CN110379756B - Full-automatic wafer lower wafer waxing return line and working method thereof - Google Patents
Full-automatic wafer lower wafer waxing return line and working method thereof Download PDFInfo
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- CN110379756B CN110379756B CN201910746897.5A CN201910746897A CN110379756B CN 110379756 B CN110379756 B CN 110379756B CN 201910746897 A CN201910746897 A CN 201910746897A CN 110379756 B CN110379756 B CN 110379756B
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- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000004018 waxing Methods 0.000 title claims abstract description 28
- 239000000919 ceramic Substances 0.000 claims abstract description 175
- 238000004140 cleaning Methods 0.000 claims abstract description 72
- 238000003860 storage Methods 0.000 claims abstract description 50
- 230000001680 brushing effect Effects 0.000 claims abstract description 31
- 238000012546 transfer Methods 0.000 claims abstract description 24
- 230000008569 process Effects 0.000 claims abstract description 23
- 235000012431 wafers Nutrition 0.000 claims description 180
- 230000007246 mechanism Effects 0.000 claims description 58
- 230000007306 turnover Effects 0.000 claims description 47
- 238000007493 shaping process Methods 0.000 claims description 29
- 238000003825 pressing Methods 0.000 claims description 19
- 230000001681 protective effect Effects 0.000 claims description 19
- 238000001035 drying Methods 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000002950 deficient Effects 0.000 abstract description 3
- 230000003749 cleanliness Effects 0.000 abstract description 2
- 238000012545 processing Methods 0.000 description 9
- 239000007921 spray Substances 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
Abstract
The invention relates to a full-automatic wafer lower wafer waxing return line and a working method thereof, wherein the full-automatic wafer lower wafer waxing return line comprises a main conveying line, the main conveying line is used for automatically conveying ceramic disks, and a shovel unit, a storage unit, a cleaning unit, a patch unit, a flat-piece unit and a transfer unit are arranged on the main conveying line, and the full-automatic wafer lower wafer waxing return line is processed through a shovel piece process, a ceramic disk storage process, a ceramic disk overturning process, a ceramic disk cleaning process, a wafer patch process, a wafer flat-piece process, a ceramic disk and a wafer transfer process. According to the full-automatic wafer lower-piece waxing return line and the working method thereof, all devices are fully and automatically matched without any manual operation, so that the labor force of workers is greatly reduced, the production efficiency is improved, meanwhile, the whole device is carried out in a dust-free environment, multiple brushing is adopted, the cleanliness of products is greatly improved, the obtained products are good in consistency, the defective rate is low, and the full-automatic wafer lower-piece waxing return line has a wide market prospect.
Description
Technical field:
the invention relates to the technical field of electronic product processing, in particular to a full-automatic wafer lower wafer waxing return line and a working method thereof.
The background technology is as follows:
the Chinese semiconductor market has the advantages that the demand of the packaging amount of the Chinese semiconductor market is rapidly increased, the labor force is short, the labor cost is continuously increased, the demand of manufacturers on automatic equipment is increased, and the Chinese semiconductor market has obvious effects of reducing the production cost and improving the product yield.
The existing wafers (sapphire sheets, silicon wafers and the like) need to be subjected to multiple procedures such as cleaning, gluing, pasting, shoveling, storage and the like when being processed. However, in the prior art, the wafer attaching, cleaning and shoveling, the cleaning and storage of the ceramic disc and the like are generally performed on different devices, and a large amount of labor force is required for transferring or carrying during processing, and the wafer surface is required to be higher, so that the transfer process cannot avoid collision or dust adhering to the wafer surface, thereby influencing the product quality.
For example, the device can realize full-automatic chip mounting by using a full-automatic chip mounter with the patent number of CN104759974A applied by the company, but the pretreatment, storage and post-chip mounting treatment of ceramic discs are all carried out on other equipment, so that workers are required to continuously transfer, the processing efficiency is affected, and the real full-automatic production cannot be realized.
The invention comprises the following steps:
how to integrate a full-automatic chip mounting return line of a wafer is changed from the original semi-automation into the real full-automation, and any manual operation is not needed in the processing process, so that the full-automatic chip mounting return line is a difficulty to be solved. Meanwhile, how to optimize the whole production line ensures that the wafer has better consistency of finished products, lower defective rate and dust-free performance, and is a problem to be solved. In addition, avoiding the use of a robot mechanism having a complicated structure is also a problem to be solved in order to reduce the use of the site. Among these problems, the problems of automatic positioning, automatic grabbing, automatic overturning, automatic transferring, automatic deviation correcting and the like of each station are more needed to be solved.
Therefore, according to the problems, the invention designs the full-automatic wafer lower wafer waxing return line and the working method thereof, wherein the full-automatic wafer lower wafer waxing return line has high automation degree, can reduce the labor force of workers, lower the production cost, has higher production efficiency and is safe and dust-free in the processing process.
The invention is realized by the following technical scheme: the full-automatic wafer lower wafer waxing return line comprises a main conveying line, wherein the main conveying line is used for automatically conveying ceramic discs, and a shovel unit, a storage unit, a cleaning unit, a patch flat-piece unit and a transfer unit are arranged on the main conveying line;
The slice shoveling unit is used for shoveling down the wafer on the ceramic disc;
the accommodating unit is correspondingly arranged at one side of the slice shoveling unit and is used for receiving the wafer shoveled by the slice shoveling unit;
the storage unit is correspondingly arranged at the output end of the shovel sheet unit and is used for storing ceramic discs of the shoveled wafers;
the cleaning unit is correspondingly arranged at the output end of the storage unit and is used for receiving the ceramic discs in the storage unit and vertically cleaning the ceramic discs;
the chip mounting flat-sheet unit is correspondingly arranged at the output end of the cleaning unit and is used for attaching the wafer to the cleaned ceramic disc and carrying out flat-sheet shaping on the wafer after chip mounting;
the transfer unit is correspondingly arranged at the output end of the flat sheet unit and is used for transferring and storing the ceramic disc and the wafer after the flat sheet is formed.
The first consideration is the problem of chipping (chipping) of the wafer after bonding. In the prior art, after a ceramic disc is attached to a chip mounter, the wafer is generally transferred to other equipment for manual chip detachment, so that the efficiency is poor, and the shovel chip is easy to damage.
Therefore, the invention designs a special shovel blade unit, which comprises a shovel blade support, a shovel blade power piece, a sliding block and a shovel plate, wherein the shovel blade power piece is fixed on the shovel blade support, the shovel blade power piece is connected with the shovel plate through the sliding block and can drive the shovel plate to move, the shovel plate is inclined to the horizontal plane, one end of the shovel plate is hinged with the bottom end of the sliding block, the middle part of the shovel plate is elastically connected with the sliding block through a spring, the shovel plate can rotate around the sliding block when being stressed, and the shovel plate can be reset through the spring when not being stressed.
