CN113299584A - Processing system and method for material piece - Google Patents
Processing system and method for material piece Download PDFInfo
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- CN113299584A CN113299584A CN202110721513.1A CN202110721513A CN113299584A CN 113299584 A CN113299584 A CN 113299584A CN 202110721513 A CN202110721513 A CN 202110721513A CN 113299584 A CN113299584 A CN 113299584A
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- drainage
- supporting platform
- wax
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Abstract
The invention discloses a processing system for a material part, which comprises a wax pasting mechanism, a transfer mechanism and a separation mechanism for the material part, wherein the separation mechanism comprises a bearing unit, a shovel unit, a driving unit and a guiding unit, and the bearing unit can rotate to an inclined plane from a horizontal plane under the action of the driving unit and then is arranged corresponding to the shovel unit; the bearing unit is used for bearing a material piece bonded through a wax body; the shovel unit can push the material piece to move in a staggered mode relative to the supporting platform, so that the material piece is separated from the supporting platform; the guide unit comprises a guide groove, flowing drainage liquid is filled in the guide groove, and the drainage liquid can bear and drain the material piece to move from the inlet end to the outlet end. The invention at least comprises the following advantages: when reducing effectively and shoveling away the degree of difficulty, can also make the wafer collect the in-process in the direction with external mechanism non-contact, avoid the production of wafer surface damage phenomenon.
Description
Technical Field
The invention relates to the technical field of automation equipment, in particular to a system and a method for processing a material piece.
Background
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
Wafers are carriers used in the production of integrated circuits, and are referred to as single crystal silicon wafers. The monocrystalline silicon wafer is prepared by drawing and extracting common silica sand, and is prepared into a monocrystalline silicon rod through a series of measures of dissolution, purification and distillation, and the monocrystalline silicon rod becomes a wafer after being polished and sliced. In the current production process, it is also necessary to treat the surface of the wafer, wherein the wax dropping process is common, so that the wafer is stuck to the support after the liquid wax is solidified. Because the thickness of wafer is thinner, how to effectively transfer the wafer after processing from the support piece is the technical problem that needs to be solved urgently at present.
In addition, because the precision requirement of the surface of the wafer is high, the wear of the surface of the wafer in the above-mentioned process and the subsequent collecting process is required to be as small as possible, and the wafer is transferred by adopting an adsorption mode in the current common means, so that the process period is long, and the surface of the wafer is damaged by unavoidable contact action and adsorption force factors.
It should be noted that the above background description is only for the sake of clarity and complete description of the technical solutions of the present invention and for the understanding of those skilled in the art. Such solutions are not considered to be known to the person skilled in the art merely because they have been set forth in the background section of the invention.
Disclosure of Invention
In order to overcome the defects in the prior art, embodiments of the present invention provide a system and a method for processing a material, which can effectively reduce the difficulty of shoveling away, and simultaneously can make a wafer not contact with an external mechanism in the guiding and collecting process, thereby avoiding the occurrence of the surface damage phenomenon of the wafer.
The embodiment of the application discloses: a processing system for a material part comprises a wax pasting mechanism, a transfer mechanism and a separation mechanism for the material part, wherein the transfer mechanism and the separation mechanism are sequentially located at the downstream of the wax pasting mechanism, the separation mechanism comprises a bearing unit located in a horizontal plane, a shovel sheet unit located in an inclined plane, a driving unit and a guiding unit, and the bearing unit can rotate to the inclined plane from the horizontal plane under the action of the driving unit and then is arranged corresponding to the shovel sheet unit;
the bearing unit comprises a support base and a support platform, the support platform is positioned in a horizontal plane and is arranged on the support base, and the support platform bears material pieces bonded through wax bodies;
the shovel unit can move towards the supporting platform after the supporting platform rotates into an inclined plane, and pushes the material part to move in a staggered manner relative to the supporting platform after the shovel unit abuts against the side wall of the material part, so that the material part is separated from the supporting platform;
the guide unit comprises a guide groove which is obliquely arranged and is provided with an inlet end and an outlet end, the inlet end can receive the separated material piece and is positioned above the outlet end, flowing drainage liquid is filled in the guide groove, and the drainage liquid can bear and drain the material piece and moves from the inlet end to the outlet end.
Furthermore, the inner side wall of the guide unit and the bottom of the guide groove are provided with drainage holes, and drainage liquid can be injected into the guide groove through the drainage holes.
Furthermore, be located the guiding groove bottom the drainage hole is provided with the multiunit along the flow direction of drainage liquid, every group the quantity of drainage hole is provided with a plurality ofly and sets up along the flow direction of perpendicular to drainage liquid.
Furthermore, the potential energy force generated by the upward flow of the drainage liquid injected into each group of drainage holes is greater than the gravity of the material piece.
Further, be provided with on the supporting pedestal and rotate the piece, supporting platform installs on the output of rotating the piece, it can drive to rotate the piece drive platform intermittent type formula rotates.
Further, the device comprises a sensing piece capable of detecting position information of the material piece, and the sensing piece is in signal connection with the rotating piece.
Further, the shovel unit comprises a shovel body, a first pushing piece and a second pushing piece, the shovel body is arranged at the output end of the second pushing piece, the first pushing piece can push the second pushing piece to move towards the material, and the second pushing piece can push the shovel body to abut against the material and shovel the material away from the supporting platform.
Further, the shovel piece body is the triangular prism form, a lateral wall of shovel piece body can laminate supporting platform's surface, a edge of shovel piece body is used for shoveling from the material spare.
The embodiment of the application also discloses: a method of machining a workpiece, comprising the steps of:
carrying out a liquid wax pasting process on the material;
transferring the material part subjected to the wax pasting process in a horizontal plane, wherein the temperature in the transferring process is in a room temperature range, and the liquid wax can cover and solidify on the surface and the side wall of the material part after flowing;
rotating the solidified material part of the liquid wax in a horizontal plane by a preset angle to enable the solidified material part to be positioned in an inclined plane;
applying a separating force to the material piece positioned in the inclined plane, so that the material piece can slide down through the self gravity;
the material after sliding falls into drainage liquid flowing along the first direction and flows to a preset position under the action of the drainage liquid, wherein the potential energy force generated by the drainage liquid upwards is greater than the gravity of the material
Further, after the solidified material of the liquid wax rotates from the horizontal plane by a preset angle, the solidified material is positioned in an inclined plane; the method comprises the steps of rotating the material piece positioned in the inclined plane to a position to be separated, feeding back a detected signal of the position of the material piece to be separated, stopping rotation of the material piece, and applying a separating force to the material piece.
By means of the technical scheme, the invention has the following beneficial effects:
1. through the support element who sets up, shovel piece unit and the combination of drive unit in this application, save the introduction of outside transfer unit, on reduce cost's basis, can also reduce the installation degree of difficulty. In addition, because the attaching force between the wafer and the supporting platform is small, the shoveling process is carried out in an inclined state, and the wafer can easily fall off relative to the supporting platform by combining the factor of gravity, thereby effectively reducing the shoveling difficulty;
2. through setting up the guide unit, every group in this application the upwards potential energy power that produces of drainage liquid that the drainage hole pours into is greater than the gravity of material spare, also can understand that the drainage liquid of this department upwards gushes the action and form the drainage similar to bernoulli principle between the drainage liquid of downflow, can regard as, both have and apply ascending holding power to the wafer, also have drive the wafer to the guiding force that the exit end flows, and then play the process of collecting, direction to the wafer.
In order to make the aforementioned and other objects, features and advantages of the invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the overall apparatus structure in an embodiment of the present invention;
fig. 2 is a partial structural schematic view at a carrying unit in the embodiment of the present invention;
FIG. 3 is a schematic structural view of a part of a carrying unit in the embodiment of the present invention;
fig. 4 is a partial structural view at the blade unit in the embodiment of the invention;
fig. 5 is a partial structural view at the blade unit in the embodiment of the present invention.
Reference numerals of the above figures: 1. a carrying unit; 2. a blade unit; 3. a guide unit; 4. a sensing element; 11. a support base; 12. a support platform; 13. a drive unit; 14. a rotating member; 21. a blade body; 22. a first pusher member; 23. a second pusher member; 31. a guide groove; 32. a drainage hole; 100. and (5) material parts.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, in the description of the present invention, the terms "first", "second", and the like are used for descriptive purposes only and for distinguishing similar objects, and no precedence between the two is considered as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
Referring to fig. 1 to 5, the present embodiment discloses a processing system for a material piece, which includes a wax attaching mechanism, a transferring mechanism and a separating mechanism for the material piece 100. The part 100 may be a carrier, such as a die, used in the production of integrated circuits. The wax pasting mechanism is used for performing a wax pasting process on the surface of the wafer; the transfer mechanism can transfer the wafer after the wax pasting process, wherein the liquid wax on the surface of the wafer flows and solidifies in the wax pasting process and the transfer process, so that the wafer is bonded on the support; the separating mechanism located on the downstream of the transferring mechanism can be in butt joint with the transferring mechanism, and then separating force is effectively applied to the wafer, so that the wafer can be shoveled away from the supporting piece, and the processed wafer is collected.
