying mechanism (3), the solvent coating mechanism (5), the rotating mechanism (6), the magnetic stirrer (7), the heating mechanism (8) and the receiving mechanism (10) are arranged in two groups, and the two groups are symmetrically arranged on the front side and the rear side of the first carrying mechanism (4), the second carrying mechanism (9) and the third carrying mechanism (11).
3. The wafer coating machine according to claim 2, wherein: the discharging mechanism (2) comprises a fourth motor (21), a placing plate (22), a fixing plate (23), an installing rod (24), an air faucet (25), a positioning rod (26), a top disc (27), a screw rod (28) and top columns (29), wherein the fixing plate (23) is fixed on a first supporting platform (101), the placing plate (22) is arranged above the fixing plate (23) in parallel, the lower end of the fixing plate (23) is fixedly provided with the fourth motor (21), a motor shaft of the fourth motor (21) is connected with the screw rod (28), the two top columns (29) are respectively arranged on two sides of the screw rod (28) in parallel, the lower ends of the two top columns are fixedly arranged on an adjusting plate, the center of the adjusting plate is provided with screw holes matched with the screw rod (28), the two top columns (29) are vertically slidably arranged on the fixing plate (23), and the upper ends of the two top columns are fixed at the lower end of the top disc (27), the top plate (27) is arranged at the center of the placing plate (22), the upper end of the top plate (27) is used for stacking wafers (13), a plurality of positioning rods (26) distributed in a circular array are fixedly arranged at the upper end of the placing plate (22), two installing rods (24) are symmetrically fixed at the upper end of the placing plate, and air nozzles (25) are fixed above the installing rods (24).
4. The wafer coating machine according to claim 3, wherein: the receiving mechanism (10) and the discharging mechanism (2) are identical in structure.
5. The wafer coating machine according to claim 3, wherein: first transport mechanism (4) include mounting box (41), guide rail (42), first cylinder (43), sucking disc mount pad (44) and sucking disc (45), guide rail (42) set up in mounting box (41), first cylinder (43) are fixed in the outside of mounting box (41), and its piston rod stretches into in mounting box (41) and links to each other with the slider is fixed, slider horizontal sliding mounting is in on guide rail (42), the outside of slider is fixed with sucking disc mount pad (44), and the lower extreme fixed mounting of sucking disc mount pad (44) has sucking disc (45) that are used for adsorbing wafer (13).
6. The wafer coating machine according to claim 3, wherein: rotatory elevating system is including fixing first mounting panel (501) in frame (1), rotate on first mounting panel (501) and install screw sleeve (503), install screw rod (502) through the screw thread in screw sleeve (503), install first band pulley (504) on screw rod (502), first band pulley (504) are connected with second band pulley (505) transmission through the belt, second band pulley (505) are fixed on the motor shaft of first motor (506), the lower extreme and third band pulley (507) fixed connection of screw sleeve (503), third band pulley (507) are connected with fourth band pulley (508) transmission through the belt, fourth band pulley (508) are fixed on the motor shaft of second motor (509), first motor (506) and second motor (509) are all fixed on first mounting panel (501).
7. The wafer coating machine according to claim 3, wherein: turn-over mechanism (12) include third straight line module (121), revolving cylinder (122) and fourth mounting panel (123), fixed mounting has revolving cylinder (122) on the removal end of third straight line module (121), fixed mounting has fourth mounting panel (123) on the output of revolving cylinder (122), install a wafer fixture (15) on fourth mounting panel (123).
8. The wafer coating machine according to claim 3, wherein: the second carrying mechanism (9) comprises a first linear module (91), a moving block (92), a fourth cylinder (93) and a second mounting plate (94), the moving block (92) is fixedly mounted at the output end of the first linear module (91), the fourth cylinder (93) is fixed on the outer side of the moving block (92), the output end of the fourth cylinder is fixedly connected with the second mounting plate (94), and a wafer clamping mechanism (15) is mounted at each of the left end and the right end of the lower end of the second mounting plate (94).
9. The wafer coating machine according to claim 3, wherein: third transport mechanism (11) are including second straight line module (111), fifth cylinder (112) and third mounting panel (113), fifth cylinder (112) fixed mounting is served at the removal of second straight line module (111), and fixed mounting has third mounting panel (113) on its output, a wafer fixture (15) is installed to the lower extreme of third mounting panel (113).
10. The wafer coating source machine according to any one of claims 7-9, wherein: wafer fixture (15) include double-end cylinder (151), fifth mounting panel (152) and clamping bar (153), install a fifth mounting panel (152) on two output of double-end cylinder (151) respectively, two clamping bar (153) are installed to the lower extreme symmetry of fifth mounting panel (152).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111352459.4A CN114005772A (en) | 2021-11-16 | 2021-11-16 | Wafer heating source coating machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111352459.4A CN114005772A (en) | 2021-11-16 | 2021-11-16 | Wafer heating source coating machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114005772A true CN114005772A (en) | 2022-02-01 |
Family
ID=79929161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111352459.4A Pending CN114005772A (en) | 2021-11-16 | 2021-11-16 | Wafer heating source coating machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114005772A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115999853A (en) * | 2022-12-28 | 2023-04-25 | 跃科智能制造(无锡)有限公司 | Hairpin motor stator copper line coating equipment |
| CN116469808A (en) * | 2023-05-06 | 2023-07-21 | 深圳市利和兴股份有限公司 | Wafer film laminating machine assembly with high-precision detection and positioning function and control method |
-
2021
- 2021-11-16 CN CN202111352459.4A patent/CN114005772A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115999853A (en) * | 2022-12-28 | 2023-04-25 | 跃科智能制造(无锡)有限公司 | Hairpin motor stator copper line coating equipment |
| CN115999853B (en) * | 2022-12-28 | 2023-09-08 | 跃科智能制造(无锡)有限公司 | Hairpin motor stator copper line coating equipment |
| CN116469808A (en) * | 2023-05-06 | 2023-07-21 | 深圳市利和兴股份有限公司 | Wafer film laminating machine assembly with high-precision detection and positioning function and control method |
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