CN110364464B - Full-automatic multifunctional paster device and full-automatic paster process - Google Patents
Full-automatic multifunctional paster device and full-automatic paster process Download PDFInfo
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- CN110364464B CN110364464B CN201910747015.7A CN201910747015A CN110364464B CN 110364464 B CN110364464 B CN 110364464B CN 201910747015 A CN201910747015 A CN 201910747015A CN 110364464 B CN110364464 B CN 110364464B
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- 238000000034 method Methods 0.000 title claims abstract description 13
- 230000008569 process Effects 0.000 title claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 90
- 230000001680 brushing effect Effects 0.000 claims abstract description 51
- 238000007493 shaping process Methods 0.000 claims abstract description 35
- 238000001035 drying Methods 0.000 claims abstract description 30
- 238000012546 transfer Methods 0.000 claims abstract description 13
- 235000012431 wafers Nutrition 0.000 claims description 120
- 230000001681 protective effect Effects 0.000 claims description 37
- 239000000919 ceramic Substances 0.000 claims description 31
- 238000003825 pressing Methods 0.000 claims description 18
- 230000007306 turnover Effects 0.000 claims description 13
- 230000003028 elevating effect Effects 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 238000004018 waxing Methods 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 230000003749 cleanliness Effects 0.000 abstract description 2
- 238000012545 processing Methods 0.000 description 5
- 238000005192 partition Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 210000003437 trachea Anatomy 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000011166 aliquoting Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to a full-automatic multifunctional paster device and a full-automatic paster process. The full-automatic multifunctional chip mounting device and the full-automatic chip mounting process can realize the functions of brushing and spin-drying, wax homogenizing, baking, shaping and edge-seeking, chip mounting flat-sheet mechanism, chip mounting flat-sheet and the like of the wafer through the mutual matching of the bearing basket fixing mechanism, the brushing and spin-drying mechanism, the wax homogenizing mechanism, the baking mechanism, the shaping and edge-seeking mechanism and the transfer manipulator, thereby ensuring the chip mounting effect of the wafer, improving the cleanliness of the product and ensuring the product quality.
Description
Technical Field
The invention relates to the technical field of electronic product processing, in particular to a full-automatic multifunctional paster device and a full-automatic paster process.
Background
The Chinese semiconductor market has the advantages that the demand of the packaging amount of the Chinese semiconductor market is rapidly increased, the labor force is short, the labor cost is continuously increased, the demand of manufacturers on automatic equipment is increased, and the Chinese semiconductor market has obvious effects of reducing the production cost and improving the product yield.
The existing wafers (sapphire sheets, silicon wafers and the like) need to be subjected to multiple procedures such as cleaning, gluing (waxing), pasting, shoveling, storage and the like when being processed. Especially, the process of sticking is critical, and if the sticking is uneven or the surface contains impurities, the subsequent product quality is greatly influenced. The utility model provides a full-automatic chip mounter of patent number CN104759974A that this company previously applied for, the device can realize full-automatic paster, does not nevertheless wash before the paster, directly the paster, leads to impurity or dust etc. to mix between wafer and the ceramic dish easily, influences the degree of consistency of paster, leads to the emergence of substandard product even. Meanwhile, the prior chip mounter is only applicable to round wafers, and cannot accurately mount the chips on irregular wafers.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides the full-automatic multifunctional paster device and the full-automatic paster process, which have the advantages of high automation degree, accurate positioning and good paster effect.
The invention is realized by the following technical scheme: a full-automatic multifunctional paster device comprises a bearing basket fixing mechanism, a brushing and spin-drying mechanism, a wax homogenizing mechanism, a baking mechanism, a shaping and edge-seeking mechanism, a paster flat-piece mechanism and a transferring manipulator;
the bearing basket fixing mechanism is used for loading wafers and is provided with a plurality of bearing basket fixing stations used for positioning the bearing baskets;
the brushing and spin-drying mechanism is used for brushing and spin-drying a wafer and comprises a positioning platform assembly and a brushing assembly, the positioning platform assembly comprises a rotary power piece, a rotary platform, a sucker, a lifting power piece, a lifting seat and a protective cover, the sucker is fixed on the rotary platform, the rotary platform is connected with the rotary power piece, the rotary power piece can drive the rotary platform and the sucker to rotate, the protective cover is sleeved outside the rotary platform, the protective cover is fixed on the lifting seat, the lifting power piece is connected with the lifting seat, the lifting power piece can drive the lifting seat and the protective cover to lift up and down so as to enable the rotary platform to enter or leave the protective cover, the brushing assembly comprises a brush disc, a brush disc driving piece, a brush disc swinging power piece, a rocker arm and a rocker arm lifting driving piece, the brush disc is correspondingly arranged above the sucker and fixedly connected with a brush disc rocker arm, the brush disc is connected with the brush disc driving piece, the brush disc driving piece can drive the brush disc to rotate axially, the brush disc swinging power piece can drive the rocker arm and the brush disc, and the brush disc lifting driving piece can be lifted and lowered, and the brush disc driving piece is connected with the brush disc driving piece, and the brush disc rocking driving piece and the brush disc rocking seat;
