CN202965420U - Silicon wafer mounter - Google Patents
Silicon wafer mounter Download PDFInfo
- Publication number
- CN202965420U CN202965420U CN 201220720095 CN201220720095U CN202965420U CN 202965420 U CN202965420 U CN 202965420U CN 201220720095 CN201220720095 CN 201220720095 CN 201220720095 U CN201220720095 U CN 201220720095U CN 202965420 U CN202965420 U CN 202965420U
- Authority
- CN
- China
- Prior art keywords
- cooler pan
- cylinder
- sucker
- movable stand
- silicon chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a silicon wafer mounter. The silicon wafer mounter comprises a bracket, a turntable, a sucker, a movable rack, a heating plate, a cooling plate, a pressing plate, a cylinder and a mounting table, wherein the turntable, the heating plate and the cooling plate are sequentially arranged on the bracket, the movable rack is arranged beside the turntable and the heating plate, the sucker is fixedly connected with the movable rack, and the movable rack can be used for moving the sucker all around; and the pressing plate is arranged above the cooling plate, the pressing plate is fixedly connected with the cylinder, and the cylinder is fixedly arranged on the mounting table. Compared with the prior art, the silicon wafer mounter disclosed by the utility model has the advantages that a plurality of silicon wafers are arranged on the turntable, and each silicon wafer has a corresponding suction hole, so that a plurality of wafer mounting tasks can be finished by moving once, the mounting efficiency is high, the precision is high, and the mounting quality is good.
Description
Technical field
The utility model relates to the silicon chip chip mounter, belongs to mechanical manufacturing field.
Background technology
The silicon chip paster is requisite program in silicon chip working process, and main at present paster speed is slow manually by the frock clamp manual operations inefficiency of customization, and the paster quality is unstable, affects product quality and enterprise development.
The utility model content
The purpose of this utility model is to overcome above shortcomings in prior art, thereby provides a kind of reasonable in design, paster efficient high, the chip mounter of silicon chip easily easy and simple to handle.
The technical scheme in the invention for solving the above technical problem is: this silicon chip chip mounter, comprise support, rotating disk, sucker, movable stand, heating plate, cooler pan, platen, cylinder, erecting bed, rotating disk, heating plate and cooler pan are installed on described support successively, the other movable stand that is provided with of rotating disk and heating plate, described sucker and movable stand fixed installation, the movable stand sucker that can move up and down, be provided with platen directly over described cooler pan, platen and cylinder fixed installation, cylinder is fixedly mounted on erecting bed.
Platen described in the utility model top is provided with stabiliser bar, and when cylinder promotion platen moved up and down, stabiliser bar played the effect that disperses the stability under loading cylinder to promote.
Movable stand described in the utility model comprises guide rail, slide block, two bar cylinder and crossbeam, and described guide rail is fixedly connected with support, and slide block and guide rail are slidably connected, and two bar cylinders lower ends is fixedly connected with slide block, two bar cylinders upper end fixed installation crossbeam.
Sucker described in the utility model comprises lower wall and upper dish, and described lower wall is installed rear inside with upper dish combination and become to be hollow, and lower wall is provided with suction hole, and upper dish is provided with aspirating hole.
Cooler pan described in the utility model comprises lower cooler pan and upper cooler pan, and described lower cooler pan is installed the rear inner hollow that becomes to be with upper cooler pan combination.
Suction hole described in the utility model is evenly distributed on lower wall
The utility model has the following advantages compared to existing technology:
1, the utility model can be placed a plurality of silicon chips on rotating disk, and each silicon chip has with it the suction hole of use relatively, the once a plurality of paster task of just completing of therefore moving, and paster efficient is high.
2, the utility model adopts the cylinder paster, and precision is high, and the paster quality is good.
3, the utility model adopts platen to compress maintenance, and ground has cooler pan and adopts water cooling, and good cooling results compresses precision high, steady quality.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation at another visual angle of the present utility model.
Fig. 3 is the structural representation of sucker described in the utility model.
Fig. 4 is the structural representation of cooler pan described in the utility model.
Label declaration: support 1, rotating disk 2, sucker 3, movable stand 4, heating plate 5, cooler pan 6, platen 7, stabiliser bar 8, cylinder 9, erecting bed 11, ceramic disk 10, guide rail 41, slide block 42, two bar cylinder 43, crossbeam 44, lower wall 31, upper dish 32, suction hole 311, aspirating hole 321, lower cooler pan 51, upper cooler pan 52
The specific embodiment
The utility model is described in further detail below in conjunction with accompanying drawing and by embodiment.
Embodiment:
Referring to Fig. 1 to Fig. 4, silicon chip chip mounter in the present embodiment, comprise support 1, rotating disk 2, sucker 3, movable stand 4, heating plate 5, cooler pan 6, platen 7, cylinder 9, erecting bed 11, rotating disk 2, heating plate 5 and cooler pan 6 are installed on described support 1 successively, the other movable stand 4 that is provided with of rotating disk 5 and heating plate 5, described sucker 3 and movable stand 4 fixed installations, movable stand 4 sucker 3 that can move up and down, be provided with platen 7 directly over described cooler pan 5, platen 7 fixedly mounts with the push rod of cylinder 9, and cylinder 9 stands upside down and is fixed on erecting bed 11.