After the shovel sheets, how to store the finished products is also a technical problem to be solved.
The invention designs a special storage unit, which comprises a slideway, a storage box and a lifting power piece, wherein the slideway is correspondingly arranged at one side of a shovel piece unit and is used for receiving a wafer shoveled by the shovel piece unit and sending the wafer into the storage box, the slideway is inclined with a horizontal plane, a water channel is arranged in the slideway, the storage box is correspondingly arranged at the outlet end of the slideway, the storage box is of a multi-layer structure, and the lifting power piece is connected with the storage box and can drive the storage box to lift.
In order to wash the ceramic disc surface after the shovel piece, still be provided with brush face unit between shovel piece unit and the receiving unit, brush face unit includes pivot, brush shower and nozzle, the pivot is a plurality of, corresponds the setting in main transfer chain through ceramic disc top and/or below, is provided with a plurality of brushes respectively in each pivot, the shower is a plurality of, corresponds the setting in main transfer chain through ceramic disc top and/or below, and the equipartition has a plurality of nozzles on each shower, and brush face unit can brush two faces of ceramic disc clean to guarantee the follow-up save.
In the prior art, the ceramic disc after the shovel slice is generally stored independently.
In order to solve the technical problem, the ceramic disc storage unit is added in the whole reflux line, the storage unit comprises a carrying manipulator, a track and a stereoscopic warehouse, the stereoscopic warehouse is correspondingly arranged at the output end of the shovel sheet unit and is used for storing ceramic discs after the shovel sheet, the stereoscopic warehouse is provided with a plurality of groups of plugboards, a plurality of plugboards used for placing the ceramic discs at intervals are respectively arranged on each group of plugboards, and the carrying manipulator is arranged on the track and can be lifted up and down or moved left and right along the track and is used for grabbing the ceramic discs after the shovel sheet and sending the ceramic discs into or taking the ceramic discs out of the stereoscopic warehouse.
In the prior art, the ceramic disc cleaning devices are various, but the cleaning mode in the ceramic disc conveying process of the return line is generally a horizontal cleaning mode, namely the ceramic disc is horizontally fed into the cleaning device for ultrasonic cleaning, the cleaning mode not only occupies large space and has poor cleaning efficiency, but also the upper surface of the ceramic disc is still easy to remain impurities.
Therefore, the invention designs a special vertical cleaning unit, which comprises a plurality of cleaning tanks, a cleaning track and a cleaning manipulator, wherein the cleaning manipulator is arranged on the track and can lift up and down or move left and right along the track and is used for feeding or taking out ceramic discs in the cleaning tanks, the cleaning manipulator comprises a movable bracket and a pair of support blocks, the two support blocks are fixed at the bottom end of the movable bracket, and a channel for vertically supporting the edges of the ceramic discs and preventing the ceramic discs from falling is formed between the two support blocks.
In order to realize vertical cleaning, the ceramic disc needs to be overturned before cleaning, and therefore a turnover unit is further arranged between the storage unit and the cleaning unit and comprises a support, a turnover power piece, a turnover frame and a bracket, wherein the turnover frame is arranged on the support and is connected with the turnover power piece, the bracket is fixed on the turnover frame, two supporting plates are fixed on the bracket, a channel for vertically supporting the edge of the ceramic disc and preventing the ceramic disc from falling is formed between the two supporting plates, and the turnover power piece can drive the turnover frame to drive the bracket to turn over, so that the ceramic disc is overturned.
Next, a relatively important flat patch unit is provided, and the related patch unit is also designed by the fully-automatic patch machine applied by the company in advance, but the function of the full-automatic patch machine is not perfect. Therefore, the invention designs a patch unit with more complete functions, and integrates a wafer brushing and spin-drying mechanism, a shaping and edge-searching mechanism and a patch flat-sheet mechanism.
In addition, since the wafer after the bonding cannot be guaranteed to be completely bonded with the ceramic disc, the wafer needs to be flattened after the bonding. The flat sheet of the full-automatic chip mounter of the prior application of the company adopts a pressing power piece, namely, the flat sheet (tabletting) is carried out under the action of common pressure, and the flat sheet effect of the flat sheet mode is not ideal.
The surface mount flat sheet unit comprises a bearing basket fixing mechanism, a brushing and spin-drying mechanism, a wax homogenizing mechanism, a baking mechanism, a shaping and edge-searching mechanism, a surface mount flat sheet mechanism and a transferring manipulator;
the bearing basket fixing mechanism is used for loading wafers and is provided with a plurality of bearing basket fixing stations used for positioning the bearing baskets;
the brushing and spin-drying mechanism is used for brushing and spin-drying a wafer and comprises a positioning platform assembly and a brushing assembly, the positioning platform assembly comprises a rotary power piece, a rotary platform, a sucker, a lifting power piece, a lifting seat and a protective cover, the sucker is fixed on the rotary platform, the rotary platform is connected with the rotary power piece, the rotary power piece can drive the rotary platform and the sucker to rotate, the protective cover is sleeved outside the rotary platform, the protective cover is fixed on the lifting seat, the lifting power piece is connected with the lifting seat, the lifting power piece can drive the lifting seat and the protective cover to lift up and down so as to enable the rotary platform to enter or leave the protective cover, the brushing assembly comprises a brush disc, a brush disc driving piece, a brush disc swinging power piece, a rocker arm and a rocker arm lifting driving piece, the brush disc is correspondingly arranged above the sucker and fixedly connected with a brush disc rocker arm, the brush disc is connected with the brush disc driving piece, the brush disc driving piece can drive the brush disc to rotate axially, the brush disc swinging power piece can drive the rocker arm and the brush disc, and the brush disc lifting driving piece can be lifted and lowered, and the brush disc driving piece is connected with the brush disc driving piece, and the brush disc rocking driving piece and the brush disc rocking seat;
The wax homogenizing mechanism is used for uniformly waxing the surface of a wafer and comprises a wax throwing component and a wax dripping component, the wax throwing component comprises a protective cover, a lifting power piece, a lifting seat, a rotary power piece and a rotating seat, the lifting power piece is connected with the lifting seat and can drive the lifting seat to lift so as to enter or fall out of the protective cover above, the rotating seat and the rotary power piece are arranged on the lifting seat, the rotary power piece is connected with the rotating seat and can drive the rotating seat to rotate, the wax dripping component is correspondingly arranged on one side of the protective cover, the wax dripping component comprises a wax dripping device and a driving power piece, and the driving power piece is connected with the wax dripping device and can drive the wax dripping device to horizontally move so as to be close to or far away from the center of the protective cover;
the baking mechanism is used for baking the uniformly-waxed wafer and is provided with a baking box;
the shaping edge searching mechanism is used for shaping edges of baked wafers and comprises a supporting table assembly and a shaping edge searching assembly, the supporting table assembly is used for placing the wafers, the shaping edge searching assembly is correspondingly arranged on one side of the supporting table assembly, the shaping edge searching assembly comprises a driving piece and a rotary supporting seat, the rotary supporting seat is correspondingly arranged on one side of the supporting table assembly, the driving piece is connected with the rotary supporting seat, and the driving piece can drive the rotary supporting seat to move forwards and backwards, up and down and rotationally, so that the wafers on the supporting table assembly are supported and rotated;
The chip bonding and leveling mechanism is used for bonding the shaped and edge-seeking wafer on the ceramic disc and leveling the wafer, and comprises a positioning table, a turnover assembly and a leveling assembly, wherein the positioning table is used for supporting and driving the ceramic disc to rotate, the turnover assembly is used for bonding the wafer on the ceramic disc, the leveling assembly is used for leveling the wafer on the ceramic disc, the turnover assembly is correspondingly arranged on one side of the positioning table and comprises a power piece, a rotating shaft and a sucker, the power piece is connected with the rotating shaft, the sucker is fixed on the rotating shaft, the power piece can drive the rotating shaft and the sucker to move left and right, up and down and in a turnover manner, the leveling assembly is correspondingly arranged above the positioning table and comprises a pressing driving piece and a pressing air bag, the pressing driving piece can drive the pressing air bag to move up and down so as to flatten the wafer on the ceramic disc, and the pressing air bag can be ventilated to realize inflation;
the transfer manipulator is used for transferring the wafers in each mechanism.
