CN116469808A - Wafer film laminating machine assembly with high-precision detection and positioning function and control method - Google Patents
Wafer film laminating machine assembly with high-precision detection and positioning function and control method Download PDFInfo
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- CN116469808A CN116469808A CN202310502824.8A CN202310502824A CN116469808A CN 116469808 A CN116469808 A CN 116469808A CN 202310502824 A CN202310502824 A CN 202310502824A CN 116469808 A CN116469808 A CN 116469808A
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- discharging
- positioning
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- 238000001514 detection method Methods 0.000 title claims abstract description 29
- 238000010030 laminating Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims abstract description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 72
- 238000007599 discharging Methods 0.000 claims abstract description 37
- 238000010408 sweeping Methods 0.000 claims abstract description 4
- 238000003756 stirring Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 230000007306 turnover Effects 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 5
- 238000000429 assembly Methods 0.000 claims description 5
- 239000007888 film coating Substances 0.000 claims description 4
- 238000009501 film coating Methods 0.000 claims description 4
- 230000009467 reduction Effects 0.000 claims description 4
- 239000003638 chemical reducing agent Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the field of film laminating facilities, in particular to a wafer film laminating machine assembly with high-precision detection and positioning, which comprises a frame, wherein a GST feeding and discharging assembly and an iron ring feeding assembly are sequentially arranged at the front part of the upper end of the frame, a discharging shifting module is arranged at the rear part of the GST feeding and discharging assembly at the upper end of the frame, a discharging manipulator is arranged at the rear part of the discharging shifting module, the discharging manipulator is fixed on the frame, an iron ring discharging overturning assembly is arranged at the rear part of the discharging manipulator at the upper end of the frame, a film pasting unreeling module, a product precise positioning code sweeping assembly, a product positioning assembly and a Tray feeding and discharging bin are sequentially arranged at the side of the iron ring discharging overturning assembly at the upper end of the frame, and the control method of the wafer film laminating machine assembly with high-precision detection and positioning is convenient to operate.
Description
Technical Field
The invention relates to the field of film laminating facilities, in particular to a wafer film laminating machine component with high-precision detection and positioning and a control method.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because of its round shape, and various circuit element structures can be manufactured on the silicon wafer to form an IC product with specific electrical functions, wherein the wafer laminator is mostly semi-automatic during film lamination, and the full-automatic wafer laminator with the conventional bulletin number of CN218660452U comprises: the multifunctional robot system comprises a six-axis mechanical arm and a multifunctional mechanical arm fixed on the six-axis mechanical arm, and the multifunctional mechanical arm conveys a wafer from the feeding system to the wafer film pasting system and cuts the wafer pasted with the PE film by turning to the six-axis mechanical arm; the wafer laminating machine adopts a multi-axis mechanical arm mode to realize high-degree automatic production, but has fewer functions, and the whole mechanism is not convenient to operate.
Disclosure of Invention
The invention aims to solve the defects in the background technology and provides a wafer film covering machine component with high-precision detection and positioning and a control method.
In order to achieve the above purpose, the invention adopts the following technical scheme: the wafer laminating machine assembly with the high-precision detection and positioning function comprises a frame, the upper end front portion of frame has set gradually unloading assembly, hoop material loading assembly on GST, the rear of unloading assembly is provided with the unloading and dials the material module on the upper end GST of frame, the rear of unloading is dialled the material module and is provided with unloading manipulator, unloading manipulator is fixed in the frame, the rear of the upper end unloading manipulator of frame is provided with hoop unloading upset subassembly, the side of the upper end hoop unloading upset subassembly of frame has set gradually pad pasting unreels module, product fine positioning and sweeps yard subassembly, product positioning assembly, tray and goes up unloading feed bin.
Preferably, the hoop blanking overturning assembly comprises a third linear module, a carrier is fixedly arranged on the third linear module, a first side plate is fixedly arranged at one end of the carrier, a second side plate is fixedly arranged at the other end of the carrier, the first side plate and the second side plate are symmetrically arranged, and a turning plate is rotationally connected between the first side plate and the second side plate.
