CN210223994U

CN210223994U - Wafer shaping mechanism

Info

Publication number: CN210223994U
Application number: CN201921320066.3U
Authority: CN
Inventors: Jizhong Li; 李继忠; Shuzhou Li; 李述周; Chun Zhu; 朱春
Original assignee: Changzhou Chemical Cleaning Technology Ltd By Share Ltd
Current assignee: Changzhou Chemical Cleaning Technology Ltd By Share Ltd
Priority date: 2019-08-14
Filing date: 2019-08-14
Publication date: 2020-03-31
Anticipated expiration: 2029-08-14

Abstract

The utility model relates to a wafer plastic mechanism, including drawing in subassembly and rotating assembly in, draw in the subassembly and be used for making the wafer draw close to the center, draw in the clamping jaw including drawing in driving piece and two, two draw in the arc wall that has corresponding with the wafer edge on the double-phase opposite of clamping jaw respectively, draw in the driving piece and can drive two and draw in the clamping jaw rotation in order to press from both sides tightly or loosen the wafer, rotating assembly corresponds the setting and is drawing in the subassembly below for fixed wafer and drive wafer are rotatory, including rotary driving piece and rotating support seat, rotary driving piece and rotating support seat are connected, and rotary driving piece can drive the rotating support seat rotation so that the wafer is rotatory. The wafer shaping mechanism can position, shape and find edges of the wafer through mutual matching of the furling assembly and the rotating assembly, so that the accuracy of subsequent chip mounting is guaranteed.

Description

Wafer shaping mechanism

Technical Field

The utility model relates to an electronic product processing technology field especially relates to a wafer plastic mechanism.

Background

The demand of the semiconductor market in China for loading machines is rapidly increased, the labor force is in short supply, and the labor cost is continuously increased, so that the demand of manufacturers for automatic equipment is improved, and the semiconductor market packaging machine has obvious effects of reducing the production cost and improving the product yield.

The existing wafer (sapphire wafer, silicon wafer, etc.) needs to be processed by a plurality of procedures, such as cleaning, gluing (waxing), pasting, shoveling, storing, etc. Because part of the wafer is not regular round and has a notch on one side, the wafer needs to be shaped and edge-searched before being attached. In the prior art, wafers are generally round and do not have a shaping and edge finding mechanism.

SUMMERY OF THE UTILITY MODEL

In order to overcome the shortcoming of the prior art, the utility model provides a can realize the all direction movement of wafer, guarantee wafer plastic mechanism of paster accuracy.

The utility model discloses a realize through following technical scheme: the utility model provides a wafer plastic mechanism, is including drawing in subassembly and rotating assembly in, draw in the subassembly and be used for making the wafer draw close to the center, including drawing in driving piece and two clamping jaws in, two have the arc wall corresponding with the wafer edge on drawing in the double-phase opposite of clamping jaw respectively, draw in the driving piece and can drive two clamping jaws in and rotate in order to press from both sides tightly or loosen the wafer in, rotating assembly corresponds to set up in the subassembly below of drawing in for fixed wafer and drive wafer are rotatory, including rotary driving piece and rotation support seat, rotary driving piece and rotation support seat are connected, and rotary driving piece can drive the rotation support seat and rotate so that the wafer is rotatory.

In order to facilitate installation, the folding device further comprises a support, the folding assembly is fixed on the upper surface of the support, the rotary driving piece is fixed on the lower surface of the support, and the rotary supporting seat is arranged above the support.

In order to adapt to different types or sizes of wafers, the furling clamping jaw comprises a power arm and a positioning block fixed on the power arm, and an arc-shaped groove is formed in the side part of the positioning block.

In order to prevent the wafer from deviating during rotation, an air passage is formed in the rotary supporting seat and penetrates through the top end of the rotary supporting seat.

The utility model has the advantages that: the wafer shaping mechanism can position, shape and find edges of the wafer through mutual matching of the furling assembly and the rotating assembly, so that the accuracy of subsequent chip mounting is guaranteed.