The working method for waxing the lower wafer of the full-automatic wafer comprises the following steps:
s1, slice shoveling procedure, namely
The wafers on the ceramic disc conveyed in the previous working procedure are shoveled one by one, and the shoveled wafers are stored one by one;
s2, a ceramic disc storage procedure, namely
Placing the ceramic disc after the shoveling into a stereoscopic warehouse;
s3, a ceramic disc cleaning procedure, namely
Cleaning the ceramic disc;
s4, wafer pasting procedure, namely
Brushing and spin-drying the wafer, homogenizing wax, baking, shaping, edge searching and turning over, and then attaching the wafer to a ceramic disc;
s5, wafer flattening process, namely
Flattening the wafer;
s6, transferring the ceramic disc and the wafer, namely
The ceramic disc and the wafer are transferred and stored for being sent to the next station.
The beneficial effects of the invention are as follows: according to the full-automatic wafer lower-piece waxing return line and the working method thereof, all devices are fully and automatically matched without any manual operation, so that the labor force of workers is greatly reduced, the production efficiency is improved, meanwhile, the whole device is carried out in a dust-free environment, multiple brushing is adopted, the cleanliness of products is greatly improved, the obtained products are good in consistency, the defective rate is low, and the full-automatic wafer lower-piece waxing return line has a wide market prospect.
Description of the drawings:
FIG. 1 is a schematic perspective view of a full-automatic wafer lower wafer waxing return line;
FIG. 2 is a schematic view of the structure of the blade unit and the receiving unit of the present invention;
FIG. 3 is a schematic view of the brush face unit of the present invention;
FIG. 4 is a schematic view of the storage unit of the present invention;
FIG. 5 is a schematic view of a handling robot according to the present invention;
fig. 6 is a schematic structural view of the flipping unit of the present invention;
FIG. 7 is a schematic view of the structure of the cleaning unit of the present invention;
FIG. 8 is a schematic view of the flip assembly of the present invention;
FIG. 9 is a schematic view of a patch panel unit according to the present invention;
FIG. 10 is a schematic view of the structure of the scrubbing and spin-drying mechanism of the present invention;
FIG. 11 is a schematic diagram of a wax homogenizing mechanism of the present invention;
FIG. 12 is a schematic structural diagram of the shaping and edge-seeking mechanism of the present invention;
FIG. 13 is a schematic view of a support table assembly of the shaping and edge-seeking mechanism of the present invention;
FIG. 14 is a schematic view of a patch panel mechanism according to the present invention;
fig. 15 is a schematic structural diagram of the flip chip assembly of the present invention.
The specific embodiment is as follows:
the preferred embodiments of the present invention will be described in detail below with reference to the attached drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present invention. The directional terms referred to in the present invention, such as "up", "down", "front", "back", "left", "right", "top", "bottom", etc., refer only to the directions of the attached drawings. Accordingly, directional terminology is used to describe and understand the invention and is not limiting of the invention.
Example 1:
the full-automatic wafer lower wafer waxing return line shown in fig. 1 comprises a main conveying line 10, wherein a shovel unit 1, a storage unit 2, a brushing unit 3, a storage unit 4, a turnover unit 5, a cleaning unit 6, a patch flat sheet unit 8, a cooling unit 7 and a transfer unit 9 are arranged on the main conveying line 10.
The main conveyor line 10 is used for automatically conveying ceramic discs, and is provided with a driving motor, a conveying roller and the like, so that the ceramic discs can be automatically conveyed to enter each station.
The wafer and the ceramic disc of the upper station are automatically conveyed to the shovel sheet unit, the shovel sheet unit is used for shoveling down the wafer on the ceramic disc, and the storage unit at one side of the shovel sheet unit is used for receiving the wafer shoveled down by the shovel sheet unit.
A blade unit and a storage unit as shown in fig. 2.
The shovel blade unit comprises a shovel blade support 11, a shovel blade power piece 12, a sliding block 13 and a shovel plate 18, wherein the shovel blade power piece 12 is fixed on the shovel blade support 11, the shovel blade power piece 12 is connected with the shovel plate 18 through the sliding block 13 and can drive the shovel plate 18 to move, the shovel plate 18 is inclined to the horizontal plane, one end of the shovel plate 18 is hinged with the bottom end of the sliding block 13, the middle part of the shovel plate 18 is elastically connected with the sliding block 13 through a spring 14, and when the bottom end of the shovel plate 18 is stressed, the shovel plate can rotate around the sliding block 13 and is reset through the spring 14 when the bottom end of the shovel plate 18 is not stressed. The shovel plate unit below still corresponds to be provided with rotary mechanism, positioning mechanism, elevating system, rotary mechanism includes revolving cylinder 16 and rotary disk, positioning mechanism includes elevating cylinder and locating wheel 17, and one side of shovel plate 18 still corresponds to be provided with inductor 15, when the pottery dish carried to shovel plate unit below, elevating cylinder drives locating wheel 17 and rises, make three locating wheel 17 support with the pottery dish edge and lean on, realize the location of pottery dish promptly, and elevating system can make pottery dish one end rise, form the incline condition, thereby the wafer above the shovel plate 18 shovel of being convenient for falls, revolving cylinder 16 can drive the rotary disk rotation thereby drive whole pottery dish rotation, and inductor 15 response wafer's position, thereby make shovel plate 18 receive the signal, shovel down the wafer one by one.
