CN108520862A - A kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush - Google Patents
A kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush Download PDFInfo
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- CN108520862A CN108520862A CN201810682353.2A CN201810682353A CN108520862A CN 108520862 A CN108520862 A CN 108520862A CN 201810682353 A CN201810682353 A CN 201810682353A CN 108520862 A CN108520862 A CN 108520862A
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- patch
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- rack
- disassembling
- glue
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
Abstract
The invention discloses a kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush, the patch workbench that it includes rack, is arranged in rack, through-hole is offered on patch workbench, the side of rack is fixed with cylinder, the piston rod of cylinder connects slide, and the both sides of slide are equipped with rolling bearing units and servo motor, and screw axis is mounted on rolling bearing units and servo motor, screw axis is threadedly coupled with slide plate, and slide plate is connect with plaster mechanism；It is fixed with tooth plate under slide, is provided with movable rotation-shaft in rack, movable rotation-shaft is provided with gear, is equipped with axle sleeve on the diameter of axle, and gear engages connection with tooth plate, plate is provided on axle sleeve；The lower end of axle sleeve is provided with gumming mechanism, the purpose of the present invention is in view of the above problems, providing a kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush, which can be achieved fast quick-detach, replacement, semi-automatic patch is used simultaneously, improves the patch efficiency and quality of wafer.
Description
Technical field
The invention belongs to communication products field, more particularly to a kind of paster apparatus carrying out fast quick-detach to glue brush, specifically
For a kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush.
Background technology
Being thinned for wafer is frequently involved in semiconductor processes, especially in the preparation process of semiconductor laser chip
In, in order to reach good heat dissipation effect and adapt to laser chip light and small development trend, the wafer by 400 microns is needed to subtract
100 microns are as thin as, however the thinned of wafer thickness leads to the reduction of its mechanical strength, causes to be easy to produce in thinning process
Raw fragment, production yield greatly reduce, therefore before carrying out reduction process, need to exist the front of wafer by adhesive bond
Have on certain thickness glass or ceramic substrate, to facilitate the operation of reduction process, increase wafer mechanical strength, is split to reduce
Piece promotes yield.
Wafer crosses Cheng Qian in patch, needs to smear UV glue to glass cover-plate or wafer, existing paster apparatus is all to use
The mode manually smeared carries out, and due to being smeared using artificial, if the UV glue smeared is excessive, wafer fitting can be made to cool down waiting
Time is longer, if the UV glue smeared is very few, fitting dynamics is inadequate, is easy to fall off, and glue brush makes again after stagnating a period of time
Used time, glue brush can be condensed one, influence brush coating effect, it is therefore desirable to and it is regular that glue brush is replaced or cleaned, and
After smearing UV glue, when carrying out patch, the wafer and glass cover-plate of placement can not ensure the precision of institute's placement location,
Error cannot achieve high accuracy positioning patch, and good time difference when leading to patch quality, levels of audit quality is uneven, and therefore, there is an urgent need for a kind of patches
Sheet devices, to meet the quick patch to wafer.
Invention content
The purpose of the present invention is in view of the above problems, providing a kind of optical branching device wafer patch dress of fast assembling-disassembling glue brush
It sets, while so that plaster mechanism is declined using cylinder, completes the brush coating task to glass cover-plate, while glue brush can be achieved quickly to tear open
It unloads, replace, ensure that the homogeneity of brush coating, which uses semi-automatic patch, improves the patch efficiency and quality of wafer.
In order to achieve the above object, the technical solution adopted by the present invention is：A kind of optical branching device wafer of fast assembling-disassembling glue brush
Paster apparatus, it includes rack, the patch workbench that is arranged in rack, and placement wafer is offered on the patch workbench
It is fixed with cylinder with the side of two through-holes of glass cover-plate, the rack, the piston rod of the cylinder connects slide, the cunning
Seat both sides be equipped with rolling bearing units and servo motor, screw axis be mounted on rolling bearing units and servo motor on, the screw axis with
Slide plate is threadedly coupled, and the slide plate passes through the opening of slide to be connect with plaster mechanism, and the plaster mechanism is located at the upper of through-hole
End；It is fixed with tooth plate on the lower plate of the slide, movable rotation-shaft, the both sides setting of the movable rotation-shaft are provided in rack
There is gear, axle sleeve is installed on the diameter of axle, the gear engages connection with tooth plate, and two groups of circles are offered on the axle sleeve and are inserted
Hole, the interior spray of the jack cross magnetic material, the circular plug of ferrous material are equipped in the jack, and the plug is logical
It crosses mounting plate to be arranged on plate, the plate is arcuate structure, and plate and axle sleeve are concentric, are provided on the plate
Glue brush, the glue brush are located in the through-hole that glass cover-plate is placed；The lower end of axle sleeve is provided with gumming mechanism.
