CN114654609A - Automatic piece device of shovel of integration sapphire wafer - Google Patents
Automatic piece device of shovel of integration sapphire wafer Download PDFInfo
- Publication number
- CN114654609A CN114654609A CN202210506944.0A CN202210506944A CN114654609A CN 114654609 A CN114654609 A CN 114654609A CN 202210506944 A CN202210506944 A CN 202210506944A CN 114654609 A CN114654609 A CN 114654609A
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- Prior art keywords
- disc
- loading
- negative pressure
- wafer
- rack
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Links
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 20
- 239000010980 sapphire Substances 0.000 title claims abstract description 20
- 230000010354 integration Effects 0.000 title description 2
- 238000001179 sorption measurement Methods 0.000 claims description 17
- 238000001514 detection method Methods 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 59
- 230000000903 blocking effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
Abstract
The invention provides an integrated automatic sapphire wafer shoveling device which comprises a dust-proof chamber, wherein a carrying disc carrying frame is installed at one end inside the dust-proof chamber, a mechanical arm is installed at the other end inside the dust-proof chamber, and a shoveling mechanism is arranged on one side of the dust-proof chamber; the shovel mechanism comprises a rack arranged on one side of the dust-proof chamber, a loading disc loading assembly arranged on the upper surface of the rack, and a positioning assembly arranged inside the rack, wherein the loading disc loading assembly comprises a loading frame arranged on the upper surface of the rack, and a loading disc arranged inside the loading frame and arranged on the upper surface of the rack. The invention can push the wafer carrying disc to center the wafer carrying disc, and prevents the situation that the manipulator needs higher precision to finish accurate centering only by limiting the displacement of the wafer carrying disc.
Description
Technical Field
The invention mainly relates to the technical field of sapphire wafer processing, in particular to an integrated automatic sapphire wafer shoveling device.
Background
Sapphire refers to non-red alumina, and sapphire wafers have comprehensive excellent mechanical, optical, chemical, electrical and radiation resistance, and are important basic materials for modern industries, especially microelectronics and optoelectronics industries.
According to the wafer shovel piece mechanism that patent document that application number is CN201921320181.0 provided can know, this wafer shovel piece mechanism includes conveying platform and corresponds the shovel piece unit of setting in the conveying platform top, the shovel piece unit includes shovel piece support, shovel piece power spare, slider and shovel board, shovel piece power spare is fixed on shovel piece support, shovel piece power spare passes through the slider and is connected with the shovel board and can drive its removal, the shovel board inclines mutually with the horizontal plane, shovel board one end is articulated with the slider bottom, through spring elastic connection between shovel board middle part and the slider, the shovel board can be rotatory around the slider when receiving pressure, through spring reset when not receiving pressure. This wafer shovel piece mechanism can shovel the wafer down from ceramic dish fast effectively through shovel piece unit, rotatory lift unit and the mutually supporting of positioning unit, and degree of automation is high, and machining efficiency is higher, and can not harm the wafer, has guaranteed product quality.
Above-mentioned wafer shovel piece mechanism can be fast effectively shoveled the wafer from ceramic dish down, and degree of automation is high, but traditional wafer shovel piece mechanism often only through the oscilaltion locating wheel, accomplishes the location to the wafer year dish, leads to the location ability comparatively single, and positioning efficiency is lower.
Disclosure of Invention
The invention mainly provides an integrated automatic sapphire wafer shoveling device which is used for solving the technical problems in the background technology.
The technical scheme adopted by the invention for solving the technical problems is as follows:
an integrated automatic sapphire wafer shoveling device comprises a dust-proof chamber, wherein a carrying disc carrying frame is installed at one end inside the dust-proof chamber, a mechanical arm is installed at the other end inside the dust-proof chamber, and a shoveling mechanism is arranged on one side of the dust-proof chamber;
the shovel mechanism comprises a rack arranged on one side of the dust-proof chamber, a loading disc loading assembly arranged on the upper surface of the rack and a positioning assembly arranged in the rack, wherein the loading disc loading assembly comprises a loading frame arranged on the upper surface of the rack and a loading disc arranged in the loading frame and arranged on the upper surface of the rack;
the locating component including install in the inside support frame of frame, install in the cylinder of support frame lower surface, with the piston rod of cylinder runs through the lifting disk that the one end of support frame is connected, and with the negative pressure adsorption component that the upper surface of lifting disk is connected, the upper surface of lifting disk is connected with a plurality of connecting rod pushing component, the execution end of connecting rod pushing component is connected with the locating wheel, and is a plurality of connecting rod pushing component encircles the setting of negative pressure adsorption component.