The storage unit comprises a slide way 21, a storage box 25 and a lifting power piece 24, wherein the slide way 21 is correspondingly arranged on one side of the shovel sheet unit and is used for receiving the wafer sent by the shovel sheet unit, the wafer is sent into the storage box 25, the slide way 21 is inclined with a horizontal plane, a plurality of water channels 22 capable of being communicated with water are formed in the slide way 21, the water channels 22 can be directly communicated with water, the wafer can be prevented from being stuck in the slide way 21, and the wafer cannot slide down normally, so that the wafer can slide down conveniently. The outlet end of the slide 21 is also provided with a stop bar 23 for blocking wafers so that wafers can be fed into the storage box 25 one by one without stacking. The receiver 25 corresponds the setting in the exit end of slide 21, and receiver 25 can set up to a plurality ofly, and every receiver 25 is multilayer structure, can deposit multi-disc wafer, lift power piece 24 is connected and can drive its lift with receiver 25.
During processing, a ceramic disc with a plurality of wafers enters the lower part of a shovel unit, a positioning wheel 17 positions the ceramic disc, an inductor 15 senses the wafers, at the moment, a shovel power piece 12 drives a sliding block 13 and a shovel plate 18 to move obliquely downwards to shovel the edge of a corresponding wafer, the sliding block 13 continues to downwards, the shovel plate 18 is rotated under pressure, a spring 14 contracts, so that the positive wafer is gradually shoveled up, then the positive wafer is sent into a slide way 21, the shovel plate 18 returns to a restoring position, the wafers enter a clamping groove of a storage box 25 through the slide way 21, and each storage is one, and a lifting power piece 24 descends by a certain height, so that the shovel wafers are stored one by one.
The surface of the ceramic disc after the shovel piece contains impurities, so that a brush surface unit is arranged between the shovel piece unit and the storage unit.
As shown in fig. 3, the brush surface unit includes a plurality of rotating shafts 32, brushes 33, spray pipes 34 and nozzles 35, the rotating shafts 32 are correspondingly disposed above and below the ceramic discs through which the main conveying line passes, a plurality of brushes 33 are respectively disposed on each rotating shaft 32, one or more spray pipes 34 are correspondingly disposed above and/or below the ceramic discs through which the main conveying line passes, and a plurality of nozzles 35 are uniformly disposed on each spray pipe 34. The rotating shaft 32 is connected with the driving motor 31 on the main conveying line through a gear set, a power mechanism is not required to be additionally arranged, and the ceramic disc is transported while the rotating shaft 32 rotates to spray and brush the upper surface and the lower surface of the ceramic disc, and then the ceramic disc is dried.
The ceramic disc after brushing enters a storage unit. The storage unit shown in fig. 4 comprises a carrying manipulator 41, a transverse rail 43, a longitudinal rail 42 and a stereoscopic warehouse, wherein the stereoscopic warehouse is correspondingly arranged at the output end of the shovel unit and is used for storing ceramic discs after the shovel, the stereoscopic warehouse is provided with a plurality of groups of plugboards 44, a plurality of plugboards 441 used for placing the ceramic discs at intervals are respectively arranged on each group of plugboards 44, namely, a plurality of plugboards 441 are formed from top to bottom by a pair of plugboards 44, each plugboard 441 can store one ceramic disc, the plugboards 441 are provided with concave grooves which are downwards concave, the ceramic discs are placed in the grooves and cannot deviate from the plugboards 441, one side of each plugboard 44 is correspondingly provided with a spray pipe 45, and the spray pipe 45 is uniformly provided with nozzles from top to bottom, namely, each plugboard 441 is correspondingly provided with a nozzle, and the ceramic discs can be sprayed and washed. The carrying manipulator 41 is arranged on the longitudinal rail 42 and can be lifted up and down along the longitudinal rail 42, the longitudinal rail 42 is arranged on the transverse rail 43 and can be moved left and right along the transverse rail 43, so that the carrying manipulator 41 can move in all directions, the ceramic disc after being scrubbed by the upper channel is sent into the inserting groove 441 through the carrying manipulator 41, and when the ceramic disc is required to be used, the ceramic disc is taken out by the carrying manipulator 41 and sent into the next station.
In addition, the invention also designs the conveying manipulator. The handling manipulator shown in fig. 5 comprises an end plate 411 capable of moving along a track, a first driving air cylinder 412, a second driving air cylinder 413, a first guide rail 415, a second guide rail 416, a positioning plate 417 and a push plate 418 which are arranged on the end plate 411, wherein the two second driving air cylinders 413 are arranged in a chute 414, the two second driving air cylinders 413 are fixedly connected with the push plate 418, a telescopic rod of the second driving air cylinder 413 is connected with the positioning plate 417, the positioning plate 417 is U-shaped and provided with 4 positioning blocks 419 for positioning ceramic discs, the telescopic rod of the first driving air cylinder 412 is connected with the push plate 418, the first guide rail 415 can move along the inner wall of the end plate 411, the second guide rail 416 can move along the first guide rail 415, and the positioning plate 417 is fixed on the second guide rail 416. When the telescopic rods of the first driving air cylinders 412 extend, the driving push plate 418 is driven to move, the second driving air cylinders 413 are driven to move along the sliding grooves 414, the first guide rails 415 are driven to move along the inner wall of the end plate 411, the first expansion and contraction are achieved, when the first driving air cylinders 412 extend to the maximum distance, the telescopic rods of the two second driving air cylinders 413 extend, the second guide rails 416 move along the first guide rails 415, the positioning plates 417 are driven to extend, the second expansion and contraction are achieved, and then the large-range movement can be achieved by being matched with the up-down and left-right movement of the end plate 411, so that the ceramic discs can be conveniently grabbed or stored.
After the ceramic disc in the stereoscopic warehouse is grabbed by the carrying manipulator and sent into the main conveying line, the ceramic disc is sent into the overturning unit to be overturned by 90 degrees. The turnover unit shown in fig. 6 comprises a bracket 51, a turnover power piece 53, a turnover frame 52 and a bracket 55, wherein the turnover frame 52 is arranged on the bracket 51 and is connected with the turnover power piece 53, the bracket 55 is fixed on the turnover frame 52, two supporting plates are fixed on the bracket 55, a channel for vertically supporting the edge of a ceramic disc and preventing the ceramic disc from falling is formed between the two supporting plates, and the turnover power piece 53 can drive the turnover frame 52 to drive the bracket 55 to turn. When the ceramic disc moves to the turnover unit, one end of the ceramic disc abuts against the positioning plate 57, the stop rod 56 moves along the guide rail 54 at this time to press the other end of the ceramic disc, so that the ceramic disc is positioned, the bracket 55 descends to press the ceramic disc, two supporting plates at one end of the bracket 55 abut against the edges of the ceramic disc, the turnover power piece 53 stretches out at this time to drive the whole turnover frame 52 to turn anticlockwise until the ceramic disc is perpendicular to the horizontal plane, and therefore a follow-up cleaning manipulator is convenient to grasp the ceramic disc.