Platen described in the utility model 7 tops are provided with stabiliser bar 8, and when cylinder 9 promotion platens 7 moved up and down, stabiliser bar 8 played the effect that disperses stability under loading cylinder 9 to promote.
Described movable stand 4 described in the utility model comprises guide rail 41, slide block 42, two bar cylinder 43 and crossbeam 44, described guide rail 41 is fixedly connected with support 1, slide block 42 is slidably connected with guide rail 41, two bar cylinders 43 lower ends are fixedly connected with slide block 42, two bar cylinder 43 upper end fixed installation crossbeams 44, crossbeam 44 connecting suckers 3, sucker 3 can move around at 5 places from rotating disk 2 to heating plate.
Described sucker 3 described in the utility model comprises lower wall 31 and upper dish 32, described lower wall 31 is installed the rear inner hollow that becomes to be with upper dish 31 combinations, lower wall 31 evenly is provided with a plurality of suction holes 311, and upper dish 32 is provided with aspirating hole 321, and aspirating hole 321 adopts breather pipe to be communicated with air pump.
Described cooler pan 5 described in the utility model comprises lower cooler pan 51 and upper cooler pan 52, and described lower cooler pan 51 is installed the rear inner hollow that becomes to be with upper cooler pan 52 combinations.
During use, at first manually silicon chip is placed on the assigned address of rotating disk 2, place ceramic disk 10 to be bonded on heating plate 5, after piling, opens silicon chip the silicon chip chip mounter, air pump is bled, aspirating hole 321 on sucker 3 picks up corresponding silicon chip, move to heating plate 5 tops, on ceramic disk 10, after artificial brushing glue, sucker 3 moves down the rear venting of contact ceramic disk 10, unloading lower silicon slice returns, the ceramic disk 10 that manually will be pasted with silicon chip moves to cooler pan 5, and the interior hollow of cooler pan 5 is filled with cooling water, and platen 7 moves down, compress silicon chip, take out after cooling.
Claims (5)
1. silicon chip chip mounter, it is characterized in that: comprise support, rotating disk, sucker, movable stand, heating plate, cooler pan, platen, cylinder and erecting bed, rotating disk, heating plate and cooler pan are installed on described support successively, the other movable stand that is provided with of rotating disk and heating plate, the fixed installation of described sucker and movable stand, the movable stand sucker that can move up and down is provided with platen directly over described cooler pan, platen and cylinder fixed installation, cylinder is fixedly mounted on erecting bed.
2. silicon chip chip mounter according to claim 1, is characterized in that: be provided with stabiliser bar above described platen.
3. silicon chip chip mounter according to claim 1, it is characterized in that: described movable stand comprises guide rail, slide block, two bar cylinder and crossbeam, described guide rail is fixedly connected with support, slide block and guide rail are slidably connected, two bar cylinders lower end is fixedly connected with slide block, two bar cylinders upper end fixed installation crossbeam.
4. silicon chip chip mounter according to claim 1, it is characterized in that: described sucker comprises lower wall and upper dish, and described lower wall becomes to be hollow with inner after upper dish combination is installed, and lower wall is provided with suction hole, and upper dish is provided with aspirating hole.
5. silicon chip chip mounter according to claim 1, it is characterized in that: described cooler pan comprises lower cooler pan and upper cooler pan, innerly after described lower cooler pan and the combination of upper cooler pan are installed becomes to be hollow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220720095 CN202965420U (en) | 2012-12-05 | 2012-12-05 | Silicon wafer mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220720095 CN202965420U (en) | 2012-12-05 | 2012-12-05 | Silicon wafer mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202965420U true CN202965420U (en) | 2013-06-05 |
Family
ID=48506543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220720095 Expired - Fee Related CN202965420U (en) | 2012-12-05 | 2012-12-05 | Silicon wafer mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202965420U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103394784B (en) * | 2013-07-31 | 2016-09-28 | 陕西航天机电环境工程设计院有限责任公司 | Capacitor body automatic soldering device |
| CN109986459A (en) * | 2017-12-29 | 2019-07-09 | 山东浪潮华光光电子股份有限公司 | A kind of heat dissipation tool and its application for chip ceramic disk in LED chip substrate reduction process |
-
2012
- 2012-12-05 CN CN 201220720095 patent/CN202965420U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103394784B (en) * | 2013-07-31 | 2016-09-28 | 陕西航天机电环境工程设计院有限责任公司 | Capacitor body automatic soldering device |
| CN109986459A (en) * | 2017-12-29 | 2019-07-09 | 山东浪潮华光光电子股份有限公司 | A kind of heat dissipation tool and its application for chip ceramic disk in LED chip substrate reduction process |
| CN109986459B (en) * | 2017-12-29 | 2021-04-06 | 山东浪潮华光光电子股份有限公司 | Heat dissipation tool for surface-mounted ceramic disc in LED chip substrate thinning process and application of heat dissipation tool |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 314031, No. 13, China energy saving Jiaxing Industrial Park, No. 1509, Chong Chong Road, Xiuzhou Industrial Park, Zhejiang, Jiaxing Patentee after: Zhejiang CIS Intelligent Equipment Co., Ltd. Address before: 314000, 318 Jiaxing Road, Xiuzhou Industrial Zone, Zhejiang, China Patentee before: Jiaxing Shunlian Rubber and Plastic Machinery Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130605 Termination date: 20161205 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |