CN110379756A - Full-automatic wafer piece bottom sheet waxing return wire and its working method - Google Patents
Full-automatic wafer piece bottom sheet waxing return wire and its working method Download PDFInfo
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- CN110379756A CN110379756A CN201910746897.5A CN201910746897A CN110379756A CN 110379756 A CN110379756 A CN 110379756A CN 201910746897 A CN201910746897 A CN 201910746897A CN 110379756 A CN110379756 A CN 110379756A
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- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000004018 waxing Methods 0.000 title claims abstract description 14
- 239000000919 ceramic Substances 0.000 claims abstract description 162
- 238000004140 cleaning Methods 0.000 claims abstract description 67
- 230000008569 process Effects 0.000 claims abstract description 40
- 238000003860 storage Methods 0.000 claims abstract description 39
- 230000007246 mechanism Effects 0.000 claims description 56
- 238000007493 shaping process Methods 0.000 claims description 29
- 238000001035 drying Methods 0.000 claims description 16
- 238000012546 transfer Methods 0.000 claims description 16
- 239000007921 spray Substances 0.000 claims description 13
- 230000001681 protective effect Effects 0.000 claims description 11
- 230000033001 locomotion Effects 0.000 claims description 10
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000429 assembly Methods 0.000 claims description 6
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 230000008520 organization Effects 0.000 claims description 3
- 229910052573 porcelain Inorganic materials 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000007547 defect Effects 0.000 abstract description 3
- 230000003749 cleanliness Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 114
- 238000010586 diagram Methods 0.000 description 14
- 230000007423 decrease Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
Abstract
The present invention relates to a kind of full-automatic wafer piece bottom sheet waxing return wire and its working methods, including main conveyor line, the main conveyor line for conveying ceramic disk automatically, it is provided with shovel piece unit, housing unit, storage unit, cleaning unit, chip unit, plain film unit and buanch unit on the main conveyor line, process is stored by shovel piece process, ceramic disk, ceramic disk overturns process, ceramic disk cleaning process, wafer patch process, wafer plain film process, ceramic disk and wafer transfering process and completes processing.Full-automatic wafer piece bottom sheet waxing return wire and its working method, it is fully automated cooperation between each device, is not necessarily to any manual operation, greatly reduces the labour of worker, improve production efficiency, meanwhile whole device carries out in dustfree environment, using multiple scrub, substantially increase the cleanliness of product, obtained homogeneity of product is preferable, and defect rate is lower, has a vast market foreground.
Description
Technical field:
The present invention relates to electronic product machining technical field more particularly to a kind of full-automatic wafer piece bottom sheet waxing return wires
And its working method.
Background technique:
China IC Market installation amount demand growth is swift and violent, and labor shortage, cost of labor are constantly soaring, leads to manufacturer
Automation equipment demand is promoted, has significant effect to reducing production cost, improving product yield.
Existing wafer (sapphire sheet, silicon wafer etc.) needs to carry out multiple working procedure during processing, and such as cleaning applies
Glue, patch, shovel piece, storage etc..However in the prior art, the cleaning of the patch of wafer, cleaning, shovel piece and ceramic disk, deposit
It puts, typically carries out on different devices, man-hour requirement worker is added to shift or carry, not only need a large amount of labor
Power, and since wafer surface is more demanding, transfer process, which not can avoid, to collide or wafer surface is stained with ash
Dirt, to influence product quality.
Such as a kind of full-automatic chip mounter of the Patent No. CN104759974A of our company's earlier application, the device can be with
It realizes full-automatic paster, but is all in other equipment for the processing after the processing of the preamble of ceramic disk, storage and patch
It carries out, needs staff constantly to shift, influence processing efficiency, cannot achieve really full-automatic production.
Summary of the invention:
One of wafer full-automatic paster return wire how is integrated, is changed to by original semi-automation really full-automatic
Change, any manual operation is not necessarily in process, is a difficult point for needing to solve.Meanwhile how whole production line is carried out
Optimization, so that the finished product consistency of wafer is preferable, defect rate is lower, dustless, and is a problem to be solved.In addition,
In order to reduce the use in place, avoid using complicated robot mechanism etc. being also problem to be solved.And at these
The problems such as in problem, how per pass station to be automatically positioned, automatically grab, automatic turning, automatic transfer, automatic deviation correction, even more needs
It to be solved.
Therefore, according to these problems, the present invention devises a kind of high degree of automation, the labour that can reduce worker,
Reduce that production cost, production efficiency is higher, process dustless full-automatic wafer piece bottom sheet waxing return wire and its work safely
Make method.
The present invention is achieved through the following technical solutions: a kind of full-automatic wafer piece bottom sheet waxing return wire, including master
Pipeline, the main conveyor line be provided with for conveying ceramic disk automatically, on the main conveyor line shovel piece unit, housing unit,
Storage unit, cleaning unit, patch plain film unit and buanch unit；
The shovel piece unit is used for will be under the wafer slice bar on ceramic disk；
The housing unit is correspondingly arranged at shovel piece unit side, for receiving the wafer under shovel piece unit shovel；
The storage unit is correspondingly arranged at the output end of shovel piece unit, for storing the ceramic disk for shoveling lower wafer；
The cleaning unit is correspondingly arranged at the output end of storage unit, for receiving the ceramic disk in storage unit and right
Ceramic disk carries out vertical cleaning；
The patch plain film unit is correspondingly arranged at the output end of cleaning unit, cleans for wafer to be fitted in
On ceramic disk, and plain film shaping is carried out to the wafer after patch；
The buanch unit is correspondingly arranged at the output end of plain film unit, for shift and store ceramic disk after plain film and
Wafer.
What is considered first is shovel piece (bottom sheet) problem of wafer after patch.In the prior art, wafer is in chip mounter
On stick ceramic disk after, typically transfer is sent into other equipment progress and tears piece open manually, not only inefficient, but also is easily damaged shovel
Piece.
Therefore, the present invention devises special shovel piece unit, the shovel piece unit include shovel piece bracket, shovel piece force piece,
Sliding block and shovel board, the shovel piece force piece are fixed on shovel piece bracket, and shovel piece force piece is connect with shovel board and can be driven by sliding block
Its movement is moved, the shovel board is tilted with horizontal plane, and shovel board one end and sliding block bottom end are hinged, is passed through between sliding block in the middle part of shovel board
Spring connection, can be rotated around sliding block when shovel board is under pressure, not by pressure when pass through spring reset.
After shovel piece, it is also the technical issues that need to address that how finished product, which is stored,.
The present invention devises special housing unit, and housing unit includes slideway, storage box and lifting drive part, the cunning
Road is correspondingly arranged at shovel piece unit side, shovels the wafer brought for receiving shovel piece unit, and wafer is sent into and is stored
In box, slideway is tilted with horizontal plane, and water channel is offered in slideway, and the storage box is correspondingly arranged at the outlet end of slideway, is received
Case is multilayered structure, and the lifting drive part connect with storage box and can drive its lifting.
In order to be additionally provided with brush finish list between the shovel piece unit and housing unit to the ceramic disk surface clean after shovel piece
Member, the brush finish unit include shaft, hairbrush spray tube and nozzle, the shaft be it is multiple, it is logical to be correspondingly arranged at main conveyor line
The ceramic disk above and or below crossed, is respectively arranged with multiple hairbrush in each shaft, the spray tube be it is multiple, be correspondingly arranged
Multiple nozzles are evenly equipped on the ceramic disk above and or below that main conveyor line passes through, each spray tube, brush finish unit can will make pottery
Two faces of porcelain dish scrub clean, to guarantee subsequent preservation.
In the prior art, the ceramic disk after shovel piece is typically individually saved.
In order to solve this technical problem, the present invention increases ceramic disk storage unit in entire return wire, described to deposit
Putting unit includes conveying robot, track and tiered warehouse facility, and the tiered warehouse facility is correspondingly arranged at the output end of shovel piece unit, is used
Ceramic disk after storing shovel piece, tiered warehouse facility have multiple groups plugboard, offer multiple use respectively on each group plugboard
In the inserting groove for being spaced apart ceramic disk, the conveying robot setting is in orbit and can move along track oscilaltion or left and right
It is dynamic, for grabbing the ceramic disk after shovel piece and ceramic disk being sent into or taken out tiered warehouse facility.
In the prior art, the device about ceramic disk cleaning is varied, but the ceramic disk of return wire was conveyed
Cleaning way in journey is typically all by the way of " level cleaning ", i.e., ceramic disk level is sent into cleaning device, carries out ultrasound
Wave cleaning, not only occupied space is big for this cleaning way, and cleaning efficiency is poor, and still easy residual is miscellaneous for the upper surface of ceramic disk
Matter.
Therefore, the present invention devises special " vertical " cleaning unit, and the cleaning unit includes rinse bath, cleaning track
And cleaning manipulator, the rinse bath be it is multiple, cleaning manipulator setting in orbit and can along track oscilaltion or
It moves left and right, the ceramic disk for being sent into or taking out in rinse bath, cleaning manipulator includes movable support bracket and tray, the tray
For a pair, two trays are fixed on movable support bracket bottom end, are formed between two trays for vertically holding up ceramic plate edge and avoiding it
The channel fallen.
In order to realize vertical cleaning, need before cleaning to overturn ceramic disk, therefore single in storage unit and cleaning
Roll-over unit is additionally provided between member, including bracket, overturning force piece, rollover stand and bracket, the rollover stand are arranged in bracket
It above and with overturning force piece connect, the bracket is fixed on rollover stand, and two supporting plates are fixed on bracket, are formed between two supporting plates
Channel for vertically holding up ceramic plate edge and it being avoided to fall, overturning force piece can drive rollover stand to drive bracket overturning,
To make ceramic disk overturn.
Followed by important patch plain film unit, the full-automatic chip mounter of our company's earlier application also devises correlation
Chip unit, but its function and not perfect.Therefore the present invention devises the more complete chip unit of function, incorporates wafer
Scrub drying mechanism, shaping Xun Bian mechanism and patch plain film mechanism.
In addition, being bonded completely since the wafer after patch not can guarantee with ceramic disk, need to carry out after patch
Plain film.The plain film of the full-automatic chip mounter of our company's earlier application is made using force piece is compressed by common pressure
With plain film (tabletting) is carried out, the effect is unsatisfactory for the plain film of the plain film mode.
The patch plain film unit includes bearing basket fixed mechanism, scrub drying mechanism, Yun La mechanism, toasts mechanism, is whole
The side Xing Xun mechanism, patch plain film mechanism and transfer robot arm；
The bearing basket fixed mechanism is provided with multiple bearing baskets for positioning bearing basket and fixes for loading wafer
Station；
Scrub drying mechanism is used to carry out scrub drying, including locating platform component and brush assemblies to wafer,
The locating platform component includes rotary power part, rotating platform, sucker, lifting drive part, lifting seat and protective cover, the suction
Disk is fixed on the rotating platform, and the rotating platform is connect with rotary power part, and rotary power part can drive rotating platform and suction
Disc spins, the protective cover are set in outside rotating platform, and protective cover is fixed on lifting seat, the lifting drive part and lifting seat
Connection, lifting drive part can drive lifting seat and protective cover oscilaltion, so that rotating platform be made to enter or deviate from protective cover, institute
Stating brush assemblies includes brush, brush actuator, brush swinging driving part, rocker arm and radial up-down actuator, the brush pair
It should be arranged in above sucker and be fixedly connected with brush rocker arm, brush is connect with brush force piece, and the brush force piece can drive
Dynamic brush axial-rotation, the brush swinging driving part are connect with rocker arm, and brush swinging driving part can drive rocker arm and brush to shake
Pendulum, the radial up-down actuator are connect with brush swinging driving part, and radial up-down actuator can drive brush swinging driving part
Lifting；
The Yun La mechanism is used to uniformly wax to wafer surface, including gets rid of wax component and drop wax component, described to get rid of wax
Component includes shield, lifting drive part, lifting seat, rotary power part and rotating seat, and the lifting drive part and lifting seat connect
It connecing and its lifting can be driven to enter or deviate from the shield of top, the rotating seat, rotary power part are arranged on lifting seat,
Rotary power part connect with rotating seat and can drive its rotation, and the drop wax component is correspondingly arranged at shield side, drips wax group
Part includes drop wax device and driving force piece, the driving force piece with drip wax device connect and it can be driven to move horizontally with close or
Far from shield center；
The baking mechanism has baking box for toasting to the wafer after even wax；
Shaping Xun Bian mechanism is used to carry out shaping to the wafer after baking to seek side, including supporting table component and shaping
Side component is sought, the supporting table component for placing wafer, seek side component and be correspondingly arranged at supporting table component one by the shaping
Side, it includes actuator and rotary support seat that side component is sought in shaping, and the rotary support seat is correspondingly arranged at supporting table component side,
The actuator is connect with rotary support seat, and actuator can drive rotary support seat front and back, upper and lower and rotary motion, to prop up
Wafer on supporting table component simultaneously makes its rotation；
Patch plain film mechanism is fitted in ceramic disk for the wafer after shaping to be sought to side, and carries out to wafer
Plain film, the positioning table including being used to support and can drive ceramic disc spins, the overturning for being fitted in wafer on ceramic disk
Component and flat sheet modules for carrying out plain film to the wafer on ceramic disk, the overturning component is correspondingly arranged at positioning table
Side, including force piece, rotary shaft and sucker, the force piece and rotation axis connection, sucker is fixed on the rotary shaft, force piece
Rotary shaft and sucker or so, upper and lower and flip-flop movement can be driven, the flat sheet modules are correspondingly arranged above positioning table, including pressure
Tight actuator and compression air bag, compressing actuator can drive compression air bag to move up and down to flatten the wafer on ceramic disk, pressure
The ventable realization bulging of tight air bag；
The transfer robot arm is for shifting each wafer within the organization.
The working method of above-mentioned full-automatic wafer piece bottom sheet waxing, includes the following steps:
S1, shovel piece process, i.e.,
Under wafer on the ceramic disk that comes of previous process conveying is shoveled one by one, and the wafer under accommodating shovel one by one；
S2, ceramic disk store process, i.e.,
Ceramic disk after shovel piece is stored in tiered warehouse facility；
S3, ceramic disk cleaning process, i.e.,
Ceramic disk is cleaned；
S4, wafer patch process, i.e.,
After side, overturning are sought in wafer scrub drying, even wax, baking, shaping, it is fitted on ceramic disk；
S5, wafer plain film process, i.e.,
Wafer is flattened；
S6, ceramic disk and wafer transfering process, i.e.,
Ceramic disk and wafer are shifted and stored, to be sent into lower one of station.
The beneficial effects of the present invention are: full-automatic wafer piece bottom sheet waxing return wire and its working method, each device it
Between be fully automated cooperation, be not necessarily to any manual operation, greatly reduce the labour of worker, improve production efficiency, meanwhile,
Whole device carries out in dustfree environment, using multiple scrub, substantially increases the cleanliness of product, obtained homogeneity of product
Preferably, defect rate is lower, has a vast market foreground.
Detailed description of the invention:
Fig. 1 is the schematic perspective view of full-automatic wafer piece bottom sheet waxing return wire of the invention；
Fig. 2 is the structural schematic diagram of shovel piece unit and housing unit of the invention；
Fig. 3 is the structural schematic diagram of brush finish unit of the invention；
Fig. 4 is the structural schematic diagram of storage unit of the invention；
Fig. 5 is the structural schematic diagram of conveying robot of the invention；
Fig. 6 is the structural schematic diagram of roll-over unit of the invention；
Fig. 7 is the structural schematic diagram of cleaning unit of the invention；
Fig. 8 is the structural schematic diagram of overturning component of the invention；
Fig. 9 is the structural schematic diagram of patch plain film unit of the invention；
Figure 10 is the structural schematic diagram of scrub drying mechanism of the invention；
Figure 11 is the structural schematic diagram of Yun La mechanism of the invention；
Figure 12 is the structural schematic diagram of shaping Xun Bian mechanism of the invention；
Figure 13 is the structural schematic diagram of the supporting table component of shaping Xun Bian mechanism of the invention；
Figure 14 is the structural schematic diagram of patch plain film mechanism of the invention；
Figure 15 is the structural schematic diagram of overturning paster component of the invention.
Specific embodiment:
The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawing, so that advantages and features of the invention energy
It is easier to be understood by those skilled in the art, so as to make a clearer definition of the protection scope of the present invention.The present invention is mentioned
The direction term arrived, such as "upper", "lower", "front", "rear", "left", "right", "top", "bottom" etc. are only with reference to annexed drawings
Direction.Therefore, the direction term used is to illustrate and understand the present invention, rather than to limit the present invention.
Embodiment 1:
Full-automatic wafer piece bottom sheet as shown in Figure 1 is waxed return wire, including main conveyor line 10, is arranged on main conveyor line 10
Have shovel piece unit 1, housing unit 2, brush finish unit 3, storage unit 4, roll-over unit 5, cleaning unit 6, patch plain film unit 8,
Cooling unit 7 and buanch unit 9.
The main conveyor line 10 can be transported for conveying ceramic disk automatically with driving motor, conveying roller etc. automatically
Ceramic disk, hence into each station.
The wafer and ceramic disk of upper track station are delivered to automatically at shovel piece unit, and shovel piece unit is used for will be on ceramic disk
Under wafer slice bar, the housing unit of shovel piece unit side is used to receive the wafer under shovel piece unit shovel.
Shovel piece unit as shown in Figure 2 and housing unit.
The shovel piece unit includes shovel piece bracket 11, shovel piece force piece 12, sliding block 13 and shovel board 18, the shovel piece force piece
12 are fixed on shovel piece bracket 11, and shovel piece force piece 12 connect with shovel board 18 and can drive its movement, the shovel by sliding block 13
Plate 18 is tilted with horizontal plane, and 18 one end of shovel board and 13 bottom end of sliding block are hinged, passes through spring between 18 middle part of shovel board and sliding block 13
14 elastic connections can be rotated when 18 bottom end of shovel board is under pressure around sliding block 13, not resetted by spring 14 is passed through when pressure.Shovel piece
Rotating mechanism, positioning mechanism, elevating mechanism are also correspondingly arranged below unit, rotating mechanism includes rotary cylinder 16 and rotation
Disk, positioning mechanism includes lifting cylinder and locating wheel 17, and the side of shovel board 18 is also correspondingly arranged on inductor 15, works as ceramic disk
When being delivered to below shovel piece unit, lifting cylinder drives locating wheel 17 to rise, make three locating wheels 17 and ceramic plate edge against,
Realize the positioning of ceramic disk, and elevating mechanism can be such that ceramic disk one end rises, and heeling condition be formed, consequently facilitating shovel board 18
Shovel falls wafer above, and rotary cylinder 16 can drive rotation disc spins to drive entire ceramic disc spins, and inductor 15
Incude the position of wafer, so that shovel board 18 is made to receive signal, it one by one will be under wafer slice bar.
The housing unit includes slideway 21, storage box 25 and lifting drive part 24, and the slideway 21 is correspondingly arranged at shovel
Blade unit side shovels the wafer brought for receiving shovel piece unit, and wafer is sent into storage box 25, slideway 21 with
Horizontal plane tilts, and offers a plurality of water through water channel 22 in slideway 21, in water channel 22 can direct water flowing, can be to avoid wafer
Piece sticks in slideway 21, can not normally glide, to further glide convenient for wafer.The outlet end of slideway 21 is additionally provided with shelves
Bar 23, for stopping wafer, so as to be not in the feelings being stacked so that wafer serially enters in storage box 25
Condition.The storage box 25 is correspondingly arranged at the outlet end of slideway 21, and storage box 25 can be set to multiple, each storage box 25
For multilayered structure, more wafers piece can be stored, the lifting drive part 24 connect with storage box 25 and can drive its lifting.
When processing, the ceramic disk with more wafers piece enters below shovel piece unit, and locating wheel 17 positions it, inductor
15 sense wafer, and shovel piece force piece 12 drives sliding block 13 and shovel piece 18 oliquely downward to move at this time, by a corresponding Zhang Jing
Disk edge scoops up, and sliding block 13 continues downwards, and shovel piece 18, which is under pressure, to be rotated, and spring 14 is shunk, thus gradually by positive
Wafer scoops up, and is then fed into slideway 21, and shovel piece 18 retreats homing, and wafer enters storage box 25 by slideway 21
Card slot in, it is every storage one, lifting drive part 24 declines certain height, to one by one store shovel piece.
Since the ceramic panel surface after shovel piece contains impurity, brush finish list is set between shovel piece unit and housing unit
Member.
As shown in figure 3, the brush finish unit includes shaft 32, hairbrush 33, spray tube 34 and nozzle 35, the shaft 32 is
It is multiple, it is correspondingly arranged above and below the ceramic disk that main conveyor line passes through, multiple hairbrush 33 is respectively arranged in each shaft 32,
Spray tube 34 is one or more, is correspondingly arranged at the ceramic disk above and or below that main conveyor line passes through, on each spray tube 34
It is evenly equipped with multiple nozzles 35.And shaft 32 is connect with the driving motor 31 on main conveyor line by gear set, does not need in addition to increase
Adding power mechanism, for ceramic disk while transport, the rotation of shaft 32 carries out spray scrub to its upper and lower surfaces, using
Drying and processing.
Ceramic disk after scrub enters storage unit.Storage unit as shown in Figure 4, including conveying robot 41, transverse direction
Track 43, long rails 42 and tiered warehouse facility, the tiered warehouse facility are correspondingly arranged at the output end of shovel piece unit, for storing shovel
Ceramic disk after piece, tiered warehouse facility have multiple groups plugboard 44, are offered on each group plugboard 44 respectively between multiple be used for
Every the inserting groove 441 of placing ceramic disk, i.e., a pair of of plugboard 44 forms multiple inserting grooves 441, each inserting groove 441 from top to bottom
A ceramic disk inside can be stored, and inserting groove 441 has the groove to lower recess, ceramic disk is placed in groove, Bu Huicong
Abjection in inserting groove 441, and 44 side of plugboard is also correspondingly arranged on spray tube 45, spray tube 45 from top to bottom on be evenly equipped with spray
Mouth, i.e. each inserting groove 411 are correspondingly arranged a nozzle, can be sprayed to ceramic disk.The handling machinery
Hand 41 be arranged on long rails 42 and can 42 oscilaltion of track along longitudinal direction, long rails 42 setting on cross track 43 simultaneously
It can transversely track 43 move left and right, thus enable 41 all-around mobile of conveying robot, the ceramic disk after upper track is scrubbed
It is sent into inserting groove 441 by conveying robot 41, when it is desired to be used, then by one of work after the taking-up feeding of conveying robot 41
Position.
In addition, the present invention also designs conveying robot.Conveying robot as shown in Figure 5, including can be along rail
The mobile end plate 411 in road, the first driving cylinder 412, second being mounted on end plate 411 drive cylinder 413, the first guide rail 415,
Second guide rail 416, positioning plate 417, push plate 418, two second driving cylinders 413 are arranged in sliding slot 414, two second driving cylinders
413 are fixedly connected with push plate 418, and the telescopic rod of the second driving cylinder 413 is connect with positioning plate 417, and positioning plate 417 is U-shaped,
With 4 locating pieces 419, for positioning to ceramic disk, the telescopic rod of the first driving cylinder 412 is connect with push plate 418, and first leads
Rail 415 can be moved along 411 inner wall of end plate, and the second guide rail 416 can be moved along the first guide rail 415, and positioning plate 417 is fixed on
On two guide rails 416.Driving push plate 418 is mobile when the telescopic rod of first driving cylinder 412 stretches out, and drives the second driving cylinder 413
It is mobile along sliding slot 414, and the first guide rail 415 of drive is mobile along 411 inner wall of end plate, realizes that first time is flexible, when the first drive
When cylinder 412 of taking offence extends to maximum distance, the telescopic rod of two second driving cylinders 413 stretches out, and the second guide rail 416 is along the first guide rail
415 is mobile, so that positioning plate 417 be driven to stretch out, realizes second and stretches, then cooperate moving up and down i.e. for end plate 411
It can be moved on a large scale, consequently facilitating crawl or storage ceramic disk.
After conveying robot grabs the ceramic disk feeding main conveyor line in tiered warehouse facility, it is sent into roll-over unit, by ceramic disk
Carry out 90 degree of overturnings.Roll-over unit as shown in FIG. 6, including bracket 51, overturning force piece 53, rollover stand 52 and bracket 55, institute
It states rollover stand 52 to be arranged on bracket 51 and connect with overturning force piece 53, the bracket 55 is fixed on rollover stand 52, bracket
It is fixed with two supporting plates on 55, forms the channel for vertically holding up ceramic plate edge and it being avoided to fall, overturning between two supporting plates
Force piece 53 can drive rollover stand 52 that bracket 55 is driven to overturn.When ceramic disk is moved to roll-over unit, ceramic disk one end and fixed
Position plate 57 is against lever 56 is moved along guide rail 54 at this time, and the ceramic disk other end is pushed down, and realizes the positioning of ceramic disk, at this time
The lower general who has surrendered's ceramic disk of bracket 55 is pushed down, and the edge of two supporting plates of 55 one end of bracket and ceramic disk is against overturning power at this time
Part 53 stretches out, and drives entire rollover stand 52 along turning counterclockwise, until ceramic disk and horizontal plane are perpendicular, consequently facilitating subsequent
Cleaning manipulator grabs ceramic disk.
Unlike the prior art, the present invention is using vertical cleaning.Cleaning unit as shown in Figure 7, including it is clear
Washing trough 61, cleaning track 62 and cleaning manipulator, the rinse bath 61 have multiple, and the cleaning manipulator includes that planer-type moves
Dynamic bracket 65, lifting drive part 63 and tray 64, the tray 64 are a pair, and two trays 64 are fixed on 65 bottom end of movable support bracket,
The channel for vertically holding up ceramic plate edge and it being avoided to fall, i.e. tray 64 and movable support bracket 65 are formed between two trays 64
Between have an arc groove, ceramic disk bottom end is just embedded in arc groove, does not fall out.The structure of the tray 64 and overturning are single
Support board structure on the bracket of member is essentially identical.It should be noted that cleaning manipulator is two groups, one group to ultrasonic wave for putting
It sets and is sent into ceramic disk in slot, for taking out ceramic disk out of ultrasonic wave placing groove, two groups match to improve cleaning another set
Efficiency.
After roll-over unit overturns ceramic disk, force piece driving previous group cleaning manipulator is moved to along cleaning track 62
Corresponding position, lifting drive part 63 drive movable support bracket 65 and tray 64 to decline, when dropping under the ceramic disk on roll-over unit
Fang Shi, force piece driving cleaning manipulator continue to move along cleaning track 62, ceramic disk are moved closer to, then on movable support bracket 65
It rises, then ceramic disk is embedded in two trays 64, to hold up ceramic disk, then previous group cleaning manipulator passes through laterally longitudinal movement
Ceramic disk is sent into ultrasonic wave placing groove and carries out ultrasonic cleaning.After the completion of cleaning, later group cleaning manipulator be can be taken off
Ceramic disk is simultaneously sent into next station.
Since the ceramic disk of the cleaning machinery after cleaning on hand is plumbness, it is additionally provided with and turns on main conveyor line
Turn component 50, is turn 90 degrees for turning over the ceramic disk after cleaning, it is made to be changed into horizontality.Overturning component as shown in Figure 8,
Including push cylinder 501, rotating plate 502, sliding seat 503, bottom positioning plate 504 and side positioning plate 505, push cylinder 501 stretches
Bar is connect with rotating plate 502, and push cylinder 501 can drive pushing plate 501 to realize 90 degree of overturnings, and sliding seat 503 is two, and setting exists
It can move on the guide rail of rotating plate 502 and along guide rail, side positioning plate 505 and bottom positioning plate are respectively fixed on two sliding seats 501
504.When the cleaning manipulator of cleaning unit is moved to above overturning component, the decline of cleaning machinery hand-motion ceramic disk, ceramics
Pan bottom, which is just inserted into the groove of two bottom positioning plates 504, realizes bottom positioning, and then force piece drives two sliding seats 503 and side
Positioning plate 505 moves inward simultaneously, by two side positionings of ceramic disk, realizes the clamping positioning of ceramic disk entirety, pushes gas at this time
The telescopic rod of cylinder 501 stretches out, and pushes rotating plate 502 that ceramic disk is driven to be rotated by 90 °, and gradually push forward, drops to ceramic disk
On the supporting bable tops of lower section.And supporting bable tops are Liftable type, convenient for the transfer of subsequent ceramic disk.
In addition, be additionally provided with transfer assembly on main conveyor line, for the transfer of subsequent ceramic disk, including Mobile base 507, lead
Rail 508, supporting block 506 and connecting rod 509, Mobile base 507 can be moved along guide rail 508, and connecting rod 509 is fixed on Mobile base 507, even
Bar both ends are respectively fixed with supporting block 506.After ceramic disk overturning after cleaning, supporting bable tops drive ceramic disk to rise, mobile
Seat 507 is moved at supporting bable tops, and two supporting blocks 506 are located at below ceramic disk, and supporting bable tops decline at this time, then ceramic disk is fallen on
In two supporting blocks 506, and it is provided with several locating wheels in supporting block 506, ceramic disk positioning is transferred to next station.Afterwards
Continuous main conveyor line is provided with multiple above-mentioned transfer assembly, and mounting means can be used laterally or longitudinally.
Followed by the most important paster technique of progress.Patch plain film unit of the invention includes chip unit and plain film list
Member.Patch plain film unit as shown in Figure 9, including bearing basket fixed mechanism 81, scrub drying mechanism 83, Yun La mechanism 85, baking
Roasting mechanism 84, shaping Xun Bian mechanism 86, patch plain film mechanism 87 and transfer robot arm 82.
The bearing basket fixed mechanism is provided with multiple bearing baskets for positioning bearing basket and fixes for loading wafer
Station, each station are plugged with more wafers piece.
The scrub drying mechanism is for carrying out scrub drying to wafer, as shown in Figure 10, including locating platform component
And brush assemblies, the locating platform component include rotating electric machine 834, lifting cylinder 838, rotating platform 835 and sucker, it is described
Sucker is fixed on rotating platform 835, and the rotating platform 835 is connect with rotating electric machine 834, and rotating electric machine 834 can drive rotation
Turn platform 835 and sucker rotation, the lifting cylinder 838 can drive the protective cover outside rotating platform 835 to go up and down, to avoid cleaning
Liquid splashes.The brush assemblies include brush 833, brush driving motor 831, brush swing motor 837, rocker arm 832, rocker arm liter
Sending down abnormally ascending cylinder 839 and scrub slot 836, the brush 833 are correspondingly arranged above sucker, and brush 833 and brush driving motor 831 connect
Connect, the brush driving motor 831 can drive 833 axial-rotation of brush, the brush swing motor 837 by rocker arm 832 with
Brush 833 connects, and brush swing motor 837 can drive rocker arm 832 and brush 833 to wave, and the radial up-down cylinder 839 can drive
Dynamic brush swing motor 837 and rocker arm 832 are gone up and down, and the scrub slot 836 is correspondingly arranged at 833 side of brush.When wafer is sent
When entering scrub drying mechanism, sucker adsorbs wafer, and brush 833 can be scrubbed after scrub slot 836 gets wet, electric rotating
Machine 834 drives rotating platform 835 and wafer rotation, brush swing motor 837 that rocker arm 832 and brush 833 is driven to wave simultaneously,
The two cooperation, can scrub clean completely wafer surface.It should be noted that the present invention devises two sets of scrub dryers
Structure, to improve processing efficiency.
The Yun La mechanism is for uniformly waxing to wafer surface, as shown in figure 11, including gets rid of wax component and drop wax group
Part gets rid of wax component with turntable 854, and turntable 854 is connect with rotating electric machine, and drop wax component has drop wax device 852, drips wax device
852 connect with cylinder 851, and the drop wax device 852 is correspondingly arranged at 854 top of turntable, and Yun La mechanism further includes lifting cylinder
855, lifting cylinder 855 can drive turntable 854 to go up and down.When wafer is sent into Yun La mechanism, turntable 854 is received and is adsorbed
Wafer, lifting cylinder 855 drive turntable 854 to ascend into sleeve 853, and sleeve 853 can fly to avoid wax oil when even wax
It splashing, cylinder 851 stretches out at this time, makes to drip the top that wax device 852 is moved to wafer center, carries out drop wax, and turntable starts to rotate,
To make wafer surface uniformly be covered with wax.
The baking mechanism is for toasting the wafer after even wax, using conventional oven.
Shaping Xun Bian mechanism is used to carry out shaping to the wafer after baking to seek side.As shown in figure 12, it including supports
Side component is sought in platform component 867 and shaping, and the supporting table component 867 for placing wafer, seek side component and be used for by the shaping
Shaping is carried out to wafer and seeks side.
It includes actuator and rotary support seat 866 that side component is sought in the shaping, and the rotary support seat 866 is correspondingly arranged at
Supporting table component side, the actuator are connect with rotary support seat 866, actuator can drive the front and back of rotary support seat 866, on
Lower and rotary motion, to prop up the wafer on supporting table component and make its rotation, the actuator includes the first sliding rail
861, the first sliding block 862, the first cylinder 863, first lifting seat 864 and motor 865, first sliding block 862 are arranged first
It can slide on sliding rail 861 and along the first sliding rail 861, first cylinder 863 is fixed on the first sliding block 862, the first cylinder 863
It is connect with first lifting seat 864, the first cylinder 863 can drive first lifting seat 864 to move up and down, and the motor 865 is fixed on
In first lifting seat 864, the rotary support seat 866 is arranged on 865 top of motor, and motor 865 can drive rotary support seat 866
Rotation.
Supporting table component as shown in fig. 13 that, including bracket 8671, supporting table 8672, rotary drive 8674 and locating clip
Pawl 8673, the supporting table 8672 are fixed on 8671 top of bracket, and supporting table 8672 is an annular structure, and diameter is slightly less than
The diameter of wafer, 8672 center of supporting table have through-hole, pass through for sucker or rotary support seat, the positioning clamping jaw 8673
For a pair, respectively corresponds setting and be respectively equipped with arc groove, arc on 8672 two sides of supporting table, the opposite face of two positioning clamping jaws 8673
Shape slot is corresponding with the radian of wafer, and the rotary drive 8674 is connect with two positioning clamping jaws 8673, rotary drive
8674 can drive two positioning clamping jaws 8673 while rotate, with the wafer in clamp or release supporting table 8672.
When processing, manipulator send wafer to supporting table 8672, two positioning clamping jaw of the driving of rotary drive 8674
8673 rotate inward simultaneously, and wafer can be drawn close realization positioning toward center by two positioning clamping jaws 8673；Then the first sliding block 862
The first cylinder 863, first lifting seat 864 and motor 865 is driven to move forward, under so that rotary support seat 866 is located at wafer just
Side, the first cylinder 863 drive first lifting seat 864, motor 865 and rotary support seat 866 to rise, wafer are jacked up, at this time
Motor 865 drives rotary support seat 866 and wafer slowly to rotate, and the inductor of side setting can incude lacking for wafer
Mouthful, when which rotates to fixed position, inductor issues signal, and motor 865 stops rotating, and first lifting seat 864 declines, brilliant
Disk returns in supporting table 8672, and shaping seeks side component and returns to original position.
Above-mentioned each process shifts each wafer within the organization by transfer robot arm, and transfer robot arm is first using our company
The transfer robot arm structure of application.
Need to carry out patch plain film processing after shaping plain film.
Patch plain film mechanism as shown in figure 14, including mounting platform 871 and be arranged on mounting platform 871 for branch
Support and can drive the positioning tables 872 of ceramic disc spins, the overturning paster component 873 for being fitted in wafer on ceramic disk,
For carrying out the flat sheet modules of plain film to the wafer on ceramic disk.
Overturning paster component as shown in figure 15, including force piece, rotary shaft 8736 and sucker 8737, the sucker 8737
It is correspondingly arranged at supporting table component side, the force piece is connect with rotary shaft 8736, and sucker 8737 is fixed on rotary shaft 8736
On, force piece can drive rotary shaft 8736 and sucker 8737 or so, upper and lower and flip-flop movement, to adsorb wafer and turn over it
Turn, the force piece includes the second sliding rail 8731, the second sliding block 8732, the second cylinder 8733, the second lifting seat 8734 and rotation
Cylinder 8735, second sliding block 8732 are arranged on the second sliding rail 8731 and can slide along the second sliding rail 8731, described second
Cylinder 8733 is fixed on the second sliding block 8732, and the second cylinder 8733 is connect with the second lifting seat 8734, and the second cylinder 8733 can
The second lifting seat 8734 is driven to move up and down, the rotary cylinder 8735 is fixed on the second lifting seat 8734, rotary cylinder
8735 connect with rotary shaft 8736 and can drive 8736 axial-rotation of rotary shaft.
The flat sheet modules are correspondingly arranged at 872 top of positioning table, including compress actuator 874 and compress air bag 875, pressure
Tight actuator 874 can drive compression air bag 875 to move up and down to flatten the wafer on ceramic disk, and compress air bag 875 and gas
Road connection, it is ventable to realize gradually bulging.
It is evenly distributed with around the positioning table 872 multiple for positioning the positioning component of ceramic disk.
When processing, the second sliding block 8732 drives the second cylinder 8733, the second lifting seat 8734 and rotary cylinder 8735 mobile,
It is located at sucker 8737 below wafer, the second cylinder 8733 drives the second lifting seat 8734, rotary cylinder 8735 and sucker
8737 rise, and wafer can be adsorbed, wafer is moved on positioning table 872 by the second sliding block 8732 by sucker 8737
Above ceramic disk, rotary cylinder 8735 drives wafer to overturn 180 degree at this time, so that it is coated with the one of glue downwards, the second last
Cylinder 8733, which drives sucker 8737 to move down, is fitted in wafer on ceramic disk, completes a patch；After patch, two positioning
Component 876 moves inward, and ceramic disk is positioned；After positioning, compresses the driving of actuator 874 and compress the decline of air bag 875, to compression gas
The inflation of capsule 875 carries out multiple bulging, to complete a plain film to the multiple plain film of the wafer of lower section；After plain film, positioning table
872 drive ceramic disk etc. point rotation, can carry out another secondary patch plain film, and so on, crystalline substance is partially sticked on ceramic disk
Disk.
Ceramic disk and wafer after plain film are sent into buanch unit 9 and are stacked after the cooling unit 7 of main conveyor line is cooling
Transfer.