Unlike the prior art, the present invention employs vertical cleaning. The cleaning unit shown in fig. 7 comprises a cleaning tank 61, a cleaning track 62 and a cleaning manipulator, wherein the cleaning tank 61 is provided with a plurality of cleaning robots, the cleaning manipulator comprises a gantry type movable bracket 65, a lifting power piece 63 and a pair of supporting blocks 64, the two supporting blocks 64 are fixed at the bottom end of the movable bracket 65, a channel for vertically supporting the edge of a ceramic disc and preventing the ceramic disc from falling is formed between the two supporting blocks 64, namely an arc-shaped groove is formed between the supporting blocks 64 and the movable bracket 65, and the bottom end of the ceramic disc is just embedded in the arc-shaped groove and cannot fall. The structure of the support blocks 64 is substantially the same as the support plate structure on the bracket of the flipping unit. It should be noted that the cleaning manipulator is divided into two groups, one group is used for sending into the ceramic dish to the ultrasonic wave standing groove, and another group is used for taking out the ceramic dish from the ultrasonic wave standing groove, and two groups cooperate in order to improve cleaning efficiency.
When the ceramic disc is turned over by the turning unit, the power part drives the former group of cleaning manipulators to move to corresponding positions along the cleaning track 62, the lifting power part 63 drives the movable bracket 65 and the supporting blocks 64 to descend, and when the ceramic disc descends below the ceramic disc on the turning unit, the power part drives the cleaning manipulators to continuously move along the cleaning track 62, gradually approach the ceramic disc, then the movable bracket 65 ascends, the ceramic disc is embedded into the two supporting blocks 64, so that the ceramic disc is supported, and then the former group of cleaning manipulators send the ceramic disc into the ultrasonic wave placing groove for ultrasonic cleaning through transverse and longitudinal movement. After the cleaning is finished, the ceramic disc can be taken out by the next group of cleaning manipulators and sent to the next station.
Because the ceramic disc on the cleaned cleaning manipulator is in a vertical state, a turnover assembly 50 is further arranged on the main conveying line and is used for turning the cleaned ceramic disc by 90 degrees to be in a horizontal state. The turnover assembly shown in fig. 8 comprises a pushing cylinder 501, a rotating plate 502, sliding seats 503, a bottom positioning plate 504 and side positioning plates 505, wherein a telescopic rod of the pushing cylinder 501 is connected with the rotating plate 502, the pushing cylinder 501 can drive the pushing plate 501 to realize 90-degree turnover, the sliding seats 503 are two and are arranged on a guide rail of the rotating plate 502 and can move along the guide rail, and the side positioning plates 505 and the bottom positioning plates 504 are respectively fixed on the two sliding seats 501. When the cleaning manipulator of the cleaning unit moves to the upper part of the overturning assembly, the cleaning manipulator drives the ceramic disc to descend, the bottom of the ceramic disc is just inserted into the grooves of the two bottom positioning plates 504 to realize bottom positioning, then the power piece drives the two sliding seats 503 and the side positioning plates 505 to move inwards simultaneously, the two sides of the ceramic disc are positioned, the whole clamping and positioning of the ceramic disc are realized, at the moment, the telescopic rod of the pushing cylinder 501 extends out, the pushing rotating plate 502 drives the ceramic disc to rotate by 90 degrees and gradually push forwards, and the ceramic disc falls on the supporting table surface below. The supporting table top is liftable, so that the subsequent ceramic disc transfer is facilitated.
In addition, a transfer assembly is further arranged on the main conveying line and used for transferring the subsequent ceramic discs, and the transfer assembly comprises a movable seat 507, a guide rail 508, a supporting block 506 and a connecting rod 509, wherein the movable seat 507 can move along the guide rail 508, the connecting rod 509 is fixed on the movable seat 507, and the supporting blocks 506 are respectively fixed at two ends of the connecting rod. After the ceramic plate after cleaning is turned over, the supporting table surface drives the ceramic plate to ascend, the movable seat 507 moves to the supporting table surface, the two supporting blocks 506 are positioned below the ceramic plate, at the moment, the supporting table surface descends, the ceramic plate falls onto the two supporting blocks 506, and a plurality of positioning wheels are arranged on the supporting blocks 506, so that the ceramic plate can be positioned and transferred to the next station. The subsequent main conveyor line is provided with a plurality of transfer modules as described above, which may be mounted in either a transverse or a longitudinal direction.
Followed by the most important patch process. The patch flat sheet unit comprises a patch unit and a flat sheet unit. The patch flat-sheet unit shown in fig. 9 comprises a carrier basket fixing mechanism 81, a brushing and spin-drying mechanism 83, a wax homogenizing mechanism 85, a baking mechanism 84, a shaping and edge-seeking mechanism 86, a patch flat-sheet mechanism 87 and a transfer manipulator 82.
The bearing basket fixing mechanism is used for loading wafers, a plurality of bearing basket fixing stations used for positioning the bearing basket are arranged, and a plurality of wafers are inserted into each station.
The brushing and spin-drying mechanism is used for brushing and spin-drying a wafer, as shown in fig. 10, and comprises a positioning platform assembly and a brushing and drying assembly, the positioning platform assembly comprises a rotating motor 834, a lifting air cylinder 838, a rotating platform 835 and a sucker, the sucker is fixed on the rotating platform 835, the rotating platform 835 is connected with the rotating motor 834, the rotating motor 834 can drive the rotating platform 835 and the sucker to rotate, and the lifting air cylinder 838 can drive a protective cover outside the rotating platform 835 to lift so as to avoid cleaning liquid from splashing. The brushing assembly comprises a brush disc 833, a brush disc driving motor 831, a brush disc swinging motor 837, a rocker arm 832, a rocker arm lifting cylinder 839 and a brushing groove 836, wherein the brush disc 833 is correspondingly arranged above the sucker, the brush disc 833 is connected with the brush disc driving motor 831, the brush disc driving motor 831 can drive the brush disc 833 to axially rotate, the brush disc swinging motor 837 is connected with the brush disc 833 through the rocker arm 832, the brush disc swinging motor 837 can drive the rocker arm 832 and the brush disc 833 to swing, the rocker arm lifting cylinder 839 can drive the brush disc swinging motor 837 and the rocker arm 832 to lift, and the brushing groove 836 is correspondingly arranged on one side of the brush disc 833. When the wafer is sent to the brushing and spin-drying mechanism, the wafer is absorbed by the sucker, the brushing disc 833 can be brushed after being dipped in water by the brushing groove 836, the rotating motor 834 drives the rotating platform 835 and the wafer to rotate, the brushing disc swinging motor 837 drives the rocker arm 832 and the brushing disc 833 to swing at the same time, and the surfaces of the wafer can be completely brushed. It should be noted that the invention designs two sets of brushing and spin-drying mechanisms to improve the processing efficiency.