Drawings

Fig. 1 is a schematic perspective view of a wafer shaping mechanism according to the present invention;

fig. 2 is a schematic view of a three-dimensional structure of the wafer shaping mechanism of the present invention in use.

Detailed Description

The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and the protection scope of the present invention can be clearly and clearly defined.

As shown in fig. 1, the wafer shaping mechanism includes a drawing assembly and a rotating assembly, the drawing assembly is used for drawing the wafer toward the center, the rotating assembly is used for fixing the wafer and driving the wafer to rotate, and the drawing assembly and the rotating assembly are respectively mounted on a support 1.

Draw in the subassembly including drawing in driving piece 2 and two clamping jaws that draw in, draw in the clamping jaw and include power arm 3 and fix locating piece 4 on power arm 3 in, locating piece 4 is the arc, and its lateral part has arc wall 41, and locating piece 4 can be dismantled with power arm 3 and be connected, draw in driving piece 2 can drive two and draw in the clamping jaw rotation in order to press from both sides tightly or loosen the wafer, rotating assembly corresponds and sets up in the subassembly below of drawing in for fixed wafer and drive wafer are rotatory, including rotary driving piece 5 and rotation support seat 6, rotary driving piece 5 is connected with rotation support seat 6, and rotary driving piece 5 can drive rotation support seat 6 and rotate so that the wafer is rotatory, air flue 61 has been seted up in rotation support seat 6, air flue 61 runs through 6 tops of rotation support seat, can make rotation support seat 6 adsorb the wafer.

In addition, the bracket 1 is also fixed with an inductor for inducing the notch of the wafer.

During processing, as shown in fig. 2, the manipulator sends the wafer 7 to the rotary supporting seat 6, the position and the direction of the wafer at the moment have certain offset, the driving part 2 is drawn in to start to act, the two positioning blocks 4 deflect inwards, the wafer 7 moves towards the center, the positioning is completed, the two positioning blocks 4 are loosened, then the rotary supporting seat 6 adsorbs the wafer 7, the rotary driving part 5 drives the wafer 7 to rotate slowly until the inductor senses the notch position of the wafer, the shaping and edge finding are realized, and the manipulator can send the wafer after the shaping and edge finding to the next station for accurate pasting.

It should be noted that the power member, the driving member, etc. of the present invention may be replaced by related power elements such as an air cylinder, an electric cylinder, a motor, an oil cylinder, etc., and may also adopt a corresponding link mechanism to realize power output, and are not limited to the names or structures thereof.

In the description of the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "disposed," "provided," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "top", "bottom", "inner", "outer", "side", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the technical solution of the present invention, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: those skilled in the art can still modify or easily conceive of changes in the technical solutions described in the foregoing embodiments or make equivalent substitutions for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A wafer plastic mechanism which characterized in that: including drawing in subassembly and rotating assembly, draw in the subassembly and be used for making the wafer draw close to the center, including drawing in driving piece and two clamping jaws that draw in, two draw in have the arc wall corresponding with the wafer edge on the double-phase opposite of clamping jaw respectively, draw in the driving piece and can drive two and draw in the clamping jaw rotation in order to press from both sides tightly or loosen the wafer, rotating assembly corresponds to set up in the subassembly below that draws in for fixed wafer and drive wafer are rotatory, including rotary driving piece and rotation support seat, rotary driving piece is connected with rotation support seat, and rotary driving piece can drive rotation support seat rotatory so that the wafer is rotatory.

2. The wafer shaping mechanism of claim 1, wherein: the folding assembly is fixed on the upper surface of the support, the rotary driving piece is fixed on the lower surface of the support, and the rotary supporting seat is arranged above the support.

3. The wafer shaping mechanism of claim 1, wherein: the furling clamping jaw comprises a power arm and a positioning block fixed on the power arm, and an arc-shaped groove is formed in the side part of the positioning block.

4. The wafer shaping mechanism of claim 1, wherein: an air passage is formed in the rotary supporting seat and penetrates through the top end of the rotary supporting seat.