CN110379756A - Full-automatic wafer piece bottom sheet waxing return wire and its working method - Google Patents

Abstract

The invention relates to a full-automatic waxing and reflow line for wafer lower wafers and its working method, comprising a main conveying line, which is used to automatically convey ceramic disks, and the main conveying line is provided with a shovel unit, The storage unit, the storage unit, the cleaning unit, the patch unit, the flat sheet unit and the transfer unit, through the shoveling process, the ceramic plate storage process, the ceramic plate flipping process, the ceramic plate cleaning process, the wafer mounting process, and the wafer leveling process. Chip process, ceramic disc and wafer transfer process to complete the processing. The fully automatic waxing and reflow line for unloading wafers and its working method are fully automatic and cooperate with each other without any manual operation, which greatly reduces the labor force of workers and improves production efficiency. At the same time, the entire device operates in a dust-free environment. It is carried out in the middle of the process, and the cleanliness of the product is greatly improved by using multiple brushes. The obtained product has better consistency and a lower defective rate, which has broad market prospects.

Description

Fully automatic wafer unloading waxing reflow line and its working method

Technical field:

The invention relates to the technical field of electronic product processing, in particular to a full-automatic waxing and reflow line for wafer lower wafers and a working method thereof.

Background technique:

The demand for installed capacity in China's semiconductor market is growing rapidly, labor shortages, and rising labor costs have led to an increase in manufacturers' demand for automation equipment, which has a significant effect on reducing production costs and improving product yield.

Existing wafers (sapphire wafers, silicon wafers, etc.) require multiple processes during processing, such as cleaning, gluing, patching, shoveling, and storage. However, in the prior art, the mounting, cleaning, and shoveling of wafers, as well as the cleaning and storage of ceramic discs, etc., are generally carried out on different equipment, and workers are required to transfer or carry them during processing. Labor force, and due to the high requirements on the surface of the wafer, collisions or dust on the surface of the wafer cannot be avoided during the transfer process, thus affecting product quality.

For example, the company's patent No. CN104759974A is a fully automatic placement machine, which can realize automatic placement, but the pre-order processing, storage and post-mounting processing of ceramic discs are all in other equipment. It requires continuous transfer of staff, which affects processing efficiency and cannot realize truly fully automated production.

Invention content:

How to integrate a fully automatic chip placement and reflow line, from the original semi-automation to the real full automation, without any manual operation in the processing process, is a difficult point that needs to be solved. At the same time, how to optimize the entire production line so that the finished products of wafers have better consistency, lower defective rate, and dust-free is another problem that needs to be solved. In addition, in order to reduce the use of the site, avoiding the use of complex robot mechanisms is also a problem that needs to be solved. Among these problems, how to automatically position, grasp, flip, transfer, and correct deviations for each station needs to be solved.

Therefore, according to these problems, the present invention has designed a kind of automation degree height, can reduce the labor power of worker, reduce production cost, production efficiency is higher, process safe and dust-free full-automatic wafer lower chip waxing reflow line and its work method.

The present invention is realized through the following technical scheme: a fully automatic wafer lower wafer waxing reflow line, including a main conveying line, the main conveying line is used for automatically conveying ceramic discs, and a shovel is arranged on the main conveying line film unit, storage unit, storage unit, cleaning unit, patch flat film unit and transfer unit;

The shovel unit is used to shovel off the wafer on the ceramic disc;

The storage unit is correspondingly arranged on one side of the shovel unit for receiving the wafers shoveled by the shovel unit;

The storage unit is correspondingly arranged at the output end of the shoveling unit, and is used for storing the ceramic disk for shoveling the wafer;

The cleaning unit is correspondingly arranged at the output end of the storage unit, and is used for receiving the ceramic disk in the storage unit and cleaning the ceramic disk vertically;

The chip-mounting unit is correspondingly arranged at the output end of the cleaning unit, and is used for attaching the wafer to the cleaned ceramic disc, and performing flat-chip shaping on the wafer after the chip is mounted;

The transfer unit is correspondingly arranged at the output end of the flat sheet unit, and is used for transferring and storing the flat ceramic discs and wafers.

The first thing to consider is the problem of shoveling (downloading) of wafers after placement. In the prior art, after the wafer is pasted with a ceramic plate on the placement machine, it is generally transferred to other equipment for manual dismantling, which is not only inefficient, but also easily damages the shovel.

Therefore, the present invention has designed a special blade unit, and the blade unit includes a blade bracket, a blade power part, a slider and a blade plate, and the blade power part is fixed on the blade bracket, and the blade power part The slider is connected with the shovel plate and can be driven to move. The shovel plate is inclined to the horizontal plane. One end of the shovel plate is hinged to the bottom end of the slider. The middle part of the shovel plate is elastically connected to the slider. Can rotate around the slider and return by spring when no pressure is applied.

After shoveling, how to store the finished product is also a technical problem that needs to be solved.

The present invention designs a special storage unit. The storage unit includes a slideway, a storage box and a lifting power part. The slideway is correspondingly arranged on one side of the shovel unit for receiving the wafers sent by the shovel unit, and Send the wafer into the storage box. The slideway is inclined to the horizontal plane. There is a waterway in the slideway. The storage box is correspondingly arranged at the exit end of the slideway. The storage box is a multi-layer structure. The box is connected and can be driven up and down.

In order to clean the surface of the ceramic disc after the shovel, a brush surface unit is also provided between the shovel unit and the storage unit, the brush surface unit includes a rotating shaft, a brush spray pipe and a nozzle, and the rotating shaft is a plurality of , correspondingly arranged above and/or below the ceramic disk that the main conveying line passes through, a plurality of brushes are respectively arranged on each rotating shaft, and there are a plurality of spray pipes, correspondingly arranged above and/or above the ceramic disk passing through the main conveying line Or below, there are multiple nozzles evenly distributed on each spray pipe, and the surface brushing unit can clean the two surfaces of the ceramic plate, so as to ensure subsequent preservation.

In the prior art, the ceramic discs after shoveling are generally stored separately.

In order to solve this technical problem, the present invention adds a ceramic disk storage unit in the entire return line, and the storage unit includes a handling manipulator, a track, and a three-dimensional warehouse, and the three-dimensional warehouse is correspondingly arranged at the output end of the shovel unit. For storing the ceramic discs after the shovels, the three-dimensional warehouse has multiple sets of plug-in boards, and each set of plug-in boards is respectively provided with a plurality of plug-in slots for placing the ceramic discs at intervals, and the handling manipulator is set on the track It can also move up and down along the track or move left and right to grab the ceramic disc behind the shovel and send the ceramic disc into or out of the three-dimensional warehouse.

In the prior art, there are many kinds of devices for cleaning ceramic discs, but the cleaning method in the process of conveying the ceramic discs in the return line generally adopts the "horizontal cleaning" method, that is, the ceramic discs are sent horizontally into the cleaning device for cleaning. Ultrasonic cleaning, this cleaning method not only takes up a lot of space, but the cleaning efficiency is poor, and impurities are still easy to remain on the upper surface of the ceramic disc.

Therefore, the present invention designs a special "vertical" cleaning unit. The cleaning unit includes a cleaning tank, a cleaning track and a cleaning manipulator. There are multiple cleaning tanks. Or move left and right to send or take out the ceramic disc in the cleaning tank. The cleaning manipulator includes a moving bracket and a bracket. The brackets are a pair. The two brackets are fixed at the bottom of the moving bracket. A channel is formed between them to support the edge of the ceramic disc vertically and prevent it from falling.

In order to realize vertical cleaning, it is necessary to turn over the ceramic plate before cleaning, so there is also a turning unit between the storage unit and the cleaning unit, including a bracket, a turning power part, a turning frame and a bracket, and the turning frame is arranged on the bracket and connected with the turning power part, the bracket is fixed on the turning frame, and two supporting plates are fixed on the supporting plate, and a passage for vertically supporting the edge of the ceramic plate and preventing it from falling is formed between the two supporting plates. The power part can drive the turning frame to drive the bracket to turn over, so that the ceramic disc turns over.

Then there is the relatively important chip mounter unit. The fully automatic chip mounter that our company applied for earlier has also designed a related chip mounter unit, but its function is not perfect. Therefore, the present invention designs a patch unit with more complete functions, which integrates the scrubbing and drying mechanism of the wafer, the shaping edge-seeking mechanism and the patching flat mechanism.

In addition, since the wafer after placement cannot be guaranteed to be completely bonded to the ceramic disc, flat wafering is required after placement. The flat chip of the fully automatic placement machine that our company applied for earlier adopts the compression power part, that is, the flat chip (chip) is carried out by ordinary pressure. The flat chip effect of this flat chip method is not ideal.

The patch and plain film unit includes a loading basket fixing mechanism, a scrubbing and drying mechanism, a wax spreading mechanism, a baking mechanism, a plastic edge seeking mechanism, a patch plain film mechanism and a transfer manipulator;

The carrying basket fixing mechanism is used for loading wafers, and is provided with a plurality of carrying basket fixing stations for positioning the carrying basket;

The scrubbing and drying mechanism is used for scrubbing and drying the wafer, and includes a positioning platform assembly and a brushing assembly. The positioning platform assembly includes a rotating power part, a rotating platform, a suction cup, a lifting power part, a lifting seat and a protective cover. The suction cup is fixed on the rotating platform, the rotating platform is connected with the rotating power part, the rotating power part can drive the rotating platform and the suction cup to rotate, the protective cover is set outside the rotating platform, and the protective cover is fixed on the lifting seat, so The lifting power part is connected with the lifting seat, and the lifting power part can drive the lifting seat and the protective cover up and down, so that the rotating platform enters or escapes from the protective cover. The brushing assembly includes a brush plate, a brush plate driving part, and a brush plate swing power part , the rocker arm and the rocker lifting drive part, the brush plate is correspondingly arranged above the suction cup and fixedly connected with the brush plate rocker arm, the brush plate is connected with the brush plate power part, and the brush plate power part can drive the brush plate to rotate axially , the brush plate swing power part is connected with the rocker arm, the brush plate swing power part can drive the rocker arm and the brush plate to swing, the rocker arm lift drive part is connected with the brush plate swing power part, and the rocker arm lift drive part can drive the brush The lifting of the power part of the disk swing;

The wax spreading mechanism is used to uniformly apply wax to the surface of the wafer, and includes a wax throwing assembly and a wax dripping assembly. The wax throwing assembly includes a protective cover, a lifting power part, a lifting seat, a rotating power part and a rotating seat. The lifting power part is connected with the lifting seat and can drive it up and down to enter or escape from the protective cover above. The rotating seat and the rotating power part are arranged on the lifting seat, and the rotating power part is connected with the rotating seat and can drive it to rotate. The wax drip assembly is correspondingly arranged on one side of the protective cover. The wax drip assembly includes a wax dripper and a driving power part. The driving power part is connected with the wax dripper and can drive it to move horizontally to approach or move away from the center of the protective cover;

The baking mechanism is used to bake the wafers after waxing, and has a baking oven;

The shaping and edge-seeking mechanism is used for shaping and edge-seeking the baked wafer, and includes a support table assembly and a shaping edge-seeking assembly. The support table assembly is used to place a wafer, and the shaping and edge-seeking assembly corresponds to It is arranged on one side of the support platform assembly, and the shaping and edge-seeking assembly includes a driving part and a rotating support seat. The rotating support seat is correspondingly arranged on one side of the supporting table assembly. The base moves back and forth, up and down, and rotates, thereby propping up the wafer on the support table assembly and causing it to rotate;

The patch and flat sheet mechanism is used to attach the wafer after shaping and edge-seeking to the ceramic disc, and perform flat sheeting on the wafer, including a positioning table for supporting and driving the ceramic disc to rotate, for An overturn assembly for laminating the wafer on the ceramic disc and a flat plate assembly for flattening the wafer on the ceramic disc. The overturn assembly is correspondingly arranged on one side of the positioning table, including a power part and a rotating shaft And the suction cup, the power part is connected with the rotating shaft, the suction cup is fixed on the rotating shaft, the power part can drive the rotating shaft and the suction cup to move left and right, up and down and overturning, and the flat plate assembly is correspondingly arranged above the positioning table, including a pressing drive The compression driver can drive the compression airbag to move up and down to flatten the wafer on the ceramic plate, and the compression airbag can be ventilated to achieve inflation;

The transfer manipulator is used to transfer wafers in each mechanism.

The above-mentioned working method for waxing the lower wafer of the full-automatic wafer comprises the following steps:

S1, shoveling process, namely

Shovel off the wafers on the ceramic tray transported from the previous process one by one, and store the shoveled wafers one by one;

S2, the ceramic disc storage process, namely

Store the shoveled ceramic discs in the three-dimensional warehouse;

S3, ceramic disc cleaning process, namely

Clean the ceramic disc;

S4, the wafer placement process, namely

After washing and drying the wafer, spreading the wax, baking, shaping the edge, flipping, and pasting it on the ceramic plate;

S5, wafer flat sheet process, that is

Flatten the wafer;

S6, ceramic disk and wafer transfer process, namely

Transfer and store ceramic discs and wafers to be sent to the next station.

The beneficial effects of the present invention are: the fully automatic wafer lower wafer waxing reflow line and its working method are fully automatic and coordinated between each device, without any manual operation, greatly reducing the labor force of workers, improving production efficiency, and at the same time , the whole device is carried out in a dust-free environment, using multiple scrubbing, which greatly improves the cleanliness of the product, the obtained product has good consistency, low defective rate, and has broad market prospects.

Description of drawings:

Fig. 1 is the schematic diagram of the three-dimensional structure of the waxing reflow line on the lower wafer of the automatic wafer of the present invention;

Fig. 2 is a schematic structural view of a shovel unit and a storage unit of the present invention;

Fig. 3 is the structural representation of the surface brushing unit of the present invention;

Fig. 4 is the structural representation of storage unit of the present invention;

Fig. 5 is the structural representation of the handling manipulator of the present invention;

Fig. 6 is a structural schematic diagram of the flipping unit of the present invention;

Fig. 7 is the structural representation of cleaning unit of the present invention;

Fig. 8 is a structural schematic diagram of the flip assembly of the present invention;

Fig. 9 is a schematic structural view of the patch flat unit of the present invention;

Fig. 10 is a schematic structural view of the scrubbing and drying mechanism of the present invention;

Fig. 11 is the structural representation of the wax uniform mechanism of the present invention;

Fig. 12 is a structural schematic diagram of the shaping edge-seeking mechanism of the present invention;

Fig. 13 is a schematic structural view of the supporting platform assembly of the shaping edge-seeking mechanism of the present invention;

Fig. 14 is a schematic structural view of the patch flat sheet mechanism of the present invention;

Fig. 15 is a schematic structural diagram of the flip patch assembly of the present invention.

Detailed ways:

The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly. The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "top", "bottom", etc., are only for reference to the attached drawings. direction. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

Example 1:

As shown in Figure 1, the full-automatic waxing and reflow line for the lower wafer of wafers includes a main conveying line 10, which is provided with a shovel unit 1, a storage unit 2, a surface brushing unit 3, a storage unit 4, and a flipping unit 10. Unit 5, cleaning unit 6, patch flat unit 8, cooling unit 7 and transfer unit 9.

The main conveying line 10 is used for automatically conveying the ceramic discs, which has a driving motor, conveying rollers, etc., and can automatically transport the ceramic discs to each station.

The wafers and ceramic discs at the upper station are automatically transported to the shovel unit. The shovel unit is used to shovel the wafers on the ceramic disc. The storage unit on one side of the shovel unit is used to receive the shovel unit. down the wafer.

The shovel unit and the storage unit as shown in FIG. 2 .

The shovel unit includes a shovel bracket 11, a shovel power part 12, a slide block 13 and a shovel plate 18, the shovel power part 12 is fixed on the shovel support 11, and the shovel power part 12 communicates with the shovel 13 through the slider 13. The shovel plate 18 is connected and can be driven to move. The shovel plate 18 is inclined to the horizontal plane. One end of the shovel plate 18 is hinged to the bottom end of the slide block 13. The middle part of the shovel plate 18 is elastically connected to the slide block 13 by a spring 14. The bottom end of the plate 18 can rotate around the slide block 13 when it is under pressure, and resets by the spring 14 when it is not under pressure. The bottom of the shovel unit is also equipped with a rotating mechanism, a positioning mechanism, and a lifting mechanism. The rotating mechanism includes a rotating cylinder 16 and a rotating disk. The positioning mechanism includes a lifting cylinder and a positioning wheel 17. One side of the blade 18 is also equipped with an inductor 15. When the ceramic disk is conveyed to the bottom of the shovel unit, the lifting cylinder drives the positioning wheel 17 to rise, so that the three positioning wheels 17 are against the edge of the ceramic disk, that is, the positioning of the ceramic disk is realized, and the lifting mechanism can make one end of the ceramic disk rise. to form a tilted state, so that the shovel plate 18 can shovel the wafer on it. The rotary cylinder 16 can drive the rotating disk to rotate to drive the entire ceramic disk to rotate, and the sensor 15 senses the position of the wafer, so that the shovel plate 18 After receiving the signal, the wafers are shoveled off one by one.

The storage unit includes a slideway 21, a storage box 25, and a lifting power member 24. The slideway 21 is correspondingly arranged on one side of the shovel unit, and is used to receive the wafers sent by the shovel unit and transfer the wafers. The wafers are sent into the storage box 25, the slideway 21 is inclined to the horizontal plane, and there are a plurality of water channels 22 in the slideway 21, and water can be directly passed through the waterway 22, which can prevent the wafer from sticking to the slideway 21 , unable to slide normally, which further facilitates the slide of the wafer. The exit end of the slideway 21 is also provided with a bar 23 for blocking the wafers, so that the wafers can enter the storage box 25 one by one without being stacked together. The storage box 25 is correspondingly arranged at the exit end of the slideway 21, and the storage box 25 can be arranged in multiples, and each storage box 25 is a multi-layer structure, which can store multiple wafers. The storage box 25 is connected and can be driven to lift it up and down.

During processing, the ceramic disc with multiple wafers enters under the shovel unit, the positioning wheel 17 positions it, and the sensor 15 senses the wafers. At this time, the shovel power part 12 drives the slider 13 and the shovel 18 Move obliquely downward to scoop up the edge of the corresponding wafer, the slider 13 continues downward, the shovel 18 rotates under pressure, and the spring 14 contracts, thereby gradually scooping up the positive wafer, and then sending it into the slideway 21 Inside, the shovel 18 retreats back to its original position, and the wafer enters the draw-in slot of the storage box 25 through the slideway 21. Every time one is received, the lifting power part 24 descends to a certain height, thereby the shovels are stored one by one.

Since the surface of the ceramic disc after shoveling contains impurities, a brushing unit is provided between the shoveling unit and the storage unit.

As shown in Figure 3, the brush surface unit includes a rotating shaft 32, a hairbrush 33, a spray pipe 34 and a nozzle 35, and the rotating shaft 32 is multiple, correspondingly arranged above and below the ceramic disc that the main conveying line passes through, each A plurality of brushes 33 are respectively arranged on the rotating shaft 32, and one or more spray pipes 34 are correspondingly arranged above and/or below the ceramic disc through which the main conveying line passes, and a plurality of nozzles are evenly distributed on each spray pipe 34 35. The rotating shaft 32 is connected to the drive motor 31 on the main conveying line through a gear set, and no additional power mechanism is needed. While the ceramic disk is being transported, the rotating shaft 32 rotates to spray and scrub the upper and lower surfaces of the ceramic disc, and then dry it. deal with.

The scrubbed ceramic discs enter the storage unit. The storage unit as shown in Figure 4 includes a handling manipulator 41, a transverse track 43, a longitudinal track 42 and a three-dimensional warehouse, and the three-dimensional warehouse is correspondingly arranged at the output end of the shovel unit for storing the ceramic disc behind the shovel, three-dimensional The warehouse has multiple groups of plug boards 44, and each group of plug boards 44 is respectively provided with a plurality of plug slots 441 for placing ceramic discs at intervals, that is, a pair of plug boards 44 forms a plurality of plug slots from top to bottom. Connecting slot 441, a ceramic disk can be stored in each plugging slot 441, and the plugging slot 441 has a groove sunken downward, the ceramic disk is placed in the groove, and will not come out from the plugging slot 441, And one side of the socket plate 44 is also correspondingly provided with a spray pipe 45, and the spray pipe 45 is evenly distributed with nozzles from top to bottom, that is, each socket slot 411 is correspondingly provided with a nozzle, which can spray the ceramic disc. rinse. The handling manipulator 41 is arranged on the longitudinal track 42 and can move up and down along the longitudinal track 42. The longitudinal track 42 is arranged on the transverse track 43 and can move left and right along the transverse track 43, so that the handling manipulator 41 can move in all directions. The ceramic disc after the first scrubbing is sent into the insertion slot 441 by the transport manipulator 41, and when needed, it is taken out by the transport manipulator 41 and sent to the next station.

In addition, the present invention is also designed to the handling manipulator. The handling manipulator shown in Figure 5 includes an end plate 411 that can move along the track, a first drive cylinder 412 installed on the end plate 411, a second drive cylinder 413, a first guide rail 415, a second guide rail 416, and a positioning plate 417, push plate 418, two second drive cylinders 413 are arranged in the chute 414, two second drive cylinders 413 are fixedly connected with push plate 418, the telescoping rod of the second drive cylinder 413 is connected with positioning plate 417, and positioning plate 417 is U-shaped, it has 4 positioning blocks 419, used for positioning the ceramic disc, the telescopic rod of the first driving cylinder 412 is connected with the push plate 418, the first guide rail 415 can move along the inner wall of the end plate 411, and the second guide rail 416 can move Moving along the first guide rail 415 , the positioning plate 417 is fixed on the second guide rail 416 . When the telescopic rod of the first drive cylinder 412 stretches out, it drives the push plate 418 to move, drives the second drive cylinder 413 to move along the chute 414, and drives the first guide rail 415 to move along the inner wall of the end plate 411 to realize the first stretching. When the first driving cylinder 412 stretches to the maximum distance, the telescopic rods of the two second driving cylinders 413 stretch out, and the second guide rail 416 moves along the first guide rail 415, thereby driving the positioning plate 417 to stretch out to realize the second stretching. Then cooperate with the up, down, left, and right movements of the end plate 411 to move in a large range, so as to facilitate grabbing or storing the ceramic disc.

The handling manipulator grabs the ceramic discs in the three-dimensional warehouse and sends them to the main conveying line, and then sends them to the turning unit to turn the ceramic discs 90 degrees. Turning unit as shown in Figure 6, comprises support 51, turning power part 53, turning frame 52 and bracket 55, and described turning frame 52 is arranged on the support 51 and is connected with turning power part 53, and described bracket 55 is fixed On the overturn frame 52, two supporting plates are fixed on the bracket 55, and a channel for vertically supporting the edge of the ceramic disc and preventing it from falling is formed between the two supporting plates, and the overturning power part 53 can drive the overturning frame 52 to drive the bracket 55 flips. When the ceramic disc moves to the overturning unit, one end of the ceramic disc abuts against the positioning plate 57, and at this time, the gear rod 56 moves along the guide rail 54 to press the other end of the ceramic disc to realize the positioning of the ceramic disc, and at this time, the bracket 55 descends Press the ceramic disc, and the two supporting plates at one end of the bracket 55 are against the edge of the ceramic disc, and at this time, the turning power part 53 stretches out, driving the entire turning frame 52 to turn counterclockwise until the ceramic disc is perpendicular to the horizontal plane , so that it is convenient for the subsequent cleaning manipulator to grab the ceramic disc.

Different from the prior art, the present invention adopts vertical cleaning. The cleaning unit as shown in Figure 7 includes a cleaning tank 61, a cleaning track 62 and a cleaning manipulator, the cleaning tank 61 has a plurality, and the cleaning manipulator includes a gantry type mobile bracket 65, a lifting power part 63 and a bracket 64 , the brackets 64 are a pair, and the two brackets 64 are fixed on the bottom of the movable bracket 65, and a channel for vertically supporting the edge of the ceramic disc and preventing it from falling is formed between the two brackets 64, that is, the bracket 64 There is an arc-shaped groove between the mobile bracket 65, and the bottom end of the ceramic disc is just embedded in the arc-shaped groove, so that it will not fall. The structure of the supporting block 64 is basically the same as that of the supporting plate on the bracket of the turning unit. It should be noted that there are two groups of cleaning manipulators, one group is used to feed ceramic discs into the ultrasonic placement tank, and the other group is used to remove ceramic discs from the ultrasonic placement tank, and the two groups cooperate to improve cleaning efficiency.

When the overturning unit turns over the ceramic disc, the power part drives the previous group of cleaning manipulators to move to the corresponding position along the cleaning track 62, and the lifting power part 63 drives the moving bracket 65 and the bracket 64 to descend, and then falls down to the ceramic disc on the overturning unit. When it is down, the power part drives the cleaning manipulator to continue to move along the cleaning track 62, gradually approaching the ceramic disc, and then the moving bracket 65 rises, and the ceramic disc is embedded in the two supporting blocks 64, thereby holding up the ceramic disc, and then the previous group of cleaning manipulators pass through Transverse and vertical movement sends the ceramic disc into the ultrasonic placement tank for ultrasonic cleaning. After the cleaning is completed, the last set of cleaning manipulators can take out the ceramic disc and send it to the next station.

Since the cleaned ceramic discs on the cleaning manipulator are in a vertical state, an overturn assembly 50 is also provided on the main conveying line for turning the cleaned ceramic discs by 90 degrees to make them into a horizontal state. Turnover assembly as shown in Figure 8, comprises pushing cylinder 501, rotating plate 502, sliding seat 503, bottom positioning plate 504 and side positioning plate 505, and the telescoping rod of pushing cylinder 501 is connected with rotating plate 502, and pushing cylinder 501 can drive to push Plate 501 realizes 90 degree overturn, and sliding seat 503 is two, is arranged on the guide rail of rotating plate 502 and can move along guide rail, and side positioning plate 505 and bottom positioning plate 504 are respectively fixed on two sliding seats 501. When the cleaning manipulator of the cleaning unit moves to the top of the turning assembly, the cleaning manipulator drives the ceramic disc to descend, and the bottom of the ceramic disc just inserts into the groove of the two bottom positioning plates 504 to realize the bottom positioning, and then the power part drives the two sliding seats 503 and the side positioning plates 505 moves inward at the same time to position both sides of the ceramic disc to realize the overall clamping and positioning of the ceramic disc. At this time, the telescopic rod of the push cylinder 501 stretches out, pushing the rotating plate 502 to drive the ceramic disc to rotate 90 degrees, and gradually push it forward , so that the ceramic disc lands on the supporting table below. The support table is liftable, which is convenient for the subsequent transfer of ceramic plates.

In addition, a transfer assembly is also provided on the main conveying line for subsequent transfer of ceramic disks, including a moving seat 507, a guide rail 508, a support block 506 and a connecting rod 509. The moving seat 507 can move along the guide rail 508, and the connecting rod 509 is fixed on On the moving seat 507, support blocks 506 are respectively fixed at both ends of the connecting rod. When the cleaned ceramic disc is overturned, the support table drives the ceramic disc to rise, the moving seat 507 moves to the support table, and the two support blocks 506 are located below the ceramic disc. At this time, the support table descends, and the ceramic disc falls on the two support blocks 506. , and the support block 506 is provided with a number of positioning wheels, and the ceramic disc can be transferred to the next station after positioning. The subsequent main conveying line is provided with a plurality of above-mentioned transfer assemblies, and its installation method can be horizontal or vertical.

Next is the most important patch process. The patch planar unit of the present invention includes a patch unit and a planar unit. As shown in Figure 9, the patch flat unit includes a loading basket fixing mechanism 81, a scrubbing and drying mechanism 83, a wax spreading mechanism 85, a baking mechanism 84, a plastic edge-seeking mechanism 86, a patch flat mechanism 87 and a transfer manipulator. 82.

The carrying basket fixing mechanism is used for loading wafers, and is provided with a plurality of carrying basket fixing stations for positioning the carrying basket, and each station is plugged with a plurality of wafers.

The scrubbing and drying mechanism is used to scrub and dry the wafer, as shown in Figure 10, it includes a positioning platform assembly and a brushing assembly, and the positioning platform assembly includes a rotating motor 834, a lifting cylinder 838, a rotating platform 835 and a suction cup , the suction cup is fixed on the rotary platform 835, the rotary platform 835 is connected with the rotary motor 834, the rotary motor 834 can drive the rotary platform 835 and the suction cup to rotate, and the lifting cylinder 838 can drive the protective cover outside the rotary platform 835 to lift, to avoid splashing of cleaning fluid. The brushing assembly includes a brush plate 833, a brush plate drive motor 831, a brush plate swing motor 837, a rocker arm 832, a rocker arm lifting cylinder 839, and a scrub tank 836. The brush plate 833 is correspondingly arranged above the suction cup. The brush disk drive motor 831 is connected, and the brush disk drive motor 831 can drive the brush disk 833 to rotate axially. The brush disk swing motor 837 is connected to the brush disk 833 through the rocker arm 832, and the brush disk swing motor 837 can drive the rocker arm 832 And the brush plate 833 swings, the rocker lift cylinder 839 can drive the brush plate swing motor 837 and the rocker arm 832 to lift, and the brush tank 836 is correspondingly arranged on one side of the brush plate 833. When the wafer is sent into the scrubbing and drying mechanism, the suction cup will absorb the wafer, and the brush plate 833 can be scrubbed after being dipped in the scrub tank 836, and the rotating motor 834 drives the rotating platform 835 and the wafer to rotate, and the brush plate swings The motor 837 drives the rocker arm 832 and the brush plate 833 to swing at the same time, and the cooperation of the two can completely clean the surface of the wafer. It should be noted that the present invention designs two sets of scrubbing and drying mechanisms to improve processing efficiency.

The wax uniform mechanism is used to uniformly apply wax to the surface of the wafer, as shown in Figure 11, comprising a wax throwing assembly and a wax dropping assembly, the wax throwing assembly has a rotary table 854, and the rotary table 854 is connected with a rotary motor, and the wax dropping assembly There is a wax dropper 852, which is connected to the cylinder 851, and the wax dropper 852 is correspondingly arranged above the rotary table 854. The wax uniform mechanism also includes a lifting cylinder 855, which can drive the rotary table 854 up and down. When the wafer is sent into the wax uniform mechanism, the rotary table 854 receives and absorbs the wafer, and the lifting cylinder 855 drives the rotary table 854 to rise into the sleeve 853. The sleeve 853 can prevent the wax from splashing when the wax is distributed. 851 stretches out, so that the wax dripper 852 moves to the top of the center of the wafer to drip wax, and the turntable starts to rotate, so that the surface of the wafer is evenly covered with wax.

The baking mechanism is used to bake the waxed wafers, and an ordinary oven can be used.

The shaping and edge-seeking mechanism is used for shaping and edge-finding the baked wafer. As shown in FIG. 12 , it includes a support table assembly 867 and a shaping edge-finding assembly. The support table assembly 867 is used for placing a wafer, and the shaping edge-finding assembly is used for shaping and edge-finding the wafer.

The shaping and edge-seeking assembly includes a driving part and a rotating support base 866, and the rotating supporting base 866 is correspondingly arranged on one side of the supporting platform assembly. The driving part is connected with the rotating supporting base 866, and the driving part can drive the rotating supporting base 866 forward and backward , up and down and rotate, so as to support the wafer on the support table assembly and make it rotate, the drive member includes a first slide rail 861, a first slide block 862, a first cylinder 863, a first lifting seat 864 and Motor 865, the first slide block 862 is arranged on the first slide rail 861 and can slide along the first slide rail 861, the first cylinder 863 is fixed on the first slide block 862, the first cylinder 863 and the first The lifting base 864 is connected, the first cylinder 863 can drive the first lifting base 864 to move up and down, the motor 865 is fixed on the first lifting base 864, the rotating support base 866 is arranged on the top of the motor 865, and the motor 865 can drive the rotating support Seat 866 rotates.

The support platform assembly shown in Figure 13 includes a bracket 8671, a support platform 8672, a rotary drive member 8674 and a positioning jaw 8673, the support platform 8672 is fixed on the top of the bracket 8671, and the support platform 8672 is a ring-shaped structure. The diameter is slightly smaller than the diameter of the wafer, and the center of the support table 8672 has a through hole for the suction cup or the rotating support seat to pass through. The positioning jaws 8673 are a pair, which are respectively arranged on both sides of the support table 8672. The two positioning jaws The opposite surfaces of 8673 are respectively provided with arc-shaped grooves, which correspond to the radian of the wafer, and the rotating drive member 8674 is connected with the two positioning jaws 8673, and the rotating driving member 8674 can drive the two positioning jaws 8673 at the same time Rotate to clamp or unclamp wafers on support table 8672.

During processing, the manipulator sends the wafer to the support table 8672, and the rotary drive member 8674 drives the two positioning jaws 8673 to rotate inward at the same time, and the two positioning jaws 8673 can move the wafer closer to the center to achieve positioning; then the first The slider 862 drives the first cylinder 863, the first lifting seat 864 and the motor 865 to move forward, so that the rotating support seat 866 is located directly below the wafer, and the first cylinder 863 drives the first lifting seat 864, the motor 865 and the rotating support seat 866 rises to lift up the wafer. At this time, the motor 865 drives the rotating support base 866 and the wafer to rotate slowly. The sensor arranged on the side can sense the notch of the wafer. The device sends a signal, the motor 865 stops rotating, the first lifting seat 864 descends, the wafer returns to the support table 8672, and the shaping edge finding assembly returns to its original position.

The above-mentioned processes transfer the wafers in each mechanism through the transfer manipulator, and the transfer manipulator can adopt the transfer manipulator structure previously applied by our company.

After plastic surgery, plain film treatment is required.

As shown in Figure 14, the chip mounter mechanism includes an installation platform 871 and a positioning table 872 arranged on the installation platform 871 for supporting and driving the rotation of the ceramic disc, for attaching the wafer to the ceramic disc. The flip chip component 873 is a flat chip component used to flat chip the wafer on the ceramic disc.

The flip patch assembly shown in Figure 15 includes a power part, a rotating shaft 8736 and a suction cup 8737, the suction cup 8737 is correspondingly arranged on one side of the support table assembly, the power part is connected with the rotating shaft 8736, and the suction cup 8737 is fixed on the rotating shaft On the shaft 8736, the power part can drive the rotation shaft 8736 and the suction cup 8737 to move left and right, up and down, and overturn, thereby absorbing the wafer and turning it over. The power part includes a second slide rail 8731, a second slider 8732, a second Cylinder 8733, second lifting seat 8734 and rotating cylinder 8735, the second slider 8732 is arranged on the second slide rail 8731 and can slide along the second slide rail 8731, the second cylinder 8733 is fixed on the second slider On 8732, the second cylinder 8733 is connected with the second lifting seat 8734, the second cylinder 8733 can drive the second lifting seat 8734 to move up and down, the rotating cylinder 8735 is fixed on the second lifting seat 8734, the rotating cylinder 8735 and the rotating shaft 8736 It is connected and can drive the rotating shaft 8736 to rotate axially.

The flat sheet assembly is correspondingly arranged above the positioning table 872, and includes a compression driver 874 and a compression air bag 875. The compression driver 874 can drive the compression air bag 875 to move up and down to flatten the wafer on the ceramic disk, and The compressed airbag 875 is communicated with the air path, and can be ventilated to realize gradual inflation.

A plurality of positioning components for positioning ceramic disks are evenly distributed around the positioning platform 872 .

During processing, the second slider 8732 drives the second cylinder 8733, the second lifting seat 8734 and the rotating cylinder 8735 to move, so that the suction cup 8737 is located under the wafer, and the second cylinder 8733 drives the second lifting seat 8734, the rotating cylinder 8735 and the suction cup 8737 rises, the suction cup 8737 can absorb the wafer, and the wafer is moved to the top of the ceramic plate on the positioning table 872 through the second slider 8732. At this time, the rotary cylinder 8735 drives the wafer to turn over 180 degrees to make it coated. The glued side faces down, and finally the second cylinder 8733 drives the suction cup 8737 to move downward to attach the wafer to the ceramic disc, completing a placement; after placement, the two positioning components 876 move inward to position the ceramic disc After positioning, the compression driver 874 drives the compression airbag 875 to descend, and the compression airbag 875 is inflated multiple times, so that the wafer below is flattened multiple times, and a flat wafer is completed; after flattening, the positioning table The 872 drives the ceramic disc to rotate in equal parts, and another flat chip can be placed, and so on, the ceramic disc is evenly pasted with wafers.

The flattened ceramic discs and wafers are cooled by the cooling unit 7 of the main conveying line, and then sent to the transfer unit 9 for stacking and transfer.

Example 2:

On the basis of embodiment 1, present embodiment 2 provides a kind of working method of waxing on the lower wafer of automatic wafer, comprises the following steps:

S1, shoveling process, namely

Shovel off the wafers on the ceramic tray transported from the previous process one by one, and store the shoveled wafers one by one;

S2, the ceramic disc storage process, namely

Store the shoveled ceramic discs in the three-dimensional warehouse;

S3, ceramic disc flipping process, namely

Flip the ceramic plate 90 degrees;

S4, ceramic disc cleaning process, namely

Vertical cleaning of ceramic discs;

S5, the wafer placement process, namely

After washing and drying the wafer, spreading the wax, baking, shaping the edge, flipping, and pasting it on the ceramic plate;

S6, wafer flat sheet process, namely

Flatten the wafer;

S7, ceramic disk and wafer transfer process, namely

Transfer and store ceramic discs and wafers to be sent to the next station.

For the parts involved in the shoveling process, the ceramic disc storage process, the ceramic disc flipping process, the ceramic disc cleaning process, the wafer chip placement process, the wafer flat chip process, the ceramic disc and the wafer transfer process, see Example 1 related discussion.

In all examples shown and described herein, any specific values should be construed as merely exemplary and not limiting, and thus other examples of the exemplary embodiments may have different values.

It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

In addition, in the description of the embodiments of the present invention, unless otherwise specified and limited, terms such as "installation", "connection", "connection", "setting", and "installation" should be interpreted in a broad sense, for example, It can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

The driving parts and power parts of the present invention can be replacements of relevant power components such as cylinders, electric cylinders, motors, oil cylinders, etc., and corresponding linkage mechanisms can also be used to achieve power output, and are not limited to their names or structures.

Sensors, alarms, and photoelectric switch inductive parts are arranged at the relevant positions of each unit or component of the present invention to ensure the continuous effectiveness of production.

In describing the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. indicate The orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation or be configured in a specific orientation. and operation, and therefore should not be construed as limiting the invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and should not be construed as indicating or implying relative importance.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims (10)

1. A full-automatic wafer lower wafer waxing and reflow line, comprising a main conveying line, the main conveying line is used to automatically transport ceramic discs, characterized in that: the main conveying line is provided with a shovel unit, a receiving unit, storage unit, cleaning unit, patch flat unit and transfer unit; The shovel unit is used to shovel off the wafer on the ceramic disc; The storage unit is correspondingly arranged on one side of the shovel unit for receiving the wafers shoveled by the shovel unit; The storage unit is correspondingly arranged at the output end of the shoveling unit, and is used for storing the ceramic disk for shoveling the wafer; The cleaning unit is correspondingly arranged at the output end of the storage unit, and is used for receiving the ceramic disk in the storage unit and cleaning the ceramic disk vertically; The chip-mounting unit is correspondingly arranged at the output end of the cleaning unit, and is used for attaching the wafer to the cleaned ceramic disc, and performing flat-chip shaping on the wafer after the chip is mounted; The transfer unit is correspondingly arranged at the output end of the flat sheet unit, and is used for transferring and storing the flat ceramic discs and wafers. 2. The fully automatic waxing and reflow line for the lower wafer of the wafer according to claim 1, characterized in that: the shovel unit includes a shovel bracket, a shovel power part, a slider and a shovel plate, and the shovel unit The power part is fixed on the shovel bracket, the power part of the shovel is connected with the shovel plate through the slider and can drive it to move, the shovel plate is inclined to the horizontal plane, one end of the shovel plate is hinged to the bottom of the slider, The blocks are elastically connected by springs, the shovel plate can rotate around the slider when it is under pressure, and return through the spring when it is not under pressure. 3. The full-automatic waxing and reflow line for wafer bottom wafer according to claim 2, characterized in that: the storage unit includes a slideway, a storage box and a lifting power part, and the slideway is correspondingly arranged on the shovel unit One side is used to receive the wafers shoveled by the shovel unit, and send the wafers into the storage box. The slideway is inclined to the horizontal plane. At the outlet end of the storage box, the storage box has a multi-layer structure, and the lifting power part is connected with the storage box and can drive it up and down. 4. The full-automatic waxing and reflow line for wafer lower wafers according to claim 1, characterized in that: a brushing unit is also arranged between the shovel unit and the storage unit, and the brushing unit includes a rotating shaft, Brush spray pipe and nozzle, the shafts are multiple, correspondingly arranged above and/or below the ceramic disc through which the main conveying line passes, and multiple brushes are respectively arranged on each shaft, and the spray pipes are multiple , which are correspondingly arranged above and/or below the ceramic disc through which the main conveying line passes, and a plurality of nozzles are evenly distributed on each spray pipe. 5. The fully automatic waxing and reflow line for the lower wafer of the wafer according to claim 1, wherein the storage unit includes a handling manipulator, a track and a three-dimensional warehouse, and the three-dimensional warehouse is correspondingly arranged on the output of the shovel unit The three-dimensional warehouse has multiple sets of plug-in boards, and each set of plug-in boards is respectively provided with a plurality of plug-in slots for placing ceramic discs at intervals. The handling manipulator is set It is on the track and can move up and down or left and right along the track, and is used to grab the ceramic disc behind the shovel and send the ceramic disc into or out of the three-dimensional warehouse. 6. The fully automatic waxing and reflow line for the lower wafer of the wafer according to claim 1, wherein the cleaning unit includes a cleaning tank, a cleaning track and a cleaning manipulator, and the cleaning manipulator is arranged on the cleaning track and can Lift up and down or move left and right along the cleaning track, used to feed or take out the ceramic discs in the cleaning tank. The cleaning manipulator includes a moving bracket and a bracket. The brackets are a pair, and the two brackets are fixed at the bottom of the moving bracket. , A channel for vertically supporting the edge of the ceramic disc and preventing it from falling is formed between the two supporting blocks. 7. The fully automatic waxing and reflow line for the lower wafer of the wafer according to claim 6, characterized in that: a flipping unit is also provided between the storage unit and the cleaning unit, which is used to transport the ceramic discs from the storage unit Overturning includes a bracket, an overturning power part, a overturning frame and a bracket. The overturning frame is arranged on the bracket and connected with the overturning power part. The bracket is fixed on the overturning frame. A passage for vertically supporting the edge of the ceramic disc and preventing it from falling is formed between the supporting plates, and the turning power part can drive the turning frame to drive the bracket to turn over, so that the ceramic disc turns over. 8. The full-automatic waxing and reflow line for wafer lower wafers according to claim 1, characterized in that: the patch flat wafer unit includes a loading basket fixing mechanism, a scrubbing and drying mechanism, a wax spreading mechanism, and a baking mechanism , Plastic edge-seeking mechanism, SMT plain film mechanism and transfer manipulator; The carrying basket fixing mechanism is used for loading wafers, and is provided with a plurality of carrying basket fixing stations for positioning the carrying basket; The scrubbing and drying mechanism is used for scrubbing and drying the wafer, and includes a positioning platform assembly and a brushing assembly. The positioning platform assembly includes a rotating power part, a rotating platform, a suction cup, a lifting power part, a lifting seat and a protective cover. The suction cup is fixed on the rotating platform, the rotating platform is connected with the rotating power part, the rotating power part can drive the rotating platform and the suction cup to rotate, the protective cover is set outside the rotating platform, and the protective cover is fixed on the lifting seat, so The lifting power part is connected with the lifting seat, and the lifting power part can drive the lifting seat and the protective cover up and down, so that the rotating platform enters or escapes from the protective cover. The brushing assembly includes a brush plate, a brush plate driving part, and a brush plate swing power part , the rocker arm and the rocker lifting drive part, the brush plate is correspondingly arranged above the suction cup and fixedly connected with the brush plate rocker arm, the brush plate is connected with the brush plate power part, and the brush plate power part can drive the brush plate to rotate axially , the brush plate swing power part is connected with the rocker arm, the brush plate swing power part can drive the rocker arm and the brush plate to swing, the rocker arm lift drive part is connected with the brush plate swing power part, and the rocker arm lift drive part can drive the brush The lifting of the power part of the disk swing; The wax spreading mechanism is used to uniformly apply wax to the surface of the wafer, and includes a wax throwing assembly and a wax dripping assembly. The wax throwing assembly includes a protective cover, a lifting power part, a lifting seat, a rotating power part and a rotating seat. The lifting power part is connected with the lifting seat and can drive it up and down to enter or escape from the protective cover above. The rotating seat and the rotating power part are arranged on the lifting seat, and the rotating power part is connected with the rotating seat and can drive it to rotate. The wax drip assembly is correspondingly arranged on one side of the protective cover. The wax drip assembly includes a wax dripper and a driving power part. The driving power part is connected with the wax dripper and can drive it to move horizontally to approach or move away from the center of the protective cover; The baking mechanism is used to bake the wafers after waxing, and has a baking oven; The shaping and edge-seeking mechanism is used for shaping and edge-seeking the baked wafer, and includes a support table assembly and a shaping edge-seeking assembly. The support table assembly is used to place a wafer, and the shaping and edge-seeking assembly corresponds to It is arranged on one side of the support platform assembly, and the shaping and edge-seeking assembly includes a driving part and a rotating support seat. The rotating support seat is correspondingly arranged on one side of the supporting table assembly. The base moves back and forth, up and down, and rotates, thereby propping up the wafer on the support table assembly and causing it to rotate; The patch and flat sheet mechanism is used to attach the wafer after shaping and edge-seeking to the ceramic disc, and perform flat sheeting on the wafer, including a positioning table for supporting and driving the ceramic disc to rotate, for An overturn assembly for laminating the wafer on the ceramic disc and a flat plate assembly for flattening the wafer on the ceramic disc. The overturn assembly is correspondingly arranged on one side of the positioning table, including a power part and a rotating shaft And the suction cup, the power part is connected with the rotating shaft, the suction cup is fixed on the rotating shaft, the power part can drive the rotating shaft and the suction cup to move left and right, up and down and overturning, and the flat plate assembly is correspondingly arranged above the positioning table, including a pressing drive The compression driver can drive the compression airbag to move up and down to flatten the wafer on the ceramic plate, and the compression airbag can be ventilated to achieve inflation; The transfer manipulator is used to transfer wafers in each mechanism. 9. The full-automatic waxing and reflow line for wafer under-chip according to claim 1, characterized in that: a cooling unit is also arranged on the main conveying line, and the cooling unit is correspondingly arranged on the chip-mounting unit. The output end is used to cool the wafer after placement. 10. A working method for waxing the lower wafer of a fully automatic wafer, adopting the waxing reflow line of the lower wafer of the automatic wafer as claimed in any one of claims 1-9, characterized in that, comprising the steps of: S1, shoveling process, namely Shovel off the wafers on the ceramic tray transported from the previous process one by one, and store the shoveled wafers one by one; S2, the ceramic disc storage process, namely Store the shoveled ceramic discs in the three-dimensional warehouse; S3, ceramic disc cleaning process, namely Clean the ceramic disc; S4, the wafer placement process, namely After washing and drying the wafer, spreading the wax, baking, shaping the edge, flipping, and pasting it on the ceramic plate; S5, wafer flat sheet process, that is Flatten the wafer; S6, ceramic disk and wafer transfer process, namely Transfer and store ceramic discs and wafers to be sent to the next station.