The wax homogenizing mechanism is used for uniformly waxing the surface of the wafer, and comprises a wax throwing component and a wax dripping component, as shown in fig. 11, the wax throwing component is provided with a rotary table 854, the rotary table 854 is connected with a rotary motor, the wax dripping component is provided with a wax dripping device 852, the wax dripping device 852 is connected with an air cylinder 851, the wax dripping device 852 is correspondingly arranged above the rotary table 854, the wax homogenizing mechanism further comprises a lifting air cylinder 855, and the lifting air cylinder 855 can drive the rotary table 854 to lift. When the wafer is sent into the wax homogenizing mechanism, the rotary table 854 receives and adsorbs the wafer, the lifting air cylinder 855 drives the rotary table 854 to ascend into the sleeve 853, wax oil splashing during wax homogenizing can be avoided by the sleeve 853, at the moment, the air cylinder 851 stretches out, the wax dropping device 852 moves to the upper part of the center of the wafer to drop wax, and the rotary table starts to rotate, so that the surface of the wafer is uniformly full of wax.
The baking mechanism is used for baking the uniformly-waxed wafer, and a common oven is adopted.
The shaping and edge searching mechanism is used for shaping and edge searching the baked wafer. As shown in fig. 12, the wafer carrier comprises a support table assembly 867 and a shaping edge-seeking assembly, wherein the support table assembly 867 is used for placing the wafer, and the shaping edge-seeking assembly is used for shaping the wafer.
The shaping edge searching assembly comprises a driving piece and a rotary supporting seat 866, the rotary supporting seat 866 is correspondingly arranged on one side of the supporting table assembly, the driving piece is connected with the rotary supporting seat 866, the driving piece can drive the rotary supporting seat 866 to move back and forth, up and down and rotationally, so that a wafer on the supporting table assembly is supported and rotated, the driving piece comprises a first sliding rail 861, a first sliding block 862, a first air cylinder 863, a first lifting seat 864 and a motor 865, the first sliding block 862 is arranged on the first sliding rail 861 and can slide along the first sliding rail 861, the first air cylinder 863 is fixed on the first sliding block 862, the first air cylinder 863 is connected with the first lifting seat 864, the first air cylinder 863 can drive the first lifting seat 864 to move up and down, the motor 865 is fixed on the first lifting seat 864, the rotary supporting seat 866 is arranged at the top end of the motor 865, and the motor 865 can drive the rotary supporting seat 6 to rotate.
The supporting table assembly as shown in fig. 13 comprises a supporting frame 8671, a supporting table 8672, a rotary driving member 8674 and positioning clamping jaws 8673, wherein the supporting table 8672 is fixed at the top end of the supporting frame 8671, the supporting table 8672 is of a circular ring structure, the diameter of the supporting table is slightly smaller than that of a wafer, a through hole is formed in the center of the supporting table 8672 and can be used for a sucking disc or a rotary supporting seat to pass through, the positioning clamping jaws 8673 are a pair of positioning clamping jaws, are respectively and correspondingly arranged at two sides of the supporting table 8672, arc-shaped grooves are respectively formed in opposite faces of the two positioning clamping jaws 8673, the arc-shaped grooves correspond to the radian of the wafer, the rotary driving member 8674 is connected with the two positioning clamping jaws 8673, and the rotary driving member 8674 can drive the two positioning clamping jaws 8673 to rotate simultaneously so as to clamp or unclamp the wafer on the supporting table 8672.
During processing, the wafer is sent to the supporting table 8672 by the mechanical arm, the rotary driving piece 8674 drives the two positioning clamping jaws 8673 to simultaneously rotate inwards, and the two positioning clamping jaws 8673 can draw the wafer towards the center to realize positioning; then the first slider 862 drives the first cylinder 863, the first lifting seat 864 and the motor 865 to move forward, so that the rotary supporting seat 866 is located right below the wafer, the first cylinder 863 drives the first lifting seat 864, the motor 865 and the rotary supporting seat 866 to lift up the wafer, the motor 865 drives the rotary supporting seat 866 and the wafer to rotate slowly, the sensor arranged on the side can sense the notch of the wafer, when the notch rotates to a fixed position, the sensor sends out a signal, the motor 865 stops rotating, the first lifting seat 864 descends, the wafer returns to the supporting table 8672, and the shaping edge finding assembly returns to the original position.
The wafer in each mechanism is transferred through the transfer manipulator in each process, and the transfer manipulator adopts the transfer manipulator structure of the prior application of the company.
And (3) carrying out surface mounting and flattening treatment after shaping and flattening.
The chip-leveling mechanism shown in fig. 14 comprises a mounting platform 871, a positioning table 872 arranged on the mounting platform 871 and used for supporting and driving the ceramic disk to rotate, a turnover chip-leveling assembly 873 used for attaching the wafer to the ceramic disk, and a leveling assembly used for leveling the wafer on the ceramic disk.
The turnover patch assembly shown in fig. 15 comprises a power member, a rotating shaft 8736 and a suction disc 8737, wherein the suction disc 8737 is correspondingly arranged on one side of the supporting table assembly, the power member is connected with the rotating shaft 8736, the suction disc 8737 is fixed on the rotating shaft 8736, the power member can drive the rotating shaft 8736 and the suction disc 8737 to move left and right, up and down and turnover so as to absorb a wafer and enable the wafer to turn over, the power member comprises a second sliding rail 8731, a second sliding block 8732, a second air cylinder 8733, a second lifting seat 8734 and a rotating air cylinder 8735, the second sliding block 8732 is arranged on the second sliding rail 8731 and can slide along the second sliding rail 8731, the second air cylinder 8733 is fixed on the second sliding block 8732, the second air cylinder 8733 is connected with the second lifting seat 8734, the second air cylinder 8733 can drive the second lifting seat 8734 to move up and down, the rotating air cylinder 8735 is fixed on the second lifting seat 8734, and the rotating air cylinder 8735 is connected with the rotating shaft 8736 and can drive the rotating shaft 8736 to rotate axially.
The flat plate component is correspondingly arranged above the positioning table 872 and comprises a pressing driving piece 874 and a pressing air bag 875, the pressing driving piece 874 can drive the pressing air bag 875 to move up and down so as to flatten the wafer on the ceramic disc, and the pressing air bag 875 is communicated with the air channel and can be ventilated to realize gradual bulge.
A plurality of positioning components for positioning the ceramic disks are uniformly distributed around the positioning table 872.