the wax homogenizing mechanism is used for uniformly waxing the surface of a wafer and comprises a wax throwing component and a wax dripping component, the wax throwing component comprises a protective cover, a lifting power piece, a lifting seat, a rotary power piece and a rotating seat, the lifting power piece is connected with the lifting seat and can drive the lifting seat to lift so as to enter or fall out of the protective cover above, the rotating seat and the rotary power piece are arranged on the lifting seat, the rotary power piece is connected with the rotating seat and can drive the rotating seat to rotate, the wax dripping component is correspondingly arranged on one side of the protective cover, the wax dripping component comprises a wax dripping device and a driving power piece, and the driving power piece is connected with the wax dripping device and can drive the wax dripping device to horizontally move so as to be close to or far away from the center of the protective cover;
the baking mechanism is used for baking the uniformly-waxed wafer and is provided with a baking box;
the shaping edge searching mechanism is used for shaping edges of baked wafers and comprises a supporting table assembly and a shaping edge searching assembly, the supporting table assembly is used for placing the wafers, the shaping edge searching assembly is correspondingly arranged on one side of the supporting table assembly, the shaping edge searching assembly comprises a driving piece and a rotary supporting seat, the rotary supporting seat is correspondingly arranged on one side of the supporting table assembly, the driving piece is connected with the rotary supporting seat, and the driving piece can drive the rotary supporting seat to move forwards and backwards, up and down and rotationally, so that the wafers on the supporting table assembly are supported and rotated;
the chip bonding and leveling mechanism is used for bonding the shaped and edge-seeking wafer on the ceramic disc and leveling the wafer, and comprises a positioning table, a turnover assembly and a leveling assembly, wherein the positioning table is used for supporting and driving the ceramic disc to rotate, the turnover assembly is used for bonding the wafer on the ceramic disc, the leveling assembly is used for leveling the wafer on the ceramic disc, the turnover assembly is correspondingly arranged on one side of the positioning table and comprises a power piece, a rotating shaft and a sucker, the power piece is connected with the rotating shaft, the sucker is fixed on the rotating shaft, the power piece can drive the rotating shaft and the sucker to move left and right, up and down and in a turnover manner, the leveling assembly is correspondingly arranged above the positioning table and comprises a pressing driving piece and a pressing air bag, the pressing driving piece can drive the pressing air bag to move up and down so as to flatten the wafer on the ceramic disc, and the pressing air bag can be ventilated to realize inflation;
the transfer manipulator is used for transferring the wafers in each mechanism.
In order to facilitate the water dipping of the brush disc and ensure the cleaning effect, the brushing and spin-drying mechanism further comprises a cleaning water tank, and the cleaning water tank is fixed outside the protective cover.
In order to guarantee the even wax effect, even wax mechanism still includes locating component, locating component sets up in the protection casing bottom, including location power spare and two locating arms, be fixed with the arc locating piece on the locating arm respectively, location power spare is connected with two locating arms, and location power spare can drive two locating arms and inwards or outwards remove simultaneously to make the wafer on the arc locating piece clamp or loosen the swivel mount.
In order to accurately position the wafer, the supporting table component of the shaping edge searching mechanism comprises a support, a supporting table, a rotary driving piece and positioning clamping jaws, wherein the supporting table is fixed at the top end of the support, a through hole is formed in the center of the supporting table, the positioning clamping jaws are arranged at two sides of the supporting table respectively in a pair, arc-shaped grooves are formed in the opposite faces of the two positioning clamping jaws respectively, the rotary driving piece is connected with the two positioning clamping jaws, and the rotary driving piece can drive the two positioning clamping jaws to rotate simultaneously so as to clamp or loosen the wafer on the supporting table.
In order to drive the rotary supporting seat to do front-back, up-down and rotary motions, the driving piece of the shaping edge searching mechanism comprises a first sliding rail, a first sliding block, a first air cylinder, a first lifting seat and a motor, wherein the first sliding block is arranged on the first sliding rail and can slide along the first sliding rail, the first air cylinder is fixed on the first sliding block and is connected with the first lifting seat, the first air cylinder can drive the first lifting seat to move up and down, the motor is fixed on the first lifting seat, the rotary supporting seat is arranged at the top end of the motor, and the motor can drive the rotary supporting seat to rotate.
In order to improve brushing efficiency and ensure pasting efficiency, the brushing and spin-drying mechanism is provided with one or more sets.
The transfer robot has one or more sets in order to improve the transfer efficiency of the wafer.
In order to drive the adsorption table to do left-right, up-down and overturning motions, the power piece of the overturning assembly comprises a second sliding rail, a second sliding block, a second air cylinder, a second lifting seat and a rotary air cylinder, wherein the second sliding block is arranged on the second sliding rail and can slide along the second sliding rail, the second air cylinder is fixed on the second sliding block and is connected with the second lifting seat, the second air cylinder can drive the second lifting seat to move up and down, the rotary air cylinder is fixed on the second lifting seat, and the rotary air cylinder is connected with the rotary shaft and can drive the rotary shaft to axially rotate.
In order to be convenient for drive ceramic dish partition rotation, paster flat-piece mechanism still includes partition rotary component, partition rotary component includes lift power spare, elevating platform and rotary power spare, the lift power spare is connected with the elevating platform, have the trachea in the elevating platform, the elevating platform upper surface has the gas pocket, trachea and gas pocket intercommunication, and the elevating power spare can drive the elevating platform and go up and down in order to pass the through-hole of locating platform, rotary power spare is connected with the elevating platform, and rotary power spare can drive elevating platform axial rotation.
The invention also provides a full-automatic paster process, which adopts the full-automatic multifunctional paster device and comprises the following steps:
s1, taking out a wafer in a bearing basket fixing mechanism, and sending the wafer into a brushing and spin-drying mechanism for brushing and spin-drying;
s2, conveying the wafer subjected to brushing and spin-drying into a wax homogenizing mechanism, and uniformly waxing the surface of the wafer;
s3, conveying the wafer subjected to the uniform wax into a baking mechanism for baking;
s4, sending the dried wafer into a shaping and edge-searching mechanism for shaping and edge-searching;
s5, the overturning assembly overturns the wafer by 180 degrees, then one surface of the wafer with wax is attached to the ceramic disc, and the flat piece assembly carries out air bag flat piece on the wafer after the surface mounting, so that the wafer is completely attached to the ceramic disc.
The beneficial effects of the invention are as follows: the full-automatic multifunctional chip mounting device and the full-automatic chip mounting process can realize the functions of brushing and spin-drying, wax homogenizing, baking, shaping and edge-seeking, chip mounting flat-sheet mechanism, chip mounting flat-sheet and the like of the wafer through the mutual matching of the bearing basket fixing mechanism, the brushing and spin-drying mechanism, the wax homogenizing mechanism, the baking mechanism, the shaping and edge-seeking mechanism and the transfer manipulator, thereby ensuring the chip mounting effect of the wafer, improving the cleanliness of the product and ensuring the product quality.
Drawings
Fig. 1 is a schematic perspective view of a fully automatic multifunctional patch device according to the present invention;
FIG. 2 is a schematic perspective view of a brushing and spin-drying mechanism according to the present invention;
FIG. 3 is a schematic perspective view of the brush spin-drying mechanism of the present invention with the protective cover removed;
FIG. 4 is a schematic perspective view of a wax homogenizing mechanism of the present invention;
FIG. 5 is a schematic perspective view of the wax homogenizing mechanism of the present invention with the protective cover removed;
FIG. 6 is a schematic diagram of a three-dimensional structure of the shaping and edge-seeking mechanism of the present invention;
FIG. 7 is a schematic perspective view of a support table assembly according to the present invention;
FIG. 8 is a schematic perspective view of a patch panel mechanism according to the present invention;
FIG. 9 is a schematic perspective view of a flip assembly according to the present invention;
FIG. 10 is a schematic view of a positioning assembly according to the present invention;
fig. 11 is a schematic perspective view of the aliquoting rotary mechanism of the present invention.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the attached drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present invention.
The full-automatic multifunctional paster device shown in fig. 1 comprises a bearing basket fixing mechanism 1, a brushing and spin-drying mechanism 3, a wax homogenizing mechanism 5, a baking mechanism 4, a shaping and edge-searching mechanism 6, a paster flat-piece mechanism 7 and a transferring manipulator 2.
The carrying basket fixing mechanism 1 is used for loading wafers, and is provided with a plurality of carrying basket fixing stations used for positioning the carrying basket, and each station is inserted with a plurality of wafers.
The brushing and spin-drying mechanism is used for brushing and spin-drying a wafer, as shown in fig. 2 and 3, and comprises a positioning platform assembly and a brushing assembly, wherein the positioning platform assembly comprises a rotary power piece 211, a rotary platform 25, a sucker 214, a lifting power piece 24, a lifting seat 213 and a protective cover, the sucker 214 is fixed at the top end of the rotary platform 25, the rotary platform 25 is connected with the rotary power piece 211, the rotary power piece 211 can drive the rotary platform 25 and the sucker 214 to rotate, the protective cover is sleeved outside the rotary platform 25, the protective cover is fixed on the lifting seat 213 and comprises an outer cover 210 and an inner cover 2101, the outer cover 210 is fixed on a bracket and sleeved outside the inner cover 2101, the inner cover 2101 is fixed on the lifting seat 213 and can lift up and down along with the lifting seat 213, the lifting power piece 24 is connected with the lifting seat 213 through a lifting frame 28 and a guide rod 29, and the lifting power piece 24 can drive the lifting seat 213 and the protective cover to lift up and down, so that the rotary platform 25 enters or falls out of the protective cover; the brushing assembly comprises a brushing disc 23, a brushing disc driving piece 21, a brushing disc swinging power piece 27, a swinging arm 22 and a swinging arm lifting driving piece 215, wherein the brushing disc 23 is correspondingly arranged above the sucking disc 214 and fixedly connected with the brushing disc swinging arm 22, the brushing disc 23 is connected with the brushing disc driving piece 21, the brushing disc driving piece 21 can drive the brushing disc 23 to axially rotate, the brushing disc swinging power piece 27 is connected with the swinging arm 22, the brushing disc swinging power piece 27 can drive the swinging arm 22 and the brushing disc 23 to swing, the swinging arm lifting driving piece 215 is connected with the brushing disc swinging power piece 27, the swinging arm lifting driving piece 215 can drive the brushing disc swinging power piece 27 and the swinging arm 22 to lift, one side of the swinging arm lifting driving piece 215 is provided with a dial indicator 216, and one side of the lifting seat 213 is fixedly provided with a cleaning water tank 26.
The invention designs two sets of brushing and spin-drying mechanisms which operate simultaneously to improve the brushing and spin-drying efficiency.
During processing, the wafer is conveyed onto the sucker 214 by the transfer manipulator, the sucker 214 adsorbs the wafer, at the moment, the lifting power piece 24 drives the lifting seat 213 and the inner cover 2101 to ascend, the inner cover 2101 is sleeved outside the wafer, the brush disc swinging power piece 27 drives the rocker arm 22 and the brush disc 23 to swing, the brush disc 23 is soaked with water, then the rocker arm lifting driving piece 215 drives the brush disc swinging power piece 27 and the rocker arm 22 to descend, the brush disc 23 is lowered to the upper surface of the wafer, at the moment, the rotary power piece 211 drives the rotary platform 25, the sucker 214 and the wafer to rotate slowly, and the brush disc swinging power piece 27 drives the rocker arm 22 and the brush disc 23 to swing at the same time, so that the surface of the wafer is uniformly brushed by the brush disc 23, after brushing, the rotary platform 25 is slightly lowered, the wafer is separated from the brush disc 23, at the moment, the rotary power piece 211 drives the rotary platform 25, the sucker 214 and the wafer to rotate at a high speed, so that the wafer is dried, and then the wafer is grabbed and conveyed into the next station by the transfer manipulator.
The wax homogenizing mechanism is used for uniformly waxing the surface of a wafer, as shown in fig. 4, the wafer comprises a support 51, a protective cover 52, a wax throwing component and a wax dripping component, the protective cover 52 is fixed at the top end of the support 51, an opening is formed in the bottom end of the protective cover 52, a top cover 53 is arranged at the top end of the protective cover 52, a through groove 531 is formed in the top cover 53, the through groove 531 extends from the edge of the top cover 53 to the center of the top cover 53, the wax throwing component is correspondingly arranged below the protective cover 52, the wax throwing component comprises a lifting power piece 54, a lifting seat 55, a rotating power piece 56 and a rotating seat 57, the lifting power piece 54 is a group, guide rods 58 are respectively arranged on two sides of the lifting seat 55, the lifting power piece 54 drives the lifting seat 55 to lift along the guide rods 58, so as to drive the lifting seat 55 to lift or separate from the protective cover 52, the rotating seat 57 and the rotating power piece 56 are arranged on the lifting seat 55, the rotating power piece 56 is connected with the rotating seat 57 and can drive the rotating seat 53 to rotate, the wax dripping component is correspondingly arranged on one side of the protective cover 52, the wax dripping component comprises a wax dripping device 510 and a driving power piece 59, and the driving device 59 can move along the lifting power piece 59 to move along the through groove 55 or the horizontal groove 510 and can move along the horizontal driving groove 510 or the horizontal driving device 510.
As shown in fig. 5, the wafer wax homogenizing mechanism further includes a positioning assembly, the positioning assembly is disposed at the bottom end of the protective cover, and includes a positioning power member 511 and two positioning arms 512, the two positioning arms 512 are respectively fixed with an arc positioning block 513, the positioning power member 511 is connected with the two positioning arms 512, and the positioning power member 511 can drive the two positioning arms 512 to move inwards or outwards at the same time, so that the arc positioning block 513 clamps or unclamps the wafer on the rotating seat.
During processing, a wafer is sent to the rotating seat 57 by a manipulator, the lifting power piece 54 drives the lifting seat 55 and the rotating seat 57 to ascend, the positioning power piece 511 drives the two positioning arms 512 to move inwards simultaneously, so that the two arc positioning blocks 513 position the wafer to be positioned at the center of the top of the rotating seat 57, after positioning is finished, the lifting power piece 54 continues to drive the lifting seat 55 and the rotating seat 57 to ascend, the rotating seat 57 enters the protective cover 52, the driving power piece 59 drives the wax dropper 510 to extend forwards, the wax dropper 510 is positioned at the center above the rotating seat 57, the wax dropper 510 starts to drop wax, in the wax dropping process, the rotating power piece 56 drives the rotating seat 57 to rotate to perform centrifugal action, the upper surface of the wafer is gradually coated with wax, after wax is uniformly distributed, the lifting seat 55 descends, and the manipulator takes the wafer out and sends the wafer to the next station.
The baking mechanism is used for baking the uniformly-waxed wafer, and a common oven is adopted.
The shaping edge searching mechanism is used for shaping edges of the baked wafer, as shown in fig. 6, and comprises a supporting table assembly 61 and a shaping edge searching assembly, wherein the supporting table assembly 61 is used for placing the wafer, and the shaping edge searching assembly is used for shaping edges of the wafer.
The shaping edge searching assembly comprises a driving piece and a rotary supporting seat 626, the rotary supporting seat 626 is correspondingly arranged on one side of the supporting table assembly, the driving piece is connected with the rotary supporting seat 626, the driving piece can drive the rotary supporting seat 626 to move back and forth, up and down and rotationally, so that the wafer 63 on the supporting table assembly is supported and rotated, the driving piece comprises a first sliding rail 621, a first sliding block 622, a first air cylinder 623, a first lifting seat 624 and a motor 625, the first sliding block 622 is arranged on the first sliding rail 621 and can slide along the first sliding rail 621, the first air cylinder 623 is fixed on the first sliding block 622, the first air cylinder 623 is connected with the first lifting seat 624, the first air cylinder 623 can drive the first lifting seat 624 to move up and down, the motor 625 is fixed on the first lifting seat 624, the rotary supporting seat 626 is arranged at the top end of the motor 625, and the motor 625 can drive the rotary supporting seat 626 to rotate.
The supporting table assembly shown in fig. 7 comprises a support 611, a supporting table 612, a rotary driving member 614 and positioning clamping jaws 613, wherein the supporting table 612 is fixed at the top end of the support 611, the supporting table 612 is in a circular structure, the diameter of the supporting table is slightly smaller than that of a wafer, a through hole is formed in the center of the supporting table 612 and can be used for a sucker or a rotary supporting seat to pass through, the positioning clamping jaws 613 are respectively and correspondingly arranged at two sides of the supporting table 612, arc-shaped grooves are respectively formed in the opposite surfaces of the two positioning clamping jaws 613, the arc-shaped grooves correspond to the radian of the wafer, the rotary driving member 614 is connected with the two positioning clamping jaws 613, and the rotary driving member 614 can drive the two positioning clamping jaws 613 to rotate simultaneously so as to clamp or unclamp the wafer on the supporting table 612.
During processing, the wafer is sent to the supporting table 612 by the mechanical arm, the rotary driving piece 614 drives the two positioning clamping jaws 613 to simultaneously rotate inwards, and the two positioning clamping jaws 613 can draw the wafer towards the center to realize positioning; then, the first slider 622 drives the first cylinder 623, the first lifting seat 624 and the motor 625 to move forward, so that the rotary support seat 626 is located under the wafer, the first cylinder 623 drives the first lifting seat 624, the motor 625 and the rotary support seat 626 to lift up the wafer, at this time, the motor 625 drives the rotary support seat 626 and the wafer to rotate slowly, the sensor arranged on the side can sense the notch of the wafer, when the notch rotates to a fixed position, the sensor sends out a signal, the motor 625 stops rotating, the first lifting seat 624 descends, the wafer returns to the support table 612, and the shaping edge finding assembly returns to the original position.
The surface mounting and flattening mechanism shown in fig. 8 comprises a mounting platform 71, a positioning table 72 arranged on the mounting platform 71 and used for supporting and driving the ceramic disc to rotate, a turnover assembly 73 used for attaching the wafer to the ceramic disc, and a flattening assembly used for flattening the wafer on the ceramic disc.
The turnover assembly as shown in fig. 9 includes a power member, a rotation shaft 736 and a suction cup 737, wherein the suction cup 737 is correspondingly disposed at one side of the support table assembly, the power member is connected to the rotation shaft 736, the suction cup 737 is fixed on the rotation shaft 736, the power member can drive the rotation shaft 736 and the suction cup 737 to move left and right, up and down and turnover, thereby adsorbing and turnover the wafer, the power member includes a second slide rail 731, a second slide block 732, a second air cylinder 733, a second lifting seat 734 and a rotating air cylinder 735, the second slide block 732 is disposed on the second slide rail 731 and can slide along the second slide rail 731, the second air cylinder 733 is fixed on the second slide block 732, the second air cylinder 733 is connected to the second lifting seat 734, the second air cylinder 733 can drive the second lifting seat 734 to move up and down, the rotating air cylinder 735 is fixed on the second lifting seat 734, and the rotating air cylinder 735 is connected to the rotation shaft 736 and can drive the rotation shaft 736 to rotate axially.
The flat plate assembly is correspondingly arranged above the positioning table 72 and comprises a pressing driving piece 74 and a pressing air bag 75, the pressing driving piece 74 can drive the pressing air bag 75 to move up and down so as to flatten the wafer on the ceramic disc, the pressing air bag 75 is communicated with the air passage, and gradual inflation can be realized through ventilation.
A plurality of positioning assemblies 76 for positioning the ceramic disks are uniformly distributed around the positioning table 72. As shown in fig. 10, the positioning assembly includes a pushing power component 761 and a pushing plate 762, the pushing power component 761 can drive the pushing plate 762 to translate, and an arc-shaped groove 7621 corresponding to the edge of the ceramic disc is formed on the side of the pushing plate 762.
The halving rotary mechanism as shown in fig. 11 comprises a lifting power piece 771, a lifting platform 772 and a rotary power piece 773, wherein the lifting power piece 771 is connected with the lifting platform 772, an air pipe 775 is arranged in the lifting platform 772, an air hole 777 is formed in the upper surface of the top end of the lifting platform 772, the air pipe 775 is communicated with the air hole 777, the lifting power piece 771 can drive the lifting platform 772 to lift so as to penetrate through a through hole of the positioning platform, the rotary power piece 773 is connected with the lifting platform 772, and the rotary power piece 773 can drive the lifting platform 772 to axially rotate.
A rotating plate 776 is fixed at the top end of the lifting platform 772, and the rotating power piece 773 is connected with the rotating plate 776; the bottom of the lifting platform 772 is provided with a connecting seat 774, the lifting power piece 771 is connected with the lifting platform 772 through the connecting seat 774, and a bearing is arranged between the lifting platform 772 and the connecting seat 774.
During processing, the second slider 732 drives the second air cylinder 733, the second lifting seat 734 and the rotary air cylinder 735 to move, so that the suction cup 737 is positioned below the wafer, the second air cylinder 733 drives the second lifting seat 734, the rotary air cylinder 735 and the suction cup 737 to ascend, the suction cup 737 can absorb the wafer, the wafer is moved to the upper part of the ceramic disc on the positioning table 72 through the second slider 732, at the moment, the rotary air cylinder 735 drives the wafer to turn over 180 degrees, the surface coated with glue is downward, and finally the second air cylinder 733 drives the suction cup 737 to move downwards, so that the wafer is attached to the ceramic disc, and one-time attaching is completed; after the patch is attached, the push plate 762 is driven by the two pushing power pieces 761 to move inwards, so that the ceramic disc is positioned; after positioning, the pressing driving piece 74 drives the pressing air bag 75 to descend, and the pressing air bag 75 is inflated for multiple times to bulge, so that the wafer below is flattened for multiple times, and one-time flattening is completed; after the wafer is flattened, the lifting power piece 771 drives the lifting table 772 to lift, the lifting table 772 supports the ceramic disc on the positioning table 72, the air suction mechanism sucks air to adsorb the wafer on the lifting table 772, at the moment, the rotating power piece 773 drives the lifting table 772 and the ceramic disc to rotate for a certain angle, the lifting table 772 descends, the ceramic disc is uniformly rotated once, another pasting can be performed, and the wafer is uniformly pasted on the ceramic disc in a full-scale mode.
The wafer in each mechanism is transferred by the transfer manipulator 2 in each process, the transfer manipulator adopts the transfer manipulator structure of the prior application of the company, and in addition, the invention designs two sets of transfer manipulators.
The full-automatic surface mounting technology comprises the following steps:
s1, taking out a wafer in a bearing basket fixing mechanism, and sending the wafer into a brushing and spin-drying mechanism for brushing and spin-drying;
s2, conveying the wafer subjected to brushing and spin-drying into a wax homogenizing mechanism, and uniformly waxing the surface of the wafer;
s3, conveying the wafer subjected to the uniform wax into a baking mechanism for baking;
s4, sending the dried wafer into a shaping and edge-searching mechanism for shaping and edge-searching;
s5, the overturning assembly adsorbs and overturns the wafer by 180 degrees, then one surface of the wafer with wax is attached to the ceramic disc, and the flat piece assembly carries out air bag flat piece on the wafer after the surface is attached to enable the wafer to be completely attached to the ceramic disc.
It should be noted that the power part, the driving part and the like of the invention can be replaced by related power elements such as an air cylinder, an electric cylinder, a motor, an oil cylinder and the like, and can also adopt corresponding link mechanisms to realize power output, and the invention is not limited by the name or the structure thereof.
In describing embodiments of the present invention, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "configured," and "provided" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "top", "bottom", "inner", "outer", "side", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Finally, it should be noted that: the foregoing examples are merely illustrative of the present invention, and not limiting, and it will be understood by those skilled in the art that the present invention is not limited thereto, and that the present invention has been described in detail with reference to the foregoing examples: any person skilled in the art may modify or easily conceive of the technical solution described in the foregoing embodiments, or perform equivalent substitution of some of the technical features, while remaining within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention, and are intended to be included in the scope of the present invention.
Claims (8)
1. A full-automatic multi-functional paster device, its characterized in that: comprises a bearing basket fixing mechanism, a brushing and spin-drying mechanism, a wax homogenizing mechanism, a baking mechanism, a shaping and edge-searching mechanism, a patch flattening mechanism and a transferring manipulator;
the bearing basket fixing mechanism is used for loading wafers and is provided with a plurality of bearing basket fixing stations used for positioning the bearing baskets;
the brushing and spin-drying mechanism is used for brushing and spin-drying a wafer and comprises a positioning platform assembly and a brushing assembly, the positioning platform assembly comprises a rotary power piece, a rotary platform, a sucker, a lifting power piece, a lifting seat and a protective cover, the sucker is fixed on the rotary platform, the rotary platform is connected with the rotary power piece, the rotary power piece can drive the rotary platform and the sucker to rotate, the protective cover is sleeved outside the rotary platform, the protective cover is fixed on the lifting seat, the lifting power piece is connected with the lifting seat, the lifting power piece can drive the lifting seat and the protective cover to lift up and down so as to enable the rotary platform to enter or leave the protective cover, the brushing assembly comprises a brush disc, a brush disc driving piece, a brush disc swinging power piece, a rocker arm and a rocker arm lifting driving piece, the brush disc is correspondingly arranged above the sucker and fixedly connected with a brush disc rocker arm, the brush disc is connected with the brush disc driving piece, the brush disc driving piece can drive the brush disc to rotate axially, the brush disc swinging power piece can drive the rocker arm and the brush disc, and the brush disc lifting driving piece can be lifted and lowered, and the brush disc driving piece is connected with the brush disc driving piece, and the brush disc rocking driving piece and the brush disc rocking seat;
the wax homogenizing mechanism is used for uniformly waxing the surface of a wafer and comprises a wax throwing component and a wax dripping component, the wax throwing component comprises a protective cover, a lifting power piece, a lifting seat, a rotary power piece and a rotating seat, the lifting power piece is connected with the lifting seat and can drive the lifting seat to lift so as to enter or fall out of the protective cover above, the rotating seat and the rotary power piece are arranged on the lifting seat, the rotary power piece is connected with the rotating seat and can drive the rotating seat to rotate, the wax dripping component is correspondingly arranged on one side of the protective cover, the wax dripping component comprises a wax dripping device and a driving power piece, and the driving power piece is connected with the wax dripping device and can drive the wax dripping device to horizontally move so as to be close to or far away from the center of the protective cover;
the baking mechanism is used for baking the uniformly-waxed wafer and is provided with a baking box;
the shaping edge searching mechanism is used for shaping edges of baked wafers and comprises a supporting table assembly and a shaping edge searching assembly, the supporting table assembly is used for placing the wafers, the shaping edge searching assembly is correspondingly arranged on one side of the supporting table assembly, the shaping edge searching assembly comprises a driving piece and a rotary supporting seat, the rotary supporting seat is correspondingly arranged on one side of the supporting table assembly, the driving piece is connected with the rotary supporting seat, and the driving piece can drive the rotary supporting seat to move forwards and backwards, up and down and rotationally, so that the wafers on the supporting table assembly are supported and rotated;
the chip bonding and leveling mechanism is used for bonding the shaped and edge-seeking wafer on the ceramic disc and leveling the wafer, and comprises a positioning table, a turnover assembly and a leveling assembly, wherein the positioning table is used for supporting and driving the ceramic disc to rotate, the turnover assembly is used for bonding the wafer on the ceramic disc, the leveling assembly is used for leveling the wafer on the ceramic disc, the turnover assembly is correspondingly arranged on one side of the positioning table and comprises a power piece, a rotating shaft and a sucker, the power piece is connected with the rotating shaft, the sucker is fixed on the rotating shaft, the power piece can drive the rotating shaft and the sucker to move left and right, up and down and in a turnover manner, the leveling assembly is correspondingly arranged above the positioning table and comprises a pressing driving piece and a pressing air bag, the pressing driving piece can drive the pressing air bag to move up and down so as to flatten the wafer on the ceramic disc, and the pressing air bag can be ventilated to realize inflation;
the transfer manipulator is used for transferring the wafers in each mechanism;
the brushing and spin-drying mechanism further comprises a cleaning water tank, and the cleaning water tank is fixed outside the protective cover;
the wax homogenizing mechanism further comprises a positioning assembly, the positioning assembly is arranged at the bottom end of the protective cover and comprises a positioning power piece and two positioning arms, arc-shaped positioning blocks are respectively fixed on the positioning arms, the positioning power piece is connected with the two positioning arms, and the positioning power piece can drive the two positioning arms to move inwards or outwards simultaneously so that the arc-shaped positioning blocks clamp or loosen wafers on the rotating seat.