Furthermore, a shell of the loading disc is provided with a center hole for the negative pressure adsorption part to penetrate through, the shell of the loading disc is provided with arc detection long holes symmetrically arranged by taking the center hole as a center shaft, and the shell of the loading disc is provided with sliding long holes arranged around the center hole.
Furthermore, the connecting rod pushing component comprises a sliding rod which is connected with the sliding long hole in a sliding mode and penetrates through the positioning wheel, a sliding block which is installed at one end, extending to the inner portion of the rack, of the sliding rod, a first hinged seat which is installed on the lower surface of the sliding block and a second hinged seat which is installed on the upper surface of the lifting disc, wherein the second hinged seat is connected with the first hinged seat through a connecting rod.
Furthermore, the positioning wheel is connected with the outer surface of the sliding rod through a bearing.
Furthermore, the negative pressure adsorption part comprises a supporting cylinder arranged on the upper surface of the lifting disc, a rotary joint arranged in the supporting cylinder and a negative pressure sucker connected with the execution end of the rotary joint.
Furthermore, the negative pressure adsorption part also comprises a gear ring which is arranged inside the supporting cylinder and is arranged on the outer surface of the bottom end of the negative pressure sucker, and a first gear which is meshed with the outer surface of the gear ring, wherein the first gear is rotationally connected with the supporting cylinder through a rotating shaft.
Furthermore, the negative pressure adsorption part also comprises a second gear sleeved on the outer surface of the bottom end of the rotating shaft and a third gear in meshed connection with the plurality of second gears, the third gear is sleeved on the outer surface of an output shaft of a motor, and the motor is installed at the bottom end of the inner part of the supporting cylinder.
Furthermore, the outer surface of the output shaft of the motor is provided with a coder, and one end of the coder is arranged on the inner surface of the supporting cylinder.
Furthermore, the outer surface of the top end of the supporting cylinder is provided with a supporting rod, and the supporting rod is far away from the upper surface of one end of the supporting cylinder and is provided with a circuit board.
Furthermore, the loading disc is used for containing a wafer carrying disc, and a positioning contact is arranged on the lower surface of the wafer carrying disc.
Compared with the prior art, the invention has the following beneficial effects:
firstly, the invention can push the wafer carrying disc to center the wafer carrying disc, and prevent the manipulator from needing higher precision to finish accurate centering only by limiting the displacement of the wafer carrying disc, and the invention specifically comprises the following steps: the second hinged seat is pushed and pulled by the lifting disc to ascend, the second hinged seat pushes and pulls the first hinged seat through the connecting rod, the sliding block is driven by the first hinged seat to be close to the circle center of the wafer carrying disc, the sliding rod is driven by the sliding block to slide along the sliding long hole, so that the positioning wheel on the sliding rod is driven to be close to the circle center of the wafer carrying disc, and the circle center of the wafer carrying disc is pushed by the positioning wheel to be aligned with the circle center of the center hole.
Secondly, the negative pressure sucker is abutted against the wafer carrying disc under the driving of the lifting disc, so that the negative pressure sucker and the wafer carrying disc are adsorbed and fixed after negative pressure is formed between the negative pressure sucker and the wafer carrying disc, and the wafer carrying disc is driven by the negative pressure sucker to rotate, so that the wafer carrying disc is stably fixed and displaced.
The present invention will be explained in detail below with reference to the drawings and specific embodiments.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the blade mechanism of the present invention;
FIG. 3 is a right side view of the blade mechanism of the present invention;
FIG. 4 is a schematic view of the configuration of the rack and the boat loading assembly of the present invention;
FIG. 5 is a schematic view of a link pushing member according to the present invention;
FIG. 6 is a schematic structural view of a negative pressure adsorption member according to the present invention;
FIG. 7 is a cross-sectional view of a support cartridge of the present invention;
FIG. 8 is a schematic view of a wafer carrier according to the present invention.