During processing, the second sliding block 8732 drives the second air cylinder 8733, the second lifting seat 8734 and the rotary air cylinder 8735 to move, so that the suction disc 8737 is positioned below the wafer, the second air cylinder 8733 drives the second lifting seat 8734, the rotary air cylinder 8735 and the suction disc 8737 to ascend, the suction disc 8737 can absorb the wafer, the wafer is moved to the upper part of the ceramic disc on the positioning table 872 through the second sliding block 8732, at the moment, the rotary air cylinder 8735 drives the wafer to turn 180 degrees, the surface coated with glue is downward, and finally the second air cylinder 8733 drives the suction disc 8737 to move downwards, so that the wafer is attached to the ceramic disc, and one-time attaching is completed; after the patch, the two positioning assemblies 876 move inward to position the ceramic disc; after positioning, the pressing driving piece 874 drives the pressing air bag 875 to descend, and the pressing air bag 875 is inflated for multiple times to expand, so that the wafer below is flattened for multiple times, and one-time flattening is completed; after the wafer is flattened, the positioning table 872 drives the ceramic disc to rotate in an equal division manner, so that another wafer pasting can be performed, and the wafer is uniformly pasted on the ceramic disc in an equal division manner.
The ceramic disc and the wafer after being flattened are sent into a transfer unit 9 for stacking and transferring after being cooled by a cooling unit 7 of a main conveying line.
Example 2:
on the basis of embodiment 1, embodiment 2 provides a working method for full-automatic wafer lower wafer waxing, which comprises the following steps:
s1, slice shoveling procedure, namely
The wafers on the ceramic disc conveyed in the previous working procedure are shoveled one by one, and the shoveled wafers are stored one by one;
s2, a ceramic disc storage procedure, namely
Placing the ceramic disc after the shoveling into a stereoscopic warehouse;
s3, the ceramic disc overturning procedure, namely
Turning the ceramic disc by 90 degrees;
s4, a ceramic disc cleaning procedure, namely
Vertically cleaning the ceramic disc;
s5, wafer pasting procedure, namely
Brushing and spin-drying the wafer, homogenizing wax, baking, shaping, edge searching and turning over, and then attaching the wafer to a ceramic disc;
s6, wafer flattening process, namely
Flattening the wafer;
s7, transferring the ceramic disc and the wafer, namely
The ceramic disc and the wafer are transferred and stored for being sent to the next station.
The parts related to the shoveling process, the ceramic tray storing process, the ceramic tray turning process, the ceramic tray cleaning process, the wafer pasting process, the wafer flattening process, the ceramic tray and the wafer transferring process are discussed in the related description of embodiment 1.
Any particular values in all examples shown and described herein are to be construed as merely illustrative and not a limitation, and thus other examples of exemplary embodiments may have different values.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In addition, in the description of embodiments of the present invention, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "configured," "provided," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The driving piece, the power piece and the like of the invention can be replaced by related power elements such as an air cylinder, an electric cylinder, a motor, an oil cylinder and the like, can also adopt corresponding link mechanisms to realize power output, and are not limited by names or structures.
The related positions of each unit or component of the invention are provided with the sensor, the alarm and the photoelectric switch sensing piece, thereby ensuring the continuous effectiveness of production.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention.
Claims (7)
1. The utility model provides a full-automatic wafer lower piece waxing return line, includes main transfer chain, main transfer chain is used for automatic transport ceramic dish, its characterized in that: the main conveying line is provided with a shovel unit, a storage unit, a cleaning unit, a patch flat unit and a transfer unit;
The slice shoveling unit is used for shoveling down the wafer on the ceramic disc;
the accommodating unit is correspondingly arranged at one side of the slice shoveling unit and is used for receiving the wafer shoveled by the slice shoveling unit;
the storage unit is correspondingly arranged at the output end of the shovel sheet unit and is used for storing ceramic discs of the shoveled wafers;
the cleaning unit is correspondingly arranged at the output end of the storage unit and is used for receiving the ceramic discs in the storage unit and vertically cleaning the ceramic discs;
the chip mounting flat-sheet unit is correspondingly arranged at the output end of the cleaning unit and is used for attaching the wafer to the cleaned ceramic disc and carrying out flat-sheet shaping on the wafer after chip mounting;
the transfer unit is correspondingly arranged at the output end of the flat sheet unit and is used for transferring and storing the ceramic disc and the wafer after the flat sheet is formed;
the shovel blade unit comprises a shovel blade support, a shovel blade power piece, a sliding block and a shovel plate, wherein the shovel blade power piece is fixed on the shovel blade support, the shovel blade power piece is connected with the shovel plate through the sliding block and can drive the shovel plate to move, the shovel plate is inclined with a horizontal plane, one end of the shovel plate is hinged with the bottom end of the sliding block, the middle part of the shovel plate is elastically connected with the sliding block through a spring, the shovel plate can rotate around the sliding block when being stressed, and the shovel plate can be reset through the spring when not stressed;
The storage unit comprises a slideway, a storage box and a lifting power piece, wherein the slideway is correspondingly arranged on one side of the shovel piece unit and is used for receiving the wafer sent by the shovel piece unit, sending the wafer into the storage box, the slideway is inclined with a horizontal plane, a water channel is formed in the slideway, the storage box is correspondingly arranged at the outlet end of the slideway, and the storage box is of a multi-layer structure;
the cleaning unit comprises a cleaning tank, a cleaning track and a cleaning manipulator, wherein the cleaning manipulator is arranged on the cleaning track and can vertically lift or move left and right along the cleaning track, and is used for feeding or taking out ceramic discs in the cleaning tank, the cleaning manipulator comprises a movable bracket and a pair of support blocks, the two support blocks are fixed at the bottom end of the movable bracket, and a channel for vertically supporting the edges of the ceramic discs and preventing the ceramic discs from falling is formed between the two support blocks.
2. The fully automated wafer offside waxing reflow of claim 1, wherein: the multifunctional shovel comprises a shovel sheet unit, a storage unit, a brush face unit, a plurality of spraying pipes and a plurality of nozzles, wherein the brush face unit is arranged between the shovel sheet unit and the storage unit and comprises a plurality of rotating shafts, the rotating shafts are correspondingly arranged above and/or below ceramic discs through which a main conveying line passes, the rotating shafts are respectively provided with a plurality of brushes, the spraying pipes are correspondingly arranged above and/or below the ceramic discs through which the main conveying line passes, and the spraying pipes are uniformly provided with the nozzles.