Further, the gumming mechanism by glue loading box and support bar group at being placed with UV glue in the glue loading box.
Further, the plaster mechanism includes a manifold clamp, connecting rod and patch rack, the branch manifold clamp
It is connect with connecting rod with slide plate, paster table frame is arranged in connecting rod；Positioned at the lower end of patch rack, sucker fixed block, institute are set
The lower end for stating sucker fixed block is provided with sucker, and gas-tpe fitting is connect by tracheae with sucker.
Further, inner cavity and the gas outlet for being connected to inner cavity are offered in the patch rack, the gas outlet is located at
Patch rack both sides, branch pipe one end are fixed on branch manifold clamp, and the other end is connected to the inner cavity of patch rack.
Further, it is respectively arranged with the identical left locating piece of shape for placing the through hole of glass cover-plate and wafer
I and left locating piece II, the through hole for placing wafer is provided with the right locating piece II being oppositely arranged with left positioning II, described
Left locating piece I and left locating piece II patch workbench is connected by spring, and left-hand end is provided with the conical surface, the conical surface and patch
It is formed with card slot between piece workbench, is provided on the left of the patch rack and the matched briquetting of the conical surface.
Further, the shape of the left positioning I and left locating piece II is to form the parallel first part of extending direction
And Part III, and the second part of first part and Part III is connected, the second part and first part and third portion
Divide and is vertically arranged.
Further, in wafer patch, the patch rack and left locating piece II, wafer, glass cover-plate and patch
A drying tank is formed between piece workbench, the drying tank is connected to inner cavity by gas outlet.
Further, crank and rocker mechanism, the crank rocker machine are provided with for placing the through-hole lower end of wafer
Structure is made of the tup on mounting base, the driving motor being arranged in mounting base, central shaft and the centrally disposed axis diameter of axle, institute
The tup stated includes pressure head and link block, and the pressure head upper end is arc structure.
Further, the quantity of the tup is 4, on the equidistant centrally disposed axis diameter of axle.
Beneficial effects of the present invention are：
1. the present invention carries out moving down gripping glass cover-plate using cylinder to slide, the engagement of gear is pushed away by tooth plate
Power makes movable rotation-shaft rotate, and realizes and carries out brush coating to glass cover-plate, reduces the use of motor, cleverly design, make entirely to fill
It sets more rationally, by semi-automatic patch, substantially increases the quality of the patch efficiency of wafer.
2. the device uses automatic brush coating, make to be applied to the UV glue amount homogeneous on glass cover-plate, the wafer after patch is high
Degree is consistent.
3. two irony plugs of plate are inserted into jack, attracting with jack magnetism, ensure not easily to fall off when brush coating and move
It is dynamic, it prevents glue brush to be frozen into one convenient for carrying out quick-replaceable or cleaning to glue brush using the fixed form of magnetic, influences to brush
Glue effect.
4. the patch rack with inner cavity, by being filled with hot wind, is accelerated to the solidification after wafer bak stay after patch
Speed.
5. when declining, using the extruding of briquetting, make left locating piece I and left locating piece II to glass cover-plate and wafer into
Row centralized positioning ensures that welt flushes in patch, and the quality being bonded is highly improved, and the stability of wafer obtains
Enhancing.
6. in wafer patch, between patch rack and left locating piece II, wafer, glass cover-plate and patch workbench
A drying tank is formed, the hot gas being filled in drying tank, the hot gas being filled with is dried in drying tank around welt side seam,
Reduce distributing for hot gas.
7. the device makes tup beat wafer after patch flushes, using crank and rocker mechanism, make UV glue laminateds
Tightly, plug is flat, prevents internal hollowing, generates bubble.
8. wafer of the present invention is kept entire patch efficiency quicker, is reduced the labor of worker using semi-automatic patch
Fatigue resistance improves work efficiency.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
Fig. 2 is the partial enlargement structural representation at A in Fig. 1.
Fig. 3 is the structural schematic diagram that brush coating is carried out to glass cover-plate.
Fig. 4 is the attachment structure schematic diagram of axle sleeve and plate.
Fig. 5 is the side structure schematic view of plate.
Fig. 6 is the structural schematic diagram that plaster mechanism draws that glass cover-plate prepares patch.
Fig. 7 is the connection dimensional structure diagram of sucker fixed block and sucker.
Fig. 8 is the partial enlargement structural representation at B in Fig. 6.
Fig. 9 is the structural schematic diagram of left positioning I.
Figure 10 is the structural schematic diagram of tup.
Label character described in figure is expressed as：1, rack；2, cylinder；3, piston rod；4, slide；5, rolling bearing units；6, it watches
Take motor；7, screw axis；8, slide plate；9, plaster mechanism；10, tooth plate；11, gear；12, movable rotation-shaft；13, axle sleeve；14, glue
Brush；15, gumming mechanism；16, patch workbench；17, glass cover-plate；18, wafer；19, left locating piece I；20, sliding slot；21, bullet
Spring；22, right locating piece II；23, left locating piece II；24, UV glue；25, driving motor；26, central shaft；27, tup；28, plate；
29, mounting plate；30, plug；130, jack；151, glue loading box；152, supporting rod；161, through-hole；191, abutment face；192, first
Part；193, second part；194, Part III；231, the conical surface；271, pressure head；272, link block；401, it is open；901, branch pipe
Clamping plate；902, connecting rod；903, gas-tpe fitting；904, sucker fixed block；905, sucker；906, branch pipe；907, patch rack；
908, inner cavity；909, briquetting；910, gas outlet；911, drying tank；912, gap.
Specific implementation mode
In order to make those skilled in the art more fully understand technical scheme of the present invention, below in conjunction with the accompanying drawings to the present invention into
The description of row detailed description, this part is only exemplary and explanatory, should not there is any limitation to protection scope of the present invention
Effect.
As shown in Fig. 1-Figure 10, concrete structure of the invention is：The patch work that it includes rack 1, is arranged in rack 1
Platform 16 offers two through-holes 161 for placing wafer 18 and glass cover-plate 17, the rack 1 on the patch workbench 16
Side be fixed with cylinder 2, the piston rod 3 of the cylinder 2 connects slide 4, and the both sides of the slide 4 are equipped with 5 He of rolling bearing units
Servo motor 6, screw axis 7 are mounted on rolling bearing units 5 and servo motor 6, and the screw axis 7 is threadedly coupled with slide plate 8, is passed through
The step of drive displacement on screw axis 7 of slide plate 8 of servo motor 6, realization intermediate plate and patch, the slide plate 8 passes through opening for slide 4
Mouth 401 is connect with plaster mechanism 9, and the plaster mechanism 9 is located at the upper end of through-hole 161；It is solid on the lower plate of the slide 4
Surely there is tooth plate 10, be provided with movable rotation-shaft 12 in rack 1, the both sides of the movable rotation-shaft 12 are provided with gear 11, pacify on the diameter of axle
Equipped with axle sleeve 13, the gear 11 engages connection with tooth plate 10, and two groups of circular socket holes 130, institute are offered on the axle sleeve 13
It states spray in jack 130 and crosses magnetic material, the circular plug 30 of ferrous material is equipped in the jack 130, it is described to insert
First 30 are arranged by mounting plate 29 on plate 28, and the plate 28 is arcuate structure, and plate 28 and axle sleeve 13 are concentric, institute
Glue brush 14 is provided on the plate 28 stated, the glue brush 14 is located in the through-hole 161 that glass cover-plate 17 is placed；The tooth of rotation
Wheel 11 drives movable rotation-shaft 12 to rotate, and makes glue brush 14 that 24 glue of UV glue to be applied on glass cover-plate 17,14, the glue brush
In in the through-hole 161 that glass cover-plate 17 is placed, convenient for carrying out brush coating to the bottom of glass cover-plate 17；Positioned at the lower end of axle sleeve 13
It is provided with gumming mechanism 15；Using automatic brush coating, make to be applied to the UV glue amount homogeneous on glass cover-plate, the wafer 18 after patch
It is highly consistent, while being coordinated using the irony plug 30 of plate 28 and the jack 130 of magnetic material, so that plate 28 is fixed on axle sleeve
It is easy to disassemble on 13, glue brush 14 is replaced and cleaned.
Preferably, the gumming mechanism 15 is made of glue loading box 151 and supporting rod 152, is placed in the glue loading box 151
UV glue while autosizing, contains the glue of drippage, ensure that the profit of 24 glue of cleannes and UV glue of device
With rate.
Preferably, the plaster mechanism 9 includes a manifold clamp 901, connecting rod 902 and patch rack 907, described
Branch manifold clamp 901 and connecting rod 902 are connect with slide plate 8, and patch rack 907 is arranged in connecting rod 902；Positioned at patch rack
907 lower end setting sucker fixed block 904, the lower end of the sucker fixed block 904 are provided with sucker 905, and gas-tpe fitting 903 is logical
Tracheae is crossed to connect with sucker 905.
Preferably, inner cavity 908 and the gas outlet 910 for being connected to inner cavity 908 are offered in the patch rack 907, it is described
Gas outlet 910 is located at 907 both sides of patch rack, and 906 one end of branch pipe is fixed on branch manifold clamp 901, the other end and patch rack
907 inner cavity 908 is connected to, and the patch rack 907 with inner cavity 908, by being filled with hot wind, is accelerated to wafer after patch
Setting rate after 18 patch of piece.
Preferably, the identical left side of shape is respectively arranged at glass cover-plate 17 and the through-hole 161 of wafer 18 for placing
Locating piece I19 and left locating piece II23 is provided at the through-hole 161 for placing wafer 18 and is oppositely arranged with left positioning II23
Right locating piece II22, the left locating piece I19 and left locating piece II23 patch workbench 16 is connected by spring 21, and
Left-hand end is provided with the conical surface 231, and card slot 20 is formed between the conical surface 231 and patch workbench 16, the patch rack 907
Left side is provided with pushes left locating piece I19 or left locating piece II23 to glass with 231 matched briquetting 909 of the conical surface, briquetting 909
Cover board 17 and wafer carry out intermediate plate positioning and patch positioning, ensure that welt flushes in patch, the quality being bonded obtain compared with
The stability of big promotion, wafer is enhanced.
Preferably, the shape of the left positioning I19 and left locating piece II23 is to form parallel first of extending direction
Divide 192 and Part III 194, and the second part 194 of connection first part 192 and Part III 194, the second part
194 are vertically arranged with first part 192 and Part III 194.
Preferably, in wafer patch, the patch rack 907 and left locating piece II23, wafer 18, glass cover-plate 17
And a drying tank 911 is formed between patch workbench 16, the drying tank 911 is connected to inner cavity 908 by gas outlet 910,
The hot gas being filled in drying tank, the hot gas being filled with are dried in drying tank around welt side seam, and hot gas is reduced
It distributes, improves the reasonable utilization of heat.
Preferably, crank and rocker mechanism, the crank rocker are provided with for placing 161 lower end of through-hole of wafer 18
Mechanism is by the hammer on mounting base, 26 diameter of axle of the driving motor being arranged in mounting base 25, central shaft 26 and centrally disposed axis
First 27 composition, the tup 27 include pressure head 271 and link block 272, and 271 upper end of pressure head is arc structure；It is pasting
While after flushing, by starting driving motor 25, crank and rocker mechanism action is driven, using beaing for tup 27, after ensureing patch
High superposed.
Preferably, the quantity of the tup 27 is 4, on equidistant 26 diameter of axle of centrally disposed axis.
The course of work of the present invention：
Manually or mechanically glass cover-plate 17 and wafer 18 are placed on patch workbench 16 by hand, and such as Fig. 2, glass cover-plate 17 is set
In on left locating piece I19；Such as Fig. 8, wafer 18 is placed in left locating piece 23.Then such as Fig. 1, starts cylinder 2, make piston rod 3
Retraction, slide 4 moves down, and while slide 4 moves down, the rack 10 being arranged on slide 4 drives gear 11 to rotate, drive activity
Shaft 12 rotates, and the glue brush 14 of rotation carries out brush coating to 17 bottom surface of glass cover-plate（The height of glue brush 14 exceeds patch workbench 16
Upper plane）, it is located at the briquetting 909 of patch rack 907 when declining, briquetting 909 pushes left locating piece I19 to move to right, abutment face
191 push glass cover-plate 17 to move, and so that the gap 912 between glass cover-plate 17 and abutment face 191 is converted into fit-state, at this time
Sucker 905 draws glass cover-plate 17, is clamped to glass cover-plate 17.
Then, starting cylinder 2, slide 4 is pushed to rise to certain position, servo motor 6 starts, and screw axis 7 is driven to rotate,
Since for threaded connection, slide plate 8 moves to right, after reaching the positive upper end of wafer 18, cylinder 2 starts, and slide 4 is made to be displaced downwardly to fixation
Position, as shown in Figure 6 and Figure 8, briquetting 909 push left locating piece II23 movements, carry out centralized positioning to wafer 18, ensure patch
Piece flushes, and after patch flushes, crank and rocker mechanism action sees that driving motor 25 drives central shaft 26 to rotate, and makes tup 27 not
Disconnected beats, and prevents internal hollowing, bubble, patch rack 907 and left locating piece II23, wafer 18, glass cover-plate 17 occurs
And drying tank 911 is formed between patch workbench 16, it is filled with hot wind into drying tank 911, fitting side seam is dried, is added
Setting rate after fast welt.
Glue brush 14 is dismantled：
After 14 use of glue brush, the UV glue 24 that is adhered on glue brush 14 can solidify it is agglomerating, to prevent from impacting brush coating, it usually needs
Glue brush 14 is replaced or cleaned, when needing replacing, since plug 30 and the jack 130 on plate 28 are magnetic, only needs hand
It is dynamic to extract plate 28, glue brush 14 can be cleaned.
It should be noted that herein, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or equipment including a series of elements includes not only those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or equipment institute it is intrinsic
Element.
Principle and implementation of the present invention are described for specific case used herein, the explanation of above example
The method and its core concept for being merely used to help understand the present invention are answered the above is only a preferred embodiment of the present invention
When pointing out due to the finiteness of literal expression, and objectively there is unlimited concrete structure, for the common skill of the art
For art personnel, without departing from the principle of the present invention, several improvement, retouching or variation can also be made, can also incited somebody to action
Above-mentioned technical characteristic is combined in the right way；These improve retouching, variation or combination, or the not improved structure by invention
Think and technical solution directly applies to other occasions, is regarded as protection scope of the present invention.
Claims (9)
1. a kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush, which is characterized in that it includes rack（1）, setting exist
Rack（1）On patch workbench（16）, the patch workbench（16）On offer placement wafer（18）And glass cover-plate
（17）Two through-holes（161）, the rack（1）Side be fixed with cylinder（2）, the cylinder（2）Piston rod（3）Connection
Slide（4）, the slide（4）Both sides be equipped with rolling bearing units（5）And servo motor（6）, screw axis（7）Mounted on rolling bearing units
（5）And servo motor（6）On, the screw axis（7）With slide plate（8）It is threadedly coupled, the slide plate（8）Across slide（4）Open
Mouthful（401）With plaster mechanism（9）Connection, the plaster mechanism（9）Positioned at through-hole（161）Upper end；In the slide（4）'s
Tooth plate is fixed on lower plate（10）, rack（1）On be provided with movable rotation-shaft（12）, the movable rotation-shaft（12）Both sides setting
There is gear（11）, axle sleeve is installed on the diameter of axle（13）, the gear（11）With tooth plate（10）Engagement connection, the axle sleeve（13）
On offer two groups of circular socket holes（130）, the jack（130）Magnetic material, the jack are crossed in interior spray（130）Interior cooperation is set
It is equipped with the circular plug of ferrous material（30）, the plug（30）Pass through mounting plate（29）It is arranged in plate（28）On, it is described
Plate（28）For arcuate structure, and plate（28）With axle sleeve（13）With one heart, the plate（28）On be provided with glue brush（14）, institute
The glue brush stated（14）Positioned at glass cover-plate（17）The through-hole placed（161）It is interior；Positioned at axle sleeve（13）Lower end be provided with gluing
Mechanism（15）.
2. a kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush according to claim 1, which is characterized in that institute
State gumming mechanism（15）By glue loading box（151）And supporting rod（152）Composition, the glue loading box（151）Inside it is placed with UV glue.
3. a kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush according to claim 1, which is characterized in that institute
State plaster mechanism（9）Including a manifold clamp（901）, connecting rod（902）And patch rack（907）, the branch manifold clamp
（901）And connecting rod（902）With slide plate（8）Connection, patch rack（907）It is arranged in connecting rod（902）On；Positioned at patch rack
（907）Lower end be arranged sucker fixed block（904）, the sucker fixed block（904）Lower end be provided with sucker（905）, tracheae
Connector（903）Pass through tracheae and sucker（905）Connection.
4. a kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush according to claim 3, which is characterized in that institute
State patch rack（907）Inside offer inner cavity（908）Be connected to inner cavity（908）Gas outlet（910）, the gas outlet
（910）Positioned at patch rack（907）Both sides, branch pipe（906）One end is fixed on branch manifold clamp（901）On, the other end and paster table
Frame（907）Inner cavity（908）Connection.
5. a kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush according to claim 4, which is characterized in that use
In placement glass cover-plate（17）And wafer（18）Through-hole（161）Place is respectively arranged with the identical left locating piece I of shape（19）
With left locating piece II（23）, for placing wafer（18）Through-hole（161）Place is provided with and left positioning II（23）It is oppositely arranged
Right locating piece II（22）, the left locating piece I（19）With left locating piece II（23）Pass through spring（21）Connect patch work
Make platform（16）, and left-hand end is provided with the conical surface（231）, the conical surface（231）With patch workbench（16）Between be formed with card slot
（20）, the patch rack（907）Left side be provided with and the conical surface（231）Matched briquetting（909）.
6. a kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush according to claim 5, which is characterized in that institute
State left positioning I（19）With left locating piece II（23）Shape be to form the parallel first part of extending direction（192）And third
Part（194）, and connection first part（192）And Part III（194）Second part（194）, the second part（194）
With first part（192）And Part III（194）It is vertically arranged.
7. a kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush according to claim 5, which is characterized in that
When wafer patch, the patch rack（907）With left locating piece II（23）, wafer（18）, glass cover-plate（17）And patch
Workbench（16）Between form a drying tank（911）, the drying tank（911）With inner cavity（908）Pass through gas outlet（910）Even
It is logical.
8. a kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush according to claim 4-7 any one,
It is characterized in that, for placing wafer（18）Through-hole（161）Lower end is provided with crank and rocker mechanism, the crank rocker machine
Structure is by mounting base, the driving motor being arranged in mounting base（25）, central shaft（26）And centrally disposed axis（26）On the diameter of axle
Tup（27）Composition, the tup（27）Including pressure head（271）And link block（272）, the pressure head（271）Upper end is
Arc structure.
9. a kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush according to claim 8, which is characterized in that institute
State tup（27）Quantity be 4, equidistant centrally disposed axis（26）On the diameter of axle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810682353.2A CN108520862A (en) | 2018-06-28 | 2018-06-28 | A kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810682353.2A CN108520862A (en) | 2018-06-28 | 2018-06-28 | A kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush |
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| Publication Number | Publication Date |
|---|---|
| CN108520862A true CN108520862A (en) | 2018-09-11 |
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|---|---|---|---|
| CN201810682353.2A Withdrawn CN108520862A (en) | 2018-06-28 | 2018-06-28 | A kind of optical branching device wafer paster apparatus of fast assembling-disassembling glue brush |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364464A (en) * | 2019-08-14 | 2019-10-22 | 常州科沛达清洗技术股份有限公司 | Full-automatic multi-functional paster apparatus and full-automatic paster technique |
| CN110379747A (en) * | 2019-08-14 | 2019-10-25 | 常州科沛达清洗技术股份有限公司 | Full-automatic wafer piece cleans patch all-in-one machine |
| CN112687582A (en) * | 2020-12-14 | 2021-04-20 | 北京七星天禹电子有限公司 | Wafer chip mounter |
| CN113471104A (en) * | 2021-06-10 | 2021-10-01 | 范冬利 | Wisdom community related LED wafer substrate attenuate paster processing apparatus |
-
2018
- 2018-06-28 CN CN201810682353.2A patent/CN108520862A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364464A (en) * | 2019-08-14 | 2019-10-22 | 常州科沛达清洗技术股份有限公司 | Full-automatic multi-functional paster apparatus and full-automatic paster technique |
| CN110379747A (en) * | 2019-08-14 | 2019-10-25 | 常州科沛达清洗技术股份有限公司 | Full-automatic wafer piece cleans patch all-in-one machine |
| CN110364464B (en) * | 2019-08-14 | 2024-02-06 | 常州科沛达清洗技术股份有限公司 | Full-automatic multifunctional paster device and full-automatic paster process |
| CN110379747B (en) * | 2019-08-14 | 2024-02-06 | 常州科沛达清洗技术股份有限公司 | Full-automatic wafer cleaning and pasting integrated machine |
| CN112687582A (en) * | 2020-12-14 | 2021-04-20 | 北京七星天禹电子有限公司 | Wafer chip mounter |
| CN113471104A (en) * | 2021-06-10 | 2021-10-01 | 范冬利 | Wisdom community related LED wafer substrate attenuate paster processing apparatus |
| CN113471104B (en) * | 2021-06-10 | 2023-12-12 | 鄂尔多斯市同晖电子科技有限公司 | LED chip substrate thinning patch processing device related to intelligent community |
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