In the figure: 10. a manipulator; 20. a carrier tray carrier; 30. a dust-proof room; 40. a blade mechanism; 41. a frame; 42. a carrier tray loading assembly; 421. a loading frame; 422. loading a disc; 4221. a central bore; 4222. an arc-shaped detection long hole; 4223. a slide long hole; 423. a wafer carrying tray; 4231. positioning a contact; 43. a positioning assembly; 431. a support frame; 432. a cylinder; 433. a lifting plate; 434. a negative pressure adsorption member; 4341. a support cylinder; 4342. a rotary joint; 4343. a negative pressure sucker; 4344. a toothed ring; 4345. a first gear; 4346. a rotating shaft; 4347. a second gear; 4348. a third gear; 4349. a motor; 434a, an encoder; 434b, a support rod; 434c, a circuit board; 435. a connecting rod pushing member; 4351. a slide bar; 4352. a slider; 4353. a first hinge mount; 4354. a second hinged seat; 4355. a connecting rod; 436. and (5) positioning the wheel.
Detailed Description
In order to facilitate an understanding of the invention, the invention will now be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the invention are shown, but which may be embodied in different forms and not limited to the embodiments described herein, but which are provided so as to provide a more thorough and complete disclosure of the invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may be present, and when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present, as the terms "vertical", "horizontal", "left", "right" and the like are used herein for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, and the knowledge of the terms used herein in the specification of the present invention is for the purpose of describing particular embodiments and is not intended to limit the present invention, and the term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
In an embodiment, referring to fig. 1 to 8, an integrated automatic sapphire wafer shoveling device includes a dust-proof chamber 30, wherein a carrying tray carrier 20 is installed at one end inside the dust-proof chamber 30, a manipulator 10 is installed at the other end inside the dust-proof chamber 30, and a shoveling mechanism 40 is installed at one side of the dust-proof chamber 30;
the blade mechanism 40 includes a frame 41 installed at one side of the dust-proof chamber 30, a tray loading assembly 42 installed on an upper surface of the frame 41, and a positioning assembly 43 installed inside the frame 41, where the tray loading assembly 42 includes a loading frame 421 installed on an upper surface of the frame 41, and a loading tray 422 installed inside the loading frame 421 and installed on an upper surface of the frame 41;
the positioning assembly 43 includes a supporting frame 431 mounted inside the frame 41, an air cylinder 432 mounted on a lower surface of the supporting frame 431, a lifting disc 433 connected with one end of a piston rod of the air cylinder 432 penetrating through the supporting frame 431, and a negative pressure adsorption part 434 connected with an upper surface of the lifting disc 433, wherein a plurality of link pushing parts 435 are connected to the upper surface of the lifting disc 433, a positioning wheel 436 is connected to an execution end of the link pushing parts 435, and the plurality of link pushing parts 435 are arranged around the negative pressure adsorption part 434.
Specifically, please refer to fig. 3 and 4 again, a central hole 4221 for inserting the negative pressure adsorption part 434 is formed in the housing of the loading disc 422, arc detection long holes 4222 symmetrically arranged with the central hole 4221 as a central axis are formed in the housing of the loading disc 422, and a sliding long hole 4223 arranged around the central hole 4221 is formed in the housing of the loading disc 422;
the link pushing member 435 includes a sliding rod 4351 slidably connected to the sliding slot 4223 and disposed through the positioning wheel 436, a sliding block 4352 installed at one end of the sliding rod 4351 extending into the frame 41, a first hinge seat 4353 installed at a lower surface of the sliding block 4352, and a second hinge seat 4354 installed at an upper surface of the lifting disc 433, wherein the second hinge seat 4354 is connected to the first hinge seat 4353 through a link 4355;
it should be noted that, in the present embodiment, the loading tray 422 is inserted through the central hole 4221 for the negative pressure chuck 4343 to penetrate, so that the negative pressure chuck 4343 contacts the wafer loading tray 423 held on the loading tray 422 to adsorb and fix the wafer loading tray 423, the loading tray 422 is inserted through the positioning contact 4231 through the arc-shaped detection slot 4222, and the loading tray 422 is inserted through the sliding slot 4223 for the sliding rod 4351;
further, the second hinge seat 4354 is pushed and pulled by the lifting disc 433 to lift, the second hinge seat 4354 pushes and pulls the first hinge seat 4353 through the connecting rod 4355, the slider 4352 is driven by the first hinge seat 4353, the slider 4352 drives the sliding rod 4351 to slide along the sliding slot 4223, so as to drive the positioning wheel 436 on the sliding rod 4351 to be close to the center of the wafer carrier 423 or to be away from the center of the wafer carrier, so that the positioning wheel 436 pushes the center of the wafer carrier 423 to be aligned with the center of the central hole 4221;
further, the second hinge seat 4354 may be located inside or outside the first hinge seat 4353, and when the second hinge seat 4354 is located inside the first hinge seat 4353, the lifting of the lifting plate 433 will cause the second hinge seat 4354 to push the first hinge seat 4353 away from the center of the wafer chuck 423 through the connecting rod 4355;
when the first hinge seat 4353 is located at the inner side of the second hinge seat 4354, the lifting of the lift plate 433 causes the first hinge seat 4353 to push the second hinge seat 4354 to approach the center of the wafer stage 423 through the connecting rod 4355.
Specifically, referring to fig. 5 and 6 again, the positioning wheel 436 is connected to the outer surface of the sliding rod 4351 through a bearing;
the negative pressure adsorption part 434 comprises a supporting cylinder 4341 arranged on the upper surface of the lifting disc 433, a rotary joint 4342 arranged in the supporting cylinder 4341, and a negative pressure suction disc 4343 connected with the execution end of the rotary joint 4342;
the negative pressure adsorption part 434 further comprises a gear ring 4344 arranged inside the support cylinder 4341 and mounted on the outer surface of the bottom end of the negative pressure suction cup 4343, and a first gear 4345 engaged with the outer surface of the gear ring 4344, wherein the first gear 4345 is rotatably connected with the support cylinder 4341 through a rotating shaft 4346;
it should be noted that, in the embodiment, the rotary joint 4342 and the vacuum chuck 4343 are connected to the actuating end of the rotary joint 4342, so that the vacuum chuck 4343 can still tightly adsorb the wafer carrier 423 during the process of driving the wafer carrier 423 to rotate;
further, when the first gear 4345 rotates, the first gear 4345 drives the gear ring 4344 connected thereto to rotate, and the gear ring 4344 drives the vacuum chuck 4343 to rotate.
Specifically, referring to fig. 6 and 7 again, the negative pressure absorption part 434 further includes a second gear 4347 sleeved on an outer surface of a bottom end of the rotating shaft 4346, and a third gear 4348 engaged with the plurality of second gears 4347, wherein the third gear 4348 is sleeved on an outer surface of an output shaft of a motor 4349, and the motor 4349 is installed at an inner bottom end of the supporting cylinder 4341;
an encoder 434a is installed on the outer surface of an output shaft of the motor 4349, and one end of the encoder 434a is installed on the inner surface of the support cylinder 4341;
it should be noted that, in the embodiment, when the motor 4349 drives the third gear 4348 connected to the output shaft thereof to rotate, the third gear 4348 is engaged with the second gear 4347 to drive the second gear 4347 to rotate, the second gear 4347 drives the rotation shaft 4346 to rotate, and the rotation shaft 4346 drives the first gear 4345 to rotate;
further, the motor 4349 monitors a rotation angle and a speed generated when the output shaft rotates through the encoder 434a sleeved outside the output shaft, so that the encoder 434a transmits an electrical signal with the rotation angle and the speed to the PLC connected thereto, and the electrical signal is used for the PLC to determine.
Specifically, please refer to fig. 6 and 8 again, a support rod 434b is installed on the outer surface of the top end of the support cylinder 4341, and a circuit board 434c is installed on the upper surface of one end of the support rod 434b far away from the support cylinder 4341;
the loading disc 422 is used for containing a wafer carrying disc 423, and a positioning contact 4231 is arranged on the lower surface of the wafer carrying disc 423;
it should be noted that, in the embodiment, the wafer carrier 423 is driven by the vacuum chuck 4343 to rotate until the positioning contact 4231 at the bottom of the wafer carrier 423 contacts the circuit board 434c on the supporting rod 434b, and the circuit board 434c generates a pulse signal to the PLC controller for the PLC controller to determine.