3. The fully automated wafer offside waxing reflow of claim 1, wherein: the storage unit comprises a carrying manipulator, a track and a stereoscopic warehouse, wherein the stereoscopic warehouse is correspondingly arranged at the output end of the shovel unit and is used for storing ceramic discs after the shovel, the stereoscopic warehouse is provided with a plurality of groups of plugboards, a plurality of plugboards used for placing the ceramic discs at intervals are respectively arranged on the plugboards, and the carrying manipulator is arranged on the track and can be lifted up and down or moved left and right along the track and is used for grabbing the ceramic discs after the shovel and sending the ceramic discs into or taking the ceramic discs out of the stereoscopic warehouse.
4. The fully automated wafer offside waxing reflow of claim 1, wherein: the ceramic tray turnover device is characterized in that a turnover unit is further arranged between the storage unit and the cleaning unit and used for turning over the ceramic tray conveyed by the storage unit, the ceramic tray turnover device comprises a support, a turnover power piece, a turnover frame and a bracket, the turnover frame is arranged on the support and connected with the turnover power piece, the bracket is fixed on the turnover frame, two supporting plates are fixed on the bracket, a channel for vertically supporting the edge of the ceramic tray and preventing the ceramic tray from falling is formed between the two supporting plates, and the turnover power piece can drive the turnover frame to drive the bracket to turn over, so that the ceramic tray is turned over.
5. The fully automated wafer offside waxing reflow of claim 1, wherein: the surface mount flat sheet unit comprises a bearing basket fixing mechanism, a brushing and spin-drying mechanism, a wax homogenizing mechanism, a baking mechanism, a shaping and edge-searching mechanism, a surface mount flat sheet mechanism and a transferring manipulator;
the bearing basket fixing mechanism is used for loading wafers and is provided with a plurality of bearing basket fixing stations used for positioning the bearing baskets;
the brushing and spin-drying mechanism is used for brushing and spin-drying a wafer and comprises a positioning platform assembly and a brushing assembly, the positioning platform assembly comprises a rotary power piece, a rotary platform, a sucker, a lifting power piece, a lifting seat and a protective cover, the sucker is fixed on the rotary platform, the rotary platform is connected with the rotary power piece, the rotary power piece can drive the rotary platform and the sucker to rotate, the protective cover is sleeved outside the rotary platform, the protective cover is fixed on the lifting seat, the lifting power piece is connected with the lifting seat, the lifting power piece can drive the lifting seat and the protective cover to lift up and down so as to enable the rotary platform to enter or leave the protective cover, the brushing assembly comprises a brush disc, a brush disc driving piece, a brush disc swinging power piece, a rocker arm and a rocker arm lifting driving piece, the brush disc is correspondingly arranged above the sucker and fixedly connected with a brush disc rocker arm, the brush disc is connected with the brush disc driving piece, the brush disc driving piece can drive the brush disc to rotate axially, the brush disc swinging power piece can drive the rocker arm and the brush disc, and the brush disc lifting driving piece can be lifted and lowered, and the brush disc driving piece is connected with the brush disc driving piece, and the brush disc rocking driving piece and the brush disc rocking seat;
The wax homogenizing mechanism is used for uniformly waxing the surface of a wafer and comprises a wax throwing component and a wax dripping component, the wax throwing component comprises a protective cover, a lifting power piece, a lifting seat, a rotary power piece and a rotating seat, the lifting power piece is connected with the lifting seat and can drive the lifting seat to lift so as to enter or fall out of the protective cover above, the rotating seat and the rotary power piece are arranged on the lifting seat, the rotary power piece is connected with the rotating seat and can drive the rotating seat to rotate, the wax dripping component is correspondingly arranged on one side of the protective cover, the wax dripping component comprises a wax dripping device and a driving power piece, and the driving power piece is connected with the wax dripping device and can drive the wax dripping device to horizontally move so as to be close to or far away from the center of the protective cover;
the baking mechanism is used for baking the uniformly-waxed wafer and is provided with a baking box;
the shaping edge searching mechanism is used for shaping edges of baked wafers and comprises a supporting table assembly and a shaping edge searching assembly, the supporting table assembly is used for placing the wafers, the shaping edge searching assembly is correspondingly arranged on one side of the supporting table assembly, the shaping edge searching assembly comprises a driving piece and a rotary supporting seat, the rotary supporting seat is correspondingly arranged on one side of the supporting table assembly, the driving piece is connected with the rotary supporting seat, and the driving piece can drive the rotary supporting seat to move forwards and backwards, up and down and rotationally, so that the wafers on the supporting table assembly are supported and rotated;
The chip bonding and leveling mechanism is used for bonding the shaped and edge-seeking wafer on the ceramic disc and leveling the wafer, and comprises a positioning table, a turnover assembly and a leveling assembly, wherein the positioning table is used for supporting and driving the ceramic disc to rotate, the turnover assembly is used for bonding the wafer on the ceramic disc, the leveling assembly is used for leveling the wafer on the ceramic disc, the turnover assembly is correspondingly arranged on one side of the positioning table and comprises a power piece, a rotating shaft and a sucker, the power piece is connected with the rotating shaft, the sucker is fixed on the rotating shaft, the power piece can drive the rotating shaft and the sucker to move left and right, up and down and in a turnover manner, the leveling assembly is correspondingly arranged above the positioning table and comprises a pressing driving piece and a pressing air bag, the pressing driving piece can drive the pressing air bag to move up and down so as to flatten the wafer on the ceramic disc, and the pressing air bag can be ventilated to realize inflation;
the transfer manipulator is used for transferring the wafers in each mechanism.
6. The fully automated wafer offside waxing reflow of claim 1, wherein: and the main conveying line is also provided with a cooling unit which is correspondingly arranged at the output end of the patch flat sheet unit and used for cooling the wafer after the patch.
7. A working method for full-automatic wafer lower wafer waxing, which adopts the full-automatic wafer lower wafer waxing return line as set forth in any one of claims 1-6, and is characterized by comprising the following steps:
s1, slice shoveling procedure, namely
The wafers on the ceramic disc conveyed in the previous working procedure are shoveled one by one, and the shoveled wafers are stored one by one;
s2, a ceramic disc storage procedure, namely
Placing the ceramic disc after the shoveling into a stereoscopic warehouse;
s3, a ceramic disc cleaning procedure, namely
Cleaning the ceramic disc;
s4, wafer pasting procedure, namely
Brushing and spin-drying the wafer, homogenizing wax, baking, shaping, edge searching and turning over, and then attaching the wafer to a ceramic disc;
s5, wafer flattening process, namely
Flattening the wafer;
s6, transferring the ceramic disc and the wafer, namely
The ceramic disc and the wafer are transferred and stored for being sent to the next station.
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| CN201910746897.5A CN110379756B (en) | 2019-08-14 | 2019-08-14 | Full-automatic wafer lower wafer waxing return line and working method thereof |
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| CN201910746897.5A CN110379756B (en) | 2019-08-14 | 2019-08-14 | Full-automatic wafer lower wafer waxing return line and working method thereof |
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