As shown in fig. 1, in the present embodiment, the separating mechanism includes a carrying unit 1, a blade unit 2 located above the carrying unit 1, a driving unit 13, and a guide unit 3 located at the left front of the carrying unit 1. It should be noted that the carrying unit 1 can be rotated from a horizontal plane to an inclined plane under the action of the driving unit 13 and then is arranged corresponding to the blade unit 2.
Referring to fig. 2 to 3, in the present embodiment, the carrying unit 1 includes a supporting base 11 and a supporting platform 12 disposed on the supporting base 11, wherein the supporting platform 12 is located above the supporting base 11 and in a horizontal plane. The support platform 12 is disc-shaped, and a plurality of wafers are distributed on the support platform 12 in an annular array. It is noted that the wafer is in a horizontal plane until the wax on the wafer solidifies, which is equivalent to the requirement that the support platform 12 be in a horizontal plane. After the wax body on the wafer solidifies, the wafer is bonded on the supporting platform 12 due to the fluidity of the wax body, and then the bearing unit 1 is pushed by the driving unit 13 to rotate through a preset angle, so that the subsequent shoveling-off process is carried out. The preset angle here is between 15-25 deg..
In the present embodiment, the driving unit 13 is located on the left side of the support base 11, and the driving unit 13 in the present embodiment may be a push-out cylinder. The output end of the ejection cylinder is connected with the support base 11, so that the ejection cylinder can push the whole support unit to rotate by a preset angle relative to the horizontal plane in the process of obliquely ejecting upwards.
In one possible embodiment, a rotating part 14 is disposed on the supporting base 11, wherein the rotating part 14 may be a stepping motor, an output shaft of the stepping motor extends in a vertical direction and is capable of being fixedly disposed with a center of the supporting platform 12 located in a horizontal plane, so as to drive the supporting platform 12 to intermittently rotate under the input of a fixed pulse, and further drive the plurality of wafers to move to preset positions respectively, thereby facilitating the shoveling.
Referring to fig. 4, in the present embodiment, the blade unit 2 is disposed corresponding to the supporting platform 12, where the blade unit 2 includes a blade body 21, a first pushing member 22, and a second pushing member 23. The shovel blade body 21 is in a horizontal triangular prism shape, and the cross section of the shovel blade body 21 is in a right-angled triangular shape. Wherein, the lower surface of shovel piece body 21 can with the laminating of supporting platform 12's surface, an edge of shovel piece can with the lateral wall butt of wafer to be used for shoveling from expect 100.
In the above arrangement, both the first pushing member 22 and the second pushing member 23 may be cylinder members, where the second pushing member 23 is disposed at an output end of the first pushing member 22, and the blade body 21 is disposed at an output end of the second pushing member 23. The first pushing member 22 and the second pushing member 23 are provided to enable the shovel blade body 21 to be capable of abutting against the side wall of the wafer, so that the wafer is shoveled away from the supporting platform 12 under the action of the abutting force.
Specifically, the first pushing member 22 can reciprocate in the up-down direction, so as to push the blade body 21 to move toward the supporting platform 12 until one side surface of the blade body 21 is attached to the supporting platform 12; the second pushing member 23 can move in an inclined plane, the inclined plane is parallel to the plane where the inclined supporting platform 12 is located, the second pushing member 23 firstly pushes the shovel blade body 21 to move towards the wafer in the inclined plane, and then exerts a butting force forward after butting with the wafer, so that the wafer can be shoveled away from the supporting platform 12, and then slides down from the supporting platform 12 to the downstream guiding unit 3 through self gravity.
In the above arrangement, the shovel blade body 21 can shovel one of the wafers from the supporting platform 12 after completing one cycle of operation. According to production requirements, a plurality of wafers are arranged on the supporting platform 12, and when one wafer falls off relative to the supporting platform 12, the supporting platform 12 is driven by the rotating part 14 to intermittently rotate for a certain angle. In order to make the angle of each turn substantially equal, a sensor element 4 is also provided in this application. Sensing element 4 is located the top and the adaptation setting of supporting platform 12, this sensing element 4 can detect the position information of wafer to can with rotate 14 signal connection, in case the wafer is rotated when targetting in place, sensing element 4 can with the information feedback that detects to rotate 14, rotate 14 stall of rotation, in order to guarantee to shovel from the effective of process going on.
As shown in fig. 5, in the present embodiment, the guide unit 3 includes a guide groove 31 that is disposed obliquely and has an inlet end and an outlet end, wherein the inlet end is located above the outlet end. Specifically, the guide unit 3 includes a guide body in a long bar shape, and the guide groove 31 is formed by recessing the upper surface of the guide body downward. Drainage holes 32 are formed in the inner side wall of the guide body and the bottom of the guide groove 31, drainage liquid can be filled in the guide groove 31 through the drainage holes 32, and the drainage liquid always tends to flow.
By the above arrangement, the wafer sliding down from the supporting platform 12 falls into the guide groove 31 from the inlet end; the drainage liquid in the guide groove 31 can bear and drain the wafer from the inlet end to the outlet end.
It is worth noting that a plurality of groups of drainage holes 32 are formed in the bottom of the guide groove 31 along the flowing direction of drainage liquid, and a plurality of drainage holes 32 are formed in each group and are arranged along the flowing direction perpendicular to the drainage liquid. Through the above arrangement, the potential energy force generated by the upward flow of the drainage liquid injected into each group of drainage holes 32 is greater than the gravity of the material part 100, and it can also be understood that a flow similar to the bernoulli principle is formed between the upward surge action of the drainage liquid and the downward flow of the drainage liquid, so that the arrangement has the advantages of applying an upward supporting force to the wafer and also having a guiding force for driving the wafer to flow to the outlet end, and further performing the collecting and guiding processes on the wafer.
It should be noted that the width of the guiding groove 31 is larger than the diameter of the wafer, and the drainage liquid gushed out through the drainage holes 32 on the side wall makes the wafer stably located at the middle position of the guiding groove 31 in the drainage process, so as to avoid contacting with the guiding body, and further avoid the occurrence of damage phenomenon on the surface of the wafer in the guiding process.
The embodiment also discloses a processing method for a material piece, wherein the material piece 100 in the method can be a wafer in a sheet shape and the like, and the method comprises the following steps:
and carrying out a liquid wax pasting process on the wafer, and uniformly coating the liquid wax body on the surface of the wafer through a wax pasting mechanism.
The wafer after the wax pasting process is horizontally transferred to the separating mechanism through the transferring mechanism, the temperature in the transferring process is in a room temperature range, and the liquid wax can cover and solidify on the surface and the side wall of the wafer and the surface of the supporting platform 12 of the separating mechanism through flowing.
Rotating the solidified wafer with the liquid wax from the horizontal plane through a preset angle by the rotating part 14, and then positioning the wafer in the inclined plane by the driving unit 13; in the process that a plurality of wafers are repeatedly shoveled away, the sensing element 4 feeds back the detected signal of the wafer at the position to be separated, so that the supporting platform 12 stops rotating, and further the separating force is applied to the wafer.
The material 100 in the inclined plane is applied with a separating force by the shovel blade unit 2, so that the wafer can slide down by self gravity.
The material part 100 after sliding falls into drainage liquid flowing along the first direction, and flows to a preset position under the action of the drainage liquid, wherein the potential energy force generated by the drainage liquid upwards is greater than the gravity of the material part 100.
Specifically, be located the guide way 31 bottom drainage hole 32 is provided with the multiunit along the flow direction of drainage liquid, every group the quantity of drainage hole 32 is provided with a plurality ofly and sets up along the flow direction of perpendicular to drainage liquid. Through the above arrangement, the potential energy force generated by the upward flow of the drainage liquid injected into each group of drainage holes 32 is greater than the gravity of the material part 100, and it can also be understood that a flow similar to the bernoulli principle is formed between the upward surge action of the drainage liquid and the downward flow of the drainage liquid, so that the arrangement has the advantages of applying an upward supporting force to the wafer and also having a guiding force for driving the wafer to flow to the outlet end, and further performing the collecting and guiding processes on the wafer.
Specifically, the width of guide way 31 is greater than the diameter of wafer, and through on the lateral wall the drainage liquid that drainage hole 32 gushed out makes the wafer stably be in the intermediate position department of guide way 31 at the in-process of drainage, avoid with the contact of direction body, and then avoid the wafer surface to produce the appearance of damage phenomenon at the direction in-process.