The specific operation mode of the invention is as follows:
a person places the carrying disc carrying frame 20 inside the dust-proof chamber 30, the manipulator 10 carries the wafer carrying disc 423 to the shovel mechanism 40 to perform centering and origin point finding processing on the wafer carrying disc 423, the wafer carrying disc 423 is rotated to shovel graduation after the origin point is found out, the shovel platform is inclined to shovel, the shoveled wafer enters the blocking plug through water flow and a slide way, the blocking plug carrier moves downwards to form a blocking slot after a collected wafer is collected, the next wafer is collected, and the blocking plug transferring manipulator puts the collected full blocking plug into a discharge material to be conveyed to a conveying line after the full collection;
during the process of centering and finding the origin, the lifting disc 433 is pushed by the air cylinder 432 to ascend, the second hinged seat 4354 is pushed by the lifting disc 433 to ascend, the second hinged seat 4354 is pushed by the connecting rod 4355 to push the first hinged seat 4353, the slider 4352 is driven by the first hinged seat 4353 to be close to the center of the wafer carrier disc 423, the slider 4352 drives the sliding rod 4351 to slide along the sliding slot 4223, so as to drive the positioning wheel 436 on the sliding rod 4351 to be close to the center of the wafer carrier disc 423, and the positioning wheel 436 pushes the center of the wafer carrier disc 423 to be aligned with the center of the center hole 4221;
after the circle center of the wafer carrier disc 423 is aligned with the circle center of the central hole 4221, the negative pressure chuck 4343 is also driven by the lifting disc 433 to abut against the wafer carrier disc 423, so that negative pressure is formed between the negative pressure chuck 4343 and the wafer carrier disc 423 to complete the adsorption and fixation between the wafer carrier disc 423 and the negative pressure chuck 4343, the wafer carrier disc 423 is driven by the negative pressure chuck 4343 to rotate until the single positioning contact 4231 at the bottom of the wafer carrier disc 423 is contacted with the circuit board 434c on the supporting rod 434b, and the circuit board 434c generates a pulse signal to the PLC controller for the PLC controller to determine.
The invention is described above with reference to the accompanying drawings, it is obvious that the invention is not limited to the above-described embodiments, and it is within the scope of the invention to adopt such insubstantial modifications of the inventive method concept and solution, or to apply the inventive concept and solution directly to other applications without modification.
Claims (10)
1. An integrated automatic sapphire wafer shoveling device comprises a dust-proof chamber (30), and is characterized in that a carrying disc carrying frame (20) is installed at one end inside the dust-proof chamber (30), a mechanical arm (10) is installed at the other end inside the dust-proof chamber (30), and a shoveling mechanism (40) is arranged on one side of the dust-proof chamber (30);
the shovel mechanism (40) comprises a rack (41) arranged on one side of the dust-proof chamber (30), a disc loading assembly (42) arranged on the upper surface of the rack (41), and a positioning assembly (43) arranged inside the rack (41), wherein the disc loading assembly (42) comprises a loading frame (421) arranged on the upper surface of the rack (41), and a loading disc (422) arranged inside the loading frame (421) and arranged on the upper surface of the rack (41);
the positioning assembly (43) comprises a supporting frame (431) installed inside the rack (41), a cylinder (432) installed on the lower surface of the supporting frame (431), a lifting disc (433) connected with one end, through which a piston rod of the cylinder (432) penetrates through the supporting frame (431), of the cylinder (432), and a negative pressure adsorption part (434) connected with the upper surface of the lifting disc (433), wherein the upper surface of the lifting disc (433) is connected with a plurality of connecting rod pushing parts (435), the execution end of each connecting rod pushing part (435) is connected with a positioning wheel (436), and the connecting rod pushing parts (435) are arranged around the negative pressure adsorption part (434).
2. The automatic integrated sapphire wafer shoveling device according to claim 1, wherein a housing of the loading disc (422) is provided with a central hole (4221) through which the negative pressure adsorption component (434) is inserted, the housing of the loading disc (422) is provided with arc-shaped detection long holes (4222) symmetrically arranged with the central hole (4221) as a central axis, and the housing of the loading disc (422) is provided with a sliding long hole (4223) arranged around the central hole (4221).
3. The integrated sapphire wafer automatic blade device of claim 2, wherein the link pushing member (435) comprises a sliding rod (4351) slidably connected to the sliding slot (4223) and disposed through the positioning wheel (436), a sliding block (4352) mounted on one end of the sliding rod (4351) extending to the inner portion of the frame (41), a first hinge seat (4353) mounted on a lower surface of the sliding block (4352), and a second hinge seat (4354) mounted on an upper surface of the lifting plate (433), and the second hinge seat (4354) and the first hinge seat (4353) are connected by a link (4355).
4. The integrated automatic sapphire wafer shoveling device of claim 1, wherein the positioning wheel (436) is connected with the outer surface of the sliding rod (4351) through a bearing.
5. The integrated automatic sapphire wafer shoveling device according to claim 1, wherein the negative pressure suction part (434) comprises a support cylinder (4341) mounted on the upper surface of the lifting plate (433), a rotary joint (4342) mounted inside the support cylinder (4341), and a negative pressure suction cup (4343) connected with an execution end of the rotary joint (4342).
6. The integrated automatic sapphire wafer shoveling device of claim 5, wherein the negative pressure suction part (434) further comprises a toothed ring (4344) disposed inside the supporting cylinder (4341) and mounted on an outer surface of a bottom end of the negative pressure suction cup (4343), and a first gear (4345) engaged with an outer surface of the toothed ring (4344), wherein the first gear (4345) is rotatably connected with the supporting cylinder (4341) through a rotating shaft (4346).
7. The integrated automatic sapphire wafer shoveling device of claim 6, wherein the negative pressure suction part (434) further comprises a second gear (4347) sleeved on an outer surface of a bottom end of the rotating shaft (4346), and a third gear (4348) in meshed connection with the plurality of second gears (4347), the third gear (4348) is sleeved on an outer surface of an output shaft of a motor (4349), and the motor (4349) is mounted at an inner bottom end of the supporting cylinder (4341).
8. The integrated automatic sapphire wafer shoveling device of claim 7, wherein an encoder (434a) is mounted on the outer surface of the output shaft of the motor (4349), and one end of the encoder (434a) is mounted on the inner surface of the support cylinder (4341).
9. The automatic integrated sapphire wafer shoveling device according to claim 8, wherein a supporting rod (434b) is mounted on the outer surface of the top end of the supporting cylinder (4341), and a circuit board (434c) is surface mounted on one end of the supporting rod (434b) far away from the supporting cylinder (4341).
10. The automatic integrated sapphire wafer shoveling device according to claim 1, wherein the loading tray (422) is used for containing a wafer carrying tray (423), and positioning contacts (4231) are mounted on the lower surface of the wafer carrying tray (423).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210506944.0A CN114654609A (en) | 2022-05-10 | 2022-05-10 | Automatic piece device of shovel of integration sapphire wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210506944.0A CN114654609A (en) | 2022-05-10 | 2022-05-10 | Automatic piece device of shovel of integration sapphire wafer |
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| CN114654609A true CN114654609A (en) | 2022-06-24 |
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| CN202210506944.0A Pending CN114654609A (en) | 2022-05-10 | 2022-05-10 | Automatic piece device of shovel of integration sapphire wafer |
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| CN113299584A (en) * | 2021-06-28 | 2021-08-24 | 苏州辰轩光电科技有限公司 | Processing system and method for material piece |
| CN113578170A (en) * | 2021-08-17 | 2021-11-02 | 通用生物系统（安徽）有限公司 | Controllable electromagnetism refiner is used in nucleic acid preparation |
| CN113903693A (en) * | 2021-10-13 | 2022-01-07 | 中环领先半导体材料有限公司 | Non-contact non-wax wafer feeding machine |
| CN113921438A (en) * | 2021-10-18 | 2022-01-11 | 麦斯克电子材料股份有限公司 | Multi-size wafer centering device |
| CN113732851A (en) * | 2021-11-05 | 2021-12-03 | 四川明泰微电子有限公司 | Device for polishing back of semiconductor wafer |
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