Embodiment 2:
On the basis of embodiment 1, the present embodiment 2 provides a kind of working method of full-automatic wafer piece bottom sheet waxing, packet
Include following steps:
S1, shovel piece process, i.e.,
Under wafer on the ceramic disk that comes of previous process conveying is shoveled one by one, and the wafer under accommodating shovel one by one；
S2, ceramic disk store process, i.e.,
Ceramic disk after shovel piece is stored in tiered warehouse facility；
S3, ceramic disk overturn process, i.e.,
Ceramic disk is subjected to 90 degree of overturnings；
S4, ceramic disk cleaning process, i.e.,
Vertical cleaning is carried out to ceramic disk；
S5, wafer patch process, i.e.,
After side, overturning are sought in wafer scrub drying, even wax, baking, shaping, it is fitted on ceramic disk；
S6, wafer plain film process, i.e.,
Wafer is flattened；
S7, ceramic disk and wafer transfering process, i.e.,
Ceramic disk and wafer are shifted and stored, to be sent into lower one of station.
Process, ceramic disk cleaning process, wafer patch are overturn about shovel piece process, ceramic disk storage process, ceramic disk
Component involved in process, wafer plain film process, ceramic disk and wafer transfering process is shown in that the related of embodiment 1 is discussed.
In all examples being illustrated and described herein, any occurrence should be construed as merely illustratively, without
It is as limitation, therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In addition, in the description of the embodiment of the present invention unless specifically defined or limited otherwise, term " installation ", " phase
Even ", " connection ", " setting ", " being equipped with " etc. shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to detachably connect
It connects, or is integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, intermediate matchmaker can also be passed through
Jie is indirectly connected, and can be the connection inside two elements.It for the ordinary skill in the art, can be with concrete condition
Understand the concrete meaning of above-mentioned term in the present invention.
Actuator, force piece of the invention etc. can be the replacement of the associated powers element such as cylinder, electric cylinders, motor, oil cylinder,
Corresponding link mechanism can also be used and realize power output, it is not limited to its title or structure.
The relevant position of each unit or component of the invention is all provided with sensor, alarm, the induction of optoelectronic switch class
Part guarantees the continuous effective of production.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", " vertical ",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.
Claims (10)
- The return wire 1. a kind of full-automatic wafer piece bottom sheet is waxed, including main conveyor line, the main conveyor line for conveying pottery automatically Porcelain dish, it is characterised in that: shovel piece unit, housing unit, storage unit, cleaning unit, patch are provided on the main conveyor line Plain film unit and buanch unit；The shovel piece unit is used for will be under the wafer slice bar on ceramic disk；The housing unit is correspondingly arranged at shovel piece unit side, for receiving the wafer under shovel piece unit shovel；The storage unit is correspondingly arranged at the output end of shovel piece unit, for storing the ceramic disk for shoveling lower wafer；The cleaning unit is correspondingly arranged at the output end of storage unit, for receiving the ceramic disk in storage unit and to ceramics Disk carries out vertical cleaning；The patch plain film unit is correspondingly arranged at the output end of cleaning unit, for wafer to be fitted in the ceramics cleaned On disk, and plain film shaping is carried out to the wafer after patch；The buanch unit is correspondingly arranged at the output end of plain film unit, for shifting and storing ceramic disk and wafer after plain film Piece.
- The return wire 2. full-automatic wafer piece bottom sheet according to claim 1 is waxed, it is characterised in that: the shovel piece unit packet Shovel piece bracket, shovel piece force piece, sliding block and shovel board are included, the shovel piece force piece is fixed on shovel piece bracket, and shovel piece force piece is logical It crosses sliding block and its movement is connect and can driven with shovel board, the shovel board is tilted with horizontal plane, and shovel board one end and sliding block bottom end are hinged, Can be rotated around sliding block when shovel board is under pressure between sliding block by spring connection in the middle part of shovel board, not by pressure when pass through Spring reset.
- The return wire 3. full-automatic wafer piece bottom sheet according to claim 2 is waxed, it is characterised in that: the housing unit packet Slideway, storage box and lifting drive part are included, the slideway is correspondingly arranged at shovel piece unit side, send for receiving shovel piece unit shovel The wafer to come over, and wafer is sent into storage box, slideway is tilted with horizontal plane, and water channel is offered in slideway, described Storage box is correspondingly arranged at the outlet end of slideway, and storage box is multilayered structure, and the lifting drive part connect with storage box and can Drive its lifting.
- The return wire 4. full-automatic wafer piece bottom sheet according to claim 1 is waxed, it is characterised in that: the shovel piece unit with Brush finish unit is additionally provided between housing unit, the brush finish unit includes shaft, hairbrush spray tube and nozzle, and the shaft is It is multiple, it is correspondingly arranged at the ceramic disk above and or below that main conveyor line passes through, is respectively arranged with multiple hairbrush in each shaft, The spray tube be it is multiple, be correspondingly arranged at the ceramic disk above and or below that main conveyor line passes through, be evenly equipped on each spray tube Multiple nozzles.
- The return wire 5. full-automatic wafer piece bottom sheet according to claim 1 is waxed, it is characterised in that: the storage unit packet Conveying robot, track and tiered warehouse facility are included, the tiered warehouse facility is correspondingly arranged at the output end of shovel piece unit, for storing shovel Ceramic disk after piece, tiered warehouse facility have multiple groups plugboard, offer multiple intervals that are used on each group plugboard respectively and put The inserting groove of ceramic disk is set, the conveying robot setting is in orbit and along track oscilaltion or can move left and right, and is used for Grab shovel piece after ceramic disk and by ceramic disk be sent into or take out tiered warehouse facility.
- The return wire 6. full-automatic wafer piece bottom sheet according to claim 1 is waxed, it is characterised in that: the cleaning unit packet Rinse bath, cleaning track and cleaning manipulator are included, the cleaning manipulator is arranged on cleaning track and can be along cleaning track Lower lifting moves left and right, the ceramic disk for being sent into or taking out in rinse bath, and cleaning manipulator includes movable support bracket and tray, The tray is a pair, and two trays are fixed on movable support bracket bottom end, are formed between two trays for vertically holding up ceramic plate edge And the channel for avoiding it from falling.
- The return wire 7. full-automatic wafer piece bottom sheet according to claim 6 is waxed, it is characterised in that: the storage unit with Roll-over unit is additionally provided between cleaning unit, the ceramic disk for storage unit conveying to come is overturn, including bracket, overturning Force piece, rollover stand and bracket, the rollover stand are arranged on bracket and connect with overturning force piece, and the bracket, which is fixed on, to be turned over It is fixed with two supporting plates on pivoted frame, on bracket, is formed between two supporting plates for vertically holding up ceramic plate edge and it being avoided to fall Channel, overturning force piece can drive rollover stand to drive bracket overturning, so that ceramic disk be made to overturn.