2. The fully automatic multi-functional patch device of claim 1, wherein: the supporting table assembly of the shaping edge searching mechanism comprises a support, a supporting table, a rotary driving piece and positioning clamping jaws, wherein the supporting table is fixed at the top end of the support, a through hole is formed in the center of the supporting table, the positioning clamping jaws are respectively and correspondingly arranged on two sides of the supporting table, arc-shaped grooves are respectively formed in opposite faces of the two positioning clamping jaws, the rotary driving piece is connected with the two positioning clamping jaws, and the rotary driving piece can drive the two positioning clamping jaws to rotate simultaneously so as to clamp or loosen a wafer on the supporting table.
3. The fully automatic multi-functional patch device of claim 2, wherein: the driving piece of the shaping edge finding mechanism comprises a first sliding rail, a first sliding block, a first air cylinder, a first lifting seat and a motor, wherein the first sliding block is arranged on the first sliding rail and can slide along the first sliding rail, the first air cylinder is fixed on the first sliding block and is connected with the first lifting seat, the first air cylinder can drive the first lifting seat to move up and down, the motor is fixed on the first lifting seat, the rotary supporting seat is arranged at the top end of the motor, and the motor can drive the rotary supporting seat to rotate.
4. The fully automatic multi-functional patch device of claim 1, wherein: the brushing and spin-drying mechanism is provided with one or more sets.
5. The fully automatic multi-functional patch device of claim 1, wherein: the transfer robot has one or more sets.
6. The fully automatic multi-functional patch device of claim 1, wherein: the power piece of upset subassembly includes second slide rail, second slider, second cylinder, second elevating seat and revolving cylinder, the second slider sets up on the second slide rail and can follow the second slide rail and slide, the second cylinder is fixed on the second slider, and the second cylinder is connected with the second elevating seat, and the second cylinder can drive the second elevating seat and reciprocate, the revolving cylinder is fixed on the second elevating seat, and revolving cylinder is connected with the rotation axis and can drive rotation axis axial rotation.
7. The fully automatic multi-functional patch device of claim 1, wherein: the patch flat mechanism further comprises an equally-dividing rotating assembly, the equally-dividing rotating assembly comprises a lifting power piece, a lifting table and a rotating power piece, the lifting power piece is connected with the lifting table, an air pipe is arranged in the lifting table, an air hole is formed in the upper surface of the lifting table, the air pipe is communicated with the air hole, the lifting power piece can drive the lifting table to lift so as to penetrate through a through hole of the positioning table, the rotating power piece is connected with the lifting table, and the rotating power piece can drive the lifting table to axially rotate.
8. A fully automatic patch process employing a fully automatic multifunctional patch device according to any one of claims 1 to 7, comprising the steps of:
s1, taking out a wafer in a bearing basket fixing mechanism, and sending the wafer into a brushing and spin-drying mechanism for brushing and spin-drying;
s2, conveying the wafer subjected to brushing and spin-drying into a wax homogenizing mechanism, and uniformly waxing the surface of the wafer;
s3, conveying the wafer subjected to the uniform wax into a baking mechanism for baking;
s4, sending the dried wafer into a shaping and edge-searching mechanism for shaping and edge-searching;
s5, the overturning assembly adsorbs and overturns the wafer by 180 degrees, then one surface of the wafer with wax is attached to the ceramic disc, and the flat piece assembly carries out air bag flat piece on the wafer after the surface is attached to enable the wafer to be completely attached to the ceramic disc.
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| CN110886751B (en) * | 2019-12-04 | 2021-07-27 | 歌尔股份有限公司 | Automatic FPC bonding machine |
| CN111785668B (en) * | 2020-08-03 | 2024-08-13 | 江苏科沛达半导体科技有限公司 | Wafer edge etching machine |
| CN113631025A (en) * | 2021-08-04 | 2021-11-09 | 拓思精工科技(苏州)有限公司 | Silicon carbide seed crystal chip mounter and using method thereof |
| CN114033780A (en) * | 2021-11-18 | 2022-02-11 | 长沙山普智能科技有限公司 | Full-automatic ceramic chip pasting machine and chip pasting method |
| CN114361081B (en) * | 2022-01-12 | 2022-08-09 | 杭州承扬自动化科技有限公司 | Full-automatic wafer pastes wax machine |
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Effective date of registration: 20240829 Address after: 232000 Factory Building No. 5, Ancheng Economic Development Zone, Ancheng Town, Tianjia'an District, Huainan City, Anhui Province Patentee after: Kopeda Semiconductor (Anhui) Co.,Ltd. Country or region after: China Address before: 213000 299 Fu Min Road, Lucheng street, Wujin District, Changzhou, Jiangsu Patentee before: CHANGZHOU KEPEIDA CLEANING TECHNOLOGY Co.,Ltd. Country or region before: China |