Preferably, one end of the turning plate is fixedly provided with a first connecting shaft, the end part of the first connecting shaft is rotationally connected with a first side plate, the other end of the turning plate is fixedly provided with a second connecting shaft, the side surface of the second side plate is fixedly provided with a speed reducer, one end of the speed reducer is fixedly connected with the second connecting shaft, the other end of the speed reducer is fixedly provided with a servo motor, and the servo motor is fixed on the second side plate.
Preferably, the connecting corner of the second side plate and the carrier and the connecting corner of the first side plate and the carrier are embedded with reinforcing plates, four supporting frames are fixedly arranged in an annular array at the middle part of the lower end of the turning plate, and suction assemblies are fixedly arranged on the supporting frames.
Preferably, the blanking material shifting module comprises two upright posts which are oppositely arranged, wherein a first linear module and a second linear module are fixedly arranged on opposite surfaces of the upright posts respectively, a connecting plate is fixedly arranged between the first linear module and the second linear module, and the connecting plate is horizontally arranged.
Preferably, the upper end face of the connecting plate is provided with a small iron ring guide plate close to one side edge, the upper end face of the connecting plate is provided with a small iron ring guide plate No. two close to the other side edge, the small iron ring guide plate No. one and the small iron ring guide plate No. two are symmetrically arranged, the upper end face of the connecting plate is provided with a large iron ring guide plate No. one, the upper end face of the connecting plate is provided with a large iron ring guide plate No. two at one side edge, and the large iron ring guide plate No. one and the large iron ring guide plate No. two are symmetrically arranged.
Preferably, the lower end of the first small iron ring guide plate, the lower end of the first large iron ring guide plate, the lower end face of the second small iron ring guide plate and the lower end face of the second large iron ring guide plate are fixedly provided with support plates, the lower end faces of the support plates are fixed on the connecting plates, and a plurality of universal balls are arranged on the upper end faces of the first large iron ring guide plate, the upper end faces of the first small iron ring guide plate, the upper end faces of the second small iron ring guide plate and the upper end faces of the second large iron ring guide plate in a linear array.
Preferably, the middle part of the upper end of the connecting plate is fixedly provided with a linear motor, the upper end of the linear motor is fixedly provided with a mounting plate, the end part of the mounting plate is fixedly provided with a push plate, and the mounting plate and the push plate are integrally formed.
The control method of the wafer film laminating machine component with high-precision detection and positioning is also provided, and comprises the following steps:
s1: feeding is carried out through the iron ring feeding assembly, and positioning is carried out through the product fine positioning code sweeping assembly and the product positioning assembly;
s2: performing iron ring film coating through a film sticking and unreeling module;
s3: and finally, conveying the coated iron ring into a GST feeding and discharging assembly through an iron ring discharging overturning assembly and a discharging stirring module.
Compared with the prior art, the invention has the following beneficial effects:
1. the wafer laminating machine assembly has the functions of automatic feeding and discharging, automatic film pasting, automatic cutting into a whole and the like, and is convenient to operate.
2. Through the unloading of setting up group material module, can utilize linear electric motor to drive the mounting panel and remove, and then drive the push pedal of connecting on the mounting panel and remove, with the big hoop of carrying on a big hoop deflector and No. two big hoop deflector or the little hoop of carrying on a little hoop deflector and No. two little hoop deflector promotes, universal ball rolls this moment, with supplementary hoop motion, with the hoop dial into GST go up the unloading in the unloading assembly, with this purpose that has reached automatic unloading has improved convenient operation degree.
3. Through the hoop unloading upset subassembly that sets up, can utilize to absorb the subassembly to hoop, no. three straight line modules rise to suitable height afterwards, and servo motor work is through the slow rotation of reduction gear drive No. two connecting axles afterwards, and then drives and turn over the board and slowly rotate to with the hoop upset 180 degrees that will adsorb on turning over the board, with this purpose that reaches the automatic stirring, improved convenient operation degree.
Drawings
FIG. 1 is a schematic view of a wafer laminator assembly with high precision detection and positioning according to the present invention;
FIG. 2 is a schematic diagram of a GST loading and unloading assembly of a wafer laminator assembly with high precision detection and positioning according to the invention;
FIG. 3 is a schematic diagram of a product positioning assembly of the wafer laminator assembly of the invention with high precision detection and positioning;
FIG. 4 is an exploded view of a product precision positioning code scanning assembly of the wafer laminator assembly of the invention with high precision detection and positioning;
FIG. 5 is a schematic diagram of a film-sticking and unreeling module of the wafer film-coating machine assembly with high-precision detection and positioning;
FIG. 6 is a schematic diagram of a blanking and kick-out module of a wafer laminator assembly with high precision detection and positioning in accordance with the present invention;
FIG. 7 is a schematic diagram of a blanking manipulator of a wafer laminator assembly with high precision detection and positioning in accordance with the present invention;
FIG. 8 is a schematic diagram of a Tray loading and unloading bin of a wafer laminator assembly of the invention with high accuracy detection and positioning;
FIG. 9 is a schematic diagram of an iron ring blanking turnover assembly of a wafer laminator assembly of the invention with high precision detection and positioning;
FIG. 10 is a schematic diagram of an iron ring loading assembly of a wafer laminator assembly of the invention with high precision detection and positioning.
In the figure: 1. GST loading and unloading assembly; 2. an iron ring feeding assembly; 3. a blanking manipulator; 4. a blanking and stirring module; 41. a column; 42. a connecting plate; 43. a first small iron ring guide plate; 44. a first large iron ring guide plate; 45. a second small iron ring guide plate; 46. a second large iron ring guide plate; 47. a support plate; 48. a universal ball; 49. a first straight line module; 410. a second straight line module; 411. a mounting plate; 412. a linear motor; 413. a push plate; 5. a film pasting and unreeling module; 6. an iron ring blanking overturning assembly; 61. a third straight line module; 62. a carrier; 63. a first side plate; 64. a second side plate; 65. a reinforcing plate; 66. a first connecting shaft; 67. a second connecting shaft; 68. a speed reducer; 69. turning plate; 610. a support frame; 611. a servo motor; 612. a suction assembly; 7. product fine positioning code scanning assembly; 8. a product positioning assembly; 9. feeding and discharging bins on a Tray; 10. a frame.
Detailed Description
The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art.
The wafer laminating machine assembly with high-precision detection and positioning as shown in fig. 1-10 comprises a frame 10, wherein a GST feeding and discharging assembly 1 and an iron ring feeding assembly 2 are sequentially arranged at the front part of the upper end of the frame 10, a blanking stirring module 4 is arranged at the rear of the GST feeding and discharging assembly 1 at the upper end of the frame 10, a blanking manipulator 3 is arranged at the rear of the blanking stirring module 4, the blanking manipulator 3 is fixed on the frame 10, and the blanking consists of the blanking manipulator 3, an iron ring blanking turnover assembly 6, the GST feeding and discharging assembly 1, the blanking stirring module 4 and the like, and is mainly used for turning an iron ring 180 degrees and then taking the iron ring into the GST, and an iron ring blanking turnover assembly 6 is arranged at the rear of the blanking manipulator 3 at the upper end of the frame 10.
The upper end hoop blanking upset subassembly 6 of frame 10's side has set gradually pad pasting unreeling module 5, the product is accurately positioned sweeps code component 7, product locating component 8, the unloading feed bin 9 on the Tray, product is accurately positioned sweeps code component 7, product locating component 8 when the location, when product material loading manipulator or tilting mechanism cross the piece on the pad pasting tool, the tool platform heats, soften the product, when the carrier plate thickness is pressed close to completely to the product, the counterpoint camera is shot the product position, through calculating the product position, and carry out the position correction through the UVW platform to the product. If the product size deviation is too large, the UVW platform can not be corrected, the feeding manipulator re-picks up and re-discharges the product, the film pasting unit in the film pasting and unreeling module 5 consists of a material collecting and unreeling roll, an iron ring roll paste, a cutting, a product roll paste, a film supporting mechanism and the like, and the cutting mechanism consists of a lifting Z-axis, a cutting rotating motor, a cutting radius adjusting motor and other parts, and the GST feeding and discharging assembly 1, the iron ring feeding assembly 2, the discharging manipulator 3, the film pasting and unreeling module 5, the product precise positioning and sweeping module 7, the product positioning assembly 8 and the Tray feeding and discharging bin 9 are all of the prior art, so the film pasting and unreeling module is not elaborated herein.
The hoop blanking turnover assembly 6 comprises a third linear module 61, a carrier 62 is fixedly arranged on the third linear module 61, the third linear module 61 plays a role of driving the carrier 62 to move up and down, a first side plate 63 is fixedly arranged at one end of the carrier 62, a second side plate 64 is fixedly arranged at the other end of the carrier 62, the first side plate 63 and the second side plate 64 are symmetrically arranged, a turning plate 69 is rotationally connected between the first side plate 63 and the second side plate 64, and the carrier 62 plays a role of bearing the first side plate 63 and the second side plate 64.
One end of the turning plate 69 is fixedly provided with a first connecting shaft 66, the end part of the first connecting shaft 66 is rotationally connected with a first side plate 63, the first connecting shaft 66 plays a role in connecting the turning plate 69 with the first side plate 63, the other end of the turning plate 69 is fixedly provided with a second connecting shaft 67, the side surface of the second side plate 64 is fixedly provided with a speed reducer 68, one end of the speed reducer 68 is fixedly connected with the second connecting shaft 67, the second connecting shaft 67 plays a role in connecting the turning plate 69 with the speed reducer 68, the other end of the speed reducer 68 is fixedly provided with a servo motor 611, the servo motor 611 is fixed on the second side plate 64, and the servo motor 611 plays a role in driving the turning plate 69 to turn 180 degrees.
The connecting corners of the second side plate 64 and the carrier 62 and the connecting corners of the first side plate 63 and the carrier 62 are respectively inlaid with a reinforcing plate 65, the reinforcing plates 65 play a role in reinforcing connection, four supporting frames 610 are fixedly arranged in an annular array at the middle part of the lower end of the turning plate 69, suction assemblies 612 are fixedly arranged on the supporting frames 610, the supporting frames 610 play a role in bearing the suction assemblies 612, and the suction assemblies 612 play a role in sucking workpieces by utilizing suction.
The blanking material shifting module 4 comprises two upright posts 41 which are oppositely arranged, a first linear module 49 and a second linear module 410 are fixedly arranged on opposite surfaces of the two upright posts 41 respectively, the upright posts 41 play a role of bearing the first linear module 49 and the second linear module 410, a connecting plate 42 is fixedly arranged between the first linear module 49 and the second linear module 410, the connecting plate 42 is horizontally arranged, the connecting plate 42 plays a role of supporting, and the first linear module 49 and the second linear module 410 play a role of driving the connecting plate 42 to move up and down.
The upper end face of connecting plate 42 is close to one side edge department and is provided with No. one little iron ring deflector 43, the upper end face of connecting plate 42 is close to opposite side edge department and is provided with No. two little iron ring deflector 45, no. one little iron ring deflector 43 is the symmetry setting with No. two little iron ring deflector 45, no. one little iron ring deflector 43 plays the effect of carrying on little iron ring with No. two little iron ring deflector 45, an upper end face side edge department of connecting plate 42 is provided with No. one big iron ring deflector 44, an upper end face side edge department of connecting plate 42 is provided with No. two big iron ring deflector 46, no. one big iron ring deflector 44 is the symmetry setting with No. two big iron ring deflector 46, no. one big iron ring deflector 44 plays the effect of carrying on big iron ring with No. two big iron ring deflector 46.
The lower extreme of No. one little hoop deflector 43 and the lower extreme of No. one big hoop deflector 44, the lower terminal surface of No. two little hoop deflector 45 and the lower terminal surface of No. two big hoop deflector 46 are all fixed mounting have backup pad 47, the lower terminal surface of backup pad 47 is fixed in on the connecting plate 42, backup pad 47 plays the effect of overhead support, the up end of No. one big hoop deflector 44, the up end of No. one little hoop deflector 43, the up end of No. two little hoop deflector 45, a plurality of universal balls 48 are installed to the up end average linear array of No. two big hoop deflector 46, universal ball 48 plays the effect of reducing wearing and tearing.
The middle part of the upper end of the connecting plate 42 is fixedly provided with a linear motor 412, the upper end of the linear motor 412 is fixedly provided with a mounting plate 411, the end part of the mounting plate 411 is fixedly provided with a push plate 413, the mounting plate 411 plays a role in mounting the push plate 413 on the linear motor 412, the linear motor 412 plays a role in driving the push plate 413 to horizontally and linearly move, and the mounting plate 411 and the push plate 413 are integrally formed.
The control method of the wafer film laminating machine component with high-precision detection and positioning is also provided, and comprises the following steps:
s1: feeding is carried out through the iron ring feeding assembly 2, and positioning is carried out through the product fine positioning code scanning assembly 7 and the product positioning assembly 8;
s2: performing iron ring film coating through a film sticking and unreeling module 5;
s3: finally, the iron ring after being coated is sent into the GST feeding and discharging assembly 1 through the iron ring discharging and overturning assembly 6 and the discharging and stirring module 4.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention, which is defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. Wafer laminating machine subassembly with high accuracy detects and location, including frame (10), its characterized in that: the feeding and discharging device is characterized in that a GST feeding and discharging assembly (1) and an iron ring feeding assembly (2) are sequentially arranged at the front part of the upper end of the frame (10), a discharging and stirring module (4) is arranged at the rear of the GST feeding and discharging assembly (1) at the upper end of the frame (10), a discharging manipulator (3) is arranged at the rear of the discharging and stirring module (4), the discharging manipulator (3) is fixed on the frame (10), an iron ring discharging and overturning assembly (6) is arranged at the rear of the feeding and discharging manipulator (3) at the upper end of the frame (10), and a film unreeling module (5), a product precise positioning and sweeping module (7), a product positioning assembly (8) and a Tray feeding and overturning bin (9) are sequentially arranged at the side of the iron ring discharging and overturning assembly (6) at the upper end of the frame (10).
2. The wafer laminator assembly with high precision detection and positioning of claim 1, wherein: the iron ring unloading upset subassembly (6) is including No. three straight line modules (61), fixed mounting has carrier (62) on No. three straight line modules (61), one end fixed mounting of carrier (62) has curb plate (63), the other end fixed mounting of carrier (62) has curb plate (64) No. two, curb plate (63) are the symmetry setting with curb plate (64) No. two, rotate between curb plate (63) and No. two curb plates (64) and be connected with and turn over board (69).
3. The wafer laminator assembly with high precision detection and positioning of claim 2, wherein: one end fixed mounting who turns over board (69) has connecting axle (66), the tip and the curb plate (63) rotation of connecting axle (66) are connected, the other end fixed mounting who turns over board (69) has No. two connecting axles (67), the side fixed mounting of curb plate (64) No. two has reduction gears (68), the one end and the connecting axle (67) fixed connection No. two of reduction gears (68), the other end fixed mounting of reduction gears (68) has servo motor (611), servo motor (611) are fixed in on curb plate (64) No. two.
4. A wafer laminator assembly with high precision detection and positioning according to claim 3, wherein: reinforcing plates (65) are embedded at the connection corners of the second side plate (64) and the carrier (62) and at the connection corners of the first side plate (63) and the carrier (62), four supporting frames (610) are fixedly arranged at the middle annular array of the lower end of the turning plate (69), and suction assemblies (612) are fixedly arranged on the supporting frames (610).
5. The wafer laminator assembly with high precision detection and positioning of claim 1, wherein: the blanking material shifting module (4) comprises two upright posts (41) which are oppositely arranged, a first linear module (49) and a second linear module (410) are fixedly arranged on opposite surfaces of the two upright posts (41) respectively, a connecting plate (42) is fixedly arranged between the first linear module (49) and the second linear module (410), and the connecting plate (42) is horizontally arranged.
6. The wafer laminator assembly with high precision detection and positioning of claim 5, wherein: the small iron ring guide plate (43) is arranged at the edge of one side, which is close to the upper end face of the connecting plate (42), the small iron ring guide plate (45) is arranged at the edge of the other side, which is close to the upper end face of the connecting plate (42), the small iron ring guide plate (43) and the small iron ring guide plate (45) are symmetrically arranged, the large iron ring guide plate (44) is arranged at the edge of one side of the upper end face of the connecting plate (42), the large iron ring guide plate (46) is arranged at the edge of one side of the upper end face of the connecting plate (42), and the large iron ring guide plate (44) and the large iron ring guide plate (46) are symmetrically arranged.
7. The wafer laminator assembly with high precision detection and positioning of claim 6, wherein: the lower extreme of a little hoop deflector (43) and the lower extreme of a big hoop deflector (44), the lower terminal surface of No. two little hoop deflector (45) and the lower terminal surface of No. two big hoop deflector (46) are all fixed mounting have backup pad (47), the lower terminal surface of backup pad (47) is fixed in on connecting plate (42), a plurality of universal balls (48) are installed to the even linear array of the up end of a big hoop deflector (44), the up end of a little hoop deflector (43), the up end of No. two little hoop deflector (45) and the up end of No. two big hoop deflector (46).
8. The wafer laminator assembly with high precision detection and positioning of claim 7, wherein: the linear motor (412) is fixedly arranged in the middle of the upper end of the connecting plate (42), the mounting plate (411) is fixedly arranged at the upper end of the linear motor (412), the push plate (413) is fixedly arranged at the end part of the mounting plate (411), and the mounting plate (411) and the push plate (413) are integrally formed.
9. A control method of a wafer film laminating machine assembly with high-precision detection and positioning, used in the wafer film laminating machine assembly with high-precision detection and positioning of claim 1, characterized by comprising the following steps: s1: feeding is carried out through an iron ring feeding assembly (2), and positioning is carried out through a product fine positioning scanning component (7) and a product positioning component (8);
s2: performing iron ring film coating through a film sticking and unreeling module (5);
s3: finally, the iron ring after being coated is sent into the GST feeding and discharging assembly (1) through the iron ring discharging and overturning assembly (6) and the discharging and stirring module (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310502824.8A CN116469808A (en) | 2023-05-06 | 2023-05-06 | Wafer film laminating machine assembly with high-precision detection and positioning function and control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310502824.8A CN116469808A (en) | 2023-05-06 | 2023-05-06 | Wafer film laminating machine assembly with high-precision detection and positioning function and control method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116469808A true CN116469808A (en) | 2023-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310502824.8A Pending CN116469808A (en) | 2023-05-06 | 2023-05-06 | Wafer film laminating machine assembly with high-precision detection and positioning function and control method |
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| Country | Link |
|---|---|
| CN (1) | CN116469808A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153771A (en) * | 1994-11-29 | 1996-06-11 | Fujikoshi Mach Corp | Device and method for supplying and discharging wafer |
| CN107910286A (en) * | 2017-12-29 | 2018-04-13 | 苏州吉才智能科技有限公司 | A kind of Full-automatic film chip mounter |
| CN111276427A (en) * | 2018-12-04 | 2020-06-12 | 株式会社迪思科 | Wafer dividing device |
| CN212665866U (en) * | 2020-06-18 | 2021-03-09 | 成都芯翼科技有限公司 | Clamp for chip processing |
| CN114005772A (en) * | 2021-11-16 | 2022-02-01 | 苏州康沃斯智能装备有限公司 | Wafer heating source coating machine |
| CN115384847A (en) * | 2022-08-27 | 2022-11-25 | 郑州轨道交通信息技术研究院 | Loading and unloading device and method of automatic wafer film sticking machine |
| CN219610372U (en) * | 2023-03-30 | 2023-08-29 | 深圳奥图美特技术有限公司 | Full-automatic blue film attaching machine |
-
2023
- 2023-05-06 CN CN202310502824.8A patent/CN116469808A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153771A (en) * | 1994-11-29 | 1996-06-11 | Fujikoshi Mach Corp | Device and method for supplying and discharging wafer |
| CN107910286A (en) * | 2017-12-29 | 2018-04-13 | 苏州吉才智能科技有限公司 | A kind of Full-automatic film chip mounter |
| CN111276427A (en) * | 2018-12-04 | 2020-06-12 | 株式会社迪思科 | Wafer dividing device |
| CN212665866U (en) * | 2020-06-18 | 2021-03-09 | 成都芯翼科技有限公司 | Clamp for chip processing |
| CN114005772A (en) * | 2021-11-16 | 2022-02-01 | 苏州康沃斯智能装备有限公司 | Wafer heating source coating machine |
| CN115384847A (en) * | 2022-08-27 | 2022-11-25 | 郑州轨道交通信息技术研究院 | Loading and unloading device and method of automatic wafer film sticking machine |
| CN219610372U (en) * | 2023-03-30 | 2023-08-29 | 深圳奥图美特技术有限公司 | Full-automatic blue film attaching machine |
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