- The return wire 8. full-automatic wafer piece bottom sheet according to claim 1 is waxed, it is characterised in that: the patch plain film list Member includes bearing basket fixed mechanism, scrub drying mechanism, Yun La mechanism, baking mechanism, shaping Xun Bian mechanism, patch plain film mechanism And transfer robot arm；The bearing basket fixed mechanism is provided with multiple for positioning the bearing basket regular worker of bearing basket for loading wafer Position；The scrub drying mechanism is described for carrying out scrub drying, including locating platform component and brush assemblies to wafer Locating platform component includes rotary power part, rotating platform, sucker, lifting drive part, lifting seat and protective cover, and the sucker is solid Fixed the rotating platform is connect with rotary power part on the rotating platform, and rotary power part can drive rotating platform and sucker to revolve Turn, the protective cover is set in outside rotating platform, and protective cover is fixed on lifting seat, and the lifting drive part and lifting seat connect It connecing, lifting drive part can drive lifting seat and protective cover oscilaltion, so that rotating platform is made to enter or deviate from protective cover, it is described Brush assemblies include brush, brush actuator, brush swinging driving part, rocker arm and radial up-down actuator, and the brush is corresponding It is arranged above sucker and is fixedly connected with brush rocker arm, brush is connect with brush force piece, and the brush force piece can drive Brush axial-rotation, the brush swinging driving part are connect with rocker arm, and brush swinging driving part can drive rocker arm and brush to wave, The radial up-down actuator is connect with brush swinging driving part, and radial up-down actuator can drive brush swinging driving part liter Drop；The Yun La mechanism is used to uniformly wax to wafer surface, including gets rid of wax component and drop wax component, described to get rid of wax component Including shield, lifting drive part, lifting seat, rotary power part and rotating seat, the lifting drive part is connect simultaneously with lifting seat Its lifting can be driven to enter or deviate from the shield of top, the rotating seat, rotary power part are arranged on lifting seat, rotation Force piece connect with rotating seat and can drive its rotation, and the drop wax component is correspondingly arranged at shield side, drips wax component packet Include drop wax device and driving force piece, the driving force piece with drip wax device connect and it can be driven to move horizontally with close to or far from Shield center；The baking mechanism has baking box for toasting to the wafer after even wax；Shaping Xun Bian mechanism is used to carry out shaping to the wafer after baking to seek side, including side is sought in supporting table component and shaping Component, the supporting table component for placing wafer, seek side component and be correspondingly arranged at supporting table component side, whole by the shaping It includes actuator and rotary support seat that shape, which seeks side component, and the rotary support seat is correspondingly arranged at supporting table component side, described Actuator is connect with rotary support seat, and actuator can drive rotary support seat front and back, upper and lower and rotary motion, to prop up support Wafer on platform component simultaneously makes its rotation；Wafer of the patch plain film mechanism for after shaping to be sought to side is fitted in ceramic disk, and carries out to wafer flat Piece, the positioning table including being used to support and can drive ceramic disc spins, the overturning group for being fitted in wafer on ceramic disk Part and flat sheet modules for carrying out plain film to the wafer on ceramic disk, the overturning component is correspondingly arranged at positioning table one Side, including force piece, rotary shaft and sucker, the force piece and rotation axis connection, sucker is fixed on the rotary shaft, and force piece can Rotary shaft and sucker or so, upper and lower and flip-flop movement are driven, the flat sheet modules are correspondingly arranged above positioning table, including are compressed Actuator and compression air bag, compressing actuator can drive compression air bag to move up and down to flatten the wafer on ceramic disk, compress The ventable realization bulging of air bag；The transfer robot arm is for shifting each wafer within the organization.
- The return wire 9. full-automatic wafer piece bottom sheet according to claim 1 is waxed, it is characterised in that: on the main conveyor line It is additionally provided with cooling unit, the cooling unit is correspondingly arranged at the output end of patch plain film unit, after cold patch Wafer.
- 10. a kind of working method of full-automatic wafer piece bottom sheet waxing, described in any item full-automatic using such as claim 1-9 Wafer bottom sheet waxing return wire, which comprises the steps of:S1, shovel piece process, i.e.,Under wafer on the ceramic disk that comes of previous process conveying is shoveled one by one, and the wafer under accommodating shovel one by one；S2, ceramic disk store process, i.e.,Ceramic disk after shovel piece is stored in tiered warehouse facility；S3, ceramic disk cleaning process, i.e.,Ceramic disk is cleaned；S4, wafer patch process, i.e.,After side, overturning are sought in wafer scrub drying, even wax, baking, shaping, it is fitted on ceramic disk；S5, wafer plain film process, i.e.,Wafer is flattened；S6, ceramic disk and wafer transfering process, i.e.,Ceramic disk and wafer are shifted and stored, to be sent into lower one of station.
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| CN112540514A (en) * | 2020-12-17 | 2021-03-23 | 中国电子科技集团公司第十三研究所 | Developing apparatus |
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| CN114388368A (en) * | 2022-01-12 | 2022-04-22 | 杭州承扬自动化科技有限公司 | Wafer wax pasting implementation method |
| CN114361081A (en) * | 2022-01-12 | 2022-04-15 | 杭州承扬自动化科技有限公司 | Full-automatic wafer pastes wax machine |
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| CN117457548A (en) * | 2023-12-22 | 2024-01-26 | 北京特思迪半导体设备有限公司 | Wafer paster device and wafer waxless polishing feeding equipment |
| CN117457547A (en) * | 2023-12-22 | 2024-01-26 | 北京特思迪半导体设备有限公司 | Wafer wax-free polishing pretreatment mechanism and feeding equipment |
| CN117457567A (en) * | 2023-12-22 | 2024-01-26 | 北京特思迪半导体设备有限公司 | Wafer waxless polishing feeding equipment and flexible sucker thereof |
| CN117457567B (en) * | 2023-12-22 | 2024-03-01 | 北京特思迪半导体设备有限公司 | Wafer waxless polishing feeding equipment and flexible sucker thereof |
| CN117457547B (en) * | 2023-12-22 | 2024-03-22 | 北京特思迪半导体设备有限公司 | Wafer wax-free polishing pretreatment mechanism and feeding equipment |
| CN117457548B (en) * | 2023-12-22 | 2024-03-22 | 北京特思迪半导体设备有限公司 | Wafer paster device and wafer waxless polishing feeding equipment |
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