CN210040153U - Full-automatic multifunctional paster device - Google Patents
Full-automatic multifunctional paster device Download PDFInfo
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- CN210040153U CN210040153U CN201921319774.5U CN201921319774U CN210040153U CN 210040153 U CN210040153 U CN 210040153U CN 201921319774 U CN201921319774 U CN 201921319774U CN 210040153 U CN210040153 U CN 210040153U
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Abstract
The utility model relates to a full-automatic multi-functional paster device, including bearing basket fixed establishment, brushing the mechanism that spin-dries, even wax mechanism, toast the mechanism, the limit mechanism is sought in the plastic, paster plain film mechanism and shift the manipulator, in proper order through scrub spin-dry, even wax, toast, the plastic is sought limit, paster, plain film and is accomplished the paster. This full-automatic multi-functional paster device is through bearing basket fixed establishment, scrubbing mechanism, the even wax mechanism that spin-dries, toasts the mechanism, limit mechanism, the plain piece mechanism of paster are sought in the plastic and transferring mutually supporting of manipulator, can realize that the scrubbing of wafer is spin-dried, even wax, toasts, the plastic is sought functions such as limit, the plain piece of paster to guarantee the paster effect of wafer, improved the cleanliness factor of product, guaranteed product quality.
Description
Technical Field
The utility model relates to an electronic product processing technology field especially relates to a full-automatic multi-functional paster device.
Background
The demand of the semiconductor market in China for loading machines is rapidly increased, the labor force is in short supply, and the labor cost is continuously increased, so that the demand of manufacturers for automatic equipment is improved, and the semiconductor market packaging machine has obvious effects of reducing the production cost and improving the product yield.
The existing wafer (sapphire wafer, silicon wafer, etc.) needs to be processed by a plurality of procedures, such as cleaning, gluing (waxing), pasting, shoveling, storing, etc. Especially, the process of surface mounting is very important, and if the surface mounting is uneven or impurities are contained on the surface, the subsequent product quality is greatly influenced. The prior patent number of this company was CN 104759974A's a full-automatic chip mounter, the device can realize full-automatic paster, does not pass through before the paster and washs, and direct paster leads to impurity or dust etc. to mix into between wafer and the ceramic dish easily, influences the degree of consistency of paster, leads to the emergence of substandard product even. Meanwhile, the prior chip mounter is only suitable for circular wafers, and accurate chip mounting cannot be realized for irregular wafers.
SUMMERY OF THE UTILITY MODEL
In order to overcome the shortcoming of the prior art, the utility model provides a degree of automation is high, the location is accurate, the effectual full-automatic multi-functional paster device of paster.
The utility model discloses a realize through following technical scheme: a full-automatic multifunctional paster device comprises a bearing basket fixing mechanism, a brushing and spin-drying mechanism, a wax homogenizing mechanism, a baking mechanism, a shaping and edge searching mechanism, a paster flattening mechanism and a transfer manipulator;
the carrier basket fixing mechanism is used for loading a wafer and is provided with a plurality of carrier basket fixing stations for positioning the carrier basket;
the scrubbing and spin-drying mechanism is used for scrubbing and spin-drying the wafer, and comprises a positioning platform assembly and a scrubbing assembly, wherein the positioning platform assembly comprises a rotary power part, a rotary platform, a sucker, a lifting power part, a lifting seat and a protective cover, the sucker is fixed on the rotary platform, the rotary platform is connected with the rotary power part, the rotary power part can drive the rotary platform and the sucker to rotate, the protective cover is sleeved outside the rotary platform, the protective cover is fixed on the lifting seat, the lifting power part is connected with the lifting seat, the lifting power part can drive the lifting seat and the protective cover to lift up and down, so that the rotary platform can enter or separate from the protective cover, the scrubbing assembly comprises a brush disc, a brush disc driving part, a brush disc swinging power part, a rocker arm and a rocker arm lifting driving part, the brush disc is correspondingly arranged above the sucker and fixedly connected with the brush disc rocker arm, and the brush disc is connected, the brush disc power part can drive the brush disc to axially rotate, the brush disc swinging power part is connected with the rocker arm, the brush disc swinging power part can drive the rocker arm and the brush disc to swing, the rocker arm lifting driving part is connected with the brush disc swinging power part, and the rocker arm lifting driving part can drive the brush disc swinging power part to lift;
the wax homogenizing mechanism is used for uniformly coating wax on the surface of a wafer and comprises a wax throwing component and a wax dropping component, the wax throwing component comprises a protective cover, a lifting power part, a lifting seat, a rotary power part and a rotary seat, the lifting power part is connected with the lifting seat and can drive the lifting seat to lift so as to enter or separate from the protective cover above, the rotary seat and the rotary power part are arranged on the lifting seat, the rotary power part is connected with the rotary seat and can drive the rotary seat to rotate, the wax dropping component is correspondingly arranged on one side of the protective cover, the wax dropping component comprises a wax dropping device and a driving power part, and the driving power part is connected with the wax dropping device and can drive the wax dropping device to horizontally move so as to be close to or far away from the center of;
the baking mechanism is used for baking the wafer after the wax is evenly distributed and is provided with a baking box;
the shaping and edge-searching mechanism is used for shaping and searching edges of the baked wafer and comprises a supporting platform assembly and a shaping and edge-searching assembly, the supporting platform assembly is used for placing the wafer, the shaping and edge-searching assembly is correspondingly arranged on one side of the supporting platform assembly, the shaping and edge-searching assembly comprises a driving piece and a rotary supporting seat, the rotary supporting seat is correspondingly arranged on one side of the supporting platform assembly, the driving piece is connected with the rotary supporting seat, and the driving piece can drive the rotary supporting seat to move forwards and backwards, upwards and downwards and rotate so as to support the wafer on the supporting platform assembly and enable the wafer to rotate;
the chip flattening mechanism is used for attaching the shaped edge-searched wafer to a ceramic disc and flattening the wafer, and comprises a positioning table, an overturning assembly and a flattening assembly, wherein the positioning table is used for supporting and driving the ceramic disc to rotate, the overturning assembly is used for attaching the wafer to the ceramic disc, the flattening assembly is used for flattening the wafer on the ceramic disc, the overturning assembly is correspondingly arranged on one side of the positioning table and comprises a power piece, a rotating shaft and a sucking disc, the power piece is connected with the rotating shaft, the sucking disc is fixed on the rotating shaft, the power piece can drive the rotating shaft and the sucking disc to move left and right, up and down and overturn, the flattening assembly is correspondingly arranged above the positioning table and comprises a pressing driving piece and a pressing air bag, the pressing air bag can be driven to move up and down to flatten the wafer on the ceramic disc, and the pressing air bag can;
the transfer manipulator is used for transferring the wafers in each mechanism.
In order to facilitate the brush disc to be stained with water and ensure the cleaning effect, the brushing and spin-drying mechanism further comprises a cleaning water tank which is fixed outside the protective cover.
In order to guarantee the even wax effect, even wax mechanism still includes locating component, locating component sets up in the protection casing bottom, including location power spare and two locating arms, is fixed with the arc locating piece on the locating arm respectively, location power spare is connected with two locating arms, and location power spare can drive two locating arms and inwards or outwards remove simultaneously to make the arc locating piece press from both sides the tight wafer on or unclamp the roating seat.
In order to can pinpoint the wafer, limit mechanism's a supporting bench subassembly includes support, brace table, rotary driving spare and location clamping jaw is sought in the plastic, the brace table is fixed on the support top, and the brace table center has the through-hole, the location clamping jaw is a pair of, corresponds the setting respectively in a supporting bench both sides, is equipped with the arc wall on the opposite face of two location clamping jaws respectively, rotary driving spare is connected with two location clamping jaws, and rotary driving spare can drive two location clamping jaws and rotate simultaneously to press from both sides tightly or loosen the wafer on the brace table.
In order to drive the rotary supporting seat to do front-back, up-down and rotary motion, the driving piece of the shaping edge finding mechanism comprises a first slide rail, a first slide block, a first air cylinder, a first lifting seat and a motor, wherein the first slide block is arranged on the first slide rail and can slide along the first slide rail, the first air cylinder is fixed on the first slide block and is connected with the first lifting seat, the first air cylinder can drive the first lifting seat to move up and down, the motor is fixed on the first lifting seat, the rotary supporting seat is arranged at the top end of the motor, and the motor can drive the rotary supporting seat to rotate.
In order to improve the brushing efficiency and ensure the patch efficiency, the brushing and spin-drying mechanism is provided with one set or a plurality of sets.
In order to improve the transfer efficiency of the wafer, the transfer robot has one or more sets.
In order to drive the adsorption table to do left-right, up-down and turnover motions, the power part of the turnover assembly comprises a second slide rail, a second slide block, a second cylinder, a second lifting seat and a rotary cylinder, the second slide block is arranged on the second slide rail and can slide along the second slide rail, the second cylinder is fixed on the second slide block and connected with the second lifting seat, the second cylinder can drive the second lifting seat to move up and down, the rotary cylinder is fixed on the second lifting seat and connected with the rotary shaft and can drive the rotary shaft to rotate axially.
In order to facilitate the driving of the ceramic disc to rotate in an equant manner, the patch flattening mechanism further comprises an equant rotating assembly, the equant rotating assembly comprises a lifting power piece, a lifting table and a rotating power piece, the lifting power piece is connected with the lifting table, an air pipe is arranged in the lifting table, the upper surface of the lifting table is provided with an air hole, the air pipe is communicated with the air hole, the lifting power piece can drive the lifting table to lift so as to penetrate through a through hole of the positioning table, the rotating power piece is connected with the lifting table, and the rotating power piece can drive the lifting table to rotate axially.
The utility model also provides a full-automatic paster technology adopts above-mentioned full-automatic multi-functional paster device, including following step:
s1, taking out the wafer in the bearing basket fixing mechanism, and conveying the wafer into a brushing and spin-drying mechanism for brushing and spin-drying;
s2, conveying the wafer after being brushed and dried into a wax homogenizing mechanism, and uniformly waxing the surface of the wafer;
s3, sending the wafer after wax mixing into a baking mechanism for drying;
s4, sending the dried wafer into a shaping and edge searching mechanism for shaping and edge searching;
and S5, the wafer is turned over by 180 degrees through the turning assembly, then the surface of the wafer with the wax is attached to the ceramic disc, and the wafer after being attached is subjected to airbag flattening through the flattening assembly, so that the wafer is completely attached to the ceramic disc.
The utility model has the advantages that: this full-automatic multi-functional paster device and full-automatic paster technology are through bearing basket fixed establishment, scrubbing mechanism, the even wax mechanism of spin-drying, toast the mechanism, the limit mechanism is sought in the plastic, the flat piece mechanism of paster and transferring mutually supporting of manipulator, can realize functions such as the scrubbing spin-drying of wafer, even wax, toast, limit, the flat piece of paster is sought in the plastic to guarantee the paster effect of wafer, improved the cleanliness factor of product, guaranteed product quality.
Drawings
Fig. 1 is a schematic perspective view of the fully automatic multifunctional sheet sticking device of the present invention;
fig. 2 is a schematic perspective view of the brushing and spin-drying mechanism of the present invention;
fig. 3 is a schematic view of the three-dimensional structure of the brushing and spin-drying mechanism of the present invention after the protective cover is removed;
FIG. 4 is a schematic perspective view of the wax homogenizing mechanism of the present invention;
FIG. 5 is a schematic view of the three-dimensional structure of the wax homogenizing mechanism with the protective cover removed;
fig. 6 is a schematic perspective view of the shaping edge-finding mechanism of the present invention;
fig. 7 is a schematic perspective view of the supporting table assembly of the present invention;
fig. 8 is a schematic perspective view of the patch flattening mechanism of the present invention;
fig. 9 is a schematic perspective view of the turnover assembly of the present invention;
fig. 10 is a schematic structural view of the positioning assembly of the present invention;
fig. 11 is a schematic perspective view of the halving rotating mechanism of the present invention.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and the protection scope of the present invention can be clearly and clearly defined.
As shown in fig. 1, the full-automatic multifunctional sheet sticking device comprises a bearing basket fixing mechanism 1, a brushing and spin-drying mechanism 3, a wax homogenizing mechanism 5, a baking mechanism 4, a shaping and edge-searching mechanism 6, a sheet sticking and flattening mechanism 7 and a transfer manipulator 2.
The bearing basket fixing mechanism 1 is used for loading wafers, a plurality of bearing basket fixing stations used for positioning the bearing basket are arranged, and a plurality of wafers are inserted into each station.
The wafer brushing and spin-drying mechanism is used for brushing and spin-drying a wafer, and comprises a positioning platform assembly and a brushing assembly, the positioning platform assembly comprises a rotary power piece 211, a rotary platform 25, a sucker 214, a lifting power piece 24, a lifting seat 213 and a protective cover, the sucker 214 is fixed at the top end of the rotary platform 25, the rotary platform 25 is connected with the rotary power piece 211, the rotary power piece 211 can drive the rotary platform 25 and the sucker 214 to rotate, the protective cover is sleeved outside the rotary platform 25 and fixed on the lifting seat 213, the protective cover comprises an outer cover 210 and an inner cover 2101, the outer cover 210 is fixed on a support and sleeved outside the inner cover 2101, the inner cover 2101 is fixed on the lifting seat 213 and can lift up and down along with the lifting seat 213, the lifting power piece 24 is connected with the lifting seat 213 through a lifting frame 28 and a guide rod 29, and the lifting power piece 24 can drive the lifting seat 213 and the lifting seat 213 to lift up and down, thereby moving the rotary platform 25 into and out of the protective cover; the brushing assembly comprises a brush disc 23, a brush disc driving part 21, a brush disc swinging power part 27, a rocker arm 22 and a rocker arm lifting driving part 215, wherein the brush disc 23 is correspondingly arranged above the sucker 214 and fixedly connected with the brush disc rocker arm 22, the brush disc 23 is connected with the brush disc power part 21, the brush disc power part 21 can drive the brush disc 23 to axially rotate, the brush disc swinging power part 27 is connected with the rocker arm 22, the brush disc swinging power part 27 can drive the rocker arm 22 and the brush disc 23 to swing, the rocker arm lifting driving part 215 is connected with the brush disc swinging power part 27, the rocker arm lifting driving part 215 can drive the brush disc swinging power part 27 and the rocker arm 22 to lift, a dial indicator 216 is arranged on one side of the rocker arm lifting driving part 215, and a cleaning water tank 26 is fixed on one side of the lifting.
The utility model discloses a two sets scrub the mechanism that spin-dries, function simultaneously to improve and scrub spin-dry efficiency.
When in processing, a wafer is sent to the suction disc 214 by the transfer manipulator, the wafer is sucked by the suction disc 214, the lifting power part 24 drives the lifting seat 213 and the inner cover 2101 to ascend, the inner cover 2101 is sleeved outside the wafer, the brush disc swinging power part 27 drives the rocker arm 22 and the brush disc 23 to swing, the brush disc 23 is soaked with water, then the rocker arm lifting driving part 215 drives the brush disc swinging power part 27 and the rocker arm 22 to descend, the brush disc 23 descends to the upper surface of the wafer, the rotating power part 211 drives the rotating platform 25, the suction disc 214 and the wafer to rotate at a slow speed, the brush disc swinging power part 27 simultaneously drives the rocker arm 22 and the brush disc 23 to swing, so that the brush disc 23 uniformly brushes the surface of the wafer, after brushing, the rotating platform 25 slightly descends to separate the wafer from the brush disc 23, the rotating power part 211 drives the rotating platform 25, the suction disc 214 and the wafer to rotate at a high speed, and liquid on the surface of the wafer is dried, after the wafer is dried, the wafer descends and is grabbed by the transfer manipulator and sent to the next station.
The wax homogenizing mechanism is used for uniformly coating wax on the surface of a wafer, and as shown in fig. 4, the wax homogenizing mechanism comprises a support 51, a protective cover 52, a wax throwing component and a wax dropping component, the protective cover 52 is fixed at the top end of the support 51, an opening is formed at the bottom end of the protective cover 52, a top cover 53 is arranged at the top end of the protective cover 52, a through groove 531 is formed in the top cover 53, the through groove 531 extends from the edge of the top cover 53 to the center of the top cover 53, the wax throwing component is correspondingly arranged below the protective cover 52, the wax throwing component comprises a lifting power piece 54, a lifting seat 55, a rotating power piece 56 and a rotating seat 57, the lifting power piece 54 is a group, guide rods 58 are respectively arranged at two sides of the lifting seat 55, the lifting power piece 54 drives the lifting seat 55 to lift up and down along the guide rods 58 so as to drive the lifting seat 55 to lift to enter or, the rotating power member 56 is connected with the rotating base 57 and can drive the rotating base to rotate, the wax dropping assembly is correspondingly arranged on one side of the protective cover 52, the wax dropping assembly comprises a wax dropping device 510 and a driving power member 59, the wax dropping device 510 can move along the through groove 531, and the driving power member 59 is connected with the wax dropping device 510 and can drive the wax dropping device 510 to horizontally move to be close to or far away from the center of the protective cover 52.
As shown in fig. 5, the wafer waxing mechanism further includes a positioning component, the positioning component is disposed at the bottom end of the protective cover, and includes a positioning power component 511 and two positioning arms 512, arc-shaped positioning blocks 513 are respectively fixed on the two positioning arms 512, the positioning power component 511 is connected to the two positioning arms 512, and the positioning power component 511 can drive the two positioning arms 512 to move inwards or outwards at the same time, so that the arc-shaped positioning blocks 513 clamp or loosen the wafer on the rotating base.
During processing, a wafer is conveyed to the rotating base 57 by a manipulator, the lifting power part 54 drives the lifting base 55 and the rotating base 57 to ascend, the positioning power part 511 drives the two positioning arms 512 to move inwards simultaneously, so that the two arc-shaped positioning blocks 513 position the wafer and enable the wafer to be positioned at the center of the top of the rotating base 57, after the positioning is completed, the lifting power part 54 continues to drive the lifting base 55 and the rotating base 57 to ascend, so that the rotating base 57 enters the protective cover 52, at the moment, the driving power part 59 drives the wax dropping device 510 to extend forwards, the wax dropping device 510 is positioned at the center above the rotating base 57, the wax dropping device 510 starts to drop wax, during the wax dropping process, the rotating power part 56 drives the rotating base 57 to rotate to generate a centrifugal effect, so that the upper surface of the wafer is gradually and uniformly coated with wax, after the wax is uniformly distributed, the lifting base 55 descends, and the manipulator takes out the.
The baking mechanism is used for baking the wafer after wax is evenly distributed, and a common oven is adopted.
The shaping edge searching mechanism is used for shaping and searching edges of the baked wafer, and comprises a supporting platform component 61 and a shaping edge searching component, as shown in fig. 6, wherein the supporting platform component 61 is used for placing the wafer, and the shaping edge searching component is used for shaping and searching edges of the wafer.
The shaping edge-searching component comprises a driving component and a rotary supporting seat 626, the rotary supporting seat 626 is correspondingly arranged at one side of the supporting seat component, the driving member is connected with the rotary support 626, the driving member can drive the rotary support 626 to move back and forth, up and down and rotate, thereby supporting and rotating the wafer 63 on the support table assembly, the driving member includes a first slide rail 621, a first slide block 622, a first cylinder 623, a first lift seat 624 and a motor 625, the first slider 622 is disposed on the first sliding rail 621 and can slide along the first sliding rail 621, the first cylinder 623 is fixed on the first slide block 622, the first cylinder 623 is connected with the first lifting seat 624, the first cylinder 623 can drive the first lifting seat 624 to move up and down, the motor 625 is fixed on the first lifting seat 624, the rotary support 626 is arranged on the top end of the motor 625, and the motor 625 can drive the rotary support 626 to rotate.
As shown in fig. 7, the supporting table assembly includes a support 611, a supporting table 612, a rotary driving element 614 and positioning jaws 613, the supporting table 612 is fixed on the top end of the support 611, the supporting table 612 is an annular structure, the diameter of which is slightly smaller than the diameter of the wafer, a through hole is formed in the center of the supporting table 612 for the suction cup or the rotary supporting seat to pass through, the positioning jaws 613 are a pair and are respectively disposed on two sides of the supporting table 612, arc-shaped grooves are respectively disposed on opposite surfaces of the two positioning jaws 613, the arc-shaped grooves correspond to the radian of the wafer, the rotary driving element 614 is connected to the two positioning jaws 613, and the rotary driving element 614 can drive the two positioning jaws 613 to rotate simultaneously to clamp or loosen.
During processing, the manipulator delivers the wafer to the support platform 612, the rotary driving element 614 drives the two positioning clamping jaws 613 to rotate inwards at the same time, and the two positioning clamping jaws 613 can draw the wafer close to the center to realize positioning; then the first slider 622 drives the first cylinder 623, the first lifting seat 624 and the motor 625 to move forward, so that the rotary support 626 is located under the wafer, the first cylinder 623 drives the first lifting seat 624, the motor 625 and the rotary support 626 to ascend, so as to jack up the wafer, at this time, the motor 625 drives the rotary support 626 and the wafer to slowly rotate, a sensor arranged on the side part can sense a notch of the wafer, when the notch rotates to a fixed position, the sensor sends a signal, the motor 625 stops rotating, the first lifting seat 624 descends, the wafer returns to the support table 612, and the shaping edge finding assembly returns to the original position.
The wafer pasting and flattening mechanism shown in fig. 8 includes an installation platform 71, a positioning table 72 disposed on the installation platform 71 and used for supporting and driving the ceramic disc to rotate, a turning assembly 73 used for pasting the wafer on the ceramic disc, and a flattening assembly used for flattening the wafer on the ceramic disc.
The turning assembly shown in fig. 9 comprises a power member, a rotating shaft 736 and a suction cup 737, wherein the suction cup 737 is correspondingly disposed at one side of the support platform assembly, the power member is connected with the rotating shaft 736, the suction cup 737 is fixed on the rotating shaft 736, the power member can drive the rotating shaft 736 and the suction cup 737 to move left and right, up and down and turn over, thereby adsorbing and turning the wafer, the power member comprises a second slide rail 731, a second slider 732, a second cylinder 733, a second lifting seat 734 and a rotary cylinder 735, the second slider 732 is disposed on the second slide rail 731 and can slide along the second slide rail 731, the second cylinder 733 is fixed on the second slider 732, the second cylinder 733 is connected with the second lifting seat 734, the second cylinder 733 can drive the second lifting seat 734 to move up and down, the rotary cylinder 735 is fixed to the second elevating base 734, and the rotary cylinder 735 is connected to the rotary shaft 736 and drives the rotary shaft 736 to rotate axially.
The flat sheet assembly is correspondingly arranged above the positioning table 72 and comprises a pressing driving piece 74 and a pressing air bag 75, the pressing driving piece 74 can drive the pressing air bag 75 to move up and down to press the wafer on the ceramic disc, the pressing air bag 75 is communicated with the air path, and the gradual bulging can be realized through ventilation.
A plurality of positioning assemblies 76 for positioning the ceramic discs are uniformly distributed around the positioning table 72. As shown in fig. 10, the positioning assembly includes a pushing power component 761 and a pushing plate 762, the pushing power component 761 can drive the pushing plate 762 to translate, and an arc-shaped slot 7621 corresponding to an edge of the ceramic disk is formed at a side of the pushing plate 762.
The equal division rotating mechanism shown in fig. 11 includes a lifting power member 771, a lifting platform 772 and a rotating power member 773, wherein the lifting power member 771 is connected with the lifting platform 772, an air pipe 775 is arranged in the lifting platform 772, an air hole 777 is arranged on the upper surface of the top end of the lifting platform 772, the air pipe 775 is communicated with the air hole 777, the lifting power member 771 can drive the lifting platform 772 to lift so as to penetrate through a through hole of the positioning platform, the rotating power member 773 is connected with the lifting platform 772, and the rotating power member 773 can drive the lifting platform 772 to rotate axially.
A rotating plate 776 is fixed at the top end of the lifting platform 772, and the rotating power piece 773 is connected with the rotating plate 776; the bottom end of the lifting platform 772 is provided with a connecting seat 774, the lifting power piece 771 is connected with the lifting platform 772 through the connecting seat 774, and a bearing is arranged between the lifting platform 772 and the connecting seat 774.
During processing, the second slider 732 drives the second cylinder 733, the second lifting seat 734 and the rotary cylinder 735 to move, so that the suction cup 737 is located below the wafer, the second cylinder 733 drives the second lifting seat 734, the rotary cylinder 735 and the suction cup 737 to ascend, the suction cup 737 can suck the wafer, the wafer is moved to the position above the ceramic disc on the positioning table 72 through the second slider 732, at the moment, the rotary cylinder 735 drives the wafer to turn over by 180 degrees, the side coated with glue faces downwards, and finally the second cylinder 733 drives the suction cup 737 to move downwards so that the wafer is attached to the ceramic disc, and primary mounting is completed; after the ceramic disc is pasted, the two pushing power parts 761 drive the push plate 762 to move inwards, so that the ceramic disc is positioned; after positioning, the pressing driving part 74 drives the pressing air bag 75 to descend, and the pressing air bag 75 is inflated to perform multiple times of bulging, so that the wafer below is subjected to multiple times of flattening, and one-time flattening is completed; after the wafer is flattened, the lifting power member 771 drives the lifting platform 772 to ascend, the lifting platform 772 supports the ceramic disc on the positioning platform 72, the air suction mechanism sucks air to adsorb the wafer on the lifting platform 772, at the moment, the rotating power member 773 drives the lifting platform 772 and the ceramic disc to rotate for a certain angle, the lifting platform 772 descends, one ceramic disc is rotated in an equal division mode, another ceramic disc can be pasted on the ceramic disc in an equal division mode, and therefore the wafer can be pasted on the ceramic disc in an equal division mode.
Above-mentioned each process shifts the wafer in each mechanism through shifting manipulator 2, the manipulator that shifts adopts the preceding application of this company shift the manipulator structure can, in addition, the utility model designs two sets of transfer manipulators.
The full-automatic surface mounting process comprises the following steps:
s1, taking out the wafer in the bearing basket fixing mechanism, and conveying the wafer into a brushing and spin-drying mechanism for brushing and spin-drying;
s2, conveying the wafer after being brushed and dried into a wax homogenizing mechanism, and uniformly waxing the surface of the wafer;
s3, sending the wafer after wax mixing into a baking mechanism for drying;
s4, sending the dried wafer into a shaping and edge searching mechanism for shaping and edge searching;
and S5, the wafer is adsorbed and turned for 180 degrees by the turning assembly, then the surface of the wafer with the wax is attached to the ceramic disc, and the wafer after being attached is subjected to airbag flattening by the flattening assembly so that the wafer is completely attached to the ceramic disc.
It should be noted that the power member, the driving member, etc. of the present invention may be replaced by related power elements such as an air cylinder, an electric cylinder, a motor, an oil cylinder, etc., and may also adopt a corresponding link mechanism to realize power output, and are not limited to the names or structures thereof.
In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "disposed," "provided," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "top", "bottom", "inner", "outer", "side", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the technical solution of the present invention, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: those skilled in the art can still modify or easily conceive of changes in the technical solutions described in the foregoing embodiments or make equivalent substitutions for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (9)
1. The utility model provides a full-automatic multi-functional paster device which characterized in that: the automatic wax-removing machine comprises a bearing basket fixing mechanism, a brushing and spin-drying mechanism, a wax-homogenizing mechanism, a baking mechanism, a shaping and edge-searching mechanism, a chip-mounting and flattening mechanism and a transfer manipulator;
the carrier basket fixing mechanism is used for loading a wafer and is provided with a plurality of carrier basket fixing stations for positioning the carrier basket;
the scrubbing and spin-drying mechanism is used for scrubbing and spin-drying the wafer, and comprises a positioning platform assembly and a scrubbing assembly, wherein the positioning platform assembly comprises a rotary power part, a rotary platform, a sucker, a lifting power part, a lifting seat and a protective cover, the sucker is fixed on the rotary platform, the rotary platform is connected with the rotary power part, the rotary power part can drive the rotary platform and the sucker to rotate, the protective cover is sleeved outside the rotary platform, the protective cover is fixed on the lifting seat, the lifting power part is connected with the lifting seat, the lifting power part can drive the lifting seat and the protective cover to lift up and down, so that the rotary platform can enter or separate from the protective cover, the scrubbing assembly comprises a brush disc, a brush disc driving part, a brush disc swinging power part, a rocker arm and a rocker arm lifting driving part, the brush disc is correspondingly arranged above the sucker and fixedly connected with the brush disc rocker arm, and the brush disc is connected, the brush disc power part can drive the brush disc to axially rotate, the brush disc swinging power part is connected with the rocker arm, the brush disc swinging power part can drive the rocker arm and the brush disc to swing, the rocker arm lifting driving part is connected with the brush disc swinging power part, and the rocker arm lifting driving part can drive the brush disc swinging power part to lift;
the wax homogenizing mechanism is used for uniformly coating wax on the surface of a wafer and comprises a wax throwing component and a wax dropping component, the wax throwing component comprises a protective cover, a lifting power part, a lifting seat, a rotary power part and a rotary seat, the lifting power part is connected with the lifting seat and can drive the lifting seat to lift so as to enter or separate from the protective cover above, the rotary seat and the rotary power part are arranged on the lifting seat, the rotary power part is connected with the rotary seat and can drive the rotary seat to rotate, the wax dropping component is correspondingly arranged on one side of the protective cover, the wax dropping component comprises a wax dropping device and a driving power part, and the driving power part is connected with the wax dropping device and can drive the wax dropping device to horizontally move so as to be close to or far away from the center of;
the baking mechanism is used for baking the wafer after the wax is evenly distributed and is provided with a baking box;
the shaping and edge-searching mechanism is used for shaping and searching edges of the baked wafer and comprises a supporting platform assembly and a shaping and edge-searching assembly, the supporting platform assembly is used for placing the wafer, the shaping and edge-searching assembly is correspondingly arranged on one side of the supporting platform assembly, the shaping and edge-searching assembly comprises a driving piece and a rotary supporting seat, the rotary supporting seat is correspondingly arranged on one side of the supporting platform assembly, the driving piece is connected with the rotary supporting seat, and the driving piece can drive the rotary supporting seat to move forwards and backwards, upwards and downwards and rotate so as to support the wafer on the supporting platform assembly and enable the wafer to rotate;
the chip flattening mechanism is used for attaching the shaped edge-searched wafer to a ceramic disc and flattening the wafer, and comprises a positioning table, an overturning assembly and a flattening assembly, wherein the positioning table is used for supporting and driving the ceramic disc to rotate, the overturning assembly is used for attaching the wafer to the ceramic disc, the flattening assembly is used for flattening the wafer on the ceramic disc, the overturning assembly is correspondingly arranged on one side of the positioning table and comprises a power piece, a rotating shaft and a sucking disc, the power piece is connected with the rotating shaft, the sucking disc is fixed on the rotating shaft, the power piece can drive the rotating shaft and the sucking disc to move left and right, up and down and overturn, the flattening assembly is correspondingly arranged above the positioning table and comprises a pressing driving piece and a pressing air bag, the pressing air bag can be driven to move up and down to flatten the wafer on the ceramic disc, and the pressing air bag can;
the transfer manipulator is used for transferring the wafers in each mechanism.
2. The fully automatic multi-functional patch device of claim 1, wherein: the brushing and spin-drying mechanism further comprises a cleaning water tank, and the cleaning water tank is fixed outside the protective cover.
3. The fully automatic multi-functional patch device of claim 1, wherein: even wax mechanism still includes locating component, locating component sets up in the protection casing bottom, including location power spare and two location arms, is fixed with the arc locating piece on the location arm respectively, location power spare is connected with two location arms, and location power spare can drive two location arms and inwards or outwards remove simultaneously to make the arc locating piece press from both sides the tight wafer on or unclamping the roating seat.
4. The fully automatic multi-functional patch device of claim 1, wherein: the supporting table assembly of the shaping edge finding mechanism comprises a support, a supporting table, a rotary driving piece and positioning clamping jaws, wherein the supporting table is fixed on the top end of the support, a through hole is formed in the center of the supporting table, the positioning clamping jaws are a pair of and are respectively correspondingly arranged on two sides of the supporting table, arc-shaped grooves are respectively formed in opposite surfaces of the two positioning clamping jaws, the rotary driving piece is connected with the two positioning clamping jaws, and the rotary driving piece can drive the two positioning clamping jaws to rotate simultaneously so as to clamp or loosen a wafer on the supporting table.
5. The fully automatic multi-functional patch device of claim 4, wherein: the driving piece of the shaping edge finding mechanism comprises a first slide rail, a first slide block, a first air cylinder, a first lifting seat and a motor, wherein the first slide block is arranged on the first slide rail and can slide along the first slide rail, the first air cylinder is fixed on the first slide block, the first air cylinder is connected with the first lifting seat, the first air cylinder can drive the first lifting seat to move up and down, the motor is fixed on the first lifting seat, the rotary supporting seat is arranged at the top end of the motor, and the motor can drive the rotary supporting seat to rotate.
6. The fully automatic multi-functional patch device of claim 1, wherein: the brushing and drying mechanism is provided with one set or a plurality of sets.
7. The fully automatic multi-functional patch device of claim 1, wherein: the transfer robot has one or more sets.
8. The fully automatic multi-functional patch device of claim 1, wherein: the power part of the turnover assembly comprises a second slide rail, a second slide block, a second air cylinder, a second lifting seat and a rotary air cylinder, the second slide block is arranged on the second slide rail and can slide along the second slide rail, the second air cylinder is fixed on the second slide block and connected with the second lifting seat, the second air cylinder can drive the second lifting seat to move up and down, the rotary air cylinder is fixed on the second lifting seat and connected with the rotary shaft and can drive the rotary shaft to rotate axially.
9. The fully automatic multi-functional patch device of claim 1, wherein: the paster plain film mechanism still includes the partition rotating assembly, the partition rotating assembly includes lift power spare, elevating platform and rotatory power spare, lift power spare is connected with the elevating platform, the trachea has in the elevating platform, and the elevating platform upper surface has the gas pocket, trachea and gas pocket intercommunication, and lift power spare can drive the through-hole that the elevating platform goes up and down in order to pass the location platform, rotatory power spare is connected with the elevating platform, and rotatory power spare can drive elevating platform axial rotation.
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| CN201921319774.5U CN210040153U (en) | 2019-08-14 | 2019-08-14 | Full-automatic multifunctional paster device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364464A (en) * | 2019-08-14 | 2019-10-22 | 常州科沛达清洗技术股份有限公司 | Full-automatic multi-functional paster apparatus and full-automatic paster technique |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364464A (en) * | 2019-08-14 | 2019-10-22 | 常州科沛达清洗技术股份有限公司 | Full-automatic multi-functional paster apparatus and full-automatic paster technique |
| CN110364464B (en) * | 2019-08-14 | 2024-02-06 | 常州科沛达清洗技术股份有限公司 | Full-automatic multifunctional paster device and full-automatic paster process |
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