The principle and the implementation mode of the invention are explained by applying specific embodiments in the invention, and the description of the embodiments is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A processing system for a material part comprises a wax pasting mechanism, a transfer mechanism and a separation mechanism for the material part, wherein the transfer mechanism and the separation mechanism are sequentially located at the downstream of the wax pasting mechanism;
the bearing unit comprises a support base and a support platform, the support platform is positioned in a horizontal plane and is arranged on the support base, and the support platform bears material pieces bonded through wax bodies;
the shovel unit can move towards the supporting platform after the supporting platform rotates into an inclined plane, and pushes the material part to move in a staggered manner relative to the supporting platform after the shovel unit abuts against the side wall of the material part, so that the material part is separated from the supporting platform;
the guide unit comprises a guide groove which is obliquely arranged and is provided with an inlet end and an outlet end, the inlet end can receive the separated material piece and is positioned above the outlet end, flowing drainage liquid is filled in the guide groove, and the drainage liquid can bear and drain the material piece and moves from the inlet end to the outlet end.
2. The processing system for the material part according to claim 1, wherein the inner side wall of the guide unit and the bottom of the guide groove are provided with drainage holes, and the drainage liquid can be injected into the guide groove through the drainage holes.
3. The processing system for the material piece according to claim 2, wherein the drainage holes at the bottom of the guide groove are provided in a plurality of groups along the flow direction of the drainage fluid, and the number of the drainage holes in each group is provided in plurality and is perpendicular to the flow direction of the drainage fluid.
4. The processing system for material pieces according to claim 3, wherein the potential upward force generated by the drainage fluid injected into each group of drainage holes is greater than the gravity force of the material pieces.
5. A tooling system for a material according to claim 1 wherein the support base is provided with a rotatable member and the support platform is mounted on the output of the rotatable member, the rotatable member being capable of driving the drive platform in intermittent rotation.
6. The system as claimed in claim 5, including a sensing element capable of detecting positional information of the article, the sensing element being in signal communication with the rotatable element.
7. The processing system for a material piece according to claim 1, wherein the blade unit includes a blade body, a first pushing member and a second pushing member, the blade body is disposed on an output end of the second pushing member, the first pushing member can push the second pushing member to move toward the material piece, and the second pushing member can push the blade body to abut against the material piece and scoop the material piece away from the supporting platform.
8. The separating mechanism and the separating method for the material parts according to claim 7, wherein the shovel blade body is in a triangular prism shape, one side wall of the shovel blade body can be attached to the surface of the supporting platform, and one edge of the shovel blade body is used for shoveling and separating the material parts.
9. A processing method for a material piece is characterized by comprising the following steps:
carrying out a liquid wax pasting process on the material;
transferring the material part subjected to the wax pasting process in a horizontal plane, wherein the temperature in the transferring process is in a room temperature range, and the liquid wax can cover and solidify on the surface and the side wall of the material part after flowing;
rotating the solidified material part of the liquid wax in a horizontal plane by a preset angle to enable the solidified material part to be positioned in an inclined plane;
applying a separating force to the material piece positioned in the inclined plane, so that the material piece can slide down through the self gravity;
the material after sliding falls into drainage liquid flowing along the first direction and flows to a preset position under the action of the drainage liquid, wherein the potential energy force generated by the drainage liquid upwards is greater than the gravity of the material.
10. The processing method for the material according to claim 9, wherein the material after the liquid wax is solidified in the step "is rotated from the horizontal plane through a predetermined angle so as to be located in the inclined plane; the method comprises the steps of rotating the material piece positioned in the inclined plane to a position to be separated, feeding back a detected signal of the position of the material piece to be separated, stopping rotation of the material piece, and applying a separating force to the material piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110721513.1A CN113299584A (en) | 2021-06-28 | 2021-06-28 | Processing system and method for material piece |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110721513.1A CN113299584A (en) | 2021-06-28 | 2021-06-28 | Processing system and method for material piece |
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| CN113299584A true CN113299584A (en) | 2021-08-24 |
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| CN202110721513.1A Pending CN113299584A (en) | 2021-06-28 | 2021-06-28 | Processing system and method for material piece |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114654609A (en) * | 2022-05-10 | 2022-06-24 | 芜湖益盈鼎裕自动化设备有限公司 | Automatic piece device of shovel of integration sapphire wafer |
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2021
- 2021-06-28 CN CN202110721513.1A patent/CN113299584A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114654609A (en) * | 2022-05-10 | 2022-06-24 | 芜湖益盈鼎裕自动化设备有限公司 | Automatic piece device of shovel of integration sapphire wafer |
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